CN117983919A - Laser welding method and system thereof - Google Patents
Laser welding method and system thereof Download PDFInfo
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- CN117983919A CN117983919A CN202211331209.7A CN202211331209A CN117983919A CN 117983919 A CN117983919 A CN 117983919A CN 202211331209 A CN202211331209 A CN 202211331209A CN 117983919 A CN117983919 A CN 117983919A
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- 238000003466 welding Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 47
- 229910000679 solder Inorganic materials 0.000 claims abstract description 101
- 238000002844 melting Methods 0.000 claims abstract description 46
- 230000008018 melting Effects 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims description 20
- 230000000007 visual effect Effects 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
The invention relates to the technical field of laser welding, in particular to a laser welding method and a system thereof, wherein the method comprises the following steps: detecting the position of a chip to be welded on the substrate to judge whether the chip to be welded is deviated or not; if the chip to be welded is judged to deviate, laser pre-melting treatment is carried out on the solder paste positioned under the corresponding end of the chip to be welded according to the deviation direction, the deviation is corrected, and laser melting treatment is carried out on the solder paste positioned under the two ends of the chip to be welded, so that the laser welding of the chip to be welded is completed. A laser welding system applying the method is also provided. According to the invention, according to the direction of offset, solder paste under the corresponding end is melted, offset is corrected, then the solder pastes on two sides are simultaneously subjected to laser melting treatment, and welding is completed, so that the position of a chip is corrected and the welding is completed, and the welding yield is greatly improved.
Description
Technical Field
The invention relates to the technical field of laser welding, in particular to a laser welding method and a laser welding system.
Background
The Mini-LEDCOB display screen is characterized in that a chip adopts a flip LED chip, the size of the chip is smaller than 300 micrometers on two sides of the chip, and a PCB substrate is used as a display product for integrally packaging the display carrier plates. The base materials can be expanded into COG, COF and the like according to different base materials. Along with the reduction of the distance, the Mini-LED COB display product has better advantages in the aspects of reliability, manufacturing cost and display effect, and becomes the most fire-explosion technology in the current industry.
At present, the general mode for assembling the Mini-LED chip and the substrate is as follows: the LED chip is subjected to die bonding on a bonding pad printed with the solder paste by a die bonder; and then melting the solder paste by means of reflow soldering or laser soldering to form stable circuit conduction. In the chip assembly process, the chip can be placed in a position deviation phenomenon due to the factor of system stability, and the chip deviation is further enlarged in the welding process due to mismatching of the melting surface tension of the solder paste, so that the chip circuit breaking is finally formed.
Therefore, a laser welding method is needed to solve the technical problem that the die attach offset is further enlarged during die attach.
Disclosure of Invention
In view of the above, the present invention provides a laser welding method to solve the problems of poor welding and low yield caused by chip offset.
The technical scheme adopted by the invention for solving the technical problems is as follows:
According to an aspect of the present invention, there is provided a laser welding method including:
detecting the position of a chip to be welded on a substrate to judge whether the chip to be welded is deviated or not;
If the chip to be welded is judged to deviate, carrying out laser pre-melting treatment on the solder paste positioned below the corresponding end of the chip to be welded according to the deviation direction, correcting the deviation, and carrying out laser melting treatment on the solder paste positioned below the two ends of the chip to be welded to finish the laser welding of the chip to be welded.
Preferably, before the step of detecting the position of the chip to be soldered on the substrate to determine whether the chip to be soldered is offset, the method further includes:
and placing a chip on a preset area of the substrate, wherein a first end of the chip is placed on a bonding pad on which the solder paste is printed on a first side of the preset area, and a second end of the chip is placed on a bonding pad on which the solder paste is printed on a second side of the preset area, so as to form the chip to be welded.
Preferably, after the step of performing position detection on the chip to be soldered on the substrate to determine whether the chip to be soldered is offset, the method further includes:
and if the chip to be welded is judged not to deviate, carrying out the same laser melting treatment on the solder paste positioned under the two ends of the chip to be welded to finish the laser welding of the chip to be welded.
Preferably, the step of detecting a position of the chip to be soldered on the substrate to determine whether the chip to be soldered is offset specifically includes:
Performing position detection on the chip to be welded through a visual detection assembly to acquire the position relationship between the center of the chip to be welded and the center of the preset area;
If the position relationship is that the center of the chip to be welded is coincident with the center of the preset area, judging that the chip to be welded is not deviated;
If the position relationship is that the center of the chip to be welded is located at the first side of the center of the preset area, judging that the chip to be welded is deviated, wherein the deviation direction is the first side;
if the position relationship is that the center of the chip to be welded is located at the second side of the center of the preset area, judging that the chip to be welded is deviated, and the deviation direction is the second side.
Preferably, the step of performing laser pre-melting treatment on solder paste under the corresponding end of the chip to be soldered according to the direction of the offset to correct the offset specifically includes:
If the offset direction is the first side, carrying out laser pre-melting treatment on the solder paste positioned under the second end of the chip to be welded through second side laser until the center of the chip to be welded coincides with the center of the preset area;
If the offset direction is the second side, performing laser pre-melting treatment on the solder paste positioned under the first end of the chip to be welded through the first side laser until the center of the chip to be welded coincides with the center of the preset area
Preferably, the laser energy in the laser pre-melting treatment is gradually changed from small to large until the center of the chip to be welded coincides with the center of the preset area.
Preferably, the step of performing the same laser melting treatment on the solder paste under the two ends of the chip to be soldered specifically includes: and carrying out laser melting treatment on the solder paste positioned under the first end of the chip to be welded through first side laser and carrying out laser melting treatment on the solder paste positioned under the second end of the chip to be welded through second side laser, wherein when the laser melting treatment is carried out, the laser energy of the first side laser is equal to the energy of the second side laser.
Preferably, the laser welding method further comprises the steps of:
After the laser welding of the chip to be welded is finished, the solder paste positioned below the two ends of the chip to be welded is subjected to cooling treatment, so that the chip to be welded is welded and fixed on the substrate.
The present invention further provides a system for laser welding comprising:
the visual detection assembly is used for detecting the position of the chip to be welded on the substrate;
The laser emission assembly is used for carrying out laser melting treatment on solder paste below two ends of the chip to be welded;
A controller for controlling the operation of the vision inspection assembly and the laser emission assembly, respectively, to perform the laser welding method of any one of claims 1-8, when in operation.
Preferably, the laser emitting assembly includes:
The laser light source is connected with the controller and used for emitting laser beams;
The light splitting module is used for receiving the laser beam emitted by the laser light source and splitting the laser beam into two parallel laser beams with equal energy;
and the energy control module is connected with the controller and used for controlling the energy size and emission of the received two parallel laser beams with equal energy.
Compared with the prior art, according to the laser welding method, according to the direction of offset, the solder paste at the corresponding end is melted, the offset is corrected, then the solder pastes at the two sides are subjected to laser melting treatment at the same time, so that the molten states of the solder pastes at the two sides are consistent, further, the chip stop displacement is stopped at the corrected position, and finally, the welding is completed, and further, the welding yield is greatly improved.
Drawings
Fig. 1 is a schematic hardware structure of a laser welding system according to the present invention.
Fig. 2 is an enlarged schematic view of the structure of the substrate to be processed in the system a for laser welding according to the present invention.
Fig. 3 is a schematic diagram of a structure of a chip on a substrate to be processed at a system a for laser welding according to the present invention shifted rightward.
Fig. 4 is a schematic flow chart of a first embodiment of a laser welding method according to the present invention.
Fig. 5 is a schematic flow chart of a second embodiment of the laser welding method provided by the invention.
Fig. 6 is a specific flowchart of step S12 of the laser welding method shown in fig. 4.
Fig. 7 is a specific flowchart of step S13 of the laser welding method shown in fig. 4.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear and obvious, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, fig. 1 is a schematic hardware structure of a laser welding system according to a first embodiment of the present invention. The invention provides a laser welding system, which comprises a visual detection component, a control component and a control component, wherein the visual detection component is used for detecting the position of a chip to be welded on a substrate;
The laser emission component is used for carrying out laser melting treatment on the solder paste positioned under the two ends of the chip to be welded,
And the controller is used for respectively controlling the visual detection assembly and the laser emission assembly to work so as to execute laser welding when in work.
Specifically, the visual detection component 5 is a CCD, a visual sensor; the laser emission component comprises a laser light source 2, a light splitting module 3 and an energy control module 4, wherein the laser light source 2 and the energy control module 4 are respectively connected with a controller 6, the light splitting module 3 receives a laser beam emitted by the laser light source 2 and is decomposed into two parallel laser beams with equal energy, the two parallel laser beams are emitted to the energy control module 4, and the controller 6 controls the energy control module 4 to control the energy and emission of the received two parallel laser beams with equal energy; the controller is a PC, i.e. a computer.
In one embodiment, the laser welding system 1 includes a laser light source 2, a beam splitting module 3, an energy control module 4, a visual inspection assembly 5, and a controller 6. The controller 6 is connected with the laser light source 2, the energy control module 4 and the visual detection component 5 in a wired manner, and the controller 6 can control the three connected devices. In this embodiment, the vision detecting component 5 is a CCD, which is a vision sensor that converts an optical signal into an electrical signal, and can be understood as having functions of a camera and position feedback.
In some embodiments, the energy module may also be other common devices or energy sources with heating functions.
The following describes in detail the respective devices of the laser welding system in connection with fig. 1:
The visual detection assembly 5 is disposed opposite to the position of the chip 30, so that the visual detection assembly 5 can monitor the position of the chip 30 in real time and send the position information of the chip 30 to the controller 6. The controller 6 compares and judges the received center position information of the chip with the center of the preset area. When it is determined that the positional information of the chip is shifted, the controller 6 controls the energy control module 4 according to the shifted information. At the same time, the controller 6 also controls the laser light source 2 to emit laser light to the spectroscopic module 3.
In this embodiment, the left side is set to be the first side, and the right side is set to be the second side. In the present embodiment, the judgment result includes whether the chip 30 is not shifted, shifted left, or shifted right. Specifically, if the position relationship is that the center of the chip to be welded coincides with the center of the preset area, judging that the chip to be welded is not deviated; if the position relationship is that the center of the chip to be welded is positioned at the first side of the center of the preset area, judging that the chip to be welded is deviated, and the deviation direction is left; if the position relationship is that the center of the chip to be welded is located at the second side of the center of the preset area, judging that the chip to be welded is deviated, and the deviation direction is right.
The beam splitting module 3 receives the laser light emitted from the laser light source 2 and splits the laser light into a first laser light on a first side and a second laser light on a second side, and then transmits the first laser light and the second laser light to the energy control module 4. In this embodiment, the energy control module 4 is composed of two energy controllers that are connected to each other. The first laser beam is emitted from a first side of the beam-splitting module 3 and received by the energy controller of the first side, and the second laser beam is emitted from a second side of the beam-splitting module 3 and received by the energy controller of the second side. Referring to fig. 2 and fig. 3 again, fig. 2 is an enlarged schematic view of the structure of the substrate to be processed at the system a for laser welding according to the present invention. Fig. 3 is a schematic diagram of a structure of a chip on a substrate to be processed at a system a for laser welding according to the present invention shifted rightward. As can be seen from fig. 2, the substrate includes a first side pad 11 and a second side pad 12 disposed at a left-right interval, a first side solder paste 21 is disposed at an upper end portion of the first side pad 11 near the central axis 40, a second side solder paste 22 is disposed at an upper end portion of the second side pad 12 near the central axis 40, the chip 30 is disposed on the first side solder paste 21 and the second side solder paste 22, and a length of a portion of the chip 30 on the first side of the central axis 40 is equal to a length of a portion of the chip 30 on the second side of the central axis 40, that is, the chip 30 is symmetrically disposed along the central axis 40. In this embodiment, the central axis 40 is the center of the preset area. At this time, the controller 6 determines the received positional information of the chip 30, and determines that the position of the chip 30 is not shifted, and at this time, the same laser melting process is directly performed on the solder paste located under both ends of the chip to be soldered, so as to complete the laser synchronous soldering of the chip to be soldered. Referring again to fig. 3, the center of the chip 30 is not coincident with the center of the predetermined area and the center of the chip 30 is biased toward the second side. At this time, the controller 6 determines the position of the received chip 30, determines that the chip 30 is shifted to the second side, and then the controller 6 controls the laser light source 2 to be started, the laser light source 2 emits laser light to the beam splitting module 3, and the beam splitting module 3 emits a first beam of laser light on the first side to the energy controller on the first side and emits a second beam of laser light on the second side to the energy controller on the second side. The controller 6 controls the energy controller on the first side of the energy control module 4 to emit the first beam of laser onto the first side solder paste 21 of the first side pad 11 according to the information that the chip 30 is shifted to the second side, so that the first side solder paste 21 on the first side pad 11 is pre-melted first, and the chip 30 moves to the first side due to the surface tension of the melted first side solder paste 21 until the chip to be soldered reaches the preset area. The preset area is reached, specifically, the center of the chip to be welded coincides with the center of the preset area. When the chip 30 is displaced to a predetermined area, the first laser beam keeps the energy unchanged, so that the molten state of the first side solder paste 21 on the first side pad 11 is unchanged. At this time, the energy control module 4 is simultaneously enabled to emit the second laser beam onto the second side solder paste 22 and enable the second laser beam to be melted to be consistent with the melted state of the first side solder paste 21, the chip 30 is stationary, and then the first side solder paste 21 on the first side bonding pad 11 and the second side solder paste 22 on the second side bonding pad 12 are synchronously cooled to complete synchronous welding. The molten state is more specifically that the energy of the first laser beam and the energy of the second laser beam are always equal, so that the molten states of the first side solder paste 21 and the second side solder paste 22 are consistent.
In this embodiment, the offset information includes that the center of the chip 30 is offset to the first side or to the second side with respect to the center of the preset area, and when the chip 30 is offset to the first side, the laser is emitted to the solder paste on the second side pad 12; when the chip 30 is shifted to the second side, laser light is emitted to the solder paste on the first side pad 11.
In this embodiment, the energy control module 4 may control the energy levels of the received first and second laser beams. That is, after the energy control module 4 receives the first laser beam and the second laser beam, the energy of the two laser beams can be adjusted and then emitted. And the energy control module 4 can select which laser is emitted in what order.
In some embodiments, the determination that the chip 30 is not offset is when the center of the chip 30 coincides with the center of the predetermined area.
In some embodiments, when the chip 30 is not offset, the chip 30 is offset to the first side or the second side of the center of the predetermined area by a first set length, and the first set length is the maximum distance that the chip 30 is allowed to offset to the first side or the second side.
In some embodiments, when the chip 30 is not shifted to the center of the preset area and is determined to be within the second set length from the solder paste side of the pre-melted area, the second set length is a process of simultaneously performing laser melting treatment on the solder paste under the first end of the chip to be soldered by the first side laser and performing laser melting treatment on the solder paste under the second end of the chip to be soldered by the second side laser, since the solder paste which is pre-melted is melted first, the solder paste which is not pre-melted is heated and melted by the laser until the molten state of the solder paste which is pre-melted first is consistent, and in this process, the tension of the pre-melted solder paste is still greater than the tension of the solder paste which is melted later, and in this process, the length of the chip 30 which is continuously shifted is the second set length. If the center of the chip 30 is offset by a second set length towards the side of the solder paste far from the pre-melting treatment toward the center of the preset area, the continuous offset distance of the chip can be neutralized in the subsequent process of carrying out the same laser melting treatment on the solder paste under the two ends of the chip to be welded, and the welding yield is further improved.
Based on the hardware structure of the laser welding system and the system formed by the hardware structure, various embodiments of the method of the invention are presented.
Fig. 4 is a schematic flow chart of a first embodiment of the laser welding method according to the present invention.
Step S12, detecting the position of a chip to be welded on a substrate to judge whether the chip to be welded is deviated or not;
In the embodiment, the laser light source is a semiconductor laser, the emitted laser is in an infrared band, the wavelength is 900-1300nm, the energy is 5-50W, and the PC module controls the laser light source to emit laser. The functions and the position settings of the provided laser light source, the light splitting module, the energy control module, the visual detection module, the PC module, the solder paste on the first side bonding pad and the solder paste on the second side bonding pad are consistent with those of the laser welding system, and are not repeated here.
Specifically, as shown in fig. 6, fig. 6 is a schematic flow chart of step S12 of the laser welding method shown in fig. 4. The specific process comprises the following steps:
Step S121: and carrying out position detection on the chip to be welded through the visual detection assembly so as to acquire the position relation between the center of the chip to be welded and the center of the preset area.
Step S122: if the position relationship is that the center of the chip to be welded is coincident with the center of the preset area, judging that the chip to be welded is not deviated; if the position relationship is that the center of the chip to be welded is located at the first side of the center of the preset area, judging that the chip to be welded is deviated, wherein the deviation direction is the first side; if the position relationship is that the center of the chip to be welded is located at the second side of the center of the preset area, judging that the chip to be welded is deviated, and the deviation direction is the second side.
In the present embodiment, the device that receives the detected position information and determines whether or not to shift is the controller 6 shown in fig. 1.
It will be appreciated that in other embodiments, detecting the location of the chip and determining whether the chip is offset may be accomplished by other commercially available devices.
And S13, if the chip to be welded is judged to deviate, carrying out laser pre-melting treatment on the solder paste positioned under the corresponding end of the chip to be welded according to the deviation direction, and carrying out laser melting treatment on the solder paste positioned under the two ends of the chip to be welded after correcting the deviation, so as to finish the laser welding of the chip to be welded.
In this embodiment, the shifted information includes that the chip is not shifted, shifted to the first side, or shifted to the second side.
In this embodiment, when the chip is shifted to the first side, the laser is emitted to the solder paste on the second side pad; when the chip is shifted to the second side, laser is emitted to the solder paste on the first side bonding pad.
Specifically, as shown in fig. 7, fig. 7 is a schematic flowchart of step S13 of the laser welding method shown in fig. 4. The specific process comprises the following steps:
step S131: if the offset direction is the first side, carrying out laser pre-melting treatment on the solder paste positioned under the second end of the chip to be welded through second side laser until the center of the chip to be welded coincides with the center of the preset area; if the direction of the offset is the second side, performing laser pre-melting treatment on the solder paste positioned under the first end of the chip to be welded through the first side laser until the center of the chip to be welded coincides with the center of the preset area.
Step S132: the solder paste under the first end of the chip to be welded is subjected to laser melting treatment through the first side laser, and the solder paste under the second end of the chip to be welded is subjected to laser melting treatment through the second side laser, and when the solder paste is subjected to laser melting treatment, the laser energy of the first side laser is equal to the energy of the second side laser.
In this example, maintaining the molten state indicates that the surface tension of the solder paste is unchanged. "the same laser melting treatment is performed on the solder paste under both ends of the chip to be soldered" means that the surface tension of the solder paste on both sides is the same.
In this embodiment, when the chip is detected to be displaced to the first side to the preset area, the energy received by the solder paste on the first side is kept unchanged, and the melting treatment of the solder paste which is not melted on the second side includes melting the solder paste which is not melted on the second side to be consistent with the melting state of the solder paste on the side far away from the offset in a short time, and the continuous displacement length of the chip is within the maximum allowable offset length in the short time.
The determination of the chip 30 not being shifted may be provided in several ways, and is described in detail in the description of the apparatus.
In some embodiments, the first beam of laser light emission directions corresponds to solder paste on the first side pads and the second beam of laser light emission directions corresponds to solder paste on the second side pads.
In this embodiment, if the chip is shifted to the first side, the energy control module 4 emits a second laser beam on the second side, the second laser beam is emitted on the solder paste on the second side pad, and as the solder paste melts, the chip moves to the second side under the action of the surface tension of the molten solder paste until the center of the chip coincides with the center of the preset area.
In some embodiments, if the chip is shifted to the second side, the energy control module 4 emits a first laser beam on the first side, the first laser beam is emitted on the solder paste on the first side pad, and as the solder paste melts, the chip moves to the first side under the surface tension of the molten solder paste until the center of the chip coincides with the center of the preset area.
In this embodiment, the energy control module 4 controls the energy of the first beam of laser light or the second beam of laser light, specifically, the energy of the first beam of laser light or the second beam of laser light is gradually changed from small to large in the process of pulling the chip 30 forward until the center of the chip to be welded coincides with the center of the preset area.
In this embodiment, the laser light is collimated by the lens group of the spectroscopic system, the first laser light and the second laser light split by the spectroscopic system are parallel and the energies of the first laser light and the second laser light are equal.
It will be appreciated that in other embodiments, the solder paste on the first side pad and the solder paste on the second side pad may be melted by other heating devices, so long as the flow steps of fig. 4 are complied with.
Fig. 5 is a schematic flow chart of a second embodiment of the laser welding method according to the present invention.
Which differs from the first embodiment in that the second embodiment method further comprises before: step S11: the chip is fixedly crystallized on a preset area of the substrate, so that a first end of the chip is arranged on a bonding pad printed with solder paste on a first side of the preset area, and a second end of the chip is arranged on a bonding pad printed with solder paste on a second side of the preset area, so that a chip to be welded is formed;
In this embodiment, the chip 30 is almost always shifted to the first side or the second side. As particularly shown in fig. 3.
The first embodiment method further comprises a step S14: after the laser welding of the chip to be welded is finished, the solder paste positioned below the two ends of the chip to be welded is cooled so as to fix the chip to be welded on the substrate.
According to the method for laser welding, the solder paste at the corresponding end is melted according to the offset direction, the chip is displaced towards the correction direction until the center of the chip coincides with the center of a preset area due to the action of the surface tension of liquid, then the solder pastes at the two sides are heated by lasers with the same energy at the same time, so that the molten states of the solder pastes at the two sides are consistent, the chip stops displacing and stays at the corrected position, and finally cooling welding is carried out, so that the welding yield is greatly improved; in addition, by controlling the energy of the emitted laser, the energy of the emitted laser is particularly changed from small to large, so that the chip can be accurately corrected to a preset area, and the welding yield is greatly improved; when the chip is corrected to a preset area, another beam of laser is emitted to the solder paste on the other bonding pad, and the laser energy received by the solder paste on the bonding pad on the first side is consistent with the laser energy received by the solder paste on the bonding pad on the second side, so that the chip is fixed at a position after correction, synchronous welding can be completed, and the position of the chip is pulled forward and welded and fixed; the first laser beam and the second laser beam are parallel and have equal energy, so that a guarantee is provided for subsequent control; meanwhile, the method is simple and is convenient for mass production.
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, and thus do not limit the scope of the claims of the present invention. Those skilled in the art will appreciate that many modifications are possible in which the invention is practiced without departing from its scope or spirit, e.g., features of one embodiment can be used with another embodiment to yield yet a further embodiment. Any modification, equivalent replacement and improvement made within the technical idea of the present invention should be within the scope of the claims of the present invention.
Claims (10)
1. A laser welding method, comprising the steps of:
detecting the position of a chip to be welded on a substrate to judge whether the chip to be welded is deviated or not;
if the chip to be welded is judged to deviate, carrying out laser pre-melting treatment on the solder paste positioned below the corresponding end of the chip to be welded according to the deviation direction, correcting the deviation, and carrying out laser melting treatment on the solder paste positioned below the two ends of the chip to be welded to finish the laser welding of the chip to be welded.
2. The method of claim 1, wherein before the step of performing position detection on the chip to be soldered on the substrate to determine whether the chip to be soldered is offset, the method further comprises:
and placing a chip on a preset area of the substrate, wherein a first end of the chip is placed on a bonding pad on which the solder paste is printed on a first side of the preset area, and a second end of the chip is placed on a bonding pad on which the solder paste is printed on a second side of the preset area, so as to form the chip to be welded.
3. The method of claim 1, wherein after the step of performing position detection on the chip to be soldered on the substrate to determine whether the chip to be soldered is offset, the method further comprises:
and if the chip to be welded is judged not to deviate, carrying out the same laser melting treatment on the solder paste positioned under the two ends of the chip to be welded, and completing the laser welding of the chip to be welded.
4. The method of claim 2, wherein the step of performing position detection on the chip to be soldered on the substrate to determine whether the chip to be soldered is offset specifically includes:
Performing position detection on the chip to be welded through a visual detection assembly to acquire the position relationship between the center of the chip to be welded and the center of the preset area;
If the position relationship is that the center of the chip to be welded is coincident with the center of the preset area, judging that the chip to be welded is not deviated;
If the position relationship is that the center of the chip to be welded is located at the first side of the center of the preset area, judging that the chip to be welded is deviated, wherein the deviation direction is the first side;
if the position relationship is that the center of the chip to be welded is located at the second side of the center of the preset area, judging that the chip to be welded is deviated, and the deviation direction is the second side.
5. The method according to claim 4, wherein the step of performing laser pre-melting treatment on solder paste located under the corresponding end of the chip to be soldered according to the direction of the offset, and correcting the offset, specifically comprises:
If the offset direction is the first side, carrying out laser pre-melting treatment on the solder paste positioned under the second end of the chip to be welded through second side laser until the center of the chip to be welded coincides with the center of the preset area;
and if the offset direction is the second side, carrying out laser pre-melting treatment on the solder paste positioned under the first end of the chip to be welded through first side laser until the center of the chip to be welded coincides with the center of the preset area.
6. The laser welding method according to claim 5, wherein the laser energy at the time of the laser pre-melting treatment is gradually changed from small to large until the center of the chip to be welded coincides with the center of the preset area.
7. The method of claim 3, wherein the step of performing the same laser melting treatment on the solder paste under both ends of the chip to be soldered comprises: and carrying out laser melting treatment on the solder paste positioned under the first end of the chip to be welded through first side laser and carrying out laser melting treatment on the solder paste positioned under the second end of the chip to be welded through second side laser, wherein when the laser melting treatment is carried out, the laser energy of the first side laser is equal to the energy of the second side laser.
8. The laser welding method according to any one of claims 1 to 7, further comprising the steps of:
After the laser welding of the chip to be welded is finished, the solder paste positioned below the two ends of the chip to be welded is subjected to cooling treatment, so that the chip to be welded is welded and fixed on the substrate.
9. A laser welding system, comprising:
the visual detection assembly is used for detecting the position of the chip to be welded on the substrate;
The laser emission assembly is used for carrying out laser melting treatment on solder paste below two ends of the chip to be welded;
A controller for controlling the operation of the vision inspection assembly and the laser emission assembly, respectively, to perform the laser welding method of any one of claims 1-8, when in operation.
10. The laser welding system of claim 9, wherein the laser emitting assembly comprises:
The laser light source is connected with the controller and used for emitting laser beams;
The light splitting module is used for receiving the laser beam emitted by the laser light source and splitting the laser beam into two parallel laser beams with equal energy;
and the energy control module is connected with the controller and used for controlling the energy size and emission of the received two parallel laser beams with equal energy.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211331209.7A CN117983919A (en) | 2022-10-28 | 2022-10-28 | Laser welding method and system thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211331209.7A CN117983919A (en) | 2022-10-28 | 2022-10-28 | Laser welding method and system thereof |
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| CN117983919A true CN117983919A (en) | 2024-05-07 |
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| CN202211331209.7A Pending CN117983919A (en) | 2022-10-28 | 2022-10-28 | Laser welding method and system thereof |
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| CN (1) | CN117983919A (en) |
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- 2022-10-28 CN CN202211331209.7A patent/CN117983919A/en active Pending
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