CN117981053A

CN117981053A - Expansion device

Info

Publication number: CN117981053A
Application number: CN202180102154.XA
Authority: CN
Inventors: 铃木芳邦
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2024-05-03
Also published as: JPWO2023042263A1; TW202312315A; TWI828058B; WO2023042263A1; KR20240021309A

Abstract

The cold air supply unit (7) of the expansion device (100) is configured to supply cold air to a recess (120) surrounded by the clamping unit (63) and the wafer ring structure (200) in a state in which the annular member (230) is gripped by the clamping unit (63) and a space above the clamping unit (63) is unsealed and opened, thereby accumulating the cold air in the recess (120).

Description

Expansion device

Technical Field

The present invention relates to an expanding apparatus, and more particularly, to an expanding apparatus having a wafer ring structure including a wafer.

Background

Conventionally, an expanding apparatus having a wafer ring structure including a wafer is known. Such an expansion device is disclosed in, for example, japanese patent No. 5243101.

In japanese patent No. 5243101, a breaking device (expanding device) having a wafer ring structure including a wafer is disclosed. In the wafer ring structure, the wafer is mounted on the protective tape via a film-like adhesive material. The protective tape has stretchability. The protective tape is mounted to the annular frame. A breaking line for dividing the wafer into a plurality of chips is formed in the wafer.

The breaking device of japanese patent No. 5243101 is configured to break a wafer along a grid-like breaking line. The breaking device is provided with a frame holding unit, a protective tape expanding unit, a cold air introducing unit and a case. The frame holding unit is configured to hold the ring frame. The protective tape expanding unit is configured to expand the protective tape in a state where the annular frame is held by the frame holding unit, thereby breaking the wafer along the breaking line. The cool air introduction unit is configured to cool the protective tape to a temperature at which the wafer is easily broken by introducing cool air into the closed case.

Prior art literature

Patent literature

Patent document 1: japanese patent No. 5243101

Disclosure of Invention

Problems to be solved by the invention

However, in the breaking device of japanese patent No. 5243101, when the protective tape is cooled by the cool air introduction unit, the protective tape on which the wafer is mounted is covered from above by a lid-shaped case for closing (sealing) the cool air, and thus it is difficult to access the wafer from above. Therefore, in the breaking device of japanese patent No. 5243101, when the protective tape (sheet member) is cooled by the cool air introduction unit (cool air supply portion), it is desirable to cool the protective tape in a state where a path enabling access to the wafer from above is ensured.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an expansion device that can cool a fin member while ensuring a path that enables access to a wafer from above when the fin member is cooled by a cool air supply unit.

Means for solving the problems

An expansion device according to an aspect of the present invention includes: the wafer ring structure comprises a wafer which can be divided along a dividing line, a sheet member which is adhered with the wafer and has elasticity, and an annular ring member which is adhered to the sheet member in a state of surrounding the wafer; an expanding section including a clamping section for clamping the annular member, wherein the wafer is divided along the dividing line by expanding the sheet member in a state where the annular member is clamped by the clamping section; and a cool air supply unit configured to supply cool air to the sheet member when the sheet member is expanded by the expansion unit, the cool air supply unit being configured to store cool air in the recess by supplying cool air to the recess surrounded by the holding unit and the wafer ring structure in a state in which the annular member is held by the holding unit and a space above the holding unit is unsealed.

In the expansion device according to the aspect of the present invention, as described above, the cool air supply unit is configured to supply cool air to the concave portion surrounded by the holding portion and the wafer ring structure in a state where the annular member is held by the holding portion and the space above the holding portion is not closed but opened, thereby accumulating cool air in the concave portion. Accordingly, the cooling fin member can be cooled by accumulating the cooling air in the concave portion without supplying the cooling air to the closed space such as the case, and therefore, when the cooling fin member is cooled by the cooling air supply portion, the cooling fin member can be cooled in a state where a path capable of approaching the wafer from above is ensured.

In the expansion device of the above one aspect, preferably, the concave portion includes: an inner side surface of the clamping part and an inner side surface of the annular member; and a bottom surface formed by the upper surface of the sheet member. With this configuration, the concave portion is formed by the inner surface of the clip portion, the inner surface of the annular member, and the upper surface of the sheet member, and therefore, the concave portion can be formed by merely gripping the annular member by the clip portion. As a result, the recess portion having the upper side open can be easily formed.

In the expansion device according to the above aspect, the cold air supply unit preferably includes a cold air supply port that is disposed above the wafer in a state in which the annular member is gripped by the gripping unit, and supplies cold air from above toward below. With this configuration, the cold air supplied from the cold air supply port can be made to flow directly toward the bottom of the concave portion, and therefore the cold air can be efficiently stored in the concave portion.

In the expansion device according to the above aspect, the cold air supply unit is preferably configured to be movable in the vertical direction, and the cold air supply unit is preferably configured to supply the cold air to the concave portion in a state where the cold air supply unit is moved in the downward direction and is disposed at a position within the concave portion. With this configuration, unlike the case where the cold air is supplied to the concave portion in a state where the cold air supply portion is disposed (fixed) outside the concave portion, the flow of the cold air to the outside of the concave portion can be suppressed, and thus the cold air can be reliably supplied into the concave portion.

In this case, it is preferable that the cooling air supply unit further includes a fixing member for fixing the cooling air supply unit, and the depth of the concave portion is longer than the length of the fixing member in the vertical direction. With this configuration, the depth of the concave portion can be ensured, and thus more cool air can be stored in the concave portion.

In the expansion device according to the above aspect, preferably, the expansion device further includes a cooling unit configured to cool the sheet member from below in a state where the annular member is gripped by the grip portion, and the cooling unit includes a cooling member having a peltier element and contacting the sheet member from below in a state where the cooling member is cooled by the peltier element. With this configuration, the cooling member can cool the fin member not only by the cool air supply unit but also by the cooling member, and therefore the fin member can be cooled more effectively.

In this case, it is preferable that the cooling device further includes a control unit that performs control of both cooling by the cool air supply unit of the upper cooling fin member and cooling by the cooling unit of the lower cooling fin member by accumulating cool air in the concave portion. With this configuration, the control unit can cool the fin member by both the cool air supply unit and the cooling unit, and therefore the fin member can be sufficiently cooled.

In the expansion device of the above one aspect, preferably, the holding portion includes: a lower grip portion for supporting the annular member from below; and an upper holding portion that forms a portion of the inner surface of the recess that is located above the annular member, and presses the annular member from above. With this configuration, the recess is formed by the inner surface of the upper grip portion in a state where the annular member is gripped by the lower grip portion and the upper grip portion, and therefore the structure for forming the recess and the structure for gripping the annular member can be shared. As a result, an increase in the structure of the expansion device can be suppressed.

In this case, the upper grip portion preferably has a plurality of slide moving bodies that are slidable in the horizontal direction in the inner direction of the wafer side and in the outer direction of the opposite side of the wafer side. With this configuration, unlike the case where the plurality of sliding movement bodies move in the vertical direction, interference between each of the plurality of sliding movement bodies and the structure disposed above the upper grip portion can be suppressed, and therefore, a reduction in the degree of freedom in the arrangement of the structure disposed above the upper grip portion in the expansion device can be suppressed.

Effects of the invention

According to the present invention, as described above, when the cooling fin member is cooled by the cool air supply unit, the cooling fin member can be cooled while ensuring a path through which the wafer can be accessed from above.

Drawings

Fig. 1 is a top view of an expansion device of an embodiment.

FIG. 2 is a side view of an expansion device of an embodiment.

Fig. 3 is a plan view of a wafer ring structure of the expanding device according to the embodiment.

Fig. 4 is a cross-sectional view taken along line 101-101 of fig. 3.

Fig. 5 is a bottom view of a debris cleaner of the extension apparatus of one embodiment.

Fig. 6 is a bottom view of a heat-shrinkable portion of the expansion device of one embodiment.

Fig. 7 is a block diagram showing a control structure of an expansion device according to an embodiment.

Fig. 8 is a flowchart showing a semiconductor chip manufacturing process of the expanding device according to the embodiment.

Fig. 9 is a side view of a grip portion of an expansion device of an embodiment.

Fig. 10 is a plan view showing a lower grip portion and an upper grip portion of the expanding device according to the embodiment.

Fig. 11 is a side view showing a clip portion and a cool air supply portion of an expansion device according to an embodiment.

Fig. 12 is an enlarged view of the clip portion and the cool air supply portion in fig. 11.

Fig. 13 is a side view showing a cool air supply unit and a cooling unit of an expansion device according to an embodiment.

Fig. 14 is a side view showing an expanded state of a sheet member of an expanding portion of an expanding device according to an embodiment.

Fig. 15 is a flowchart showing a first half of the expansion process of the expansion device according to the embodiment.

Fig. 16 is a flowchart showing a second half of the expansion process of the expansion device according to the embodiment.

Fig. 17 is a flowchart showing a contact cooling process of the expansion device according to the embodiment.

Fig. 18 is a side view showing a state in which a wafer ring structure is placed on a lower grip portion of an expanding device according to one embodiment.

Fig. 19 is a plan view showing the lower grip and the upper grip of the expanding device according to the embodiment in a state where the wafer ring structure is placed on the lower grip.

Fig. 20 is a plan view showing a state in which a wafer ring structure is placed on a lower grip portion of an expanding device according to one embodiment, and the upper grip portion is closed.

Fig. 21 is a plan view showing a state in which a wafer ring structure is positioned by a position adjustment unit of an expanding device according to an embodiment.

Fig. 22 is a side view showing a state in which a wafer ring structure is gripped by a lower grip portion and an upper grip portion of the expanding apparatus according to one embodiment.

Detailed Description

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

The configuration of an expansion device 100 according to an embodiment of the present invention will be described with reference to fig. 1 to 22.

(Structure of expansion device)

As shown in fig. 1 and 2, the expanding device 100 is configured to divide a wafer 210 into a plurality of semiconductor chips. The expanding device 100 is configured to form a sufficient gap between the plurality of semiconductor chips. Here, the wafer 210 is irradiated with laser light having a wavelength that is transmissive to the wafer 210 along the dividing line (dicing line), and a modified layer is formed in advance. The modified layer means a crack, a void, or the like formed in the wafer 210 by laser light. The method of forming the modified layer on the wafer 210 in this manner is called stealth dicing.

Accordingly, in the expanding device 100, the wafer 210 is divided along the modified layer by expanding the sheet member 220. In the expanding device 100, the sheet member 220 is expanded, whereby the gaps between the plurality of semiconductor chips formed by the division are enlarged.

The expansion device 100 includes a base plate 1, a case 2, a lifting hand 3, a suction hand 4, a base 5, an expansion unit 6, a cold air supply unit 7, a cooling unit 8, a debris cleaner 9, a heat shrinkage unit 10, and an ultraviolet irradiation unit 11.

Here, the direction in which the box portion 2 and the heat shrinkage portion 10 are arranged in the horizontal direction is referred to as the X direction, the box portion 2 side in the X direction is referred to as the X1 direction, and the heat shrinkage portion 10 side in the X direction is referred to as the X2 direction. The direction orthogonal to the X direction in the horizontal direction is referred to as the Y direction, the cartridge 2 side in the Y direction is referred to as the Y1 direction, and the direction opposite to the Y1 direction is referred to as the Y2 direction. The vertical direction is referred to as the Z direction, the upward direction is referred to as the Z1 direction, and the downward direction is referred to as the Z2 direction.

Floor plate

The base plate 1 is a base provided with a case portion 2 and an adsorption hand portion 4. The bottom plate 1 has a rectangular shape long in the Y direction in plan view.

Box part

The cassette part 2 is configured to be able to accommodate a plurality of (five) wafer ring structures 200. Here, as shown in fig. 3 and 4, the wafer ring structure 200 has a wafer 210, a sheet member 220, and an annular member 230.

The wafer 210 is a circular thin plate formed of a crystal of a semiconductor substance which is a material of a semiconductor integrated circuit. In the wafer 210, as described above, a modified layer obtained by modifying the inside is formed along the dividing line. That is, the wafer 210 is configured to be separable along the dividing line. The sheet member 220 is an adhesive tape having stretchability. An adhesive layer is provided on the upper surface 220a of the sheet member 220. The wafer 210 is attached to the adhesive layer of the sheet member 220. The ring member 230 is a metal frame having a ring shape in a plan view. A notch 240 and a notch 250 are formed in the outer side surface 230a of the annular member 230. The ring member 230 is adhered to the adhesive layer of the sheet member 220 in a state of surrounding the wafer 210.

As shown in fig. 1 and 2, the cassette part 2 includes a Z-direction moving mechanism 21, a wafer cassette 22, and a pair of mounting parts 23. The Z-direction moving mechanism 21 is configured to move the wafer cassette 22 in the Z-direction using the motor 21a as a driving source. The Z-direction moving mechanism 21 includes a mounting table 21b for supporting the wafer cassette 22 from below. The wafer cassette 22 is supplied and placed on the placement table 21b by a manual operation. The wafer cassette 22 has a housing space capable of housing a plurality of wafer ring structures 200. A plurality (five) of the pair of placement portions 23 are disposed inside the wafer cassette 22. The annular member 230 of the wafer ring structure 200 is placed on the pair of placement portions 23 from the Z1 direction side. One of the pair of mounting portions 23 protrudes from the inner surface of the wafer cassette 22 on the X1 direction side toward the X2 direction side. The other of the pair of placement portions 23 protrudes from the inner surface of the wafer cassette 22 on the X2 direction side toward the X1 direction side.

Lifting hand

The lifting hand 3 is configured to be able to take out the wafer ring structure 200 from the cassette 2. The lifting hand 3 is configured to be able to house the wafer ring structure 200 in the cassette 2.

Specifically, the lifting hand 3 includes a Y-direction moving mechanism 31 and a lifting hand 32. The Y-direction moving mechanism 31 is configured to move the lifting hand 32 in the Y-direction using the motor 31a as a driving source. The lifting hand 32 is configured to support the ring member 230 of the wafer ring structure 200 from the Z2 direction side.

Adsorption hand

The suction hand 4 is configured to suck the ring member 230 of the wafer ring structure 200 from the Z1 direction side.

Specifically, the suction hand 4 includes an X-direction moving mechanism 41, a Z-direction moving mechanism 42, and a suction hand 43. The X-direction moving mechanism 41 is configured to move the suction hand 43 in the X-direction using the motor 41a as a driving source. The Z-direction moving mechanism 42 is configured to move the suction hand 43 in the Z-direction using the motor 42a as a driving source. The suction hand 43 is configured as an annular member 230 for supporting the wafer ring structure 200 from the Z1 direction side.

Base

The base 5 is a base provided with an expansion portion 6, a cooling unit 8, and an ultraviolet irradiation portion 11. The base 5 has a rectangular shape long in the Y direction in plan view.

Expansion part

The expanding portion 6 is configured to divide the wafer 210 along the dividing line by expanding the sheet member 220 of the wafer ring structure 200.

Specifically, the expanding portion 6 includes a Z-direction moving mechanism 61, a Y-direction moving mechanism 62, a clamping portion 63, and an expanding ring 64. The Z-direction moving mechanism 61 is configured to move the holding portion 63 in the Z-direction using the motor 61a as a driving source. The Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamping portion 63, and the expansion ring 64 in the Y-direction using the motor 62a as a driving source.

The holding portion 63 is configured to hold the ring member 230 of the wafer ring structure 200. The clamp 63 has a lower grip 63a and an upper grip 63b. The lower grip 63a supports the ring member 230 from the Z2 direction side. The upper grip 63b presses the ring member 230 supported by the lower grip 63a from the Z1 direction side. In this way, the ring member 230 is gripped by the lower gripping portion 63a and the upper gripping portion 63b.

The expansion ring 64 is configured to expand (expand) the sheet member 220 by supporting the sheet member 220 from the Z2 direction side. The expansion ring 64 has a ring shape in plan view.

Cold air supply unit

The cool air supply unit 7 is configured to supply cool air from the Z1 direction side to the sheet member 220 when the sheet member 220 is expanded by the expansion unit 6.

Specifically, the cool air supply unit 7 includes a plurality of nozzles 71. The nozzle 71 has a cold air supply port 71a (see fig. 5) through which cold air supplied from a cold air supply source (not shown) flows out. The nozzle 71 is mounted to the debris cleaner 9. The cold air supply source is a cooling device for generating cold air. The cool air supply source supplies air cooled by a cooling device or the like provided with a heat pump or the like, for example. Such a cold air supply source is provided in the base 5. The cold air supply source is connected to each of the plurality of nozzles 71 through a hose (not shown).

Cooling unit

The cooling unit 8 is configured to cool the sheet member 220 from the Z2 direction side when the sheet member 220 is expanded by the expansion portion 6.

Specifically, the cooling unit 8 includes a cooling member 81 having a cooling body 81a and a peltier element 81b, and a cylinder 82. The cooling body 81a is constituted by a member having a large heat capacity and a high heat conductivity. The cooling body 81a is made of a metal such as aluminum. The peltier element 81b is configured to cool the cooling body 81 a. The cooling body 81a is not limited to aluminum, and may be another member having a large heat capacity and a high heat conductivity.

The cooling unit 8 is configured to be movable in the Z direction by the cylinder 82. Thereby, the cooling unit 8 can be moved to a position in contact with the sheet member 220 and a position separated from the sheet member 220.

Fragment cleaner

The debris cleaner 9 is configured to suck the debris or the like of the wafer 210 when the sheet member 220 is expanded by the expansion portion 6.

As shown in fig. 5, the debris cleaner 9 includes an annular member 91 and a plurality of suction ports 92. The annular member 91 is a member having an annular shape as viewed from the Z1 direction side. The plurality of suction ports 92 are openings for sucking fragments and the like of the wafer 210. The plurality of suction ports 92 are formed on the lower surface of the annular member 91 on the Z2 direction side. The annular member 91 is an example of a "fixing member" in the scope of the claims.

As shown in fig. 2, the debris cleaner 9 is configured to be movable in the Z direction by a cylinder (not shown). Thereby, the debris cleaner 9 can be moved to a position close to the wafer 210 and a position that can avoid the suction hand 43 moving in the X direction.

Heat-shrinkable part

The heat shrinkage section 10 is configured to shrink the sheet member 220 expanded by the expanded section 6 by heating in a state where gaps between the plurality of semiconductor chips are maintained.

As shown in fig. 1, the heat shrinkage section 10 includes a Z-direction moving mechanism 110, a heating ring 111, a suction ring 112, and an expansion maintaining ring 113. The Z-direction moving mechanism 110 is configured to move the heating ring 111 and the suction ring 112 in the Z-direction using the motor 110a as a driving source.

As shown in fig. 6, the heating ring 111 has a ring shape in a plan view. In addition, the heating ring 111 has a sheath heater that heats the sheet member 220. The suction ring 112 is integrally formed with the heating ring 111. The suction ring 112 has a ring shape in plan view. A plurality of suction ports 112a are formed in the lower surface of the suction ring 112 on the Z2 direction side. The expansion maintaining ring 113 is configured to press the sheet member 220 from the Z1 direction side so that the sheet member 220 near the wafer 210 does not contract due to the heating of the heating ring 111.

The expansion maintaining ring 113 has a ring shape in a plan view. The expansion maintaining ring 113 is configured to be movable in the Z direction by a cylinder (not shown). Thereby, the expansion maintaining ring 113 can be moved to a position where the sheet member 220 is pressed and a position where it is separated from the sheet member 220.

Ultraviolet ray irradiation part

The ultraviolet irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays in order to reduce the adhesive force of the adhesive layer of the sheet member 220. Specifically, the ultraviolet irradiation section 11 has illumination for ultraviolet rays.

(Control Structure of expansion device)

As shown in fig. 7, the expansion device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expansion control calculation unit 17, an operation control calculation unit 18, and a storage unit 19.

The first control unit 12 is configured to control the heat shrinkage unit 10. The first control unit 12 includes a CPU (Central Processing Unit: central processing unit) and a storage unit having a ROM (Read Only Memory) and a RAM (Random Access Memory: random access Memory). The first control unit 12 may include, as a storage unit, an HDD (HARD DISK DRIVE: hard disk drive) or the like that holds stored information even after the voltage is turned off. The HDD may be provided in common to the first control unit 12, the second control unit 13, the third control unit 14, the fourth control unit 15, and the fifth control unit 16.

The second control unit 13 is configured to control the cool air supply unit 7, the cooling unit 8, and the debris cleaner 9. The second control unit 13 includes a CPU and a storage unit having a ROM, a RAM, and the like. The third control unit 14 is configured to control the expansion unit 6. The third control unit 14 includes a CPU and a storage unit having ROM, RAM, and the like. The second control unit 13 and the third control unit 14 may include, as the storage unit, an HDD or the like that holds the stored information even after the voltage is turned off.

The fourth control unit 15 is configured to control the box unit 2 and the lifting hand 3. The fourth control section 15 includes a CPU and a storage section having ROM, RAM, and the like. The fifth control unit 16 is configured to control the suction hand 4. The fifth control section 16 includes a CPU and a storage section having ROM, RAM, and the like. The fourth control unit 15 and the fifth control unit 16 may include, as the storage unit, an HDD or the like that holds the stored information even after the voltage is turned off.

The expansion control calculation unit 17 is configured to perform a calculation related to the expansion process of the sheet member 220 based on the processing results of the first control unit 12, the second control unit 13, and the third control unit 14. The expansion control arithmetic unit 17 includes a CPU and a storage unit having a ROM, a RAM, and the like.

The operation control calculation unit 18 is configured to perform a calculation related to the movement process of the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16. The operation control arithmetic section 18 includes a CPU and a storage section having a ROM, a RAM, and the like.

The storage unit 19 stores a program for operating the expansion device 100. The storage section 19 includes ROM, RAM, and the like.

(Semiconductor chip manufacturing Process by an expanding device)

The overall operation of the expansion device 100 will be described below.

In step S1, the wafer ring structure 200 is taken out of the cassette part 2. That is, after the wafer ring structure 200 housed in the cassette 2 is supported by the lifting hand 32, the lifting hand 32 is moved to the Y2 direction side by the Y direction moving mechanism 31, whereby the wafer ring structure 200 is taken out of the cassette 2. In step S2, the wafer ring structure 200 is transferred to the expanding unit 6 by the suction hand 43. That is, the wafer ring structure 200 taken out from the cassette part 2 is moved to the X2 direction side by the X direction moving mechanism 41 in a state of being sucked by the suction hand 43. Then, the wafer ring structure 200 moving toward the X2 direction is transferred from the suction hand 43 to the holding portion 63, and then held by the holding portion 63.

In step S3, the sheet member 220 is expanded by the expansion portion 6. At this time, the sheet member 220 of the wafer ring structure 200 held by the holding portion 63 is cooled by both the cool air supply portion 7 and the cooling unit 8. The wafer ring structure 200 cooled to a predetermined temperature is lowered by the Z-direction moving mechanism 61 while being held by the holding portion 63. Then, the sheet member 220 is expanded by the expansion ring 64, whereby the wafer 210 is divided along the dividing line. At this time, the wafer 210 is divided while sucking the chips by the chip cleaner 9.

In step S4, the expansion portion 6 is moved toward the Z2 direction side of the heat shrinkage portion 10 while maintaining the expanded state of the sheet member 220. That is, after the wafer 210 is divided, the wafer ring structure 200 in the state where the sheet member 220 is expanded is moved in the Y1 direction by the Y-direction moving mechanism 62. In step S5, the sheet member 220 is heated by the heat shrinkage section 10 to shrink. At this time, the wafer ring structure 200 moving in the Y1 direction is heated by the heating ring 111 while being sandwiched between the expansion maintaining ring 113 and the expansion ring 64. At this time, the suction by the suction ring 112 and the ultraviolet irradiation by the ultraviolet irradiation section 11 are performed.

In step S6, the expansion unit 6 is returned to the original position. That is, the wafer ring structure 200 having the sheet member 220 contracted is moved to the Y2 direction side by the Y direction moving mechanism 31. In step S7, the wafer ring structure 200 is transferred from the expanding unit 6 to the lifting hand 3 by the suction hand 43, moved to the X1 direction side by the X direction moving mechanism 41, and transferred to the lifting hand 32. In step S8, the wafer ring structure 200 is accommodated in the cassette part 2. Then, the wafer ring structure 200 supported by the lift hand 32 is moved to the Y1 direction side by the Y direction moving mechanism 31, and the wafer ring structure 200 is accommodated in the cassette part 2. Thus, the processing performed on one wafer ring structure 200 is completed.

(Detailed structures of the clamping part, the Cold air supply part and the Cooling Unit)

The detailed structures of the holding portion 63, the cool air supply portion 7, and the cooling unit 8 will be described with reference to fig. 9 to 14.

Detailed structure of lower grip

As shown in fig. 9 and 10, the lower grip 63a includes a support 163a, a position adjustment portion 163b, a positioning pin 163c, and a positioning pin 163d.

The support 163a supports the ring member 230 of the wafer ring structure 200 from the Z2 direction side. The support 163a has a through hole 163e. The through hole 163e penetrates the support 163a in the Z direction. The through hole 163e is formed so that the cooling body 81a contacts the sheet member 220 from the Z2 direction side. In the horizontal direction (XY direction), the size of the through hole 163e is larger than the cooling body 81 a. The size of the through hole 163e is slightly smaller than the annular member 230 in the horizontal direction (XY direction).

The position adjustment unit 163b is configured to move the wafer ring structure 200 placed on the support 163a toward the positioning pins 163c and 163 d. The position adjustment portion 163b is configured to be movable in the Y direction in the E1 direction toward the positioning pins 163c and 163 d. The position adjustment portion 163b is configured to be movable in the Y direction in the E2 direction away from the positioning pins 163c and 163 d.

The position adjusting unit 163b moves in the E1 direction, and thereby the notch 240 of the wafer ring structure 200 placed on the support 163a is brought into contact with the positioning pin 163 c. The position adjusting unit 163b moves in the E1 direction, and thereby the notch 250 of the wafer ring structure 200 placed on the support 163a is brought into contact with the positioning pin 163 d. Thereby, the wafer ring structure 200 is positioned in the horizontal direction. After positioning the wafer ring structure 200, the position adjusting unit 163b moves in the E2 direction and returns to the original position.

The positioning pins 163c and 163d are pins protruding in the Z1 direction from the upper surface of the support 163a on the Z1 direction side, respectively. The positioning pin 163c is disposed at a position corresponding to the notch 240. The positioning pin 163d is disposed at a position corresponding to the notch 250.

Detailed structure of upper grip

As shown in fig. 9 and 10, the upper grip 63b includes a plurality of (four) sliding moving bodies. The plurality of sliding movement bodies can slide in the horizontal direction in the inner direction (hereinafter referred to as D1 direction) of the wafer 210 side and in the outer direction (hereinafter referred to as D2 direction) of the opposite side to the wafer 210 side. The plurality of sliding moving bodies are a first sliding moving body 263a, a second sliding moving body 263b, a third sliding moving body 263c, and a fourth sliding moving body 263d.

The first sliding movement body 263a and the second sliding movement body 263b are arranged at positions facing each other in the Y direction. The first sliding movement body 263a and the second sliding movement body 263b are respectively movable in the D1 direction in the Y direction and the D2 direction on the opposite side of the wafer 210 side in the Y direction to the wafer 210.

The third sliding movable body 263c and the fourth sliding movable body 263d are disposed at positions facing each other in the X direction. The third sliding movement body 263c and the fourth sliding movement body 263D are respectively movable in the D1 direction in the X direction near the wafer 210 and in the D2 direction on the opposite side of the X direction from the wafer 210 side.

The first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263D are moved in the D1 direction, respectively, and are disposed at positions (inner positions) for pressing the annular member 230 from the Z1 direction side. Further, the first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263D are moved in the D2 direction, respectively, and are disposed at positions (outside positions) where the annular member 230 is not pressed from the Z1 direction side. In addition, at the outer position, the wafer ring structure 200 can move in the Z direction inside the first sliding moving body 263a, the second sliding moving body 263b, the third sliding moving body 263c, and the fourth sliding moving body 263 d.

The first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263D are moved in the D1 direction and the D2 direction by using actuators (not shown) such as motors or cylinders as driving sources, respectively.

Detailed structure of cool air supply part

As shown in fig. 11, the cool air supply unit 7 of the present embodiment is configured to retain cool air in the vicinity of the sheet member 220 of the wafer ring structure 200, instead of supplying cool air into the sealed case. In fig. 11, the cold air is virtually represented by hatching. That is, the cool air supply unit 7 is configured to supply cool air to the concave portion 120 surrounded by the clamp portion 63 and the wafer ring structure 200 in a state in which the annular member 230 is gripped by the clamp portion 63 and the space on the Z1 direction side of the clamp portion 63 is not closed and opened, thereby accumulating cool air in the concave portion 120.

Specifically, the cold air supply portion 7 includes a plurality of (two) nozzles 71 and a temperature sensor 72. In addition, although two nozzles 71 are provided, one or three or more nozzles may be provided.

The plurality of nozzles 71 are each configured to flow cool air toward the Z2 direction side. The plurality of nozzles 71 each have a cool air supply port 71a. The cool air supply port 71a is configured to be disposed on the Z1 direction side of the wafer 210 in a state where the annular member 230 is gripped by the gripping portion 63, and to supply cool air from the Z1 direction side toward the Z2 direction side. The cool air supply port 71a is opened toward the Z2 direction side. The cool air flowing out from the cool air supply port 71a flows toward the wafer 210, and contacts the wafer 210 to flow toward the sheet member 220 around the wafer 210.

The temperature sensor 72 is configured to measure the temperature of the atmosphere in the recess 120. The temperature sensor 72 is electrically connected to the second control unit 13. Thereby, the temperature measurement value of the temperature sensor 72 is sent to the second control section 13. The temperature sensor 72 is attached to the outer side surface of the annular member 91 of the debris cleaner 9.

As shown in fig. 12, the concave portion 120 is a concave space recessed from the upper end portion of the holding portion 63 toward the Z2 direction side. The recess 120 has an inner side 120a and a bottom 120b. The inner side 263e and the inner side 230b are side surfaces formed on the wafer 210 side in the horizontal direction, respectively. The inner surface 120a is constituted by an inner surface 263e of the upper grip 63b of the grip 63 and an inner surface 230b of the ring member 230. The inner side surface 263e is a surface formed when the first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263D are moved in the D1 direction, respectively. The bottom surface 120b is a surface formed on the Z2 direction side of the cool air supply unit 7. The bottom surface 120b is constituted by the upper surface 220a of the sheet member 220. In this way, in the concave portion 120, the cold air having a higher density than the air at normal temperature is retained near the upper surface 220a of the sheet member 220. The retained cold air is less likely to flow out of the concave portion 120 through the inner side face 263e of the upper grip portion 63b of the grip portion 63, the inner side face 230b of the annular member 230, and the upper surface 220a of the sheet member 220.

In the Z direction, the depth F of the concave portion 120 is greater than the length L of the annular member 91. In the horizontal direction (XY direction), the width W1 of the concave portion 120 is larger than the width W2 of the annular member 91. Thus, the recess 120 has a size capable of accommodating the annular member 91. The recess 120 has a substantially hexagonal shape in plan view (see fig. 1).

The cool air supply unit 7 is configured to be movable in the Z direction together with the annular member 91 by a cylinder (not shown). Thereby, the cool air supply unit 7 can be moved to a lower position Dw (see fig. 11) close to the wafer 210 and an upper position Up (see fig. 2) where the suction hand 43 moving in the X direction can be avoided. Accordingly, the cool air supply unit 7 is configured to supply cool air to the concave portion 120 in a state of being moved in the Z2 direction and disposed at a position (lower position Dw) within the concave portion 120.

Detailed structure of cooling unit

As shown in fig. 13, the cooling unit 8 is a unit for cooling the fin member 220 while the fin member 220 is cooled by the cool air supply portion 7. In this way, by using both the cold air supply portion 7 and the cooling unit 8, it is possible to avoid an insufficient cooling capacity. Thus, for example, even in the case of using the sheet member 220 in which a film member (for example, a die attach film or the like) is disposed below the wafer 210, or in the case of using the sheet member 220 made of a material that is slightly soft and difficult to cool, the sheet member 220 can be cooled more reliably.

The cooling unit 8 is configured to cool the sheet member 220 from the Z2 direction side in a state where the annular member 230 is gripped by the grip portion 63. As described above, the cooling unit 8 includes the cooling member 81 having the cooling body 81a and the peltier element 81b, and the cylinder 82. In the cooling unit 8, the cooling body 81a cooled by the peltier element 81b is raised toward the Z1 direction by the cylinder 82, and is brought into contact with the sheet member 220 from the Z2 direction side.

Detailed structures of the second and third control portions

As shown in fig. 11, the second control unit 13 is configured to perform the following control: based on the temperature measurement value of the temperature sensor 72, the space in the recess 120 is cooled to a predetermined temperature by the cold air supplied from the cold air supply unit 7. The predetermined temperature is, for example, about 0 ℃. As shown in fig. 13, the second control unit 13 is configured to control: based on a preset set time, the cooling body 81a is brought into contact with the sheet member 220 from the Z2 direction side during the set time, thereby cooling the sheet member 220.

As shown in fig. 11 and 13, the second control unit 13 is configured to perform the following control: based on the setting of whether cooling by both the cold air supply portion 7 and the cooling unit 8 is required or not, which is preset according to the type of the sheet member 220, cooling by both cooling by the cold air supply portion 7 of the Z1 direction side cooling sheet member 220 and cooling by the cooling unit 8 of the Z2 direction side cooling sheet member 220 is performed by accumulating cold air in the concave portion 120. Whether or not cooling by both the cold air supply portion 7 and the cooling unit 8 is required is preset by a user according to the kind of the sheet member 220.

As shown in fig. 14, the second control unit 13 is configured to perform the following control: after the cooling by the cooling unit 8 is stopped, the cooling member 81 is moved to the Z2 direction side and arranged at the lower position based on the elapse of the set time.

The second control unit 13 is configured to control: the suction by the debris cleaner 9 is started based on the temperature in the recess 120 reaching the prescribed temperature. The third control unit 14 is configured to control: based on the notification from the expansion control computing unit 17 that suction by the debris cleaner 9 has started, the holding portion 63 is moved to the Z2 direction side. By this, the wafer 210 is divided along the dividing line by expanding the sheet member 220 by the expansion ring 64, and thus a plurality of semiconductor chips are formed.

The second control unit 13 is configured to control: based on the notification of the position of the lower end of the grip 63 on the Z2 direction side obtained from the expansion control computing unit 17, the supply of the cold air by the cold air supply unit 7 is stopped, and the suction by the debris cleaner 9 is stopped. The second control unit 13 is configured to control: the cold air supply unit 7 is moved to the Z1 direction side and placed at the upper position Up based on the stop of the supply of the cold air by the cold air supply unit 7.

(Expansion processing)

The expansion process in the expansion device 100 will be described with reference to fig. 15 and 16. The expansion process is a process performed in step S3 in the above-described semiconductor chip manufacturing process.

As shown in fig. 15, in step S301, the second control unit 13 causes the suction hand 43 to be lifted up in the Z1 direction based on the wafer ring structure 200 being placed on the lower grip 63 a. At this time, the first, second, third, and fourth sliding movement bodies 263a, 263b, 263c, and 263D of the upper grip 63b are in a state of being moved in the D2 direction (see fig. 18 and 19). Then, the annular member 230 is mounted on the support 163a of the lower grip 63a (see fig. 18 and 19).

In step S302, the third control unit 14 moves the first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263D of the upper grip 63b in the direction D1 based on the notification that the suction hand 43 has been lifted from the expansion control operation unit 17 (see fig. 20). In step S303, the position adjustment unit 163b is moved in the E1 direction by the third control unit 14. At this time, the notch 240 of the wafer ring structure 200 is in contact with the positioning pin 163c, and the notch 250 of the wafer ring structure 200 is in contact with the positioning pin 163d (see fig. 21). Thereby, the wafer ring structure 200 is positioned in the horizontal direction. Then, after the position adjustment unit 163b is moved in the E1 direction, the third control unit 14 moves the position adjustment unit 163b in the E2 direction, and returns the position to the original position.

In step S304, after the position adjustment unit 163b is returned to the original position, the third control unit 14 moves (lifts) the lower grip 63a in the Z1 direction, and the upper grip 63b and the lower grip 63a grip the annular member 230 of the wafer ring structure 200 (see fig. 22).

In step S305, the second control unit 13 lowers the debris cleaner 9 based on the notification of the completion of the raising of the lower grip 63a obtained from the expansion control computing unit 17 (see fig. 11). In step S306, the second control unit 13 determines whether cooling of the sheet member 220 is required. If cooling of the sheet member 220 is required, the process proceeds to step S307, and if cooling of the sheet member 220 is not required, the process proceeds to step S309 in fig. 16.

In step S307, after the second control unit 13 starts the supply of the cold air by the cold air supply unit 7 (see fig. 11), the flow proceeds to step S400. In step S400, the contact cooling process is performed by the second control unit 13. In addition, the contact cooling process will be described later.

In step S308, the second control unit 13 determines whether or not the atmospheric temperature in the recess 120 measured by the temperature sensor 72 has reached a predetermined temperature. When the predetermined temperature is reached, the routine proceeds to step S309 in fig. 16, and when the predetermined temperature is not reached, step S308 is repeated.

As shown in fig. 16, in step S309, suction by the debris cleaner 9 is started by the second control section 13. Here, the suction amount of the debris cleaner 9 is smaller than the amount of the cold air supplied from the cold air supply portion 7. In step S310, the third control unit 14 causes the grip 63 to rapidly descend and expands the expansion ring 64 based on the notification that the suction by the debris cleaner 9 has been started being acquired from the expansion control calculation unit 17 (see fig. 14).

In step S311, based on the notification that expansion is completed from the expansion control calculation unit 17, the cooling by the cold air supply unit 7 is stopped by the second control unit 13. If cooling of the sheet member 220 by the cool air supply unit 7 and the cooling unit 8 is not required, the process of step S311 is not performed, and the flow proceeds to step S312.

In step S312, the suction of the debris cleaner 9 is stopped by the second control section 13 based on the stop of the cooling by the cool air supply section 7. In step S313, the second control unit 13 stops the suction by the debris cleaner 9, and thereafter, the expansion process ends. In addition, when cooling of the sheet member 220 by the cool air supply unit 7 and the cooling unit 8 is not required, the second control unit 13 stops the suction of the debris cleaner 9 based on the notification that the expansion is completed obtained from the expansion control operation unit 17.

Contact cooling treatment

The contact cooling process in the expansion device 100 will be described with reference to fig. 17. The contact cooling process is a process of cooling by the cooling unit 8 together with cooling by the cool air supply unit 7.

In step S401, the second control unit 13 starts cooling the cooling body 81a by the peltier element 81b based on the raising of the cooling body 81a (see fig. 13). In step S402, it is determined whether or not the set time has elapsed. If the set time has elapsed, the routine proceeds to step S403, and if the set time has not elapsed, step S402 is repeated. In step S403, the cooling body 81a is lowered by the second control unit 13. In step S404, after the cooling of the cooling body 81a by the peltier element 81b is stopped by the second control unit 13, the contact cooling process is terminated.

(Effects of the present embodiment)

In the present embodiment, the following effects can be obtained.

In the present embodiment, as described above, the cool air supply unit 7 is configured to supply cool air to the concave portion 120 surrounded by the clamp portion 63 and the wafer ring structure 200 in a state in which the annular member 230 is gripped by the clamp portion 63 and the space above the clamp portion 63 is not closed and is opened, thereby accumulating cool air in the concave portion 120. Accordingly, since the cooling air can be stored in the concave portion 120 without supplying the cooling air to the closed space such as the case, the cooling air supply portion 7 can cool the cooling air 220 while ensuring a path capable of approaching the wafer 210 from the Z1 direction.

In the present embodiment, as described above, the concave portion 120 includes: an inner side face 263e of the clamp 63 and an inner side face 230b of the ring member 230; and a bottom surface 120b formed by an upper surface 220a of the sheet member 220. Thus, the concave portion 120 is formed by the inner side face 263e of the clamp 63, the inner side face 230b of the annular member 230, and the upper surface 220a of the sheet member 220, and thus the concave portion 120 can be formed by merely holding the annular member 230 by the clamp 63. As a result, the recess 120 that is open in the Z1 direction can be easily formed.

In the present embodiment, as described above, the cool air supply unit 7 includes the cool air supply port 71a, and the cool air supply port 71a is disposed on the Z1 direction side of the wafer 210 in a state where the annular member 230 is gripped by the gripping unit 63, and supplies cool air from the Z1 direction side to the Z2 direction side. Accordingly, the cold air supplied from the cold air supply port 71a can be directly flowed toward the bottom of the concave portion 120, and thus the cold air can be efficiently accumulated in the concave portion 120.

In the present embodiment, as described above, the cool air supply unit 7 is configured to be movable in the Z direction. The cool air supply unit 7 is configured to supply cool air to the concave portion 120 in a state of being moved in the Z2 direction and being disposed at a position within the concave portion 120. Accordingly, unlike the case where the cold air is supplied to the concave portion 120 in a state where the cold air supply portion 7 is disposed (fixed) outside the concave portion 120, the flow of the cold air to the outside of the concave portion 120 can be suppressed, and thus the cold air can be reliably supplied into the concave portion 120.

In the present embodiment, as described above, the expansion device 100 includes the annular member 91 to which the cold air supply unit 7 is fixed. In the Z direction, the depth F of the concave portion 120 is greater than the length L of the annular member 91. This ensures the depth F of the concave portion 120, and therefore, more cold air can be stored in the concave portion 120.

In the present embodiment, as described above, the expansion device 100 includes the cooling unit 8, and the cooling unit 8 can cool the sheet member 220 from below in a state where the annular member 230 is gripped by the grip portion 63. The cooling unit 8 includes a cooling member 81, and the cooling member 81 has a peltier element 81b and contacts the sheet member 220 from below in a state of being cooled by the peltier element 81 b. Thus, the cooling member 81 can cool the fin member 220 in addition to the cool air supply unit 7, and thus the fin member 220 can be cooled more effectively.

In the present embodiment, as described above, the expansion device 100 further includes the second control unit 13, and the second control unit 13 performs control of both cooling by the cold air supply unit 7 of the upper cooling fin member 220 and cooling by the cooling unit 8 of the lower cooling fin member 220 by accumulating cold air in the concave portion 120. With this configuration, the second control unit 13 can cool the fin member 220 by both the cool air supply unit 7 and the cooling unit 8, and therefore the fin member 220 can be sufficiently cooled.

In the present embodiment, as described above, the clamp 63 includes: a lower grip 63a for supporting the ring member 230 from the Z2 direction side; and an upper grip 63b that forms a portion of the inner surface 120a of the recess 120 on the Z1 direction side of the annular member 230, and presses the annular member 230 from the Z1 direction side. In this way, the recess 120 is formed by the inner surface 263e of the upper grip 63b in a state where the lower grip 63a and the upper grip 63b grip the annular member 230, and therefore the structure for forming the recess 120 and the structure for gripping the annular member 230 can be shared. As a result, an increase in the structure of the expansion device 100 can be suppressed.

In the present embodiment, as described above, the upper grip 63b includes the first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263D that can slide in the horizontal direction in the D1 direction on the wafer 210 side and in the D2 direction on the opposite side to the wafer 210 side. Thus, unlike the case where the first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263d move in the Z direction, interference between each of the first sliding movement body 263a, the second sliding movement body 263b, the third sliding movement body 263c, and the fourth sliding movement body 263d and a structure disposed on the Z1 direction side of the upper grip 63b can be suppressed, and therefore, a reduction in the degree of freedom in the arrangement of the structure disposed on the Z1 direction side of the upper grip 63b in the expansion device 100 can be suppressed.

Modification example

The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the description of the above embodiments but by the scope of the claims, and includes all changes (modifications) within the meaning and scope equivalent to the scope of the claims.

For example, in the above embodiment, the example in which the cold air supply port 71a supplies cold air from the Z1 direction side toward the Z2 direction side (from the upper side toward the lower side) has been shown, but the present invention is not limited to this. In the present invention, the cool air supply port may supply cool air in a horizontal direction.

In the above embodiment, the cold air supply unit 7 is configured to supply cold air to the concave portion 120 in a state of being moved in the Z2 direction (downward direction) and being disposed at a position within the concave portion 120, but the present invention is not limited to this. In the present invention, the cold air supply unit may be configured to supply cold air to the concave portion in a state of being disposed at a position outside the concave portion.

In the above embodiment, the depth F of the concave portion 120 is larger than the length L of the annular member 91 (fixing member), but the present invention is not limited to this. In the present invention, the depth of the concave portion may be smaller than the length of the fixing member.

In the above embodiment, the example in which the expansion device 100 includes the cooling unit 8 has been shown, but the present invention is not limited to this. In the present invention, the expansion device may not include the cooling unit.

In the above embodiment, the cooling member 81 has been shown as having the peltier element 81b, but the present invention is not limited to this. In the present invention, the cooling body may be cooled by a cooling element other than the peltier element.

In the above embodiment, the example in which the cold air supply unit 7 has the nozzle 71 has been shown, but the present invention is not limited to this. In the present invention, the cool air supply unit may be a cylindrical member instead of a tapered member like a nozzle.

In the above embodiment, the example in which the temperature sensor 72 is attached to the outer side surface of the annular member 91 of the debris cleaner 9 has been shown, but the present invention is not limited to this. In the present invention, the temperature sensor may be mounted in other places such as the holding portion as long as the temperature of the atmosphere in the concave portion can be measured.

In the above embodiment, the example in which the cool air supply port 71a is formed in the nozzle 71 has been shown, but the present invention is not limited to this. In the present invention, the cool air supply port may be formed in the nip portion or the like.

In the above embodiment, the example was shown in which the cool air supply unit 7 is configured to be movable in the Z direction together with the annular member 91 by a cylinder (not shown), but the present invention is not limited to this. In the present invention, the cool air supply unit may be disposed in a fixed place without moving.

In the above-described embodiment, for convenience of explanation, an example was described in which a flow-driven flowchart in which the processing is sequentially performed in accordance with the processing flow is used for the control processing of the second control unit 13 (control unit), but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven (event-driven type) processing in which processing is executed in units of events. In this case, the operation may be performed in a complete event-driven type, or may be performed by combining event-driven and flow-driven types.

Description of the reference numerals

6. An expansion section;

7. A cool air supply unit;

8. A cooling unit;

13a second control section (control section);

63. A clamping part;

63a lower grip;

63b upper grip;

71a cold air supply port;

72. A temperature sensor;

81. a cooling member;

81b peltier element;

91 a ring-shaped member (fixing member);

100. an expansion device;

120. a concave portion;

120a inner side;

120b bottom surface;

200. a wafer ring structure;

210. A wafer;

220. A sheet member;

220a upper surface;

230. An annular member;

230b inner side;

263a first sliding moving body (sliding moving body);

263b a second sliding moving body (sliding moving body);

263c a third sliding moving body (sliding moving body);

263d fourth sliding moving body (sliding moving body);

263e inner side;

F (depth of recess);

L (length of the fixing member).

Claims

1. An expansion device is provided with:

a wafer ring structure including a wafer that can be divided along a dividing line, a sheet member that is attached to the wafer and has stretchability, and an annular ring member that is attached to the sheet member in a state of surrounding the wafer;

an expanding section including a clamping section for clamping the annular member, wherein the wafer is divided along the dividing line by expanding the sheet member in a state where the annular member is clamped by the clamping section; and

A cool air supply unit configured to supply cool air to the sheet member when the sheet member is expanded by the expansion unit,

The cool air supply unit is configured to supply cool air to a recess surrounded by the clamping unit and the wafer ring structure in a state in which the annular member is held by the clamping unit and a space above the clamping unit is not sealed and is opened, thereby accumulating cool air in the recess.

2. The expansion device of claim 1, wherein,

The recess includes:

an inner side surface of the clamping portion and an inner side surface of the annular member; and

The bottom surface is formed by the upper surface of the sheet member.

3. The expansion device according to claim 1 or 2, wherein,

The cool air supply unit includes a cool air supply port that is disposed above the wafer in a state where the annular member is held by the holding unit, and supplies cool air from above toward below.

4. The expansion device according to claim 1 to 3, wherein,

The cold air supply part is configured to be movable in the up-down direction,

The cold air supply unit is configured to supply cold air to the concave portion in a state of being moved in a downward direction and being disposed at a position within the concave portion.

5. The expansion device of claim 4, wherein,

The expansion device further comprises a fixing member for fixing the cold air supply unit,

In the up-down direction, the depth of the recess is greater than the length of the fixing member.

6. The expansion device of any of claims 1 to 5, wherein,

The expanding device further comprises a cooling unit capable of cooling the sheet member from below in a state where the annular member is held by the holding portion,

The cooling unit includes a cooling member having a peltier element and being in contact with the sheet member from below in a state of being cooled by the peltier element.

7. The expansion device of claim 6, wherein,

The expansion device further includes a control unit that performs control of both cooling by the cool air supply unit that stores cool air in the concave portion and cools the sheet member from above and cooling by the cooling unit that cools the sheet member from below.

8. The expansion device of any of claims 1 to 7, wherein,

The clamping part includes:

a lower grip portion for supporting the annular member from below; and

An upper holding portion that forms a portion of an inner surface of the recess that is located above the annular member, and presses the annular member from above.

9. The expansion device of claim 8, wherein,

The upper grip portion has a plurality of sliding movement bodies that are slidable in a horizontal direction in an inner direction of the wafer side and in an outer direction of a side opposite to the wafer side.