CN117954333B - High-reliability integrated circuit packaging method - Google Patents
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Abstract
The application relates to the technical field of integrated circuit packaging, and provides a high-reliability integrated circuit packaging method, which comprises the following steps: preparing a packaging support substrate with substrate electrodes on the front side and the back side, and attaching the integrated circuit packaging body to the packaging support substrate; connecting an outlet end of the integrated circuit package body with pins of a package supporting substrate through gold wires, then using a baking device to bake, acquiring a self-adaptive adjustment result of the baking temperature based on analysis of proper characteristics, adjustment directions and adjustment degrees of the baking temperature, and completing the baking treatment through the self-adaptive adjustment result of the baking temperature; and then, packaging the integrated circuit through a thermal spraying process, a glue film pasting process, a packaging process and a cutting process. The application improves the reliability and the packaging efficiency of the integrated circuit package by adaptively adjusting the baking temperature in the baking process.
Description
Technical Field
The application relates to the technical field of integrated circuit packaging, in particular to a high-reliability integrated circuit packaging method.
Background
With the development of microelectronic information technology, integrated circuits are becoming more and more widely used, and as an important component of microelectronic information technology, the development of microelectronic information industrialization is being promoted with high efficiency. Integrated circuits, also known as microcircuits, are often referred to as "ICs" in a circuit that connect together the desired electronic components, such as transistors, resistors, etc., by some process technique, to thereby perform a particular function.
The required electronic components are integrated to form an integrated circuit, which often involves the packaging process of the integrated circuit. With the development of integrated circuits, the packaging process of integrated circuits has made great progress. However, the packaging of integrated circuits still has some problems, such as moisture generated between electronic components during the packaging process, which can seriously affect the reliability and stability of the integrated circuit package.
In order to avoid the influence of water vapor generated in the packaging process of the integrated circuit on the packaging effect, the integrated circuit packaging body is mostly baked through a baking device, so that the water vapor is prevented from condensing and dripping on a packaging supporting substrate, and the reliability and the safety of the integrated circuit packaging are improved. At present, the baking temperature of the baking device is often difficult to determine, and due to the change of the baking environment, when the baking temperature is not suitable for the current baking environment, the baking efficiency and the baking effect are often not effectively improved, so that the reliability and the efficiency of the integrated circuit package are lower. In order to improve the reliability and the packaging efficiency of the integrated circuit package, the baking temperature in the baking process is required to be adaptively adjusted so as to prevent water vapor condensation from dripping on the basis of the package supporting substrate, and effectively improve the baking efficiency and the baking effect, thereby improving the reliability and the packaging efficiency of the integrated circuit package.
Disclosure of Invention
The application provides a high-reliability integrated circuit packaging method, which aims to solve the problems of lower reliability and packaging efficiency of integrated circuit packaging, and adopts the following technical scheme:
One embodiment of the present application provides a high reliability integrated circuit packaging method comprising the steps of:
S1: preparing a packaging support substrate with substrate electrodes on the front side and the back side, and attaching the integrated circuit packaging body to the packaging support substrate; pressing a semi-cured resin sheet on one surface of the integrated circuit packaging body to serve as an underfilling material of the integrated circuit packaging body, and pressing a plastic resin sheet on the other surface of the integrated circuit packaging body;
S2: connecting an outlet end of the integrated circuit package body with pins of a package supporting substrate through gold wires, then baking by using a baking device, acquiring a self-adaptive adjustment result of the baking temperature based on analysis of proper characteristics, adjustment directions and adjustment degrees of the baking temperature, and completing the baking by using the baking device based on the self-adaptive adjustment result of the baking temperature;
s3: after baking, curing the underfill of the chip at the curing temperature of the semi-cured resin sheet by using a thermal spraying process for the package support substrate;
S4: the integrated circuit package body is subjected to adhesive film pasting treatment, then the package supporting substrate is placed in a package mold, and the package supporting substrate is subjected to package treatment by using a package grinding tool, so that the packaged package supporting substrate is obtained;
S5: finally, the packaging structure of each independent integrated circuit packaging body is formed through cutting treatment, and the packaging of the integrated circuit is completed.
Preferably, a preset number of integrated circuit packages arranged in an array are arranged on the package support substrate.
Preferably, the first side of the integrated circuit package is opposite the second side of the integrated circuit package.
Preferably, the spraying temperature in the thermal spraying process is 40-60/>Curing temperature is 30/>-40/>。
Preferably, an encapsulating material is disposed in the encapsulating mold.
Preferably, the method for obtaining the self-adaptive adjustment result of the baking temperature based on the analysis of the suitable characteristics, the adjustment direction and the adjustment degree of the baking temperature comprises the following steps:
respectively taking a sequence formed by baking ambient temperature data acquired by a temperature sensor and surface temperature data of a packaging body as a baking ambient temperature data sequence and a packaging body temperature data sequence, and performing filtering processing on the baking ambient temperature data sequence and the packaging body temperature data sequence by using a limiting filtering algorithm to respectively obtain a baking ambient temperature time sequence and a packaging body temperature time sequence;
selecting a preset number of acquisition time groups with the smallest time interval from each acquisition time as a neighborhood truncation acquisition time group of each acquisition time;
Taking a sequence formed by baking temperature data of all acquisition moments in a neighborhood cut-off acquisition moment set of each acquisition moment in the baking environment temperature time sequence according to the ascending order of time as a baking environment temperature change sequence of each acquisition moment;
Taking a sequence formed by the package temperature data of all the collection moments in the neighborhood cut-off collection moment set of each collection moment in the package temperature time sequence according to the ascending order of time as a package temperature change sequence of each collection moment;
Taking a correlation measurement result between a baking environment temperature change sequence and a packaging body temperature change sequence at each acquisition time as a baking characteristic correlation index at each acquisition time, and taking a sequence formed by the baking characteristic correlation indexes at all the acquisition times according to the sequence of a time ascending order as a correlation gradient baking characteristic sequence;
Acquiring a baking proper characteristic mutation index at each acquisition time according to the correlation gradient baking characteristic sequence; acquiring a temperature regulation direction degree index of each acquisition time according to the baking proper characteristic mutation index of each acquisition time;
Calculating the absolute value of a temperature difference value between the baking environment temperature data at each acquisition time and the package temperature data, calculating the opposite number of the product of the absolute value and the temperature adjustment direction degree index at each acquisition time, and taking the sum of the opposite number and the baking environment temperature data at each acquisition time as the optimal baking environment temperature value at each acquisition time;
Taking a sequence formed by the optimal baking environment temperature values at all the acquisition moments according to the ascending order of time as a baking temperature prediction sequence, taking the baking temperature prediction sequence as the input of an ARIMA differential autoregressive moving average algorithm, acquiring a prediction result of the optimal baking environment temperature value at the current moment by using the ARIMA differential autoregressive moving average algorithm, and taking the prediction result of the optimal baking environment temperature value at the current moment as a self-adaptive adjustment result of the baking temperature.
Preferably, the method for obtaining the baking suitability characteristic mutation index at each acquisition time according to the correlation gradient baking characteristic sequence comprises the following steps:
Taking the absolute value of the difference between each data in the baking environment temperature change sequence at each acquisition time and each data in the packaging temperature change sequence as a first absolute value, and taking a negative mapping result taking a natural constant as a base number and the first absolute value as an index as a molecule; taking the sum of the absolute value of the difference between the mean square error of all data in the baking environment temperature change sequence at each acquisition moment and the mean square error of all data in the packaging temperature change sequence and 1 as a denominator; taking the sum of the opposite number of the ratio of the numerator to the denominator and 1 as a first sum value, calculating a similarity measurement result between a baking environment temperature change sequence and a packaging body temperature change sequence at each acquisition time, and taking the product of the average value of the first sum value accumulated on the baking environment temperature change sequence and the similarity measurement result as a temperature difference mutation characteristic index at each acquisition time;
Taking the absolute value of the difference between the baking characteristic correlation indexes of each acquisition time except the first acquisition time and the last acquisition time in a neighborhood cut-off acquisition time set of each acquisition time in the correlation gradient baking characteristic sequence as a second absolute value, and taking a natural constant as a base and a negative mapping result taking the second absolute value as an index as a molecule; taking the sum of the variation coefficient and 1 of the baking characteristic correlation indexes at all acquisition moments in a neighborhood cut-off acquisition moment set of each acquisition moment in the correlation gradient baking characteristic sequence as a denominator; taking the average value of the sum of the ratio of the numerator and the denominator on the neighborhood truncation acquisition time set as the correlation continuity gradient characteristic index of each acquisition time;
Taking the product of the mean square error of all data in the baking environment temperature change sequence at each acquisition time and the temperature difference mutation characteristic index at each acquisition time as a numerator, taking the correlation continuity gradient characteristic index at each acquisition time as a denominator, and taking the ratio of the numerator to the denominator as the baking suitability characteristic mutation index at each acquisition time.
Preferably, the method for obtaining the temperature adjustment direction degree index of each collection time according to the baking suitability characteristic mutation index of each collection time comprises the following steps:
Calculating the temperature difference between the baking environment temperature and the packaging body temperature at each acquisition time in the baking environment temperature time sequence and the packaging body temperature time sequence, taking a sequence formed by the temperature differences according to the ascending order of time as a temperature difference change characteristic time sequence, and taking a sequence formed by the temperature differences at all acquisition times in a neighborhood cut-off acquisition time set at each acquisition time in the temperature difference change characteristic time sequence according to the ascending order of time as a temperature change characteristic subsequence at each acquisition time;
Taking the temperature change characteristic subsequence of each acquisition time as input of a DFA trending fluctuation analysis algorithm, and obtaining a trending temperature sequence of each acquisition time by using the DFA trending fluctuation analysis algorithm;
acquiring a temperature difference stable characteristic coefficient of each acquisition time according to the trending temperature sequence of each acquisition time;
acquiring a temperature difference change direction characteristic value of each acquisition time according to the temperature change characteristic subsequence of each acquisition time;
And calculating a normalization result of the ratio of the baking proper characteristic mutation index to the temperature difference stable characteristic coefficient at each acquisition time, and taking the product of the normalization result and the temperature difference change direction characteristic value as a temperature adjustment direction degree index at each acquisition time.
Preferably, the method for obtaining the temperature difference stability characteristic coefficient of each collection time according to the trending temperature sequence of each collection time comprises the following steps:
Calculating the variance of all data in the trending temperature sequence at each acquisition time, and taking a negative mapping result taking a natural constant as a base and the variance as an index as a molecule;
calculating the absolute value of the difference between each data and the data mean value in the trending temperature sequence at each acquisition time, and taking the sum of the absolute value and 1 as a denominator;
And taking the average value of the sum of the ratios of the numerator and the denominator on the trending temperature sequence as the temperature difference stability characteristic coefficient at each acquisition time.
Preferably, the method for obtaining the characteristic value of the temperature difference change direction at each collection time according to the temperature change characteristic subsequence at each collection time comprises the following steps:
And calculating the difference value of each data except the first data in the temperature change characteristic subsequence at each acquisition time and the last data, and taking the average value of the sum of the difference values on the temperature change characteristic subsequence as the characteristic value of the temperature difference change direction at each acquisition time.
The beneficial effects of the application are as follows: based on analysis of baking proper characteristics in the baking process of the integrated circuit package body, constructing a baking proper characteristic variation index, and reflecting whether the current baking temperature is suitable for continuously baking characteristics when the package body is baked by a baking device at the current moment; based on analysis of the adjustment direction and the adjustment degree of the baking temperature in the baking process, and combining the analysis result of the baking proper characteristics, constructing a temperature adjustment direction degree index, and reflecting the degree of the baking temperature adjustment direction at the acquisition time, wherein the baking temperature adjustment direction comprises up-adjustment and down-adjustment of the baking temperature; and constructing an optimal baking environment temperature value by using a temperature adjustment direction degree index, constructing a baking temperature prediction sequence by using the optimal baking environment temperature value, and obtaining a baking temperature self-adaptive adjustment result in the baking process by using an ARIMA differential autoregressive moving average algorithm based on the baking temperature prediction sequence. The application adaptively adjusts the baking temperature in the baking process of the integrated circuit packaging body based on the analysis of the proper characteristics, the adjusting direction and the adjusting degree of the baking temperature, and improves the reliability and the packaging efficiency of the integrated circuit packaging by improving the baking efficiency and the baking effect.
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In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a flow chart of a method for packaging an integrated circuit with high reliability according to an embodiment of the present application;
fig. 2 is a flowchart of an implementation of a method for packaging an integrated circuit with high reliability according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1, a flowchart of a high reliability integrated circuit packaging method according to an embodiment of the application is shown, the method includes the following steps:
and S001, acquiring baking environment temperature data and package body temperature data in the baking process of the integrated circuit package by utilizing a temperature sensor, and respectively acquiring a baking environment temperature time sequence and a package body temperature time sequence according to the baking environment temperature data and the package body temperature data.
The application adaptively adjusts and controls the baking temperature in the baking process of the packaging process, so as to improve the reliability and packaging efficiency of the integrated circuit package by improving the baking efficiency and the baking effect of the integrated circuit package. The packaging process of the integrated circuit comprises the following steps:
Step S1, preparing a packaging support substrate, wherein substrate electrodes are manufactured on the front side and the back side of the packaging support substrate; the package support substrate is provided with 20 integrated circuit packages arranged in an array, the integrated circuit packages are attached to the package support substrate, and the first side of the integrated circuit packages is opposite to the second side of the integrated circuit packages; one surface of the integrated circuit packaging body is pressed with the semi-cured resin sheet to be used as the underfilling material of the integrated circuit packaging body, and the other surface is pressed with the plastic resin sheet;
and S2, connecting the leading-out end of the integrated circuit package body with a pin of the frame through a gold wire, and then baking by using a baking device.
In order to adaptively adjust the baking temperature in the baking process of the packaging process, the baking environment temperature in the baking process of the step S2 and the surface temperature of the packaging body are acquired by utilizing the temperature sensor to obtain the baking environment temperature data and the packaging body temperature data, the acquisition time interval is 1S, the acquisition time length is 10min, and an implementer can determine the acquisition time interval and the acquisition time length value according to scene requirements.
In order to facilitate the subsequent self-adaptive adjustment of the baking temperature in the baking process, and reduce the influence of environmental noise on the analysis of the baking process, the acquired sequences consisting of the baking environmental temperature data and the package temperature data according to the ascending order of time are used as the baking environmental temperature data sequence and the package temperature data sequence, the baking environmental temperature data sequence and the package temperature data sequence are respectively used as the input of a limiting and filtering algorithm, the output of the limiting and filtering algorithm is used as the baking environmental temperature data sequence and the package temperature data sequence after the filtering process, and the baking environmental temperature data sequence and the package temperature data sequence after the filtering process are respectively recorded as the baking environmental temperature time sequence and the package temperature time sequence, wherein the limiting and filtering algorithm is a known technology and the specific process is not repeated.
Thus, a baking environment temperature time sequence and a packaging body temperature time sequence are obtained and are used for subsequent analysis of self-adaptive adjustment of the baking temperature in the baking process.
Step S002, a baking environment temperature change sequence and a packaging body temperature change sequence are obtained according to the baking environment temperature time sequence and the packaging body temperature time sequence, a correlation gradient baking characteristic sequence is obtained according to the baking environment temperature change sequence and the packaging body temperature change sequence, and a baking proper characteristic mutation index is obtained according to the correlation gradient baking characteristic sequence.
Due to the change of the baking environment, the temperature of the baking environment fluctuates to a certain extent, and the environment may change to a larger extent. At the same time, ambient temperature is transferred to the package by thermal conductivity of temperature, and moisture generated on the surface of the package is evaporated to maintain the drying characteristics of the surface of the package.
Typically, there is a high correlation between the baking ambient temperature and the package temperature, and the temperature difference in heat transfer between the two is kept at some fixed level. However, due to the temperature change of the environment, the baking environment temperature is firstly influenced, so that the correlation between the baking environment temperature and the packaging body temperature is changed, and meanwhile, the temperature difference between the baking environment temperature and the packaging body temperature is changed. Since the baking temperature of the baking apparatus is preset, and the environment changes, it is not suitable to use the original baking temperature for baking treatment at this time, that is, the baking suitable characteristics at this time change. In order to adaptively adjust the baking temperature during baking, it is necessary to analyze the change in the baking proper characteristics during baking.
Specifically, a set of 50 acquisition time components with the smallest time interval from each acquisition time is selected as a neighborhood truncation acquisition time set of each acquisition time.
In order to analyze the change of the correlation between the baking ambient temperature and the package body temperature, a sequence formed by the baking temperature data of all the collection moments in the neighborhood cut-off collection moment set of each collection moment in the baking ambient temperature time sequence according to the ascending order of time is used as a baking ambient temperature change sequence of each collection moment in the baking ambient temperature time sequence, and a sequence formed by the package body temperature data of all the collection moments in the neighborhood cut-off collection moment set of each collection moment in the package body temperature time sequence according to the ascending order of time is used as a package body temperature change sequence of each collection moment in the package body temperature time sequence.
Taking the pearson correlation coefficient between the baking environment temperature change sequence and the packaging temperature change sequence at each acquisition time as a baking characteristic correlation index at each acquisition time, and taking a sequence formed by the baking characteristic correlation indexes at all the acquisition times according to the sequence of time ascending as a correlation gradient baking characteristic sequence, wherein the calculation of the pearson correlation coefficient is a known technology, and the specific process is not repeated.
Further, based on the above analysis, a baking suitability characteristic mutation index at each acquisition time is calculated, reflecting whether the current baking temperature is suitable for the continuous baking when the package is baked by the baking device at the current time, and the calculation is shown as follows:
In the method, in the process of the invention, Indicating the temperature difference mutation characteristic index of the ith acquisition time,/>For/>Distance function,/>And/>Respectively represents a baking environment temperature change sequence and a packaging body temperature change sequence at the ith acquisition time,Represents/>, between the baking ambient temperature change sequences and the package temperature change sequences at the ith acquisition timeDistance/>Representing the number of data in any one of said sequences of changes at the ith acquisition instant,/>As an exponential function based on natural constants,/>Data j in the baking environment temperature change sequence representing the ith acquisition time,/>Data j in the package temperature change sequence representing the ith acquisition time,/>And/>Mean square error of all data in the baking environment temperature change sequence and the packaging temperature change sequence at the ith acquisition time are respectively expressed, and the mean square error is/The function of the regulating factor is to avoid that the denominator is 0 and the empirical value of the regulating factor is 1;
related continuity gradient characteristic index representing ith acquisition time Representing the number of all acquisition moments in the neighborhood truncation acquisition moment set of the ith acquisition moment,/>And/>Respectively representing the baking characteristic correlation indexes of the a-1 th acquisition time in the neighborhood cut-off acquisition time set of the ith acquisition time of the correlation gradient baking characteristic sequence,The variation coefficient of the baking characteristic correlation index at all acquisition moments in the neighborhood cut-off acquisition moment set representing the ith acquisition moment of the correlation gradient baking characteristic sequence, wherein the calculation of the variation coefficient is a known technology, and the specific process is not repeated;
and (5) indicating the index of the proper characteristic mutation of baking at the ith acquisition time.
Between sequencesDistance/>The larger the sequence, the smaller the similarity between the sequences, the more likely the environmental temperature difference is reflected to a certain extent to generate larger mutation phenomenon, and the difference/>The larger, and the difference between the mean square deviations/>The larger the difference between the baking environment temperature change sequence and the packaging body temperature change sequence is, the larger the difference between the discrete features is, and the more obvious the feature that the environment temperature difference is suddenly changed is, the larger the temperature difference suddenly changed feature index is, because a certain time is required for heat transfer; in addition, the difference between the baking characteristic correlation indexes/>The larger, and the coefficient of variation/>The larger the correlation between the baking ambient temperature and the packaging body temperature is, the smaller the continuous characteristic of the correlation between the baking ambient temperature and the packaging body temperature is, and the smaller the correlation continuous characteristic index is; thus, the temperature difference mutation characteristic index/>The larger, and related continuity graded feature index/>The smaller the temperature difference is, the more obvious the characteristics of mutation of the temperature difference is, the more likely the temperature difference is caused by larger change, and the mean square error/>The larger the temperature difference is, the larger the temperature difference change is, and the baking temperature of the baking device is not suitable for continuously baking the integrated circuit packaging body, so that the characteristic mutation index suitable for baking is larger.
Based on the analysis, obtaining the baking proper characteristic mutation indexes at different acquisition moments, wherein the baking proper characteristic mutation indexes reflect whether baking temperatures at different moments are suitable for continuously baking the integrated circuit package, and when the baking proper characteristic mutation indexes are larger, the baking temperatures set by the baking device at the current moment are more unsuitable for baking the integrated circuit; and when the characteristic mutation index suitable for baking is smaller, the baking temperature set by the baking device at the current moment is more suitable for baking the integrated circuit.
Thus, a suitable characteristic mutation index for baking is obtained for subsequent analysis of the degree of baking temperature adjustment direction.
Step S003, obtaining a temperature difference change characteristic time sequence according to the baking environment temperature time sequence and the package temperature time sequence, obtaining a temperature change characteristic subsequence according to the temperature difference change characteristic time sequence, obtaining a trending temperature sequence according to the temperature change characteristic subsequence, obtaining a temperature adjustment direction degree index according to the trending temperature sequence and a baking proper characteristic mutation index, and obtaining an optimal baking environment temperature value according to the temperature adjustment direction degree index.
Further, in order to more accurately adaptively adjust the baking temperature during the baking process, it is necessary to analyze the baking temperature adjustment direction at each acquisition time to determine the baking temperature up-and down-adjustments of the baking apparatus. Considering the temperature difference between the baking ambient temperature and the package body temperature, the package body temperature is generally stable, and when the temperature difference becomes smaller, the baking ambient temperature is reduced, and the baking temperature is suitable for being finely adjusted upwards; when the temperature difference becomes large, it is indicated that the baking ambient temperature rises, and at this time, it is appropriate to finely adjust the baking temperature downward. Therefore, in order to determine the adjustment direction of the baking temperature, further analysis is performed based on the temperature difference between the baking ambient temperature and the package temperature.
Specifically, based on the baking ambient temperature time sequence and the package body temperature time sequence, calculating the temperature difference between the baking ambient temperature and the package body temperature at each acquisition time, taking a sequence formed by the temperature differences according to the order of time ascending as a temperature difference change characteristic time sequence, and taking a sequence formed by the temperature differences at all acquisition times in a neighborhood cut-off acquisition time set at each acquisition time in the temperature difference change characteristic time sequence according to the order of time ascending as a temperature change characteristic subsequence at each acquisition time.
In order to analyze the stability characteristics of the temperature difference change, the temperature change characteristic subsequence at each acquisition time is used as the input of a DFA trending fluctuation analysis algorithm (DETRENDED FLUCTUATION ANALYSIS, DFA), and the output of the trending fluctuation analysis algorithm is used as the trending temperature sequence at each acquisition time, wherein the DFA trending fluctuation analysis algorithm is a known technology, and the specific process is not repeated.
Further, based on the above analysis, a temperature adjustment direction degree index at each acquisition time is calculated, reflecting the degree of the baking temperature adjustment direction at the acquisition time, the baking temperature adjustment direction including the up-and down-adjustment of the baking temperature, the calculation formula of which is as follows:
In the method, in the process of the invention, Representing the temperature difference stable characteristic coefficient of the ith acquisition time,/>Representing the number of data in the detrending temperature sequence at the ith acquisition time,/>As an exponential function based on natural constants,/>Representing the variance of all data within the detrending temperature sequence at the ith acquisition instant,/>B-th data in the detrending temperature sequence representing the i-th acquisition time,/>, andRepresenting the mean value of all data in the trending temperature sequence at the ith acquisition time,/>The function of the regulating factor is to avoid that the denominator is 0 and the empirical value of the regulating factor is 1;
Characteristic value of temperature difference change direction at ith acquisition time,/> Representing the number of data in the temperature change characteristic subsequence at the ith acquisition time,/>And/>Respectively representing the g-1 data in the temperature change characteristic subsequence at the ith acquisition time;
Index of the degree of temperature adjustment direction indicating the i-th acquisition time,/> For/>Normalization function,/>Index of change in baking suitability characteristic indicating the ith acquisition time,/>Representation/>Normalized values of the calculated results of (a).
Variance ofThe larger, and the difference between the value and the mean/>The larger the data stability degree of the detrack temperature sequence is, the lower the data stability degree is, the larger the temperature difference change at the current moment is reflected to a certain extent, and the larger the degree of the baking temperature adjustment direction is, the smaller the temperature difference stability characteristic coefficient is; in addition, when the difference between the values/>When the temperature is larger and positive, the baking environment temperature is higher, and the baking temperature of the baking device is subjected to fine adjustment downwards at the moment, so that the characteristic value of the temperature difference change direction is larger; when the difference between the values/>When the temperature is smaller and negative, the baking environment temperature is smaller, and the baking temperature of the baking device is required to be finely adjusted upwards, so that the characteristic value of the temperature difference change direction is smaller; thus, bake-suitable characteristic mutation index/>The larger and the temperature difference stable characteristic coefficient/>The smaller the temperature difference, the greater the extent of the temperature difference change, the more unsuitable the baking temperature of the baking device is at the moment for continuously baking the integrated circuit packaging body, and the greater the extent of the temperature adjustment is at the moment, the/>Normalized value/>The degree of temperature regulation is highlighted as part of the product, while the temperature difference changes direction characteristic value/>The temperature regulation direction is determined by the characteristic value of the temperature difference change direction as a vector value, and the characteristic value/>The higher the positive value, the higher the baking ambient temperature, and the lower the baking temperature of the baking device should be finely adjusted, the index of the temperature adjustment direction/>The larger.
Further, based on the baking ambient temperature at each collection time and the temperature difference between the baking ambient temperature at each collection time and the package body temperature, and in combination with the temperature adjustment direction degree index, calculating an optimal baking ambient temperature value at each collection time:
In the method, in the process of the invention, Represents the optimal baking ambient temperature value at the ith acquisition time,/>Toast ambient temperature data representing the ith acquisition instant,/>Index of the degree of temperature adjustment direction indicating the i-th acquisition time,/>And the temperature difference value between the baking ambient temperature and the package temperature at the ith acquisition time is represented.
The index of the temperature adjustment direction degree is positive value andThe larger the baking environment temperature is, the higher the baking environment temperature is, and the lower the baking temperature of the baking device is subjected to fine adjustment, the smaller the optimal baking environment temperature value is; the temperature regulation direction degree index is negative and/>The smaller the baking ambient temperature, the lower the baking ambient temperature, and the more the baking temperature of the baking device should be finely adjusted upwards, the larger the optimal baking ambient temperature value.
So far, the optimal baking environment temperature value is obtained and used for the subsequent self-adaptive adjustment of the baking temperature.
Step S004, a baking temperature prediction sequence is obtained according to the optimal baking environment temperature value, an ARIMA differential autoregressive moving average algorithm is utilized to obtain a baking temperature self-adaptive adjustment result based on the baking temperature prediction sequence, a baking device is utilized to finish baking treatment of the integrated circuit package body based on the baking temperature self-adaptive adjustment result, and then the integrated circuit package is finished through a thermal spraying process, an adhesive film pasting treatment, a packaging treatment and a cutting treatment.
Further, in order to adaptively adjust the baking temperature in the baking process, a sequence formed by the optimal baking environment temperature values at all the acquisition moments according to the ascending order of time is used as a baking temperature prediction sequence, the baking temperature prediction sequence is used as the input of an ARIMA differential autoregressive moving average algorithm (Autoregressive Integrated Moving Average Model, ARIMA), namely, the optimal baking environment temperature values at the first K moments are used as the input of the algorithm, the output of the ARIMA differential autoregressive moving average algorithm is used as the prediction result of the optimal baking environment temperature value at the current moment, namely, the optimal baking environment temperature value at the K+1th moment, wherein the ARIMA differential autoregressive moving average algorithm is a known technology, and the specific process is not repeated. A flow chart of an implementation of the present application is shown in fig. 2.
Taking the predicted result of the optimal baking environment temperature value at the current moment as the self-adaptive adjusting result of the baking temperature, adjusting the baking temperature of the baking device to be the self-adaptive adjusting result of the baking temperature, completing the baking treatment of the integrated circuit package, and then carrying out the following process steps:
Step S3, after baking, the packaging support substrate is used for curing the underfilling of the chip at the curing temperature of the semi-curing resin sheet by using a thermal spraying process, wherein the spraying temperature is 50 Curing temperature is 35/>；
S4, carrying out adhesive film pasting treatment on the integrated circuit packages to separate the integrated circuit packages from each other, wherein each integrated circuit package after separation has a corresponding part on the adhesive film pasting treatment; placing the packaging support substrate in a packaging mold, wherein a packaging material is arranged in the packaging mold, and packaging the packaging support substrate through the packaging material to obtain a packaged packaging support substrate;
and S5, finally cutting to form the packaging structure of each independent integrated circuit packaging body, and finishing the packaging method of the integrated circuit.
Thus, the integrated circuit packaging method with high reliability is completed.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. The above description is only of the preferred embodiments of the present application and is not intended to limit the application, but any modifications, equivalent substitutions, improvements, etc. within the principles of the present application should be included in the scope of the present application.
Claims (5)
1. A method of packaging an integrated circuit with high reliability, the method comprising the steps of:
S1: preparing a packaging support substrate with substrate electrodes on the front side and the back side, and attaching the integrated circuit packaging body to the packaging support substrate; pressing a semi-cured resin sheet on one surface of the integrated circuit packaging body to serve as an underfilling material of the integrated circuit packaging body, and pressing a plastic resin sheet on the other surface of the integrated circuit packaging body;
S2: connecting an outlet end of the integrated circuit package body with pins of a package supporting substrate through gold wires, then baking by using a baking device, acquiring a self-adaptive adjustment result of the baking temperature based on analysis of proper characteristics, adjustment directions and adjustment degrees of the baking temperature, and completing the baking by using the baking device based on the self-adaptive adjustment result of the baking temperature;
s3: after baking, curing the underfill of the chip at the curing temperature of the semi-cured resin sheet by using a thermal spraying process for the package support substrate;
S4: the integrated circuit package body is subjected to adhesive film pasting treatment, then the package supporting substrate is placed in a package mold, and the package mold is used for carrying out package treatment on the package supporting substrate, so that the packaged package supporting substrate is obtained;
S5: finally, forming the packaging structure of each independent integrated circuit packaging body through cutting treatment, and finishing packaging of the integrated circuits;
the method for obtaining the self-adaptive adjustment result of the baking temperature based on the analysis of the proper characteristics, the adjustment direction and the adjustment degree of the baking temperature comprises the following steps:
respectively taking a sequence formed by baking ambient temperature data acquired by a temperature sensor and surface temperature data of a packaging body as a baking ambient temperature data sequence and a packaging body temperature data sequence, and performing filtering processing on the baking ambient temperature data sequence and the packaging body temperature data sequence by using a limiting filtering algorithm to respectively obtain a baking ambient temperature time sequence and a packaging body temperature time sequence;
selecting a preset number of acquisition time groups with the smallest time interval from each acquisition time as a neighborhood truncation acquisition time group of each acquisition time;
Taking a sequence formed by baking temperature data of all acquisition moments in a neighborhood cut-off acquisition moment set of each acquisition moment in the baking environment temperature time sequence according to the ascending order of time as a baking environment temperature change sequence of each acquisition moment;
Taking a sequence formed by the package temperature data of all the collection moments in the neighborhood cut-off collection moment set of each collection moment in the package temperature time sequence according to the ascending order of time as a package temperature change sequence of each collection moment;
Taking a correlation measurement result between a baking environment temperature change sequence and a packaging body temperature change sequence at each acquisition time as a baking characteristic correlation index at each acquisition time, and taking a sequence formed by the baking characteristic correlation indexes at all the acquisition times according to the sequence of a time ascending order as a correlation gradient baking characteristic sequence;
Acquiring a baking proper characteristic mutation index at each acquisition time according to the correlation gradient baking characteristic sequence; acquiring a temperature regulation direction degree index of each acquisition time according to the baking proper characteristic mutation index of each acquisition time;
Calculating the absolute value of a temperature difference value between the baking environment temperature data at each acquisition time and the package temperature data, calculating the opposite number of the product of the absolute value and the temperature adjustment direction degree index at each acquisition time, and taking the sum of the opposite number and the baking environment temperature data at each acquisition time as the optimal baking environment temperature value at each acquisition time;
Taking a sequence formed by the optimal baking environment temperature values at all the acquisition moments according to the ascending order of time as a baking temperature prediction sequence, taking the baking temperature prediction sequence as the input of an ARIMA differential autoregressive moving average algorithm, acquiring a prediction result of the optimal baking environment temperature value at the current moment by using the ARIMA differential autoregressive moving average algorithm, and taking the prediction result of the optimal baking environment temperature value at the current moment as a self-adaptive adjustment result of the baking temperature;
the method for acquiring the baking proper characteristic mutation index at each acquisition time according to the correlation gradient baking characteristic sequence comprises the following steps:
Taking the absolute value of the difference between each data in the baking environment temperature change sequence at each acquisition time and each data in the packaging temperature change sequence as a first absolute value, and taking a negative mapping result taking a natural constant as a base number and the first absolute value as an index as a molecule; taking the sum of the absolute value of the difference between the mean square error of all data in the baking environment temperature change sequence at each acquisition moment and the mean square error of all data in the packaging temperature change sequence and 1 as a denominator; taking the sum of the opposite number of the ratio of the numerator to the denominator and 1 as a first sum value, calculating a similarity measurement result between a baking environment temperature change sequence and a packaging body temperature change sequence at each acquisition time, and taking the product of the average value of the first sum value accumulated on the baking environment temperature change sequence and the similarity measurement result as a temperature difference mutation characteristic index at each acquisition time;
Taking the absolute value of the difference between the baking characteristic correlation indexes of each acquisition time except the first acquisition time and the last acquisition time in a neighborhood cut-off acquisition time set of each acquisition time in the correlation gradient baking characteristic sequence as a second absolute value, and taking a natural constant as a base and a negative mapping result taking the second absolute value as an index as a molecule; taking the sum of the variation coefficient and 1 of the baking characteristic correlation indexes at all acquisition moments in a neighborhood cut-off acquisition moment set of each acquisition moment in the correlation gradient baking characteristic sequence as a denominator; taking the average value of the sum of the ratio of the numerator and the denominator on the neighborhood truncation acquisition time set as the correlation continuity gradient characteristic index of each acquisition time;
Taking the product of the mean square error of all data in the baking environment temperature change sequence at each acquisition time and the temperature difference mutation characteristic index at each acquisition time as a numerator, taking the correlation continuity gradient characteristic index at each acquisition time as a denominator, and taking the ratio of the numerator to the denominator as the baking suitability characteristic mutation index at each acquisition time;
The method for acquiring the temperature adjustment direction degree index of each acquisition time according to the baking proper characteristic mutation index of each acquisition time comprises the following steps:
Calculating the temperature difference between the baking environment temperature and the packaging body temperature at each acquisition time in the baking environment temperature time sequence and the packaging body temperature time sequence, taking a sequence formed by the temperature differences according to the ascending order of time as a temperature difference change characteristic time sequence, and taking a sequence formed by the temperature differences at all acquisition times in a neighborhood cut-off acquisition time set at each acquisition time in the temperature difference change characteristic time sequence according to the ascending order of time as a temperature change characteristic subsequence at each acquisition time;
Taking the temperature change characteristic subsequence of each acquisition time as input of a DFA trending fluctuation analysis algorithm, and obtaining a trending temperature sequence of each acquisition time by using the DFA trending fluctuation analysis algorithm;
acquiring a temperature difference stable characteristic coefficient of each acquisition time according to the trending temperature sequence of each acquisition time;
acquiring a temperature difference change direction characteristic value of each acquisition time according to the temperature change characteristic subsequence of each acquisition time;
Calculating a normalization result of the ratio of the baking proper characteristic mutation index to the temperature difference stable characteristic coefficient at each acquisition time, and taking the product of the normalization result and the temperature difference change direction characteristic value as a temperature adjustment direction degree index at each acquisition time;
The method for acquiring the temperature difference stable characteristic coefficient of each acquisition time according to the trending temperature sequence of each acquisition time comprises the following steps:
Calculating the variance of all data in the trending temperature sequence at each acquisition time, and taking a negative mapping result taking a natural constant as a base and the variance as an index as a molecule;
calculating the absolute value of the difference between each data and the data mean value in the trending temperature sequence at each acquisition time, and taking the sum of the absolute value and 1 as a denominator;
Taking the average value of the sum of the ratios of the numerator and the denominator on the trending temperature sequence as the temperature difference stable characteristic coefficient at each acquisition moment;
the method for acquiring the characteristic value of the temperature difference change direction at each acquisition time according to the temperature change characteristic subsequence at each acquisition time comprises the following steps:
And calculating the difference value of each data except the first data in the temperature change characteristic subsequence at each acquisition time and the last data, and taking the average value of the sum of the difference values on the temperature change characteristic subsequence as the characteristic value of the temperature difference change direction at each acquisition time.
2. The method of claim 1, wherein a predetermined number of integrated circuit packages arranged in an array are disposed on the package support substrate.
3. The method of claim 1, wherein the first side of the integrated circuit package is opposite the second side of the integrated circuit package.
4. The method of claim 1, wherein the spray temperature in the thermal spray process is 40-60/>Curing temperature is 30/>-40/>。
5. The method of claim 1, wherein the encapsulation material is disposed in the encapsulation mold.
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| CN111328840A (en) * | 2018-09-20 | 2020-06-26 | 东莞市正旭新能源设备科技有限公司 | Air heat source pump dynamic baking system |
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| CN111328840A (en) * | 2018-09-20 | 2020-06-26 | 东莞市正旭新能源设备科技有限公司 | Air heat source pump dynamic baking system |
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