CN117960633B - Material transfer mechanism for wafer sorting machine based on vibration reduction base - Google Patents
Material transfer mechanism for wafer sorting machine based on vibration reduction base Download PDFInfo
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- CN117960633B CN117960633B CN202410374205.XA CN202410374205A CN117960633B CN 117960633 B CN117960633 B CN 117960633B CN 202410374205 A CN202410374205 A CN 202410374205A CN 117960633 B CN117960633 B CN 117960633B
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- damping
- driving motor
- swing arm
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- 230000009467 reduction Effects 0.000 title claims abstract description 56
- 239000000463 material Substances 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 title claims abstract description 32
- 238000012546 transfer Methods 0.000 title claims abstract description 30
- 238000009434 installation Methods 0.000 claims abstract description 24
- 230000008878 coupling Effects 0.000 claims abstract description 14
- 238000010168 coupling process Methods 0.000 claims abstract description 14
- 238000005859 coupling reaction Methods 0.000 claims abstract description 14
- 238000005096 rolling process Methods 0.000 claims abstract description 14
- 210000003437 trachea Anatomy 0.000 claims abstract description 9
- 239000006096 absorbing agent Substances 0.000 claims abstract description 5
- 238000013016 damping Methods 0.000 claims description 76
- 239000002245 particle Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000012798 spherical particle Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 5
- 229910000639 Spring steel Inorganic materials 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 36
- 239000000758 substrate Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 7
- 238000005265 energy consumption Methods 0.000 description 6
- 238000013021 overheating Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Vibration Prevention Devices (AREA)
Abstract
The invention discloses a material transfer mechanism for a wafer sorting machine based on a vibration reduction base, which comprises the following components: the vibration reduction base comprises a base plate and a vibration absorber, wherein a plurality of spherical propping pieces are respectively arranged at the two sides of the vibration reduction container in an inward rolling manner according to the height; the driving motor is fixedly arranged at the bottom side of the base plate, and a plurality of jacking convex edges matched with the spherical jacking piece are respectively arranged at two sides of an output shaft of the driving motor in a step shape; the swing arm mount pad, the rigid coupling in driving motor's output axle head, corresponding swing arm is upwards installed respectively to the both sides of swing arm mount pad, the upper end of swing arm outwards inclines respectively and sets up and the rigid coupling has corresponding air cock installation component, air cock installation component's mounting mid-mounting has the trachea, tracheal outer end connection has the rubber suction nozzle. The invention can effectively improve the sorting efficiency of the wafers.
Description
Technical Field
The invention relates to a material transfer mechanism for a wafer separator, in particular to a material transfer mechanism for a wafer separator based on a vibration reduction base.
Background
The wafer sorter needs to sort the wafers with different electronic data after passing the test, wherein hundreds or thousands of wafers with different data are attached to one substrate, and a plurality of substrates are vertically arranged in one substrate groove. In the sorting process, qualified wafers are effectively conveyed to the position of the material transfer mechanism through substrate movement, then the corresponding wafers are ejected out through the corresponding ejector pin mechanisms, so that the wafers are adsorbed by the suction nozzles of the material transfer mechanism, and the qualified wafers are transferred to the substrate on the other side through rotation of the material transfer mechanism.
In the practical use process, the existing material transfer mechanism for the wafer sorting machine has the problem of low transfer efficiency. The main reason for this is: the driving motor integrally generates a rotating process at the material transfer mechanism, if the rotating speed is too high, the problem that the inertia force is too high exists, so that the driving motor can vibrate relatively greatly when the driving motor is stopped, the wafer is easy to vibrate obviously between the suction nozzles, and the wafer cannot be accurately attached to the qualified product accommodating substrate.
Therefore, the design of the material transfer mechanism for the wafer sorting machine based on the vibration reduction base, which can effectively solve the vibration problem caused by the lifting of the rotation speed, can further obviously improve the overall operation speed of the material transfer mechanism so as to further improve the sorting efficiency of the wafers, is a research purpose of the invention.
Disclosure of Invention
The invention aims at solving the technical problems in the prior art, and provides a material transfer mechanism for a wafer sorter based on a vibration reduction base, which can effectively solve the technical problems in the prior art.
The technical scheme of the invention is as follows:
A material transfer mechanism for a wafer sorter based on a vibration reduction base, comprising:
The vibration reduction base comprises a base plate and a vibration absorber, wherein the middle part of the base plate is provided with a mounting groove, the middle part of the mounting groove is provided with a corresponding guide hole, the vibration absorber comprises a vibration reduction container fixedly embedded in the mounting groove, the vibration reduction container is in an annular shape, corresponding first damping particles are fixedly filled and mounted in the vibration reduction container, and a plurality of spherical jacking pieces are respectively and inwards mounted at two sides of the vibration reduction container in a rolling manner according to the height;
The driving motor is fixedly arranged at the bottom side of the base plate, an output shaft of the driving motor penetrates through the guide hole of the base plate and the inner hole of the vibration reduction container to extend to the upper side of the base plate, a plurality of jacking convex edges matched with the spherical jacking pieces are respectively arranged on two sides of the output shaft of the driving motor in a step shape, and the jacking convex edges positioned on two sides of the output shaft of the driving motor form rolling butt with the corresponding spherical jacking pieces in sequence in the rotation process of the output shaft of the driving motor;
The swing arm mount pad, the rigid coupling in driving motor's output axle head, the both sides of swing arm mount pad upwards install corresponding swing arm respectively, the upper end of swing arm outwards inclines respectively and sets up and the rigid coupling has corresponding air cock installation component, the air cock installation component contain the rigid coupling in the mounting at swing arm top and rigid coupling in damping piece on the mounting, a corresponding trachea is installed in the middle part penetration of mounting, tracheal outer tip extends to the outside of mounting and is connected with the rubber suction nozzle, be provided with on the damping piece with the air cavity of trachea looks adaptation, tracheal inner tip peg graft to in the air cavity, the bottom side of air cavity communicates downwards and is provided with a pneumatic tube that is connected to on the external pneumatic control system, still be provided with corresponding damping chamber on the damping piece respectively, it has corresponding second damping particle to fill respectively in the damping chamber.
The swing arms can be installed on the swing arm installation seats in a swinging mode through corresponding spring steel plates respectively, corresponding support arms are fixedly connected to the swing arm installation seats on the inner sides of the swing arms in an upward mode respectively, and corresponding buffer springs are fixedly installed between the support arms and the swing arms respectively.
The inner sides of the swing arms are respectively and fixedly connected with corresponding fixing sleeves inwards, the outer ends of the buffer springs are fixedly arranged in the fixing sleeves, and the inner ends of the buffer springs are respectively and fixedly abutted to the supporting arms.
The swing arm is fixedly connected with a limiting shaft piece used for limiting the swing direction of the swing arm, and the swing arm is provided with a guide long hole used for penetrating through the limiting shaft piece.
And one side of the driving motor is fixedly connected with a radiator outwards, and the radiator comprises a radiating plate fixedly connected to the side wall of the driving motor and a plurality of radiating fins integrally formed and connected to the radiating plate.
The vibration reduction container comprises a vibration reduction groove which is arranged in an annular shape and an annular cover plate which is fixedly connected to the upper part of the vibration reduction groove, wherein the outer edge of the annular cover plate extends to the outer side of the mounting groove and is fixedly mounted on the upper surface of the base plate through a corresponding locking bolt.
The periphery bottom indent of vibration damping groove is provided with corresponding draw-in groove, fixed mounting has a corresponding rubber packing ring in the draw-in groove, after the vibration damping groove is installed in place, the rubber packing ring is extrusion state and is located the vibration damping groove with between the bed plate.
And a sealing rubber ring which is arranged on the air pipe in a sealing way is fixedly connected in the air cavity of the vibration reduction piece.
The inner end part of the vibration reduction piece is fixedly provided with a sealing plate for sealing the vibration reduction cavity.
The first damping particles adopt iron-based spherical particles, and the second damping particles adopt aluminum-based spherical particles.
The invention has the advantages that:
1) The invention improves the traditional swing arm into the arrangement that the upper end is inclined outwards, thereby forming the abdication at the upper end of the swing arm, facilitating the addition of the vibration absorbing piece on the basis of the fixing piece, the air pipe and the rubber suction nozzle, effectively realizing the control of air suction and discharge through the arrangement of the air cavity arranged on the vibration absorbing piece, and then effectively realizing the filling of the second damping particles through the arrangement of the vibration absorbing cavity arranged in the air cavity, and obviously improving the integral assembly and the operation stability of the air nozzle mounting assembly and the rubber suction nozzle through the friction energy consumption among the second damping particles, thereby overcoming the vibration problem caused by the improvement of the rotation speed, obviously improving the integral operation speed of the material transfer mechanism and further improving the sorting efficiency of wafers.
2) By adding the vibration reduction piece, the integral assembly and operation stability of the air faucet mounting assembly and the rubber suction nozzle can be improved, but the integral weight of the vibration reduction device is increased, and the vibration quantity of the rubber suction nozzle part is obviously reduced, but the integral vibration quantity of the device in operation is increased. In order to solve the problem, the traditional vibration damping base is further divided into the base plate and the vibration damper, the spherical jacking parts arranged at two sides of the vibration damping container are used for conducting rolling jacking limiting on the jacking convex edges arranged at the output shaft end of the driving motor, so that the installation and operation stability of the output shaft of the driving motor can be effectively improved, vibration generated by equipment operation can be transmitted to the vibration damper, the stability of the vibration damper after the integral weight is increased during operation can be ensured through the friction energy consumption among the first damping particles of the vibration damper, the vibration problem caused by the rotation speed is further overcome, the integral operation speed of the material transfer mechanism is obviously improved, and the sorting efficiency of wafers is further improved.
3) Because the equipment operation rate is improved, and the equipment is in an operation state for most of the time, the continuous rolling friction between the jacking convex edges and the spherical jacking pieces is easy to cause overheating of parts. Therefore, the problem of friction overheating between the jacking convex edge and the spherical jacking piece is effectively solved, and the practical effect of the invention is ensured.
4) The vibration reduction container comprises a vibration reduction groove which is arranged in an annular shape and an annular cover plate which is fixedly connected to the upper part of the vibration reduction groove, wherein the bottom of the periphery of the vibration reduction groove is concavely provided with a corresponding clamping groove, a corresponding rubber gasket is fixedly arranged in the clamping groove, and the rubber gasket is positioned between the vibration reduction groove and the base plate in an extrusion state after the vibration reduction groove is arranged in place, so that the vibration reduction effect is further improved through the buffer effect of the rubber gasket while the installation stability of the vibration reduction container is ensured.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a partial cross-sectional view of the present invention.
Fig. 3 is a schematic view of a structure in which a driving motor is mounted on a vibration damping mount.
Fig. 4 is a schematic structural view of a swing arm mounted on a swing arm mount.
FIG. 5 is a cross-sectional view of the air cap mounting assembly.
Fig. 6 is a schematic structural view of the vibration damping chamber filled with the second damping particles.
In the accompanying drawings: vibration damping base 1, base plate 101, vibration damper 102, mounting groove 2, guide hole 3, vibration damping container 1021, vibration damping groove 10211, annular cover plate 10212, first damping particles 1022, lock bolt 4, spherical jack 5, driving motor 6, jack flange 7, swing arm mount 8, swing arm 9, air tap mount 10, fixing member 1001, vibration damping member 1002, air pipe 11, rubber suction nozzle 12, air cavity 13, air pipe 14, vibration damping cavity 15, second damping particles 16, spring steel plate 17, support arm 18, buffer spring 19, fixing sleeve 20, limit shaft 21, guide slot 22, radiator 23, heat radiation plate 2301, heat radiation fin 2302, rubber gasket 24, sealing rubber ring 25, and closing plate 26.
Detailed Description
For the convenience of understanding by those skilled in the art, the structure of the present invention will now be described in further detail with reference to the accompanying drawings:
referring to fig. 1-6, a material transfer mechanism for a wafer sorter based on a vibration reduction base includes:
The vibration damping base 1 comprises a base plate 101 and a vibration damper 102, wherein an installation groove 2 is formed in the middle of the base plate 101, a corresponding guide hole 3 is formed in the middle of the installation groove 2, the vibration damper 102 comprises a vibration damping container 1021 fixedly embedded in the installation groove 2, the vibration damping container 1021 is in an annular shape, corresponding first damping particles 1022 are fixedly filled and installed in the vibration damping container 1021, and a plurality of spherical propping pieces 5 are respectively and inwards installed on two sides of the vibration damping container 1021 in a rolling mode according to the height (the spherical propping pieces 5 in the embodiment are embedded on the side wall of the vibration damping container 1021 in a punching mode);
The driving motor 6 is fixedly arranged at the bottom side of the base plate 101, an output shaft of the driving motor 6 penetrates through the guide hole 3 of the base plate 101 and the inner hole of the vibration reduction container 1021 to extend to the upper side of the base plate 101, a plurality of jacking convex edges 7 matched with the spherical jacking pieces 5 are respectively arranged at two sides of the output shaft of the driving motor 6 in a step shape, and the jacking convex edges 7 positioned at two sides of the output shaft of the driving motor 6 form rolling butt with the corresponding spherical jacking pieces 5 in sequence in the rotation process of the output shaft of the driving motor 6;
Swing arm mount pad 8, the rigid coupling in driving motor 6's output axle head, corresponding swing arm 9 is upwards installed respectively to the both sides of swing arm mount pad 8, the upper end of swing arm 9 outwards inclines respectively and sets up and the rigid coupling has corresponding air cock installation component 10, air cock installation component 10 contain the rigid coupling in mounting 1001 at swing arm 9 top and rigid coupling in damping piece 1002 on the mounting 1001, a corresponding trachea 11 is run through in the middle part of mounting 1002, the outer tip of trachea 11 extends to the outside of mounting 1001 and is connected with rubber suction nozzle 12, be provided with on the damping piece 1002 with the air cavity 13 of trachea 11 looks adaptation, the inner tip of trachea 11 peg graft to in the air cavity 13, the bottom side of air cavity 13 communicates downwards and is provided with a pneumatic tube 14 on the external pneumatic control system, still be provided with corresponding damping cavity 15 on the damping piece 1002 respectively, it is filled with corresponding second damping particle 16 respectively to fill in the damping cavity 15.
The invention improves the traditional swing arm 9 into an arrangement with the upper end inclined outwards, thereby forming a yielding position at the upper end of the swing arm 9, facilitating the addition of the vibration reduction member 1002 on the basis of the fixing member 1001, the air pipe 11 and the rubber suction nozzle 12, effectively realizing the control of air suction and discharge through the arrangement of the air cavity 13 arranged on the vibration reduction member 1002, and effectively realizing the filling of the second damping particles 16 through the arrangement of the vibration reduction cavity 15 arranged in the air cavity 13, and obviously improving the integral assembly and operation stability of the air nozzle mounting assembly 10 and the rubber suction nozzle 12 according to the invention through the friction energy consumption among the second damping particles 16, thereby overcoming the vibration problem caused by the improvement of the rotation speed, obviously improving the integral operation speed of the material transfer mechanism, and further improving the sorting efficiency of wafers.
By adding the vibration damping member 1002, the overall assembly and operation stability of the air nozzle mounting assembly 10 and the rubber suction nozzle 12 can be improved, but the overall weight of the invention is increased, and the vibration amount of the rubber suction nozzle 12 is obviously reduced, but the overall vibration amount during the operation of the equipment is increased. In order to solve the problem, the traditional vibration damping base 1 is further divided into the base plate 101 and the vibration damper 102, the spherical jacking pieces 5 arranged on two sides of the vibration damping container 102 are used for rolling and jacking limiting the jacking convex edges 7 arranged on the output shaft end of the driving motor 6, so that the installation and running stability of the output shaft of the driving motor 6 can be effectively improved, vibration generated by equipment running can be transmitted to the vibration damper 102, the running stability of the vibration damping device after the whole weight is increased can be ensured through the friction energy consumption among the first damping particles 1022 of the vibration damper 102, the vibration problem caused by the rotation speed lifting is further overcome, the whole running speed of the material transfer mechanism is obviously improved, and the sorting efficiency of wafers is further improved.
Because the equipment operation rate is improved, and the equipment is in an operation state for most of the time, the continuous rolling friction between the jacking convex edges 7 and the spherical jacking pieces 5 is easy to cause overheating of parts, therefore, the spherical jacking pieces 5 are further arranged on two sides of the vibration reduction container 1021 according to the height, the jacking convex edges 7 are arranged on two sides of an output shaft of the driving motor 6 in a step shape, so that the rolling contact between the jacking convex edges 7 and the spherical jacking pieces 5 can be realized in a one-by-one contact mode in the operation process of the equipment, the contact rate of each jacking convex edge 7 and the spherical jacking pieces 5 is greatly reduced, and the jacking convex edges 7 arranged in the step shape can also form obvious disturbance on air flow in the rotation process, thereby improving the heat dissipation effect. Therefore, the problem of friction overheating between the jacking convex edge 7 and the spherical jacking piece 5 is effectively solved, and the practical effect of the invention is ensured.
The swing arms 9 can be installed on the swing arm installation seats 8 in a swinging mode through corresponding spring steel plates 17, corresponding support arms 18 are fixedly connected to the swing arm installation seats 8 on the inner sides of the swing arms 9 in an upward mode respectively, and corresponding buffer springs 19 are fixedly installed between the support arms 18 and the swing arms 9 respectively.
The inner sides of the swing arms 9 are respectively and fixedly connected with corresponding fixing sleeves 20 inwards, the outer ends of the buffer springs 19 are fixedly arranged in the fixing sleeves 20, and the inner ends of the buffer springs 19 are respectively and fixedly abutted to the supporting arms 18.
A limiting shaft piece 21 for limiting the swing direction of the swing arm 9 is fixedly connected to the support arm 18, and a guiding long hole 22 for penetrating through the limiting shaft piece 21 is formed in the swing arm 9.
A radiator 23 is fixedly connected to one side of the driving motor 6 outwards, and the radiator 23 comprises a radiating plate 2301 fixedly connected to the side wall of the driving motor 6, and a plurality of radiating fins 2302 integrally formed and connected to the radiating plate 2301.
The vibration damping container 1021 includes a vibration damping groove 10211 formed in a ring shape, and an annular cover plate 10212 fixedly connected to an upper portion of the vibration damping groove 10211, wherein an outer edge of the annular cover plate 10212 extends to an outer side of the mounting groove 2 and is fixedly mounted to an upper surface of the base plate 101 by a corresponding locking bolt 4.
The bottom of the periphery of the vibration reduction groove 10211 is concavely provided with a corresponding clamping groove, a corresponding rubber gasket 24 is fixedly installed in the clamping groove, and after the vibration reduction groove 10211 is installed in place, the rubber gasket 24 is positioned between the vibration reduction groove 10211 and the base plate 101 in an extrusion state.
With the intervention of the rubber gasket 2, the vibration reduction effect is further improved through the buffer effect of the rubber gasket 2 while the installation stability of the vibration reduction container 1021 is ensured.
A sealing rubber ring 25 is fixedly connected in the air cavity 13 of the vibration damper 1002 and is sealed and arranged on the air pipe 11.
The inner end of the damper 1002 is fixedly provided with a closing plate 26 for closing the damper chamber 15.
The first damping particles 1022 are iron-based spherical particles, and the second damping particles 16 are aluminum-based spherical particles.
The specific working procedure of the invention is as follows:
s1, starting a driving motor 6 to rotate positively, driving a swing arm 9 arranged on one side of a swing arm mounting seat 8 to rotate until a rubber suction nozzle 12 is opposite to a qualified wafer positioned on a material substrate, and ejecting the qualified wafer fixed on the material substrate through a corresponding ejector pin mechanism to enable the qualified wafer to be abutted to the rubber suction nozzle 12;
S2, starting air suction by an external pneumatic control system, after the rubber suction nozzle 12 adsorbs the qualified wafers, starting a driving motor 6 to rotate the rubber suction nozzle 12 adsorbed with the qualified wafers to a blank substrate positioned on the other side, and enabling the blank substrate to be in contact with the qualified wafers fixed on the rubber suction nozzle 12 under the ejection action of a corresponding ejector pin mechanism so as to attach and mount the qualified wafers; at this time, the rubber suction nozzle 12 arranged on the swing arm 9 at the other side of the swing arm mounting seat 8 is opposite to the qualified wafer positioned on the material substrate again;
S3, the rubber suction nozzle 12 arranged on the swing arm 9 at the other side of the swing arm mounting seat 8 adsorbs and fixes the qualified wafer again, and then the driving motor 6 starts forward rotation again so as to send the qualified wafer to the blank substrate again for attaching and mounting;
s4, repeating the steps S1-S3 to continuously sort and attach the qualified wafers on the material substrates to the blank substrates.
In the forward and backward rotation process of the output shaft of the driving motor 6, each propping convex edge 7 arranged on the output shaft of the driving motor 6 can form rolling contact with the corresponding spherical propping piece 5 one by one, so that vibration generated by equipment operation is transmitted to the vibration damper 102 of the vibration damping base 1, and vibration damping is effectively formed through friction energy consumption among the first damping particles 1022 of the vibration damper 102, so that the overall operation stability of the invention is ensured. The second damping particles 16 disposed in the damping cavity 15 can consume energy through friction thereof to form energy consumption damping when the rubber suction nozzle 12 adsorbs and fixes the qualified wafer, so as to ensure the overall operation stability of the air nozzle mounting assembly 10 and the rubber suction nozzle 12.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The utility model provides a wafer is material transfer mechanism for sorter based on damping base which characterized in that includes:
the vibration reduction base (1) comprises a base plate (101) and a vibration absorber (102), wherein an installation groove (2) is formed in the middle of the base plate (101), corresponding guide holes (3) are formed in the middle of the installation groove (2), the vibration absorber (102) comprises a vibration reduction container (1021) fixedly embedded in the installation groove (2), the vibration reduction container (1021) is arranged in an annular shape, corresponding first damping particles (1022) are fixedly filled in the vibration reduction container (1021), and a plurality of spherical propping pieces (5) are respectively arranged at two sides of the vibration reduction container (1021) in an inward rolling mode according to the height;
The driving motor (6) is fixedly arranged at the bottom side of the base plate (101), an output shaft of the driving motor (6) penetrates through the guide hole (3) of the base plate (101) and the inner hole of the vibration reduction container (1021) and extends to the upper side of the base plate (101), a plurality of jacking convex edges (7) matched with the spherical jacking pieces (5) are respectively arranged on two sides of an output shaft of the driving motor (6) in a step shape, and in the rotation process of the output shaft of the driving motor (6), the jacking convex edges (7) positioned at two sides of the output shaft of the driving motor (6) sequentially form rolling butt with the corresponding spherical jacking pieces (5) to realize rolling contact between the jacking convex edges (7) and the spherical jacking pieces (5) in a one-by-one contact mode;
Swing arm mount pad (8), the rigid coupling in the output axle head of driving motor (6), corresponding swing arm (9) are upwards installed respectively to the both sides of swing arm mount pad (8), the upper end of swing arm (9) outwards slope setting respectively and rigid coupling have corresponding air cock installation component (10), air cock installation component (10) contain the rigid coupling in mounting (1001) at swing arm (9) top and rigid coupling in damping piece (1002) on mounting (1001), a corresponding trachea (11) are run through in the middle part of mounting (1001), the outer tip of trachea (11) extends to the outside of mounting (1001) and is connected with rubber suction nozzle (12), be provided with on damping piece (1002) with in air cavity (13) of air cavity (11) looks adaptation, the tip of air cavity (13) peg graft to in air cavity (13), the bottom side down the intercommunication of air cavity (13) be provided with one be connected to pneumatic tube (14) on the pneumatic control system, still be provided with on the mounting (1002) respectively corresponding damping particle (15) in the corresponding damping chamber (15) of filling respectively.
2. The material transfer mechanism for the wafer sorting machine based on the vibration reduction base according to claim 1, wherein the swing arms (9) are respectively installed on the swing arm installation seats (8) in a swinging mode through corresponding spring steel plates (17), corresponding support arms (18) are respectively and fixedly connected to the swing arm installation seats (8) on the inner sides of the swing arms (9) upwards, and corresponding buffer springs (19) are respectively and fixedly installed between the support arms (18) and the swing arms (9).
3. The material transfer mechanism for the wafer sorting machine based on the vibration reduction base according to claim 2, wherein the inner sides of the swing arms (9) are respectively and fixedly connected with corresponding fixing sleeves (20) inwards, the outer ends of the buffer springs (19) are fixedly arranged in the fixing sleeves (20), and the inner ends of the buffer springs (19) are respectively and fixedly abutted to the supporting arms (18).
4. A material transfer mechanism for a wafer sorting machine based on a vibration damping base according to claim 3, wherein a limiting shaft (21) for limiting the swinging direction of the swinging arm (9) is fixedly connected to the supporting arm (18), and a guiding long hole (22) for penetrating through the limiting shaft (21) is arranged on the swinging arm (9).
5. A material transfer mechanism for a wafer sorter based on a vibration damping base according to claim 3, wherein a radiator (23) is fixedly connected to one side of the driving motor (6) outwards, and the radiator (23) comprises a heat radiation plate (2301) fixedly connected to the side wall of the driving motor (6), and a plurality of heat radiation fins (2302) integrally formed and connected to the heat radiation plate (2301).
6. The material transfer mechanism for a wafer sorter based on a vibration damping base according to claim 1, wherein the vibration damping container (1021) includes a vibration damping groove (10211) provided in a ring shape, and an annular cover plate (10212) fixedly connected to an upper portion of the vibration damping groove (10211), and an outer edge of the annular cover plate (10212) extends to an outside of the mounting groove (2) and is fixedly mounted to an upper surface of the base plate (101) by a corresponding locking bolt (4).
7. The material transfer mechanism for a wafer sorter based on a vibration reduction base according to claim 6, wherein a corresponding clamping groove is concavely formed in the bottom of the periphery of the vibration reduction groove (10211), a corresponding rubber gasket (24) is fixedly installed in the clamping groove, and after the vibration reduction groove (10211) is installed in place, the rubber gasket (24) is located between the vibration reduction groove (10211) and the base plate (101) in an extrusion state.
8. The material transfer mechanism for the wafer sorting machine based on the vibration reduction base according to claim 1, wherein a sealing rubber ring (25) which is sealed and sleeved on the air pipe (11) is fixedly connected in the air cavity (13) of the vibration reduction piece (1002).
9. The material transfer mechanism for a wafer sorter based on the vibration damping base according to claim 1, wherein a closing plate (26) for closing the vibration damping chamber (15) is fixedly installed at an inner end portion of the vibration damping member (1002).
10. The material transfer mechanism for a wafer sorter based on a vibration damping base according to claim 1, wherein the first damping particles (1022) are iron-based spherical particles, and the second damping particles (16) are aluminum-based spherical particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410374205.XA CN117960633B (en) | 2024-03-29 | 2024-03-29 | Material transfer mechanism for wafer sorting machine based on vibration reduction base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410374205.XA CN117960633B (en) | 2024-03-29 | 2024-03-29 | Material transfer mechanism for wafer sorting machine based on vibration reduction base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117960633A CN117960633A (en) | 2024-05-03 |
| CN117960633B true CN117960633B (en) | 2024-06-14 |
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| CN202410374205.XA Active CN117960633B (en) | 2024-03-29 | 2024-03-29 | Material transfer mechanism for wafer sorting machine based on vibration reduction base |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214917939U (en) * | 2021-01-20 | 2021-11-30 | 陕西重构智信科技有限公司 | Intelligent screening equipment for coal mining |
| CN216781131U (en) * | 2022-02-27 | 2022-06-21 | 厦门锦海山金属制品有限公司 | Adsorption type vibration reduction supporting mechanism for tool clamp |
| CN217940968U (en) * | 2022-07-05 | 2022-12-02 | 深圳市大成自动化设备有限公司 | Swing arm mechanism for sorting machine |
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| JP2007246214A (en) * | 2006-03-15 | 2007-09-27 | Hamamura Yuatsu Kk | Visual inspection device |
| CN114308739A (en) * | 2021-12-24 | 2022-04-12 | 深圳市朝阳光科技有限公司 | Rotary material taking structure of full-automatic wafer sorting machine |
| CN219267604U (en) * | 2022-12-05 | 2023-06-27 | 深圳市昌富祥智能科技有限公司 | One drags two swing arm wiring mechanism to optimize structure |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214917939U (en) * | 2021-01-20 | 2021-11-30 | 陕西重构智信科技有限公司 | Intelligent screening equipment for coal mining |
| CN216781131U (en) * | 2022-02-27 | 2022-06-21 | 厦门锦海山金属制品有限公司 | Adsorption type vibration reduction supporting mechanism for tool clamp |
| CN217940968U (en) * | 2022-07-05 | 2022-12-02 | 深圳市大成自动化设备有限公司 | Swing arm mechanism for sorting machine |
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