CN117970689A - Liquid crystal display device having a light shielding layer - Google Patents
Liquid crystal display device having a light shielding layer Download PDFInfo
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- CN117970689A CN117970689A CN202410233318.8A CN202410233318A CN117970689A CN 117970689 A CN117970689 A CN 117970689A CN 202410233318 A CN202410233318 A CN 202410233318A CN 117970689 A CN117970689 A CN 117970689A
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- film transistor
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 239000010409 thin film Substances 0.000 claims abstract description 64
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 238000005452 bending Methods 0.000 claims description 30
- 239000011324 bead Substances 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001270131 Agaricus moelleri Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
The application provides a liquid crystal display device, which comprises a backlight module, a display panel and a driving component, wherein the backlight module comprises a back plate, a supporting frame, an optical component and a light source, the supporting frame is arranged on one side of the back plate, the supporting frame and the back plate are enclosed to form a containing cavity, the optical component is arranged in the containing cavity, the light source component is also arranged in the containing cavity, the display panel comprises a counter substrate, a thin film transistor array substrate and a liquid crystal layer, the thin film transistor array substrate is positioned on one surface of the counter substrate far away from the backlight module, the center of the counter substrate points to the side direction of the counter substrate, a part of the thin film transistor array substrate protrudes out of the counter substrate, the liquid crystal layer is arranged between the counter substrate and the thin film transistor array substrate, the driving component is arranged on the supporting frame, and the driving component is positioned between the supporting frame and the part of the thin film transistor array substrate protruding out of the counter substrate. The application reduces the width of the frame of the liquid crystal display device.
Description
Technical Field
The application relates to the technical field of display, in particular to a liquid crystal display device.
Background
In the conventional lcd device, the driving assembly is generally disposed on the side of the display panel through the support frame of the backlight module, but the lcd device using the disposition method has a wider frame.
Therefore, a new solution is needed to solve the above-mentioned problems.
Disclosure of Invention
The application aims to provide a liquid crystal display device, which is used for reducing the frame width of the liquid crystal display device.
In order to solve the problems, the technical scheme of the application is as follows:
the present application proposes a liquid crystal display device including:
A backlight module;
The display panel is arranged on the backlight module; and
The driving assembly is arranged on the backlight module and is electrically connected with the display panel;
Wherein, backlight unit includes:
a back plate;
The support frame is arranged on one side of the backboard, and the support frame and the backboard enclose a containing cavity;
an optical component arranged in the accommodating cavity; and
The light source is arranged in the accommodating cavity;
wherein, the display panel includes:
An opposite substrate;
The thin film transistor array substrate is positioned on one surface of the opposite substrate far away from the backlight module, and part of the thin film transistor array substrate protrudes out of the opposite substrate along the direction that the center of the opposite substrate points to the side edge of the opposite substrate; and
A liquid crystal layer disposed between the counter substrate and the thin film transistor array substrate;
the driving assembly is arranged between the supporting frame and the part of the thin film transistor array substrate protruding out of the opposite substrate.
Optionally, in some embodiments of the application, the driving assembly includes:
the driving chip is arranged on one surface of the thin film transistor array substrate, which is close to the supporting frame;
The control circuit board is arranged between the supporting frame and the thin film transistor array substrate; and
The flexible circuit board comprises a first binding part, a second binding part and a bending part, wherein the two sides of the bending part are respectively connected with the first binding part and the second binding part, the first binding part is electrically connected with the thin film transistor array substrate, the second binding part is electrically connected with the control circuit board, the control circuit board is far away from one side of the thin film transistor array substrate, and the bending part is bent at one side of the control circuit board.
Optionally, in some embodiments of the present application, a first groove is disposed on a surface of the control circuit board, which is close to the thin film transistor array substrate, and the driving chip is accommodated in the first groove.
Optionally, in some embodiments of the present application, a second groove is disposed on a surface of the control circuit board away from the tft array substrate, and elements of the control circuit board are disposed in the second groove.
Optionally, in some embodiments of the present application, a first groove is formed on a surface of the control circuit board, which is close to the thin film transistor array substrate, the driving chip is accommodated in the first groove, a second groove is formed on a surface of the control circuit board, which is far away from the thin film transistor array substrate, elements of the control circuit board are disposed in the second groove, and an orthographic projection of the first groove on a plane of the back plate is located outside an orthographic projection of the second groove on the plane of the back plate.
Optionally, in some embodiments of the present application, the driving chip is located on a side of the control circuit board close to a side of the opposite substrate.
Optionally, in some embodiments of the present application, the flexible circuit board is bent at a side of the control circuit board away from the opposite substrate, and at least a portion of an orthographic projection of the bending portion on a plane of the back plate is located outside an orthographic projection of the thin film transistor array substrate on the plane of the back plate.
Optionally, in some embodiments of the present application, a portion of the orthographic projection of the control circuit board on the plane of the back plate is located outside the orthographic projection of the thin film transistor array substrate on the plane of the back plate.
Optionally, in some embodiments of the present application, an outer edge of the orthographic projection of the support frame on the plane of the back plate is located outside an outer edge of the orthographic projection of the bending portion on the plane of the back plate.
Optionally, in some embodiments of the present application, a connection surface between the first binding portion and the thin film transistor array substrate is parallel to a connection surface between the second binding portion and the control circuit board.
In the application, the thin film transistor array substrate is arranged on one surface of the opposite substrate far away from the backlight module, so that the display panel is in an inverted state that the thin film transistor array substrate is positioned on the light emitting surface of the liquid crystal layer and the opposite substrate is positioned on the light entering surface of the liquid crystal layer.
Drawings
FIG. 1 is a schematic diagram of a conventional liquid crystal display device;
fig. 2 is a schematic view of a liquid crystal display device according to a first embodiment of the present application;
Fig. 3 to 6 are schematic diagrams illustrating steps one to five of the assembling method of the liquid crystal display device shown in fig. 2;
fig. 7 is a schematic view of a liquid crystal display device according to a second embodiment of the present application;
Fig. 8 is a schematic view of a liquid crystal display device according to a third embodiment of the present application.
Reference numerals:
100. A backlight module; 110. a back plate; 120. a support frame; 130. an optical component; 131. a reflective layer; 132. a light guide plate; 133. an optical film; 140. a light source; 141. LED lamp beads; 142. a lamp bead circuit board;
200. A display panel; 210. an opposite substrate; 220. a thin film transistor array substrate; 230. a liquid crystal layer;
300. A drive assembly; 310. a driving chip; 320. a control circuit board; 321. a first groove; 322. a second groove;
330. a flexible circuit board; 331. a first binding portion; 332. a second binding portion; 333. a bending part; 400. and (5) fixing glue.
Detailed Description
The terms used in the specification and claims have meanings corresponding to meanings commonly understood by those of ordinary skill in the art to which the present application pertains.
The various embodiments of the application are similar and the different embodiments may be combined with each other.
The application provides a liquid crystal display device which can be used for televisions, mobile phone desktop computer display screens, notebook computers and the like.
As shown in fig. 2 to 8, the liquid crystal display device of the present application includes a backlight module 100, a display panel 200 and a driving assembly 300, wherein the display panel 200 is disposed on the backlight module 100 for displaying display frames composed of different colors and gray scales according to driving signals, the backlight module 100 is used for providing the display panel 200 with a light source 140, the driving assembly 300 is disposed on the backlight module 100, and the driving assembly 300 is electrically connected with the display panel 200 for driving the display panel 200 to display different frames according to the driving signals.
The backlight module 100 of the present application includes a back plate 110, a supporting frame 120, an optical assembly 130 and a light source 140, wherein the supporting frame 120 is disposed on one side of the back plate 110, the supporting frame 120 and the back plate 110 enclose a receiving cavity, the optical assembly 130 is disposed in the receiving cavity, the light source 140 is also disposed in the receiving cavity, and when the light source 140 is on, the light generated by the light source 140 is emitted to the display panel 200 under the light guiding and/or reflecting effects of the optical assembly 130, so as to provide the light beam for the display panel 200.
The display panel 200 of the present application includes a counter substrate 210, a thin film transistor array substrate 220, and a liquid crystal layer 230.
The thin film transistor array substrate 220 is disposed on a surface of the opposite substrate 210 away from the backlight module 100, and a portion of the thin film transistor array substrate 220 protrudes from the opposite substrate 210 along a direction in which a center of the opposite substrate 210 is directed to a side of the opposite substrate 210.
The liquid crystal layer 230 is disposed between the opposite substrate 210 and the thin film transistor array substrate 220. The liquid crystal layer 230 includes liquid crystal molecules, which change an arrangement order under an electric field to control a transmission efficiency of light through the liquid crystal layer 230. The thin film transistor array substrate 220 of the present application is located on the light-emitting surface of the liquid crystal layer 230, and the opposite substrate 210 is located on the light-entering surface of the liquid crystal layer 230.
The driving assembly 300 of the present application is disposed between the supporting frame 120 and a portion of the tft array substrate 220 protruding from the opposite substrate 210.
In the application, the thin film transistor array substrate 220 is arranged on one surface of the opposite substrate 210 far away from the backlight module 100, so that the display panel 200 is in an inverted state that the thin film transistor array substrate 220 is positioned on the light emergent surface of the liquid crystal layer 230 and the opposite substrate 210 is positioned on the light incident surface of the liquid crystal layer 230, and because the thin film transistor array substrate 220 is protruded relative to the side edge of the opposite substrate 210, a gap is reserved between the thin film transistor array substrate 220 and the supporting frame 120 of the inverted display panel, the driving component 300 is arranged in the gap between the supporting frame and the thin film transistor array substrate 220, and at least one part of the thin film transistor array substrate 220 and the driving component 300 of the display panel is overlapped, therefore, the space occupied by the driving component 300 on the side of the display panel 200 is reduced, the frame of the liquid crystal display device is narrowed, the influence of the driving component 300 on the thickness of the liquid crystal display device is reduced when the driving component 300 is arranged between the supporting frame 120 and the thin film transistor array substrate 220, the risk that the thin film transistor array substrate 300 is damaged can be further reduced, and the driving component 300 can be stably transmitted between the driving component 300 and the supporting frame and the thin film transistor array substrate 220 is also reduced, and the risk that the driving component 300 can be stably arranged between the driving component and the thin film transistor array substrate 220 is reduced, and the risk of the driving component is reduced, and the risk that the driving component is reduced.
As shown in fig. 1, in the prior art, the driving assembly 300 is generally disposed at a side of the display panel 200 through a supporting frame of the backlight module 100, and the width of the side frame of the lcd device is wider, as shown in fig. 2, 7 and 8, and the width of the side frame of the lcd device is narrower.
As shown in fig. 2 to 6, in the first embodiment of the present application, the driving assembly 300 includes a driving chip 310, a control circuit board 320, and a flexible circuit board 330.
The driving chip 310 is disposed on a surface of the tft array substrate 220 near the supporting frame 120.
The control circuit board 320 is disposed between the support frame 120 and the tft array substrate 220.
The flexible circuit board 330 includes a first binding portion 331, a second binding portion 332 and a bending portion 333, two sides of the bending portion 333 are respectively connected with the first binding portion 331 and the second binding portion 332, the first binding portion 331 is electrically connected with the thin film transistor array substrate 220, the second binding portion 332 is electrically connected with the control circuit board 320 far away from one side of the thin film transistor array substrate 220, and the bending portion 333 bends at one side of the control circuit board 320.
In this embodiment, the control circuit board 320 is electrically connected to the tft array substrate 220 through the flexible circuit board 330, the control circuit board 320 is disposed between the support board and the portion of the tft array substrate 220 protruding from the opposite substrate 210, so that at least a portion of the control circuit board 320 is in a folded state at one side of the control circuit board 320, the front projection of the control circuit board 320 on the plane of the back plate 110 overlaps with the front projection of the tft array substrate 220 on the plane of the back plate 110, the space occupied by the control circuit board 320 at the side of the lcd device is reduced, thereby narrowing the frame of the lcd device, the first binding portion 331 and the second binding portion 332 are disposed on the flexible circuit board 330, the second binding portion 332 is connected to the tft array substrate 220, and the bending portion 333 is bent at one side of the control circuit board 320, so that the bending portion 333 is in a folded state, the planar space occupied by the length of the flexible circuit board 330 is shortened, the frame of the lcd device is reduced, the control circuit board 320 is located between the first binding portion 331 and the second binding portion 332, and the bending space of at least one control circuit board 320 is provided for bending the control circuit board 320, and the thickness of the flexible circuit board 320 is reduced, and the damage is reduced.
In this embodiment, the light source 140 is an LED light bar, and the LED light bar includes an LED light bead 141 and a light bead circuit board 142 connected with the LED light bead 141.
In this embodiment, the optical assembly 130 includes a light guide plate 132 and a reflective layer 131. The reflective layer 131 is located between the light guide plate 132 and the back plate 110.
In this embodiment, the optical assembly 130 further includes an optical film 133, where the optical film 133 is disposed on the light guide plate 132, and the optical film 133 includes a diffusion film and/or a brightness enhancement film.
In this embodiment, a first groove 321 is disposed on a surface of the control circuit board 320 near the tft array substrate 220, and the driving chip 310 is accommodated in the first groove 321.
In this embodiment, the front projection of the driving chip 310 on the plane of the back plate 110 is located in the front projection of the control circuit board 320 on the plane of the back plate 110, and the first groove 321 is disposed on the control circuit board 320, so that the control circuit board 320 forms a space for avoiding the driving chip 310, which avoids the thickness increase of the liquid crystal display device caused by direct overlapping of the driving chip 310 and the control circuit board 320, and the first groove 321 for avoiding the driving chip 310 is disposed on the control circuit board 320, so that the thickness of the liquid crystal display device is not required to be additionally increased when the control circuit board 320 is disposed between the support frame 120 and the thin film transistor array substrate 220. The first groove 321 is used for accommodating the driving chip 310, and the control circuit board 320 can also protect the driving chip 310, so as to avoid damage caused by extrusion of the driving chip 310.
In this embodiment, the depth of the first groove 321 is greater than or equal to 1mm. Specifically, the depth of the first groove 321 is 1.5mm.
In this embodiment, a second groove 322 is disposed on a surface of the control circuit board 320 away from the tft array substrate 220, and the components of the control circuit board 320 are disposed in the second groove 322.
In this embodiment, the second groove 322 is disposed on the surface of the control circuit board 320 far away from the tft array substrate 220, so that the components of the control circuit board 320 can be accommodated in the second groove 322, and the overall thickness of the control circuit board 320 after the components are disposed is further reduced, which is beneficial to the thinning of the liquid crystal display device, and the components of the control circuit board 320 are disposed in the second groove 322, so that the components can be prevented from being damaged due to extrusion.
In this embodiment, the depth of the second groove 322 is greater than or equal to 1mm. Specifically, the depth of the second groove 322 is greater than or equal to 1.2mm. In this embodiment, the depth of the second groove 322 is 1.5mm.
In this embodiment, the front projection of the first groove 321 on the plane of the back plate 110 is located in the front projection of the second groove 322 on the plane of the back plate 110, so as to reduce the width between the two sides of the control circuit board 320, which is beneficial to the frame narrowing of the liquid crystal display device.
Or as shown in fig. 7, in the second embodiment of the present application, the front projection of the first groove 321 on the plane of the back plate 110 is located outside the front projection of the second groove 322 on the plane of the back plate 110, so that the first groove 321 and the second groove 322 are staggered, and the thickness of the control circuit board 320 is smaller, which is beneficial to the thickness reduction of the liquid crystal display device.
Or the control circuit board 320 is provided with only the first groove 321 and not the second groove 322.
Or the control circuit board 320 is provided with only the second groove 322 and the first groove 321 is not provided.
In the present embodiment, the flexible circuit board 330 is bent at a side of the control circuit board 320 away from the opposite substrate 210, and at least a portion of the orthographic projection of the bending portion 333 on the plane of the back plate 110 is located outside the orthographic projection of the thin film transistor array substrate 220 on the plane of the back plate 110.
Specifically, the bending portion 333 of the flexible circuit board 330 protrudes from the tft array substrate 220 in a direction away from the opposite substrate 210, so that the upper portion of the protruding portion of the bending portion 333 of the flexible circuit board 330 is not limited by the tft array substrate 220, the curvature change of the bending portion 333 is more gentle, the bending portion 333 can form an arc-shaped bending, and the flexible circuit board 330 is prevented from being damaged.
In this embodiment, a portion of the orthographic projection of the control circuit board 320 on the plane of the back plate 110 is located outside the orthographic projection of the thin film transistor array substrate 220 on the plane of the back plate 110.
In this embodiment, the control circuit board 320 abuts against one surface of the first binding portion 331 away from the tft array substrate 220, the flexible circuit board 330 is bent at a side of the control circuit board 320 away from the opposite substrate 210, a side of the control circuit board 320 away from the opposite substrate 210 protrudes out of the side of the tft array substrate 220, the portion of the control circuit board 320 protruding out of the tft array substrate 220 supports the flexible circuit board 330 protruding out of the tft array substrate 220, and the bending portion 333 of the flexible circuit board 330 is prevented from being deformed by extrusion along a direction perpendicular to the plane where the back plate 110 is located, so that the flexible circuit board 330 and the tft array substrate 220 are bound together to be broken or separated, and the flexible circuit board 330 is prevented from being folded in half to be broken, thereby improving the stability of the liquid crystal display device.
In this embodiment, a gap is formed between the control circuit board 320 and the supporting frame 120, the second binding portion 332 of the flexible circuit board 330 is located in the gap, and a fixing adhesive 400 is disposed in the gap, and the fixing adhesive 400 is used for fixing the control circuit board 320 on the supporting frame 120. In this embodiment, the fixing glue 400 is double-sided glue or other insulating glue.
In the present embodiment, the outer edge of the orthographic projection of the support frame 120 on the plane of the back plate 110 is located outside the outer edge of the orthographic projection of the bending portion 333 on the plane of the back plate 110.
Specifically, the side surface of the supporting frame 120 away from the opposite substrate 210 protrudes from the bending portion 333, so that the supporting frame 120 can reduce the probability that the bending portion 333 is pressed perpendicular to the side surface of the supporting frame 120 away from the opposite substrate 210, reduce the probability that the bending portion 333 is deformed by extrusion, and improve the binding and signal transmission stability of the flexible circuit board 330.
In this embodiment, the connection surface of the first binding portion 331 on the tft array substrate 220 is parallel to the connection surface of the second binding portion 332 and the control circuit board 320, i.e. the flexible circuit board 330 is bent at 180 ° to reduce the limitation of the length of the flexible circuit board 330 to the width of the frame of the lcd device to the greatest extent.
As shown in fig. 3 to 6, the liquid crystal display device of the present embodiment includes, in an assembling step:
Step one, as shown in fig. 3, a driving chip 310 and a first binding portion 331 of a flexible circuit board 330 are connected to a display panel 200, wherein a thin film transistor array substrate 220 of the display panel 200 is located below a liquid crystal layer 230 of the display panel 200, an opposite substrate 210 of the display panel 200 is located above the liquid crystal layer 230, and the driving chip 310 and the flexible circuit board 330 are connected to the thin film transistor array substrate 220;
step two, as shown in fig. 4, the control circuit board 320 is connected to a surface of the flexible circuit board 330, which is far away from the thin film transistor array substrate 220, where a second groove 322 is disposed on a surface of the control circuit board 320 connected to the second binding portion 332;
Step three, as shown in fig. 5, the display panel 200 and the control circuit board 320 are inverted, i.e. the display panel 200 and the control circuit board 320 are turned over by 180 ° so that the thin film transistor array substrate 220 is located above the liquid crystal layer 230 of the display panel 200 and the opposite substrate 210 is located below the liquid crystal layer 230;
Step four, as shown in fig. 6, bending the flexible circuit board 330 to turn the second binding portion 332 by 180 degrees, and reversely fastening the control circuit board 320 on the thin film transistor array substrate 220, wherein the surface of the control circuit board 320 connected with the second binding portion 332 is the surface of the control circuit board 320 far away from the thin film transistor array substrate 220;
Step five, fixing the control circuit board 320 and the tft array substrate 220 on the backlight module 100, wherein the control circuit board 320 is fixed on the support frame 120 of the backlight module 100, and the opposite substrate 210 is located on the optical component 130 of the backlight module 100.
Or the front projection of the flexible circuit board 330 on the plane of the back plate 110 is located in the front projection of the thin film transistor array substrate 220 on the plane of the back plate 110.
Specifically, the flexible circuit board 330 is completely shielded by the tft array substrate 220, so as to further reduce adverse effects of the flexible circuit board 330 on the frame width of the lcd device.
Or the bending portion 333 of the flexible circuit board 330 is bent at a side of the control circuit board 320 near the opposite substrate 210.
As shown in fig. 8, the third embodiment of the present application is similar to the first embodiment, and is different from the first embodiment in that in the third embodiment, the driving chip 310 is located on a side of the control circuit board 320 close to the side of the opposite substrate 210, that is, the driving chip 310 is not overlapped with the control circuit board 320, the driving chip 310 is located in a space between the control circuit board 320 and the opposite substrate 210, the control circuit board 320 may not be provided with the first groove 321, and further, an increase in thickness of the liquid crystal display device caused by a thickness superposition of the control circuit board 320 and the driving chip 310 may be avoided.
The foregoing describes in detail specific embodiments of the present application. The above-described embodiments of the present application are only preferred embodiments of the present application, and many variations and modifications may be made by those having ordinary skill in the art without departing from the spirit of the application. Such variations and modifications are intended to fall within the scope of the present application as defined in the appended claims.
Claims (10)
1. A liquid crystal display device, comprising:
A backlight module;
The display panel is arranged on the backlight module; and
The driving assembly is arranged on the backlight module and is electrically connected with the display panel;
Wherein, backlight unit includes:
a back plate;
The support frame is arranged on one side of the backboard, and the support frame and the backboard enclose a containing cavity;
an optical component arranged in the accommodating cavity; and
The light source is arranged in the accommodating cavity;
wherein, the display panel includes:
An opposite substrate;
The thin film transistor array substrate is positioned on one surface of the opposite substrate far away from the backlight module, and part of the thin film transistor array substrate protrudes out of the opposite substrate along the direction that the center of the opposite substrate points to the side edge of the opposite substrate; and
A liquid crystal layer disposed between the counter substrate and the thin film transistor array substrate;
the driving assembly is arranged between the supporting frame and the part of the thin film transistor array substrate protruding out of the opposite substrate.
2. The liquid crystal display device of claim 1, wherein the driving assembly comprises:
the driving chip is arranged on one surface of the thin film transistor array substrate, which is close to the supporting frame;
The control circuit board is arranged between the supporting frame and the thin film transistor array substrate; and
The flexible circuit board comprises a first binding part, a second binding part and a bending part, wherein the two sides of the bending part are respectively connected with the first binding part and the second binding part, the first binding part is electrically connected with the thin film transistor array substrate, the second binding part is electrically connected with the control circuit board, the control circuit board is far away from one side of the thin film transistor array substrate, and the bending part is bent at one side of the control circuit board.
3. The liquid crystal display device of claim 2, wherein a first groove is formed in a surface of the control circuit board adjacent to the thin film transistor array substrate, and the driving chip is accommodated in the first groove.
4. The liquid crystal display device of claim 2, wherein a second groove is formed on a surface of the control circuit board away from the thin film transistor array substrate, and the element of the control circuit board is disposed in the second groove.
5. The liquid crystal display device of claim 2, wherein a first groove is formed in a surface of the control circuit board, which is close to the thin film transistor array substrate, and the driving chip is accommodated in the first groove, a second groove is formed in a surface of the control circuit board, which is far away from the thin film transistor array substrate, and elements of the control circuit board are arranged in the second groove, and an orthographic projection of the first groove on a plane of the back plate is located outside an orthographic projection of the second groove on the plane of the back plate.
6. The liquid crystal display device of claim 2, wherein the driving chip is located at a side of the control circuit board near a side of the opposite substrate.
7. The liquid crystal display device as claimed in any one of claims 2 to 6, wherein the flexible circuit board is bent at a side of the control circuit board away from the opposite substrate, and at least a portion of an orthographic projection of the bent portion on a plane of the back plate is located outside an orthographic projection of the thin film transistor array substrate on the plane of the back plate.
8. The liquid crystal display device of any one of claims 2 to 6, wherein a portion of the orthographic projection of the control circuit board on the plane of the back plate is located outside the orthographic projection of the thin film transistor array substrate on the plane of the back plate.
9. The liquid crystal display device of any one of claims 2 to 6, wherein an outer edge of the orthographic projection of the supporting frame on the plane of the back plate is located outside an outer edge of the orthographic projection of the bending portion on the plane of the back plate.
10. The liquid crystal display device according to any one of claims 2 to 6, wherein a connection surface of the first binding portion and the thin film transistor array substrate is parallel to a connection surface of the second binding portion and the control circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410233318.8A CN117970689A (en) | 2024-02-29 | 2024-02-29 | Liquid crystal display device having a light shielding layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410233318.8A CN117970689A (en) | 2024-02-29 | 2024-02-29 | Liquid crystal display device having a light shielding layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117970689A true CN117970689A (en) | 2024-05-03 |
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ID=90864855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410233318.8A Pending CN117970689A (en) | 2024-02-29 | 2024-02-29 | Liquid crystal display device having a light shielding layer |
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| Country | Link |
|---|---|
| CN (1) | CN117970689A (en) |
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- 2024-02-29 CN CN202410233318.8A patent/CN117970689A/en active Pending
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