CN118028757A - Method for regulating deposition rate and thickness of each region in vacuum chamber in real time - Google Patents
Method for regulating deposition rate and thickness of each region in vacuum chamber in real time Download PDFInfo
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- CN118028757A CN118028757A CN202410150524.2A CN202410150524A CN118028757A CN 118028757 A CN118028757 A CN 118028757A CN 202410150524 A CN202410150524 A CN 202410150524A CN 118028757 A CN118028757 A CN 118028757A
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- 230000001105 regulatory effect Effects 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000012544 monitoring process Methods 0.000 claims abstract description 71
- 238000002310 reflectometry Methods 0.000 claims abstract description 44
- 239000007921 spray Substances 0.000 claims abstract description 37
- 230000001276 controlling effect Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 20
- 238000012937 correction Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 description 100
- 238000007747 plating Methods 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
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- 239000000243 solution Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
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- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention discloses a method for regulating and controlling the deposition rate and thickness of each region in a vacuum chamber in real time, wherein at least one monitoring region is divided and established in the vacuum chamber, and the surface reflectivity of a matrix in any monitoring region and the temperature value of the monitoring region are obtained; calibrating and correcting the obtained surface reflectivity and temperature value; calculating the rated deposition rate and the rated deposition thickness of the monitoring area based on the corrected surface reflectivity and temperature value; acquiring the actual deposition rate and the actual deposition thickness of the monitoring area, comparing and judging the actual deposition rate and the rated deposition thickness, and correspondingly and dynamically adjusting the output power value of the spray head based on the comparison result, wherein when the difference value between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is larger, the adjusting amplitude of the output power value of the spray head is larger; therefore, uniform coating in the vacuum chamber and real-time regulation and control of the film deposition rate are realized.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a method for regulating and controlling deposition rate and thickness of each region in a vacuum chamber in real time.
Background
Vacuum coating refers to heating and evaporating a plating material in a vacuum chamber or bombarding the plating material by accelerated ions so as to make atoms and atomic groups on the surface of the plating material escape, and the escape atoms and atomic groups can be deposited on the surface of a substrate to form a film with the same composition as the plating material. Particularly, in the vacuum coating process, the step of controlling the film deposition is important, and if the film deposition rate and thickness cannot be accurately controlled in the deposition process, the formed film can be too thin or too thick, and the prepared finished product cannot meet the production requirement and cannot be used.
The conventional method for regulating and controlling the deposition rate and thickness of each region in the vacuum chamber cannot directly obtain the deposition condition of the film in the vacuum chamber in the prior art, so that the production requirements of uniform film plating and vacuum film plating for regulating and controlling the deposition rate of the film in real time cannot be effectively met.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a method for regulating and controlling the deposition rate and thickness of each region in a vacuum chamber in real time.
In order to achieve the above object, the method for regulating and controlling the deposition rate and thickness of each region in a vacuum chamber in real time provided by the invention comprises at least one substrate and at least one spray head arranged in the vacuum chamber, and the method comprises the following steps:
Step S1: dividing and establishing at least one monitoring area in a vacuum chamber, and acquiring the surface reflectivity of a part of a substrate in any one monitoring area and the temperature value of the monitoring area, wherein each monitoring area is controlled by spraying of a corresponding spray head;
step S2: calibrating and correcting the obtained surface reflectivity and temperature value;
step S3: calculating the rated deposition rate and the rated deposition thickness of the monitoring area based on the corrected surface reflectivity and temperature value;
Step S4: and acquiring the actual deposition rate and the actual deposition thickness of the monitoring area, comparing and judging with the rated deposition rate and the rated deposition thickness, and correspondingly and dynamically adjusting the output power value of the spray head based on the comparison result, wherein when the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is larger, the adjusting amplitude of the output power value of the spray head is larger.
Further, establishing at least one monitoring area within the vacuum chamber includes: the vacuum chamber is divided equally into a number of zones of uniform volume, wherein each of the equal zones serves as a monitoring zone.
Further, in step S2, calibration correction is performed on the obtained surface reflectivity and temperature value, including: step S2.1: obtaining a correction model; step S2.2: and calibrating the surface reflectivity and the temperature value through the correction model.
Further, in step S3, a rated deposition rate and a rated deposition thickness of the monitored area are calculated based on the corrected surface reflectivity and temperature value, including: step S3.1: obtaining a first calculation model and a second calculation model, wherein the first calculation model is s=a×temperature+b, s is a rated deposition rate, and a and b are model coefficients obtained by regression calculation of the surface reflectivity and the temperature value; the second calculation model is p=s×t, p is the rated deposition thickness, and t is the deposition time; step S3.2: and calculating the rated deposition rate and the rated deposition thickness of the monitoring area through the first calculation model and the second calculation model.
Further, in step S4, if the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is a positive value, the output power value of the showerhead is reduced; and if the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is a negative value, the output power value of the spray head is increased.
The equipment for regulating and controlling the deposition rate and thickness of each region in the vacuum chamber in real time comprises at least one sensing module for acquiring the surface reflectivity of a part of a substrate in any one monitoring region and the temperature value of the monitoring region, a data processing module for calibrating and correcting the acquired surface reflectivity and temperature value and calculating the rated deposition rate and rated deposition thickness of the monitoring region based on the corrected surface reflectivity and temperature value, and a regulating module for acquiring the actual deposition rate and actual deposition thickness of the monitoring region, comparing and judging the actual deposition rate and rated deposition thickness with the rated deposition rate and rated deposition thickness and correspondingly and dynamically regulating the output power value of the spray head based on the comparison result.
By adopting the scheme, the invention has the beneficial effects that by arranging at least one monitoring area and independently controlling the output power value of the spray heads in each monitoring area, the whole uniform coating of the matrix in the vacuum chamber and the real-time regulation and control of the film deposition rate and thickness can be realized, thereby greatly improving the control precision of the film deposition rate and thickness and greatly improving the quality and production efficiency of finished products.
Drawings
Fig. 1 is a flowchart of a method for real-time controlling the deposition rate and thickness of each region in a vacuum chamber according to the present embodiment.
Fig. 2 is a detailed flowchart of calibration correction of the obtained surface reflectivity and temperature value in step S2.
Fig. 3 is a detailed flowchart of calculating the rated deposition rate and the rated deposition thickness of the monitored area based on the corrected surface reflectivity and temperature value in step S3.
FIG. 4 is a schematic diagram of an arrangement for real-time conditioning of a substrate within a vacuum chamber in accordance with one embodiment of the present application.
FIG. 5 is a schematic diagram of an arrangement of an apparatus for real-time control of deposition rate and thickness of various regions within a vacuum chamber in accordance with one embodiment of the present application.
The device comprises a 1-vacuum chamber, a 2-sensing module, a 3-data processing module, a 4-regulation module, a 5-substrate and a 6-nozzle.
Detailed Description
In order that the invention may be understood more fully, the invention will be described with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete.
The implementation details of the technical scheme of the embodiment of the invention are described in detail below:
Referring to fig. 1, in the present embodiment, at least one substrate 5 and at least one showerhead 6 are included in a vacuum chamber 1, and the substrate 5 and the showerhead 6 are disposed in opposition; the following further explains the method for regulating the deposition rate and thickness of each region in the vacuum chamber in real time in the embodiment of the invention based on the above components:
Step S1: the vacuum chamber 1 is divided to establish at least one monitoring area, and the surface reflectivity of the substrate 5 in any one monitoring area and the temperature value of the monitoring area are acquired, wherein each monitoring area is controlled by spraying of a corresponding spray head 6.
In the present embodiment, the vacuum chamber 1 is equally divided into several areas of uniform volume, wherein each equally divided area serves as a monitoring area, in particular, each monitoring area may represent a partial spatial area delimited in the vacuum chamber 1 and in which only one shower head 6 is provided. More specifically, each monitoring area is controlled by spraying from a corresponding spray head 6, and the range of each monitoring area is the spraying range of the spray head 6.
Step S2: and calibrating and correcting the obtained surface reflectivity and temperature value.
Referring to fig. 2, in this embodiment, calibration correction of the obtained surface reflectivity and temperature value may be performed according to the steps shown in fig. 2, including:
step S2.1: obtaining a correction model;
step S2.2: the surface reflectivity is calibrated and the temperature value is calibrated through the correction model.
In the embodiment, the surface reflectivity is calibrated by using a correction model, namely, the least square error calculation is carried out on the surface reflectivity data of a plurality of different angles obtained in the same time period, and the calculation result is the corrected surface reflectivity, so that the visual angle difference can be reduced, and the change of the surface structure of the matrix 5 can be obtained more accurately; and calibrating the temperature value by using a correction model, namely acquiring temperature value change data of a monitoring area within a certain time, performing polynomial fitting calculation on the change data, wherein a calculation result is a calibration parameter, adding the acquired actual temperature value and the calibration parameter, and the obtained sum is a corrected temperature value, so that detection errors can be reduced. It should be noted that, the least squares error calculation and the polynomial fitting calculation belong to conventional technical means, and are not described in detail herein.
Step S3: and calculating the rated deposition rate and the rated deposition thickness of the monitoring area based on the corrected surface reflectivity and temperature value. Referring to fig. 3, in this embodiment, the calculation of the rated deposition rate and the rated deposition thickness of the monitored area based on the corrected surface reflectivity and temperature value may be performed according to the steps shown in fig. 2, including:
step S3.1: obtaining a first calculation model and a second calculation model, wherein the first calculation model is s=a×temperature+b, s is a rated deposition rate, and a and b are model coefficients obtained by regression calculation of surface reflectivity and temperature values; the second calculation model is p=s×t, p is the rated deposition thickness, and t is the deposition time; in this embodiment, the value of a is 0.01 and the value of b is 0.6.
Step S3.2: and calculating the rated deposition rate and the rated deposition thickness of the monitoring area through the first calculation model and the second calculation model.
Step S4: and acquiring the actual deposition rate and the actual deposition thickness of the monitoring area, comparing and judging the actual deposition rate and the rated deposition thickness, and correspondingly and dynamically adjusting the output power value of the spray head 6 based on the comparison result, wherein when the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is larger, the adjusting amplitude of the output power value of the spray head 6 is larger. Wherein, if the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is a positive value, the output power value of the spray head 6 is reduced; if the difference between the actual deposition rate and the nominal deposition rate/thickness of the monitored area is negative, the output power value of the showerhead 6 is increased.
Referring to fig. 4, in one embodiment of the present invention, the surface reflectance of the substrate 5 in the monitoring area a is obtained to be 0.75, the temperature is 80 ℃, and the surface reflectance of the substrate 5 in the monitoring area B is obtained to be 0.82, the temperature is 85 ℃. Firstly, the obtained surface reflectivity and temperature value in the monitoring area A, B are calibrated and corrected, the surface reflectivity of the substrate 5 in the corrected monitoring area A is calculated to be 0.75, the temperature value is 80, and the surface reflectivity of the substrate 5 in the corrected monitoring area B is calculated to be 0.82, and the temperature value is 85. Secondly, substituting the data into a first calculation model and a second calculation model respectively, setting the deposition time to be 10s, and calculating to obtain the rated deposition rate of 1.4 nm/s and the rated deposition thickness of 14 nm in the monitoring area A; the rated deposition rate in the monitoring area B is 1.45 nm/s, and the rated deposition thickness is 14.5 nm. Finally, comparing and judging the rated parameters with the actual parameters to obtain that the injection rate (i.e. the actual deposition rate) of the spray head 6 in the monitoring area A is 1.2 nm/s, the difference value (the difference value is-0.2) between the spray head 6 and the rated deposition rate is a negative value, and the output power value of the spray head 6 (such as the injection frequency and the injection time of the spray head 6) needs to be increased to increase the injection rate to 1.4 nm/s so as to ensure that the actual deposition thickness is 14 nm; the obtained spray rate (i.e. actual deposition rate) of the spray head 6 in the monitoring area B is 1.6 nm/s, the difference (difference 0.15) between the spray head 6 and the rated deposition rate is positive, the output power value of the spray head 6 (such as the spray frequency and the spray time of the spray head 6) needs to be reduced to reduce the spray rate to 1.45 nm/s-1.55 nm/s, and further the actual deposition thickness is ensured to be 14.5 nm-15.5 nm, which is the allowable error range of the coating process.
Wherein, when the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitor area a/B is larger, the adjustment amplitude of the output power value of the shower head 6 is larger. Specifically, when the output power value of the spray head 6 in the monitoring area A is regulated and controlled, the output power value is increased by 0.05 nm/s each time; the operations of steps S1 to S4 are then repeated until the nominal deposition rate is reached. When the output power value of the spray head 6 in the monitoring area B is regulated and controlled, the regulation is reduced by 0.03nm/s each time; the operations of steps S1 to S4 are then repeated until the nominal deposition rate is reached. Therefore, by accurately regulating and controlling each monitoring area, the whole uniform coating of the substrate 5 in the vacuum chamber 1 is effectively ensured.
In the technical scheme of the embodiment of the invention, a device for regulating and controlling the deposition rate and thickness of each area in the vacuum chamber 1 in real time is also provided, which can realize the operation, and comprises at least one sensing module 2 for acquiring the surface reflectivity of the matrix 5 in any one monitoring area and the temperature value of the monitoring area, a data processing module 3 for calibrating and correcting the acquired surface reflectivity and temperature value and calculating the rated deposition rate and rated deposition thickness of the monitoring area based on the corrected surface reflectivity and temperature value, and a regulating and controlling module 4 for acquiring the actual deposition rate and actual deposition thickness of the monitoring area, comparing and judging the actual deposition rate and the rated deposition thickness, and correspondingly and dynamically regulating the output power value of the spray head 6 based on the comparison result.
The sensing module 2 is disposed in the vacuum chamber 1 and comprises an optical sensor and a temperature sensor, the optical sensor can measure the optical property of the surface of the substrate 5 so as to detect the surface reflectivity of the substrate 5 in the deposition process, the temperature sensor can monitor the temperature change of the surface of the substrate 5 in the deposition process, and the system can monitor the surface reflectivity and the temperature parameter with high precision in the deposition process through the combined use of the two sensors. Secondly, the data processing module 3 can analyze and process the surface reflectivity and the temperature parameter of the matrix 5 in each monitoring area to calculate the rated deposition rate and the rated deposition thickness in each monitoring area, and further analyze and obtain the uniformity of the whole coating film in the vacuum chamber 1; the regulation and control module 4 can compare and judge based on the data result analyzed and processed by the data processing module 3, and correspondingly and dynamically adjust the output power of the spray head 6; therefore, the whole uniform film coating of the matrix 5 in the vacuum chamber 1 is effectively ensured, and the deposition rate and thickness of the film are accurately regulated and controlled in real time.
The above-described embodiments are merely preferred embodiments of the present invention, and are not intended to limit the present invention in any way. Any person skilled in the art, using the disclosure above, may make many more possible variations and modifications of the technical solution of the present invention, or make many more modifications of the equivalent embodiments of the present invention without departing from the scope of the technical solution of the present invention. Therefore, all equivalent changes made according to the inventive concept are covered by the protection scope of the invention without departing from the technical scheme of the invention.
Claims (6)
1. The method for regulating and controlling the deposition rate and thickness of each region in the vacuum chamber in real time comprises at least one substrate and at least one spray head which are arranged in the vacuum chamber, and is characterized in that: the method comprises the following steps:
Step S1: dividing and establishing at least one monitoring area in the vacuum chamber (1), and acquiring the surface reflectivity of a part of a substrate (5) in any one monitoring area and the temperature value of the monitoring area, wherein each monitoring area is controlled by spraying of a corresponding spray head (6);
step S2: calibrating and correcting the obtained surface reflectivity and temperature value;
step S3: calculating the rated deposition rate and the rated deposition thickness of the monitoring area based on the corrected surface reflectivity and temperature value;
Step S4: and acquiring the actual deposition rate and the actual deposition thickness of the monitoring area, comparing and judging with the rated deposition rate and the rated deposition thickness, and correspondingly and dynamically adjusting the output power value of the spray head (6) based on the comparison result, wherein when the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is larger, the adjusting amplitude of the output power value of the spray head (6) is larger.
2. The method for real-time control of deposition rate and thickness of each region in a vacuum chamber according to claim 1, wherein: dividing and establishing at least one monitoring area within the vacuum chamber (1), comprising: the vacuum chamber (1) is equally divided into a plurality of areas of uniform volume, wherein each equally divided area serves as a monitoring area.
3. The method for real-time control of deposition rate and thickness of each region in a vacuum chamber according to claim 1, wherein: in step S2, calibration correction is performed on the obtained surface reflectivity and temperature value, including:
step S2.1: obtaining a correction model;
Step S2.2: and calibrating the surface reflectivity and the temperature value through the correction model.
4. The method for real-time control of deposition rate and thickness of each region in a vacuum chamber according to claim 1, wherein: in step S3, the nominal deposition rate and nominal deposition thickness of the monitored area are calculated based on the corrected surface reflectivity and temperature values, including:
Step S3.1: obtaining a first calculation model and a second calculation model, wherein the first calculation model is s=a×temperature+b, s is a rated deposition rate, and a and b are model coefficients obtained by regression calculation of the surface reflectivity and the temperature value; the second calculation model is p=s×t, p is the rated deposition thickness, and t is the deposition time;
step S3.2: and calculating the rated deposition rate and the rated deposition thickness of the monitoring area through the first calculation model and the second calculation model.
5. The method for real-time control of deposition rate and thickness of each region in a vacuum chamber according to claim 1, wherein: in step S4, if the difference between the actual deposition rate and the rated deposition rate/the actual deposition thickness and the rated deposition thickness of the monitoring area is a positive value, decreasing the output power value of the showerhead (6); if the difference between the actual deposition rate and the nominal deposition rate/thickness of the monitored area is negative, the output power value of the spray head (6) is increased.
6. A device for real-time regulation of deposition rate and thickness of various regions in a vacuum chamber as claimed in claim 1, wherein: the device comprises at least one sensing module (2) for acquiring the surface reflectivity of a part of a substrate (5) in any monitoring area and the temperature value of the monitoring area, a data processing module (3) for calibrating and correcting the acquired surface reflectivity and temperature value and calculating the rated deposition rate and rated deposition thickness of the monitoring area based on the corrected surface reflectivity and temperature value, and a regulating module (4) for acquiring the actual deposition rate and actual deposition thickness of the monitoring area, comparing and judging the actual deposition rate and actual deposition thickness with the rated deposition rate and rated deposition thickness, and correspondingly and dynamically regulating the output power value of the spray head (6) based on the comparison result.
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