CN118028913A - Preparation method and product of high-frequency high-speed extra-thin electrolytic copper foil additive - Google Patents
Preparation method and product of high-frequency high-speed extra-thin electrolytic copper foil additive Download PDFInfo
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- CN118028913A CN118028913A CN202410091111.1A CN202410091111A CN118028913A CN 118028913 A CN118028913 A CN 118028913A CN 202410091111 A CN202410091111 A CN 202410091111A CN 118028913 A CN118028913 A CN 118028913A
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- solution
- copper foil
- electrolytic copper
- speed
- sodium
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 239000011889 copper foil Substances 0.000 title claims abstract description 55
- 239000000654 additive Substances 0.000 title claims abstract description 14
- 230000000996 additive effect Effects 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 108010010803 Gelatin Proteins 0.000 claims abstract description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229920000159 gelatin Polymers 0.000 claims abstract description 4
- 239000008273 gelatin Substances 0.000 claims abstract description 4
- 235000019322 gelatine Nutrition 0.000 claims abstract description 4
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 4
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims abstract description 4
- -1 sodium 2-mercaptobenzimidazole propane sulfonate Chemical compound 0.000 claims abstract description 4
- UOULCEYHQNCFFH-UHFFFAOYSA-M sodium;hydroxymethanesulfonate Chemical compound [Na+].OCS([O-])(=O)=O UOULCEYHQNCFFH-UHFFFAOYSA-M 0.000 claims abstract description 4
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 claims abstract description 3
- 239000000243 solution Substances 0.000 claims description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 238000005303 weighing Methods 0.000 claims description 8
- 239000011259 mixed solution Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000002000 Electrolyte additive Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000007865 diluting Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000004576 sand Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- KHAZIIVSIJPRGF-UHFFFAOYSA-N [Na].CCCS Chemical compound [Na].CCCS KHAZIIVSIJPRGF-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
The invention discloses a preparation method and a product of a high-frequency high-speed ultrathin electrolytic copper foil additive, which comprise the following raw materials: copper sulfate, sulfuric acid, sodium 2-mercaptobenzimidazole propane sulfonate, sodium hydroxymethane sulfonate, sodium 3-mercaptopropane sulfonate, polyoxyethylene-polyoxypropylene ether and gelatin. The electrolytic copper foil produced by the additive has flat surface grains, low profile, high tensile strength, high elongation and no pinholes, and is electrodeposited on constant-current continuous constant-speed rotating equipment to obtain electrolytic copper foils with different thicknesses. Realizes the mass production of extremely thin high-frequency high-speed electrolytic copper foil with extremely thin thickness of 1 mu m, has good performance and stable consistency, and has no pinholes, sand and bubbles.
Description
Technical Field
The invention relates to the technical field of electrolytic copper foil production and manufacturing, in particular to a preparation method of a high-frequency high-speed ultrathin electrolytic copper foil additive and a product.
Background
The high-end copper foil has a very wide application range, and covers a plurality of fields such as communication equipment, computer hardware, medical instruments and the like. In communication equipment, the high-frequency high-speed electronic copper foil is widely applied to the fields of wireless communication, satellite communication, radar and the like so as to meet the requirement of high-frequency transmission
Electronic copper foil can be classified into general conventional type and high-end type. Varieties of high-end electronic copper foil for PCBs include high-frequency high-speed electronic copper foil. The high-frequency high-speed electronic copper foil has wide application market in the fields of wireless communication, high-speed network, radar and the like, and the high-end copper foil is mainly applied to the manufacturing field of high-end printed circuit boards due to the characteristics of high manufacturing level, strict application condition requirements or special requirements and the like. The ultra-low profile copper foil for high frequency and high speed circuits is a high-end electronic copper foil applied to PCB manufacturing. The copper foil has extremely low surface roughness and profile height, and can provide better circuit performance and reliability. In high frequency and high speed circuits, stability and accuracy of signal transmission are critical to the circuit's performance, and high performance very low profile copper foil can meet this requirement.
The copper foil for high frequency and high speed circuit board needs to meet the following technical requirements:
1. Low dielectric loss: the smaller the dielectric constant of the high-frequency copper-clad plate is, the more stable the transmission is. The dielectric constant of the high-frequency copper-clad plate is generally less than 0.005
2. High heat resistance: the high-frequency and high-speed copper-clad plate needs to withstand a high-temperature environment, and thus needs to have good heat resistance.
3. Excellent adhesion: the copper foil with excellent copper foil peeling strength needs to have good adhesion with base material resin, and consistent stability of carrier foil peeling force after molding processing under high temperature and high pressure conditions so as to ensure the overall performance of the copper-clad plate.
4. Low coefficient of linear expansion: under the condition of temperature change, the volume change of the copper foil is as small as possible so as to ensure the dimensional stability of the copper-clad plate
5. Good formability: the copper foil is required to have good formability to facilitate bending, stretching, etc. operations during production.
The technical difficulties of the copper foil for the high-frequency high-speed circuit board mainly comprise:
1. interlayer alignment degree: because of the number of layers of the high-layer board, the alignment requirements of the client design end on each layer of the PCB are more and more strict, and the alignment tolerance between layers is usually controlled.
2. And (3) inner layer circuit manufacturing: the high-layer board is made of special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer and the like, and high requirements are put on inner layer circuit manufacture and pattern size control.
3. Pressing and manufacturing: and when the lamination content is produced, the defects of sliding plates, layering, resin cavities, bubble residues and the like are easily generated.
4. Copper foil selection: high frequency, high speed copper clad laminates require the use of specific types of copper foil, such as reverse copper foil (RTF) and ultra low profile copper foil (HVLP), which are more demanding for copper foil surface roughness (Rz), typically HVLP surface roughness (Rz). Ltoreq.1.3 μm.
Disclosure of Invention
The invention aims to provide a preparation method of a high-frequency high-speed extra-thin electrolytic copper foil additive, which has the advantages of simple steps, easy control of conditions and low cost.
The invention also aims to provide the high-frequency high-speed extra-thin electrolytic copper foil additive prepared by the method.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a high-frequency high-speed extra-thin electrolytic copper foil additive comprises the following steps:
(1) The following raw materials were prepared:
(2) Respectively weighing copper sulfate, sulfuric acid, sodium 2-mercaptobenzimidazole propane sulfonate, sodium hydroxymethane sulfonate, sodium 3-mercaptopropane sulfonate, polyoxyethylene-polyoxypropylene ether and gelatin, dissolving in deionized pure water to obtain solution A, solution B, solution C, solution D, solution E, solution F and solution G
(3) Adding the solution A, the solution B, the solution C, the solution D, the solution E, the solution F and the solution G prepared in the step (2) into a constant temperature stirring tank, and stirring for 60 minutes under the constant temperature of 55-60 ℃ to obtain a mixed solution;
(4) And (3) quantitatively diluting the mixed solution obtained in the step (3) with deionized water to finish the preparation of the electrolyte additive.
A high-frequency high-speed extra-thin electrolytic copper foil additive comprises the following raw materials:
The invention has the beneficial effects that:
1. The electrolytic copper foil produced by the additive has flat surface grains, low profile, high tensile strength, high elongation and no pinholes, and is electrodeposited on constant-current continuous constant-speed rotating equipment to obtain electrolytic copper foils with different thicknesses. Realizes the mass production of extremely thin high-frequency high-speed electrolytic copper foil with extremely thin thickness of 1 mu m, has good performance and stable consistency, and has no pinholes, sand and bubbles.
2. The current efficiency in a low area is improved, the working current density is improved, the crystal leveling effect is optimized, the crystal of the plated layer ' copper nodule ' is finely and finely distributed uniformly, the top of the copper nodule ' is similar to an arc spherical surface angle, and the smaller the size of the nodule particles on the surface of the copper foil is (the lower the nodule particles are, the lower the surface profile degree of the copper foil is), the more beneficial the copper foil is to improving the ' Young modulus '. Is beneficial to the peeling strength of the copper foil.
3. The cathode polarization is improved, pinholes and bast sand generated by the copper plating layer can be eliminated, the grains of the plating layer can be more uniform, fine and compact, the conductivity and physical properties of the copper foil are improved, and the appearance (flatness or crimping degree), tensile strength and elongation consistency and stability of the copper foil are ensured.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment provides a high-frequency high-speed ultrathin electrolytic copper foil additive, which comprises the following steps:
the following raw materials were prepared:
weighing 25Kg of copper sulfate and dissolving in 20L of deionized pure water to obtain a solution A;
8Kg of sulfuric acid is weighed and dissolved in 15L of deionized pure water to obtain a solution B;
Weighing 50g of 2-mercaptobenzimidazole propane sodium sulfonate, and dissolving in 40L deionized pure water to obtain solution C;
Weighing 50g of sodium hydroxymethylsulfonate, and dissolving in 10L of deionized pure water to obtain a solution D;
weighing 50g of 3-mercaptopropane sodium sulfonate, and dissolving in 2L of deionized pure water to obtain solution E;
Weighing 20g of polyoxyethylene-polyoxypropylene ether, and dissolving in 2L of deionized pure water to obtain a solution F;
weighing 50G of gelatin, and dissolving in 2L of deionized pure water to obtain a solution G;
Adding the solution A, the solution B, the solution C, the solution D, the solution E, the solution F and the solution G into a constant temperature stirring tank, and stirring for 60 minutes under the constant temperature of 55-60 ℃ to obtain a mixed solution; and quantitatively diluting the mixed solution to 100L by using deionized water to finish the preparation of the electrolyte additive.
The electrolytic copper foil produced by the additive has flat surface grains, low profile, high tensile strength, high elongation and no pinholes, and is electrodeposited on constant-current continuous constant-speed rotating equipment to obtain electrolytic copper foils with different thicknesses. Realizes the mass production of extremely thin high-frequency high-speed electrolytic copper foil with extremely thin thickness of 1 mu m, has good performance and stable consistency, and has no pinholes, sand and bubbles.
The current efficiency in a low area is improved, the working current density is improved, the crystal leveling effect is optimized, the crystal of the plated layer ' copper nodule ' is finely and finely distributed uniformly, the top of the copper nodule ' is similar to an arc spherical surface angle, and the smaller the size of the nodule particles on the surface of the copper foil is (the lower the nodule particles are, the lower the surface profile degree of the copper foil is), the more beneficial the copper foil is to improving the ' Young modulus '. Is beneficial to the peeling strength of the copper foil.
The cathode polarization is improved, pinholes and bast sand generated by the copper plating layer can be eliminated, the grains of the plating layer can be more uniform, fine and compact, the conductivity and physical properties of the copper foil are improved, and the appearance (flatness or crimping degree), tensile strength and elongation consistency and stability of the copper foil are ensured.
The above description is only of the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present invention or modifications to equivalent embodiments using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present invention. Therefore, all equivalent changes according to the shape, structure and principle of the present invention are covered in the protection scope of the present invention.
Claims (2)
1. The high-frequency high-speed extra-thin electrolytic copper foil additive is characterized by comprising the following steps of:
(1) The following raw materials were prepared:
(2) Respectively weighing copper sulfate, sulfuric acid, sodium 2-mercaptobenzimidazole propane sulfonate, sodium hydroxymethane sulfonate, sodium 3-mercaptopropane sulfonate, polyoxyethylene-polyoxypropylene ether and gelatin, dissolving in deionized pure water to obtain solution A, solution B, solution C, solution D, solution E, solution F and solution G
(3) Adding the solution A, the solution B, the solution C, the solution D, the solution E, the solution F and the solution G prepared in the step (2) into a constant temperature stirring tank, and stirring for 60 minutes under the constant temperature of 55-60 ℃ to obtain a mixed solution;
(4) And (3) quantitatively diluting the mixed solution obtained in the step (3) with deionized water to finish the preparation of the electrolyte additive.
2. A high frequency high speed extra thin electrolytic copper foil additive prepared according to the method of claim 1, comprising the following raw materials:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410091111.1A CN118028913A (en) | 2024-01-23 | 2024-01-23 | Preparation method and product of high-frequency high-speed extra-thin electrolytic copper foil additive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410091111.1A CN118028913A (en) | 2024-01-23 | 2024-01-23 | Preparation method and product of high-frequency high-speed extra-thin electrolytic copper foil additive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118028913A true CN118028913A (en) | 2024-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410091111.1A Pending CN118028913A (en) | 2024-01-23 | 2024-01-23 | Preparation method and product of high-frequency high-speed extra-thin electrolytic copper foil additive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118028913A (en) |
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- 2024-01-23 CN CN202410091111.1A patent/CN118028913A/en active Pending
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