CN221572975U - Backlight module and display device - Google Patents

Abstract

The embodiment of the application provides a backlight module and a display device, wherein the backlight module comprises: the backboard is provided with a through hole; the luminous chip is fixed on one side of the backboard, pins of the luminous chip penetrate through the through holes, and the pins are exposed out of the other side of the backboard. Through punching the backboard, leading pins of the light emitting chips to the back through holes of the backboard, the electric connection between a plurality of light emitting chips and the electric connection with the control part can be directly realized, the existing mode of arranging an aluminum substrate between the backboard and the light emitting chips to install the light emitting chips is replaced, the aluminum substrate is not required, and the cost can be saved.

Description

Backlight module and display device

Technical Field

The application belongs to the technical field of display, and particularly relates to a backlight module and a display device.

Background

The arrangement and combination of the light emitting chips in the backlight module of the display device such as a television can change the point light source into the surface light source, thereby providing uniform backlight to the display module.

The mounting mode of the light emitting chip is usually to perform SMT (Surface Mounted Technology, surface mount technology) bonding on an aluminum substrate, and the aluminum substrate is usually disposed on a back plate in a whole surface for mounting the light emitting chip. However, this arrangement makes the backlight module more costly.

Disclosure of utility model

The embodiment of the application provides a backlight module and a display device, which can change the mounting mode of a light-emitting chip and reduce the manufacturing cost of the backlight module.

In a first aspect, an embodiment of the present application provides a backlight module, including:

The backboard is provided with a through hole;

The luminous chip is fixed on one side of the backboard, pins of the luminous chip penetrate through the through holes, and the pins are exposed out of the other side of the backboard.

Optionally, the pin includes:

The first subsection is arranged on the back plate and is connected with the light-emitting chip;

The second subsection is connected with the first subsection in a bending way and is positioned in the through hole;

And the third subsection is connected with the second subsection in a bending way, and the third subsection is arranged on one side of the back plate, which is away from the light-emitting chip.

Optionally, the backlight module further includes:

And the heat transfer element is arranged between the first subsection and the back plate so as to radiate heat of the light-emitting chip.

Optionally, the material of the heat transfer element is silica gel.

Optionally, the backlight module further includes:

the support is connected with the backboard through a connecting piece, and is sleeved on the light-emitting chip to fix the light-emitting chip, and the light-emitting chip is exposed out of the support.

Optionally, the bracket includes:

the sleeving part is provided with a slot hole, and the light-emitting chip is arranged in the slot hole;

The mounting part is connected with the sleeving part and surrounds the sleeving part, and the mounting part is connected with the backboard through the connecting piece.

Optionally, the height of the sleeving part is greater than the height of the mounting part; and/or

The height of the sleeving part is larger than that of the light-emitting chip.

Optionally, the backlight module further includes a lens, and the lens includes:

a first part covering the sleeving part and the light emitting chip;

The second part is connected with the first part and surrounds the first part, and is arranged on the mounting part and sequentially connected with the mounting part and the backboard through the connecting piece.

Optionally, the first portion includes a case portion having an accommodating space and a protrusion protruding from the case portion toward one side of the light emitting chip;

The backlight module further comprises a reflecting piece which is arranged on the protruding portion so as to reflect and disperse light rays emitted by the light emitting chip.

In a second aspect, an embodiment of the present application further provides a display device, including a backlight module as set forth in any one of the above.

In the backlight module and the display device provided by the embodiment of the application, the back plate is perforated, and the pins of the light emitting chips penetrate through the through holes of the back plate to be led to the back surface, so that the electric connection between a plurality of light emitting chips and the electric connection with the control part can be directly realized, the existing mode of arranging the aluminum substrate between the back plate and the light emitting chips to mount the light emitting chips is replaced, the aluminum substrate is not required, and the cost can be saved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the figures in the following description are only some embodiments of the application, from which other figures can be obtained without inventive effort for a person skilled in the art.

For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts throughout the following description.

Fig. 1 is a schematic structural diagram of a first angle of a display device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a second angle of the display device according to the embodiment of the present application.

Fig. 3 is a schematic diagram of a first structure of a backlight module according to an embodiment of the application.

Fig. 4 is a schematic diagram of a second structure of a backlight module according to an embodiment of the application.

Fig. 5 is a schematic diagram of a third structure of a backlight module according to an embodiment of the application.

Fig. 6 is a schematic diagram of a fourth structure of a backlight module according to an embodiment of the application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.

Referring to fig. 1, fig. 1 is a schematic view illustrating a first angle of a display device according to an embodiment of the application. The embodiment of the application provides a display device 1, wherein the display device 1 can be a device with a display function such as a mobile phone, a tablet, a television, a computer, a vehicle-mounted video device and the like.

The embodiment of the application is exemplified by a liquid crystal type display device, the liquid crystal display utilizes the photoelectric effect of liquid crystal to control by the voltage outside the liquid crystal display, and the liquid crystal display obtains the contrast change of visible optics by utilizing the rotation capability of the liquid crystal molecules to light rays through the refraction characteristics of the liquid crystal molecules, thereby achieving the purpose of the phenomenon.

For example, please refer to fig. 1 in combination with fig. 2, fig. 2 is a schematic diagram illustrating a second angle of a display device according to an embodiment of the present application. The display device 1 includes a backlight module 10 and a display screen 20, the backlight module 10 provides backlight for the display screen 20, the display screen 20 is generally configured by sandwiching a liquid crystal layer between an array substrate and a color film substrate, and the backlight module 10 cooperates with the display screen 20 to realize image display.

In the related art, the mounting mode of the light emitting chip is usually to perform SMT bonding on an aluminum substrate, and the aluminum substrate is disposed on a back plate for mounting the light emitting chip. However, this arrangement makes the backlight module more costly.

In order to reduce the manufacturing cost of the backlight module, the embodiment of the application improves the mounting mode of the light emitting chip in the backlight module, and the description is given below with reference to the accompanying drawings.

Referring to fig. 3 in conjunction with fig. 1 and fig. 2, fig. 3 is a schematic structural diagram of a backlight module according to an embodiment of the application. The backlight module 10 includes a back plate 100 and lamp beads 110.

The back plate 100 is used for carrying components of the backlight module 10, such as the lamp beads 110, i.e. backlight source, diffusion plate, optical film, etc. Illustratively, the backplate 100 is provided with a through-hole 102 for the device to pass through.

The beads 110 are backlight sources. The lamp bead 110 includes a light emitting chip 111 and a glue layer 112, and the light emitting chip 111 has pins 113. The light emitting chip 111 is electrically connected to an external control circuit thereof through the pins 113, so that the light emission of the light emitting chip 111 is conveniently controlled. The glue layer 112 is disposed on the light emitting chip 111, so that on one hand, the light emitting chip 111 can be packaged, and on the other hand, the light emitted by the light emitting chip 111 can be adjusted. For example, the glue layer 112 may be a fluorescent glue, for example, when blue light emitted by the light emitting chip 111 is incident into the fluorescent glue, since the blue light spectrum is within the excitation spectrum of the fluorescent powder, the fluorescent powder can have a strong absorption effect on the blue light, and after a part of the absorbed blue light is converted into light emitted by the fluorescent powder, the light is mixed with the blue light directly transmitted from the fluorescent glue to form white light.

The leads 113 are a medium for electrically connecting the light emitting chip 111 to other electric devices. In the embodiment of the present application, the light emitting chip 111 is fixed on one side of the back plate 100, that is, the side of the back plate 100 facing the display screen 20. The pins 113 are disposed through the through holes 102, and the pins 113 are exposed on the other side of the back plate 100, i.e. exposed from the back surface of the back plate 100, so as to be electrically connected with other electrical devices.

In the backlight module 10 provided by the embodiment of the application, by punching the back plate 100 and leading the pins 113 of the light emitting chips 111 to the back surface through the through holes 102 of the back plate 100, the electrical connection between the plurality of light emitting chips 111 and the electrical connection with the control part can be directly realized, the existing mode of arranging an aluminum substrate between the back plate and the light emitting chips to mount the light emitting chips is replaced, the aluminum substrate is not required, and the cost can be saved.

In the related art, in order to facilitate electrical connection, electrical devices for electrical connection, such as a connection circuit and a solder leg, are generally disposed on an aluminum substrate, and only the light emitting chip is required to be soldered on the aluminum substrate, so that the electrical connection of the light emitting chip can be conveniently achieved. The connection circuit and the solder fillets on the aluminum substrate make the aluminum substrate more costly. The back plate is mainly used for bearing devices such as lamp beads, the material of the back plate can be metal or hard plastic, the metal only needs to be of a type with high strength and low cost, and the manufacturing cost of the hard plastic is low and is lower than that of the aluminum substrate. Therefore, the embodiment of the application eliminates the arrangement of the aluminum substrate, and the lamp beads 110 are directly mounted on the back plate 100, so that the manufacturing cost of the backlight module 10 can be reduced.

It should be noted that, the number of the pins 113 is generally two, and the corresponding back plate 100 has through holes 102 corresponding to the two pins 113. The two pins 113 serve as positive and negative pins of the light emitting chip 111 so as to be electrically connected with other devices, and the application is described by taking one pin 113 as an example, and the shape of the other pin 113 is similar to that of the other pin, for example, the two pins 113 may be symmetrically distributed. The material of the pins 113 is a pad material, such as silver on nickel.

For example, please refer to fig. 1 to 3 in combination with fig. 4, fig. 4 is a schematic diagram of a second structure of a backlight module according to an embodiment of the present application. The pin 113 includes a first sub-segment 1130, a second sub-segment 1132, and a third sub-segment 1134. The first sub-segment 1130, the second sub-segment 1132, and the third sub-segment 1134 are connected in sequence. The first sub-section 1130 is disposed on the back plate 100 and connected to the light emitting chip 111, i.e. the positive electrode or the negative electrode of the light emitting chip 111 is led out. It is understood that the first sub-section 1130 may be disposed parallel to the back plate 100 to improve the smoothness of the connection and reduce the occurrence of poor lap joints caused by warpage of the wires. The second sub-segment 1132 is bent and connected with the first sub-segment 1130, and is located in the through hole 102, that is, the second sub-segment 1132 may be vertically disposed, and on one hand, may conform to the shape of the through hole 102, and on the other hand, may further lead out the positive electrode or the negative electrode of the light emitting chip 111. The third sub-section 1134 is connected with the second sub-section 1132 in a bending manner, and the third sub-section 1134 is disposed on a side of the back plate 100 away from the light emitting chip 111. The third sub-segment 1134 leads the second sub-segment 1132 out of the through hole 102 for connection with other pins 113 such as the light emitting chip 111. In the process of manufacturing, the first subsection 1130, the second subsection 1132 and the third subsection 1134 are integrally formed, and in order to facilitate wiring on the back surface of the back plate 100, the three subsections are bent and arranged. For ease of illustration, the embodiment of the present application divides pin 113 into three subsections.

It should be noted that, the backlight module 10 includes a plurality of lamp beads 110, the plurality of lamp beads 110 are disposed at intervals, and the plurality of lamp beads 110 are electrically connected through respective pins 113, so as to be electrically connected with the control device, thereby implementing light emission control of the plurality of lamp beads 110.

The backlight module 10 further includes a heat transfer member 120, and the heat transfer member 120 is disposed between the first sub-section 1130 and the back plate 100 to dissipate heat from the light emitting chips 111. The heat transfer member 120 may be made of silica gel, so that the first sub-section 1130 may be adhered to the back plate 100, and heat generated by the light emitting chip 111 may be transferred to the back plate 100, and the back plate 100 is made of a metal material, so that heat of the light emitting chip 111 may be rapidly dissipated. Of course, the heat transfer member 120 may be made of other materials, and the above description is given by way of example of silica gel, and should not be construed as limiting the heat transfer member 120.

For example, please refer to fig. 1 to 4 in combination with fig. 5, fig. 5 is a schematic diagram of a third structure of a backlight module according to an embodiment of the present application. The backlight module 10 further includes a bracket 130 and a lens 140.

The bracket 130 can fix the light emitting chip 111 and adjust the light emitted by the light emitting chip 111. For example, the bracket 130 is connected to the back plate 100 through the connection member 150, and the connection member 150 may be a screw. The support 130 is sleeved on the light emitting chip 111 to fix the light emitting chip 111, and the light emitting chip 111 is exposed out of the support 130 so as to emit light.

Illustratively, the bracket 130 includes a nest 132 and a mount 134. The mounting portion 132 has a slot 133, and the light emitting chip 111 is disposed in the slot 133. Alternatively, the mounting portion 132 is disposed at a position corresponding to the slot 133 for carrying the light emitting chip 111 and the adhesive layer 112. It should be noted that, the slot 133 may be understood as a groove or a through hole, and since the light emitting chip 111 is disposed in the slot 133 and the light emitting chip 111 needs to be connected to the lead 113 at the bottom of the slot 133, the bottom of the slot 133 may be provided with a through hole.

The mounting portion 134 is connected to the fitting portion 132, and is disposed around the fitting portion 132. The height of the sleeving part 132 is larger than that of the mounting part 134, so that the light emitting requirement of the light emitting chip 111 can be met, and the waste of materials can be reduced. The sleeving part 132 may be cylindrical, and the sleeving part 132 gradually decreases from one end far away from the mounting part 134 to one end close to the mounting part 134, so that the sleeving part 132 and the mounting part 134 may be in smooth transition, that is, one side of the sleeving part 132 away from the back plate 100 is a cambered surface, and the lens 140 may be matched to reflect light.

Wherein, the mounting portion 134 is connected with the back plate 100 through the connection member 150 to fix the light emitting chip 111.

The height of the sleeving part 132 is greater than that of the light emitting chip 111, and the side wall surrounding the slot hole 133 can reflect the light emitted by the light emitting chip 111, that is, the light emitted by the light emitting chip 111 is emitted after being improved, and the diffusion angle of the light emitted by the light emitting chip 111 can be increased by matching with the lens 140. Here, the height of the light emitting chip 111 may not include the lead 113 portion, or may be understood as comparing the height of the main body portion of the light emitting chip 111 with the height of the socket 132.

Illustratively, the material of the lens 140 may be selected to be a transparent material, such as a transparent Polycarbonate (PC), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), or Polypropylene (PP) material, and the lens 140 may be optically designed according to the light type, such as a large angle light emission requirement.

For example, lens 140 includes a first portion 142 and a second portion 144. The first portion 142 covers the sleeving part 132 and the light emitting chip 111, and the first portion 142 has an accommodating space 143, so that even if the sleeving part 132 and the light emitting chip 111 are both located in the accommodating space 143, the accommodating space 143 still has a margin space so as to adjust the light emitted by the light emitting chip 111. The first portion 142 may be bowl-shaped and the second portion 144 is connected to the first portion 142 and disposed about the first portion 142. The second portion 144 is disposed on the mounting portion 134 and is connected to the mounting portion 134 and the back plate 100 in turn by a connector 150. That is, the lens 140 shares the connection member 150 with the bracket 130, so that the arrangement of the connection member can be reduced, thereby saving the cost.

Wherein the first portion 142 includes a shell portion 1420 and a projection 1422. The case portion 1420 has an accommodating space 143. The projection 1422 projects from the case portion 1420 toward one side of the light emitting chip 111, for example, the projection 1422 may project to be tapered, and a tip of the taper extends toward the light emitting chip 111. And, the first portion 142 is partially coated on the right above the light emitting chip 111, so as to reflect the light of the light emitting chip 111. For example, the backlight module 10 further includes a reflective member 160, and the reflective member 160 is disposed on the protrusion 1422 to reflect and diffuse the light emitted from the light emitting chip 111.

For example, the material of the reflecting member 160 may be metal, such as a silver film or a lower cost aluminum film, to reflect the light emitted from the light emitting chip 111. That is, a metal film is disposed on the surface of the protruding portion 1422, and the light emitted by the light emitting chip 111 is lifted by the sleeving portion 132 and reflected by the reflecting member 160, so that a large-angle light emission can be realized.

In the embodiment of the present application, the light-emitting chips 111 are included in each light-emitting chip 110, and the light-emitting chips 111 are illustrated as two light-emitting chips 111 in each light-emitting chip 110, which is not to be construed as a limitation on the number of light-emitting chips 111 in each light-emitting chip 110. The two light emitting chips 111 are disposed at intervals, and the tip of the protrusion 1422 may correspond to the middle position of the two light emitting chips 111, so that the tapered side of the protrusion 1422 may reflect and diverge light emitted from the two light emitting chips 111, respectively, thereby expanding the light extraction angle.

Fig. 6 is a schematic diagram of a fourth structure of the backlight module according to the embodiment of the application. If the lamp bead 110 includes one light emitting chip 111, the tip of the protrusion 1422 may be disposed corresponding to the middle of the light emitting chip 111, such as the center line, and the tapered side of the protrusion 1422 may reflect and diverge light emitted from the light emitting chip 111 from the peripheral side, respectively, so that the light extraction angle may be also enlarged. In this case, the projection 1422 is different in size from the projection 1422 in the case of the two light emitting chips 111 described above, such as a smaller diameter of the bottom of the projection 1422 in the case of one light emitting chip 111.

It should be noted that, in the backlight module 10 of the embodiment of the present application, an aluminum substrate can be avoided, and productivity waste generated by SMT can be avoided, which is a backlight scheme with extremely reduced cost, and meanwhile, the cooperation of the bracket 130 and the lens 140 can realize large-angle light emission. In the related art, the aluminum substrate in the backboard has a height difference to the reflector plate, so that the cavity cannot be completely leveled, and the white field picture is not good enough. The light source assembly of the embodiment of the present application is wired outside the back plate 100, which can effectively improve the problem.

In the backlight module 10 and the display device 1 provided in the embodiments of the present application, by punching the backplate 100 and guiding the pins 113 of the light emitting chips 111 to the back surface through the through holes 102 of the backplate 100, the electrical connection between the plurality of light emitting chips 111 and the electrical connection with the control part can be directly realized, instead of the existing manner of arranging an aluminum substrate between the backplate and the light emitting chips to mount the light emitting chips, the aluminum substrate is not required, and the cost can be saved.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.

The backlight module and the display device provided by the embodiment of the application are described in detail, and specific examples are applied to illustrate the principle and the implementation of the application, and the description of the above embodiments is only used for helping to understand the method and the core idea of the application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the present description should not be construed as limiting the present application in summary.

Claims (10)

1. A backlight module, comprising:

The backboard is provided with a through hole;

The luminous chip is fixed on one side of the backboard, pins of the luminous chip penetrate through the through holes, and the pins are exposed out of the other side of the backboard.

2. A backlight module according to claim 1, wherein the pins comprise:

The first subsection is arranged on the back plate and is connected with the light-emitting chip;

The second subsection is connected with the first subsection in a bending way and is positioned in the through hole;

And the third subsection is connected with the second subsection in a bending way, and the third subsection is arranged on one side of the back plate, which is away from the light-emitting chip.

3. A backlight module according to claim 2, wherein the backlight module further comprises:

And the heat transfer element is arranged between the first subsection and the back plate so as to radiate heat of the light-emitting chip.

4. A backlight module according to claim 3, wherein the heat transfer member is made of silica gel.

5. A backlight module according to any of claims 1-4, further comprising:

the support is connected with the backboard through a connecting piece, and is sleeved on the light-emitting chip to fix the light-emitting chip, and the light-emitting chip is exposed out of the support.

6. A backlight module according to claim 5, wherein the bracket comprises:

the sleeving part is provided with a slot hole, and the light-emitting chip is arranged in the slot hole;

The mounting part is connected with the sleeving part and surrounds the sleeving part, and the mounting part is connected with the backboard through the connecting piece.

7. The backlight module according to claim 6, wherein the height of the sheathing part is greater than the height of the mounting part; and/or

The height of the sleeving part is larger than that of the light-emitting chip.

8. A backlight module according to claim 6, further comprising a lens comprising:

a first part covering the sleeving part and the light emitting chip;

The second part is connected with the first part and surrounds the first part, and is arranged on the mounting part and sequentially connected with the mounting part and the backboard through the connecting piece.

9. The backlight module according to claim 8, wherein the first portion includes a housing portion having an accommodating space and a protrusion protruding from the housing portion toward one side of the light emitting chip;

The backlight module further comprises a reflecting piece which is arranged on the protruding portion so as to reflect and disperse light rays emitted by the light emitting chip.

10. A display device comprising a backlight module according to any one of claims 1-9.