CN117968930A - Temperature drift correction system and method for MEMS heat conduction type vacuum sensor - Google Patents
Temperature drift correction system and method for MEMS heat conduction type vacuum sensor Download PDFInfo
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Abstract
The invention relates to the technical field of MEMS heat conduction type vacuum sensors, and particularly discloses a temperature drift correction system and a temperature drift correction method of an MEMS heat conduction type vacuum sensor. The temperature drift correction system of the MEMS heat conduction type vacuum sensor provided by the invention has the advantages of no additional temperature sensor, low cost, wide application range, simple structure and easiness in realization.
Description
Technical Field
The invention relates to the technical field of MEMS heat conduction type vacuum sensors, in particular to a temperature drift correction system and a test method of an MEMS heat conduction type vacuum sensor.
Background
MEMS heat conduction type vacuum sensors are widely used in the fields of electronic products, aerospace, chemical industry, material science, high-energy particle science and the like. The working principle is that power is applied to the heating element, so that the temperature of the sensitive area is changed, the changed temperature is influenced by the vacuum degree, and the temperature information is converted into an electric signal through the thermosensitive element to be output, so that the vacuum degree information is reflected. In practical applications, the measurement results are generally affected by the ambient temperature. The existing solutions mainly include three types: the first is to control the ambient temperature to be stable within a certain range during the measurement of the pressure; secondly, when the MEMS heat conduction type vacuum sensor is designed, a corresponding matching circuit is also designed, so that the sensor is in a constant temperature working mode, and the influence of temperature on a measurement result is reduced; and thirdly, measuring the environmental temperature by using a temperature sensor, and then estimating a U-P curve at the temperature by combining a calibration curve at a known temperature. For the first scheme, related equipment is needed for controlling the ambient temperature in the measuring process, so that material resources and manpower are consumed, and the measuring precision is low; in the second scheme, a matched circuit is needed to support, and the size of the finished device of the MEMS heat conduction type vacuum sensor is generally larger due to the existence of the circuit, so that the MEMS heat conduction type vacuum sensor has no advantage in specific application, such as measurement of air pressure in a narrow space. The third scheme is to measure the ambient temperature by using a temperature sensor, and then to realize temperature drift correction by using an algorithm.
Disclosure of Invention
The invention provides a temperature drift correction system and a test method of a MEMS heat conduction type vacuum sensor, which do not use an additional temperature sensor to realize temperature drift correction.
As a first aspect of the present invention, there is provided a temperature drift correction system of a MEMS thermal conduction type vacuum sensor, the temperature drift correction system of the MEMS thermal conduction type vacuum sensor includes a MEMS thermal conduction type vacuum sensor, an air pressure measurement module, a heating element resistance measurement module, a correction operation module, and a power supply module, the MEMS thermal conduction type vacuum sensor is connected to the air pressure measurement module and the heating element resistance measurement module through single pole double throw switches, the air pressure measurement module and the heating element resistance measurement module are both connected to the correction operation module, and the power supply module is connected to the MEMS thermal conduction type vacuum sensor, the air pressure measurement module, the heating element resistance measurement module, and the correction operation module, respectively, wherein the MEMS thermal conduction type vacuum sensor includes a sensitive area on which a thermal element and a heating element are placed, the thermal element is connected to the air pressure measurement module through single pole double throw switches, and the heating element is connected to the heating element resistance measurement module through single pole double throw switches.
Further, the heat-sensitive element and the heating element are two independent elements or the same element with both heat-sensitive function and heating function.
Further, the resistance of the resistor in the resistance measuring module of the heating element does not change with temperature, and the resistor is connected with the heating element in series.
Further, the microcontroller in the correction operation module forms a digital operation circuit, and a heating element resistance temperature drift formula and a temperature drift correction algorithm are implanted in the digital operation circuit.
As another aspect of the present invention, there is provided a temperature drift correction method of a MEMS thermal conduction vacuum sensor, which is applied to a temperature drift correction system of the MEMS thermal conduction vacuum sensor, the temperature drift correction method of the MEMS thermal conduction vacuum sensor comprising:
Step 1), testing in a variable temperature environment to obtain a relation equation of the resistance R of the heating element and the environment temperature T, namely a resistance temperature drift formula of the heating element: r=f (T); solidifying the resistance temperature drift formula of the heating element in the digital operation circuit;
Step 2), controlling a vacuum testing system under the environment temperature T 0 to enable the pressure of the vacuum cavity to reach any one value or multiple values within the range of 0Pa and 1Pa-1000Pa and 10 5 Pa respectively, and simultaneously respectively measuring the voltage of the corresponding thermosensitive element under each pressure to obtain a first relation equation of the voltage U and the air pressure P of the thermosensitive element: u=g 1(P,T0);
Step 3), changing the ambient temperature to be T 1, controlling a vacuum testing system to enable the vacuum cavity pressure to respectively reach any one value or multiple values within the range of 0Pa and 1Pa-1000Pa and 10 5 Pa, and simultaneously respectively measuring the voltages of the corresponding thermosensitive elements under each pressure to obtain a second relation equation of the voltage U and the air pressure P of the thermosensitive elements: u=g 2(P,T1);
Step 4), according to u=g 1(P,T0) and u=g 2(P,T1), obtaining a third equation of relation between voltage U and barometric pressure P of the thermal element at any ambient temperature T: u=g (P, T); for u=g (P, T) deformation, a temperature drift correction algorithm is obtained: p=h (U, T) and curing the temperature drift correction algorithm in the digital arithmetic circuit;
Step 5), placing the MEMS heat conduction type vacuum sensor in an atmosphere environment, stirring a single-pole double-throw switch to enable a heating element resistance measuring module to be connected with the MEMS heat conduction type vacuum sensor, measuring the resistance R 'of the heating element through the heating element resistance measuring module, and obtaining an environment temperature T' according to a heating element resistance temperature drift formula;
Step 6), placing the MEMS heat conduction type vacuum sensor in a vacuum environment to be measured, and toggling a single-pole double-throw switch to enable a gas pressure measurement module to be connected with the MEMS heat conduction type vacuum sensor, wherein the gas pressure measurement module is used for measuring the voltage U 'of the thermosensitive element at the ambient temperature T';
step 7), bringing the ambient temperature T ' obtained in step 5) and the temperature-sensitive element voltage U ' obtained in step 6) into the temperature drift correction algorithm to obtain a vacuum ambient pressure value P ' to be measured.
Further, the steps 1) to 4) are only required to be operated once, and the steps 5) to 7) are only required to be repeated every time the MEMS heat conduction type vacuum sensor is used later.
The temperature drift correction system of the MEMS heat conduction type vacuum sensor provided by the invention has the following advantages: the temperature measuring circuit has the advantages that no additional temperature sensor is used, only one resistor is used, the temperature measuring circuit is simple in structure, and meanwhile temperature drift correction of the MEMS heat conduction type vacuum sensor can be realized by combining a temperature drift correction algorithm.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention.
Fig. 1 is a schematic diagram of a temperature drift correction system of a MEMS thermal conduction vacuum sensor in accordance with an embodiment of the present invention.
Fig. 2 is a flowchart of a temperature drift correction method of a MEMS thermal conduction vacuum sensor according to an embodiment of the present invention.
Detailed Description
In order to further describe the technical means and effects adopted for achieving the preset aim of the present invention, the following detailed description will refer to the specific implementation, structure, characteristics and effects of the temperature drift correction system of the MEMS thermal conduction vacuum sensor according to the present invention with reference to the accompanying drawings and the preferred embodiments. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this embodiment, a temperature drift correction system of a MEMS heat conduction type vacuum sensor is provided, as shown in fig. 1, where the temperature drift correction system of the MEMS heat conduction type vacuum sensor includes a MEMS heat conduction type vacuum sensor 1, a barometric pressure measurement module, a heating element resistance measurement module, a correction operation module, and a power supply module, the MEMS heat conduction type vacuum sensor 1 is connected with the barometric pressure measurement module and the heating element resistance measurement module through a single-pole double-throw switch, the barometric pressure measurement module and the heating element resistance measurement module are both connected with the correction operation module, the power supply module is connected with the MEMS heat conduction type vacuum sensor 1, the barometric pressure measurement module, the heating element resistance measurement module, and the correction operation module, where the MEMS heat conduction type vacuum sensor 1 includes a sensitive area 11, a thermosensitive element 12 and a heating element 13 are placed on the sensitive area 11, the thermosensitive element 12 is connected with the barometric pressure measurement module through a single-pole double-throw switch, and the heating element is connected with the heating element resistance measurement module through a single-pole double-throw switch.
Preferably, the heat sensitive element 12 and the heating element 13 are two independent elements, or one and the same element with both heat sensitive and heating functions.
Preferably, the resistance of the resistor in the resistance measuring module of the heating element does not change with temperature, and the resistor and the heating element 13 are connected in series to form a voltage dividing circuit, so that the voltage division on the resistor is different at different ambient temperatures, and the current ambient temperature can be calculated according to different voltages.
Preferably, the microcontroller in the correction operation module forms a digital operation circuit, and a heating element resistance temperature drift formula and a temperature drift correction algorithm are implanted in the digital operation circuit.
Specifically, the air pressure measurement module comprises a voltage follower and an analog-to-digital converter, the heating element resistance measurement module comprises a resistor and an analog-to-digital converter, and the correction operation module comprises a voltage follower and a microcontroller; in order to solve the impedance matching problem, more accurate voltage can be obtained by using two voltage followers; the two analog-to-digital converters are capable of converting the acquired analog voltage into a digital voltage.
As another embodiment of the present invention, as shown in fig. 2, there is provided a temperature drift correction method of a MEMS thermal conduction vacuum sensor, which is applied to the temperature drift correction system of the MEMS thermal conduction vacuum sensor, the temperature drift correction method of the MEMS thermal conduction vacuum sensor includes:
Step 1), testing in a variable temperature environment to obtain a relation equation of the resistance R of the heating element 13 and the environment temperature T, namely a heating element resistance temperature drift formula: r=f (T); solidifying the resistance temperature drift formula of the heating element in the digital operation circuit;
Step 2), controlling a vacuum testing system under the environment temperature T 0 to enable the pressure of the vacuum cavity to reach any one value or multiple values within the range of 0Pa and 1Pa-1000Pa and 10 5 Pa respectively, and simultaneously respectively measuring the voltage of the corresponding thermosensitive element 12 under each pressure to obtain a first relation equation of the voltage U and the air pressure P of the thermosensitive element 12: u=g 1(P,T0);
Step 3), changing the ambient temperature to be T 1, controlling a vacuum testing system to enable the vacuum cavity pressure to respectively reach any one value or multiple values within the range of 0Pa and 1Pa-1000Pa and 10 5 Pa, and simultaneously respectively measuring the voltages of the corresponding thermosensitive element 12 under each pressure to obtain a second relation equation of the voltage U and the air pressure P of the thermosensitive element 12: u=g 2(P,T1);
Step 4), according to u=g 1(P,T0) and u=g 2(P,T1), a third equation of relation between the voltage U and the air pressure P of the thermal element 12 at any ambient temperature T is obtained: u=g (P, T); for u=g (P, T) deformation, a temperature drift correction algorithm is obtained: p=h (U, T) and curing the temperature drift correction algorithm in the digital arithmetic circuit;
Step 5), placing the MEMS heat conduction type vacuum sensor 1 in an atmosphere environment, stirring a single-pole double-throw switch to enable a heating element resistance measuring module to be connected with the MEMS heat conduction type vacuum sensor 1, measuring the resistance R 'of the heating element 13 through the heating element resistance measuring module, and obtaining the environment temperature T' according to a heating element resistance temperature drift formula;
Step 6), placing the MEMS heat conduction type vacuum sensor 1 in a vacuum environment to be measured, and toggling a single-pole double-throw switch to enable a gas pressure measurement module to be connected with the MEMS heat conduction type vacuum sensor 1, wherein the gas pressure measurement module is used for measuring the voltage U 'of the thermosensitive element 12 at the ambient temperature T';
Step 7), bringing the ambient temperature T ' obtained in step 5) and the voltage U ' of the thermosensitive element 12 obtained in step 6) into the temperature drift correction algorithm to obtain a vacuum ambient pressure value P ' to be measured.
Preferably, steps 1) -4) are performed only once, and steps 5) -7) are repeated each time the MEMS thermally conductive vacuum sensor is used.
The temperature drift correction system and method for the MEMS heat conduction type vacuum sensor provided by the invention have the characteristics of simple circuit structure, low cost, no need of using an additional temperature sensor, wide application range and the like.
The present invention is not limited to the above-mentioned embodiments, but is intended to be limited to the following embodiments, and any modifications, equivalents and modifications can be made to the above-mentioned embodiments without departing from the scope of the invention.
Claims (6)
1. The temperature drift correction system of the MEMS heat conduction type vacuum sensor is characterized by comprising the MEMS heat conduction type vacuum sensor (1), an air pressure measurement module, a heating element resistance measurement module, a correction operation module and a power supply module, wherein the MEMS heat conduction type vacuum sensor (1) is respectively connected with the air pressure measurement module and the heating element resistance measurement module through a single-pole double-throw switch, the air pressure measurement module and the heating element resistance measurement module are both connected with the correction operation module, the power supply module is respectively connected with the MEMS heat conduction type vacuum sensor (1), the air pressure measurement module, the heating element resistance measurement module and the correction operation module, the MEMS heat conduction type vacuum sensor (1) comprises a sensitive area (11), a thermosensitive element (12) and a heating element (13) are placed on the sensitive area (11), the thermosensitive element (12) is respectively connected with the air pressure measurement module through a single-pole double-throw switch, and the heating element is respectively connected with the heating element resistance measurement module through the single-pole double-throw switch.
2. A temperature drift correction system for a MEMS thermally conductive vacuum sensor according to claim 1, characterized in that the thermo-sensitive element (12) and the heating element (13) are two separate elements or one and the same element having both a thermo-sensitive function and a heating function.
3. A temperature drift correction system for a MEMS thermal conduction vacuum transducer as set forth in claim 1, wherein the resistance of the resistor in the heating element resistance measurement module is constant with temperature, the resistor being in series with the heating element (13).
4. The system of claim 1, wherein the microcontroller in the calibration module forms a digital circuit, and the digital circuit is embedded with a temperature drift formula and a temperature drift calibration algorithm for the resistance of the heating element.
5. A temperature drift correction method of a MEMS thermal conduction vacuum sensor, applied to the temperature drift correction system of a MEMS thermal conduction vacuum sensor as set forth in any one of claims 1 to 4, characterized in that the temperature drift correction method of the MEMS thermal conduction vacuum sensor includes:
Step 1), testing in a variable temperature environment to obtain a relation equation of the resistance value R of the heating element (13) and the environment temperature T, namely a heating element resistance value temperature drift formula: r=f (T); solidifying the resistance temperature drift formula of the heating element in the digital operation circuit;
Step 2), controlling a vacuum testing system under the environment temperature T 0 to enable the pressure of a vacuum cavity to reach any one value or multiple values within the range of 0Pa and 1Pa-1000Pa and 10 5 Pa respectively, and simultaneously respectively measuring the voltage of the corresponding thermosensitive element (12) under each pressure to obtain a first relation equation of the voltage U and the air pressure P of the thermosensitive element (12): u=g 1(P,T0);
Step 3), changing the ambient temperature to be T 1, controlling a vacuum testing system to enable the vacuum cavity pressure to respectively reach any one value or multiple values within the range of 0Pa and 1Pa-1000Pa and 10 5 Pa, and simultaneously respectively measuring the voltage of the corresponding thermosensitive element (12) under each pressure to obtain a second relation equation of the voltage U and the air pressure P of the thermosensitive element (12): u=g 2(P,T1);
Step 4), according to u=g 1(P,T0) and u=g 2(P,T1), obtaining a third equation of relation between voltage U and barometric pressure P for the thermal element (12) at any ambient temperature T: u=g (P, T); for u=g (P, T) deformation, a temperature drift correction algorithm is obtained: p=h (U, T) and curing the temperature drift correction algorithm in the digital arithmetic circuit;
Step 5), placing the MEMS heat conduction type vacuum sensor (1) in an atmosphere environment, stirring a single-pole double-throw switch to enable a heating element resistance measuring module to be connected with the MEMS heat conduction type vacuum sensor (1), measuring the resistance R 'of the heating element (13) through the heating element resistance measuring module, and obtaining the environment temperature T' according to a heating element resistance temperature drift formula;
Step 6), placing the MEMS heat conduction type vacuum sensor (1) in a vacuum environment to be measured, and toggling a single-pole double-throw switch to enable an air pressure measuring module to be connected with the MEMS heat conduction type vacuum sensor (1), and measuring the voltage U 'of the thermosensitive element (12) at the ambient temperature T' through the air pressure measuring module;
step 7), bringing the ambient temperature T ' obtained in step 5) and the voltage U ' of the thermosensitive element (12) obtained in step 6) into the temperature drift correction algorithm to obtain a vacuum ambient pressure value P ' to be measured.
6. The method of claim 5, wherein steps 1) to 4) are performed only once, and steps 5) to 7) are repeated each time the MEMS thermally conductive vacuum sensor is used.
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| JP2022056487A (en) * | 2020-09-30 | 2022-04-11 | Tdk株式会社 | Gas sensor |
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- 2024-01-29 CN CN202410116514.7A patent/CN117968930A/en active Pending
Patent Citations (6)
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| CH556030A (en) * | 1973-06-07 | 1974-11-15 | Cobra Ag Infrared Systems Inc | PROCESS FOR COMPENSATING THE TEMPERATURE DRIFT OF A BRIDGE CIRCUIT, AT LEAST PARTICALLY CONSISING OF TEMPERATURE DEPENDENT RESISTORS. |
| JP2015227822A (en) * | 2014-06-02 | 2015-12-17 | Tdk株式会社 | Heat conduction type gas sensor |
| JP2017003441A (en) * | 2015-06-11 | 2017-01-05 | 新コスモス電機株式会社 | Gas thermal conduction type gas sensor and output correction method thereof |
| CN107830967A (en) * | 2017-10-31 | 2018-03-23 | 无锡职业技术学院 | A kind of MEMS air differential pressures sensor |
| JP2022056487A (en) * | 2020-09-30 | 2022-04-11 | Tdk株式会社 | Gas sensor |
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