CN118017266A - Spring needle, electronic equipment and charging equipment - Google Patents

Spring needle, electronic equipment and charging equipment Download PDF

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Publication number
CN118017266A
CN118017266A CN202410421450.1A CN202410421450A CN118017266A CN 118017266 A CN118017266 A CN 118017266A CN 202410421450 A CN202410421450 A CN 202410421450A CN 118017266 A CN118017266 A CN 118017266A
Authority
CN
China
Prior art keywords
probe
sleeve
pogo pin
cavity
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202410421450.1A
Other languages
Chinese (zh)
Other versions
CN118017266B (en
Inventor
孟胤
毕凌宇
江成
辛春雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202410421450.1A priority Critical patent/CN118017266B/en
Publication of CN118017266A publication Critical patent/CN118017266A/en
Application granted granted Critical
Publication of CN118017266B publication Critical patent/CN118017266B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The application provides a spring needle, electronic equipment and charging equipment, and relates to the technical field of electronic equipment. The spring needle is used for solving the problem that the contact between the probe and the sleeve is unstable due to the inclined swing of the probe of the spring needle. The spring needle comprises a sleeve, a spring and a probe. The sleeve is internally provided with a cavity. The spring is arranged in the cavity. The probe part extends into the cavity, and the spring is abutted between the probe and the bottom surface of the cavity; the end face of one end of the probe extending into the cavity is an inclined plane, and a first included angle is formed between the inclined plane and a plane perpendicular to the axis of the probe. The probe and the side wall of the cavity are provided with gaps, the maximum inclination angle of the probe in the sleeve is a second included angle, and the first included angle is larger than the second included angle.

Description

Spring needle, electronic equipment and charging equipment
Technical Field
The application relates to the technical field of electronic equipment, in particular to a spring needle, electronic equipment and charging equipment.
Background
Spring pins are a common electronic connection device that can be used to charge electronic devices or to transmit signals, etc. The spring needle comprises a sleeve, a probe, a spring and other parts, the spring is arranged in the sleeve, the probe part stretches into the sleeve and is abutted against the spring, and when the probe compresses the spring, the probe can be abutted against the inner wall of the sleeve to realize the conduction of the two ends of the spring needle. However, a gap is formed between the probe and the sleeve, and the probe can tilt and swing during movement, so that the probe is in unstable contact with the sleeve, and the problems of instantaneous disconnection and the like are caused.
Disclosure of Invention
The embodiment of the application provides a spring needle, electronic equipment and charging equipment, which are used for solving the problem that the contact between a probe and a sleeve is unstable and the probe is broken instantaneously due to the inclined swing of the probe of the spring needle.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:
In a first aspect, a pogo pin is provided that includes a sleeve, a spring, and a probe. The sleeve is internally provided with a cavity. The spring is arranged in the cavity. The probe part extends into the cavity, and the spring is abutted between the probe and the bottom surface of the cavity; the end face of one end of the probe extending into the cavity is an inclined plane, and a first included angle is formed between the inclined plane and a plane perpendicular to the axis of the probe. The probe and the side wall of the cavity are provided with gaps, the maximum inclination angle of the probe in the sleeve is a second included angle, and the first included angle is larger than the second included angle.
In the spring needle provided by the first aspect of the application, when the end face of the probe is an inclined surface, the inclined surface forms an ellipse, the length of the major axis of the ellipse is larger than the diameter of the probe (the minor axis of the ellipse is equal to the diameter of the probe), and the larger the first included angle between the inclined surface and the cross section of the probe is, the larger the length of the major axis of the inclined surface is.
Thus, when the probe is tilted, the angle formed between the bevel and the cross-section of the sleeve decreases, i.e. the bevel gradually tends to rotate parallel to the cross-section of the sleeve, i.e. the long axis rotates in a direction parallel to the cross-section of the sleeve. Because the long axis of the inclined plane is larger than the diameter of the probe, and the inclination angle of the probe is only about 3 degrees to 5 degrees, the end point far away from the other end of the probe in the two end points of the long axis of the inclined plane can be abutted with the sleeve.
Moreover, the point farthest from the other end of the probe on the inclined surface is abutted with the inner wall of the cavity, the abutting points are formed at the opening of the probe and the sleeve, and the vertical projections of the two abutting points on the cross section of the probe are symmetrically arranged along the axis, so that the probe and the sleeve can be stably abutted, and when the probe is subjected to external pressure, the probe cannot shake easily, so that the probe and the sleeve are stably contacted.
In a possible implementation manner of the first aspect of the present application, the probe includes a first portion and a second portion, a diameter of the first portion is smaller than a diameter of the second portion, the second portion is located in the cavity, and an end surface of the second portion, which is far away from the first portion, is an inclined surface and is abutted against the spring; one end of the first part far away from the second part extends out of the cavity; the diameter of the opening of the sleeve is smaller than the diameter of the cavity inside the sleeve and smaller than the diameter of the second portion.
In a possible implementation manner of the first aspect of the present application, the probe is movable between a first position and a second position, and in the case that the probe is located in the first position, an end surface of the second portion of the probe, which is close to the first portion, abuts against an opening edge of the sleeve; with the probe in the second position, the first portion moves into the cavity, the spring is compressed, and an end of the second portion remote from the first portion abuts an inner wall of the cavity.
In a possible implementation manner of the first aspect of the present application, an end portion of the second portion, which is far away from the first portion, has a first contact portion, where the first contact portion is a position farthest from the first portion along the axial direction of the probe, and an end portion of the second portion, which is near to the first portion, has a second contact portion;
The vertical projection of the first contact part and the second contact part on the cross section of the probe is symmetrically arranged along the axis of the probe; when the probe is at the second position, the first contact part and the second contact part are both abutted with the inner wall of the cavity. Therefore, the two positions of the probe, which are abutted with the sleeve, are positioned in the cavity, so that the protection of the contact is facilitated, and the risk of water inflow corrosion is reduced.
In a possible implementation manner of the first aspect of the present application, in the case that the probe is in the second position, there is a gap between the first portion and an inner wall of the opening of the sleeve. Under this structure, can further guarantee probe and sleeve stable contact, reduce the risk that PIM problem produced.
In a possible implementation manner of the first aspect of the present application, the maximum gap between the first portion and the opening of the sleeve is larger than the maximum gap between the second portion and the inner wall of the sleeve with the probe in the first position. In this way, during the process of moving the probe to the second position, the second portion of the probe will first abut against the inner wall of the sleeve, so that a gap exists between the first portion and the opening of the sleeve.
In a possible implementation manner of the first aspect of the present application, when the probe is in the first position, a distance between the first portion and an inner wall at the opening of the sleeve is a first distance X, where X > d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos θ -1) + (a+g) sin θ -ntan θ -m;
Wherein d 1 is the diameter of the first portion, d 2 is the diameter of the second portion, a is the maximum length of the second portion along the middle axial direction, g is the length of the first portion-d 1/2, θ is the maximum inclination angle of the probe when in the second position, m is the maximum distance between the second portion and the inner wall of the cavity when the probe is in the first position, and n is the difference between the total length of the pogo pin and the length of the sleeve when the probe is in the second position. That is, when the probe is at the first position and the distance between the first part of the probe and the opening of the sleeve meets the above condition, the first part of the probe is not contacted with the opening of the sleeve after the probe moves to the second position.
In a possible implementation manner of the first aspect of the present application, the probe further includes a third portion, the third portion is disposed between the first portion and the second portion, and a diameter of the third portion gradually decreases from the second portion to the first portion; the third portion abuts an opening edge of the sleeve with the probe in the first position.
In a possible implementation manner of the first aspect of the present application, when the probe is in the first position, a distance between the first portion and an inner wall at the opening of the sleeve is a first distance X, where X > d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos θ -1) + (a+f+g) sin θ -ntan θ -m;
Wherein d 1 is the diameter of the first portion, d 2 is the diameter of the second portion, a is the maximum length of the second portion in the axial direction, g is the length of the first portion-d 1/2, θ is the inclination angle of the probe when in the second position, m is the maximum distance between the second portion and the inner wall of the cavity when the probe is in the first position, n is the difference between the total length of the pogo pin and the length of the sleeve when the probe is in the second position, and f is the length of the third portion.
In a possible implementation manner of the first aspect of the present application, with the probe in the second position, an end of the second portion remote from the first portion abuts against an inner wall of the cavity, and the first portion abuts against the opening of the sleeve. With this configuration, the probe forms a contact point with the opening of the sleeve.
In a possible implementation manner of the first aspect of the present application, the sleeve includes a cylinder and a cover, the cover is connected with the cylinder, an opening is formed in the cover, and a chamfer is provided on an edge of an inner wall of the opening, which is far from the cylinder. With the structure, the roughness of the inner wall of the opening can be reduced, so that the contact stability of the first part abutting against the opening of the sleeve is improved.
In a possible implementation manner of the first aspect of the present application, a chamfer is provided on an inner wall of the opening near an edge of the cylinder.
In a possible implementation manner of the first aspect of the present application, the sleeve includes a cylinder and a cover, one end of the cover is connected to the cylinder along an axial direction of the spring needle, a middle portion of the cover is used for abutting against the first portion, and the other end of the cover extends in a direction away from the first portion. With this structure, the first portion is made to abut against the lid middle portion, thereby improving the contact stability of the first portion with the lid abutment.
In a possible implementation manner of the first aspect of the present application, the spring needle further includes an insulating layer, the insulating layer is disposed on an inner wall of the cavity, and an end of the second portion, which is far away from the first portion, abuts against the insulating layer when the probe is located at the second position. In this structure, the probe and the sleeve transmit radio frequency signals by means of electromagnetic coupling.
In a possible implementation manner of the first aspect of the present application, the insulating layer fills a gap between the second portion and the inner wall of the cavity. Under the structure, the contact area of the probe and the insulating layer is increased, and the coupling effect between the probe and the insulating layer is improved.
In a possible implementation manner of the first aspect of the present application, along an axial direction of the spring needle, the cavity includes a first area and a second area, the first area is disposed near an end of the opening of the sleeve, and the second area is disposed far from the end of the opening of the sleeve; the diameter of the first region is greater than the diameter of the second region, and an end of the second portion remote from the first portion abuts the second region when the probe is in the second position. In this way, the contact between the probe and the inner wall of the sleeve in the process of the movement of the probe can be avoided, and therefore the risk of PIM problem in the process of the movement of the probe is reduced.
In a possible implementation manner of the first aspect of the present application, the distance between the first portion and the inner wall of the opening of the sleeve is a first distance when the probe is in the first position, and the difference in diameter between the first region and the second region is greater than the first distance. With this structure, it can be further ensured that the probe does not come into contact with the inner wall of the sleeve during the movement.
In a possible implementation manner of the first aspect of the present application, the pressure F to which the probe is subjected is greater than or equal to 0.3N in the case that the probe is located in the second position. Under pressure, the probe can be brought into stable contact with the sleeve.
In a possible implementation manner of the first aspect of the present application, the spring needle further includes a ball, and the ball abuts between the spring and the probe. The beads may be, for example, conductive material, such as copper balls. Alternatively, the beads may be insulating material, for example, zirconium beads.
In a second aspect, there is provided an electronic device including a main board and a spring pin, where the spring pin is a spring pin according to any one of the above claims, a sleeve of the spring pin is fixed on the main board, and a probe of the spring pin is used for abutting with an external device.
The electronic device according to the second aspect of the present application, due to the inclusion of the pogo pin according to any of the above-mentioned aspects, can solve the same technical problems and achieve the same technical effects.
In a third aspect, a charging device is provided, where the charging device includes a circuit board and a spring pin, where the spring pin is a spring pin according to any one of the above technical solutions, the spring pin is fixed on the circuit board, and a probe of the spring pin is used to abut against an electronic device.
Drawings
Fig. 1 is a block diagram of an electronic device according to an embodiment of the present application;
fig. 2 is an exploded view of an electronic device according to an embodiment of the present application;
Fig. 3 is a block diagram of an electronic device and a charging device according to an embodiment of the present application;
FIG. 4 is a block diagram of a pogo pin according to an embodiment of the present application;
FIG. 5 is a block diagram of another pogo pin provided by embodiments of the present application;
FIG. 6 is a view showing another connection structure of the pogo pin and the abutment surface shown in FIG. 5
FIG. 7 is a further connection block diagram of the pogo pin and abutment surface provided in FIG. 5;
FIG. 8 is a block diagram of yet another pogo pin provided by embodiments of the present application;
FIG. 9 is a partial block diagram of a probe and sleeve provided by an embodiment of the present application;
fig. 10 is a schematic diagram of a conduction path of a spring needle with a copper ball as a ball according to an embodiment of the present application;
Fig. 11 is a schematic diagram of a conduction path of a spring needle with a ball of pick according to an embodiment of the present application;
FIG. 12 is a schematic diagram of a spring needle passing through a DC signal according to an embodiment of the present application;
FIG. 13 is a schematic diagram of a spring needle passing RF signals according to an embodiment of the present application;
FIG. 14 is a block diagram of a pogo pin in a first position provided by an embodiment of the present application;
FIG. 15 is a block diagram of a pogo pin in a second position provided by an embodiment of the present application;
FIG. 16 is a block diagram of another pogo pin in a first position according to an embodiment of the present application;
FIG. 17 is a block diagram of another pogo pin in a second position provided in an embodiment of the present application;
FIG. 18 is a schematic illustration of the dimensioning of the various parts of the pogo pin provided in FIG. 16;
FIG. 19 is a schematic illustration of the dimensioning of the various parts of the pogo pin provided in FIG. 17;
FIG. 20 is a schematic illustration of dimensioning portions of another pogo pin (with the probe in a first position) provided in an embodiment of the application;
FIG. 21 is a schematic illustration of dimensioning portions of another pogo pin (with the probe in the second position) provided in an embodiment of the application;
FIG. 22 is a block diagram of yet another pogo pin (with the probe in a second position) provided by an embodiment of the present application;
FIG. 23 is a block diagram of yet another pogo pin (with the probe in a second position) provided by an embodiment of the present application;
FIG. 24 is a partial block diagram of another sleeve and probe provided in accordance with an embodiment of the present application;
FIG. 25 is a partial block diagram of yet another sleeve and probe provided in accordance with an embodiment of the present application;
FIG. 26 is a block diagram of a sleeve and probe (in a first position) according to an embodiment of the present application;
FIG. 27 is a block diagram of yet another sleeve and probe (in a second position) provided in accordance with an embodiment of the present application;
FIG. 28 is a block diagram of a sleeve and probe (in a first position) according to an embodiment of the present application;
FIG. 29 is a block diagram of a sleeve and probe (in a second position) according to an embodiment of the present application;
FIG. 30 is a block diagram of yet another pogo pin 500 (probe 520 in a first position) provided by an embodiment of the present application;
FIG. 31 is a block diagram of a probe 520 of the further pogo pin 500 provided in FIG. 30 in a second position;
FIG. 32 is a block diagram of yet another pogo pin 500 (probe 520 in a first position) provided by an embodiment of the present application;
Fig. 33 is a block diagram of the probe 520 of the further pogo pin 500 provided in fig. 32 in a second position.
Reference numerals: 10-an electronic device; 100-watchband; 110-a first belt body; 120-a second belt body; 200-a housing; 210-middle frame; 220-a rear cover; 230-connecting shaft; 300-a display module; 310-a light-transmitting cover plate; 320-a display screen; 400-main board; 500-spring needle; 510-sleeve; 511-opening; 512-cylinder; 513-covers; 514-cavity; 514 a-a first region; 514 b-a second region; 520-probe; 521-first part; 522-a second portion; 522 a-inclined plane; 522 b-a first contact; 522 c-a second contact; 523-a third portion; 530-a spring; 540-beads; 550-insulating sleeve; 560-an insulating layer; 20-a charging device; 201-a charging contact surface; 30-an abutment surface; 301-a metal layer; 302-a material layer; 40-position one; 41-position two; 42-position three.
Detailed Description
The following description of the technical solutions according to the embodiments of the present application will be given with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.
Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.
Furthermore, in the present application, directional terms "upper", "lower", etc. are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for description and clarity with respect thereto, and which may be changed accordingly in accordance with the change in the orientation in which the components are disposed in the drawings.
In the present application, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium.
The embodiment of the application provides electronic equipment which is a type of electronic equipment with a display function. In particular, the electronic device may be a portable electronic apparatus or other type of electronic apparatus. For example, the electronic device may be a wearable device (including a smart watch, a smart bracelet, etc.), a cell phone, a tablet computer (tablet personal computer), a laptop computer (laptop computer), a Personal Digital Assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, etc. For convenience of explanation, the electronic device is taken as an example of the smart watch.
Referring to fig. 1 and 2, fig. 1 is a block diagram of an electronic device 10 according to an embodiment of the present application, and fig. 2 is an exploded view of the electronic device 10 according to an embodiment of the present application, where a watchband 100 is not shown in fig. 2. As can be seen from the above description, in this embodiment, the electronic device 10 is a smart watch (i.e. a wearable device). The electronic device 10 may include a display module 300, a case 200, a wristband 100, a motherboard 400, and a charging module (not shown).
The wristband 100 is used to wear the electronic device 10 on a wrist. The wristband 100 may include a first band 110 and a second band 120, and the first band 110 and the second band 120 are disposed at both sides of the case 200, respectively. And wristband 100 may be made of leather, plastic, or metal.
In some embodiments, the connection between first band 110 and case 200 of wristband 100, and between second band 120 and case 200 of wristband 100 may be via connection shaft 230. For example, the connection shaft 230 passes through a connection hole (not shown) on the first belt body 110, and both ends of the connection shaft 230 are connected with the housing 200 so that the first portion 521 can rotate with respect to the housing 200. Wherein, two ends of the connection shaft 230 may be fixedly connected or movably connected with the housing 200.
Alternatively, first strap 110 and second strap 120 of wristband 100 may both be secured to case 200, e.g., wristband 100 may be integrally injection molded with case 200, i.e., wristband 100 and case 200 form a unitary structure. Therefore, the specific material of the band 100 and the connection manner of the band 100 and the case 200 in the embodiment of the present application are not particularly limited.
The housing 200 is used to protect the electronics inside the electronic device 10. The case 200 may include a middle frame 210 and a rear cover 220, and the first portion 521 and the second portion 522 of the band 100 are respectively disposed at both sides of the middle frame 210 and connected to the middle frame 210. The materials of the middle frame 210 and the rear cover 220 include, but are not limited to, metal, ceramic, plastic, and glass. The material of the middle frame 210 may be the same as or different from the material of the rear cover 220.
The rear cover 220 is disposed at one side of the middle frame 210, and is fixedly connected to the middle frame 210. Illustratively, the rear cover 220 and the middle frame 210 may be fixed by bonding, clamping, welding, screwing, or the like. Alternatively, the rear cover 220 and the middle frame 210 may be integrally formed, i.e., the middle frame 210 and the housing 200 formed by the rear cover 220 are integrally formed as a single structural member. Therefore, the specific structure and material of the housing 200 are not particularly limited in the embodiment of the application.
The display module 300 is used for displaying images. The display module 300 may include a light-transmissive cover plate 310 and a display screen 320 (also referred to as a display panel). Specifically, the light-transmitting cover plate 310 and the display screen 320 are stacked, and may be adhered and fixed by optical adhesive. The material of the transparent cover plate 310 includes, but is not limited to, glass. For example, the transparent cover plate 310 may use a general transparent glass for protecting the display screen 320 to prevent the display screen 320 from being damaged by external force and to prevent dust. Alternatively, the light-transmitting cover plate 310 with the touch function may be used to make the electronic device 10 have the touch function, so that the use of the electronic device is more convenient for the user. Therefore, the specific material of the transparent cover plate 310 is not particularly limited in the present application.
The transparent cover 310 is disposed on a side of the middle frame 210 away from the rear cover 220, and the middle frame 210 is fixedly connected with the transparent cover 310. In this way, the light-transmitting cover 310, the middle frame 210 and the rear cover 220 define a receiving space, and the display screen 320 and other electronic devices are disposed in the receiving space.
Illustratively, the transparent cover 310 may partially extend into the middle frame 210 and be adhered to the inner wall of the middle frame 210. Or the transparent cover plate 310 may also be fastened to the surface of the middle frame 210 away from the rear cover 220, that is, the gap between the transparent cover plate 310 and the middle frame 210 cannot be directly seen from the display surface of the electronic device 10, so that a user can obtain a better visual effect, and the user experience is improved.
In addition, the display 320 may be a flexible display 320 or a rigid display 320. For example, the display screen 320 may be an organic light-emitting diode (OLED) display screen 320, an active-matrix organic light-emitting diode (AMOLED) display screen 320, a mini-light-emitting diode (MINI LIGHT-emitting diode) display screen 320, a micro-light-emitting diode (micro-emitting diode) display screen 320, a micro-organic light-emitting diode (micro organic light-emitting diode) display screen 320, a quantum dot LIGHT EMITTING diode (QLED) display screen 320, a liquid crystal display screen 320 (liquid CRYSTAL DISPLAY, LCD), and the like.
The motherboard 400 is used for disposing electronic devices inside the electronic apparatus 10 and electrically connecting the electronic devices. The main board 400 may be fixed to the middle frame 210 by gluing, screwing, welding, clamping, and the like. The electronic device is used to implement various functions of the electronic apparatus 10. For example, the electronic device may be a control Chip (e.g., a System On Chip (SOC)), a graphics control Chip (graphics processing unit, GPU), a universal memory (universal flash storage, UFS), a camera module, a flash module, a battery, and the like.
The charging module is used for charging the battery of the electronic device 10, and is electrically connected with the motherboard 400. Specifically, referring to fig. 3, fig. 3 is a block diagram of an electronic device 10 and a charging device 20 according to an embodiment of the present application, where the electronic device 10 is connected to an external charging device 20, so that the charging device 20 is electrically connected to the electronic device 10 through a charging module, and charges a battery of the electronic device 10.
Specifically, with continued reference to fig. 3, the charging module includes a plurality of pogo pins 500 (pogo pins), where the pogo pins 500 are fixed on the motherboard 400, and electrically connected with the motherboard 400, and an end of the pogo pins 500 away from the motherboard 400 extends out of the housing 200 of the electronic device 10, for example, may extend from a surface of the rear cover 220 or may extend from a side wall of the middle frame 210. The charging device 20 is internally provided with a circuit board and a charging module (not shown in the figure), the charging module is electrically connected with the circuit board, the charging module is provided with a charging contact surface 201, and the charging contact surface 201 exposes the surface of the charging device 20.
When the electronic device 10 is connected with the charging device 20, the spring pin 500 abuts against the charging contact surface 201 of the charging device 20, so that the electronic device 10 is electrically connected with the charging device 20, and the charging device 20 can charge the battery of the electronic device 10. In some embodiments, the charging device 20 and the electronic device 10 may be plugged together, for example, in a male and female manner. Or the charging device 20 and the electronic device 10 may be connected by magnetic attraction, for example, a magnetic member (i.e., a magnet, for example, shown by two circles on two sides of the charging contact surface 201 in fig. 3) is disposed on one of the charging device 20 and the electronic device 10, and a metal member (for example, shown by two circles on two sides of the pogo pin 500 in fig. 3) is disposed on the other of the charging device 20 and the electronic device 10, so that the charging device 20 and the electronic device 10 are connected by the magnetic member and the metal member being attracted to each other. Meanwhile, the pogo pin 500 abuts on the charging contact surface 201, so that the electronic device 10 is charged by the charging device 20.
In other possible embodiments, the charging module may be disposed in the charging device 20, the charging module is disposed in the electronic device 10, that is, the pogo pin 500 is disposed in the charging device 20, the charging contact surface 201 is located on the surface of the electronic device 10, and when the electronic device 10 is connected to the charging device 20, the pogo pin 500 abuts against the charging contact surface 201, so as to realize that the charging device 20 charges the electronic device 10. Accordingly, the embodiments of the present application are not particularly limited thereto, and in the following embodiments, the spring needle 500 is provided on the electronic device 10 as an example.
In order to ensure stable charging connection between the charging device 20 and the electronic device 10, the pogo pin 500 needs to be in stable contact with the charging contact surface 201, and the pogo pin 500 itself needs to be in stable conduction. The spring pin 500 is stably abutted against the charging contact surface 201, and depends on the connection stability between the electronic device 10 and the charging device 20. The spring needle 500 itself is stably conducted and depends on its own structure.
Specifically, referring to fig. 4, fig. 4 is a block diagram of a pogo pin 500 according to an embodiment of the present application. The pogo pin 500 includes a sleeve 510, a probe 520, and a spring 530, wherein the spring 530 is disposed inside the sleeve 510, and the probe 520 partially extends into the sleeve 510 and abuts against the spring 530. When the charging device 20 is connected to the electronic device 10, the probe 520 of the pogo pin 500 abuts against the charging contact surface 201, is pressed by the charging contact surface 201, and the probe 520 moves toward the inside of the sleeve 510, compressing the spring 530. Under the elastic force of the spring 530, the probe 520 can be stably abutted against the charging contact surface 201. And, the probe 520 compresses the spring 530 such that the probe 520 and the spring 530 form stable conduction, thereby achieving electrical connection of the electronic device 10 and the charging device 20 and charging the battery of the electronic device 10.
In addition, referring to fig. 5, fig. 5 is a block diagram of another pogo pin 500 according to an embodiment of the present application. The pogo pin may further include a ball 540, and the ball 540 may be disposed between the probe 520 and the spring 530, and the ball may be made of an insulating material or a conductive material.
In other embodiments, the spring pin 500 may be applied to antenna signal transmission in addition to the charging of the electronic device 10, that is, the spring pin 500 is disposed on the main board 400, and the probe 520 of the spring pin 500 is used to abut against a surface (hereinafter referred to as an abutment surface 30) of another device, for example, a screen, a shielding cover, an antenna pad (also referred to as a panel antenna or a patch antenna), a metal decorative cover, and so on.
For example, referring to fig. 5, the sleeve 510 of the spring needle 500 may be welded and fixed to the main board 400, and an end of the probe 520 of the spring needle 500 extending out of the sleeve 510 may directly abut against the abutment surface 30. Alternatively, referring to fig. 6, fig. 6 is another connection structure diagram of the pogo pin 500 and the abutment surface 30 provided in fig. 5, the abutment surface 30 may be spot-welded to form the metal layer 301, and the probe 520 abuts against the metal layer 301. Alternatively, a silver paste layer (as shown in fig. 6, the metal layer 301 is replaced with a silver paste layer) is formed on the contact surface 30, and the probe 520 is brought into contact with the silver paste layer.
Referring to fig. 7, fig. 7 is a schematic diagram showing another connection structure between the pogo pin 500 and the contact surface 30 provided in fig. 5, a material layer 302 of conductive adhesive, insulating adhesive or dielectric material is disposed on the contact surface 30, a metal layer 301 is disposed on a surface of the material layer 302 away from the contact surface 30, and the probe 520 is in contact with the metal layer 301. Alternatively, a material layer 302 such as conductive adhesive or insulating adhesive is disposed on the contact surface 30, a dielectric material layer is disposed on a surface of the material layer 302 away from the contact surface 30 (as shown in fig. 7, the metal layer 301 is replaced with a dielectric material layer), and the probe 520 abuts against the dielectric material layer. It should be understood that the above connection structure is only a few examples, and other structural layers may be further disposed between the probe 520 and the abutment surface 30 to form an electrical connection, and thus the embodiment of the present application is not limited thereto.
In some embodiments, the spring 530 length changes continuously during the movement of the probe 520 when the pogo pin 500 abuts between the motherboard 400 and the abutment surface 30, which may cause the antenna resonance to shift. Therefore, the spring 530 may be insulated from the probe 520, and the probe 520 may be brought into contact with the inner wall of the sleeve 510 to form a stable antenna path, so as to reduce the influence of the spring 530 on the antenna resonance.
In particular, with continued reference to fig. 5-7, the ball 540 of the spring needle 500 may be made of an insulating material, such as zirconium beads. The ball 540 is abutted between the probe 520 and the spring 530, thereby insulating the probe 520 from the spring 530. Alternatively, referring to fig. 8, fig. 8 is a schematic diagram of another pogo pin 500 according to an embodiment of the application, the pogo pin 500 may include an insulation sleeve 550, wherein the insulation sleeve 550 is sleeved at one end of the spring 530 near the probe 520, an end portion of the insulation sleeve 550 abutting against the probe 520 forms a hemispherical structure, and an end surface of the probe 520 abutting against the insulation sleeve 550 forms an inclined plane 522a to ensure that the probe 520 abuts against the insulation sleeve 550 stably, so as to realize insulation between the probe 520 and the spring 530. Alternatively, the spring 530 may be made of an insulating material to provide insulation between the probe 520 and the spring 530.
Referring to fig. 9, however, fig. 9 is a partial block diagram of a probe 520 and a sleeve 510 according to an embodiment of the present application. Since the probe 520 needs to move along the axial direction of the pogo pin 500, there is a certain gap between the probe 520 and the sleeve 510, and when the probe 520 moves along the axial direction, the probe 520 swings away from the axial direction (generally, the swing angle is about 3 ° to 5 °, and the swing angle of the ball 540 and the probe 520 with the end face being the inclined surface 522a is the smallest), so that the contact between the probe 520 and the sleeve 510 is unstable, and the problem of snap and PIM occurs.
Note that PIM refers to passive intermodulation (Passive Intermodulation, PIM), which is a signal distortion, and refers to signal distortion generated when signals of two or more different frequencies are mixed and input into an edge-less device, due to a nonlinear characteristic (i.e., contact instability) of a connection point (i.e., a contact point) or a material. Nonlinear mixing that causes PIM does not involve active devices, typically caused by metallic materials, fabrication processes for interconnect devices, or other passive devices in the system.
Further, since the probe 520 contacts the inner wall of the sleeve 510 to form a single path for direct current and radio frequency current (i.e., alternating current), the path is reduced (the probe 520 and the spring 530, and the probe 520 and the sleeve 510 form a path), and thus the direct current impedance increases.
Based on this, in the embodiment of the present application, PIM and dc impedance are tested by taking the pogo pin 500 provided with the ball 540 as an example, referring to fig. 10 and 11, fig. 10 is a schematic diagram of a conducting path of the pogo pin 500 provided with the ball 540 as a copper ball, and fig. 11 is a schematic diagram of a conducting path of the pogo pin 500 provided with the ball 540 as a pick ball. As can be seen, the pogo pin 500 has two conductive paths, i.e., probe 520 to ball 540 and probe 520 to sleeve 510, when copper balls are used. When the spring needle 500 employs pick beads, there is only one conductive path, i.e., the probe 520 to the sleeve 510.
Thus, three different pogo pins 500 were prepared, the three pogo pins 500 being pogo pins 500 in which the ball 540 was copper (conductive), the ball 540 was a pogo pin 500 in which the ball was pick (insulating), and another pogo pin 500 in which the ball 540 was pick, wherein the pogo pins 500 in which the two balls 540 were pick were different in size. The test results are shown in tables 1, 2 and 3.
TABLE 1
TABLE 2
TABLE 3 Table 3
Wherein the upper contact surface represents the abutment surface 30 and the lower contact surface represents the surface in contact with the motherboard 400. The knocked state indicates that the pogo pin 500 or the electronic device 10 provided with the pogo pin 500 collides or shakes. The pogo pin 500 of table 1 uses copper balls as the ball 540, i.e., the pogo pin 500 has a double passage. The pogo pins 500 of tables 2 and 3 respectively use different pick beads as the ball 540, i.e., form a single passage.
As can be seen from the above table, the spring needle 500 of table 1 and table 2 has no instantaneous break in both the rest state and the knocking state, the resistance of the pick-and-ball scheme corresponding to table 2 is stable in the rest state, and the resistance jumps in the knocking state, and the resistance can be stable in the knocking state when the pressure is greater than 0.7N. PIM was not significantly different for the two, one stabilized at 0.22N, i.e., the pick bead protocol of Table 2, and one stabilized at 0.33N, with less difference. The pick bead solution of table 3 is inferior in PIM test results, and still stable when the force reaches 2N.
In addition, the spring needle 500 (copper ball scheme corresponding to table 1) is simulated, please refer to fig. 12 in combination with fig. 10, and fig. 12 is a schematic diagram of the spring needle 500 passing through a dc signal according to an embodiment of the present application. In the case of a direct current signal, the direction of current flow follows the shortest path of least resistance formed when the spring 530 is compressed to the limit, i.e., direct current is concentrated at the location of the shortest path and the least resistance, i.e., through the probe 520, the spring 530 to the other end.
Referring to fig. 13 in combination with fig. 11, fig. 13 is a schematic diagram illustrating a spring needle 500 passing through a radio frequency signal according to an embodiment of the present application. For radio frequency signals, due to skin effect, current flows primarily through the surface, i.e., most of the radio frequency signal is transmitted through the probe 520 to the sleeve 510. Thus, even if electrical conduction between the probe 520 and the spring 530 (e.g., the copper ball scheme described above) is not achieved, radio frequency signals are not transmitted through the spring 530.
As is clear from the above test and simulation results, no matter what structure is adopted for the pogo pin 500, no significant influence is exerted on the dc signal, because the dc current flows along the path with the smallest impedance and the shortest path. With respect to rf signals, PIM problems may occur regardless of the structure of the spring needle 500, i.e., insulating or conductive, the ball 540.
The PIM problem is caused by unstable contact between the probe 520 and the sleeve 510, i.e., by the probe 520 swinging during the movement of the probe 520, which results in unstable contact between the probe 520 and the inner wall of the sleeve 510, and thus PIM and snap-off problems.
Specifically, referring to fig. 14 and 15, fig. 14 is a structural diagram of a pogo pin 500 in a first position according to an embodiment of the present application, and fig. 15 is a structural diagram of a pogo pin 500 in a second position according to an embodiment of the present application. The sleeve 510 of the pogo pin 500 has an opening 511 therein, and a cavity 514 therein, and the diameter of the opening 511 is smaller than that of the cavity 514. Illustratively, the sleeve 510 may include a barrel 512 and a cover 513, where the cover 513 is integrally formed with the barrel 512, the cover 513 is disposed at one end of the barrel 512, the cover 513 is provided with an opening 511, the barrel 512 has a cavity 514 therein, and the diameter of the opening 511 is smaller than that of the cavity 514.
Also, the probe 520 of the spring needle 500 includes a first portion 521 and a second portion 522, the first portion 521 having a diameter smaller than the second portion 522, and the first portion 521 having a diameter smaller than the opening 511. The second portion of the probe 520 extends into the cavity 514 of the sleeve 510 and abuts the spring 530, and the first portion of the probe 520 extends out of the sleeve 510 through the opening 511.
The probe 520 is movable between a first position and a second position, and when the probe 520 is positioned at the first position (as shown in fig. 14), the second portion 522 of the probe 520 abuts against the edge of the opening 511 of the sleeve 510 near the end surface of the first portion 521, that is, the second portion 522 abuts against the cover 513. With the probe 520 in the second position, the first portion 521 moves into the cavity 514 and the spring 530 is compressed (as shown in fig. 15).
During movement of the probe 520 between the first and second positions, the probe 520 may move in a direction offset from its own axis. With continued reference to fig. 14 and 15, when the probe 520 moves to the second position, the first portion 521 of the probe 520 may contact the opening 511 of the sleeve 510 (i.e., the cover 513) (hereinafter, the contact position is referred to as a position one 40), and the end of the second portion 522 of the probe 520 near the first portion 521 may contact the inner wall of the sleeve 510 (i.e., the cylinder 512) (hereinafter, the contact position is referred to as a position two 41), and the end of the second portion of the probe 520 remote from the first portion 521 may also contact the inner wall of the sleeve 510 (i.e., the cylinder 512) (hereinafter, the contact position is referred to as a position three 42).
Because the probe 520 is in an inclined state, the first position 40, the second position 41 and the third position 42 are located on two sides of the axis of the sleeve 510 on the cross section of the sleeve 510, that is, the first position 40 and the third position 42 are distributed along the radial direction of the sleeve 510, and the second position 41 and the third position 42 are also distributed along the radial direction of the sleeve 510. It will be appreciated that, since position one 40 is the location where the first portion 521 contacts the sleeve 510, position two 41 and position three 42 are both locations where the second portion 522 contacts the sleeve 510, and therefore, the diameter of the circumference of the perpendicular projection of position one 40 on the cross section of the sleeve 510 is smaller than the diameter of the circumference of the perpendicular projection of position two 41 and position three 42 on the cross section, and that position two 41 and position three 42 may be symmetrically disposed along the axis of the sleeve 510.
However, based on the processing precision problem, it is difficult to simultaneously make the first position 40, the second position 41 and the third position 42 in a stable contact state, and particularly, the first position 40 and the second position 41 generally cause one position to be in stable contact, while the other position forms a virtual joint, so that the PIM is unstable. It will be appreciated that the stable contact state refers to a state in which stable contact can be formed under the striking state in the above test, that is, disconnection due to shaking or collision is not caused.
Based on this, another pogo pin 500 is provided in the embodiment of the present application, and the pogo pin 500 may be applied to the electronic device 10 or the charging device 20 described above. Referring to fig. 16 and 17, fig. 16 is a structural diagram of another pogo pin 500 in a first position according to an embodiment of the present application, and fig. 17 is a structural diagram of another pogo pin 500 in a second position according to an embodiment of the present application.
Specifically, the pogo pin 500 includes the sleeve 510, the spring 530, and the probe 520 described above. The sleeve 510 is internally provided with a cavity 514, a spring 530 is arranged in the cavity 514, the probe 520 partially stretches into the cavity 514, and the spring 530 is abutted between the probe 520 and the bottom surface of the cavity 514; the end of the probe 520 that extends into the cavity 514 is beveled 522a (shown as a diagonal line in fig. 16). The inclined surface 522a is abutted against the ball 540, and the inclined surface 522a may be abutted directly against the spring 530 when the ball 540 is not provided.
Wherein the inclined surface 522a forms a first angle a with a plane perpendicular to the axis of the probe 520, i.e. the inclined surface 522a forms a first angle a with the cross section of the probe 520. The maximum inclination angle of the probe 520 in the sleeve 510 is a second angle θ, that is, the angle between the axis of the probe 520 and the axis of the sleeve 510 when the probe 520 is at the second position, and the first angle a is greater than the second angle θ.
In some embodiments, probe 520 may include a first portion 521 and a second portion 522 as described above, where the diameter of first portion 521 is smaller than the diameter of second portion 522, and where the diameter of first portion 521 is smaller than the diameter of opening 511, and where the end of the second portion distal from the first portion is beveled 522a as described above. When the probe 520 is located at the second position, the end of the second portion 522 remote from the first portion 521 abuts against the inner wall of the cavity 514 (i.e., position three 42).
Based on this, since the cross section of the probe 520 is circular, that is, both the first portion 521 and the second portion 522 of the probe 520 are of a cylindrical structure, when the end surface of the second portion 522 is the inclined surface 522a, the inclined surface 522a forms an elliptical shape, the length of the major axis of the elliptical shape (that is, the inclined line indicating the inclined surface 522a in fig. 16) is longer than the diameter of the second portion 522 (the minor axis thereof is equal to the diameter of the second portion 522), and the greater the first angle a between the inclined surface 522a and the cross section of the second portion 522 is, the greater the length of the major axis of the inclined surface 522a is.
Because the major axis length of the inclined surface 522a is greater than the diameter of the second portion 522, when the probe 520 is inclined, the point on the inclined surface 522a furthest from the first portion 521 (i.e., the one of the two ends of the major axis of the oval shape formed by the inclined surface 522a that is farther from the first portion 521) can abut against the inner wall of the cavity 514 (i.e., the position three 42), so that the probe 520 can abut against the inner wall of the cavity 514 at the position three 42 in addition to the above-described position one 40 or position two 41.
Moreover, since the probe 520 is obliquely arranged, the projection position of the third position 42 on the cross section of the sleeve 510 and the projection position of the first position 40 or the second position 41 on the cross section of the sleeve 510 are symmetrically arranged relative to the center of the cross section (namely, the axis of the sleeve 510), so that the reliability of stable contact between the probe 520 and the sleeve 510 can be improved through the contact points symmetrically arranged along the axis of the sleeve 510, the stability of contact between the probe 520 and the sleeve 510 is ensured, and the influence of PIM or instantaneous interruption problem on signal transmission is reduced.
In addition, since the first position 40 and the second position 41 cannot be precisely ensured to form stable contact, the first position 40 and the second position 41 ensure that only one position can be stably contacted, and thus the stable contact between the probe 520 and the sleeve 510 can be realized.
Based on this, in some embodiments, referring to fig. 16 and 17, the end of the second portion 522 away from the first portion 521 has a first contact portion 522b, where the first contact portion 522b is the position farthest from the first portion 521 along the axial direction of the probe 520, that is, the point farther from the first portion 521 between two ends of the long axis of the inclined surface 522 a. The end of the second portion 522 near the first portion 521 has a second contact 522c.
The perpendicular projection of the first contact portion 522b and the second contact portion 522c on the cross section of the probe 520 is symmetrically arranged along the center of the cross section, that is, the first contact portion 522b and the second contact portion 522c are symmetrically arranged along the axis of the probe 520. When the probe 520 is located at the second position, the first contact portion 522b and the second contact portion are both in contact with the inner wall of the cavity 514, that is, the second position 41 and the third position 42 are in stable contact.
Thus, when the probe 520 moves to the second position, the probe 520 is inclined. Since the perpendicular projections of the first contact portion 522b and the second contact portion 522c on the cross section of the probe 520 are symmetrically arranged, when the first contact portion 522b and the second contact portion 522c are both abutted against the inner wall of the cavity 514, i.e. the two ends of the second portion 522 are respectively abutted against the two ends of the inner wall of the cavity 514 along the radial direction, the second portion 522 of the probe 520 can be stably abutted against the cavity 514. In the case where the probe 520 is abutted between the main board 400 and the abutment surface 30, the probe 520 is subject to the pressure of the abutment surface 30 and the elastic force of the spring 530, so that the probe 520 is not easily vibrated due to the collision, that is, in this case, the probe 520 and the sleeve 510 are in a stable contact state.
In addition, since the second contact portion 522c is located inside the sleeve 510, the second position 41 is brought into stable contact, and the liquid is not easily introduced, so that the risk of corrosion and unstable contact is advantageously reduced. In addition, since the swing angle of the first portion 521 is larger when the probe 520 swings, the problem of false touch is easy to occur, so that the problem of RSE (Radiation Spurious Emission, radiation stray disturbance) is caused, and therefore, the second position 41 and the third position 42 form a stable structure, which is more beneficial to ensuring the reliability of stable conduction between the probe 520 and the sleeve 510.
On this basis, in order to ensure that the second position 41 and the third position 42 form stable contact, the first position 40 is not touched by mistake. Referring to fig. 18 and 19, fig. 18 is a schematic illustration of the dimensioning of the parts of the pogo pin 500 provided in fig. 16, and fig. 19 is a schematic illustration of the dimensioning of the parts of the pogo pin 500 provided in fig. 17, wherein the ball 540 and the spring 530 are not shown in fig. 18 and 19. With probe 520 in the second position, there is a gap between first portion 521 and the inner wall at opening 511 of sleeve 510 (i.e., cap 513).
In some embodiments, with the probe in the first position, the maximum gap between the first portion and the opening of the sleeve is greater than the maximum gap between the second portion and the inner wall of the sleeve. In this way, during the process of moving the probe to the second position, the second portion of the probe can be abutted against the inner wall of the sleeve, so that a gap exists between the first portion and the opening of the sleeve.
Based on this, in order to ensure that the probe 520 is in the second position, the first portion 521 has a gap with the inner wall of the opening 511 of the sleeve 510, i.e., the probe 520 is first contacted with the inner wall of the sleeve 510 at the above-described second position 41 and third position 42, so that the probe 520 cannot be further inclined. Therefore, the probe 520 needs to satisfy the following conditions.
Specifically, with probe 520 in the first position, first portion 521 is a first distance X from the inner wall of opening 511 of sleeve 510, X > d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos θ -1) + (a+g) sin θ -ntan θ -m.
Where d 1 is the diameter of the first portion 521, d 2 is the diameter of the second portion 522, a is the maximum length of the second portion 522 in the axial direction, g is the length of the first portion 521-d 1/2 (i.e., the radius of the first portion 521), θ is the maximum inclination angle of the probe 520 in the second position (as shown in fig. 17), m is the maximum distance between the second portion 522 and the inner wall of the cavity 514 when the probe 520 is in the first position, and n is the difference between the total length of the pogo pin 500 and the length of the sleeve 510 when the probe 520 is in the second position.
Based on the above formula, when the first distance X meets the condition, that is, the first distance X is greater than the value calculated by the formula, it is ensured that the probe 520 is in the inclined state with the probe 520 in the second position, a gap is provided between the first portion 521 of the probe 520 and the inner wall of the opening 511 of the sleeve 510 (that is, the probe 520 is not in contact with the sleeve 510 at the position one 40), and the second portion 522 of the probe 520 is in abutment with the inner wall of the sleeve 510, that is, both the position two 41 and the position three 42 are in stable contact.
In other possible examples, referring to fig. 20 and 21, fig. 20 is a schematic illustration of dimensioning of parts of another pogo pin 500 (the probe 520 is located in the first position) according to the embodiment of the application, and fig. 21 is a schematic illustration of dimensioning of parts of another pogo pin 500 (the probe 520 is located in the second position) according to the embodiment of the application, wherein the ball 540 and the spring 530 are not shown in fig. 20 and 21. The probe 520 may further include a third portion 523, wherein the third portion 523 is disposed between the first portion 521 and the second portion 522, and the diameter of the third portion 523 gradually decreases from the second portion 522 to the first portion 521.
With the probe 520 in the first position, the third portion 523 abuts the edge of the opening 511 of the sleeve 510, i.e. the third portion 523 abuts the cover 513. In this case, the third portion 523 forms a tapered structure with a gradually decreasing diameter, so the inner wall of the cover 513 may form a tapered structure contoured to the third portion 523, so that when the third portion 523 abuts against the cover 513, a surface-to-surface contact is formed, so as to increase the stressed area, reduce the local stress, and facilitate the extension of the service life.
Also, in this case, when the above-mentioned probe 520 is in the first position, the first distance X between the first portion 521 and the inner wall at the opening 511 needs to satisfy the following formula, X > d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos θ -1) + (a+f+g) sin θ -ntan θ -m. Thus, it is ensured that when the probe 520 is in the second position, the probe 520 is not in contact with the sleeve 510 at the first position 40, and is in stable contact at the second position 41 and the third position 42.
Where d 1 is the diameter of the first portion 521, d 2 is the diameter of the second portion 522, a is the maximum length of the second portion 522 in the axial direction, g is the length of the first portion 521-d 1/2 (i.e., the radius of the first portion 521), θ is the maximum inclination angle of the probe 520 in the second position (as shown in fig. 17), m is the maximum distance between the second portion 522 and the inner wall of the cavity 514 when the probe 520 is in the first position, n is the difference between the total length of the spring needle 500 and the length of the sleeve 510 when the probe 520 is in the second position, and f is the length of the third portion 523 in the axial direction of the probe 520.
On this basis, in the case that the probe 520 is located at the second position, in order to further ensure that the probe 520 and the sleeve 510 can form stable contact at the second position 41 and the third position 42, the pressure F to which the probe 520 is subjected is equal to or greater than 0.3N. I.e., at least 0.3N of pressure is applied to the probe 520, the probe 520 can be brought into stable contact with the sleeve 510 in the second position, thereby further improving the reliability of the stable connection of the probe 520 and the sleeve 510.
The inner wall of the cavity 514 of the sleeve 510 may be a low-roughness good-conductivity interface, such as gold, nickel, silver, copper, etc.
Further, whether PIM is a problem when the probe 520 is in contact with the sleeve 510 may be determined by parameters such as resistivity ρ c, young' S modulus E, applied pressure F, contact area S, skin depth, roughness η, heat capacity C, thermal conductivity λ, current amplitude I, density ρ d, and the like. The strip adjustable variables are only applied pressure F, contact area S, roughness eta and current amplitude I.
As can be seen from the above, the applied pressure F is greater than or equal to 0.3N, the current amplitude I is determined according to the application scenario, and the roughness η is determined based on the material, so that the PIM value can be adjusted by adjusting the contact area S between the probe 520 and the inner wall of the sleeve 510. With the probe 520 in the second position, the larger the contact area S between the probe 520 and the inner wall of the sleeve 510, the more advantageous the dc impedance is reduced and the better the ac path is formed. Because the diameter of the second portion 522 is larger than that of the first portion 521, when the second position 41 and the third position 42 form stable contact, the contact area between the probe 520 and the sleeve 510 is larger, which is more beneficial to signal transmission.
Specifically, the radius r of the abutment surface 30 formed by abutment of the probe 520 with the sleeve 510 can be calculated by the following formula.
。
Wherein F 0 is the contact pressure of position two 41 and position three 42, and F 0 is determined by the above pressure F, E 1 and E 2 are Young's moduli of the probe 520 and the sleeve 510, μ 1 and μ 2 are Poisson's ratios of the probe 520 and the sleeve 510, and R 1 and R 2 are radii of the bottom (i.e., the second portion 522) of the probe 520 and the cavity 514 of the sleeve 510, respectively.
Based on this, the contact area s=pi r between the probe 520 and the sleeve 510. From this, the contact area S between the probe 520 and the sleeve 510 can be calculated to facilitate the adjustment of this parameter.
In other embodiments, referring to fig. 22, fig. 22 is a block diagram of yet another pogo pin 500 (with a probe 520 in a second position) according to an embodiment of the present application, wherein a spring 530 and a ball 540 are not shown in fig. 22. With the probe 520 in the second position, stable contact between the probe 520 and the sleeve 510 can also be achieved at positions one 40 and three 42. That is, the first contact portion 522b of the probe 520 is in contact with the inner wall of the sleeve 510, and the first portion 521 of the probe 520 is in contact with the inner wall of the opening 511 of the sleeve 510. And, the pressure F applied to the probe 520 is not less than 0.3N.
Thus, since the first position 40 and the third position 42 are also located at the two ends of the sleeve 510 in the radial direction, the probe 520 can be stably abutted in the sleeve 510. When the probe 520 is abutted against the main plate 400 and the abutment surface 30, the probe 520 is pressed by the abutment surface 30 and the elastic force of the spring 530, so that the probe 520 is not easily vibrated by the collision, that is, the probe 520 and the sleeve 510 can be in a stable contact state in this case.
Illustratively, to ensure that position one 40 is able to make stable contact with position three 42, position two 41 is not. Accordingly, where the probe 520 is required to be in the first position, the first distance X between the first portion 521 of the probe 520 and the inner wall of the opening 511 of the sleeve 510 satisfies the following formula. Where probe 520 includes first portion 521 and second portion 522, first distance X.ltoreq.d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos θ -1) + (a+g) sin θ -ntan θ -m.
Referring to fig. 23, fig. 23 is a block diagram of still another pogo pin 500 (with a probe 520 in a second position) according to an embodiment of the present application. Where probe 520 further includes third portion 523, first distance X.ltoreq.d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos θ -1) + (a+f+g) sin θ -ntan θ -m. Here, the parameters in the formulas are the same as those in the above example, please refer back to fig. 18 and 20, and thus, a repetitive description will not be made.
In this way, the angle by which the probe 520 may be tilted is reduced due to the reduced first distance X. Thus, when the probe 520 moves to the second position and tilts, the probe 520 abuts the sleeve 510 at the position one 40, and at this time, the second contact portion 522c of the second portion 522 of the probe 520 is not in contact with the inner wall of the cavity 514 of the sleeve 510, so that in this scenario, the probe 520 and the sleeve 510 form stable contact at the positions one 40 and three 42.
The increase or decrease of the first distance X may be achieved by adjusting the size of the opening 511 of the sleeve 510, or may be achieved by adjusting the diameter of the first portion 521 of the probe 520. Therefore, the embodiment of the present application is not particularly limited thereto.
In some embodiments, referring to fig. 24, fig. 24 is a partial view of a sleeve 510 and a probe 520 according to another embodiment of the present application. The inner wall of the opening 511 of the sleeve 510 (i.e., the cover 513) is provided with a chamfer at the edge far from the cylinder 512, the chamfer being equal to or more than 3 °. With this structure, the edge of the opening 511 can be made to form a smooth surface, so that when the first portion 521 of the probe 520 abuts against the opening 511, a more stable contact can be formed between the two, so as to reduce the risk of unstable contact caused by rough surface.
In addition, a chamfer may be provided at the edge of the opening 511 of the cover 513 near the cylinder 512, and the chamfer is not less than 3 °. Thus, the two edges of the opening 511 along the axial direction of the cylinder 512 form a smooth surface, thereby further improving the reliability of stable contact between the probe 520 and the cylinder 512.
In other embodiments, referring to fig. 25, fig. 25 is a partial view of a sleeve 510 and a probe 520 according to another embodiment of the present application. One end of the cover 513 is connected to the cylinder 512 in the axial direction of the sleeve 510, and for example, both may be integrally formed or welded. The middle part of the cover 513 is configured to abut against the first portion 521 of the probe 520, and the other end of the cover 513 extends in a direction away from the first portion 521. That is, the cover 513 is formed with a structure in which the middle portion protrudes in a direction approaching the probe 520 and is used to abut against the probe 520, so that the problem of transient break or PIM due to unstable contact between the probe 520 and the cylinder 512 caused by the large roughness of the edge of the opening 511 is avoided.
On the basis, in the process of moving the probe 520 of the spring needle 500 from the first position to the second position, the pressure F applied to the probe 520 is insufficient (less than 0.3N), and the probe 520 is in virtual connection with the inner wall of the sleeve 510, so that the probe 520 moves to the second position along with the continuous increase of the pressure F, and the probe 520 is abutted against the inner wall of the sleeve 510 to form stable contact. However, in this process, PIM problems may be caused by the virtual connection of the probe 520 to the sleeve 510.
Based on this, referring to fig. 26 and 27, fig. 26 is a structural diagram of a sleeve 510 and a probe 520 (located at a first position) according to an embodiment of the present application, and fig. 27 is a structural diagram of a sleeve 510 and a probe 520 (located at a second position) according to an embodiment of the present application. The cavity 514 of the sleeve 510 may include a first region 514a and a second region 514b, the first region 514a being disposed proximate to one end of the opening 511 of the sleeve 510 and the second region 514b being disposed distal to one end of the opening 511 of the sleeve 510. When the probe 520 is in the second position, the end of the second portion 522 of the probe 520 away from the first portion 521 abuts against the second region 514b, that is, the first contact portion 522b of the probe 520 abuts against the second region 514b of the cavity 514.
In this way, since the diameter of the first region 514a is larger, the first portion 521 (i.e., the first contact portion 522 b) of the probe 520 cannot contact with the first region 514a during the movement of the probe 520 from the first position to the second position, so that the risk of occurrence of virtual connection during the movement of the probe 520 is reduced, which is beneficial to improving the reliability of stable contact between the probe 520 and the sleeve 510.
In some embodiments, with continued reference to fig. 26 and 27, the first region 514a may be an annular groove formed on an inner wall of the cavity 514 of the sleeve 510, that is, the wall thickness of the sleeve 510 in the first region 514a is smaller than that in the second region 514b. Or fig. 28 is a structural diagram of still another sleeve and probe (in a first position) according to an embodiment of the present application, and fig. 29 is a structural diagram of still another sleeve and probe (in a second position) according to an embodiment of the present application, where a first area 514a of the sleeve 510 may be protruded outward, so that a diameter of the first area 514a is larger than a diameter of the second area 514b. Therefore, the present application is not particularly limited thereto.
In other embodiments, the length Y of the first region 514a along the axial direction of the sleeve 510 is greater than or equal to the downward stroke of the spring 530 when the probe 520 is in the second position and the second and third positions 41 and 42 are in stable contact. Thus, the first contact portion 522b does not contact the first region 514a during movement of the probe 520, and can be stably contacted with the sleeve 510 when the probe 520 is located at the second position.
Illustratively, the force-based calculation formula f=kx, where F is the pressure applied to the probe 520 described above, k is the spring constant of the spring 530, and x is the compression stroke of the spring 530, i.e., the movement stroke of the probe 520. So that the movement stroke of the probe 520 can be calculated based on the pressure F and the elastic coefficient k of the spring 530. Thereby determining a minimum value for the length Y of the first region 514 a.
And, the difference between the diameter of the first region 514a and the diameter of the second region 514b is greater than or equal to the first distance X (i.e., the distance between the second portion 522 of the probe 520 and the inner wall of the opening 511 of the sleeve 510 when the probe 520 is in the first position). In this way, it is further ensured that the probe 520 does not contact the first region 514a during movement from the first position to the second position, thereby further reducing the risk of PIM problems.
In this case, to ensure that the probe 520 does not contact the sleeve 510 at the first position 40 (the first position 40 has a gap), an insulating material may be provided at the opening 511 of the sleeve 510 to further ensure that the probe 520 and the sleeve 510 are not conducted at the first position 40. The embodiment of the present application is not particularly limited thereto.
In other embodiments, referring to fig. 30 and 31, fig. 30 is a structural diagram of still another pogo pin 500 (a probe 520 is located at a first position) according to an embodiment of the present application, and fig. 31 is a structural diagram of a probe 520 of still another pogo pin 500 provided in fig. 30 in a second position. In the case where the probe 520 is located at the second position and the probe 520 is not in direct contact with the inner wall of the sleeve 510, for example, when the insulating layer 560 is provided between the inner wall of the sleeve 510 and the second portion 522 of the probe 520, the current can be coupled to the surface of the sleeve 510 by electromagnetic coupling and remain at the other end of the pogo pin 500.
Specifically, the pogo pin 500 provided by the embodiment of the present application may further include an insulating layer 560, where the insulating layer 560 is disposed on an inner wall of the cavity 514 of the sleeve 510, and when the probe 520 is located at the second position, an end of the second portion 522 away from the first portion 521 abuts against the insulating layer 560, that is, the first contact portion 522b and the second contact portion 522c of the second portion 522 abut against the insulating layer 560.
And, based on the capacitance formula c=ε 0 S/d, ε is the relative permittivity (i.e. the permittivity of the probe 520 and the sleeve 510), ε 0 is the vacuum permittivity, S is the contact area, and d is the dielectric thickness. The contact area S can be calculated by the aforementioned formula. From this, it is understood that the larger the contact area S, the smaller the dielectric thickness d, and the larger the relative permittivity epsilon, the better the electromagnetic coupling effect.
In some examples, to further increase the contact area S of the probe 520 with the insulating layer 560, the insulating layer 560 may fill the gap between the second portion 522 of the probe 520 and the inner wall of the cavity 514 of the sleeve 510. Thus, when the probe 520 moves, since the insulating layer 560 is filled between the second portion 522 and the inner wall of the sleeve 510, the probe 520 moves only in its own axial direction and does not tilt. And, the side walls of the second portion 522 of the probe 520 are all attached to the insulating layer 560, so that the contact area between the probe 520 and the insulating layer 560 is maximized, which is beneficial to further improving the coupling effect between the probe 520 and the sleeve 510.
In addition, the insulating layer 560 may cover the entire area of the inner wall of the cavity 514 of the sleeve 510. Or referring to fig. 32 and 33, fig. 32 is a block diagram of still another pogo pin 500 (with a probe 520 in a first position) according to an embodiment of the present application; fig. 33 is a view showing a structure in which the probe 520 of the pogo pin 500 shown in fig. 32 is located at the second position, and the length of the insulating layer 560 is equal to or greater than the maximum movement stroke of the probe 520 plus the maximum length of the second portion 522 of the probe 520 along the axial direction of the sleeve 510, so that the probe 520 can abut against the insulating layer 560 to electromagnetically couple with the sleeve 510 when the probe 520 moves to the second region 514 b.
For example, the insulating layer 560 may be made of a material having a high dielectric constant and low loss, such as a fluorine material. Also, the insulating layer 560 may be manufactured through a film coating process or a PVD (Physical Vapor Deposition ) process.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (21)

1. A spring needle, comprising:
A sleeve having a cavity therein;
The spring is arranged in the cavity;
the probe partially stretches into the cavity, and the spring is abutted between the probe and the bottom surface of the cavity; the end face of one end of the probe extending into the cavity is an inclined plane, and a first included angle is formed between the inclined plane and a plane perpendicular to the axis of the probe;
The probe is provided with a gap with the side wall of the cavity, the maximum inclination angle of the probe in the sleeve is a second included angle, and the first included angle is larger than the second included angle.
2. The pogo pin of claim 1, wherein the probe comprises a first portion and a second portion, the first portion having a smaller diameter than the second portion, the second portion being located within the cavity, and an end surface of the second portion remote from the first portion being the bevel; one end of the first part far away from the second part extends out of the cavity; the diameter of the opening of the sleeve is smaller than the diameter of the cavity inside the sleeve and smaller than the diameter of the second part, and the diameter of the first part is smaller than the diameter of the opening of the sleeve.
3. The pogo pin of claim 2, wherein the probe is movable between a first position and a second position, the first portion moving into the cavity with the probe in the second position, the spring being compressed.
4. A pogo pin according to claim 3, wherein the end of the second portion remote from the first portion has a first contact portion, the first contact portion being the furthest position from the first portion in the axial direction of the probe, the end of the second portion adjacent to the first portion having a second contact portion;
The vertical projection of the first contact part and the second contact part on the cross section of the probe is symmetrically arranged along the axis of the probe; and when the probe is positioned at the second position, the first contact part and the second contact part are abutted with the inner wall of the cavity.
5. The pogo pin of claim 4, wherein with the probe in the second position, there is a gap between the first portion and an inner wall at the opening of the sleeve.
6. A pogo pin according to claim 3, wherein a maximum clearance between the first portion and the opening of the sleeve is greater than a maximum clearance between the second portion and the inner wall of the sleeve with the probe in the first position.
7. The pogo pin of claim 5, wherein with the probe in the first position, a distance between the first portion and an inner wall at an opening of the sleeve is a first distance X, X > d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos Θ -1) + (a+g) sin Θ -ntan Θ -m;
Wherein d 1 is the diameter of the first portion, d 2 is the diameter of the second portion, a is the maximum length of the second portion in the axial direction, g is the length of the first portion-d 1/2, θ is the maximum inclination angle of the probe in the second position, m is the maximum distance between the second portion and the inner wall of the cavity when the probe is in the first position, and n is the difference between the total length of the spring needle and the length of the sleeve when the probe is in the second position.
8. A pogo pin according to claim 3, wherein the probe further comprises a third portion, the third portion being provided between the first portion and the second portion, and the diameter of the third portion gradually decreasing from the second portion to the first portion; the third portion abuts an opening edge of the sleeve with the probe in the first position.
9. The pogo pin of claim 8, wherein with the probe in the first position, a maximum distance between the first portion and an inner wall at an opening of the sleeve is a first distance X, X > d 1/2（cosθ+tanθ+sinθtanθ-1）+d2/2 (cos Θ -1) + (a+f+g) sin Θ -ntan Θ -m;
Wherein d 1 is the diameter of the first portion, d 2 is the diameter of the second portion, a is the maximum length of the second portion in the axial direction, g is the length of the first portion-d 1/2, θ is the inclination angle of the probe in the second position, m is the maximum distance between the second portion and the inner wall of the cavity when the probe is in the first position, n is the difference between the total length of the spring needle and the length of the sleeve when the probe is in the second position, and f is the length of the third portion.
10. A pogo pin according to claim 3, wherein with the probe in the second position, an end of the second portion remote from the first portion abuts an inner wall of the cavity and the first portion abuts an opening of the sleeve.
11. The pogo pin of claim 10, wherein the sleeve comprises a barrel and a cover, the cover is connected with the barrel, an opening is formed in the cover, and a chamfer is formed on an edge of an inner wall of the opening, which is far away from the barrel.
12. A pogo pin according to claim 11, wherein the inner wall of the opening is provided with a chamfer adjacent the rim of the barrel.
13. The pogo pin of claim 10, wherein the sleeve comprises a cylinder and a cover, one end of the cover is connected with the cylinder along an axial direction of the pogo pin, a middle portion of the cover is used for abutting the first portion, and the other end of the cover extends in a direction away from the first portion.
14. The pogo pin of any of claims 3 to 13, further comprising an insulating layer disposed on an inner wall of the cavity, wherein an end of the second portion remote from the first portion abuts the insulating layer when the probe is in the second position.
15. The pogo pin of claim 14, wherein the insulating layer fills a gap between the second portion and the cavity inner wall.
16. A pogo pin according to any of claims 3 to 13, wherein the cavity comprises a first region and a second region along the axial direction of the pogo pin, the first region being provided at an end close to the opening of the sleeve, the second region being provided at an end remote from the opening of the sleeve;
The diameter of the first region is greater than the diameter of the second region, and an end of the second portion remote from the first portion abuts the second region with the probe in the second position.
17. The pogo pin of claim 16, wherein a distance between the first portion and an inner wall at the opening of the sleeve is a first distance with the probe in the first position, the difference in diameter of the first region and the second region being greater than the first distance.
18. Spring needle according to any one of claims 3-13, characterized in that the probe is subjected to a pressure F being not less than 0.3N in case the probe is in the second position.
19. The pogo pin of any of claims 1 to 13, further comprising a ball, the ball abutting between the spring and the probe.
20. An electronic device, comprising:
A main board;
a pogo pin according to any one of claims 1 to 19, wherein a sleeve of the pogo pin is fixed to the main board, and a probe of the pogo pin is used for abutting against an external device.
21. A charging apparatus, characterized by comprising:
A circuit board;
A pogo pin according to any one of claims 1 to 19, wherein a sleeve of the pogo pin is fixed to the circuit board, and a probe of the pogo pin is used for abutting against an electronic device.
CN202410421450.1A 2024-04-09 2024-04-09 Spring needle, electronic equipment and charging equipment Active CN118017266B (en)

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Application Number Priority Date Filing Date Title
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CN118017266B CN118017266B (en) 2024-08-13

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207217845U (en) * 2017-08-01 2018-04-10 东莞市连亘电子有限公司 A kind of domatic thimble structure
CN209249747U (en) * 2019-01-15 2019-08-13 深圳市建极科技有限公司 The pogo pin connectors of single-point conducting
CN210607735U (en) * 2019-10-23 2020-05-22 深圳市中正天科技有限公司 Connector capable of transmitting current
CN216121035U (en) * 2021-11-08 2022-03-22 鹰潭市普利逊精密科技有限公司 Connect stable spring probe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207217845U (en) * 2017-08-01 2018-04-10 东莞市连亘电子有限公司 A kind of domatic thimble structure
CN209249747U (en) * 2019-01-15 2019-08-13 深圳市建极科技有限公司 The pogo pin connectors of single-point conducting
CN210607735U (en) * 2019-10-23 2020-05-22 深圳市中正天科技有限公司 Connector capable of transmitting current
CN216121035U (en) * 2021-11-08 2022-03-22 鹰潭市普利逊精密科技有限公司 Connect stable spring probe

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