CN117954361A - Purging mechanism applied to wafer loader - Google Patents
Purging mechanism applied to wafer loader Download PDFInfo
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- CN117954361A CN117954361A CN202410349803.1A CN202410349803A CN117954361A CN 117954361 A CN117954361 A CN 117954361A CN 202410349803 A CN202410349803 A CN 202410349803A CN 117954361 A CN117954361 A CN 117954361A
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- air tap
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- 230000007246 mechanism Effects 0.000 title claims abstract description 58
- 238000010926 purge Methods 0.000 title claims abstract description 32
- 238000007667 floating Methods 0.000 claims abstract description 61
- 230000003028 elevating effect Effects 0.000 claims abstract 8
- 230000006978 adaptation Effects 0.000 claims abstract 2
- 210000001503 joint Anatomy 0.000 claims description 9
- 238000003032 molecular docking Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000036316 preload Effects 0.000 claims 1
- 238000010408 sweeping Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 58
- 239000007789 gas Substances 0.000 description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000007789 sealing Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 101100153581 Bacillus anthracis topX gene Proteins 0.000 description 1
- 101150041570 TOP1 gene Proteins 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer conveying, and particularly relates to a purging mechanism applied to a wafer loader. Including transportation desktop, air cock elevating system and the air cock that floats, wherein be equipped with on the transportation desktop with the bottom air inlet looks adaptation of the wafer transport box that bears the weight of the interface, air cock elevating system sets up in the bottom of transportation desktop, and be connected with the air cock that floats that passes the interface on the transportation desktop, air cock elevating system is used for driving the air cock that floats and goes up and down, make the air cock that floats dock or separate with the bottom air inlet of wafer transport box, the air cock that floats has flexible compensation mechanism, can automatic compensation dock position deviation through flexible compensation mechanism, the air cock that floats is used for carrying the shielding gas in the wafer transport box. The floating air tap is tightly attached to the bottom air inlet of the wafer transport box, so that air leakage is avoided, and vibration is small; the transportation desktop has various interface forms, good suitability and compatibility.
Description
Technical Field
The invention belongs to the technical field of wafer conveying, and particularly relates to a purging mechanism applied to a wafer loader.
Background
The trend toward smaller and thinner chip fabrication has led to pollution control becoming more and more important, and the presence of moisture in the silicon wafer carrier can lead to defects such as cracking of the thin film on the silicon wafer surface. Therefore, the silicon wafer transport box is an effective method for preventing the silicon wafers in the silicon wafer transport box from being polluted by the inside and the outside by filling the inside of the silicon wafer transport box with nitrogen through the bottom air inlet before the silicon wafer transport box is transported and stored. At present, most products drive the lifting of the purging air faucet through the expansion and contraction of the air cylinder, so that the purging air faucet is tightly communicated with the air inlet at the bottom of the silicon wafer transport box, and nitrogen is conveyed to the silicon wafer transport box through the air inlet, thereby reducing the humidity and the oxygen concentration in the silicon wafer transport box and playing a role in protecting the silicon wafer.
At present, the laminating of blowing air cock and silicon wafer transport box bottom air inlet interface in the current gas blowing unit does not possess floatability, can have the risk of gas leakage, still has occupation space simultaneously and vibrates great problem. In addition, the structure of the conventional load port device has the defects of single interface form and no compatibility.
Disclosure of Invention
The invention aims to solve the problems that the bonding of a purge air tap in the conventional gas purging unit and an air inlet interface at the bottom of a silicon wafer transport box does not have floatability, the risk of air leakage exists, meanwhile, the problems of large occupied space and large vibration exist, and the problems that the interface form is single and the compatibility cannot be achieved in the structure of the conventional loading port device are solved.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the invention provides a purging mechanism applied to a wafer loader, which comprises a transportation tabletop, an air tap lifting mechanism and a floating air tap, wherein an interface matched with a bottom air inlet of a carried wafer transportation box is arranged on the transportation tabletop, the air tap lifting mechanism is arranged at the bottom of the transportation tabletop and is connected with the floating air tap penetrating through the interface on the transportation tabletop, the air tap lifting mechanism is used for driving the floating air tap to lift so as to enable the floating air tap to be in butt joint or separation with the bottom air inlet of the wafer transportation box, the floating air tap is provided with a flexible compensation mechanism, the butt joint position deviation can be automatically compensated through the flexible compensation mechanism, and the floating air tap is used for conveying protective gas into the wafer transportation box.
The floating air tap further comprises an air tap top cover, a shell assembly and an air tap core, wherein the air tap core is installed in the shell assembly through the flexible compensation mechanism, so that the air tap core has the freedom degree of axial movement and horizontal deflection, one end of the air tap core is connected with the air tap top cover, and the air tap top cover is used for being in butt joint with a bottom air inlet of the wafer transport box.
The flexible compensation mechanism comprises a flexible angle compensation structure and an elastic element, wherein the flexible angle compensation structure is sleeved on the air tap core and is in sliding fit with the shell assembly, and the flexible angle compensation structure is used for compensating the angle deviation of the air tap core in the horizontal direction; the elastic element is limited between the flexible angle compensation structure and the housing assembly, and the elastic element is used for providing axial pretightening force.
The shell assembly comprises a sleeve, an air tap shell and an air tap end cover, wherein the sleeve is arranged on the inner side of the air tap shell and is axially limited through the air tap end cover, and the flexible angle compensation structure is in sliding fit with the inner wall of the sleeve; and two ends of the elastic element are respectively abutted with the flexible angle compensation structure and the air nozzle end cover.
The flexible angle compensation structure is a knuckle bearing; the elastic element is a spring.
The air tap top cover is in threaded connection with the air tap core, and the end part of the air tap top cover is sealed with the air tap core through a sealing element sleeved on the air tap core.
The air tap lifting mechanism comprises a linear driving source, a guiding component and a lifting plate, wherein the linear driving source is arranged on the transportation tabletop, the output end of the linear driving source is connected with the lifting plate, the linear driving source is used for driving the lifting plate to move up and down, the lifting plate is connected with the transportation tabletop through the guiding component, the guiding component provides guiding for the up-and-down movement of the lifting plate, and two ends of the lifting plate are respectively connected with two floating air taps.
The guide assembly comprises a guide shaft and a linear bearing, wherein the linear bearing is embedded on the lifting plate, the guide shaft is in sliding fit with the linear bearing, and the upper end of the guide shaft is fixedly connected with the transportation tabletop.
The air tap lifting mechanisms are two groups, and four floating air taps connected with the two groups of air tap lifting mechanisms are arranged in a trapezoid or rectangle.
The interface on the transportation desktop comprises a trapezoid interface I, a trapezoid interface II, a rectangular interface I, a rectangular interface II, a front interface I and a front interface II, wherein the trapezoid interface I, the rectangular interface II and the trapezoid interface II are sequentially arranged at one end of the transportation desktop, and the front interface I and the front interface II are arranged at the other end of the transportation desktop;
The front interface I, the front interface II, the rectangular interface I and the rectangular interface II are in a rectangular arrangement form;
The front interface I, the front interface II, the trapezoid interface I and the trapezoid interface II are in a trapezoid arrangement mode.
The invention has the advantages and beneficial effects that:
1. the purging mechanism applied to the wafer loader provided by the invention has the advantages that the floating air nozzle is tightly attached to the bottom air inlet of the wafer transport box, so that the air leakage phenomenon is avoided, and the vibration is small; the transportation desktop has various interface forms, good suitability and compatibility.
2. The floating air tap has the angle compensation function in the horizontal direction and the displacement compensation function in the vertical direction, and when the silicon wafer transport box is inclined in the horizontal direction, the flexible angle compensation structure in the floating air tap can automatically change the angle, so that the floating air tap is always aligned with the bottom air inlet of the wafer transport box; when the wafer transport case has displacement deviation in the vertical direction, the elastic element plays a role at the moment, so that the floating air tap and the bottom air inlet of the wafer transport case are guaranteed to be always well attached, and the risk of air leakage is reduced.
Drawings
Fig. 1 is a schematic structural view of a purging mechanism for a wafer loader according to the present invention
FIG. 2 is an isometric view of an air tap lifting mechanism according to the present invention;
FIG. 3 is a front view of the air tap lifting mechanism of the invention;
FIG. 4 is a cross-sectional view of a floating air cap of the present invention;
FIG. 5 is an exploded view of a floating air cap of the present invention;
FIG. 6 is a schematic diagram illustrating the displacement compensation of a floating nozzle according to the present invention;
FIG. 7 is a schematic diagram of an interface of a transport desktop according to the present invention;
FIG. 8 is a schematic view of the installation positions of the transportation table and the floating air nozzle according to the present invention.
In the figure: 1. the gas cap comprises a transportation table top, 101, a trapezoid interface I, 102, a trapezoid interface II, 103, a rectangular interface I, 104, a rectangular interface II, 105, a front interface I, 106, a front interface II, 2, a floating gas cap, 201, a gas cap, 202, a sealing element, 203, a flexible angle compensation structure, 204, an elastic element, 205, a sleeve, 206, a gas cap housing, 207, a set screw, 208, a gas cap, 209, a gas cap core, 210, a gas cap joint, 3, a cylinder connecting plate, 4, a cylinder, 5, a guide shaft, 6, a linear bearing, 7.L type connecting plate, 71, a long L type connecting plate, 72, a short L type connecting plate, 8, a linear bearing connecting plate, 9, a cylinder joint, 10, a cylinder joint, 11, a gas cap joint, 12, a set screw, 14 and a wafer transportation box.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the invention provides a purging mechanism applied to a wafer loader, which comprises a transportation table top 1, an air nozzle lifting mechanism and a floating air nozzle 2, wherein a wafer transportation box 14 is placed above the transportation table top 1, and the wafer transportation box 14 moves along with the transportation table top 1 to assist in carrying and storing silicon chips. The transportation desktop 1 is provided with an interface matched with the bottom air inlet of the wafer transportation box 14, the air tap lifting mechanism is arranged at the bottom of the transportation desktop 1 and connected with the floating air tap 2 penetrating through the interface on the transportation desktop 1, the air tap lifting mechanism is used for driving the floating air tap 2 to lift, so that the floating air tap 2 is in butt joint with or separated from the bottom air inlet of the wafer transportation box 14, the floating air tap 2 is used for conveying protective gas into the wafer transportation box 14, the floating air tap 2 is provided with a flexible compensation mechanism, the butt joint position deviation can be automatically compensated through the flexible compensation mechanism, the floating air tap can be closely attached to the bottom air inlet of the wafer transportation box 14, and air leakage is avoided.
As shown in fig. 2 and 3, in the embodiment of the present invention, the air tap lifting mechanism includes a linear driving source, a guiding component and a lifting plate, wherein the linear driving source is disposed on the transportation table top 1, and the output end of the linear driving source is connected with the lifting plate, the linear driving source is used for driving the lifting plate to move up and down, the lifting plate is connected with the transportation table top 1 through the guiding component, the guiding component provides guiding for the up and down movement of the lifting plate, and two ends of the lifting plate are respectively connected with two floating air taps 2.
In the embodiment of the invention, the guide assembly comprises a guide shaft 5 and a linear bearing 6, wherein the linear bearing 6 is embedded on the lifting plate, the guide shaft 5 is in sliding fit with the linear bearing 6, and the upper end of the guide shaft is fixedly connected with the transportation table top 1. The guide shaft 5 and the linear bearing 6 are matched, so that the lifting process of the floating air nozzle 2 is stable, and the clamping stagnation phenomenon is prevented.
Specifically, the linear driving source is an air cylinder 4, the air cylinder 4 is connected with the bottom of the transportation table top1 through an air cylinder connecting plate 3, the air cylinder 4 is connected with an external air source through an air cylinder connector 10, the air cylinder connector 10 is fixed on the air cylinder 4 through threads, and the air cylinder 4 outputs power in the vertical direction. The lifting plate comprises a linear bearing connecting plate 8 and two L-shaped connecting plates 7 respectively connected to two ends of the linear bearing connecting plate 8, wherein the linear bearing connecting plate 8 is connected with a cylinder rod of the cylinder 4 through a cylinder joint 9, linear bearings 6 respectively positioned on two sides of the cylinder 4 are arranged on the linear bearing connecting plate 8, and the linear bearing connecting plate 8 is guided through two guide shafts 5. The two floating air nozzles 2 are respectively arranged on the two L-shaped connecting plates 7 through fixing screws 12, as shown in figure 8. The embodiment adopts a one-to-two structure, namely, one group of air cylinders 4 drives the two groups of floating air nozzles 2 to lift, the structure is more compact, the consistency of the lifting actions of the two groups of floating air nozzles 2 is ensured, the clamping stagnation phenomenon is avoided, the vibration is reduced, and the manufacturing cost is reduced. Preferably, the cylinder joint 9 is a floating joint to compensate the position error of the floating air nozzles 2 at two sides.
When purging is needed, the cylinder 4 contracts to drive the lifting plate upwards, and the lifting plate is fixed with the floating air nozzle 2, so that the floating air nozzle 2 is in butt joint with the bottom air inlet of the wafer transport case 14. When the purging is stopped, the pneumatic control is omitted from the air cylinder 4, the cylinder rod of the air cylinder 4 stretches out under the action of weight, the floating air tap 2 descends, and at the moment, the floating air tap 2 is separated from the bottom air inlet of the wafer transport case 14.
In the embodiment of the present invention shown in fig. 2 and 8, the air tap lifting mechanisms are two groups, and four floating air taps 2 connected with the two groups of air tap lifting mechanisms are arranged in a trapezoid or rectangle. The length of the L-shaped connecting plate 7 in two groups of air tap lifting mechanisms is different, wherein one group of air tap lifting mechanisms is a long L-shaped connecting plate 71, and the other group of air tap lifting mechanisms is a short L-shaped connecting plate 72.
As shown in fig. 4 to 6, in the embodiment of the present invention, the floating air tap 2 further includes an air tap cap 201, a housing assembly, an air tap core 209 and an air tap connector 210, wherein the air tap core 209 is installed in the housing assembly through a flexible compensation mechanism, so that the air tap core 209 has degrees of freedom of axial movement and horizontal deflection, two ends of the air tap core 209 are respectively connected with the air tap cap 201 and the air tap connector 210, the air tap connector 210 is used for being connected with an external air source, and the air tap cap 201 is used for being in butt joint with a bottom air inlet of the wafer transport case 14.
In the embodiment of the invention, the flexible compensation mechanism comprises a flexible angle compensation structure 203 and an elastic element 204, wherein the flexible angle compensation structure 203 is sleeved on the air nozzle core 209, the flexible angle compensation structure 203 is in sliding fit with the shell assembly, and the flexible angle compensation structure 203 is used for compensating the angle deviation of the air nozzle core 209 in the horizontal direction; the flexible angle compensation structure 203 can automatically adjust the angle of the floating air tap 2 according to the levelness of the wafer transport case 14 to perform angle compensation; when the bottom of the wafer transport case 14 is slightly inclined, the floating air tap 2 can be ensured to be always attached to the air inlet of the wafer transport case 14. The elastic element 204 is limited between the flexible angle compensation structure 203 and the housing assembly, and the elastic element 204 is used to provide an axial pre-tightening force for the docking of the air cap 201 with the air inlet at the bottom of the wafer carrier 14.
In the embodiment of the invention, the housing assembly comprises a sleeve 205, a gas cap housing 206 and a gas cap 208, wherein the sleeve 205 is disposed inside the gas cap housing 206, and is axially limited by the gas cap housing 208, the gas cap housing 208 is disposed at an opening end of the gas cap housing 206, and is fixedly connected with the gas cap housing 206 by a fixing screw 207, and both the bottom of the gas cap housing 206 and the gas cap housing 208 are provided with a central hole for the gas cap 209 to pass through. The flexible angle compensation structure 203 is in sliding fit with the inner wall of the sleeve 205; the two ends of the elastic element 204 are respectively abutted against the flexible angle compensation structure 203 and the air nozzle end cover 208, and after the assembly, the elastic element 204 is in a compressed state, provides a certain pretightening force, and can perform displacement compensation in the vertical direction; when the bottom of the wafer carrier 14 is deviated in vertical height, the air cap 201 can be always attached to the bottom air inlet end surface of the wafer carrier 14 due to the elastic element 204. In this embodiment, the flexible angle compensation structure 203 is a knuckle bearing; the elastic element 204 is a spring.
In the embodiment of the invention, the air tap top cap 201 is in threaded connection with the air tap core 209, and the end part of the air tap top cap 201 is sealed with the air tap core 209 through the sealing element 202 sleeved on the air tap core 209, so that the sealing element 202 prevents the purge gas from leaking from the threads, and the purge effect is ensured.
As shown in fig. 7 and 8, in the embodiment of the present invention, the interfaces on the transport desktop 1 include a trapezoid interface i 101, a trapezoid interface ii 102, a rectangular interface i 103, a rectangular interface ii 104, a front interface i 105, and a front interface ii 106, where the trapezoid interface i 101, the rectangular interface i 103, the rectangular interface ii 104, and the trapezoid interface ii 102 are sequentially arranged at one end of the transport desktop 1, and the front interface i 105 and the front interface ii 106 are opened at the other end of the transport desktop 1; the front interface I105, the front interface II 106, the rectangular interface I103 and the rectangular interface II 104 are in a rectangular arrangement form, and the interface is adapted to the wafer transport box 14 in the rectangular arrangement form; the front interface I105, the front interface II 106, the trapezoid interface I101 and the trapezoid interface II 102 are arranged in a trapezoid manner, and the interface is adapted to the wafer transport pod 14 in the trapezoid arrangement manner. Preferably, the transport table top 1 is of T-shaped construction. Because the transportation table top 1 is reserved with two types of interfaces, the wafer transportation box 14 compatible with the rectangular interface and the trapezoidal interface can be switched according to actual conditions by adjusting the installation position of the floating air nozzle 2.
The invention provides a purging mechanism applied to a wafer loader, which has the following working principle:
When purging is required, as shown in fig. 2-3, the purge gas flows through the cylinder joint 10 to drive the cylinder rod of the cylinder 4 to shrink, so that the linear bearing connecting plate 8 is driven to stretch. The linear bearing connecting plate 8 is limited by the positions of the linear bearing 6 and the guide shaft 5, so that the linear bearing connecting plate 8 can stably run in a lifting manner. Because one end of the L-shaped connecting plate 7 is connected with the linear bearing connecting plate 8, and the other end is connected with the floating air tap 2, when the linear bearing connecting plate 8 rises upwards, the floating air tap 2 is driven to rise. After the purging is finished, the cylinder rod of the cylinder 4 returns to the original position to drive the floating air tap 2 to descend.
As shown in fig. 4-6, the floating gas cap 2 is a key component for purging the wafer carrier, and the sleeve 205 is installed in the gas cap housing 206, so that the flexible angle compensation structure 203 is attached to the inner wall of the sleeve 205, and the flexible angle compensation structure 203 is ensured to slide smoothly in the sleeve 205. The elastic element 204 is arranged in the sleeve 205, one end of the elastic element 204 is attached to the end face of the flexible angle compensation mechanism 203, the other end of the elastic element 204 is in contact with the air tap end cover 208, the elastic element 204 is in a compressed state during assembly, displacement compensation can be performed in the vertical direction, and certain pretightening force is provided to ensure that the floating air tap 2 is attached to the bottom air inlet of the wafer transport case 14. The air tap core 209 passes the hole of flexible angle compensation mechanism 203, and the swing of certain angle can be realized for flexible angle compensation mechanism 203 hole to air tap core 209, can adjust according to the horizontal angle of wafer transport case 14 voluntarily, and the adjustment angle scope is ± 0.7, can guarantee that floating air tap 2 aligns with the bottom air inlet of wafer transport case 14 all the time, prevents that the purge gas from revealing. In addition, the sealing element 202 is added at the groove of the air tap core 209, and the air tap top cover 201 and the air tap core 209 are extruded through screw thread matching, so that the sealing ring element 202 is deformed, and the sealing effect is achieved.
The invention provides a purging mechanism applied to a wafer loader, the compensation function of a floating air tap 2 can realize the compensation in the horizontal direction and the vertical direction, the pre-tightening force is provided by a compression elastic element 204, and the floating air tap 2 is kept close to the bottom air inlet of a wafer transport box 14 in the vertical direction; the flexible angle compensation mechanism 203 can be used for adjusting a certain angle in the horizontal direction to compensate gaps generated by uneven bottoms of the wafer transport cases 14, so that the floating air faucet 2 is always well attached to the bottom air inlet of the wafer transport cases 14, and the risk of air leakage is reduced. In addition, the lifting plate and the transportation tabletop 1 are reserved at the installation positions of the wafer transportation box with the rectangular interface and the trapezoid interface, the rectangular interface and the trapezoid interface can be switched according to actual conditions, and the compatibility is good.
The foregoing is merely an embodiment of the present invention and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, expansion, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a be applied to sweeping mechanism of wafer loader, a serial communication port, including transportation desktop (1), air cock elevating system and floating air cock (2), wherein be equipped with on transportation desktop (1) with the interface of the bottom air inlet looks adaptation of the wafer transport box (14) that bears, air cock elevating system sets up in the bottom of transportation desktop (1), and be connected with floating air cock (2) that pass the interface on transportation desktop (1), air cock elevating system is used for driving floating air cock (2) and goes up and down, make the bottom air inlet butt joint or the separation of floating air cock (2) and wafer transport box (14), floating air cock (2) have flexible compensation mechanism, can automatic compensation butt joint position deviation through flexible compensation mechanism, floating air cock (2) are used for carrying shielding gas in to wafer transport box (14).
2. The purge mechanism for a wafer loader according to claim 1, wherein the floating air tap (2) further comprises an air tap cap (201), a housing assembly and an air tap core (209), wherein the air tap core (209) is mounted in the housing assembly by the flexible compensation mechanism, such that the air tap core (209) has degrees of freedom of axial movement and horizontal deflection, one end of the air tap core (209) is connected with the air tap cap (201), and the air tap cap (201) is used for docking with a bottom air inlet of the wafer transport case (14).
3. The purging mechanism for a wafer loader of claim 2, wherein the flexible compensation mechanism comprises a flexible angle compensation structure (203) and an elastic element (204), wherein the flexible angle compensation structure (203) is sleeved on the air tap core (209), the flexible angle compensation structure (203) is in sliding fit with the housing assembly, and the flexible angle compensation structure (203) is used for compensating the angle deviation of the air tap core (209) in the horizontal direction; a resilient element (204) is confined between the flexible angle compensation structure (203) and the housing assembly, the resilient element (204) being adapted to provide an axial preload.
4. The purge mechanism of claim 3, wherein the housing assembly comprises a sleeve (205), a gas cap housing (206) and a gas cap cover (208), wherein the sleeve (205) is disposed inside the gas cap housing (206) and is axially limited by the gas cap cover (208), and the flexible angle compensation structure (203) is slidably engaged with an inner wall of the sleeve (205); both ends of the elastic element (204) are respectively abutted with the flexible angle compensation structure (203) and the air nozzle end cover (208).
5. A purge mechanism applied to a wafer loader according to claim 3, characterized in that the flexible angle compensation structure (203) is a knuckle bearing; the elastic element (204) is a spring.
6. The purging mechanism for a wafer loader of claim 2, wherein the air cap top cover (201) is in threaded connection with the air cap core (209), and a seal element (202) sleeved on the air cap core (209) seals between an end of the air cap top cover (201) and the air cap core (209).
7. The purging mechanism for a wafer loader according to claim 1, wherein the air tap lifting mechanism comprises a linear driving source, a guiding component and a lifting plate, wherein the linear driving source is arranged on the transportation table top (1) and the output end of the linear driving source is connected with the lifting plate, the linear driving source is used for driving the lifting plate to move up and down, the lifting plate is connected with the transportation table top (1) through the guiding component, the guiding component provides guiding for the up-and-down movement of the lifting plate, and two ends of the lifting plate are respectively connected with the two floating air taps (2).
8. The purging mechanism as recited in claim 7, wherein the guide assembly comprises a guide shaft (5) and a linear bearing (6), wherein the linear bearing (6) is embedded on the lifting plate, the guide shaft (5) is slidably matched with the linear bearing (6), and the upper end of the guide shaft is fixedly connected with the transportation table top (1).
9. The purging mechanism for a wafer loader as recited in claim 7, wherein said air tap elevating mechanisms are two sets, and four of said floating air taps (2) connected to two sets of said air tap elevating mechanisms are arranged in a trapezoid or a rectangle.
10. The purging mechanism for a wafer loader according to claim 1, wherein the interfaces on the transport table top (1) comprise a trapezoid interface i (101), a trapezoid interface ii (102), a rectangle interface i (103), a rectangle interface ii (104), a front interface i (105) and a front interface ii (106), wherein the trapezoid interface i (101), the rectangle interface i (103), the rectangle interface ii (104) and the trapezoid interface ii (102) are sequentially arranged at one end of the transport table top (1), and the front interface i (105) and the front interface ii (106) are arranged at the other end of the transport table top (1);
The front interface I (105), the front interface II (106), the rectangular interface I (103) and the rectangular interface II (104) are in a rectangular arrangement form;
The front interface I (105), the front interface II (106), the trapezoid interface I (101) and the trapezoid interface II (102) are arranged in a trapezoid mode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410349803.1A CN117954361B (en) | 2024-03-26 | 2024-03-26 | Purging mechanism applied to wafer loader |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410349803.1A CN117954361B (en) | 2024-03-26 | 2024-03-26 | Purging mechanism applied to wafer loader |
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| CN117954361A true CN117954361A (en) | 2024-04-30 |
| CN117954361B CN117954361B (en) | 2024-06-14 |
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| CN117954361B (en) | 2024-06-14 |
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