CN117950227A - Light emitting module, display panel and electronic equipment - Google Patents

Light emitting module, display panel and electronic equipment Download PDF

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Publication number
CN117950227A
CN117950227A CN202211337922.2A CN202211337922A CN117950227A CN 117950227 A CN117950227 A CN 117950227A CN 202211337922 A CN202211337922 A CN 202211337922A CN 117950227 A CN117950227 A CN 117950227A
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CN
China
Prior art keywords
light emitting
chip
light
driving
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211337922.2A
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Chinese (zh)
Inventor
龙浩晖
李晓宇
张立
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202211337922.2A priority Critical patent/CN117950227A/en
Priority to PCT/CN2023/124949 priority patent/WO2024088107A1/en
Publication of CN117950227A publication Critical patent/CN117950227A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3406—Control of illumination source

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The embodiment of the application belongs to the technical field of display equipment, and particularly relates to a light-emitting module, a display panel and electronic equipment. The embodiment of the application aims to solve the problem of larger thickness of the light-emitting module. The embodiment provides a light emitting module, display panel and electronic equipment, drive plate and light emitting plate set up with the layer, compare with drive plate and light emitting plate range upon range of setting, drive plate and light emitting plate set up with the layer, can reduce the thickness of light emitting module along perpendicular to light emitting plate direction, and then realized light emitting module, display panel and electronic equipment's miniaturization.

Description

Light emitting module, display panel and electronic equipment
Technical Field
The embodiment of the application relates to the technical field of display equipment, in particular to a light-emitting module, a display panel and electronic equipment.
Background
A liquid crystal display panel (liquid CRYSTAL DISPLAY LCD) generally includes a light emitting module and a liquid crystal layer, the light emitting module providing backlight to the liquid crystal layer, and the liquid crystal layer realizing image display by controlling the backlight. Wherein, the light emitting module includes: the LED backlight module comprises a light-emitting plate and a driving plate, wherein a plurality of light-emitting diodes are arranged on the light-emitting plate, the driving plate is provided with a driving chip, the driving plate and the light-emitting plate are arranged in a stacked mode, the driving plate and the light-emitting plate are connected through a connector, so that electric connection between the driving chip and each light-emitting diode is realized, each light-emitting diode is driven to emit light through the driving chip, and backlight is further generated.
However, the stacked arrangement of the driving board and the light emitting board results in a larger thickness of the light emitting module in a direction perpendicular to the light emitting board.
Disclosure of Invention
The embodiment of the application provides a light-emitting module, a display panel and electronic equipment, which are used for solving the problem that the thickness of the light-emitting module along the direction vertical to a light-emitting plate is larger.
In a first aspect, an embodiment of the present application provides a light emitting module, including a light emitting board and a driving board, where a plurality of first light emitting sources are disposed on the light emitting board at intervals, and the driving board and the light emitting board are disposed on the same layer; the driving plate is provided with a driving chip, the driving chip is electrically connected with each first light-emitting source, and each first light-emitting source can be driven to emit light through the driving chip, so that backlight is provided.
Through above-mentioned setting, the drive plate sets up with the luminescent plate homolayer, compares with drive plate and luminescent plate range upon range of setting, and drive plate and luminescent plate homolayer set up, can reduce the thickness of light emitting module along the perpendicular to luminescent plate direction, and then realized the miniaturization of luminous membrane group.
In some embodiments, which may include the above embodiments, the driving board includes a first surface and a second surface that are disposed opposite to each other, the first surface being a surface of the driving board facing the light emitting side, and the driving chip is disposed on the second surface. Because the first light-emitting source and the driving chip can all produce heat when working, the driving chip is arranged on one side of the driving plate, which is away from the liquid crystal layer, so that the distance between the first light-emitting source and the driving chip is increased, heat accumulation on one side of the light-emitting source, which faces the liquid crystal layer, can be avoided, and the heat dissipation of the light-emitting source is facilitated, so that the overheat of the light-emitting source is avoided.
In some embodiments, which may include the above embodiments, a plurality of second light emitting sources are disposed on the first surface at intervals, and the driving chip is further electrically connected to each of the second light emitting sources. When the light-emitting module works, the first light-emitting source and the second light-emitting source emit light at the same time, so that the light-emitting intensity of the light-emitting module can be improved; in addition, the second light-emitting source on the driving plate emits light, so that the weaker backlight intensity of the area corresponding to the driving plate can be avoided, and the uniformity of the backlight is improved.
On the other hand, when the driving chip is arranged on the second surface, the driving chip can be prevented from occupying the space of the second surface, so that more second light-emitting sources can be arranged on the second surface, and the light-emitting intensity of the light-emitting sources is further improved.
In some embodiments, which may include the above embodiments, the driving chip includes a digital chip and an analog chip, the digital chip is disposed on the driving board, the digital chip is electrically connected to the analog chip, and the analog chip is electrically connected to each of the first light emitting sources. The driving chip comprises a digital chip for carrying out data processing and an analog chip for driving each first light-emitting source to emit light, and compared with the mode that the data processing and the function for driving each first light-emitting source to emit light are integrated on the same chip, the driving chip can reduce the integration level of the chip, and further reduce the manufacturing difficulty of the chip.
In some embodiments, which may include the embodiments described above, both the digital chip and the analog chip are disposed on the second surface. So set up, because first light emitting source, analog chip and digital chip during operation all can produce the heat, set up digital chip and analog chip in the drive plate back of the body one side of leaving the liquid crystal layer, increased the distance between first light emitting source and digital chip and the analog chip, can avoid the heat to gather in the one side of light emitting module orientation liquid crystal layer, the heat dissipation of light emitting module of being convenient for to avoid light emitting module overheated.
In some embodiments, which may include the above embodiments, the analog chip includes a first analog chip disposed on the light emitting panel and a second analog chip disposed on the driving panel, the first analog chip and the second analog chip are electrically connected to the digital chip, and the first analog chip and the second analog chip are electrically connected to the plurality of first light emitting sources. So set up, first analog chip sets up on the luminescent plate, compares on the drive plate with first analog chip setting, can avoid the chip quantity on the drive plate too much, leads to the circuit pattern on the drive plate too complicated, and then has reduced the preparation degree of difficulty of drive plate.
In some embodiments, which may include the above embodiments, the light emitting module includes a support frame, and the light emitting panel and the driving panel are detachably connected to the support frame. So set up, can realize the fixed to luminescent plate and drive plate through the support frame to avoid luminescent plate and drive plate separation in the in-process of using.
In a second aspect, an embodiment of the present application further provides a display panel, including a liquid crystal layer, a color film substrate, and a light emitting module as described above, where the color film substrate, the liquid crystal layer, and the light emitting module are stacked, and the liquid crystal layer is located between the color film substrate and the light emitting module. Through above-mentioned setting, drive plate and luminescent plate in the luminescence module set up with the luminescent plate homolayer, compare with drive plate and luminescent plate range upon range of setting, drive plate and luminescent plate homolayer set up, can reduce the thickness of luminescence module along perpendicular to luminescent plate direction, and then realized luminescence module and display panel's miniaturization.
In a third aspect, an embodiment of the present application further provides an electronic device, including a housing and a display panel as described above, where the display panel and the housing together form an enclosed space. Through above-mentioned setting, drive plate and luminescent plate homolayer setting in display panel's the light emitting module, compare with drive plate and luminescent plate range upon range of setting, drive plate and luminescent plate homolayer setting can reduce the thickness of light emitting module along the perpendicular to luminescent plate direction, and then realized the miniaturization of light emitting module, display panel and electronic equipment.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of the display panel of FIG. 1 taken along the direction A-A;
FIG. 3 is an exploded view of a related art light emitting module;
FIG. 4 is a top view of a light emitting module according to an embodiment of the application;
FIG. 5 is a cross-sectional view taken along the direction B-B in FIG. 4;
FIG. 6 is a schematic diagram illustrating connection of display panels according to an embodiment of the application;
FIG. 7 is a second top view of a light emitting module according to an embodiment of the application;
FIG. 8 is a cross-sectional view taken along the direction C-C in FIG. 7;
FIG. 9 is a top view of a light emitting module according to an embodiment of the application;
FIG. 10 is a cross-sectional view taken along the direction D-D in FIG. 9;
FIG. 11 is a top view of a light emitting module according to an embodiment of the application;
FIG. 12 is a cross-sectional view taken along the direction E-E in FIG. 11;
FIG. 13 is a fifth top view of a light emitting module according to an embodiment of the application;
FIG. 14 is a cross-sectional view taken in the direction F-F of FIG. 13;
FIG. 15 is a top view of a light emitting module according to an embodiment of the application;
FIG. 16 is a cross-sectional view taken in the direction G-G of FIG. 15;
FIG. 17 is a top view of a light emitting module according to an embodiment of the application;
FIG. 18 is a cross-sectional view taken in the H-H direction of FIG. 17;
fig. 19 is a top view eight of a light emitting module according to an embodiment of the application.
Reference numerals illustrate: 10: an electronic device; 20: a system-on-chip; 30: a central control board; 40: a field editable logic gate array; 50: a signal processing chip; 100: a light emitting module; 101: a light emitting panel; 102: a driving plate; 103: a first light-emitting source; 104: a second light emitting source; 105: a connector; 106: a driving chip; 110: a housing; 120: a display panel; 200: a panel body; 201: a color film substrate; 202: a liquid crystal layer; 203: an array substrate; 1011: a light emitting surface; 1021: a first surface; 1022: a second surface; 1061: a digital chip; 1062: an analog chip; 1063: a first analog chip; 1064: and a second analog chip.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1, an embodiment of the present application provides an electronic device 10, where the electronic device 10 includes a housing 110 and a display panel 120 disposed on the housing 110, and it is understood that the electronic device 10 may include: a device capable of displaying an image, such as a mobile phone (as shown in fig. 2), a tablet computer, a television, a smart watch, or a virtual reality device (virtual REALITY VR), the electronic device 10 is not limited in this embodiment.
It is understood that the display panel 120 and the housing 110 together form an enclosed space that can house a motherboard, a battery device of the electronic device 10.
Referring to fig. 2, fig. 2 is a cross-sectional view of the display panel 120 along A-A in fig. 1, the display panel 120 may be a liquid crystal display panel (liquid CRYSTAL DISPLAY LCD), and accordingly, the display panel 120 includes a panel body 200 and a light emitting module 100, wherein the panel body 200 includes an array substrate 203, a liquid crystal layer 202 and a color film substrate 201 that are stacked, the liquid crystal layer 202 is located between the array substrate 203 and the color film substrate 201, the color film substrate 201 is disposed on a light emitting side of the liquid crystal layer 202, the light emitting module 100 is disposed on a light incident side of the liquid crystal layer 202, that is, the light emitting module 100 is disposed on a side of the array substrate 203 facing away from the liquid crystal layer 202, and the light emitting module 100 is used for providing backlight to the liquid crystal layer 202. When the liquid crystal display device works, the array substrate 203 can control the deflection of liquid crystal molecules in the liquid crystal layer 202, so as to control light rays to pass through the liquid crystal layer 202, and light rays emitted from the light emitting side of the liquid crystal layer 202 pass through the color film substrate 201, so that image display can be realized.
It is to be understood that the light emitting module 100 may be applied not only to a liquid crystal display panel, but also to a display panel such as a submillimeter light emitting diode display panel (mini LED) and a micro light emitting diode display panel (micro LED), which is not limited in this embodiment. For example, in an implementation in which the display panel is a micro led display panel, the light emitting module 100 does not provide backlight, but is directly used for image display.
Referring to fig. 3, in the related art, a light emitting module 100 includes a plurality of light emitting panels 101 arranged in an array, wherein the plurality of light emitting panels 101 are located in the same plane, so that the plurality of light emitting panels 101 are spliced into a flat panel; wherein, a plurality of light emitting diodes are arranged on the light emitting surface of each light emitting plate 101 in an array. The light emitting module 100 further includes a driving board 102, where the driving board 102 and the light emitting board 101 are stacked, and a driving chip 106 is disposed on the driving board 102; the driving board 102 is connected to the light emitting board 101 through a connector, so that the driving chip 106 is electrically connected to the light emitting diode on the light emitting board 101 through the connector. When the system-level chip (system on chip SOC) works, the original display data are sent to the field programmable gate array (field programmable GATE ARRAY FPGA), the FPGA is electrically connected with each driving chip 106, and after the FPGA processes the original display data, the FPGA sends the data to each driving chip 106 so as to control each driving chip 106 to drive the light-emitting diode on the light-emitting plate 101 to emit light, and further backlight is generated.
However, in the related art, the stacked arrangement of the driving board 102 and the light emitting board 101 results in a large thickness of the light emitting module 100 in a direction perpendicular to the light emitting board 101, and it is difficult to achieve miniaturization of the light emitting module 100.
Referring to fig. 4 and 5, in the present embodiment, the light emitting module 100 includes a light emitting board 101, a plurality of first light emitting sources 103 are disposed on the light emitting board 101 at intervals, the light emitting board 101 may include a printed circuit board (printed circuit board PCB) or a flexible circuit board (flexible printed circuit FPC), and the first light emitting sources 103 may include light emitting diodes (LIGHT EMITTING diode LEDs), fluorescent lamps, and the like. The plurality of first light emitting sources 103 are disposed on the light emitting surface 1011 of the light emitting panel 101 at intervals, and it is understood that the light emitting surface 1011 is a surface of the light emitting panel 101 facing the panel body 200 shown in fig. 2, so that backlight can be provided to the panel body 200 when the plurality of first light emitting sources 103 emit light.
In an implementation in which the light emitting panel 101 is a printed circuit board, the light emitting panel 101 may be a metal-based printed circuit board (metal core PCB MCPCB), that is, the light emitting panel 101 includes a circuit board, and a metal plate attached to a surface of the circuit board opposite to the light emitting surface 1011, wherein the metal plate may be an aluminum plate, a copper plate, or the like. Or the light emitting panel 101 is an FR4 substrate, that is, a substrate in which the light emitting panel 101 is formed of glass fiber and epoxy resin at high temperature and high pressure. Of course, the printed circuit board may be a glass board. It can be appreciated that the light emitting surface 1011 of the printed circuit board may have a circuit pattern formed thereon, and the circuit pattern is connected to each of the first light emitting sources 103; of course, the circuit pattern may also be provided on the surface of the printed circuit board opposite the light emitting surface 1011.
With continued reference to fig. 4 and 5, the light emitting module 100 provided in this embodiment further includes a driving board 102, where the driving board 102 and the light emitting board 101 are disposed in the same layer, and the driving board 102 includes a first surface 1021 and a second surface 1022 that are disposed opposite to each other, where the first surface 1021 may be disposed facing the light emitting side, that is, the first surface 1021 is disposed facing the panel body 200 shown in fig. 2, and the second surface 1022 is disposed facing away from the light emitting side. It will be appreciated that the driving board 102 and the light emitting board 101 are arranged in the same layer, wherein the first surface 1021 may be in the same plane as the light emitting surface 1011; of course, the second surface 1022 and the surface of the light emitting plate 101 facing away from the light emitting surface 1011 may be disposed in the same layer as the driving plate 102 and the light emitting plate 101. Illustratively, the second surface 1022 is in the same plane as the surface of the light emitting panel 101 facing away from the light emitting surface 1011 while the first surface 1021 is in the same plane as the light emitting surface 1011, so that the thickness of the driving board 102 is the same as that of the light emitting panel 101 in the direction perpendicular to the light emitting panel 101; of course, in the present embodiment, the thickness of the driving plate 102 and the light emitting plate 101 may also be different in the direction perpendicular to the light emitting plate 101.
The driving board 102 is provided with a driving chip 106, the driving chip 106 is electrically connected with each first light emitting source 103, and each first light emitting source 103 can be driven to emit light by the driving chip 106, so as to provide backlight for the panel body 200 shown in fig. 2.
With continued reference to fig. 4 and 5, in the present embodiment, the driving board 102 may be connected to the light emitting board 101 through a connector 105 along one end parallel to the light emitting surface 1011. For example, the connector 105 may include a first connector and a second connector, where the first connector may be disposed at an end of the driving board 102 parallel to the preset plane direction, and the second connector is correspondingly disposed at an end of the light emitting board 101 parallel to the preset plane direction, and the first connector and the second connector are connected to each other, so that the connection between the driving board 102 and the light emitting board 101 may be achieved. It will be appreciated that the first connector may include a plurality of pins, each pin being electrically connected to one of the first light sources 103, and the second connector may include a plurality of pins, each pin being electrically connected to the driver chip 106, each pin being inserted into one of the pins, so as to electrically connect the driver chip 106 to each of the first light sources 103.
In other implementations, the first connector may include a plurality of pins, each pin electrically connected to one of the first light sources 103, and the second connector may include a plurality of pins, each pin electrically connected to the driver chip 106, each pin inserted into one of the pins, and also electrically connected between the driver chip 106 and each of the first light sources 103.
Referring to fig. 6, in some embodiments, the electronic device 10 further includes a system on chip 20 (system on chip SOC), a central control board 30 (TCON), a signal processing chip 50 (Source), a field programmable gate array 40 (field programmable GATE ARRAY FPGA); the system-in-chip 20 is electrically connected to both the field programmable logic gate array 40 and the central control board 30, the field programmable logic gate array 40 may be electrically connected to the driving chip 106, the central control board 30 is electrically connected to the signal processing chip 50 and the array substrate 203, and the signal processing chip 50 is also electrically connected to the array substrate 203 (shown in fig. 2) in the panel body 200.
In operation, the field programmable logic gate array 40 receives the original display data of the system on a chip 20, and the field programmable logic gate array 40 processes the original display data and sends the processed data to the driving chip 106, so that the driving chip 106 drives each first light emitting source 103 (as shown in fig. 5) on the light emitting panel 101 to emit light, thereby forming a backlight. After receiving the data from the system-in-chip 20, the central control board 30 performs timing configuration, and sends the data to the array substrate 203 (as shown in fig. 2) and the signal processing chip 50 on the panel body 200, and the signal processing chip 50 processes the received digital signal or analog signal, and sends the processed data to the array substrate 203, so that the array substrate 203 controls the liquid crystal molecule deflection of the liquid crystal layer 202 to realize image display.
In the related art, as shown in fig. 3, the light emitting module 100 includes a light emitting panel 101 and a driving panel 102, a plurality of light emitting diodes are disposed on the light emitting panel 101, and a plurality of constant current driving chips (mIC) are further disposed on the light emitting panel 101, and each constant current driving chip is electrically connected to one or more light emitting diodes. The driving board 102 and the light emitting board 101 are arranged in a stacked manner, a timing control chip (BCON) is arranged on the driving board 102, and the driving board 102 can be connected with the light emitting board 101 through a connector so as to realize the electrical connection of the timing control chip and each constant current driving chip. The system-level chip is electrically connected with the field-editable logic gate array, and the field-editable logic gate array is electrically connected with the time sequence control chip. When the system-level chip works, the system-level chip sends the original display data to the field-editable logic gate array, the field-editable logic gate array processes the data, then sends the data to the time sequence control chip, the time sequence control chip carries out time sequence configuration, and then sends the data to each constant current driving chip so as to drive each light emitting diode to emit light, so that backlight is formed.
With continued reference to fig. 4 and 5, in some embodiments, the driving chip 106 may integrate one or more of a signal processing function, a brightness adjusting function, a detecting function (e.g., temperature detection, open-short detection, etc.), a timing control function (BL-TCON), a function of adjusting brightness according to a used temperature range of the first light emitting source 103, a function of providing raw display data. Thereby improving the operation and data processing capabilities of the drive board 102 and improving the integration of the drive board 102.
It can be understood that when the driving chip 106 integrates the function of adjusting the brightness according to the usage temperature range of the first light emitting source 103, the system-in-chip 20 as shown in fig. 6 can directly send the original display data to the driving chip 106, and the driving chip 106 drives the first light emitting source 103 to emit light, so that the data is not required to be sent to the field programmable logic gate array 40 first, and then sent to the timing control chip by the field programmable logic gate array 40, so that the control delay can be reduced. When the driver chip 106 integrates a function of providing raw display data, the raw display data can be directly generated by the driver chip 106 without acquiring the raw display data by the system-in-chip 20, and the workload of the system-in-chip 20 can be reduced.
In other embodiments, the driving board 102 shown in fig. 5 may further be provided with one or more of a power management module, an image processor, a central processing unit, a flash memory, a double data rate memory, a system-level chip, a radio frequency module, a photosensitive chip, a fingerprint recognition chip, an iris recognition chip, a face recognition chip, a sensor chip, a power manager, an antenna module, a receiver, a microphone, a timing controller, a touch sensing chip, a wireless controller, a bluetooth module, an inertial sensor, or a pressure gauge, so that the driving board 102 has a function of "storage and/or operation and/or sensing", and further improves operation and data processing capabilities of the driving board 102, and further improves integration and scalability of the driving board 102.
With continued reference to fig. 5, in the above-described implementations, the driver chips 106 may include one or more, and the number of driver chips 106 may be selected as appropriate based on the functionality of the driver board 102.
As shown in fig. 4, in some embodiments, the projected area of the driving plate 102 in the preset plane is smaller than the projected area of the light emitting plate 101 in the preset plane, that is, the area of the driving plate 102 is smaller than the area of the light emitting plate 101. Since the first light emitting source 103 is arranged on the light emitting plate 101, the circuit pattern on the light emitting plate 101 is relatively simple, so that the light emitting plate 101 can be provided with only one layer of circuit pattern, namely, the light emitting plate 101 is a single-layer circuit board; the driving board 102 is provided with the driving chip 106, and the driving chip 106 has more pins, so that the circuit patterns on the driving board 102 are complex, and the corresponding driving board 102 can be provided with multiple layers of circuit patterns which are parallel and spaced along the direction perpendicular to the driving board 102, i.e. the driving board 102 is a multiple layers of circuit boards.
Through the arrangement, the area of the light-emitting board 101 of the single-layer circuit board is larger, the area of the driving board 102 of the multi-layer circuit board is smaller, and compared with the case that the light-emitting board 101 and the driving board 102 are both multi-layer circuit boards, the area of the multi-layer circuit board with higher cost in the embodiment is smaller, the area of the single-layer circuit board with lower cost is larger, and the manufacturing cost of the light-emitting module 100 can be reduced.
In this embodiment, the light emitting module 100 further includes a supporting frame, and the light emitting board 101 and the driving board 102 are detachably connected with the supporting frame. So set up, can realize the fixed to luminescent plate 101 and drive plate 102 through the support frame to avoid luminescent plate 101 and drive plate 102 separation in the in-process of using. The light emitting plate 101 and the driving plate 102 may be connected to the supporting frame by a bolt connection or a clamping connection, and the detachable connection between the light emitting plate 101 and the driving plate 102 and the supporting frame is not limited in this embodiment.
With continued reference to fig. 4 and 5, in the light emitting module 100 provided in this embodiment, a plurality of first light emitting sources 103 are disposed on the light emitting surface 1011 of the light emitting board 101 at intervals, the driving board 102 and the light emitting board 101 are disposed on the same layer, the driving board 102 is provided with a driving chip 106, and the driving chip 106 is electrically connected to each first light emitting source 103. Compared with the stacked arrangement of the driving plate 102 and the light emitting plate 101, the driving plate 102 and the light emitting plate 101 are arranged in the same layer, so that the thickness of the light emitting module 100 along the direction perpendicular to the light emitting plate 101 can be reduced, and further the miniaturization of the light emitting module 100 is realized.
In this embodiment, the structure and the arrangement position of the driving chip 106 may be various, and the following description will be made in terms of a plurality of scenarios:
Scene one
Referring to fig. 4 and 5, in the present scenario, the driving board 102 includes a first surface 1021 facing the light emitting side, and a second surface 1022 disposed opposite to the first surface 1021. In some implementations, the driver chip 106 may be disposed on the first surface 1021. By such arrangement, the driving chip 106 can be prevented from occupying the space of the driving board 102 away from the panel body 200, so as to reduce the thickness of the light emitting module 100 along the direction perpendicular to the preset plane, and further realize miniaturization of the light emitting module 100.
Referring to fig. 7 and 8, in other implementations, the driving chip 106 may be disposed on the second surface 1022. Because the first light-emitting source 103 and the driving chip 106 can generate heat during operation, the driving chip 106 is arranged on one side of the driving plate 102, which is away from the liquid crystal layer 202, so that the distance between the first light-emitting source 103 and the driving chip 106 is increased, heat accumulation on one side of the light-emitting source, which is towards the liquid crystal layer 202, can be avoided, the heat dissipation of the light-emitting source is facilitated, and overheat of the light-emitting source is avoided.
Referring to fig. 9 and 10, in an implementation in which the driving chip 106 is disposed on the first surface 1021, a plurality of second light emitting sources 104 are disposed on the first surface 1021 at intervals, the driving chip 106 is further electrically connected to each of the second light emitting sources 104, and the driving chip 106 drives the first light emitting sources 103 to emit light and simultaneously drives the second light emitting sources 104 to emit light so as to generate backlight. When the backlight source works, the first light-emitting source 103 and the second light-emitting source 104 emit light at the same time, so that the light-emitting intensity of the backlight source can be improved; in addition, the second light emitting source 104 on the driving board 102 emits light, so that the weaker backlight intensity of the area corresponding to the driving board 102 can be avoided, and further the uniformity of the backlight is improved.
Illustratively, the driving chip 106 may be disposed between two adjacent second light emitting sources 104, which may improve the compactness of the driving board 102 and facilitate miniaturization of the driving board 102.
Referring to fig. 11 and 12, in an implementation in which the driving chip 106 is disposed on the second surface 1022, a plurality of second light emitting sources 104 may also be disposed on the first surface 1021 at intervals, the driving chip 106 is further electrically connected to each of the second light emitting sources 104, and the driving chip 106 drives the first light emitting sources 103 to emit light and simultaneously drives the second light emitting sources 104 to emit light so as to generate backlight. When the light emitting module 100 works, the first light emitting source 103 and the second light emitting source 104 emit light at the same time, so that the light emitting intensity of the backlight source can be improved; in addition, the second light emitting source 104 on the driving board 102 emits light, so that the weaker backlight intensity of the area corresponding to the driving board 102 can be avoided, and further the uniformity of the backlight is improved.
On the other hand, the driving chip 106 is disposed on the second surface 1022, so that the driving chip 106 can be prevented from occupying the space of the second surface 1022, so that more second light sources 104 can be disposed on the second surface 1022, and further the light emission intensity of the backlight source is improved.
It is understood that in this scenario, the second light emitting source 104 may include a light emitting diode (LIGHT EMITTING diode LED), a fluorescent lamp, and the like, and the present embodiment is not limited to the second light emitting source 104.
In this scenario, the driving board 102 and the light emitting board 101 may be connected through the connector 105, that is, the plurality of first light emitting sources 103 are connected to the connector 105 through the circuit pattern on the light emitting board 101, and the driving chip 106 is connected to the connector 105 through the circuit pattern on the driving board 102. In an implementation in which a plurality of second light emitting sources 104 are disposed on the driving board 102, the plurality of second light emitting sources 104 may be connected to the driving chip 106 through a circuit pattern on the driving board 102.
In this scenario, the number of driving chips 106 may be one or more, and the number of driving chips 106 may be reasonably set according to the number of the first light emitting sources 103.
Scene two
Referring to fig. 13 and 14, the difference between the present scenario and the first scenario is that the driving chip 106 includes a digital chip 1061 and an analog chip 1062, the digital chip 1061 is disposed on the driving board 102, the digital chip 1061 is electrically connected to the analog chip 1062, and the analog chip 1062 is electrically connected to each of the first light emitting sources 103. In operation, the digital chip 1061 processes the data after receiving the data, and sends the processed data to the analog chip 1062, where the analog chip 1062 drives each of the first light sources 103 to emit light. Thus, the driving chip 106 includes the digital chip 1061 for performing data processing and the analog chip 1062 for driving each first light emitting source 103 to emit light, and compared with the case that the functions of data processing and driving each first light emitting source 103 to emit light are integrated in the same chip, the integration level of the chip can be reduced, and the manufacturing difficulty of the chip can be further reduced.
In this scenario, the analog chip 1062 may be disposed on the driving board 102, where the analog chip 1062 is spaced from the digital chip 1061, and the analog chip 1062 and the digital chip 1061 may be connected by a circuit pattern on the driving board 102. The driving board 102 and the light emitting board 101 may be connected through the connector 105, that is, the plurality of first light emitting sources 103 may be connected to the connector 105 through the circuit pattern on the light emitting board 101, and the analog chip 1062 may be connected to the connector 105 through the circuit pattern on the driving board 102.
In some implementations, the drive board 102 includes a first surface 1021 facing the light-exiting side, and the digital chip 1061 and the analog chip 1062 may each be disposed on the first surface 1021. It will be appreciated that the digital chip 1061 and the analog chip 1062 are spaced apart on the first surface 1021. So set up, digital chip 1061 and analog chip 1062 are disposed on the side of driving board 102 facing panel body 200, so as to avoid occupying the space of driving board 102 facing away from liquid crystal layer 202, and further reduce the thickness of light emitting module 100 along the direction perpendicular to the preset plane, so as to facilitate miniaturization of light emitting module 100.
In other implementations, the drive board 102 includes a first surface 1021 disposed facing the light exit side, and a second surface 1022 disposed opposite the first surface 1021, with both the digital chip 1061 and the analog chip 1062 disposed on the second surface 1022. So set up, because first light-emitting source 103, analog chip 1062 and digital chip 1061 during operation all can produce the heat, set up digital chip 1061 and analog chip 1062 in the one side that drive plate 102 deviates from liquid crystal layer 202, increased the distance between first light-emitting source 103 and digital chip 1061 and the analog chip 1062, can avoid the heat to gather in the one side that the light-emitting module orientation liquid crystal layer 202, the heat dissipation of the light-emitting module of being convenient for to avoid the light-emitting module overheated.
Of course, in the present embodiment, the analog chip 1062 is disposed on the first surface 1021 while the digital chip 1061 may be disposed on the second surface 1022; or the analog chip 1062 is disposed on the second surface 1022 while the digital chip 1061 is disposed on the first surface 1021, which is not limited in this embodiment.
Referring to fig. 15 and 16, in the above implementation manner, a plurality of second light emitting sources 104 may be disposed on the first surface 1021 at intervals, and the plurality of second light emitting sources 104 are electrically connected to the analog chip 1062. When the backlight source works, the first light-emitting source 103 and the second light-emitting source 104 emit light at the same time, so that the light-emitting intensity of the backlight source can be improved; in addition, the second light emitting source 104 on the driving board 102 emits light, so that the weaker backlight intensity of the area corresponding to the driving board 102 can be avoided, and further the uniformity of the backlight is improved.
It can be appreciated that in the implementation manner in which the digital chip 1061 and the analog chip 1062 are disposed on the second surface 1022, the digital chip 1061 and the analog chip 1062 can be prevented from occupying the space of the first surface 1021, so that more second light emitting sources 104 can be disposed on the first surface 1021, and further the backlight intensity of the light emitting module can be improved.
In this scenario, the number of digital chips 1061 may be one or more, and the number of analog chips 1062 may be one or more, and the number of digital chips 1061 and analog chips 1062 is not limited in this scenario.
Scene three
Referring to fig. 17 and 18, the difference between the present scenario and the second scenario is that the analog chip 1062 includes a first analog chip 1063 and a second analog chip 1064, the first analog chip 1063 is disposed on the light emitting board 101, the second analog chip 1064 is disposed on the driving board 102, the first analog chip 1063 and the second analog chip 1064 are electrically connected to the digital chip 1061, and the first analog chip 1063 and the second analog chip 1064 are electrically connected to the plurality of first light emitting sources 103. So set up, first analog chip 1063 sets up on luminescent plate 101, compares on comparing with first analog chip 1063 sets up on drive plate 102, can avoid the chip quantity on the drive plate 102 too much, leads to the circuit pattern on the drive plate 102 too complicated, and then has reduced the preparation degree of difficulty of drive plate 102.
For example, the first analog chip 1063 may be disposed on the light emitting surface 1011 of the light emitting panel 101, so as to avoid occupying a space on a side of the light emitting panel 101 away from the liquid crystal layer 202, thereby reducing the thickness of the light emitting module 100 along a direction perpendicular to the light emitting panel 101. Of course, the first analog chip 1063 may also be disposed on a surface of the light emitting panel 101 opposite to the light emitting surface 1011.
In some implementations, the driving board 102 includes a first surface 1021 and a second surface 1022 that are disposed opposite to each other, the first surface 1021 is disposed facing the light emitting side, the first analog chip 1063 is disposed on the light emitting board 101, and the second analog chip 1064 and the digital chip 1061 are disposed on the second surface 1022; so configured, the heat generated by the first light emitting source 103 can be prevented from affecting the operation of the second analog chip 1064 and the digital chip 1061.
In other implementations, the digital chip 1061 is disposed on the second surface 1022 and the second analog chip 1064 is disposed on the first surface 1021; by such arrangement, the distance between the second analog chip 1064 and the digital chip 1061 can be increased, that is, the digital chip 1061 and the second analog chip 1064 are arranged in a dispersed manner, so that heat can be prevented from being accumulated on the driving board 102, heat dissipation is facilitated, and overheating of the light emitting source is avoided.
In this scenario, a plurality of second light emitting sources 104 may be disposed on the first surface 1021 at intervals, where the second light emitting sources 104 are electrically connected to the second analog chip 1064 or the first analog chip 1063, so that the second light emitting sources 104 emit light while the first light emitting sources 103 emit light, thereby improving the backlight intensity and the uniformity of the backlight of the light emitting module.
Accordingly, in the implementation manner in which the second analog chip 1064 and the digital chip 1061 are disposed on the second surface 1022, the second analog chip 1064 and the digital chip 1061 may be prevented from occupying the space of the first surface 1021, and further more second light emitting sources 104 may be disposed on the first surface 1021, so as to improve the backlight intensity.
In the above implementation manner, the number of the first analog chip 1063 and the second analog chip 1064 may be one or more, and the number of the first analog chip 1063 and the second analog chip 1064 is not limited in this embodiment.
In the second and third scenes, the digital chip 1061 may be integrated with one or more of a signal processing function, a brightness adjusting function, a detecting function (e.g., temperature detection, open-short detection, etc.), a timing control function (BL-TCON), a function of adjusting brightness according to a used temperature range of the first light emitting source 103, a function of providing raw display data, and the like. Thereby improving the operation and data processing capabilities of the drive board 102 and improving the integration of the drive board 102.
The digital chip 1061 may further be provided with one or more of a power management module, an image processor, a central processing unit, a flash memory, a double data rate memory, a system-in-chip, a radio frequency module, a photosensitive chip, a fingerprint recognition chip, an iris recognition chip, a face recognition chip, a sensor chip, a power manager, an antenna module, a receiver, a microphone, a timing controller, a touch sensing chip, a wireless controller, a bluetooth module, an inertial sensor, or a pressure gauge, so that the driving board 102 has a function of "storing and/or operating and/or sensing", further improving the operation and data processing capabilities of the driving board 102, and further improving the integration level of the driving board 102.
In scenario two and scenario three, the digital chip may include a substrate, and a wafer disposed on the substrate, on which integrated circuits may be integrated to implement corresponding control and data processing functions through the integrated circuits. Such as one or more of a signal processing function, a brightness adjusting function, a detecting function (e.g., temperature detection, open-short detection, etc.), a timing control function (BL-TCON), a function of adjusting brightness according to a use temperature range of the first light emitting source, a function of providing raw display data, etc.
The digital chip 1061 may include a substrate, and first and second wafers disposed on the substrate in spaced apart relation. The integrated circuits on the first wafer are more complex (high in integration level), and the integrated circuits on the second wafer are simpler (low in integration level). Accordingly, the first and second wafers may be fabricated separately, after which the first and second wafers are mounted on the substrate. The first wafer can be manufactured with higher processing precision, the second wafer can be manufactured with lower processing precision, and compared with the method that all integrated circuits are arranged on the same wafer and manufactured with higher processing precision, the manufacturing cost and manufacturing difficulty of the digital chip can be reduced.
In the first to third scenes, as shown in fig. 17, the light emitting panels 101 may be plural, the plural light emitting panels 101 are arranged in the same layer, one driving panel 102 is arranged between two adjacent light emitting panels 101, and the driving panel 102 and the two adjacent light emitting panels 101 are connected by the connector 105. That is, the driving chip 106 on the driving board 102 is electrically connected with the first light emitting source 103 on the adjacent light emitting board 101 through the connector 105 to drive the light thereof to emit light. By this arrangement, two adjacent light emitting panels 101 share one driving panel 102, and the utilization ratio of the driving panel 102 can be improved.
Referring to fig. 19, in other embodiments, the number of the light emitting panels 101 is plural, the light emitting panels 101 are located in a predetermined plane, and the light emitting panels 101 are sequentially arranged along a predetermined direction (a horizontal direction in the direction shown in fig. 19); the driving plate 102 is provided at one end of the light emitting plate 101 in a vertical direction (vertical direction in the orientation shown in fig. 19) of the preset direction. Accordingly, the driving board 102 may be connected to each light emitting board 101 through the connector 105 to drive the first light emitting source 103 on each light emitting board 101 to emit light. Thus, the same driving board 102 can drive the first light sources 103 on the plurality of light emitting boards 101 to emit light, so that the number of the driving boards 102 can be reduced, and the cost of the light emitting module 100 can be further reduced.
It should be noted that, in the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected or integrally connected; or may be mechanically or electrically connected; the connection may be direct, indirect via an intermediate medium, or communication between two members. The specific meaning of the above terms in the embodiments of the present application can be understood by those skilled in the art according to the specific circumstances.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the embodiments of the present application, and are not limited thereto; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims (10)

1.A light emitting module, comprising:
The LED comprises a light-emitting plate, wherein a plurality of first light-emitting sources are arranged on the light-emitting surface of the light-emitting plate at intervals;
The driving plate and the light-emitting plate are arranged on the same layer, a driving chip is arranged on the driving plate, and the driving chip is electrically connected with each first light-emitting source.
2. The light emitting module of claim 1, wherein the driving plate comprises a first surface and a second surface disposed opposite to each other, the first surface being a surface of the driving plate facing the light emitting side, the driving chip being disposed on the second surface.
3. The light emitting module of claim 2, wherein a plurality of second light emitting sources are disposed on the first surface at intervals, and the driving chip is further electrically connected to each of the second light emitting sources.
4. A light emitting module as recited in claim 2 or claim 3, wherein the driver chip comprises a digital chip and an analog chip, the digital chip being disposed on the driver board, the digital chip being electrically connected to the analog chip, the analog chip being electrically connected to each of the first light emitting sources.
5. The lighting module of claim 4, wherein the digital chip and the analog chip are both disposed on the second surface.
6. The lighting module of claim 4, wherein the analog chip comprises a first analog chip and a second analog chip, the first analog chip is disposed on the light emitting panel, the second analog chip is disposed on the driving panel, the first analog chip and the second analog chip are electrically connected to the digital chip, and the first analog chip and the second analog chip are electrically connected to the plurality of first light emitting sources.
7. The lighting module of claim 6, wherein the second analog chip is disposed on the second surface.
8. The lighting module of any one of claims 1-7, wherein the lighting module comprises a support frame, and wherein the light emitting panel and the drive panel are both detachably connected to the support frame.
9. A display panel, comprising: the color film substrate, the liquid crystal layer and the light-emitting module according to any one of claims 1 to 8 are stacked, and the liquid crystal layer is located between the color film substrate and the light-emitting module.
10. An electronic device, comprising: a housing and the display panel of claim 9, the display panel and the housing together forming an enclosed space.
CN202211337922.2A 2022-10-28 2022-10-28 Light emitting module, display panel and electronic equipment Pending CN117950227A (en)

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KR100847598B1 (en) * 2006-05-10 2008-07-21 주식회사 큐리어스 Backlight unit and method for manufacturing the unit
TWI518278B (en) * 2012-10-11 2016-01-21 隆達電子股份有限公司 Lamp
US11081070B2 (en) * 2018-09-18 2021-08-03 Apple Inc. Backlight systems and methods for electronic device displays
CN215599468U (en) * 2021-08-18 2022-01-21 安徽芯瑞达科技股份有限公司 Backlight module for increasing Mini LED light-emitting angle
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