CN118016557A - Method for forming additional information functional layer and method for manufacturing electronic element - Google Patents

Abstract

The invention relates to a method for forming an additional information functional layer, a method for manufacturing an electronic device, and an additional functional layer electronic device, and aims to provide a method for forming an additional information functional layer which contributes to further miniaturization and thinning of an electronic device, an electronic module, and the like. The method for forming a functional layer with information according to one embodiment of the present invention includes a step of providing information to a functional layer including an information region having the information and a non-information region other than the information region, while forming the functional layer on a surface of an object to be constructed, wherein a color difference exists between the information region and the non-information region.

Description

Method for forming additional information functional layer and method for manufacturing electronic element

Technical Field

The present invention relates to a method for forming an additional information functional layer, a method for manufacturing an electronic device, and an electronic device with an additional functional layer.

Background

As is well known, an electronic component with a functional layer is an electronic component in which a functional layer is formed on an electronic component. Examples of the functional layer-attached electronic component include a semiconductor element and a semiconductor package element including a semiconductor element covered with a package. Such an electronic component with a functional layer is mounted on, for example, PCB (Printed Circuit Board) substrates, PWB (PRINTED WIRING Board) substrates, or the like, for use in high-speed communications, 5G, automatic operation, or the like.

On the other hand, regarding a method for manufacturing an electronic component having an information-bearing functional layer, for example, patent document 1 (JP 6508333 a) discloses a method for manufacturing an electronic circuit module including an embedded layer in which an electronic component is embedded in a first main surface of a circuit board, and a mark protruding from an outer surface of the embedded layer is provided on an outer surface of the embedded layer.

However, in the conventional method for forming the additional information functional layer on the object to be constructed such as the electronic circuit module, it is necessary to form the marking layer on the functional layer to give information or to cut off the functional layer to give information, and therefore it is necessary to ensure that the thickness of the layer on the object to be constructed is equal to or greater than the required thickness.

Disclosure of Invention

The purpose of the present invention is to provide a method for forming an additional information functional layer, which contributes to further miniaturization and thickness reduction of electronic components, electronic modules, and the like.

The invention provides a method for forming an additional information functional layer, which comprises a step of forming a functional layer on the surface of an object to be constructed and simultaneously endowing the functional layer with information, wherein the functional layer comprises an information area with the information and a non-information area other than the information area, and chromatic aberration exists between the information area and the non-information area.

Here, the term "information is given to the functional layer while forming the functional layer" means that the information-given functional layer is obtained by forming each of an information region, which is a region to which information is given, and a non-information region, which is a region to which information is not given, in the same step. For example, by forming the uneven shape having different thicknesses by discharging the material to be the functional layer by liquid ejection or by forming the pattern by ejecting the material of the functional layer different from each other, the information area and the non-information area are formed at one time in the same step, and the additional information functional layer is obtained. The information area thus formed has a color difference with the non-information area, and thus information given to the information area can be recognized. The identification means that the information is read by identifying the color difference with the naked human eye or by using a reading device or the like. On the other hand, for example, forming a functional layer to which no information is provided in a predetermined thickness, and then etching the thickness by other steps such as laser or etching to provide information to the functional layer is not included in "providing information to the functional layer while forming the functional layer".

In terms of the embodiments, "information" refers to information that can be recognized by a person or by a machine. By "machine-identifiable" is meant that even a small QR code (registered trademark) or matrix code, for example, which is difficult to identify by the naked eye, is identifiable. "information" in terms of embodiments includes graphics, text, and numbers. The term "information" in the embodiment also includes codes such as QR codes, which are not meaningful information per se. More specifically, the "information" includes information about the electronic component, such as a manufacturer of the electronic component, a model number of the electronic component, a production lot number, and the like.

The incidental information functional layer of the embodiment includes an information area and a non-information area. In the case where the information area is formed of the concave-convex shape and the thickness of the additional information functional layer is uneven, the production efficiency can be improved. Preferably the material of the additional information functional layer is the same. There is a color difference between the information area and the non-information area due to the unevenness. In the case where the information area is constituted by a pattern shape and the thickness of the incidental information functional layer is uniform, the color of the pattern itself is different from that of the non-information area.

The present invention has an effect of providing a method for forming an additional information functional layer, which contributes to further miniaturization and thinning of electronic components, electronic modules, and the like. The embodiment can avoid adding information to the same layer as the functional layer and increasing the thickness of the electronic component with the functional layer due to the added information. It is also possible to avoid an increase in the thickness of the electronic component to ensure the removal margin, thereby reducing the reduction in yield of the electronic component with the functional layer caused by the removal of the waste.

Drawings

Fig. 1 is a schematic diagram showing an overall configuration of an example of a device for manufacturing an electronic device with a functional layer according to a first embodiment.

Fig. 2 is a block diagram showing an example of a hardware configuration of a control unit of the manufacturing apparatus shown in fig. 1.

Fig. 3 is a functional block diagram showing an example of a control section of the manufacturing apparatus shown in fig. 1.

Fig. 4 is a flowchart showing an example of a method for forming the incidental information function layer according to the first embodiment.

Fig. 5 is a schematic plan view of an example of an electronic component with a functional layer manufactured by the manufacturing method according to the embodiment.

Fig. 6 is an enlarged plan view of a first example of the region VI in fig. 5.

Fig. 7 is an enlarged top view of a second example of region VI in fig. 5.

Fig. 8 is an enlarged top view of a third example of region VI in fig. 5.

Fig. 9 is a cross-sectional view of a first example of line IX-IX in fig. 5.

Fig. 10 is a sectional view of a second example of the line IX-IX in fig. 5.

Fig. 11 is a sectional view of a third example of the line IX-IX in fig. 5.

Fig. 12 is a plan view showing a first example of points on which information is given to the functional layer.

Fig. 13 is a plan view showing a second example of points of information given to the functional layer.

Fig. 14 is a plan view showing a first example of a two-dimensional code to be applied to a functional layer.

Fig. 15 is an enlarged top view of the region XV in fig. 14.

Fig. 16 is a plan view showing a second example of a two-dimensional code to be applied to a functional layer.

Fig. 17 is an enlarged top view of region XVII in fig. 16.

Fig. 18 is a top view showing a third example of the two-dimensional code given to the functional layer.

Fig. 19 is an enlarged plan view of the region XIX in fig. 18.

Fig. 20 is a plan view of an example of an electronic component with a functional layer manufactured by the manufacturing method according to the embodiment.

Fig. 21 is a schematic overall configuration of an example of a device for manufacturing an electronic device with a functional layer according to the second embodiment.

Fig. 22 is a flowchart of an example of a method for forming the incidental information functional layer according to the second embodiment.

Fig. 23 is a bottom view of the functional layer attached electronic component according to the third embodiment.

Fig. 24 is a cross-sectional view taken along line XXIV-XXIV in fig. 23.

Fig. 25 is a first diagram of an example of a forming process of forming a functional layer on an electronic component according to the third embodiment.

Fig. 26 is a second diagram of an example of a forming process of forming a functional layer on an electronic component according to the third embodiment.

Detailed Description

The manner in which the invention can be practiced is described in detail below with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference numerals, and overlapping description thereof is omitted as appropriate.

In each figure, the directions are represented by orthogonal coordinates having an X axis, a Y axis, and a Z axis. The X-axis, Y-axis and Z-axis are substantially perpendicular to each other. The Z direction represents the thickness direction of the functional layer formed on the electronic component according to the embodiment. The positive Z direction is marked up and the negative Z direction is marked down. These directions are not limiting of the embodiments.

The functional layer according to the embodiment includes, for example, a functional layer formed on the surface of an electronic component and having a function of shielding electromagnetic waves, such as a function of preventing water, moisture, heat, rust, gas, static electricity, and EMI (Electromagnetic Interference). The layer having a function of shielding electromagnetic waves (hereinafter referred to as an electromagnetic wave shielding layer) includes, for example, a layer having a function of shielding at least one of electromagnetic waves generated by an electronic component and electromagnetic waves incident on the electronic component from the outside. However, the functional layer according to the embodiment may have functions other than the above-described functions.

The functional layer according to the embodiment includes an insulating material, a conductive material, or the like. The shielding layer made of insulating material is mainly used for waterproof, dampproof, heat dissipation, rust prevention, gas prevention, static countermeasure and the like. The electromagnetic wave shielding layer is mainly composed of a conductive material. In the case of the electromagnetic wave shielding layer, a protective layer made of an insulating material may be further formed on the electromagnetic wave shielding layer in order to reduce corrosion, vulcanization, and oxidation of the conductive material. As the insulating material, various resin materials can be used. As the conductive material, a liquid metal material containing nanoparticles or complex ink composed of Au, ag, cu, or Ni, or the like can be used. However, the material constituting the functional layer according to the embodiment is not limited to an insulating material or a conductive material, and may be appropriately selected according to the purpose.

Examples of the electronic component in the embodiment include a semiconductor component, a semiconductor package component including a semiconductor component covered with a package, and a semiconductor module. The electronic component herein uses, for example, a semiconductor component manufactured by the company corporation, a semiconductor component package, or the like. An electronic component is an example of an object to be constructed. The work object is an object to be a functional layer.

Examples of the electronic component with a functional layer according to the embodiment include a semiconductor component with a functional layer formed on a surface thereof, a semiconductor package component, a semiconductor module, and a shield can.

The method for manufacturing the additional information functional layer according to the embodiment includes a step of forming a functional layer on the surface of the electronic component and simultaneously providing information to the functional layer. The incidental information functional layer is a layer composed of an information area having information and other non-information areas.

First embodiment

In the present embodiment, the information area is set to a predetermined shape, and information is given to the functional layer.

< Example of the overall structure of an apparatus for producing an electronic device with a functional layer)

Fig. 1 is a block diagram showing an example of the overall configuration of an apparatus 100 for manufacturing an electronic device 10 with a functional layer according to the first embodiment.

As shown in fig. 1, the manufacturing apparatus 100 includes a housing unit 1, a conveying unit 2, a reading unit 3, a control unit 4, a cleaning unit 5, a first forming unit 6, a first irradiation unit 7, a heating unit 8, and an inspection unit 9.

The manufacturing apparatus 100 takes out the electronic component 10A before the formation of the functional layer from the housing part 1 and conveys it in the conveying direction 50 by the conveying part 2. The manufacturing apparatus 100 reads the transported electronic component 10A by the reading section 3. The manufacturing apparatus 100 determines a predetermined shape formed on the electronic component 10A and a position on a functional layer forming the predetermined shape based on information Ei about the electronic component 10A acquired from an external device based on the reading result Im of the reading unit 3 by the control unit 4. After the cleaning section 5 cleans the surface of the electronic component 10A, the manufacturing apparatus 100 discharges the liquid composition constituting the functional layer from the first forming section 6, and forms the functional layer on the surface of the electronic component 10A, and at the same time, forms the predetermined shape determined by the control section 4. Thereby, information corresponding to the information Ei about the electronic element 10A is given to the functional layer. Then, the manufacturing apparatus 100 irradiates the functional layer formed on the electronic component 10A with heat, laser light of various wavelengths, ultraviolet light other than the laser light, and the first irradiation unit 7, hardens the functional layer, and then heats the hardened functional layer by the heating unit 8, and dries the functional layer. Thereby obtaining the functional layer attached electronic component 10. Thereafter, the manufacturing apparatus 100 inspects the appearance, the electronic characteristics, and the like of the functional layer attached electronic component 10 by the inspection unit 9.

Fig. 1 shows a case where after the electronic component 10A is conveyed in the conveying direction 50, a functional layer is formed on the electronic component 10A, and after the functional layer is heated, the electronic component 10 with the functional layer is obtained.

The housing section 1 houses a tray in which a plurality of electronic components 10A are arranged. The electronic component 10A is an electronic component to which a functional layer is to be formed.

The conveying section 2 is constituted by a belt conveyor, a roller conveyor, or the like, and conveys a tray placed on the belt conveyor or the roller conveyor in the conveying direction 50. The transport section 2 can transport the electronic component 10A stored in the tray in the transport direction 50.

The reading section 3 reads the electronic component 10A. The reading section 3 is constituted by a camera or a line sensor including a lens and an imaging element. For example, the reading section 3 reads the electronic component 10A by capturing an image of the electronic component 10A.

The information read by the reading section 3 is a manufacturer name, a component number, a lot number, information on positioning, information on the size of the electronic component 10A, and the like. The reading unit 3 can read such information printed with characters, symbols, or the like on the surface of the electronic component 10A by performing image processing on the image of the electronic component 10A. The reading unit 3 transmits the reading result Im to the control unit 4.

The control unit 4 controls the operation of the entire manufacturing apparatus 100. The control section 4 is communicably connected to an external device via a wired cable, wireless, LAN (Local Area Network), the internet, or the like.

The control unit 4 obtains information Ei about the electronic component 10A from an external device based on the reading result Im from the reading unit 3. The information Ei about the electronic component 10A is specification information of the electronic component 10A or the like provided by a manufacturer of the electronic component 10A. The specification information of the electronic component 10A includes a circuit diagram and the like. The control unit 4 can determine a predetermined shape formed on the electronic component 10A and a position where the predetermined shape is formed on the functional layer based on information Ei about the electronic component 10A acquired from an external device. The control unit 4 controls the operations of the first forming unit 6, the first irradiation unit 7, and the like based on the determination result.

For example, the control unit 4 acquires information Ei about the electronic component 10A from an external device, and then performs binarization image processing on the read result Im from the reading unit 3. The control section 4 analyzes the position where the GND lines are concentrated in the electronic component 10A from the circuit diagram of the semiconductor element included in the information Ei about the electronic component 10A, and performs the drawing image processing in accordance with the positions where the plurality of GND lines are concentrated in the electronic component 10A and the size of the semiconductor element. Here, the drawing image processing is to generate drawing image data for forming a functional layer on the electronic component 10A by the first forming unit 6 described later. In the drawn image processing, the control section 4 determines a formation position of a predetermined shape corresponding to the information Ei about the electronic component 10A on the upper surface of the semiconductor element component. The control unit 4 determines the size of the region on the functional layer in which the predetermined shape is formed, in accordance with the position on the functional layer in which the predetermined shape is formed and the size of the semiconductor element.

The cleaning section 5 cleans the electronic component 10A conveyed by the conveying section 2. The cleaning method of the cleaning section 5 may be various methods such as air blowing cleaning, pure water cleaning, solvent cleaning, infrared irradiation cleaning, heat irradiation cleaning, ultraviolet irradiation cleaning, atmospheric pressure plasma cleaning, dry cleaning, ultraviolet ozone cleaning, polishing, and sandblasting cleaning. An appropriate cleaning method may be appropriately selected according to the specification of the electronic component 10A, the specification of the functional layer formed on the electronic component 10A, and the like. The cleaning section 5 dries the surface of the electronic component 10A after cleaning.

For example, in the method of forming the additional information functional layer, if information on the electronic component such as characters or marks indicating manufacturer name, component number, production lot, type, positioning, etc. is printed on the surface of the electronic component before the functional layer is formed, the information printed on the surface of the electronic component is covered with the functional layer. As a result, in some cases, information printed on the surface of the electronic component cannot be recognized from the outside of the functional layer, and when the additional functional layer electronic component is mounted on the PWB substrate or the like, the additional functional layer electronic component cannot be positioned, or tracking information of the additional functional layer electronic component cannot be acquired. On the other hand, when information about the electronic component is provided to the functional layer-attached electronic component in a manner that can be recognized from the outside in a separate process after the formation of the functional layer, the manufacturing time becomes longer due to an increase in the number of manufacturing processes, or the manufacturing cost becomes higher with an increase in the number of devices, and the manufacturing efficiency may be lowered.

In the present embodiment, the first forming portion 6 forms a functional layer on the surface of the electronic component 10A, and at the same time, imparts information Ei to the functional layer. The first forming unit 6 forms a functional layer into a predetermined shape, and imparts information Ei about the electronic component to the functional layer. The information-added functional layer includes an information area having a predetermined shape of information Ei and a non-information area other than the information area. Since there is a color difference between the information area and the non-information area, even after the functional layer is formed on the electronic component 10A, the information Ei about the electronic component can be recognized from the functional layer. Since the information Ei about the electronic component can be recognized, the positioning of the electronic component with the functional layer can be performed when the electronic component with the functional layer is mounted on the PWB substrate or the like, and tracking information and the like of the electronic component with the functional layer can be obtained. Since the formation of the functional layer and the application of the information Ei about the electronic element to the functional layer are performed in the same process, an increase in the number of manufacturing steps, manufacturing man-hours, and manufacturing cost can be suppressed. As a result, the present embodiment can provide a method for forming an additional information functional layer with excellent manufacturing efficiency. Further, since the information area and the non-information area are formed in the same layer, the present embodiment can provide a method for forming an additional information functional layer which contributes to further miniaturization and thinning of electronic components, electronic modules, and the like.

In the present embodiment, the first forming portion 6 can form the functional layer on the electronic component 10A by discharging the liquid composition constituting the functional layer, and at the same time, impart information to the functional layer. The liquid composition is preferably discharged, and the discharge amount and the number of lamination are changed to form a functional layer having a predetermined three-dimensional shape. Thus, the functional layer can be formed in various shapes, and thus various information can be given to the functional layer in various ways. In particular, in the case of performing liquid ejection using ink jet, information can be finely and clearly given. By removing the functional layer formed with a uniform thickness, the productivity can be improved and the waste of the functional layer forming material can be reduced as compared with the case of forming a predetermined shape.

In the present embodiment, the first forming portion 6 discharges an insulating material such as IJSR4000 manufactured by solar ink manufacturing company as an example of a liquid composition. However, the method of forming the functional layer by the first forming portion 6 is not limited to spraying the liquid composition, and spraying, a dispenser, a die coater, or a method employing lift coating may be used. The information to be given to the functional layer is not limited to the information Ei about the electronic element, and may be information related to a manufacturing process, a manufacturing site, or the like.

In the present embodiment, the first forming portion 6 can discharge the liquid composition in a linear manner. The line head method is a method of discharging the liquid composition from the first forming portion 6 in a direction substantially orthogonal to the conveying direction 50, and the first forming portion 6 has a length equal to the entire width of one or more electronic components 10A mounted on the tray. By using the line head system, liquid can be applied to a large area on one or more electronic components 10A at a time, thereby realizing a high speed. However, the first forming section 6 is not limited to the line head type, and the liquid composition may be discharged by a serial head type or the like.

In the present embodiment, the information to be given to the functional layer by the first forming portion 6 may include at least one selected from the group consisting of an alphanumeric code, a barcode, and a two-dimensional code corresponding to the information about the electronic component. In this way, the information Ei about the electronic component can be managed as digital information that is convenient to read.

In the present embodiment, the first forming portion 6 can discharge the liquid composition containing the polymerizable compound. By discharging the liquid composition containing the polymerizable compound, the liquid composition can be cured by irradiation with active energy rays from the first irradiation unit 7 described below. However, the first forming portion 6 may discharge a liquid composition other than the polymerizable compound or may discharge a liquid composition other than ultraviolet light which is cured by active energy rays.

The first irradiation section 7 irradiates ultraviolet light as active energy rays to the functional layer formed on the electronic element 10A by the first formation section 6. The liquid composition constituting the functional layer is cured by irradiation of the ultraviolet light of the first irradiation section 7, and the functional layer is cured. In the present embodiment, the liquid composition discharged from the first forming portion 6 contains a polymerizable compound, and by including a step of irradiating the functional layer formed on the electronic component 10A with ultraviolet light, the time taken for curing the functional layer can be shortened, and the manufacturing time of the electronic component 10 with the functional layer can be shortened. However, instead of irradiation with ultraviolet rays, irradiation with heat may be used.

The heating section 8 heats the functional layer-attached electronic component 10 in which the functional layer on the electronic component 10A is cured. By this heating, the functional layer in the additional functional layer electronic component 10 is hardened, dried, and fixed.

The inspection unit 9 inspects the appearance, electrical characteristics, and the like of the functional layer attached electronic component 10 after the functional layer is fixed. For example, the inspection unit 9 can inspect the defect in the appearance of the functional layer attached electronic component 10 by performing image processing on the image of the functional layer attached electronic component 10 captured by the camera. Alternatively, the inspection unit 9 may inspect the electrical characteristics of the electronic component 10 with the functional layer by conducting an energization inspection using a circuit or the like having a test function.

< Construction example of control section 4 >

Hardware configuration example

Fig. 2 is a block diagram showing an example of a hardware configuration of the control unit 4. The control unit 4 is constituted by a computer. The control unit 4 has CPU (Central Processing Unit), ROM (Read Only Memory), 402, RAM (Random Access Memory), 403. The control unit 4 includes an HDD/SSD (HARD DISK DRIVE/Solid STATE DRIVE) 404, an Interface (Interface) 405, and a communication I/F406. Which are communicatively connected to each other via a system bus S.

The CPU401 executes control processing including various arithmetic processing. The ROM402 stores IPL (Initial Program Loader) or the like programs for driving the central processor 401. The RAM403 is used as a work area of the CPU 401. The HDD/SSD404 stores various information such as programs. The device connection I/F405 is an interface for connecting the control section 4 to various devices. The communication I/F406 is an interface for communication with an external device such as the external PC (Personal Computer) via a communication network or the like.

Functional configuration example

Fig. 3 is a functional block diagram of an example of the control unit 4. The control unit 4 includes an acquisition unit 41, a determination unit 42, a self-test unit 43, a formation control unit 44, a cleaning control unit 45, an irradiation control unit 46, a heating control unit 47, a determination unit 48, and an output unit 49.

The functions of the determining unit 42, the self-checking unit 43, the formation control unit 44, the cleaning control unit 45, the irradiation control unit 46, the heating control unit 47, and the determining unit 48 are realized by a processor such as the CPU401 in fig. 2 executing a process defined by a program stored in a nonvolatile memory such as the ROM 402. The functions of the acquisition unit 41 and the output unit 49 are realized by the device connection I/F405 and the communication I/F406 in fig. 2.

The acquisition unit 41 acquires the reading result Im from the reading unit 3 by controlling communication with the reading unit 3. The acquisition unit 41 also acquires information Ei about the electronic component 10A from the external device based on the read result Im by controlling communication with the external device. Further, the acquisition unit 41 acquires the inspection information Te of the functional layer-attached electronic component 10 from the inspection unit 9 by controlling communication with the inspection unit 9. The acquiring unit 41 outputs the acquired information Ei and inspection information Te about the electronic component 10A to the determining unit 42, and outputs the read result Im to the self-inspecting unit 43.

The determining unit 42 determines a predetermined shape of the functional layer formed on the electronic component 10A based on the information Ei related to the electronic component 10A acquired from the external device via the acquiring unit 41, and a position on the functional layer where the predetermined shape is formed, based on the read result Im. The determination unit 42 outputs the image data De as the determination result to the self-check unit 43.

The self-checking unit 43 detects a defect in the image data De determined by the determining unit 42 to perform self-checking on whether the image data De is acceptable. For example, when the information to be provided to the functional layer by the first forming unit 6 includes a two-dimensional code such as a QR code corresponding to the information Ei about the electronic component 10A, the self-checking unit 43 detects a defect in the two-dimensional code. When no defect is detected, the self-inspection unit 43 outputs the image data De as a good to the formation control unit 44. On the other hand, when there is a defect, the self-inspection unit 43 does not output the image data De of the defective product to the formation control unit 44, and outputs information on the defect to an external device such as a display device via the output unit 49.

The formation control unit 44 outputs the discharge control signal C2 to the first formation unit 6 via the output unit 49 based on the determination result of the determination unit 42, that is, the image data De, thereby controlling the discharge operation of the liquid composition by the first formation unit 6.

The cleaning control unit 45 outputs a cleaning control signal C1 to the cleaning unit 5 via the output unit 49, and controls the cleaning unit 5 to start cleaning or stop the operation of the cleaning unit 5.

The irradiation control unit 46 outputs an irradiation control signal C3 to the first irradiation unit 7 via the output unit 49, and controls the operation of the first irradiation unit 7 such as the start of ultraviolet irradiation, that is, the lighting of ultraviolet light, the stop of ultraviolet irradiation, and the intensity of ultraviolet light.

The heating control unit 47 outputs a heating control signal C4 to the heating unit 8 via the output unit 49, and controls the heating unit 8 to start heating or stop heating or the like, and the operation of the heating unit 8.

The determination unit 48 determines whether or not the manufactured functional layer attached electronic component 10 is a good product based on the inspection information Te from the inspection unit 9, and outputs the determination result to an external device such as a display device via the output unit 49.

< Example method of manufacturing electronic component with functional layer 10 >

Fig. 4 is a flowchart showing an example of a method for manufacturing the electronic device 10 with a functional layer.

First, in step S41, a preparation process of the electronic component 10A before the formation of the functional layer is performed. The housing section 1 houses a tray in which a plurality of prepared electronic components 10A are arranged.

Next, in step S42, the manufacturing apparatus 100 conveys the tray accommodating the electronic component 10A by the conveying section 2. The electronic component 10A is thus conveyed in the conveying direction.

Next, in step S43, the manufacturing apparatus 100 performs a process of reading the electronic component 10A by the reading unit 3. The reading unit 3 reads a pattern indicating a manufacturer name, a component number, a lot number, information on positioning, a size of the electronic component 10A, and the like, which is printed on the surface of the electronic component 10A, and outputs the read result Im to the control unit 4.

Next, in step S44, the manufacturing apparatus 100 performs a process of acquiring information Ei about the electronic component 10A from an external apparatus. Here, based on the reading result of the reading section 3, the external device is referred to, and information Ei about the electronic component is acquired. In the example given in fig. 4, the process of acquiring the information Ei about the electronic component 10A includes two processes of: step S43, a step of reading the electronic component 10A by the reading unit 3, and a step S44, a step of acquiring information about the electronic component 10A from an external device.

Next, in step S45, the manufacturing apparatus 100 executes a determining step by the control unit 4 to determine a predetermined shape and a position at which the predetermined shape is formed on the functional layer based on the information Ei about the electronic component 10A acquired in step S44.

Next, in step S46, the manufacturing apparatus 100 performs self-test on the image data De, which is the determination result of step S45, by the self-test unit 43 of the control unit 4. The self-inspection unit 43 outputs the image data De as a good to the formation control unit 44 when no defect is detected, and outputs information on the defect to an external device such as a display device via the output unit 49 when there is a defect.

Next, in step S47, the manufacturing apparatus 100 cleans the surface of the electronic component 10A on which the functional layer is formed by the cleaning section 5.

Next, in step S48, the manufacturing apparatus 100 performs a process of forming a functional layer on the electronic component 10A and simultaneously providing information to the functional layer. Specifically, the insulating material or the conductive material is discharged from the first forming portion 6 based on the image data De as a result of the determination in step S45, thereby forming a functional layer on the electronic component 10A, and at the same time, the information Ei about the electronic component is given to the functional layer. The functional layer to which the information Ei is given corresponds to the incidental information functional layer of the present embodiment.

Next, in step S49, the manufacturing apparatus 100 performs a step of irradiating the functional layer formed on the electronic component 10A with ultraviolet light or heat by the first irradiation section 7.

Next, in step S50, the manufacturing apparatus 100 heats the functional layer formed on the electronic component 10A by the heating section 8.

For example, when the target thickness of the functional layers is large, after one functional layer is formed, spot ultraviolet irradiation having an intensity of 1293 (mJ/cm ²) or the like is performed to temporarily harden the one functional layer, and the temporary hardening operation is repeated for each layer function to form a functional layer having an overall layer thickness of about 20 μm. Then, the functional layer was subjected to main hardening at 150℃for 30 minutes.

Next, in step S51, the manufacturing apparatus 100 inspects the result of forming the functional layer on the electronic component 10A by the inspection unit 9, that is, the obtained electronic component 10 with the functional layer.

As described above, the functional layer with information of the present embodiment can be formed on the electronic component 10A, and the electronic component 10 with the functional layer can be manufactured.

< Example of electronic component with functional layer according to the embodiment >

With reference to fig. 5 to 20, the functional layer attached electronic component 10 according to the embodiment is described. Fig. 5 is a top view of an example of an electronic component 10 with a functional layer manufactured by the manufacturing method according to the present embodiment. Fig. 6 to 8 are enlarged plan views of the region VI in fig. 5, wherein fig. 6 is a first example, fig. 7 is a second example, and fig. 8 is a third example. Fig. 9 to 11 are sectional views taken along line IX-IX in fig. 5, wherein fig. 9 is a first example, fig. 10 is a second example, and fig. 11 is a third example. Fig. 12 and 13 are plan views of dots 25 to which information is given to the functional layer 11, wherein fig. 12 is a first example and fig. 13 is a second example. Fig. 14 is a plan view of the QR code 20b of the first example application functional layer 11. Fig. 15 is an enlarged top view of the region XV in fig. 14. Fig. 16 is a plan view of the QR code 20b of the second example application functional layer 11. Fig. 17 is an enlarged top view of region XVII of fig. 16. Fig. 18 is a plan view of a QR code 20b of the third example application functional layer 11. Fig. 19 is an enlarged plan view of the region XIX in fig. 18. Fig. 20 is a plan view of an example of the electronic component 10 with a functional layer manufactured by the manufacturing method according to the embodiment. The functional layer 11 is an example of an additional information functional layer.

Fig. 5 is a schematic view of the functional layer 11 formed on the upper surface of the electronic component 10A. In fig. 5, since the functional layer 11 and the electronic component 10A overlap, the symbol of the functional layer 11 and the symbol of the electronic component 10A are labeled at the same time. In the following, when objects overlap, a symbol indicating the object may be simultaneously denoted.

In the present embodiment, the information area VI is provided with information 20 such as information Ei about the electronic component 10A as a part of the functional layer 11. Fig. 6 to 8 show information 20 given to the area VI. The information 20 given in the example of fig. 6 is a numeral 20a constituted by "3108". The information 20 given in the example of fig. 7 is a QR code 20b of a two-dimensional code. The information 20 given in the example of fig. 8 is a bar code 20c.

The information provided by the functional layer 11 can be provided by forming a predetermined shape in the information area VI of the functional layer 11. Fig. 9 to 11 illustrate a predetermined shape 120 formed on the functional layer 11. In the example of fig. 9 to 11, the functional layer 11 is formed on the upper surface 10A-1 and the side surface 10A-2 of the electronic component 10A. Herein, "on the electronic component 10A" means on the surface constituting the electronic component 10A including the upper surface 10A-1 of the electronic component 10A, the side surface 10A-2 of the electronic component 10A, and the like. The terminals 12 are used to electrically connect the electronic component 10A to a PCB substrate or the like.

The predetermined shape 120 in the present embodiment may include at least one of a concave portion 120a recessed with respect to the non-information area 110 in which the predetermined shape 120 is not formed in the functional layer 11, a convex portion 120c protruding with respect to the non-information area 110, and a hole 120b penetrating the functional layer in the thickness direction of the functional layer 11. In the example of fig. 9, the concave portion 120a is formed in a predetermined shape 120. The holes 120b in the example of fig. 10 are formed in a prescribed shape 120. In the example of fig. 11, the convex portion 120c is formed in a prescribed shape 120. The information 20 such as the number 20a, the QR code 20b, the barcode 20c is given to the functional layer 11 by forming the predetermined shapes 120 such as the concave portion 120a, the hole 120b, and the convex portion 120c on the functional layer 11, or by forming a combination of these predetermined shapes on the functional layer 11.

In the present embodiment, according to the information Ei about the electronic element 10A, a predetermined shape 120 corresponding to information such as a character, a number, a bar code, and a two-dimensional code including the information Ei about the electronic element 10A can be formed at a position where GND lines of the electronic element 10A are gathered. The position of the region VI in fig. 5 corresponds to the position of GND line collection in the electronic component 10A.

For example, in the functional layer 11, by forming the predetermined shape 120, the functional layer 11 becomes thinner or the area of the functional layer 11 becomes smaller than the non-information region 110, and the shielding accuracy of electromagnetic waves or noise may be lowered than the non-information region 110. In the present embodiment, in the electronic component 10A, the predetermined shape 120 is formed at the position where the GND line having less oscillation of electromagnetic waves and noise is concentrated, so that the degradation of the shielding accuracy of the functional layer 11 due to the formation of the predetermined shape 120 can be reduced.

In the present embodiment, as shown in fig. 9 to 11, the minimum thickness t2 of the functional layer 11 in the predetermined shape 120 may be 1/10 or less of the minimum thickness t1 of the functional layer 11 in the non-information area 110. For example, the minimum thickness of the functional layer 11 in the non-information area 110 may be 0.1 μm or more and 30 μm or less. This makes it possible to make the light reflection state of the predetermined shape 120 different from the light reflection state of the non-information area 110. As a result, the color tone, and the like of the information region including the predetermined shape 120 and the non-information region 110 can be made different when the functional layer 11 is viewed from the outside, and the information 20 to be added can be recognized from the outside well by forming the functional layer 11 into the predetermined shape 120. However, if the information 20 can be identified, the relationship between the thickness t2 of the functional layer 11 in the prescribed shape 120 and the thickness t1 in the non-information area 110 is not limited to the above. In addition, from the viewpoint of improving the recognition of the information given to the predetermined shape 120, it is preferable that the color difference Δe between the information area including the predetermined shape 120 and the non-information area 110 is 6.5 or more.

As shown in fig. 12 and 13, the predetermined shape 120 may include an aggregate of the points 25. The maximum width of the point 25 seen from the thickness direction (Z direction) of the functional layer 11 may be 0.5mm or less. In fig. 12, the predetermined shape 120 includes an aggregate of points 25 a. The maximum width d of the point 25a is 0.5mm or less. In fig. 13, the predetermined shape 120 includes an aggregate of points 25 b. The maximum width d of the point 25b is 0.5mm or less. The dots 25a and the dots 25b are different in depth in the thickness direction of the functional layer 11. Based on the difference in the depth, the shading, hue, and the like of the color of the dot 25 are recognized as being different from each other.

For example, when the functional layer 11 is an electromagnetic wave shielding layer, the aggregate including the dots 25 in the predetermined shape 120 can reduce the amount of the conductive material used compared with the case where the predetermined shape includes a continuous pattern. Further, the maximum width d of the dot 25 seen from the thickness direction (Z direction) of the functional layer 11 is 0.5mm or less, and the amount of the conductive material used can be further reduced. Since the price of Ag or Cu as a conductive material is high, the cost of the electronic component 10 with a functional layer can be reduced by reducing the amount of the conductive material used.

Fig. 14 to 18 show the QR code 20b formed on the functional layer 11. For example, the control unit 4 of fig. 2 may create image data corresponding to the QR code 20b using general QR code creation software based on the reading result Im of the reading unit 3. The QR code 20b includes information based on the reading result Im and positional information at which the QR code 20b is formed on the functional layer 11. The thickness of the functional layer 11 is 20 μm or the like, and the thickness of the predetermined shape 120 corresponding to the QR code 20b is 4 μm or the like.

In the present embodiment, the predetermined shape 120 corresponding to the QR code 20b may include the first region 21 and the second region 22, and the functional layer 11 of the second region 22 may be thinner than the first region 21. In addition, the area of the second region 22 seen from the upper surface direction of the functional layer 11 in one cell 23 among the plurality of cells 23 included in the predetermined shape 120 corresponding to the QR code 20b may be 1/4 or more of the area of the one cell 23 seen from the upper surface direction of the functional layer 11.

Fig. 14 shows the QR code 20ba of the second area 22 of one cell 23, i.e., when there is no blank area without a coating film. Fig. 15 is an enlarged display of one cell 23 corresponding to the region XV in fig. 14. One unit 23 has a square shape as viewed from above the functional layer 11. One unit 23 is constituted by a plurality of pixels 231 arranged in a two-dimensional shape. In the QR code 20ba shown in fig. 14 and 15, the area of the first area 21 is equal to the area of 1 cell 23.

Fig. 16 shows the QR code 20bb when the area of the second region 22 in 1 cell 23 is set to about 1/4 of the area of 1 cell 23. Fig. 17 shows an enlarged view of one cell 23 corresponding to the region XVII in fig. 16. In the QR code 20bb shown in fig. 16 and 17, the area of the second area 22 is about 1/4 of the area of one cell 23.

Fig. 18 shows the QR code 20bc when the area of the second region 22 in one cell 23 is set to about 1/2 of the area of one cell 23. Fig. 19 shows one cell 23 corresponding to the region XIX in fig. 18 in an enlarged manner. In the QR code 20bc shown in fig. 18 and 19, the area of the second area 22 is about 1/2 of the area of one cell 23.

If the opening (width) of the through hole at the time of printing (QR code production, etc.) is not controlled to 0.5mm or less, the electromagnetic wave shielding effect is not achieved. Since the conductive material forming the electromagnetic wave shield is expensive of 600000 yen/liter, it is preferable to increase the area of the opening as much as possible even in the print production in the functional layer, and to reduce the material cost. Since the shielding effect is poor, the amount of conductive material used for shielding can be reduced by expanding the opening (width) of the through hole to 0.5mm or less as much as possible.

As described above, in one cell 23 among the plurality of cells 23 having the predetermined shape 120 corresponding to the QR code 20b, the area of the second region 22 viewed from the upper surface direction of the functional layer 11 is 1/4 or more of the area of the one cell 23 viewed from the upper surface direction of the functional layer 11, so that the amount of the conductive material used can be reduced. This reduces the cost of the electronic component 10 with the functional layer.

Fig. 20 shows an additional functional layer electronic component 10 having a functional layer 11 formed on an electronic component 10A. The numerals 20a and QR code 20b given to the functional layer 11 are given by forming the functional layer 11 into a predetermined shape 120.

Second embodiment

Next, a method for forming the incidental information functional layer of the second embodiment will be described. The same names and symbols as those of the embodiment described above denote the same or similar components or constituent parts, and detailed description thereof will be omitted as appropriate.

In this embodiment, the functional layer 11 is formed of a conductive material, and the process further includes forming a protective layer on the functional layer 11 formed on the electronic component 10A, which is different from the first embodiment.

Fig. 21 is a block diagram showing an overall configuration of an example of the apparatus 100a for manufacturing the functional layer-attached electronic device 10a according to the present embodiment. The manufacturing apparatus 100a has a second forming section 6a and a second irradiation section 7a. The electronic component 10a with functional layer further forms a protective layer on the functional layer 11 formed on the electronic component 10 a.

The second forming portion 6a is disposed downstream of the first irradiation portion 7 in the conveying direction 50. The second forming portion 6a forms a protective layer on the functional layer 11 which is formed on the electronic component 10A by the first forming portion 6 and irradiated with ultraviolet rays by the first irradiation portion 7. When the manufacturing apparatus 100a does not have the first irradiation portion 7, the second forming portion 6a may be disposed downstream of the first forming portion 6 in the conveying direction 50.

The second irradiation portion 7a is disposed downstream of the second formation portion 6a in the conveying direction 50. The second irradiation unit 7a irradiates the protective layer on the functional layer 11 formed by the second forming unit 6a with ultraviolet rays, and hardens the protective layer. If the liquid composition constituting the functional layer 11 is not a polymerizable compound, the manufacturing apparatus 100a may not have the second irradiation section 7a.

< Example method of manufacturing electronic component with functional layer 10a >

Fig. 22 is a flowchart showing an example of a method for manufacturing the functional layer-attached electronic device 10a according to the second embodiment. Steps S221 to S227 in fig. 22 are the same as steps S41 to S47 in fig. 4, and thus, duplicate explanation is omitted here.

In step S228, the functional layer 11 is formed on the electronic component 10A, and at the same time, information is given to the functional layer 11. Specifically, the first forming unit 6 discharges the conductive material based on the determination result in step S225, that is, the image data De, to form the functional layer 11 on the electronic component 10A, and at the same time, to impart the information Ei about the electronic component to the functional layer 11. For example, the thickness of the functional layer 11 is 1.5 μm, and the thickness of the predetermined shape 120 is 0.1 μm.

Next, in step S229, the manufacturing apparatus irradiates the functional layer formed on the electronic component 10A with ultraviolet rays through the first irradiation section 7.

Next, in step S230, the manufacturing apparatus 100A forms a protective layer on the functional layer 11 formed on the electronic element 10A. Specifically, the second forming portion 6a discharges the insulating material, and forms a protective layer on the functional layer 11 formed on the electronic component 10A. The protective layer is formed on the entire functional layer 11 including the prescribed shape 120.

As an insulating material constituting the protective layer, various resin materials and the like can be used, and for example, IJSR4000 manufactured by solar ink manufacturing company and the like can be used as the insulating material, and the film thickness of the protective film can be 3 μm or more.

Next, in step S231, the manufacturing apparatus 100A irradiates ultraviolet rays or heat to the protective layer formed on the electronic component 10A through the second irradiation section 7 a.

Next, in step S232, the manufacturing apparatus 100A heats the functional layer 11 and the protective layer formed on the electronic component 10A by the heating section 8. For example, the functional layer 11 and the protective layer may be heated at 150 ℃ for 30 minutes to be cured formally.

Next, in step S233, the manufacturing apparatus 100a inspects the electronic component 10a with the functional layer obtained as a result of forming the protective layer on the functional layer 11 on the electronic component 10a by the inspection section 9.

As described above, the functional layer attached electronic component 10a can be manufactured.

In the present embodiment, the functional layer 11 is formed of a conductive material, and the step further includes forming a protective layer on the functional layer 11 formed on the electronic component 10A. Therefore, the functional layer 11 formed of the conductive material is covered with the protective layer, so that corrosion, oxidation, and vulcanization of the functional layer 11 can be reduced. Except for this, the effect is the same as that of the first embodiment.

The protective layer of the present embodiment can be applied to the following third embodiment.

Third embodiment

The present embodiment is different from the first embodiment in that information is given by forming an information area into a predetermined pattern shape using a material different from that of a non-information area or different forming conditions of the same material. In the electronic device with a functional layer according to the present embodiment, a functional layer is formed on a surface, the functional layer is composed of an information region and a non-information region, the functional layer has a uniform thickness as a whole, and the information region is given information by a pattern shape having a different color difference from the non-information region. From the viewpoint of improving the visibility of information, the color difference Δe between the information area and the non-information area is preferably 6.5 or more.

In this embodiment, the information region and the non-information region may be made of conductive materials or non-conductive materials, respectively, and the conductive materials may be appropriately determined according to the functions required by the functional layer. The information area and the non-information area each having a predetermined pattern shape are formed of a conductive material, and each area may be formed of the same conductive material or may be formed of a different conductive material. The "same conductive material" in this embodiment means the same kind of metal, alloy, or the like, and the manufacturer and model of the conductive material are the same, that is, the same conductive material. Constructing the information area and the non-information area from the same conductive material can reduce the time and material costs required for the management of a plurality of different kinds of conductive materials, as compared to the case of using different conductive materials. However, at least when the same conductive material is used, it is necessary to change the formation conditions of the respective regions such as firing conditions to form the regions having different colors from each other. On the other hand, "different conductive materials" includes materials composed of different kinds of metals, alloys, and the like, and materials composed of the same kind of metals, alloys, and the like, but each model is different. That is, the "different conductive materials" include materials having different colors from the beginning to each other and materials that produce different colors under the same firing conditions.

The following describes the electronic device with a functional layer according to the present embodiment.

Fig. 23 to 24 are schematic diagrams showing an example of the structure of the functional layer-attached electronic component 10b according to the present embodiment. Fig. 23 is a plan view of the electronic component 10b with the functional layer. Fig. 24 is a cross-sectional view taken along line XXIV-XXIV in fig. 23. As shown in fig. 23 to 24, the functional layer-attached electronic component 10b includes an electronic component 10A and a functional layer 11. The functional layer 11 includes a pattern shape 13 as an information area and a non-information area 110. The functional layer 11 is formed on the upper surface and the side surface of the electronic component 10A.

First example

In the first example, the information is given by forming the information area into a predetermined pattern shape with a material different from the non-information area.

For example, the non-information area 110 is formed using an Ag nanoink of DNS-0169I manufactured by Daicel corporation. Daicel corporation is the manufacturer of conductive materials and DNS-0169I is the model of conductive materials. The pattern shape 13 may use Ag nanoink of I40DM-106 manufactured by Pvnanocell company. Pvnanocell is the manufacturer of the conductive material and I40DM-106 is the model of the conductive material. That is, between the non-information area 110 and the pattern shape 13, conductive materials of the same metal type but different types are constituted, and thus "different conductive materials" are used. The materials used for the non-information area 110 and the pattern shape 13 may be appropriately changed as long as the colors of both are different.

The functional layer 11 may be formed on the electronic component 10A by inkjet. Fig. 25 to 26 are views showing an example of a process for forming the functional layer 11 on the electronic component 10A. Fig. 25 to 26 are plan views of the electronic component 10b with the functional layer.

Fig. 25 shows a state in which the non-information area 110 is given to the electronic component 10A. In fig. 25, a black region indicates a non-information region 110 to which Ag nanoink for the functional layer 11 is applied on the electronic component 10A. The blank area 11' which is not black-coated is an area to which the pattern shape 13 is given in the next process.

Fig. 26 shows a state in which Ag nanoink for pattern shape 13 is applied to blank region 11' with respect to the state of electronic element 10A shown in fig. 15. In fig. 26, the non-information area 110 given to the electronic component 10A is indicated by white, and the pattern shape 13 given to the blank area 11' is indicated by black.

Further, the assignment of the non-information area 110 and the assignment of the pattern shape 13 may be appropriately exchanged in order.

After the non-information region 110 and the pattern shape 13 are formed on the electronic component 10A, the non-information region 110 and the pattern shape 13 are sintered, thereby forming the functional layer 11 on the electronic component 10A.

In the present embodiment, the pattern shape 13 may include a graphic representing information on the position of the pin provided on the additional functional layer electronic element 10 b. Graph 14 in fig. 26 corresponds to a graph showing the position of a pin as such a reference.

Second example

The second example differs from the first example in that information is given by forming the information area in a predetermined pattern shape using the same material as the non-information area but different formation conditions. I.e. the pattern shape is formed with the same conductive material as the non-information areas but with different firing conditions.

After sintering the nano ink or complex ink of Ag, cu, etc. used for the functional layer of electromagnetic wave shielding layer, etc., the Ag or Cu changes in structure, and the particle diameter of Ag or Cu coarsens. The reflective state of the layer using Ag and Cu changes due to coarsening of the particle size of Ag and Cu, and the color of the layer changes. In this example, using such a phenomenon that the color varies depending on the sintering condition, the same conductive material can be used for the pattern shape 13 and the non-information area 110 while causing a color difference between the pattern shape 13 and the non-information area 110. As sintering conditions, there are, for example, a sintering temperature and a sintering time.

The non-information area 110 and the pattern shape 13 may be formed using Ag nanoink of DNS-0169I manufactured by Daicel corporation.

For example, as shown in fig. 25, the functional layer 11 is first provided on the electronic component 10A, and then the electronic component 10A provided with the non-information area 110 is placed in a thermostat or an oven. Then, the firing is performed at a firing temperature of 200 ℃ for 30 minutes or longer, for example. Thus, the non-information area 110 is fixed on the electronic component 10A. After the non-information area 110 is sintered, the electronic component 10A having the non-information area 110 formed therein is taken out of the oven or the oven.

Next, as shown in fig. 26, ag nanoink for pattern shape 13 is applied to blank region 11' (see fig. 25) of electronic element 10A in which non-information region 110 is formed. Then, the electronic component 10A to which the Ag nanoink for pattern shape 13 was applied was placed in a thermostatic bath or an oven. Then, the mixture is fired at, for example, a firing temperature of 120℃for 10 minutes. Thereby, the pattern shape 13 is fixed on the electronic component 10A.

As described above, the functional layer attached electronic component of the second example can be formed. The non-information region 110 and the pattern shape 13 are preferably first sintered at a higher sintering temperature. The material is not limited as long as it can be formed into conductive materials of different colors under different firing conditions.

The operational effects other than those described in the third embodiment are substantially the same as those in the first embodiment.

While the preferred embodiments have been described in detail, the present invention is not limited to the above embodiments, and various modifications and substitutions are possible to the above embodiments without departing from the scope of the claims.

The mode of the present invention is, for example, as follows.

<1> A method for forming a functional layer with information, comprising a step of providing information to a functional layer including an information region having the information and a non-information region other than the information region while forming the functional layer on a surface of an object to be constructed, wherein a color difference exists between the information region and the non-information region.

<2> The method for forming an additional information functional layer according to <1>, wherein the information is provided by forming the information area in a predetermined shape, or the information is provided by forming the information area in a predetermined pattern shape using a material different from the non-information area, or using the same material as the non-information area but different forming conditions.

<3> The method for forming an additional information functional layer according to <1> or <2>, wherein the information includes information on the object to be constructed.

<4> The method for forming an additional information functional layer according to <2>, wherein the predetermined shape comprises an aggregate of dots.

<5> The method for forming an additional information functional layer according to <4>, wherein the maximum width of the point seen from the thickness direction of the functional layer is 0.5mm or less.

<6> The method for forming a functional layer with information according to any one of <1> to <5>, wherein the information includes one or more selected from the group consisting of an alphanumeric code, a matrix code, a bar code, and a two-dimensional code corresponding to the information on the object to be constructed.

<7> The method for forming an additional information functional layer according to <2>, wherein the information area includes a first area and a second area having a thickness thinner than that of the first area, and an area of the second area seen from an upper surface direction of the functional layer is 1/4 or more of an area of one cell seen from the upper surface direction of the functional layer among the plurality of cells included in the predetermined shape.

<8> The method for forming a functional layer with information according to <2>, wherein the minimum thickness of the functional layer in the information area is 1/10 or less of the minimum thickness of the functional layer in the area where the predetermined shape is not formed.

<9> The method for forming a functional layer with information according to <1>, wherein the thickness of the functional layer in the non-information area is 0.1 μm or more and 30 μm or less.

<10> The method for forming an additional information functional layer according to any one of <1> to <9>, wherein the functional layer is formed with a conductive material.

<11> The method for forming an additional information functional layer according to <2>, wherein the pattern shape is formed with the same conductive material as the non-information area but different sintering conditions.

<12> The method for forming a functional layer with information according to any one of <1> to <11>, wherein the functional layer is formed on the object to be constructed by discharging a liquid composition constituting the functional layer, and at the same time, the information is given to the functional layer.

<13> The method for forming an additional information functional layer according to <12>, wherein the liquid composition is discharged by a line head method.

<14> The method for forming an additional information functional layer according to <12>, wherein the liquid composition contains a polymerizable compound, and the method for forming the additional information functional layer comprises a step of irradiating the functional layer formed on the object with an active energy ray.

<15> The method for forming an additional information functional layer according to <2>, further comprising a step of acquiring the information and a step of determining the shape of the information area based on the information.

<16> The method for forming an additional information functional layer according to <15>, further comprising a step of determining a position where the information area is formed.

<17> The method for forming an additional information functional layer according to <16>, wherein the position includes a position where GND lines are concentrated on the object to be constructed.

<18> A method for manufacturing an electronic component, wherein the object to be constructed is an electronic component, the method comprising the step of forming an additional information functional layer by the method for forming <1 >.

<19> An electronic component with a functional layer, wherein a functional layer is formed on a surface, the functional layer being composed of an information area and a non-information area, having a uniform thickness, the information area being given information by a pattern shape having a different color difference from the non-information area.

<20> The functional layer attached electronic component according to <19>, wherein the information area and the non-information area are composed of the same conductive material.

Description of the reference numerals

1. Storage part

2. Conveying part

3. Reading part

4. Control unit

41. Acquisition unit

42. Determination unit

43. Self-checking part

44. Forming a control part

45. Cleaning control part

46. Irradiation control unit

47. Heating control part

48. Judgment part

49. Output unit

5. Cleaning part

6. A first forming part

6A second forming portion

7. A first irradiation part

7A second irradiation part

8. Heating part

9. Inspection part

10. 10A electronic component with functional layer

10A electronic component (an example of an object to be constructed)

10A-1 upper surface

10A-2 side

11. Functional layer (one side with information functional layer)

11' Blank area

12. Terminal for connecting a plurality of terminals

13. Pattern shape

14. Graphics pattern

20. Information processing system

20A number

20B QR code

20C bar code

21. First region

22. Second region

23. Unit cell

25. Point(s)

50. Direction of conveyance

100. 100A manufacturing apparatus

110. Non-information area

120. Prescribed shape

120A recess

120B hole

120C convex portion

401 CPU

402 ROM

403 RAM

404 HDD/SSD

405. Device connection I/F

406. Communication I/F

C1 Cleaning control signal

C2 Forming a control signal

C3 Irradiation control signal

C4 Heating control signal

A. B, C, D region

Maximum width D

De image data

Ei electronic component related information

Im reading results

S system bus

Te inspection information

Thickness t1, t2

Claims (20)

1. A method for forming an additional information functional layer, wherein,

Comprising a step of forming a functional layer on the surface of an object to be constructed and imparting information to the functional layer,

The functional layer includes an information area having the information and a non-information area other than the information area, and a color difference exists between the information area and the non-information area.

2. The method for forming an additional information functional layer according to claim 1, wherein,

The information area is formed into a predetermined shape different from the thickness of the non-information area to impart the information, or

The information is provided by forming the information area in a predetermined pattern shape using a material different from that of the non-information area or using the same material as that of the non-information area but different formation conditions.

3. The method for forming an additional information functional layer according to claim 1 or 2, wherein the information includes information on the object under construction.

4. The method for forming an additional information functional layer according to claim 2, wherein the predetermined shape includes an aggregate of dots.

5. The method for forming an additional information functional layer according to claim 4, wherein a maximum width of the dot as seen from a thickness direction of the functional layer is 0.5mm or less.

6. The method for forming a functional layer with information according to claim 1 or 2, wherein the information includes one or more selected from the group consisting of an alphanumeric code, a bar code, and a two-dimensional code corresponding to the information on the object to be constructed.

7. The method for forming an additional information functional layer according to claim 2, wherein,

The information area includes a first area and a second area, the functional layer of the second area having a thinner thickness than the first area,

The area of the second region seen from the upper surface direction of the functional layer in one cell among the plurality of cells included in the predetermined shape is 1/4 or more of the area of the one cell seen from the upper surface direction of the functional layer.

8. The method for forming an additional information functional layer according to claim 2, wherein a minimum thickness of the functional layer in the information region is 1/10 or less of a minimum thickness of the functional layer in a region where the predetermined shape is not formed.

9. The method for forming an additional information functional layer according to claim 1, wherein a thickness of the functional layer in the non-information area is 0.1 μm or more and 30 μm or less.

10. The method for forming an additional information functional layer according to claim 1 or 2, wherein the functional layer is formed with a conductive material.

11. The method for forming an additional information functional layer according to claim 2, wherein the pattern shape is formed with the same conductive material as the non-information area but different sintering conditions.

12. The method for forming an additional information functional layer according to claim 1 or 2, wherein the functional layer is formed on the object to be constructed by discharging a liquid composition constituting the functional layer, and the information is given to the functional layer at the same time.

13. The method for forming an additional information functional layer according to claim 12, wherein the liquid composition is discharged by a line head method.

14. The method for forming an additional information functional layer according to claim 12, wherein,

The liquid composition contains a polymerizable compound,

The method for forming the additional information functional layer includes a step of irradiating the functional layer formed on the object with an active energy ray.

15. The method for forming an additional information functional layer according to claim 2, further comprising,

A step of acquiring the information, and

And determining the shape of the information area based on the information.

16. The method for forming a functional layer with information according to claim 15, further comprising a step of determining a position of forming the information area.

17. The method for forming an additional information functional layer according to claim 16, wherein the position includes a position where GND lines are gathered on the object to be constructed.

18. A method for manufacturing an electronic component, wherein,

The object to be constructed is an electronic component,

The method for manufacturing an electronic component includes a step of forming an additional information functional layer by using the method for forming an additional information functional layer according to claim 1.

19. An electronic component with a functional layer, wherein,

A functional layer is formed on the surface of the substrate,

The functional layer comprises an information area and a non-information area, has a uniform thickness,

The information area is given information by a pattern shape having a different color difference from the non-information area.

20. The functional layer-attached electronic component of claim 19, wherein the information region and the non-information region are composed of the same conductive material.