CN118017266B - Spring needle, electronic equipment and charging equipment - Google Patents

Abstract

The application provides a spring needle, electronic equipment and charging equipment, and relates to the technical field of electronic equipment. The spring needle is used for solving the problem that the contact between the probe and the sleeve is unstable due to the inclined swing of the probe of the spring needle. The spring needle comprises a sleeve, a spring and a probe. The sleeve is internally provided with a cavity. The spring is arranged in the cavity. The probe part extends into the cavity, and the spring is abutted between the probe and the bottom surface of the cavity; the end face of one end of the probe extending into the cavity is an inclined plane, and a first included angle is formed between the inclined plane and a plane perpendicular to the axis of the probe. The probe and the side wall of the cavity are provided with gaps, the maximum inclination angle of the probe in the sleeve is a second included angle, and the first included angle is larger than the second included angle.

Description

Spring needle, electronic device and charging device

Technical Field

The present application relates to the technical field of electronic equipment, and in particular to a spring pin, an electronic device and a charging device.

Background Art

The spring pin is a common electronic connection device that can be used to charge electronic devices or transmit signals. The spring pin includes a sleeve, a probe, a spring and other components. The spring is set in the sleeve, and the probe part extends into the sleeve and abuts against the spring. When the probe compresses the spring, the probe can abut against the inner wall of the sleeve to achieve conduction at both ends of the spring pin. However, there is a gap between the probe and the sleeve, and the probe will tilt and swing when moving, resulting in unstable contact between the probe and the sleeve, causing problems such as instantaneous disconnection.

Summary of the invention

The embodiments of the present application provide a spring needle, an electronic device, and a charging device, which are used to solve the problem that the probe of the spring needle tilts and swings, resulting in unstable contact between the probe and the sleeve, causing instantaneous disconnection.

To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

In a first aspect, a spring needle is provided, which comprises a sleeve, a spring and a probe. The sleeve has a cavity inside. The spring is arranged in the cavity. The probe partially extends into the cavity, and the spring abuts between the probe and the bottom surface of the cavity; the end surface of the probe extending into the cavity is an inclined surface, and a first angle is formed between the inclined surface and a plane perpendicular to the axis of the probe. There is a gap between the probe and the side wall of the cavity, the maximum inclination angle of the probe in the sleeve is the second angle, and the first angle is greater than the second angle.

In the spring needle provided in the first aspect of the present application, when the end face of the probe is a bevel, the bevel forms an ellipse, the length of the major axis of the ellipse is greater than the diameter of the probe (the minor axis is equal to the diameter of the probe), and the larger the first angle between the bevel and the cross-section of the probe, the larger the length of the major axis of the bevel.

In this way, when the probe is tilted, the angle formed between the inclined surface and the cross section of the sleeve decreases, that is, the inclined surface gradually tends to be parallel to the cross section of the sleeve, that is, the long axis rotates in the direction parallel to the cross section of the sleeve. Since the long axis of the inclined surface is larger than the diameter of the probe and the tilt angle of the probe is only about 3°-5°, the end point of the long axis of the inclined surface, which is farthest from the other end of the probe, can abut against the sleeve.

In addition, the point on the inclined surface farthest from the other end of the probe abuts against the inner wall of the cavity, and a contact point is also formed at the opening of the probe and the sleeve. The vertical projections of the two contact points on the cross section of the probe are symmetrically arranged along the axis. Therefore, the probe and the sleeve can be stably abutted, and when the probe is subjected to external pressure, it will not shake easily, thereby achieving stable contact between the probe and the sleeve.

In a possible implementation of the first aspect of the present application, the probe includes a first part and a second part, the diameter of the first part is smaller than the diameter of the second part, the second part is located in the cavity, and the end face of the second part away from the first part is an inclined surface and abuts against the spring; one end of the first part away from the second part extends out of the cavity; the opening diameter of the sleeve is smaller than the diameter of the cavity inside the sleeve, and smaller than the diameter of the second part.

In a possible implementation of the first aspect of the present application, the probe is capable of moving between a first position and a second position. When the probe is in the first position, the end face of the second part of the probe close to the first part abuts against the opening edge of the sleeve; when the probe is in the second position, the first part moves into the cavity, the spring is compressed, and the end of the second part away from the first part abuts against the inner wall of the cavity.

In a possible implementation of the first aspect of the present application, the end of the second part away from the first part has a first contact portion, the first contact portion is a position farthest from the first part along the axial direction of the probe, and the end of the second part close to the first part has a second contact portion;

The vertical projections of the first contact portion and the second contact portion on the cross section of the probe are symmetrically arranged along the axis of the probe; when the probe is in the second position, the first contact portion and the second contact portion are both in contact with the inner wall of the cavity. In this way, the two positions where the probe and the sleeve are in contact are both located in the cavity, which is conducive to protecting the contact points and reducing the risk of water corrosion.

In a possible implementation of the first aspect of the present application, when the probe is in the second position, there is a gap between the first portion and the inner wall of the opening of the sleeve. Under this structure, it is possible to further ensure that the probe is in stable contact with the sleeve, reducing the risk of PIM problems.

In a possible implementation of the first aspect of the present application, when the probe is in the first position, the maximum gap between the first part and the opening of the sleeve is greater than the maximum gap between the second part and the inner wall of the sleeve. In this way, when the probe moves to the second position, the second part of the probe will first abut against the inner wall of the sleeve, so that there is a gap between the first part and the opening of the sleeve.

In a possible implementation of the first aspect of the present application, when the probe is in the first position, the distance between the first part and the inner wall of the opening of the sleeve is a first distance X, X>d ₁ /2(cosθ+tanθ+sinθtanθ-1)+d ₂ /2(cosθ-1)+(a+g)sinθ-ntanθ-m;

Among them, _d1 is the diameter of the first part, _d2 is the diameter of the second part, a is the maximum length of the second part along the middle axis, g is the length of the first part - _d1 /2, θ is the maximum tilt angle when the probe is in the second position, m is the maximum distance between the second part and the inner wall of the cavity when the probe is in the first position, and n is the difference between the total length of the spring needle and the length of the sleeve when the probe is in the second position. That is, when the probe is in the first position and the distance between the first part of the probe and the opening of the sleeve meets the above conditions, it can be ensured that after the probe moves to the second position, the first part of the probe does not contact the opening of the sleeve.

In a possible implementation of the first aspect of the present application, the probe also includes a third part, which is arranged between the first part and the second part, and the diameter of the third part gradually decreases from the second part to the first part; when the probe is in the first position, the third part abuts against the opening edge of the sleeve.

In a possible implementation of the first aspect of the present application, when the probe is in the first position, the distance between the first part and the inner wall of the opening of the sleeve is a first distance X, X>d ₁ /2(cosθ+tanθ+sinθtanθ-1)+d ₂ /2(cosθ-1)+(a+f+g)sinθ-ntanθ-m;

Wherein, _d1 is the diameter of the first part, _d2 is the diameter of the second part, a is the maximum length of the second part along the axial direction, g is the length of the first part - _d1 /2, θ is the inclination angle when the probe is in the second position, m is the maximum distance between the second part and the inner wall of the cavity when the probe is in the first position, n is the difference between the total length of the spring needle and the length of the sleeve when the probe is in the second position, and f is the length of the third part.

In a possible implementation of the first aspect of the present application, when the probe is in the second position, the end of the second part away from the first part abuts against the inner wall of the cavity, and the first part abuts against the opening of the sleeve. In this structure, a contact point is formed between the probe and the opening of the sleeve.

In a possible implementation of the first aspect of the present application, the sleeve includes a cylinder and a cover, the cover is connected to the cylinder, an opening is formed on the cover, and a chamfer is formed on the edge of the inner wall of the opening away from the cylinder. Under this structure, the roughness of the inner wall of the opening can be reduced to improve the contact stability of the first part abutting against the opening of the sleeve.

In a possible implementation of the first aspect of the present application, a chamfer is provided on the inner wall of the opening near the edge of the cylinder.

In a possible implementation of the first aspect of the present application, the sleeve includes a barrel and a cover, and along the axial direction of the spring pin, one end of the cover is connected to the barrel, the middle of the cover is used for abutting the first part, and the other end of the cover extends in a direction away from the first part. Under this structure, the first part abuts against the middle of the cover, thereby improving the contact stability of the abutment between the first part and the cover.

In a possible implementation of the first aspect of the present application, the spring needle further includes an insulating layer, which is disposed on the inner wall of the cavity, and when the probe is located at the second position, the end of the second part away from the first part abuts against the insulating layer. In this structure, the radio frequency signal is transmitted between the probe and the sleeve by electromagnetic coupling.

In a possible implementation of the first aspect of the present application, the insulating layer fills the gap between the second portion and the inner wall of the cavity. In this structure, it is beneficial to increase the contact area between the probe and the insulating layer, and to improve the coupling effect between the two.

In a possible implementation of the first aspect of the present application, along the axial direction of the spring needle, the cavity includes a first area and a second area, the first area is arranged at one end close to the opening of the sleeve, and the second area is arranged at one end away from the opening of the sleeve; the diameter of the first area is greater than the diameter of the second area, and when the probe is in the second position, the end of the second part away from the first part abuts against the second area. In this way, the probe can be prevented from contacting the inner wall of the sleeve during the movement of the probe, thereby reducing the risk of PIM problems during the movement of the probe.

In a possible implementation of the first aspect of the present application, when the probe is in the first position, the distance between the first portion and the inner wall of the opening of the sleeve is the first distance, and the diameter difference between the first area and the second area is greater than the first distance. Under this structure, it can be further ensured that the probe will not contact the inner wall of the sleeve during movement.

In a possible implementation of the first aspect of the present application, when the probe is located at the second position, the pressure F applied to the probe is ≥ 0.3 N. Under the pressure, the probe can be in stable contact with the sleeve.

In a possible implementation of the first aspect of the present application, the spring needle further includes a ball, and the ball abuts between the spring and the probe. Exemplarily, the ball can be a conductive material, such as a copper ball. Alternatively, the ball can also be an insulating material, such as a zirconium ball.

In a second aspect, an electronic device is provided, which includes a mainboard and a spring pin, wherein the spring pin is a spring pin as described in any of the above technical solutions, wherein a sleeve of the spring pin is fixed on the mainboard, and a probe of the spring pin is used to abut against an external device.

The electronic device provided in the second aspect of the present application, because it includes the spring pins as described in any of the above technical solutions, can solve the same technical problems and achieve the same technical effects.

In a third aspect, a charging device is provided, which includes a circuit board and a spring pin, wherein the spring pin is a spring pin as described in any of the above technical solutions, the spring pin is fixed on the circuit board, and a probe of the spring pin is used to abut against the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a structural diagram of an electronic device provided in an embodiment of the present application;

FIG2 is an exploded view of an electronic device provided in an embodiment of the present application;

FIG3 is a structural diagram of an electronic device and a charging device provided in an embodiment of the present application;

FIG4 is a structural diagram of a spring pin provided in an embodiment of the present application;

FIG5 is a structural diagram of another spring pin provided in an embodiment of the present application;

FIG. 6 is another connection structure diagram of the spring pin and the abutment surface provided in FIG. 5

FIG. 7 is another connection structure diagram of the spring pin and the abutment surface provided in FIG. 5 ;

FIG8 is a structural diagram of another spring pin provided in an embodiment of the present application;

FIG9 is a partial structural diagram of a probe and a sleeve provided in an embodiment of the present application;

FIG10 is a schematic diagram of a conductive path of a spring pin whose ball is a copper ball provided in an embodiment of the present application;

FIG11 is a schematic diagram of a conductive path of a spring pin with a ball as a pick provided in an embodiment of the present application;

FIG12 is a schematic diagram of a simulation of a DC signal passing through a pogo pin according to an embodiment of the present application;

FIG13 is a schematic diagram of a simulation of a pogo pin passing a radio frequency signal according to an embodiment of the present application;

FIG14 is a structural diagram of a spring pin in a first position provided by an embodiment of the present application;

FIG15 is a structural diagram of a spring pin in a second position provided by an embodiment of the present application;

FIG16 is a structural diagram of another spring pin provided by an embodiment of the present application in a first position;

FIG17 is a structural diagram of another spring pin provided by an embodiment of the present application in a second position;

FIG18 is a schematic diagram showing the dimensions of various parts of the spring pin provided in FIG16 ;

FIG19 is a schematic diagram showing the dimensions of various parts of the spring pin provided in FIG17 ;

FIG20 is a schematic diagram of dimension markings of various parts of another spring needle (the probe is located at the first position) provided in an embodiment of the present application;

FIG21 is a schematic diagram of dimension markings of various parts of another spring needle (the probe is located at the second position) provided in an embodiment of the present application;

FIG22 is a structural diagram of another spring needle (the probe is located at the second position) provided in an embodiment of the present application;

FIG23 is a structural diagram of another spring needle (the probe is located at the second position) provided in an embodiment of the present application;

FIG24 is a partial structural diagram of another sleeve and probe provided in an embodiment of the present application;

FIG25 is a partial structural diagram of another sleeve and probe provided in an embodiment of the present application;

FIG26 is a structural diagram of another sleeve and a probe (located at a first position) provided in an embodiment of the present application;

FIG27 is a structural diagram of another sleeve and a probe (located at a second position) provided in an embodiment of the present application;

Figure 28 is a structural diagram of another sleeve and a probe (located in the first position) provided in an embodiment of the present application;

Figure 29 is a structural diagram of another sleeve and a probe (located in the second position) provided in an embodiment of the present application;

FIG. 30 is a structural diagram of another spring needle 500 (probe 520 is located at a first position) provided in an embodiment of the present application;

FIG31 is a structural diagram of another spring needle 500 provided in FIG30 , in which the probe 520 is located in a second position;

FIG. 32 is a structural diagram of another spring needle 500 (probe 520 is located at the first position) provided in an embodiment of the present application;

FIG. 33 is a structural diagram showing a probe 520 of another spring needle 500 provided in FIG. 32 , in which the probe 520 is located at a second position.

Figure numerals: 10-electronic device; 100-watch strap; 110-first strap body; 120-second strap body; 200-housing; 210-middle frame; 220-back cover; 230-connecting shaft; 300-display module; 310-translucent cover plate; 320-display screen; 400-main board; 500-spring pin; 510-sleeve; 511-opening; 512-cylinder; 513-cover body; 514-cavity; 514a-first area; 514b-second area Two regions; 520-probe; 521-first part; 522-second part; 522a-inclined surface; 522b-first contact portion; 522c-second contact portion; 523-third part; 530-spring; 540-ball; 550-insulating sleeve; 560-insulating layer; 20-charging device; 201-charging contact surface; 30-abutting surface; 301-metal layer; 302-material layer; 40-position one; 41-position two; 42-position three.

DETAILED DESCRIPTION

The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

In the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

The embodiment of the present application provides an electronic device, which is a type of electronic device with a display function. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a wearable device (including a smart watch, a smart bracelet, etc.), a mobile phone, a tablet computer (tablet personal computer), a laptop computer (laptop computer), a personal digital assistant (personal digital assistant, PDA), a monitor, a camera, a personal computer, a notebook computer, etc. For the convenience of explanation, the following examples are all taken as an example of an electronic device being a smart watch.

Please refer to Figures 1 and 2. Figure 1 is a structural diagram of an electronic device 10 provided in an embodiment of the present application, and Figure 2 is an exploded view of the electronic device 10 provided in an embodiment of the present application, wherein the strap 100 is not shown in Figure 2. As can be seen from the above, in this embodiment, the electronic device 10 is a smart watch (i.e., a wearable device). The electronic device 10 may include a display module 300, a housing 200, a strap 100, a mainboard 400, and a charging module (not shown in the figure).

The watchband 100 is used to wear the electronic device 10 on the wrist. The watchband 100 may include a first band body 110 and a second band body 120, and the first band body 110 and the second band body 120 are respectively arranged on both sides of the housing 200. The watchband 100 may be made of leather material, plastic material or metal material.

In some embodiments, the first strap body 110 of the strap 100 and the housing 200, as well as the second strap body 120 of the strap 100 and the housing 200, can be connected via a connecting shaft 230. For example, the connecting shaft 230 passes through a connecting hole (not shown) on the first strap body 110, and both ends of the connecting shaft 230 are connected to the housing 200, so that the first portion 521 can rotate relative to the housing 200. The two ends of the connecting shaft 230 can be fixedly connected to the housing 200 or movably connected.

Alternatively, the first strap body 110 and the second strap body 120 of the strap 100 may be fixed to the housing 200, for example, the strap 100 and the housing 200 are integrally injection molded, that is, the strap 100 and the housing 200 form an integrated structure. Therefore, the embodiment of the present application does not specifically limit the specific material of the strap 100 and the connection method of the strap 100 and the housing 200.

The housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 may include a middle frame 210 and a back cover 220. The first part 521 and the second part 522 of the strap 100 are respectively arranged on both sides of the middle frame 210 and connected to the middle frame 210. The materials of the middle frame 210 and the back cover 220 include but are not limited to metal, ceramic, plastic and glass. In addition, the material of the middle frame 210 and the material of the back cover 220 may be the same or different.

The back cover 220 is disposed on one side of the middle frame 210 and is fixedly connected to the middle frame 210. For example, the back cover 220 and the middle frame 210 can be fixed by bonding, clamping, welding or threaded connection. Alternatively, the back cover 220 and the middle frame 210 can also be an integrally formed structure, that is, the shell 200 formed by the middle frame 210 and the back cover 220 is an integral structural member. Therefore, the embodiment of the present application does not specifically limit the specific structure and material of the shell 200.

The above-mentioned display module 300 is used to display images. The display module 300 may include a light-transmitting cover plate 310 and a display screen 320 (English name: panel, also called display panel). Specifically, the light-transmitting cover plate 310 and the display screen 320 are stacked, and the two can be fixed by optical adhesive. The material of the light-transmitting cover plate 310 includes but is not limited to glass. For example, the light-transmitting cover plate 310 can be made of ordinary light-transmitting glass to protect the display screen 320 to avoid damage to the display screen 320 due to external force, and it can play a dust-proof role. Alternatively, a light-transmitting cover plate 310 with a touch function can also be used to enable the electronic device 10 to have a touch function, thereby making it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the light-transmitting cover plate 310.

Furthermore, the light-transmitting cover plate 310 is disposed on a side of the middle frame 210 away from the back cover 220, and the middle frame 210 is fixedly connected to the light-transmitting cover plate 310. In this way, the light-transmitting cover plate 310, the middle frame 210 and the back cover 220 form a receiving space, and the display screen 320 and other electronic devices are all disposed in the receiving space.

For example, the light-transmitting cover plate 310 may partially extend into the middle frame 210 and be bonded and fixed to the inner wall of the middle frame 210. Alternatively, the light-transmitting cover plate 310 may also be fastened to the surface of the middle frame 210 away from the back cover 220, that is, the gap between the light-transmitting cover plate 310 and the middle frame 210 cannot be directly seen from the display surface of the electronic device 10, so that the user can obtain a better visual effect, which is conducive to improving the user experience.

In addition, the display screen 320 may be a flexible display screen 320 or a rigid display screen 320. For example, the display screen 320 may be an organic light-emitting diode (OLED) display screen 320, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen 320, a mini light-emitting diode display screen 320, a micro light-emitting diode display screen 320, a micro organic light-emitting diode display screen 320, a quantum dot light emitting diode (QLED) display screen 320, a liquid crystal display 320 (LCD), and the like.

The mainboard 400 is used to set the electronic devices inside the electronic device 10 and realize the electrical connection between the electronic devices. The mainboard 400 can be fixed on the middle frame 210 by gluing, threading, welding, clamping, etc. The electronic device is used to realize various functions of the electronic device 10. For example, the electronic device can be a control chip (such as a system on chip, System on Chip, SOC), a graphics control chip (graphics processing unit, GPU), a universal flash storage (UFS), a camera module, a flash module, and a battery.

The charging module is used to charge the battery of the electronic device 10, and the charging module is electrically connected to the mainboard 400. Specifically, please refer to FIG. 3, which is a structural diagram of the electronic device 10 and the charging device 20 provided in an embodiment of the present application. The electronic device 10 is connected to the external charging device 20, so that the charging device 20 is electrically connected to the electronic device 10 through the charging module, and the battery of the electronic device 10 is charged.

Specifically, please continue to refer to FIG. 3 , the charging module includes a plurality of pogo pins 500, which are fixed on the mainboard 400 and electrically connected to the mainboard 400, and one end of the pogo pin 500 away from the mainboard 400 extends out of the housing 200 of the electronic device 10, for example, it can extend from the surface of the back cover 220, or it can extend from the side wall of the middle frame 210. A circuit board and a charging module (not shown in the figure) are arranged inside the charging device 20, the charging module is electrically connected to the circuit board, and the charging module has a charging contact surface 201, and the charging contact surface 201 is exposed on the surface of the charging device 20.

When the electronic device 10 is connected to the charging device 20, the spring pin 500 abuts against the charging contact surface 201 of the charging device 20, so that the electronic device 10 is electrically connected to the charging device 20, so that the charging device 20 can charge the battery of the electronic device 10. In some embodiments, the charging device 20 and the electronic device 10 can be plugged into each other, for example, in the form of a male and a female plug. Alternatively, the charging device 20 and the electronic device 10 can also be connected by magnetic attraction, for example, one of the charging device 20 and the electronic device 10 is provided with a magnetic part (i.e., a magnet, for example, as shown by the two circles on both sides of the charging contact surface 201 in FIG. 3), and the other of the charging device 20 and the electronic device 10 has a metal part (for example, as shown by the two circles on both sides of the spring pin 500 in FIG. 3), and the charging device 20 and the electronic device 10 are connected by the magnetic part and the metal part. At the same time, the spring pin 500 abuts against the charging contact surface 201, so that the electronic device 10 is charged by the charging device 20.

In some other possible embodiments, the charging module can be disposed in the charging device 20, and the charging module can be disposed in the electronic device 10, that is, the spring pin 500 is disposed in the charging device 20, and the charging contact surface 201 is located on the surface of the electronic device 10. When the electronic device 10 is connected to the charging device 20, the spring pin 500 abuts against the charging contact surface 201, so that the charging device 20 charges the electronic device 10. Therefore, the embodiments of the present application are not particularly limited to this, and the following embodiments are all described by taking the spring pin 500 disposed on the electronic device 10 as an example.

Based on this, in order to ensure that the charging device 20 and the electronic device 10 can be stably connected for charging, on the one hand, the spring pin 500 needs to be stably in contact with the charging contact surface 201, and on the other hand, the spring pin 500 itself needs to be stably conductive. Among them, the stable contact between the spring pin 500 and the charging contact surface 201 depends on the connection stability between the electronic device 10 and the charging device 20. The stable conduction of the spring pin 500 itself depends on its own structure.

Specifically, please refer to FIG. 4, which is a structural diagram of a spring pin 500 provided in an embodiment of the present application. The spring pin 500 includes a sleeve 510, a probe 520 and a spring 530. The spring 530 is arranged inside the sleeve 510, and the probe 520 partially extends into the sleeve 510 and abuts against the spring 530. When the charging device 20 is connected to the electronic device 10, the probe 520 of the spring pin 500 abuts against the charging contact surface 201 and is squeezed by the charging contact surface 201. The probe 520 moves toward the inside of the sleeve 510 and compresses the spring 530. Under the elastic force of the spring 530, the probe 520 can be stably abutted against the charging contact surface 201. In addition, the probe 520 compresses the spring 530, so that the probe 520 and the spring 530 form a stable conduction, thereby realizing the electrical connection between the electronic device 10 and the charging device 20, and charging the battery of the electronic device 10.

In addition, please refer to Figure 5, which is a structural diagram of another spring pin 500 provided in an embodiment of the present application. The spring pin may further include a ball 540, which may be disposed between the probe 520 and the spring 530, and may be made of insulating material or conductive material.

In other embodiments, the spring pin 500 can be used for antenna signal transmission in addition to charging the electronic device 10, that is, the spring pin 500 is arranged on the mainboard 400, and the probe 520 of the spring pin 500 is used to abut against the surface of other devices (hereinafter referred to as the abutment surface 30), for example, the device can be a screen, a shielding cover, an antenna pad (also called a flat antenna or a patch antenna), a metal decorative cover, etc.

For example, please continue to refer to FIG5 , the sleeve 510 of the spring pin 500 can be welded and fixed on the mainboard 400, and one end of the probe 520 of the spring pin 500 extending out of the sleeve 510 can directly abut against the above-mentioned abutment surface 30. Alternatively, please refer to FIG6 , which is another connection structure diagram of the spring pin 500 and the abutment surface 30 provided in FIG5 , and a metal layer 301 can be spot welded on the abutment surface 30, and the probe 520 abuts against the metal layer 301. Alternatively, a silver paste layer is formed on the abutment surface 30 (as shown in FIG6 , the metal layer 301 is replaced by a silver paste layer), and the probe 520 abuts against the silver paste layer.

Alternatively, please refer to FIG. 7, which is another connection structure diagram of the spring pin 500 and the abutting surface 30 provided in FIG. 5, a material layer 302 such as conductive glue, insulating glue or dielectric material is provided on the abutting surface 30, a metal layer 301 is provided on the surface of the material layer 302 away from the abutting surface 30, and the probe 520 abuts against the metal layer 301. Alternatively, a material layer 302 such as conductive glue or insulating glue is provided on the abutting surface 30, a dielectric material layer is provided on the surface of the material layer 302 away from the abutting surface 30 (as shown in FIG. 7, the metal layer 301 is replaced by a dielectric material layer), and the probe 520 abuts against the dielectric material layer, etc. It can be understood that the above connection structures are only some examples, and other structural layers can be provided between the probe 520 and the abutting surface 30 to form an electrical connection, so the embodiments of the present application do not specifically limit this.

In some embodiments, when the spring pin 500 abuts between the main board 400 and the abutting surface 30, the length of the spring 530 will continuously change during the movement of the probe 520, which may cause the antenna resonance to shift. Therefore, the spring 530 and the probe 520 can be insulated, so that the probe 520 contacts the inner wall of the sleeve 510 to form a stable antenna path, thereby reducing the influence of the spring 530 on the antenna resonance.

Specifically, please continue to refer to Figures 5 to 7. The ball 540 of the spring needle 500 can be made of insulating material, for example, a zirconium bead. The ball 540 abuts between the probe 520 and the spring 530, so that the probe 520 and the spring 530 are insulated. Alternatively, please refer to Figure 8, which is a structural diagram of another spring needle 500 provided in an embodiment of the present application. The spring needle 500 may include an insulating sleeve 550, which is sleeved on one end of the spring 530 close to the probe 520, and the end of the insulating sleeve 550 abutting against the probe 520 forms a hemispherical structure, and the end surface of the probe 520 abutting against the insulating sleeve 550 forms an inclined surface 522a to ensure that the probe 520 and the insulating sleeve 550 are stably abutted, so as to achieve insulation between the probe 520 and the spring 530. Alternatively, the spring 530 can be made of insulating material to achieve insulation between the probe 520 and the spring 530.

However, please refer to Figure 9, which is a partial structural diagram of the probe 520 and the sleeve 510 provided in the embodiment of the present application. Since the probe 520 needs to move along the axial direction of the spring needle 500, there is a certain gap between the probe 520 and the sleeve 510. This gap causes the probe 520 to swing away from the axial direction when moving along the axial direction (generally, the swing angle is about 3° to 5°, and the swing angle of the probe 520 with the ball 540 and the end face of the inclined surface 522a is the smallest), resulting in unstable contact between the probe 520 and the sleeve 510, causing problems such as instantaneous disconnection and PIM.

It should be noted that PIM refers to Passive Intermodulation (PIM), which is a type of signal distortion. It refers to the signal distortion caused by the nonlinear characteristics of the connection point (i.e. contact point) or material (i.e. contact instability) when two or more signals of different frequencies are mixed and input into a passive device. The nonlinear mixing that causes PIM does not involve active devices, but is usually caused by metal materials, the manufacturing process of interconnected devices, or other passive devices in the system.

Furthermore, since the probe 520 contacts the inner wall of the sleeve 510 to form a single path for DC and RF current (ie, AC), the number of paths is reduced (originally, the probe 520 and the spring 530 and the probe 520 and the sleeve 510 both form paths), thus causing an increase in DC impedance.

Based on this, the embodiment of the present application takes the spring needle 500 provided with the ball 540 as an example to test the PIM and DC impedance. Please refer to Figures 10 and 11. Figure 10 is a schematic diagram of the conduction path of the spring needle 500 provided in the embodiment of the present application where the ball 540 is a copper ball, and Figure 11 is a schematic diagram of the conduction path of the spring needle 500 provided in the embodiment of the present application where the ball 540 is a pick bead. It can be seen from the figure that when the spring needle 500 adopts a copper ball, there are two conduction paths, namely, the probe 520 to the ball 540, and the probe 520 to the sleeve 510. When the spring needle 500 adopts a pick bead, there is only one conduction path, namely, the probe 520 to the sleeve 510.

Therefore, three different spring pins 500 are prepared, the three spring pins 500 are respectively a spring pin 500 whose ball 540 is a copper ball (conductive), a spring pin 500 whose ball 540 is a pick bead (insulating), and another spring pin 500 whose ball 540 is a pick bead, wherein the sizes of the two spring pins 500 whose ball 540 is a pick bead are different. Please refer to Table 1, Table 2 and Table 3 for the test results.

Table 1

Table 2

Table 3

The upper contact surface refers to the abutment surface 30, and the lower contact surface refers to the surface in contact with the mainboard 400. The knocking state refers to the situation where the spring pin 500 or the electronic device 10 provided with the spring pin 500 collides or shakes. The spring pin 500 of Table 1 uses a copper ball as the ball 540, that is, the spring pin 500 has a double path. The spring pins 500 of Tables 2 and 3 use different pick beads as the ball 540, that is, a single path is formed.

As can be seen from the above table, the spring needles 500 in Tables 1 and 2 did not experience instantaneous disconnection in both the static and knocking states. The impedance of the pick-bead solution corresponding to Table 2 was stable in the static state, and the impedance jumped in the knocking state. When the pressure was greater than 0.7N, the impedance could reach stability in the knocking state. There was no significant difference in the PIM of the two. One reached stability at 0.22N, i.e., the pick-bead solution in Table 2, and the other reached stability at 0.33N, with a small difference. However, the pick-bead solution in Table 3 had poor test results in PIM. When the force reached 2N, it still did not reach stability.

In addition, the above-mentioned spring needle 500 (copper ball solution corresponding to Table 1) is simulated and tested, please refer to Figure 12 and return to Figure 10, Figure 12 is a schematic diagram of the simulation of the spring needle 500 passing a DC signal in the embodiment of the present application. In the case of a DC signal, the flow direction of the current is along the shortest path with the minimum impedance formed when the spring 530 is compressed to the limit, that is, the DC current is concentrated at the position with the shortest path and the minimum impedance, that is, it flows to the other end through the probe 520 and the spring 530.

Please refer to FIG. 13 and return to FIG. 11 , which is a schematic diagram of the simulation of the spring needle 500 passing the RF signal according to the embodiment of the present application. For the RF signal, due to the skin effect, the current mainly flows through the surface, that is, most of the RF signal is transmitted through the path from the probe 520 to the sleeve 510. Therefore, even if the probe 520 and the spring 530 are conductive (for example, the copper ball solution mentioned above), the RF signal will not be transmitted through the spring 530.

From the above test and simulation results, it can be seen that for DC signals, no matter which structure the spring pin 500 adopts, it will not have a significant impact on the DC signal, because the DC current will flow along the path with the smallest impedance and the shortest path. For RF signals, no matter which structure the ball 540 of the spring pin 500 adopts, that is, insulation or conductivity, PIM problems may occur.

It can be seen that the root cause of the PIM problem is the unstable contact between the probe 520 and the sleeve 510, that is, the probe 520 swings during the movement, resulting in unstable contact between the probe 520 and the inner wall of the sleeve 510, which will cause PIM and instantaneous disconnection problems.

Specifically, please refer to Figures 14 and 15, Figure 14 is a structural diagram of the spring pin 500 provided in the embodiment of the present application in the first position, and Figure 15 is a structural diagram of the spring pin 500 provided in the embodiment of the present application in the second position. The sleeve 510 of the spring pin 500 has an opening 511, and a cavity 514 is provided inside, and the diameter of the opening 511 is smaller than the diameter of the cavity 514. Exemplarily, the sleeve 510 may include a cylinder 512 and a cover 513, the cover 513 and the cylinder 512 are integrally formed, the cover 513 is arranged at one end of the cylinder 512, the cover 513 is provided with an opening 511, the cylinder 512 has a cavity 514, and the diameter of the opening 511 is smaller than the diameter of the cavity 514.

Furthermore, the probe 520 of the spring needle 500 includes a first portion 521 and a second portion 522, wherein the diameter of the first portion 521 is smaller than the diameter of the second portion 522, and the diameter of the first portion 521 is smaller than the diameter of the opening 511. The second portion of the probe 520 extends into the cavity 514 of the sleeve 510 and abuts against the spring 530, and the first portion of the probe 520 extends out of the sleeve 510 through the opening 511.

The probe 520 can move between a first position and a second position. When the probe 520 is in the first position (as shown in FIG. 14 ), the end surface of the second portion 522 of the probe 520 close to the first portion 521 abuts against the edge of the opening 511 of the sleeve 510, that is, the second portion 522 abuts against the cover 513. When the probe 520 is in the second position, the first portion 521 moves into the cavity 514, and the spring 530 is compressed (as shown in FIG. 15 ).

During the movement of the probe 520 between the first position and the second position, the probe 520 will move in a direction deviating from its own axis. Please continue to refer to Figures 14 and 15. When the probe 520 moves to the second position, the first part 521 of the probe 520 can contact the opening 511 of the sleeve 510 (i.e., the cover 513) (hereinafter referred to as the contact position 1 40), and the end of the second part 522 of the probe 520 close to the first part 521 can contact the inner wall of the sleeve 510 (i.e., the cylinder 512) (hereinafter referred to as the contact position 2 41), and the end of the second part of the probe 520 away from the first part 521 can also contact the inner wall of the sleeve 510 (i.e., the cylinder 512) (hereinafter referred to as the contact position 3 42).

Among them, since the probe 520 is in an inclined state, on the cross section of the sleeve 510, the first position 40, the second position 41 and the third position 42 are respectively located on both sides of the axis of the sleeve 510, that is, the first position 40 and the third position 42 are distributed along the radial direction of the sleeve 510, and the second position 41 and the third position 42 are also distributed along the radial direction of the sleeve 510. It can be understood that since the first position 40 is the position where the first part 521 contacts the sleeve 510, and the second position 41 and the third position 42 are the positions where the second part 522 contacts the sleeve 510, the diameter of the circumference of the vertical projection of the first position 40 on the cross section of the sleeve 510 is smaller than the diameter of the circumference of the vertical projections of the second position 41 and the third position 42 on the cross section, and the second position 41 and the third position 42 can be symmetrically arranged along the axis of the sleeve 510.

However, due to the problem of machining accuracy, it is difficult for position 1 40, position 2 41 and position 3 42 to be in a stable contact state at the same time, especially position 1 40 and position 2 41, which generally results in stable contact at one position and virtual contact at the other position, thus causing the problem of PIM instability. It can be understood that the stable contact state refers to the state in which stable contact can still be formed in the knocking state in the above test, that is, it will not be disconnected due to shaking or collision.

Based on this, the embodiment of the present application provides another spring pin 500, which can be applied to the above-mentioned electronic device 10 or charging device 20. Please refer to Figures 16 and 17, Figure 16 is a structural diagram of another spring pin 500 provided by the embodiment of the present application in the first position, and Figure 17 is a structural diagram of another spring pin 500 provided by the embodiment of the present application in the second position.

Specifically, the spring needle 500 includes the above-mentioned sleeve 510, spring 530 and probe 520. The sleeve 510 has a cavity 514 inside, the spring 530 is arranged in the cavity 514, the probe 520 partially extends into the cavity 514, and the spring 530 abuts between the probe 520 and the bottom surface of the cavity 514; the end surface of the probe 520 extending into the cavity 514 is an inclined surface 522a (indicated as an oblique line in FIG. 16). The inclined surface 522a abuts against the ball 540. In the case where the ball 540 is not provided, the inclined surface 522a can directly abut against the spring 530.

The inclined surface 522a forms a first angle A with a plane perpendicular to the axis of the probe 520, that is, the inclined surface 522a forms a first angle A with the cross section of the probe 520. In addition, the maximum inclination angle of the probe 520 in the sleeve 510 is the second angle θ, that is, when the probe 520 is in the second position, the angle between the axis of the probe 520 and the axis of the sleeve 510, the first angle A is greater than the second angle θ.

In some embodiments, the probe 520 may include the first portion 521 and the second portion 522, the diameter of the first portion 521 is smaller than the diameter of the second portion 522, and the diameter of the first portion 521 is smaller than the diameter of the opening 511, and the end surface of the second portion away from the first portion is the above-mentioned inclined surface 522a. In addition, when the probe 520 is located at the above-mentioned second position, the end of the second portion 522 away from the first portion 521 abuts against the inner wall of the cavity 514 (i.e., position three 42).

Based on this, since the cross-section of the probe 520 is circular, that is, the first part 521 and the second part 522 of the probe 520 are both cylindrical structures, when the end face of the second part 522 is a slope 522a, the slope 522a forms an ellipse, and the length of the major axis of the ellipse (that is, the oblique line representing the slope 522a in Figure 16) is greater than the diameter of the second part 522 (its minor axis is equal to the diameter of the second part 522), and the larger the first angle A between the slope 522a and the cross-section of the second part 522, the larger the length of the major axis of the slope 522a.

Since the major axis length of the inclined surface 522a is greater than the diameter of the second portion 522, when the probe 520 is tilted, the point on the inclined surface 522a that is farthest from the first portion 521 (i.e., the end point of the two end points of the major axis of the ellipse formed by the inclined surface 522a that is farther from the first portion 521) can abut against the inner wall of the cavity 514 (i.e., position three 42), so that in addition to the above-mentioned position one 40 or position two 41, the probe 520 can also abut against the inner wall of the cavity 514 at position three 42.

Furthermore, since the probe 520 is arranged at an angle, the projection position of position three 42 on the cross section of the sleeve 510 is symmetrically arranged with respect to the center of the cross section (i.e., the axis of the sleeve 510) of the projection position of the above-mentioned position one 40 or position two 41 on the cross section of the sleeve 510. Therefore, by symmetrically arranging the contact points along the axis of the sleeve 510, the reliability of the stable contact between the probe 520 and the sleeve 510 can be improved, thereby ensuring the stable contact between the probe 520 and the sleeve 510 and reducing the influence of PIM or momentary interruption problems on signal transmission.

In addition, since the first position 40 and the second position 41 cannot accurately ensure stable contact, the first position 40 and the second position 41 only need to ensure stable contact at one position to achieve stable contact between the probe 520 and the sleeve 510.

Based on this, in some embodiments, please continue to refer to FIG. 16 and FIG. 17 , the end of the second portion 522 away from the first portion 521 has a first contact portion 522b, and the first contact portion 522b is the position farthest from the first portion 521 along the axial direction of the probe 520, that is, the point farthest from the first portion 521 among the two ends of the long axis of the inclined surface 522a. The end of the second portion 522 close to the first portion 521 has a second contact portion 522c.

The vertical projections of the first contact portion 522b and the second contact portion 522c on the cross section of the probe 520 are symmetrically arranged along the center of the cross section, that is, the first contact portion 522b and the second contact portion 522c are symmetrically arranged along the axis of the probe 520. When the probe 520 is located at the second position, the first contact portion 522b and the second contact portion 522c are both in contact with the inner wall of the cavity 514, that is, the second position 41 and the third position 42 form a stable contact.

In this way, when the probe 520 moves to the second position, the probe 520 is in a tilted state. Since the vertical projections of the first contact portion 522b and the second contact portion 522c on the cross section of the probe 520 are symmetrically arranged, when the first contact portion 522b and the second contact portion 522c are both in contact with the inner wall of the cavity 514, that is, the two ends of the second portion 522 are respectively in contact with the two ends of the inner wall of the cavity 514 along the radial direction, so that the second portion 522 of the probe 520 can be stably in contact with the cavity 514. When the probe 520 is in contact between the main board 400 and the contact surface 30, the probe 520 is subjected to the pressure of the contact surface 30 and the elastic force of the spring 530, so that the probe 520 will not easily shake due to collision, that is, in this scenario, the probe 520 and the sleeve 510 are in a stable contact state.

In addition, since the second contact portion 522c is located inside the sleeve 510, the second position 41 forms a stable contact and is not easily penetrated by liquid, which is conducive to reducing the risk of corrosion and unstable contact. In addition, since the swing angle of the first part 521 is large when the probe 520 swings, it is easy to cause the problem of false touch, thereby causing the problem of RSE (Radiation Spurious Emission). Therefore, the second position 41 and the third position 42 form a stable structure, which is more conducive to ensuring the reliability of stable conduction between the probe 520 and the sleeve 510.

On this basis, to ensure that the second position 41 forms a stable contact with the third position 42, the first position 40 will not be accidentally touched. Please refer to Figures 18 and 19, Figure 18 is a schematic diagram of the dimensions of the various parts of the spring needle 500 provided in Figure 16, and Figure 19 is a schematic diagram of the dimensions of the various parts of the spring needle 500 provided in Figure 17, wherein the ball 540 and the spring 530 are not shown in Figures 18 and 19. When the probe 520 is in the second position, there is a gap between the first part 521 and the inner wall of the opening 511 of the sleeve 510 (i.e., the cover body 513).

In some embodiments, when the probe is in the first position, the maximum gap between the first portion and the opening of the sleeve is greater than the maximum gap between the second portion and the inner wall of the sleeve. In this way, when the probe moves to the second position, the second portion of the probe may first abut against the inner wall of the sleeve, thereby causing a gap to exist between the first portion and the opening of the sleeve.

Based on this, to ensure that when the probe 520 is in the second position, there is a gap between the first portion 521 and the inner wall of the opening 511 of the sleeve 510, that is, the probe 520 first contacts the inner wall of the sleeve 510 in the above-mentioned position 2 41 and position 3 42, so that the probe 520 cannot continue to tilt. Therefore, it is necessary to make the probe 520 meet the following conditions.

Specifically, when the probe 520 is at the first position, the distance between the first portion 521 and the inner wall of the opening 511 of the sleeve 510 is a first distance X, X>d ₁ /2(cosθ+tanθ+sinθtanθ-1)+d ₂ /2(cosθ-1)+(a+g)sinθ-ntanθ-m.

Wherein, _d1 is the diameter of the first portion 521, _d2 is the diameter of the second portion 522, a is the maximum length of the second portion 522 along the axial direction, g is the length of the first portion 521 - _d1 /2 (i.e., the radius of the first portion 521), θ is the maximum inclination angle when the probe 520 is in the second position (as shown in FIG. 17), m is the maximum distance between the second portion 522 and the inner wall of the cavity 514 when the probe 520 is in the first position, and n is the difference between the total length of the spring pin 500 and the length of the sleeve 510 when the probe 520 is in the second position.

Based on the above formula, when the first distance X meets the condition, that is, the first distance X is greater than the value calculated by the formula, it can be ensured that when the probe 520 is in the second position, the probe 520 is in an inclined state, and there is a gap between the first part 521 of the probe 520 and the inner wall of the opening 511 of the sleeve 510 (that is, the probe 520 and the sleeve 510 are not in contact at position one 40), and the second part 522 of the probe 520 is in contact with the inner wall of the sleeve 510, that is, both the position two 41 and the position three 42 are in stable contact.

In some other possible examples, please refer to Figures 20 and 21, Figure 20 is a schematic diagram of the dimensions of various parts of another spring needle 500 (probe 520 is located at the first position) provided in an embodiment of the present application, and Figure 21 is a schematic diagram of the dimensions of various parts of another spring needle 500 (probe 520 is located at the second position) provided in an embodiment of the present application, wherein the ball 540 and the spring 530 are not shown in Figures 20 and 21. The above-mentioned probe 520 may also include a third part 523, which is disposed between the first part 521 and the second part 522, and the diameter of the third part 523 gradually decreases from the second part 522 to the first part 521.

When the probe 520 is in the first position, the third portion 523 abuts against the edge of the opening 511 of the sleeve 510, that is, the third portion 523 abuts against the cover 513. In this case, the third portion 523 forms a tapered structure with a gradually decreasing diameter, so the inner wall of the cover 513 can form a tapered structure that imitates the third portion 523, so that when the third portion 523 abuts against the cover 513, surface-to-surface contact is formed to increase the force-bearing area, reduce local stress, and help extend the service life.

Furthermore, in this case, when the probe 520 is at the first position, the first distance X between the first portion 521 and the inner wall at the opening 511 needs to satisfy the following formula: X>d ₁ /2(cosθ+tanθ+sinθtanθ-1)+d ₂ /2(cosθ-1)+(a+f+g)sinθ-ntanθ-m. Thus, it can be ensured that when the probe 520 is at the second position, the probe 520 and the sleeve 510 are not in contact at the first position 40, and are in stable contact at the second position 41 and the third position 42.

Wherein, _d1 is the diameter of the first portion 521, _d2 is the diameter of the second portion 522, a is the maximum length of the second portion 522 along the axial direction, g is the length of the first portion 521 - _d1 /2 (i.e., the radius of the first portion 521), θ is the maximum inclination angle when the probe 520 is in the second position (as shown in FIG. 17), m is the maximum distance between the second portion 522 and the inner wall of the cavity 514 when the probe 520 is in the first position, n is the difference between the total length of the spring needle 500 and the length of the sleeve 510 when the probe 520 is in the second position, and f is the length of the third portion 523 along the axial direction of the probe 520.

On this basis, when the probe 520 is located at the second position, in order to further ensure that the probe 520 and the sleeve 510 can form a stable contact at the second position 41 and the third position 42, the pressure F applied to the probe 520 is ≥ 0.3 N. That is, at least 0.3 N of pressure is applied to the probe 520 to enable the probe 520 to form a stable contact with the sleeve 510 at the second position, thereby further improving the reliability of the stable connection between the probe 520 and the sleeve 510.

Furthermore, the inner wall of the cavity 514 of the sleeve 510 may be a good conductive interface with low roughness, for example, plated with gold, nickel, silver, copper, etc.

In addition, whether the PIM problem will occur when the probe 520 contacts the sleeve 510 can be related to parameters such as resistivity ρ _c , Young's modulus E, applied pressure F, contact area S, skin depth, roughness η, heat capacity C, thermal conductivity λ, current amplitude I, density ρ _d , etc. Among them, the adjustable variables are only applied pressure F, contact area S, roughness η and current amplitude I.

As can be seen from the above, the applied pressure F ≥ 0.3N, the current amplitude I is determined according to the application scenario, and the roughness η is determined based on the material. Therefore, the PIM value can also be adjusted by adjusting the contact area S between the probe 520 and the inner wall of the sleeve 510. When the above-mentioned probe 520 is located at the second position, the larger the contact area S between the probe 520 and the inner wall of the sleeve 510, the more conducive it is to reduce the DC impedance and form a better AC path. Since the diameter of the second part 522 is larger than the diameter of the first part 521, when the position two 41 and the position three 42 form a stable contact, the contact area between the probe 520 and the sleeve 510 is larger, which is more conducive to signal transmission.

Specifically, the radius of the abutting surface 30 formed by the abutting of the probe 520 and the sleeve 510 is r, which can be calculated by the following formula.

.

Wherein, _F0 is the contact pressure between position two 41 and position three 42, and _F0 is determined by the above-mentioned pressure F, _E1 and _E2 are Young's moduli of the probe 520 and the sleeve 510, respectively, _μ1 and _μ2 are Poisson's ratios of the probe 520 and the sleeve 510, respectively, and _R1 and _R2 are the radii of the bottom of the probe 520 (i.e., the second part 522) and the cavity 514 of the sleeve 510, respectively.

Based on this, the contact area S between the probe 520 and the sleeve 510 is equal to πr²=. Therefore, the contact area S between the probe 520 and the sleeve 510 can be calculated to facilitate adjustment of the parameter.

In other embodiments, please refer to FIG. 22, which is a structural diagram of another spring needle 500 (probe 520 is located at the second position) provided in an embodiment of the present application, wherein the spring 530 and the ball 540 are not shown in FIG. 22. When the probe 520 is located at the second position, the probe 520 and the sleeve 510 can also achieve stable contact at position 1 40 and position 3 42. That is, the first contact portion 522b of the probe 520 abuts against the inner wall of the sleeve 510, and the first portion 521 of the probe 520 abuts against the inner wall of the opening 511 of the sleeve 510. In addition, the pressure F applied to the probe 520 is ≥ 0.3N.

In this way, since the position 1 40 and the position 3 42 are also located at the two ends of the sleeve 510 in the radial direction, the probe 520 can stably abut against the sleeve 510. In addition, when the probe 520 abuts between the main board 400 and the abutting surface 30, the probe 520 is subjected to the pressure of the abutting surface 30 and the elastic force of the spring 530, so that the probe 520 will not easily shake due to collision, that is, in this scenario, the probe 520 and the sleeve 510 can also be in a stable contact state.

Exemplarily, to ensure that the position 1 40 can stably contact the position 3 42 and the position 2 41 does not contact. Therefore, when the probe 520 is in the first position, the first distance X between the first part 521 of the probe 520 and the inner wall of the opening 511 of the sleeve 510 satisfies the following formula. When the probe 520 includes the first part 521 and the second part 522, the first distance X≤d ₁ /2(cosθ+tanθ+sinθtanθ-1)+d ₂ /2(cosθ-1)+(a+g)sinθ-ntanθ-m.

Please refer to FIG. 23, which is a structural diagram of another spring needle 500 (probe 520 is located at the second position) provided in an embodiment of the present application. When the probe 520 further includes a third portion 523, the first distance X≤d ₁ /2(cosθ+tanθ+sinθtanθ-1)+d ₂ /2(cosθ-1)+(a+f+g)sinθ-ntanθ-m. The parameters in the formula are the same as those in the above example, please refer back to FIG. 18 and FIG. 20, and therefore, no repeated description is given.

In this way, since the first distance X is reduced, the angle at which the probe 520 can be tilted is reduced. Therefore, when the probe 520 moves to the second position and tilts, the probe 520 abuts against the sleeve 510 at position 1 40, and at this time, the second contact portion 522c of the second portion 522 of the probe 520 is not in contact with the inner wall of the cavity 514 of the sleeve 510. Therefore, in this scenario, the probe 520 forms a stable contact with the sleeve 510 at position 1 40 and position 3 42.

It should be noted that the increase or decrease of the first distance X can be achieved by adjusting the size of the opening 511 of the sleeve 510, or by adjusting the diameter of the first portion 521 of the probe 520. Therefore, the embodiment of the present application does not specifically limit this.

In some embodiments, please refer to FIG. 24, which is a partial structural diagram of another sleeve 510 and probe 520 provided in an embodiment of the present application. On the inner wall of the opening 511 of the sleeve 510 (i.e., the cover body 513), the edge away from the cylinder 512 is provided with a chamfer, and the chamfer is ≥ 3°. Under this structure, the edge of the opening 511 can form a smooth surface, so that when the first part 521 of the probe 520 abuts against the opening 511, a more stable contact can be formed between the two, so as to reduce the risk of unstable contact due to surface roughness.

In addition, the edge of the opening 511 of the cover 513 near the cylinder 512 may also be chamfered, and the chamfer is ≥ 3°. In this way, both edges of the opening 511 along the axial direction of the cylinder 512 form smooth surfaces, thereby further improving the reliability of the stable contact between the probe 520 and the cylinder 512.

In other embodiments, please refer to FIG. 25 , which is a partial structural diagram of another sleeve 510 and probe 520 provided in an embodiment of the present application. Along the axial direction of the sleeve 510, one end of the cover body 513 is connected to the cylinder 512, for example, the two can be integrally formed or welded and fixed. The middle part of the cover body 513 is used to abut against the first part 521 of the probe 520, and the other end of the cover body 513 extends in a direction away from the first part 521. That is, the cover body 513 forms a structure in which the middle part protrudes in the direction close to the probe 520, and is used to abut against the probe 520, thereby avoiding the roughness of the edge of the opening 511 being large, resulting in unstable contact between the probe 520 and the cylinder 512, causing instantaneous disconnection or PIM problems.

On the basis of the above, during the movement of the probe 520 of the spring needle 500 from the first position to the second position, the probe 520 has a virtual contact with the inner wall of the sleeve 510 because the pressure F applied to the probe 520 is insufficient (less than 0.3N). As the pressure F increases, the probe 520 moves to the second position, so that the probe 520 abuts against the inner wall of the sleeve 510 to form a stable contact. However, during this process, since the probe 520 and the sleeve 510 have a virtual contact, a PIM problem may occur.

Based on this, please refer to Figures 26 and 27. Figure 26 is a structural diagram of another sleeve 510 and a probe 520 (located in the first position) provided in an embodiment of the present application, and Figure 27 is a structural diagram of another sleeve 510 and a probe 520 (located in the second position) provided in an embodiment of the present application. The cavity 514 of the sleeve 510 may include a first area 514a and a second area 514b. The first area 514a is arranged at one end close to the opening 511 of the sleeve 510, and the second area 514b is arranged at one end away from the opening 511 of the sleeve 510. In addition, the diameter of the first area 514a is greater than the diameter of the second area 514b. When the probe 520 is in the second position, the end of the second part 522 of the probe 520 away from the first part 521 abuts against the second area 514b, that is, the first contact portion 522b of the probe 520 abuts against the second area 514b of the cavity 514.

In this way, since the diameter of the first area 514a is larger, the first part 521 (i.e., the first contact portion 522b) of the probe 520 cannot contact the first area 514a when the probe 520 moves from the first position to the second position, thereby reducing the risk of false contact during the movement of the probe 520, which is beneficial to improving the reliability of stable contact between the probe 520 and the sleeve 510.

In some embodiments, please continue to refer to FIG. 26 and FIG. 27. The first region 514a may be an annular groove opened on the inner wall of the cavity 514 of the sleeve 510, that is, the wall thickness of the sleeve 510 in the first region 514a is smaller than that in the second region 514b. Alternatively, FIG. 28 is a structural diagram of another sleeve and probe (located in the first position) provided in an embodiment of the present application, and FIG. 29 is a structural diagram of another sleeve and probe (located in the second position) provided in an embodiment of the present application. The first region 514a of the sleeve 510 may also be made to protrude outward, so that the diameter of the first region 514a is larger than the diameter of the second region 514b. Therefore, the present application does not make any special limitation on this.

In other embodiments, when the probe 520 is at the second position, the second position 41 and the third position 42 form a stable contact, and the length Y of the first region 514a along the axial direction of the sleeve 510 is greater than or equal to the downward stroke of the spring 530. In this way, during the movement of the probe 520, the first contact portion 522b will not contact the first region 514a, and the probe 520 can be in stable contact with the sleeve 510 when it is at the second position.

Exemplarily, based on the force calculation formula F=kx, F is the pressure applied to the probe 520, k is the elastic coefficient of the spring 530, and x is the compression stroke of the spring 530, that is, the movement stroke of the probe 520. Therefore, based on the pressure F and the elastic coefficient k of the spring 530, the movement stroke of the probe 520 can be calculated. Thus, the minimum value of the length Y of the first region 514a is determined.

Furthermore, the difference between the diameter of the first region 514a and the diameter of the second region 514b is greater than or equal to the first distance X (i.e., the distance between the second portion 522 of the probe 520 and the inner wall of the opening 511 of the sleeve 510 when the probe 520 is in the first position). In this way, it can be further ensured that the probe 520 will not contact the first region 514a during the movement from the first position to the second position, thereby further reducing the risk of PIM problems.

In addition, in this case, in order to ensure that the probe 520 and the sleeve 510 do not contact at position 40 (there is a gap at position 40), an insulating material may be provided at the opening 511 of the sleeve 510 to further ensure that the probe 520 and the sleeve 510 do not conduct at position 40. The embodiment of the present application does not specifically limit this.

In other embodiments, please refer to Figures 30 and 31, Figure 30 is a structural diagram of another spring needle 500 (probe 520 is located at the first position) provided in an embodiment of the present application, and Figure 31 is a structural diagram of another spring needle 500 provided in Figure 30 with probe 520 located at the second position. When the probe 520 is located at the second position and there is no direct contact between the probe 520 and the inner wall of the sleeve 510, for example, when there is an insulating layer 560 between the inner wall of the sleeve 510 and the second part 522 of the probe 520, the current can also be coupled to the surface of the sleeve 510 by electromagnetic coupling and remain at the other end of the spring needle 500.

Specifically, the spring needle 500 provided in the embodiment of the present application may further include an insulating layer 560, which is arranged on the inner wall of the cavity 514 of the sleeve 510. When the probe 520 is in the second position, the end of the second part 522 away from the first part 521 abuts against the insulating layer 560, that is, the first contact portion 522b and the second contact portion 522c of the second part 522 both abut against the insulating layer 560.

Moreover, based on the capacitance formula C=ε*ε ₀ * S/d, ε is the relative dielectric constant (i.e., the dielectric constant of the probe 520 and the sleeve 510), ε ₀ is the vacuum dielectric constant, S is the contact area, and d is the dielectric thickness. The contact area S can be calculated by the above formula. It can be seen that the larger the contact area S, the smaller the dielectric thickness d, and the larger the relative dielectric constant ε, the better the electromagnetic coupling effect.

In some examples, in order to further increase the contact area S between the probe 520 and the insulating layer 560, the insulating layer 560 can fill the gap between the second portion 522 of the probe 520 and the inner wall of the cavity 514 of the sleeve 510. In this way, when the probe 520 moves, since the insulating layer 560 fills between the second portion 522 and the inner wall of the sleeve 510, the probe 520 only moves along its own axis and does not tilt. In addition, the side walls of the second portion 522 of the probe 520 are all in contact with the insulating layer 560, so that the contact area between the probe 520 and the insulating layer 560 is maximized, which is conducive to further improving the coupling effect between the probe 520 and the sleeve 510.

In addition, the insulating layer 560 may cover the entire area of the inner wall of the cavity 514 of the sleeve 510. Alternatively, please refer to Figures 32 and 33, Figure 32 is a structural diagram of another spring needle 500 (probe 520 is located at the first position) provided in an embodiment of the present application; Figure 33 is a structural diagram of another spring needle 500 provided in Figure 32 with the probe 520 located at the second position, along the axial direction of the sleeve 510, the length of the insulating layer 560 is ≥ the maximum movement stroke of the probe 520 plus the maximum length of the second part 522 of the probe 520, so as to ensure that when the probe 520 moves to the second area 514b, it can abut against the insulating layer 560, so that the probe 520 can be electromagnetically coupled with the sleeve 510.

Exemplarily, the insulating layer 560 may be made of a material with a high dielectric constant and low loss, such as a fluorine-based material, etc. Moreover, the insulating layer 560 may be manufactured by a lamination process or a PVD (Physical Vapor Deposition) process.

In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (17)

1. A spring needle, comprising:

The sleeve is internally provided with a cavity, and the diameter of an opening of the sleeve is smaller than the diameter of the cavity in the sleeve;

the spring is arranged in the cavity;

A probe comprising a first portion and a second portion, the second portion extending into the cavity, an end of the first portion remote from the second portion extending out of the cavity, the diameter of the first portion being smaller than the diameter of the second portion, the diameter of the first portion being smaller than the diameter of the opening of the sleeve, the diameter of the opening of the sleeve being smaller than the diameter of the second portion; the spring is abutted between the second part of the probe and the bottom surface of the cavity; the end face, far away from the first part, of the second part is an inclined surface, and a first included angle is formed between the inclined surface and a plane perpendicular to the axis of the probe;

A gap is formed between the probe and the side wall of the cavity, the maximum inclination angle of the probe in the sleeve is a second included angle, and the first included angle is larger than the second included angle; the probe is movable between a first position and a second position;

The distance between the first part and the inner wall at the opening of the sleeve is a first distance X, X > d ₁/2（cosθ+tanθ+sinθtanθ-1）+d₂/2 (cos theta-1) + (a+g) sin theta-ntan theta-m;

Wherein d ₁ is the diameter of the first portion, d ₂ is the diameter of the second portion, a is the maximum length of the second portion in the axial direction, g is the length of the first portion-d ₁/2, θ is the maximum inclination angle of the probe in the second position, m is the maximum distance between the second portion and the inner wall of the cavity when the probe is in the first position, and n is the difference between the total length of the spring needle and the length of the sleeve when the probe is in the second position;

with the probe in the second position, the first portion moves into the cavity and the spring is compressed.

2. The pogo pin of claim 1, wherein an end of the second portion remote from the first portion has a first contact portion, the first contact portion being a position furthest from the first portion along the probe axis, and an end of the second portion proximate to the first portion has a second contact portion;

The vertical projection of the first contact part and the second contact part on the cross section of the probe is symmetrically arranged along the axis of the probe; and when the probe is positioned at the second position, the first contact part and the second contact part are abutted with the inner wall of the cavity.

3. The pogo pin of claim 2, wherein with the probe in the second position, there is a gap between the first portion and an inner wall at the opening of the sleeve.

4. The pogo pin of claim 1, wherein a maximum gap between the first portion and the opening of the sleeve is greater than a maximum gap between the second portion and an inner wall of the sleeve with the probe in the first position.

5. The pogo pin of claim 1, wherein the probe further comprises a third portion, the third portion disposed between the first portion and the second portion, and wherein a diameter of the third portion gradually decreases from the second portion to the first portion; the third portion abuts an opening edge of the sleeve with the probe in the first position.

6. The pogo pin of claim 5, wherein with the probe in the first position, a maximum distance between the first portion and an inner wall at an opening of the sleeve is a first distance X, X > d ₁/2（cosθ+tanθ+sinθtanθ-1）+d₂/2 (cos Θ -1) + (a+f+g) sin Θ -ntan Θ -m;

Wherein d ₁ is the diameter of the first portion, d ₂ is the diameter of the second portion, a is the maximum length of the second portion in the axial direction, g is the length of the first portion-d ₁/2, θ is the inclination angle of the probe in the second position, m is the maximum distance between the second portion and the inner wall of the cavity when the probe is in the first position, n is the difference between the total length of the spring needle and the length of the sleeve when the probe is in the second position, and f is the length of the third portion.

7. The spring needle according to claim 1, wherein the sleeve comprises a barrel and a cover body, the cover body is connected with the barrel, an opening is formed in the cover body, and a chamfer is formed on the inner wall of the opening, away from the edge of the barrel.

8. A pogo pin according to claim 7, wherein the inner wall of the opening is provided with a chamfer adjacent the rim of the barrel.

9. The pogo pin of claim 1, wherein the sleeve comprises a cylinder and a cover, one end of the cover is connected with the cylinder along an axial direction of the pogo pin, a middle portion of the cover is used for abutting the first portion, and the other end of the cover extends in a direction away from the first portion.

10. The pogo pin of any of claims 1 to 9, further comprising an insulating layer disposed on an inner wall of the cavity, wherein an end of the second portion remote from the first portion abuts the insulating layer when the probe is in the second position.

11. The pogo pin of claim 10, wherein the insulating layer fills a gap between the second portion and the cavity inner wall.

12. The pogo pin of any of claims 1 to 9, wherein the cavity comprises a first region and a second region along an axial direction of the pogo pin, the first region being disposed at an end proximal to the opening of the sleeve, the second region being disposed at an end distal from the opening of the sleeve;

The diameter of the first region is greater than the diameter of the second region, and an end of the second portion remote from the first portion abuts the second region with the probe in the second position.

13. The pogo pin of claim 12, wherein a distance between the first portion and an inner wall at the opening of the sleeve is a first distance with the probe in the first position, the difference in diameter of the first region and the second region being greater than the first distance.

14. Spring needle according to any one of claims 1-9, characterized in that the probe is subjected to a pressure F being not less than 0.3N in case the probe is in the second position.

15. The pogo pin of any of claims 1 to 9, further comprising a ball, the ball abutting between the spring and the probe.

16. An electronic device, comprising:

A main board;

A pogo pin according to any one of claims 1 to 15, wherein a sleeve of the pogo pin is fixed to the main board, and a probe of the pogo pin is used for abutting against an external device.

17. A charging apparatus, characterized by comprising:

A circuit board;

The spring needle according to any one of claims 1 to 15, wherein a sleeve of the spring needle is fixed on the circuit board, and a probe of the spring needle is used for abutting against the electronic equipment.