CN117954868A - Antenna module and communication equipment - Google Patents
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- CN117954868A CN117954868A CN202211275795.8A CN202211275795A CN117954868A CN 117954868 A CN117954868 A CN 117954868A CN 202211275795 A CN202211275795 A CN 202211275795A CN 117954868 A CN117954868 A CN 117954868A
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- 238000004891 communication Methods 0.000 title claims abstract description 22
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- 230000017525 heat dissipation Effects 0.000 abstract description 19
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 30
- 230000005284 excitation Effects 0.000 description 13
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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Abstract
The embodiment of the application provides an antenna module and communication equipment, which relate to the technical field of communication and are used for solving the problem of high heat dissipation difficulty caused by the increase of the number of channels of a beam forming chip in the antenna module, wherein the antenna module comprises: the antenna comprises a substrate, an antenna array and N beam forming chips; the antenna array is configured on the substrate and comprises a plurality of antenna arrays, wherein the plurality of antenna arrays are divided into M antenna array subgroups; each beam forming chip is connected with a plurality of antenna arrays in one antenna array subgroup; wherein M > N, M and N are positive integers. The antenna module is used for communication.
Description
Technical Field
The present invention relates to the field of communications technologies, and in particular, to an antenna module and a communication device.
Background
The fifth generation mobile communication technology (abbreviated as 5G) is a new generation broadband mobile communication technology with high speed, low time delay and large connection characteristics, and the 5G communication facility is a network infrastructure for realizing man-machine object interconnection.
The 5G mobile communication technology can provide high-quality experience such as higher-rate network access, lower-delay response speed, ultra-large-capacity wireless equipment connection number and the like for users. Compared with the commercial Sub-6GHz frequency band, the millimeter wave frequency band has rich spectrum resources, and can meet the application scenes such as hot spot areas with large bandwidth. In addition, the characteristic of low time delay of millimeter wave communication is beneficial to building complete industrial interconnection in the industrial field, and the production and management efficiency of the manufacturing industry and the manufacturing reliability of products are greatly improved. In a 5G millimeter wave system, the design of a large-scale array antenna and the integrated integration of a package antenna and a chip are two key technologies. Reasonable antenna module design architecture is the key path that the heat dissipation, cost problem are solved.
The high-integration antenna module consists of a beam forming chip, an antenna array and a power distribution network. Due to the limitation of the power consumption density, along with the increase of the number of channels of the beam forming chip, the difficulty of heat dissipation is also increased, and how to solve the heat dissipation problem and reduce the cost is one of the research directions of the current antenna module design.
Disclosure of Invention
Some embodiments of the present application provide an antenna module and a communication device for solving the heat dissipation and cost problems of an antenna module design architecture.
In a first aspect, an embodiment of the present application provides an antenna module, including: an antenna array, a beam forming chip; the antenna array comprises a plurality of antenna arrays, wherein the plurality of antenna arrays are divided into M antenna array sub-groups; each beam forming chip is connected with a plurality of antenna arrays in one antenna array subgroup; wherein M > N, M and N are positive integers.
In the antenna module provided in the above embodiment, under the condition that the number of antenna elements in the antenna array is unchanged, part of active devices are removed, so that the number of beam forming chips is smaller than the number of antenna array subgroups, and on the premise that the actual equivalent omnidirectional radiation power of the antenna array can reach a considerable level, the problem of difficult heat dissipation in high-density layout is solved, and meanwhile, the cost of the whole antenna module can be reduced to a certain extent.
In some embodiments, M antenna array subunits are arranged in an array; among the M antenna array subgroups, the antenna array subgroup connected with the beam forming chip is a first antenna array subgroup, and the antenna array subgroups except the first antenna array subgroup are second antenna array subgroups; the number of the antenna array subgroups adjacent to the at least one second antenna array subgroup in the row direction and the column direction is larger than or equal to the number of the antenna array subgroups adjacent to any one first antenna array subgroup in the row direction and the column direction, and the row direction and the column direction are the row direction and the column direction of the M antenna array subgroups.
In some embodiments, the antenna module has at least one first antenna array subgroup between any two second antenna array subgroups along the row direction or the column direction.
In some embodiments, the quantitative relationship of N and M satisfies: the difference between the ideal equivalent omni-directional radiation power of the antenna array and the actual equivalent omni-directional radiation power of the antenna array is less than or equal to a set value. The ideal equivalent omni-directional radiation power of the antenna array is equivalent omni-directional radiation power obtained by the antenna array under the control of the M beam forming chips, and the actual equivalent omni-directional radiation power of the antenna array is equivalent omni-directional radiation power obtained by the antenna array under the control of the N beam forming chips.
In some embodiments, the set point is 2dB to 3dB.
In some embodiments, the number relationship of N and M is: (3/5) M is less than or equal to N is less than or equal to (7/8) M.
In some embodiments, when n= (3/4) M, the antenna array comprises a plurality of antenna array subgroup elements, each antenna array subgroup element comprising four adjacent antenna array subgroups; among the four antenna array subgroups in each antenna array subgroup unit, three antenna array subgroups are first antenna array subgroups, and one antenna array subgroup is second antenna array subgroup.
In some embodiments, when n= (7/8) M, the antenna array comprises a plurality of antenna array subgroup elements, each antenna array subgroup element comprising eight adjacent antenna array subgroups; among the eight antenna array subunits in each antenna array subunit unit, seven antenna array subunits are first antenna array subunits, and one antenna array subunit is second antenna array subunit.
In some embodiments, the antenna array is configured as a dual polarized antenna array; the beam forming chip is configured as a dual polarized beam forming chip; the antenna module further comprises a power division network, and the power division network is electrically connected with the N beam forming chips respectively; the power distribution network is configured as a dual polarized power distribution network.
In a second aspect, an embodiment of the present application provides a communication apparatus, including: the antenna module provided in the first aspect.
The beneficial effects of the communication device are the same as those of the antenna module provided in the first aspect of the present invention, and are not described herein.
Drawings
The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate and do not limit the application.
Fig. 1 is a schematic diagram of an antenna module according to some embodiments of the present application;
fig. 2 is a schematic diagram of a sparse array of an antenna module according to some embodiments of the present application;
Fig. 3A is a schematic diagram of an antenna module according to some embodiments of the present application;
fig. 3B is a block diagram of another antenna module according to some embodiments of the present application
Fig. 4 is a block diagram of an antenna module according to some embodiments of the present application;
Fig. 5A is a schematic diagram of an antenna module architecture according to some embodiments of the present application;
FIG. 5B is a schematic illustration of a multi-level high density interconnect provided in accordance with some embodiments of the present application;
FIG. 6 is a schematic diagram of a spherical coordinate system according to some embodiments of the present application;
Fig. 7 is a schematic diagram of phase of a feed source of a beam forming adjacent antenna according to some embodiments of the present application;
Fig. 8 is a schematic diagram of a beam forming phase diagram according to some embodiments of the present application;
Fig. 9 is a schematic diagram of a beamforming wavelength provided by some embodiments of the present application;
Fig. 10 is a schematic diagram of gain curves before and after beamforming phase conversion according to some embodiments of the present application;
fig. 11 is a schematic diagram of a microstrip slot antenna architecture according to some embodiments of the present application;
FIG. 12 is a schematic diagram of a Wilkinson's divide-by-one power divider circuit according to some embodiments of the present application;
FIG. 13 is a schematic diagram of a Wilkinson power divider network according to some embodiments of the present application;
fig. 14 is a schematic diagram of an 8 x 8 full array according to some embodiments of the present application;
fig. 15 is a schematic diagram of an antenna array excitation amplitude at the corners of 8 x 8, which is 10dB less than ideal according to some embodiments of the present application;
FIG. 16 is a schematic diagram of an 8 x 8 array center with an excitation amplitude 10dB less than ideal, according to some embodiments of the present application;
Fig. 17 is a schematic diagram of an array excitation amplitude of four angles of an 8 x 8 antenna array according to some embodiments of the present application, which is 10dB smaller than ideal;
Fig. 18 is a schematic diagram of an 8 x 8 antenna array according to some embodiments of the present application, in which the excitation amplitudes of the four antennas are each 10dB smaller than ideal;
fig. 19 is a schematic diagram of an 8 x 8 antenna array provided in some embodiments of the present application, wherein the excitation amplitude of the 16 antennas in the center is 10dB less than ideal;
Fig. 20 is a schematic diagram of another antenna module according to some embodiments of the present application;
fig. 21 is a schematic diagram of another antenna module according to some embodiments of the present application;
Fig. 22 is a schematic diagram of another antenna module according to some embodiments of the present application;
fig. 23 is a schematic diagram of another antenna module according to some embodiments of the present application;
Fig. 24 is a schematic diagram of a communication device according to some embodiments of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. In addition, when describing a pipeline, the terms "connected" and "connected" as used herein have the meaning of conducting. The specific meaning is to be understood in conjunction with the context.
In embodiments of the application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.
As described in the background, in the 5G millimeter wave system, the design of the large-scale array antenna and the integrated integration of the package antenna and the chip are two key technologies. The high-integration antenna module consists of a beam forming chip, an antenna array and a power distribution network, and due to the limitation of power consumption density, the difficulty of heat dissipation is increased along with the increase of the number of channels of the beam forming chip, and the cost of the antenna module is one of the consideration factors of module design.
Based on this, some embodiments of the present application provide an antenna module and a communication device, which are improved to provide a solution that is easy to dissipate heat and reduce cost, and the antenna module and the communication device are described below.
Fig. 1 is a schematic diagram of an antenna module according to some embodiments. As shown in fig. 1, the present antenna module 100 includes: a substrate 11, an antenna array 12, a plurality of beamforming chips 13. The antenna array 12 and the beam forming chip 13 are respectively arranged on two opposite surfaces of the substrate 11; the antenna array 12 comprises a plurality of antenna elements 121, the antenna elements 121 being one individual element of the antenna array, the plurality of antenna elements 121 being divided into a plurality of antenna array sub-groups 14, e.g. each antenna array sub-group 14 comprises 4 antenna elements; each of the plurality of beamforming chips 13 is connected to a plurality of antenna elements 121 in one antenna element group 14. In some examples, the plurality of beamforming chips 13 and the plurality of antenna array sub-groups 14 are electrically connected in a one-to-one correspondence, i.e. the number of beamforming chips 13 and antenna array sub-groups 14 are equal.
In some embodiments, as shown in fig. 1, the antenna module 100 further includes a power division network 15, where the power division network 15 is electrically connected to the plurality of beamforming chips 13, and the power division network 15 includes a plurality of power splitters 151 and a plurality of connection cables 152.
In the above-mentioned scheme, the plurality of beamforming chips 13 and the plurality of antenna array subgroups 14 are in a one-to-one correspondence, and as the number of channels of the beamforming chips 13 increases, the difficulty of heat dissipation of the current antenna module 100 increases, so as to solve the problem, in some embodiments, a sparse array scheme is proposed. As shown in fig. 2, in the antenna module, a portion of the antenna array 121 is removed, so that the antenna array 12 presents a sparse layout, where a blank box represents the removed antenna array, and the scale of the active circuit is unchanged, that is, the number of beamforming chips is unchanged, where the active circuit includes the beamforming chips and the feeding connection lines of the beamforming chips and the antenna array. The reduction of the antenna array 121 solves the problem of layout wiring from the density, can solve the heat dissipation problem to a certain extent, and increases the aperture surface of the antenna at the same time, however, part of the circuits in the active circuit are in a suspended state, so that the advantage part of high integration of the beamforming chip 13 is lost, and the cost reduction is not facilitated.
In other embodiments, in the antenna module, the cost and power consumption of the 5G millimeter wave antenna module are reduced by removing part of the beam forming chip 13 without changing the size of the antenna array, and meanwhile, the heat dissipation problem is solved.
Fig. 3A and 3B are architecture diagrams of an antenna module. As shown in fig. 3A and 3B, the antenna module 1000 includes a substrate 11, an antenna array 12, N beamforming chips 13, and a power distribution network 15. The antenna array 12 includes a plurality of antenna elements 121, and the plurality of antenna elements 121 are divided into M antenna element groups 14; each of the N beamforming chips 13 is connected to a plurality of antenna elements 121 in one antenna element group 14. Wherein M > N.
It should be noted that "141-14" appearing in the drawings of the present application means that the component referred to is 141 and belongs to 14, that is, the component is both 141 and 14, and similar reference numerals appear in other positions in the drawings of the present application with reference to the above description.
Illustratively, as shown in fig. 3A, the antenna array 12 is not a full array, M antenna array sub-groups 14 are arranged in an array, and the number of antenna elements included in each antenna array sub-group is different, for example, the number of antenna elements 121 included in the antenna array sub-group 14 is 6, or 7 or 8.
Illustratively, as shown in fig. 3B, the antenna array 12 is a full array, the plurality of antenna arrays are arranged in an array, each antenna array subset 14 includes the same number of antenna elements 121, e.g., each antenna array subset 14 includes eight adjacent antenna elements 121.
As shown in fig. 3A and 3B, the antenna module includes thirty-two antenna array subgroups 14 and twenty-four beamforming chips 13, that is, the number of antenna array subgroups 14 is greater than the number of beamforming chips 13, which is equivalent to removing part of the beamforming chips, so as to solve the heat dissipation problem from the perspective of an active circuit, and in some examples, the above embodiment may be referred to as a sparse source scheme.
It should be noted that, no matter the scheme of the sparse array or the scheme of the sparse source, the equivalent omnidirectional radiation power (equivalent isotropically radiated power, EIRP) of the antenna module needs to be ensured to reach a corresponding level, that is, the normal operation and the normal implementation function of the antenna module cannot be affected.
The principle utilized for realizing the target scheme in the above embodiment is as follows: the basic principle of 'independent and uncorrelated antenna shaping and active feed network' in 5G millimeter wave beam shaping. That is, in the design of the antenna module, the same magnitude of equivalent omni-directional radiation power can be achieved by reducing the number of the antenna elements 121, and the same magnitude of equivalent omni-directional radiation power can be achieved by reducing the number of the beam forming chips 13. By reducing the number of the beam forming chips 13, not only the heat dissipation problem can be solved, but also the cost of the product can be reduced to a certain extent.
Equivalent omni-directional radiated power or effective omni-directional radiated power (EIRP) refers to the radiated power of a satellite or ground station in some specified direction. In an ideal state, the EIRP calculation formula under a large-scale array is as follows:
EIRP (dBm) =pave+10log (number of beamforming chips) +10log (number of antenna elements) +gain ANT
It can be seen that the equivalent omni-directional radiated power is related to the number of antenna elements 121 and the number of beamforming chips 13.
In some embodiments, the quantitative relationship of N and M satisfies:
The difference between the ideal equivalent omni-directional radiation power of the antenna array 12 and the actual equivalent omni-directional radiation power of the antenna array is less than or equal to a set value. The ideal equivalent omni-directional radiation power of the antenna array is equivalent omni-directional radiation power obtained by the antenna array under the control of M beam forming chips, and the actual equivalent omni-directional radiation power of the antenna array is equivalent omni-directional radiation power obtained by the antenna array under the control of N beam forming chips.
Because the number of the beam forming chips 13 is less than the number of the antenna array subgroups 14, part of the antenna array subgroups 14 are not regulated by the beam forming chips, so that the actual equivalent omni-directional radiation power of the antenna array 12 has certain loss. The difference between the ideal equivalent omni-directional radiation power of the antenna array 12 and the actual equivalent omni-directional radiation power of the antenna array is defined to be smaller than or equal to the set value, that is, the reduction value of the actual equivalent omni-directional radiation power relative to the ideal equivalent omni-directional radiation power is defined to be within an acceptable range, so that the equivalent omni-directional radiation power of the antenna module can still be ensured under the scheme of adopting a sparse source, thereby ensuring the normal operation of the antenna array.
In some examples, the setpoint is 2dB to 3dB.
In some examples, the setting value is obtained according to the specification in the TS 38.104 protocol in the third generation partnership project (3 GPP) specification series and the simulation test combined with the embodiment of the application, and under the condition that the setting value is 2 dB-3 dB, the equivalent omnidirectional radiation power of the antenna module can still be ensured, and the normal operation of the antenna array can be ensured.
In the above embodiment, under the condition that the size of the antenna array is unchanged, the number of the beam forming chips 13 is reduced by removing part of the beam forming chips, so that the problem of difficult heat dissipation in high-density layout is solved, meanwhile, the cost of the whole antenna module can be reduced to a certain extent due to the fact that the beam forming chips are saved, meanwhile, the actual equivalent omnidirectional radiation power of the antenna array can reach a quite level, and the normal operation of the antenna array is ensured.
For clarity of description of the present solution, the following describes the structure and functions of each component in the antenna module, and the implementation principle.
The structure of the antenna module is shown in fig. 4 to 5B, and in combination with fig. 3B, the antenna module includes: a beam forming chip 13, an antenna array 121 and a power dividing network 15.
The power distribution network 15 is electrically connected to the beamforming chip 13 and configured to transmit signals to the beamforming chip 13. Each beam forming chip 13 is electrically connected with the plurality of antenna arrays 121, each beam forming chip 13 is provided with a plurality of receiving and transmitting channels connected with the plurality of antenna arrays 121, the plurality of receiving and transmitting channels are electrically connected with the plurality of antenna arrays in a one-to-one correspondence manner through a plurality of feeder lines, and the beam forming chip 13 is composed of a part of power division network, a receiving and transmitting switch, an amplifier and a phase shifter. The beam forming chip is configured to realize the function of amplitude modulation and phase modulation for the antenna array, for example, the beam forming chip can independently control the amplitude and the phase of each channel, so that the indexes such as the direction, the gain, the side lobe level, the EIRP and the like of the beam of the antenna array are flexibly regulated and controlled.
The principle of Beamforming is shown in fig. 6 to 10, and Beamforming (Beamforming) is also called Beamforming. The beamforming technique allows signals at certain angles to obtain constructive interference and signals at other angles to obtain destructive interference by adjusting parameters of the fundamental elements of the phased array. Beamforming can be used for both signal transmitting and signal receiving terminals.
Fig. 6 is a schematic diagram of a specific antenna direction in a spherical coordinate system 200, where θ is defined as the angle between the antenna direction and the z-axis, and Φ is defined as the angle between the antenna direction and the x-axis. In the antenna array 12, a plurality of antenna arrays 121 are arranged in an array, and the distance between every two adjacent antenna arrays is d, as shown in fig. 7, in order to realize beam forming, the phase difference of each adjacent antenna feed source must be ensured to be dcos theta; as shown in fig. 8, phase superposition in a certain direction of the antenna can be achieved through phase modulation, so that gain improvement in the pointing direction of the antenna is realized; as shown in fig. 9, the distance between two adjacent antennas is d, where λ/2 is chosen in general, mainly because to ensure that the sidelobe level is low enough, the sidelobes will rise once above this value, and the coupling between the antenna elements will be enhanced once below this value; as shown in fig. 10, the gain effect achieved by the beam is maximum at 0 ° and 30 °.
In some embodiments, as shown in fig. 5A and 5B, the plurality of antenna elements 121 and the beamforming chip are respectively located on two sides of the substrate 1, and illustratively, the substrate is a printed circuit board (PCB, printed Circuit Board), the printed circuit board is a multi-layer board, the plurality of power lines connecting the antenna elements 121 and the beamforming chip 13 are typically required to be replaced by a high-density interconnection (HDI) process,
In some embodiments, as shown in fig. 11, the antenna array is configured as a microstrip antenna, and a slot antenna is typically used as the microstrip antenna in the 5G millimeter wave, where the microstrip antenna (PATCH ANTENNA) is composed of a patch, a slot, and a microstrip feeder. In fig. 11, the left surface layer is a patch, the second layer is a slit, and the third layer is a feeder. The right side of fig. 11 is a perspective view, from top to bottom, of a patch layer 301, a slot layer 302, and a feeder layer 303, where the slot presents an i-shape.
The feeder layer is derived from the beam forming chip 13, and the beam forming chip 13 is electrically connected to the antenna element 121 through a feeder line.
In some embodiments, the power distribution network 15 includes a plurality of power splitters 151 and connection cables 152 (see fig. 1), and the power distribution network 15 may be a T-junction power distribution network or a conventional wilkins power distribution network (see fig. 13), for example.
The power divider is called Power divider, which is a device for dividing one input signal energy into two paths or multiple paths to output equal or unequal energy, and can also reversely combine multiple paths of signal energy into one path to output, and can also be called a combiner at the moment. Certain isolation should be ensured between the output ports of one power divider. The power divider is generally divided into one-by-two (one input and two output), one-by-three (one input and three output) and the like by output. In the embodiment shown in fig. 3A and 3B, the power splitters in the power splitting network are one-to-two power splitters.
As shown in fig. 12, which is a circuit configuration diagram of an equal-division one-division two-power divider, the power divider includes: an input line 1511, two 1/4 wavelength impedance transformation lines 1512, two output lines 1513, and an isolation resistor 1514. The input line 1511 impedance is configured to be Z0; the impedance of the two-way 1/4 wavelength impedance transformation line 1512 is configured asThe impedance of the two output lines 1513 is configured to be Z0; the isolation resistor 1514 is configured to be 2×z0.
In some embodiments, as shown in fig. 13, the power division network includes an input port and a plurality of output ports, the output ports are electrically connected with the beam forming chip, and the impedance of a part of structures in the power division network is exemplified by that the impedance Z0 of the input line 1511 and the output line 1513 is 50Ω; isolation resistor 1514 is 100Ω; the 1/4 wavelength conversion line 1512 has an impedance of 70.7Ω.
As one possible design, as shown in fig. 3B, in the antenna module 1000, the antenna array 121 is configured as a dual-polarized antenna array, the beam forming chip 13 is configured as a dual-polarized beam forming chip, and the power dividing network 15 is electrically connected to the N beam forming chips, and each output port of the power dividing network 15 is illustratively electrically connected to one beam forming chip; the power division network 15 is configured as a dual-polarized power division network, wherein a solid line network represents one power division network, a dotted line network represents the other power division network, the two power division networks are taken as a group of power division networks, and are two polarized power division networks, the two power division networks respectively comprise a plurality of output ports, and the positions of the output ports of one power division network and the output ports of the other power division network are in one-to-one correspondence. Each beamforming chip 13 is electrically connected to corresponding output ports of two polarized power splitting networks 15, respectively.
The above describes the basic structure of the antenna array, the beam forming chip and the power dividing network included in the antenna module, and next describes the implementation principle of "equivalent omni-directional radiation power reaching the same magnitude by reducing the number of beam forming chips 13".
By simulation analysis it was found that in the case of a full array layout of the antenna array, a considerable level of EIRP can be achieved as well by reducing the number of beam forming chips 13. Taking a full array of 8×8 as an example, as shown in fig. 14 to 19, the following cases are classified:
1) Full array;
2) The excitation amplitude of the antenna array at the corner is 10dB smaller than ideal;
3) The excitation amplitude of one array element in the center of the array is 10dB smaller than that of an ideal array;
4) The excitation amplitude of the array at four angles of the antenna array is 10dB smaller than ideal;
5) The excitation amplitude of the four antennas in the center of the antenna array is 10dB smaller than that of an ideal antenna;
6) Sixteen array elements in the center of the antenna array are excited to have an amplitude 10dB smaller than ideal.
In fig. 14 to 19, the antenna element 121 represents an antenna element normally controlled by a beam forming chip, and the antenna element 17 represents an antenna element not controlled by a beam forming chip, wherein the antenna element 17 not controlled by a beam forming chip is represented by an excitation amplitude having an error of-10 dB in simulation.
The results shown in table 1 were obtained by simulation of the antenna array in the above case.
TABLE 1 simulation results of the effect of beamforming amplitude error on system performance
As can be seen from table 1, when there is an error in the antenna array excitation amplitude in beamforming, the following conclusion is drawn:
1. There is substantially no impact on the system EVM (error vector magnitude ) and ACPR (adjacent channel power ratio, adjacent Channel Power Ratio).
The error vector (comprising the vector of amplitude and phase) is the vector difference between the ideal error-free reference signal and the actual transmitted signal at a given moment, and can comprehensively measure the amplitude error and the phase error of the modulated signal; the error vector magnitude is defined as the ratio of the root mean square value of the average power of the error vector signal to the root mean square value of the average power of the ideal signal and is expressed in percent. The smaller the EVM, the better the signal quality.
Wherein, the adjacent channel power ratio refers to the ratio of the average power of adjacent frequency channels and the average power of the current used channel; the adjacent channel power ratio is a common index for measuring the linearity of a transmitting system, and can be used for describing the out-of-band spectrum distortion characteristic of a signal caused by nonlinear distortion of a power amplifier, namely the leakage degree of main power to an adjacent channel. In practice, the measurement is often simplified with a third order intermodulation (IMD 3) to measure the current output signal.
2. The EIRP loss is 1.49 (dB) in the case of failure of 1/4 of the antenna array at the center of the antenna array, i.e. the main lobe power obtained with full array differs from the main lobe power obtained with a central sixteen array amplitude error of-10 dB by 54.74-53.25=1.49 (dB).
3. In different cases, there will be some shift in beam pointing, and as the number of elements smaller than the ideal excitation amplitude increases, there will be a tendency for the main lobe power to decrease, but the effect will not be very pronounced.
The following demonstrates by calculation "equivalent omni-directional radiation power of the same order is achieved by reducing the number of beam forming chips 13".
According to the calculation formula of EIRP:
EIRP (dBm) =pave+10log (number of beamforming chips) +10log (number of antenna elements) +gain ANT
The final unit of EIRP in the above formula is dBm, but the logarithmic power cannot be directly added to obtain the final result, so in order to explain this problem, the theoretical basis can be clarified by quantizing the corresponding value.
The following refines according to the output power level of the common beamforming chip and the array size in the simulation diagram:
1. The linear output power Pave of the channel is calculated according to 11.6 dBm;
2. The number of the beam forming chips of the full array is calculated according to 64;
3. The antenna array of the full array is defined as 64;
4. The Gain ANT of the antenna array is calculated at 7 dB.
The calculation formula for bringing the above parameters into the EIRP can be calculated to obtain:
Under the condition that the antenna array is full (8 x 8), and all antenna elements are controlled by a beam forming chip, the calculated EIRP of the antenna array is 54.72 (dBm).
In the case of full array (8×8) of the antenna array, and the excitation of the central 16 antenna elements is adjusted to-50 dBm (simulating the situation that the central 16 elements are not excited), i.e. the 16 antenna elements are not controlled by the beamforming chip, the calculated EIRP of the antenna array is 53.47 (dBm).
It is known that the EIRP of the central 16 antenna elements of the antenna array is different by 1.25dB when the antenna array is not controlled by the beamforming chip compared with when the antenna array is fully controlled by the beamforming chip.
The simulation and calculation results can be obtained by reducing the number of the beam forming chips 13 to achieve the equivalent omnidirectional radiation power with the same magnitude, that is, the scheme of the sparse source mentioned in the embodiment can achieve the cost reduction and solve the heat dissipation problem on the premise of ensuring the equivalent omnidirectional radiation power with the same magnitude by reducing the number of the beam forming chips 13 under the condition of ensuring the scale of the antenna array is unchanged. Some embodiments of the arrangement of the beamforming chips and the antenna array sub-groups in the antenna module are described below.
In some embodiments, as shown in fig. 3B, among the plurality of antenna array subgroups 14, the antenna array subgroup 14 connected to the beamforming chip 13 is a first antenna array subgroup 141, and the antenna array subgroup 14 except for the first antenna array subgroup 141 is a second antenna array subgroup 142, that is, the plurality of antenna arrays 121 in the second antenna array subgroup 142 are not controlled by the beamforming chip, and the second antenna array subgroup 142 is not connected to the corresponding beamforming chip.
It should be noted that the plurality of antenna elements 121 in the second antenna array subgroup 142 may be subjected to the mutual coupling action of the antenna elements 121 in the first antenna array subgroup 141 adjacent thereto, resulting in a certain gain.
The number of the antenna array sub-groups 14 adjacent to the at least one second antenna array sub-group 142 in the row direction X and the column direction Y is greater than or equal to the number of the antenna array sub-groups 14 adjacent to any one of the first antenna array sub-groups 141 in the row direction X and the column direction Y, the row direction X and the column direction Y being a row direction and a column direction in which the plurality of antenna arrays 121 are arranged. Wherein the number of antenna array subunits 14 adjacent in the row direction X and the column direction Y refers to the sum of the number of antenna array subunits 14 adjacent in the row direction X and the number of antenna array subunits 14 adjacent in the column direction Y.
As shown in fig. 3B, taking as an example the second antenna array subgroup 142 located at the middle position of the antenna array 12, the number D1 of the antenna array subgroups 14 adjacent to the second antenna array subgroup 142 in the row direction X and the column direction Y is 4, and taking as an example the first antenna array subgroup 141 located at the middle position of the antenna array 12, the number D2 of the antenna array subgroups 14 adjacent to the first antenna array subgroup 141 in the row direction X and the column direction Y is 4, and D1 and D2 are equal. Taking the first antenna array subgroup 141 located at the lower right corner of the antenna array 12 as an example, the number D3 of antenna array subgroups 14 adjacent to the first antenna array subgroup 141 in the row direction X and the column direction Y is 2, and D1 is greater than D3.
I.e. at least one second antenna array subgroup 142 is located in the middle of the antenna array, with adjacent antenna array subgroups 14 in both the row direction X and the column direction Y.
In the above embodiment, in order to solve the problem of heat dissipation, the positioning principle of the beamforming chip in the antenna array is that no beamforming chip is provided in the area with higher heat density, that is, no beamforming chip is provided in the area with denser chips. And the middle position of the antenna array is a region with higher heat density, and based on the setting principle, at least one second antenna array subgroup 142 is positioned at the middle position of the antenna array, so that the radiating effect can be achieved to a greater extent, and win-win effect of reducing the cost and the radiating requirement is achieved.
In addition, since the plurality of antenna arrays 121 in the second antenna array subgroup 142 can receive the mutual coupling action of the antenna arrays 121 in the first antenna array subgroup 141 adjacent to the second antenna array subgroup, a certain gain is generated, and the second antenna array subgroup 142 is located at the middle position, even if the beam forming chip corresponding to the second antenna array subgroup 142 is removed, the second antenna array subgroup 142 can generate the gain under the action of the surrounding first antenna array subgroup 141, so that the integral EIRP of the antenna array can reach a considerable level.
In some examples, as shown in fig. 3B, there is at least one first antenna array subgroup 141 between any two second antenna array subgroups 142 along the row direction X and the column direction Y.
Illustratively, the plurality of antenna array sub-groups 14 into which the antenna array 12 is divided are arranged in 4 rows and 8 columns, with two first antenna array sub-groups 141 being present between two second antenna array sub-groups 142 along the row direction X; in the second column antenna array subgroup, there is one first antenna array subgroup 141 between two second antenna array subgroups 142 along the column direction Y. That is, any two second antenna array sub-groups 142 are not adjacent, so that as many second antenna array sub-groups 142 as possible are subjected to the mutual coupling of the surrounding first antenna array sub-groups 141, resulting in a considerable gain.
In some embodiments, on the premise that the difference between the ideal equivalent omni-directional radiation power of the antenna array and the actual equivalent omni-directional radiation power of the antenna array is less than or equal to a set value, the number relationship between N and M may be: (3/5) M is less than or equal to N is less than or equal to (7/8) M.
In order to facilitate understanding of the above-described quantitative relationship between N and M, several examples corresponding to n= (3/4) M or n= (7/8) M are provided below, respectively.
In some examples, as shown in fig. 20 and 21, the antenna array 12 includes a plurality of antenna array sub-group elements 16, each antenna array sub-group element 16 including four adjacent antenna array sub-groups 14; of the four antenna array subunits 14 in each antenna array subunit unit, three antenna array subunits 14 are first antenna array subunits 141 and one antenna array subunit 14 is second antenna array subunit 142.
In fig. 20 and 21, white squares represent removed beamforming chips, in the antenna array 12, every four adjacent antenna array sub-groups 14 are divided into one antenna array sub-group unit 16, illustratively, eight antenna array sub-group units 16 are included in the antenna array 12, one antenna array sub-group unit 16, three antenna array sub-groups 14 are the first antenna array sub-group 141, one antenna array sub-group 14 is the second antenna array sub-group 142, that is, in each antenna array sub-group unit 16, the beamforming chip corresponding to one antenna array sub-group 14 is removed, and the location of the removed beamforming chip is not limited, and in some examples, the above-mentioned beamforming chip location setting principle in the antenna array is satisfied.
The scheme is an embodiment corresponding to n= (3/4) M. Fig. 20 and 21 are only two exemplary combinations of the setting positions of the N beamforming chips, and other various schemes of setting the setting positions of the N beamforming chips fall within the scope covered by this embodiment.
In the above embodiment, 1/4 of the beamforming chip is removed from the antenna module 1000, so that n= (3/4) M is removed, and thus, the problem of heat dissipation of the antenna board can be solved substantially under the condition that EIRP is reduced by about 1.5dB, and the method is suitable for the condition that the heat dissipation pressure of the antenna module is high.
In some examples, as shown in fig. 22 and 23, the antenna array 12 includes a plurality of antenna array sub-group elements 16, each antenna array sub-group element 16 including eight adjacent antenna array sub-groups 14; of the eight antenna array subunits 14 in each antenna array subunit unit, seven antenna array subunits 14 are first antenna array subunits 141 and one antenna array subunit 14 is a second antenna array subunit 142.
In fig. 22 and 23, white squares represent removed beamforming chips, in the antenna array 12, each eight adjacent antenna array sub-groups 14 are divided into one antenna array sub-group unit 16, illustratively, four antenna array sub-group units 16 are included in the antenna array 12, one antenna array sub-group unit 16, seven antenna array sub-groups 14 are the first antenna array sub-group 141, one antenna array sub-group 14 is the second antenna array sub-group 142, that is, in each antenna array sub-group unit 16, the beamforming chip corresponding to one antenna array sub-group 14 is removed, and the location of the removed beamforming chip is not limited, and in some examples, the above-mentioned beamforming chip location setting principle in the antenna array is satisfied.
The scheme is an embodiment corresponding to n= (7/8) M. Fig. 22 and 23 are only two exemplary combinations of the setting positions of the N beamforming chips, and other various arrangements of the setting positions of the N beamforming chips are included in the scope of the present embodiment.
In the above embodiment, 1/8 of the beamforming chips are removed from the antenna module 1000, so that n= (7/8) M is obtained, and thus the heat dissipation problem can be well solved by removing fewer beamforming chips.
The above two embodiments are only typical forms of the sparse source scheme, as long as the antenna array is full and the beamforming chips 13 are in the category of sparse sources, i.e. as long as the number of beamforming chips is less than the number of antenna array subsets, the present invention is not limited to the foregoing embodiments.
The number of beamforming chips to be reduced is determined according to the reduction degree of the system EIRP. Illustratively, in addition to the case of removing 1/4 of the beamforming chips and removing 1/8 of the beamforming chips in the antenna module 1000 described in the above embodiment, in the case of the above array size, if EIRP is allowed to decrease to 1.8dB under the full array, then the number of beamforming chips of 1/3 may be removed in the case of the full array, where n= (2/3) M; if the EIRP is allowed to drop by 2.2dB under this scale array, then the number of 2/5 beamforming chips can be removed, where n= (3/5) M. Both 1.8dB and 2.2dB are less than the set point.
According to the antenna module provided by the embodiments of the invention, under the condition that the number of antenna elements in the antenna array is unchanged, part of active devices are removed, so that the number of beam forming chips is reduced, the problem of difficult heat dissipation in high-density layout is solved on the premise of ensuring the same EIRP level, and meanwhile, the cost of the whole machine can be reduced to a certain extent.
In addition, the substrate in the antenna module is a printed circuit board, more space is vacated for the wiring in the beam forming framework by reducing the number of active devices, so that the wiring interconnection process of the printed circuit board is not limited any more, the development cost of the printed circuit board is reduced, and the competitiveness of the product is improved.
Some embodiments of the present application also provide a communication device, as shown in fig. 24, where the communication device mainly relates to a base station active antenna Unit (AAU, active Antenna Unit) product in the communication field, and in some examples, the communication device 500 includes: antenna module 1000, radio frequency unit 2000, casing 3000. The antenna module 1000 and the rf unit 2000 are disposed in the housing 3000, and the rf unit 2000 is connected to the antenna module 1000. When the communication device 500 works, the radio frequency unit 2000 sends a signal to the antenna module 1000 through the input port 153 (as shown in fig. 20-23) of the power division network 15, so as to complete the communication function with the outside.
The foregoing is merely illustrative of specific embodiments of the present application, and the scope of the present application is not limited thereto, but any changes or substitutions within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims (10)
1. An antenna module, comprising:
an antenna array comprising a plurality of antenna elements, the plurality of antenna elements being divided into M antenna element groups;
each beam forming chip is connected with a plurality of antenna arrays in one antenna array subgroup;
wherein M > N, M and N are positive integers.
2. The antenna module of claim 1, wherein,
The M antenna array subgroups are arranged in an array manner;
among the M antenna array subgroups, the antenna array subgroup connected with the beam forming chip is a first antenna array subgroup, and the antenna array subgroups except for the first antenna array subgroup are second antenna array subgroups;
The number of the antenna array subgroups adjacent to the at least one second antenna array subgroup in the row direction and the column direction is larger than or equal to the number of the antenna array subgroups adjacent to any one first antenna array subgroup in the row direction and the column direction, and the row direction and the column direction are the row direction and the column direction of the M antenna array subgroups.
3. The antenna module of claim 2, wherein there is at least one first antenna array subgroup between any two second antenna array subgroups along the row direction or the column direction.
4. An antenna module as claimed in claim 2 or 3, wherein,
The quantitative relationship between N and M satisfies:
The difference value between the ideal equivalent omnidirectional radiation power of the antenna array and the actual equivalent omnidirectional radiation power of the antenna array is smaller than or equal to a set value;
The ideal equivalent omni-directional radiation power of the antenna array is equivalent omni-directional radiation power obtained by the antenna array under the control of M beam forming chips, and the actual equivalent omni-directional radiation power of the antenna array is equivalent omni-directional radiation power obtained by the antenna array under the control of N beam forming chips.
5. The antenna module of claim 4, wherein the set point is 2dB to 3dB.
6. The antenna module of claim 5, wherein,
The number relationship between N and M is as follows: (3/5) M is less than or equal to N is less than or equal to (7/8) M.
7. The antenna module of claim 6, wherein n= (3/4) M;
The antenna array comprises a plurality of antenna array subgroup units, wherein each antenna array subgroup unit comprises four adjacent antenna array subgroups;
and among the four antenna array subgroups in each antenna array subgroup unit, three antenna array subgroups are the first antenna array subgroup, and one antenna array subgroup is the second antenna array subgroup.
8. The antenna module of claim 6, wherein n= (7/8) M;
the antenna array comprises a plurality of antenna array subgroup units, wherein each antenna array subgroup unit comprises eight adjacent antenna array subgroups;
seven antenna array subgroups among eight antenna array subgroups in each antenna array subgroup unit are the first antenna array subgroup, and one antenna array subgroup is the second antenna array subgroup.
9. An antenna module according to any one of claims 1-3, characterized in that the antenna array is configured as a dual polarized antenna array; the beam forming chip is configured as a dual-polarized beam forming chip;
The antenna module further comprises a power division network, and the power division network is electrically connected with the N beam forming chips respectively; the power distribution network is configured as a dual polarized power distribution network.
10. A communication device comprising an antenna module according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211275795.8A CN117954868A (en) | 2022-10-18 | 2022-10-18 | Antenna module and communication equipment |
| PCT/CN2023/123858 WO2024083003A1 (en) | 2022-10-18 | 2023-10-10 | Antenna module and communication device |
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| KR20200120352A (en) * | 2019-04-12 | 2020-10-21 | 삼성전자주식회사 | An antenna module and an electronic device including the antenna module |
| CN112187309A (en) * | 2019-06-13 | 2021-01-05 | 中兴通讯股份有限公司 | Millimeter wave transceiver |
| CN209843935U (en) * | 2019-06-17 | 2019-12-24 | Oppo广东移动通信有限公司 | Electronic device |
| CN111722189B (en) * | 2020-06-05 | 2023-01-10 | 东方红卫星移动通信有限公司 | Multi-beam millimeter wave phased array chip and manufacturing method thereof |
| JP2023543068A (en) * | 2020-09-28 | 2023-10-12 | 華為技術有限公司 | Antenna arrays, equipment, and wireless communication devices |
| CN112787684B (en) * | 2021-01-22 | 2024-05-24 | 苏州硕贝德创新技术研究有限公司 | Front-end module for 5G millimeter waves and 5G millimeter wave communication system |
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