CN117976799A - Packaging method for improving light emitting efficiency of LED packaging device - Google Patents
Packaging method for improving light emitting efficiency of LED packaging device Download PDFInfo
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- CN117976799A CN117976799A CN202410363557.5A CN202410363557A CN117976799A CN 117976799 A CN117976799 A CN 117976799A CN 202410363557 A CN202410363557 A CN 202410363557A CN 117976799 A CN117976799 A CN 117976799A
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- chip
- light
- emitting efficiency
- connecting piece
- silver colloid
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052709 silver Inorganic materials 0.000 claims abstract description 51
- 239000004332 silver Substances 0.000 claims abstract description 51
- 239000000084 colloidal system Substances 0.000 claims abstract description 49
- 238000005498 polishing Methods 0.000 claims abstract description 45
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000000227 grinding Methods 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 6
- 239000011324 bead Substances 0.000 abstract description 11
- 230000000903 blocking effect Effects 0.000 abstract 2
- 238000012536 packaging technology Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The application discloses a packaging method for improving the light emitting efficiency of an LED packaging device, which comprises the following steps: providing a support, wherein a bonding pad for connecting a chip is arranged on the support; fixedly connecting a chip to a bonding pad, and injecting silver colloid to the side of the chip; polishing the silver colloid to make the highest point of the silver colloid lower than the upper surface of the chip; and arranging a lens outside the bracket and connecting the lens with the bracket. According to the application, the existing LED glue filling packaging technology is changed into a structure of a cavity in the lens, so that the situation of poor light emitting efficiency caused by blocking of light rays of LED lamp beads by glue filled in a bowl cup is avoided; meanwhile, the silver colloid of the fixed chip is polished, so that the silver colloid is prevented from blocking light, and the light-emitting efficiency is further improved; and the side wall of the bowl-shaped groove in the bracket is a reflecting wall, so that light rays are totally reflected, and the light emitting efficiency is increased again.
Description
Technical Field
The invention relates to the technical field of optical LED preparation, in particular to a packaging method for improving the light emitting efficiency of an LED packaging device.
Background
When the LED lamp beads in the prior art are used for packaging chips, most of the LED lamp beads are filled with colloid in the bowl cup, and then the chips are packaged in a mould pressing mode, so that the LED lamp beads designed in the mode are poor in light emitting efficiency due to the fact that light rays are blocked by the colloid filled in the bowl cup.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a packaging method for improving the light emitting efficiency of an LED packaging device, and solves at least one problem in the background art.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
a packaging method for improving light emitting efficiency of an LED packaging device comprises the following steps:
providing a support, wherein a bonding pad for connecting a chip is arranged on the support;
Fixedly connecting a chip to a bonding pad, and injecting silver colloid to the side of the chip;
Polishing the silver colloid to make the highest point of the silver colloid lower than the upper surface of the chip;
and arranging a lens outside the bracket and connecting the lens with the bracket.
Preferably, a groove with a bowl-shaped structure is arranged in the bracket, the side wall of the groove is a reflecting wall, and the reflecting wall is used for reflecting light rays emitted by the chip.
Preferably, a light-gathering body is arranged on the outer side of the chip, and the light-gathering body wraps the chip and the silver colloid;
The light collector is hemispherical.
Preferably, the lens is bonded to the support;
a cavity is formed between the lens and the support.
Preferably, the polishing assembly is used when polishing the silver colloid, the polishing assembly comprises a polishing cover, the polishing cover is semi-surrounding, a polishing head is arranged in the polishing cover and is rotationally connected with the polishing cover, and the polishing head is connected with the polishing cover through a bottom fixing head.
Preferably, the polishing head comprises a grinding disc, the grinding disc is fixedly connected with the connecting sheet through a fixing block, and one end of the connecting sheet, which is far away from the grinding disc, is fixedly connected with the elastic sheet;
The elastic sheet is provided with a plurality of connecting ends connected with the connecting sheet, and the connecting ends are connected to one point;
The whole connecting ends are cone-shaped;
and a plurality of connecting ends are connected with each other, and the connecting ends are provided with connectors for connecting with a driving assembly.
Preferably, the driving assembly comprises a connecting shaft, the connecting shaft is fixedly connected with the connector, the connector is fixedly connected with the second connecting piece, the first connecting piece is sleeved outside the second connecting piece, the first connecting piece is connected in the connecting cover, and the connecting cover is fixedly connected with the driving shaft.
Preferably, a plurality of balls are arranged between the first connecting piece and the second connecting piece, a plurality of grooves which are matched with the balls are arranged between the first connecting piece and the second connecting piece, and the balls are connected in the grooves in a rolling way;
a plurality of balls are arranged between the connecting cover and the first connecting piece, a plurality of grooves matched with the balls are arranged between the connecting cover and the first connecting piece, and the balls are in rolling connection in the grooves.
Preferably, the outer edge of the connecting cover is provided with a fixing sleeve, the diameter of the fixing sleeve is smaller than that of the first connecting piece, and the fixing sleeve is fixedly connected with the connecting cover through a fixing piece.
Preferably, an adjusting cavity is arranged in the driving shaft and is communicated with the position where the first connecting piece is connected;
The adjusting device comprises an adjusting cavity, and is characterized in that a spring is arranged in the adjusting cavity, one end of the spring is fixedly connected in the adjusting cavity, the other end of the spring is abutted to an adjusting ball, the adjusting ball is fixedly connected with one end of an adjusting rod, the other end of the adjusting rod is fixedly connected with a connecting ball head, the connecting ball head is rotationally connected with a second connecting piece, a rotating ball head is arranged in the middle section of the adjusting rod, and the rotating ball head is rotationally connected with a first connecting piece.
Preferably, the dispensing assembly is used when silver colloid is injected into the side of the chip, the dispensing assembly comprises a dispensing tube, a dispensing opening is formed in the lower end of the dispensing tube, a back plate is arranged in the dispensing tube, a rotating shaft is arranged on the back plate, a side plate is connected onto the rotating shaft in a rotating mode, a plurality of holes for circulating silver colloid are formed in the side plate, a top plate is connected onto the upper end of the side plate in a sliding mode, and the top plate is connected onto the back plate in a sliding mode;
the upper plate is fixedly connected with a limiting plate, a reset spring is arranged between the limiting plate and the side plate, and two ends of the reset spring are respectively and fixedly connected with the limiting plate and the side plate.
Compared with the prior art, the invention at least comprises the following beneficial effects:
In the traditional process for encapsulating the LED chip by glue filling, the light emitted by the LED chip is blocked to a certain extent by the glue filled in the outer layer of the LED chip, so that the light emitting efficiency is reduced;
Meanwhile, the silver colloid for fixing the chip is polished, so that the height of the silver colloid is lower than that of the chip, light rays emitted from the upper side of the chip cannot be blocked by the silver colloid, and the light rays emitted from the upper side of the chip are all dispersed, so that the light emitting efficiency is further improved;
And the side wall of the bowl-shaped groove in the bracket is a reflecting wall, when the light emitted by the upper side of the chip irradiates the reflecting wall, the reflecting wall reflects the light emitted by the chip, and the propagation route of the light is changed, so that the light is emitted towards the upper side of the chip, the light scattering is avoided, the light emitting efficiency is increased again, and the brightness of the LED lamp bead is increased.
Drawings
FIG. 1 is a schematic diagram of a device structure for manufacturing the present invention;
FIG. 2 is a schematic view of a sanding assembly of the present invention;
FIG. 3 is a schematic view of a polishing head according to the present invention;
FIG. 4 is a schematic diagram of a driving assembly according to the present invention;
FIG. 5 is a schematic cross-sectional view of a drive assembly of the present invention;
fig. 6 is a schematic cross-sectional view of the dispensing assembly of the present invention.
In the figure: 1. a bonding pad; 2. a bracket; 3. a lens; 4. a cavity; 5. a reflective wall; 6. a light-gathering body; 7. a chip; 8. silver colloid; 9. polishing the cover; 10. a bottom fixing head; 11. polishing head; 12. grinding; 13. a fixed block; 14. a connecting sheet; 15. an elastic sheet; 16. a connection cover; 17. a connector; 18. a connecting shaft; 19. a drive shaft; 20. a first connector; 21. a second connector; 22. a spring; 23. an adjusting ball; 24. an adjusting rod; 25. adjusting the cavity; 26. rotating the ball head; 27. connecting a ball head; 28. a fixing member; 29. a fixed sleeve; 30. a ball; 31. dispensing a rubber tube; 32. dispensing opening; 33. a back plate; 34. a side plate; 35. a rotating shaft; 36. a limiting plate; 37. a return spring; 38. and a top plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Example 1
Referring to fig. 1, the present invention provides a technical solution: a packaging method for improving light emitting efficiency of an LED packaging device comprises the following steps:
providing a support 2, wherein a bonding pad 1 for connecting a chip 7 is arranged on the support 2;
Fixedly connecting a chip 7 to the bonding pad 1, and injecting silver colloid 8 to the side of the chip 7;
Polishing the silver colloid 8 to enable the highest point of the silver colloid 8 to be lower than the upper surface of the chip 7;
a lens 3 is provided outside the holder 2, and the lens 3 is connected to the holder 2.
Preferably, a groove with a bowl-shaped structure is arranged in the bracket 2, the side wall of the groove is a reflecting wall 5, and the reflecting wall 5 is used for reflecting light rays emitted by the chip 7.
Preferably, a light collector 6 is arranged outside the chip 7, and the light collector 6 wraps the chip 7 and the silver colloid 8;
The light collector 6 is hemispherical.
Preferably, the lens 3 is bonded to the holder 2;
A cavity 4 is formed between the lens 3 and the holder 2.
The working principle of the scheme has the beneficial effects that:
In the traditional process for encapsulating the LED chip by glue filling, the light emitted by the LED chip is blocked to a certain extent by the glue filled in the outer layer of the LED chip, so that the light emitting efficiency is reduced;
Meanwhile, the silver colloid 8 of the fixed chip 7 is polished, so that the height of the silver colloid 8 is lower than that of the chip 7, light rays emitted from the upper side of the chip 7 cannot be blocked by the silver colloid 8, and the light rays emitted from the upper side of the chip 7 are totally dispersed, so that the light emitting efficiency is further improved;
and the side wall of the bowl-shaped groove in the bracket 2 is the reflecting wall 5, when the light rays emitted by the upper side of the chip 7 irradiate onto the reflecting wall 5, the reflecting wall 5 reflects the light emitted by the chip 7, and the propagation route of the light rays is changed, so that the light rays are emitted towards the upper side of the chip 7, the light rays are prevented from scattering, the light emitting efficiency is increased again, and the brightness of the LED lamp beads is increased.
Example 2
Referring to fig. 2-3, based on embodiment 1, a polishing assembly is used when polishing the silver paste 8, the polishing assembly includes a polishing cover 9, the polishing cover 9 is semi-enclosed, a polishing head 11 is disposed in the polishing cover 9, the polishing head 11 is rotatably connected to the polishing cover 9, and the polishing head 11 is connected to the polishing cover 9 through a bottom fixing head 10.
Preferably, the polishing head 11 comprises a grinding disc 12, the grinding disc 12 is fixedly connected with a connecting sheet 14 through a fixing block 13, and one end of the connecting sheet 14 away from the grinding disc 12 is fixedly connected with an elastic sheet 15;
The elastic sheet 15 is provided with a plurality of connecting ends connected with the connecting sheet 14, and the connecting ends are connected to one point;
The whole connecting ends are cone-shaped;
a plurality of connecting ends are connected with each other, and connectors 17 are arranged at the connecting positions of the connecting ends, and the connectors 17 are used for connecting with a driving assembly.
The working principle of the scheme has the beneficial effects that:
When the chip 7 is fixed by the silver colloid 8, the chip 7 is not firmly fixed due to too little silver colloid, the service life of the LED lamp beads is influenced, when the usage amount of the silver colloid 8 is too large, the light emission of the LED lamp beads is blocked, the luminous efficiency of the LED lamp beads is influenced, the chip 7 is firstly fixed by more silver colloid 8, then the excessive silver colloid 8 is polished, the part of the silver colloid 8 higher than the chip 7 is polished, the height of the silver colloid 8 is lower than the height of the chip 7, the light emitted by the upper side of the chip 7 is not blocked by the silver colloid 8, and the light emitted by the upper side of the chip 7 is totally dispersed, so that the luminous efficiency of the LED lamp beads is improved;
When polishing, cover 9 contact chip 7 polishes, cover 9 is used for protecting chip 7 polishes, avoid chip 7 impaired, the head 11 rotates polishes to the silver colloid 8 that is higher than chip 7 part, because this moment silver colloid 8 is higher than chip 7, cover 9 contact chip 7's the circumstances in cover 9 is polished to the top that polishes, can cause the unbalance of polishing head 11, set up elastic sheet 15, make the part that the abrasive disc 12 that is located outside cover 9 connects deform, and be located the part that polishes cover 9 and undeformed, be located the part that the abrasive disc 12 that silver colloid 8 top contacted is deformed with silver colloid 15, and be located the part that abrasive disc 12 that polishes cover 9 connects does not deform, because the deformation of elastic sheet 15 makes at silver colloid 8 and cover 9 internal surface together the uneven surface abrasive disc 12 that causes also can contact with silver colloid 8 upper surface all the time, and give up a lower pressure to silver colloid 8 upper surface, guaranteed the roughness that polishes cover 9's setting also can cause the LED to the uneven phenomenon that LED lamp bead can appear to the LED to the fact the LED to the uneven phenomenon when polishing to the high LED that the chip 7 that the top that the abrasive disc 12 contacts is guaranteed to polish.
Example 3
Referring to fig. 4-5, in the embodiment 1-2, the driving assembly includes a connecting shaft 18, the connecting shaft 18 is fixedly connected with a connecting head 17, the connecting head 17 is fixedly connected with a second connecting member 21, a first connecting member 20 is sleeved outside the second connecting member 21, the first connecting member 20 is connected in a connecting cover 16, and the connecting cover 16 is fixedly connected with a driving shaft 19.
Preferably, a plurality of balls 30 are disposed between the first connecting member 20 and the second connecting member 21, and a plurality of grooves corresponding to the balls 30 are disposed between the first connecting member 20 and the second connecting member 21, and the balls 30 are in rolling connection with the grooves;
a plurality of balls 30 are arranged between the connecting cover 16 and the first connecting piece 20, a plurality of grooves matched with the balls 30 are arranged between the connecting cover 16 and the first connecting piece 20, and the balls 30 are connected in the grooves in a rolling mode.
Preferably, the outer edge of the connecting cover 16 is provided with a fixing sleeve 29, the diameter of the fixing sleeve 29 is smaller than that of the first connecting piece 20, and the fixing sleeve 29 is fixedly connected with the connecting cover 16 through a fixing piece 28.
Preferably, an adjusting cavity 25 is disposed in the driving shaft 19, and the adjusting cavity 25 is communicated with the first connecting piece 20;
The adjusting device is characterized in that a spring 22 is arranged in the adjusting cavity 25, one end of the spring 22 is fixedly connected in the adjusting cavity 25, the other end of the spring 22 is abutted to an adjusting ball 23, the adjusting ball 23 is fixedly connected to one end of an adjusting rod 24, the other end of the adjusting rod 24 is fixedly connected with a connecting ball 27, the connecting ball 27 is rotationally connected to the second connecting piece 21, a rotating ball 26 is arranged in the middle section of the adjusting rod 24, and the rotating ball 26 is rotationally connected to the first connecting piece 20.
The working principle of the scheme has the beneficial effects that:
When polishing the part of the silver colloid 8 higher than the chip 7, the deformation of the elastic sheet 15 can cause the driving axle center of the connecting elastic sheet 15 to deviate, thereby influencing the transmission and causing uneven polishing;
The three-layer sleeving structure of the connecting cover 16, the first connecting piece 20 and the second connecting piece 21 is arranged, grooves which are matched with the balls 30 are arranged between the layers, and power is transmitted through the balls 30, so that when the axle center is deviated, the three-layer sleeving structure of the connecting cover 16, the first connecting piece 20 and the second connecting piece 21 rotates along with the axle center, and the transmission of power is not influenced under the condition that the axle connected on the elastic piece 15 is always vertical to the polishing cover 9, and the polishing evenness of the silver colloid 8 is ensured;
when the three layers of the connecting cover 16, the first connecting piece 20 and the second connecting piece 21 are rotated, the balls 30 between the three layers of the connecting cover 16, the first connecting piece 20 and the second connecting piece 21 roll, so that friction between two adjacent layers is reduced, and the rotating smoothness of the three layers of the connecting cover 16, the first connecting piece 20 and the second connecting piece 21 is ensured;
And the arrangement of the spring 22 and the adjusting rod 24 enables the connecting cover 16, the first connecting piece 20 and the second connecting piece 21 to be always in abutting connection, so that stable running of power transmission is ensured.
Example 4
Referring to fig. 6, on the basis of embodiments 1-3, a dispensing assembly is used when injecting silver paste 8 into the side of the chip 7, the dispensing assembly includes a dispensing tube 31, a dispensing opening 32 is provided at the lower end of the dispensing tube 31, a back plate 33 is provided in the dispensing tube 31, a rotating shaft 35 is provided on the back plate 33, a side plate 34 is rotatably connected to the rotating shaft 35, a plurality of holes for circulating silver paste are provided on the side plate 34, a top plate 38 is slidably connected to the upper end of the side plate 34, and the top plate 38 is slidably connected to the back plate 33;
the top plate 38 is fixedly connected with a limiting plate 36, a return spring 37 is arranged between the limiting plate 36 and the side plate 34, and two ends of the return spring 37 are respectively and fixedly connected with the limiting plate 36 and the side plate 34.
The working principle of the scheme has the beneficial effects that:
When dispensing, the dispensing amount of the dispensing opening 32 is changed according to the pressure in the dispensing tube 31, when the pressure in the dispensing tube 31 is increased, the pressure between the side plate 34 above the rotating shaft 35 and the dispensing tube 31 is increased, and the side plate 34 extrudes the reset spring 37 to rotate around the rotating shaft 35 due to the fact that the amount of the silver adhesive flowing holes on the side plate 34 is unchanged, the opening at the lower end of the side plate 34 is increased, and then the dispensing amount is increased.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present invention; the terms "first," "second," "third," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The packaging method for improving the light emitting efficiency of the LED packaging device is characterized by comprising the following steps of:
comprising the following steps:
Providing a support (2), wherein a bonding pad (1) for connecting a chip (7) is arranged on the support (2);
Fixedly connecting a chip (7) to the bonding pad (1), and injecting silver colloid (8) to the side of the chip (7);
Polishing the silver colloid (8) to enable the highest point of the silver colloid (8) to be lower than the upper surface of the chip (7);
A lens (3) is arranged outside the bracket (2), and the lens (3) is connected with the bracket (2).
2. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 1, wherein the method comprises the steps of:
The light source is characterized in that a groove with a bowl-shaped structure is arranged in the support (2), the side wall of the groove is provided with a reflecting wall (5), and the reflecting wall (5) is used for reflecting light rays emitted by the chip (7).
3. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 1, wherein the method comprises the steps of:
A light-gathering body (6) is arranged outside the chip (7), and the chip (7) and the silver colloid (8) are wrapped by the light-gathering body (6);
The light collector (6) is hemispherical.
4. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 1, wherein the method comprises the steps of:
the lens (3) is adhered to the bracket (2);
a cavity (4) is formed between the lens (3) and the bracket (2).
5. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 1, wherein the method comprises the steps of:
Use polishing assembly when polishing silver colloid (8), polishing assembly is including polishing cover (9), polishing cover (9) are half surrounding form, be provided with in polishing cover (9) and polish head (11), polish head (11) rotate and connect in polishing cover (9), just polish head (11) and polish cover (9) and be connected through end fixed head (10).
6. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 5, wherein the packaging method comprises the following steps:
The polishing head (11) comprises a grinding disc (12), the grinding disc (12) is fixedly connected with the connecting sheet (14) through a fixing block (13), and one end, far away from the grinding disc (12), of the connecting sheet (14) is fixedly connected with the elastic sheet (15);
the elastic sheet (15) is provided with a plurality of connecting ends connected with the connecting sheet (14), and the connecting ends are connected to one point;
The whole connecting ends are cone-shaped;
a plurality of connecting ends are connected with each other, and connectors (17) are arranged at the connecting positions of the connecting ends, and the connectors (17) are used for connecting with a driving assembly.
7. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 6, wherein:
The driving assembly comprises a connecting shaft (18), the connecting shaft (18) is fixedly connected with a connecting head (17), the connecting head (17) is fixedly connected with a second connecting piece (21), a first connecting piece (20) is sleeved outside the second connecting piece (21), the first connecting piece (20) is connected in a connecting cover (16), and the connecting cover (16) is fixedly connected with a driving shaft (19).
8. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 7, wherein:
A plurality of balls (30) are arranged between the first connecting piece (20) and the second connecting piece (21), a plurality of grooves which are matched with the balls (30) are arranged between the first connecting piece (20) and the second connecting piece (21), and the balls (30) are connected in the grooves in a rolling way;
A plurality of balls (30) are arranged between the connecting cover (16) and the first connecting piece (20), a plurality of grooves which are matched with the balls (30) are arranged between the connecting cover (16) and the first connecting piece (20), and the balls (30) are connected in the grooves in a rolling way;
The outer edge of the connecting cover (16) is provided with a fixing sleeve (29), the diameter of the fixing sleeve (29) is smaller than that of the first connecting piece (20), and the fixing sleeve (29) is fixedly connected with the connecting cover (16) through a fixing piece (28).
9. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 8, wherein the method comprises the steps of:
An adjusting cavity (25) is arranged in the driving shaft (19), and the adjusting cavity (25) is communicated with the first connecting piece (20);
The novel adjustable ball adjusting device is characterized in that a spring (22) is arranged in the adjusting cavity (25), one end of the spring (22) is fixedly connected in the adjusting cavity (25), the other end of the spring (22) is abutted to an adjusting ball (23), the adjusting ball (23) is fixedly connected to one end of an adjusting rod (24), the other end of the adjusting rod (24) is fixedly connected with a connecting ball head (27), the connecting ball head (27) is rotationally connected to a second connecting piece (21), a rotating ball head (26) is arranged in the middle section of the adjusting rod (24), and the rotating ball head (26) is rotationally connected to a first connecting piece (20).
10. The packaging method for improving the light-emitting efficiency of the LED packaging device according to claim 1, wherein the method comprises the steps of:
Use the point to glue the subassembly when injecting into silver colloid (8) to chip (7) avris, the point glues the subassembly and includes some glue pipes (31), some glue pipes (31) lower extreme is provided with some glue mouths (32), be provided with backplate (33) in some glue pipes (31), be provided with pivot (35) on backplate (33), rotate on pivot (35) and be connected with curb plate (34), be provided with a plurality of holes that circulate silver colloid on curb plate (34), curb plate (34) upper end sliding connection has roof (38), roof (38) sliding connection is in backplate (33);
The upper plate (38) is fixedly connected with a limiting plate (36), a reset spring (37) is arranged between the limiting plate (36) and the side plate (34), and two ends of the reset spring (37) are respectively and fixedly connected with the limiting plate (36) and the side plate (34).
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| CN202410363557.5A CN117976799B (en) | 2024-03-28 | 2024-03-28 | Packaging method for improving light emitting efficiency of LED packaging device |
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