CN117950224A - Display device - Google Patents

Abstract

The invention discloses a display device, comprising: a display panel for displaying an image; the backlight module is positioned on the light incident side of the display panel; the backlight module comprises a lamp plate, wherein the lamp plate comprises: a plurality of light emitting chips as backlight sources; a plurality of weirs, each weirs surrounding at least one light emitting chip, wherein the weirs are used for limiting the light emitting range of the light emitting chip; at least one layer of protective film is positioned in each dam, and each protective film is overlapped and covered on the surface of the light-emitting chip; at least one layer of bubble film is positioned in each surrounding dam, and each bubble film lamination is arranged on one side of all the protective films, which is far away from the light-emitting chip; each layer of bubble film comprises a plurality of bubbles, the emergent light of the light emitting chip is refracted and reflected by the bubbles, and the brightness of the emergent light right above the light emitting chip or the regional central area of the light emitting chip can be reduced on the premise that the light loss of the emergent light right above the light emitting chip or the regional central area of the light emitting chip is smaller, so that the emergent light of the backlight module is more uniform.

Description

Display device

Technical Field

The invention relates to the technical field of display, in particular to a display device.

Background

A Liquid Crystal Display (LCD) has advantages of high brightness, fine image quality, low power consumption, and long lifetime, and is widely used in the display field. The conventional LCD uses a Light-emitting Diode (LED) as a backlight source, but there is a halo phenomenon caused by a large Light-controlling area and Light leakage.

The current trend is to use light emitting diode chips as backlight sources for LCDs to achieve finer zonal control of LCD backlight modules. However, light leakage from the light-emitting region to the edge of the adjacent region occurs between the partitions of the backlight module, resulting in halation around the display image. The halation problem can be improved by shortening the distance from the light source to the display panel in the backlight module, but the problem of light shadow caused by insufficient light mixing can occur.

In the scheme of the present stage, a distributed bragg reflection (Distributed Bragg Reflector, abbreviated as DBR) structure is generally used to realize the light diffusion effect, so as to improve the phenomenon of uneven brightness and lamp shadows caused by larger brightness of the center of the light source, but the scheme using the DBR has the problem of large brightness loss of the center of the light source.

Disclosure of Invention

The invention provides a display device which is used for enabling light emitted from the right upper side of a light-emitting chip or light loss of a regional central area of the light-emitting chip to be more uniform.

The present invention provides a display device including: a display panel for displaying an image;

The backlight module is positioned on the light incident side of the display panel; the backlight module comprises a lamp panel;

The lamp panel includes:

a plurality of light emitting chips as backlight sources;

A plurality of weirs, each of which is arranged around at least one of the light emitting chips, wherein the weirs are used for limiting the light emitting range of the light emitting chips;

At least one layer of protective film is positioned in each dam, and each protective film lamination covers the surface of the light-emitting chip;

At least one layer of bubble film is positioned in each surrounding dam, and each bubble film lamination is arranged on one side of all the protection films, which is away from the light-emitting chip; each layer of bubble film comprises a plurality of bubbles, and the bubbles are used for refracting and reflecting incident light rays.

In some embodiments of the present invention, the at least one protective film and the at least one bubble film are made of the same material, and each bubble film forms the bubbles after being foamed by doping a foaming agent;

The at least one protective film and the at least one bubble film are made of organic silica gel, and the plurality of dams are made of silica gel containing reflective substances.

In some embodiments of the invention, the thickness of the dam is greater than or equal to the sum of the thickness of each of the protective films and each of the bubble films disposed within the dam.

In some embodiments of the present invention, a layer of the protective film and a layer of the bubble film are disposed in each of the weirs; the bubble film is arranged on the surface of one side, away from the light-emitting chip, of the protective film;

the thickness of the protective film is larger than that of the light-emitting chip, and the bubble film is not contacted with the light-emitting chip.

In some embodiments of the present invention, a plurality of layers of the protective films and a plurality of layers of the bubble films are disposed in each of the weirs, a sum of thicknesses of the protective films is greater than a thickness of the light emitting chip, and the bubble films are not in contact with the light emitting chip.

In some embodiments of the invention, the number of protective films in each of the weirs is the same, and the number of bubble films in each of the weirs is the same.

In some embodiments of the invention, each of the weirs is disposed around one of the light emitting chips.

In some embodiments of the present invention, the plurality of light emitting chips are divided into a plurality of partitions, each of the partitions including at least two of the light emitting chips; each of the weirs is disposed around one of the sections.

In some embodiments of the invention, each of the weirs forms a grid pattern exposing each of the sections.

In some embodiments of the present invention, the backlight module further includes:

the lamp panel is positioned on the backboard;

the diffusion plate is positioned on the light emitting side of the lamp panel; the diffusion plate is separated from the lamp panel by a set distance;

the optical diaphragm is positioned at one side of the diffusion plate away from the lamp panel;

the light-emitting chip adopts a Mini LED chip or a Micro LED chip; the color of the emergent light of each light emitting chip is the same; the backlight module further comprises:

A color conversion layer between the diffusion plate and the optical film; the color conversion layer is used for emitting light of other colors under the excitation of the emitted light of the light emitting chip.

The invention has the following beneficial effects:

The display device provided by the invention comprises: a display panel for displaying an image; the backlight module is positioned on the light incident side of the display panel; the backlight module comprises a lamp plate, wherein the lamp plate comprises: a plurality of light emitting chips as backlight sources; a plurality of weirs, each weirs surrounding at least one light emitting chip, wherein the weirs are used for limiting the light emitting range of the light emitting chip; at least one layer of protective film is positioned in each dam, and each protective film is overlapped and covered on the surface of the light-emitting chip; at least one layer of bubble film is positioned in each surrounding dam, and each bubble film lamination is arranged on one side of all the protective films, which is far away from the light-emitting chip; each layer of bubble film comprises a plurality of bubbles, the emergent light of the light emitting chip is refracted and reflected by the bubbles, and the brightness of the emergent light right above the light emitting chip or the regional central area of the light emitting chip can be reduced on the premise that the light loss of the emergent light right above the light emitting chip or the regional central area of the light emitting chip is smaller, so that the emergent light of the backlight module is more uniform.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of a light emitting chip according to an embodiment of the present invention;

FIG. 3 is a top view of a lamp panel according to an embodiment of the present invention;

FIG. 4 is a second top view of a lamp panel according to an embodiment of the present invention;

FIG. 5 is a third top view of a lamp panel according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a partial cross section of a lamp panel according to an embodiment of the present invention;

FIG. 7 is a second schematic partial cross-sectional view of a lamp panel according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of an optical path according to an embodiment of the present invention;

FIG. 9 is a third schematic partial cross-sectional view of a lamp panel according to an embodiment of the present invention;

FIG. 10 is a second schematic diagram of an optical path according to an embodiment of the present invention.

The LED display device comprises a D-display panel, a T-backlight module, a 100-backboard, a 200-diffusion plate, a 300-color conversion layer, a 400-optical film, a P-lamp panel, a 10-light-emitting chip, a 20-protection film, a 30-bubble film, an H-dam, a B-bubble, an S-locating hole, a 01-substrate, a 02-n type semiconductor layer, a 03-light-emitting layer, a 04-P type semiconductor layer, a 05-n electrode layer, a 06-P electrode layer, a 07-circuit board, a 08-bonding pad and 09-solder paste.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a further description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a repetitive description thereof will be omitted. The words expressing the positions and directions described in the present invention are described by taking the drawings as an example, but can be changed according to the needs, and all the changes are included in the protection scope of the present invention. The drawings of the present invention are merely schematic representations of relative positional relationships and are not intended to represent true proportions.

The LCD is composed of a liquid crystal display panel and a backlight module, and since the liquid crystal display panel itself does not emit light, a light source provided by the backlight module is required to realize display. The display principle of LCD is that liquid crystal is set between two electrodes, and the liquid crystal molecules are twisted under the drive of electric field between two electrodes to control the back light source to be transmitted or shielded for displaying image, and color filter is set to realize color display.

However, the LCD has difficulty in high contrast display due to limitations of a light emitting principle and a manufacturing process, and a scheme of area dimming is generally used to improve the LCD at present. The traditional LCD adopts LEDs as backlight sources, and the LEDs are divided into different areas to be matched with a display image to carry out area dimming so as to improve the image contrast, but the accuracy of the area dimming is not high, and high contrast is difficult to realize.

In the embodiment of the invention, the light-emitting chip is used as a backlight source of the LCD, and specifically the light-emitting chip refers to a Mini LED chip or a Micro LED chip, wherein the transverse dimension of the Mini LED chip is smaller than 500 μm, and the transverse dimension of the Micro LED chip is smaller than 100 μm.

Compared with the LED light source adopted in the traditional LCD, the Mini LED chip and the Micro LED chip have smaller size, and the combination of the regional dimming technology is beneficial to realizing more refined partition control of the LCD backlight, thereby realizing high-contrast display.

However, although the use of Mini LED chips and Micro LED chips instead of conventional LEDs can increase the number of partitions in the backlight module, there is still a problem of halation caused by light leakage from the light emitting area to the nearby area during display, and halation can be improved by shortening the distance from the light emitting chip to the display panel in the backlight module, but the mixing distance is reduced, and the mixing of light in the backlight module is insufficient, resulting in the occurrence of lamp shadows.

There are two common approaches in the related art to solve the above problems: one is a scheme of forming a semicircular structure packaging layer directly on a light-emitting chip by using colloid, but the diffusion capability of the scheme on emergent light of the light-emitting chip is insufficient; the other scheme is a DBR scheme, and the DBR optical film is arranged on the light emitting side of the light emitting chip to selectively reflect the angle and wavelength of the incident light, so that the defect that the light is not scattered enough in the former scheme can be overcome, but the brightness loss right above the light emitting chip can reach 30%.

In view of the above, an embodiment of the present invention provides a display device for solving the above halation problem and avoiding the occurrence of the lamp shadow problem.

Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the present invention.

As shown in fig. 1, the display device provided in the embodiment of the invention includes a display panel D and a backlight module T. The display panel D may employ an LCD display panel for displaying images. The display panel D is generally rectangular or square, and may be configured in other shapes as needed when the special-shaped display device is applied, which is not limited herein.

The backlight module T is positioned on the light incident side of the display panel D and can provide backlight for the display panel D. The backlight module T may include: the color conversion device includes a back plate 100, a lamp panel P, a diffusion plate 200, a color conversion layer 300, and an optical film 400.

The back plate 100 is located at the bottom of the display device and has supporting and carrying functions. The back plate 100 is typically a square or rectangular structure, and when applied to a shaped display device, its shape is adapted to the shape of the display device. The material of the back plate 100 is aluminum, iron, aluminum alloy, iron alloy, or the like. The back plate 100 is used for fixedly supporting the edge positions of the optical film, the diffusion layer and other components, and can also play a role in heat dissipation.

The lamp panel P is disposed on the back plate 100, and the shape of the lamp panel P is adapted to the shape of the backlight module T, and may be generally square or rectangular. The light panels P are located on the light incident side of the display panel D, and provide a backlight source for the display panel D, and one or more light panels P may be disposed in the backlight module T according to the size of the display device in practical implementation, where the number of light panels P is not limited. The backlight can be provided jointly between the lamp panels P in a mutually spliced mode, so that the optical problem caused by splicing between the lamp panels is avoided, and positioning holes can be formed in each lamp panel, so that the splice between the adjacent lamp panels is made as small as possible.

The diffusion plate 200 is located at the light emitting side of the lamp panel P, and a set distance is provided between the diffusion plate 200 and the lamp panel P. The diffusion plate 200 is generally square or rectangular, and may be provided with a scattering particle material, and light incident on the scattering particle material is continuously refracted and reflected, so as to achieve the effect of scattering the light, and further homogenize the light emitted from the light emitting chip 10.

The optical film 400 is positioned at a side of the diffusion plate 200 facing away from the lamps P, the optical film 400 is integrally disposed and the optical film 400 has the same shape as the diffusion plate 200, and may be generally disposed in a rectangular shape or a square shape. The optical film 400 may be provided to adapt the display device to various application scenarios.

In a specific implementation, the optical film 400 may include a prism sheet that may change an outgoing angle of light, thereby changing a viewable angle of the display device. The prism sheet generally has a function of converging light rays toward a positive viewing angle direction, whereby positive viewing angle brightness can be improved. The optical film 400 may further include a reflective polarizer, which is used as a brightness enhancement film, so that the brightness of the display and the utilization efficiency of light can be improved, and the outgoing light has polarization property, so that the use of the polarizer under the liquid crystal display panel is omitted.

In some embodiments, if the light panels P can emit light of only one color, for example, only blue light, the backlight module T may further include a color conversion layer 300, where the color conversion layer 300 is located between the diffusion plate 200 and the optical film 400, and the color conversion layer 300 is located on the light emitting side of each light panel P, and the color conversion layer 300 is a whole layer structure, and the shape of the light panel is adapted to the shape of the back plate 100, and may be generally set to be square or rectangular.

The color conversion layer 300 may include a red light conversion material and a green light conversion material therein, wherein the red light conversion material may be excited to generate red light under the irradiation of blue light, the green light conversion material may be excited to generate green light under the irradiation of blue light, and the red, green and blue light are mixed and emitted to provide backlight for the display panel, so that the color conversion layer 300 may be used to emit light of other colors under the excitation of blue light.

In some embodiments of the present invention, the color conversion layer 300 may be a quantum dot layer, where the quantum dot layer includes a red quantum dot material and a green quantum dot material, the red quantum dot material emits red light under excitation of blue light, the green quantum dot material emits green light under excitation of blue light, and the red light, the green light and the transmitted blue light emitted by the excitation are mixed into white light for emitting.

In other embodiments of the present invention, the color conversion layer 300 may be a fluorescent layer, where the fluorescent layer includes a red light conversion material and a green light conversion material, the red light conversion material emits red light under excitation of blue light, the green light conversion material emits green light under excitation of blue light, and the red light, the green light and the transmitted blue light emitted by the excitation are mixed to emit white light.

In the embodiment of the present invention, the lamp panel P may include a plurality of light emitting chips, a plurality of weirs, at least one protective film, and at least one bubble film.

Fig. 2 is a schematic structural diagram of a light emitting chip according to an embodiment of the present invention.

The light emitting chip may be a Mini LED chip or a Micro LED chip as a backlight source of the display device, and the light emitting chip 10 may be a flip-chip structure. Referring to fig. 2, the flip-chip light emitting chip may include a substrate 01, and an n-type semiconductor layer 02, a light emitting layer 03, and a p-type semiconductor layer 04 may be sequentially formed on the sapphire substrate 01 by a chemical vapor deposition technique using sapphire as the substrate 01, an n-electrode layer 05 composed of a metal such as ni—au may be formed on the n-type semiconductor layer 02 by an evaporation process, and a p-electrode layer 06 composed of a metal such as ni—au may be formed on the p-type semiconductor layer 04. In specific implementations, the n-type semiconductor layer 02, the light-emitting layer 03, and the p-type semiconductor layer 04 in the light-emitting chip of different colors may be formed using different materials as needed, and are not limited herein.

The lamp panel P includes a circuit board 07, and the circuit board 07 may be a printed circuit board (Printed Circuit Board, abbreviated as PCB) or the like. As shown in fig. 2, the circuit board 07 includes a plurality of bonding pads 08 for bonding the light emitting chip 10, and the flip-chip has electrodes facing downward, so that it can be directly connected to the circuit board 07. After the circuit board 07 and the light emitting chip 10 are manufactured, solder paste 09 is coated on the bonding pads, the light emitting chip is transferred onto the circuit board 07, and the n electrode layer 05 and the p electrode layer 06 of the light emitting chip 10 are welded on the circuit board 07 through a reflow soldering process and the like.

The light emitting chip of the flip-chip structure can be directly bonded with the circuit board without bonding wires, so that the connection process between the light emitting chip and the lamp panel can be simplified, and the light transmission performance of the light emitting chip 10 can be enhanced by using the light emitting chip of the flip-chip structure, so that the display contrast ratio is improved.

FIG. 3 is a top view of a lamp panel according to an embodiment of the present invention; fig. 4 is a second top view of a lamp panel according to an embodiment of the invention.

Because the light emitting directions of the light emitting chips comprise different angles, light rays emitted from the light emitting chips or the subareas thereof can enter the position range of the adjacent light emitting chips or the subareas thereof, and the problem of halation caused by light leakage can be caused when the backlight is subjected to subarea control, the embodiment of the invention is provided with the surrounding dams surrounding the light emitting chips so as to limit the light emitting range of the light emitting chips.

In the embodiment of the invention, each light-emitting chip is connected to the circuit board to form the surrounding dam, the surrounding dam can adopt the glue material containing the reflecting substance, and then glue lines which are mutually perpendicular are formed by using a transverse and longitudinal scribing mode, and each glue line forms a grid pattern. In practice, the dam may be made of white reflective material, such as white silica gel. Each surrounding dam is arranged around at least one light-emitting chip, and light rays emitted by the light-emitting chips in the surrounding dam range can be reflected by the surrounding dams when transmitted to the surrounding dams, so that the emitting direction of the light rays is changed, and the light emitting range of the light-emitting chips is limited.

Referring to fig. 3, in some embodiments of the present invention, each of the weirs H is disposed around one of the light emitting chips 10, and at this time, one of the light emitting chips 10 corresponds to one of the partitions, and the light emitted from each of the light emitting chips 10 can be limited within the range of the weirs H, so that the light emitted from each of the light emitting chips 10 is not interfered with each other, thereby reducing light leakage.

Referring to fig. 4, in other embodiments of the present invention, a plurality of light emitting chips may be divided into a plurality of partitions, each including at least two light emitting chips 10, each of the weirs H being disposed around one partition, and the grid-like pattern formed by the weirs H exposing the respective partitions. In the specific implementation, the number of the light emitting chips 10 in each partition may be the same or different, and is not limited herein. The light emitted by the light emitting chips 10 in each partition is limited in the range of the surrounding dam H by each surrounding dam H, so that the light leakage phenomenon from each partition to the adjacent partition is reduced, the halation problem is improved, and the light emitting chips are partitioned and then the surrounding dam is formed, so that the using amount of surrounding dam materials can be saved, and the manufacturing process is simplified.

In the implementation, the surrounding dams H can be selectively arranged around each light emitting chip 10 according to the needs, or the surrounding dams H are arranged around each partition of the light emitting chips 10, so that the flexible control of the emergent light of the light emitting chips 10 is realized, and the halation phenomenon caused by light leakage is improved.

FIG. 5 is a third top view of a lamp panel according to an embodiment of the present invention.

As shown in fig. 5, in some embodiments of the present invention, in order to simplify the manufacturing process, a plurality of light panels P may be disposed in the display device according to the size of the display device, the light panels P may be spliced with each other, the positions of the light panels P may be positioned through the positioning holes S, and then a dam may be formed by scribing the spliced light panels, so that the number of light panels in the display device is not limited.

In the embodiment of the invention, at least one layer of protective film and at least one layer of bubble film are also arranged in each surrounding dam, wherein each protective film lamination is arranged on the surface of the light-emitting chip, and each bubble film lamination is arranged on one side of all the protective films, which is away from the light-emitting chip.

FIG. 6 is a schematic diagram of a partial cross section of a lamp panel according to an embodiment of the present invention; fig. 7 is a second schematic partial cross-sectional view of a lamp panel according to an embodiment of the invention.

As shown in fig. 6 and 7, in the embodiment of the present invention, a protective film 20 and a bubble film 30 are disposed in each of the dams H, and the bubble film 30 is located on a surface of the protective film 20 facing away from the light emitting chip 10.

When the lamp panel is manufactured, the light-emitting chips are connected to the circuit board, then the dams are formed on the circuit board to partition the light-emitting chips, and then the protective films and the bubble films are arranged in the dams.

Specifically, the protective film 20 may be made of transparent colloid materials such as organic silica gel and resin, and the protective film 20 may be covered on each light emitting chip 10 by using a film pressing process, and then the protective film 20 is heated and cured to be spread in a range surrounded by the dam. The protection film 20 can prevent external foreign matters from entering the light-emitting chip 10, so that the influence of the external foreign matters on the performance of the light-emitting chip 10 is avoided, and meanwhile, the protection film 20 can also prevent water and oxygen, so that the service life of the light-emitting chip 10 is prolonged.

The bubble film 30 may be made of a material having thermoplasticity and thermosetting properties, such as silicone rubber, or the like. The organic silica gel is doped with a foaming agent, and gas generated by chemical reaction of the foaming agent can form bubbles in the organic silica gel, so that the organic silica gel needs to be heated when the bubble film 30 is solidified, and a plurality of bubbles B in the bubble film 30 can be formed in the solidification process. In specific implementation, the bubble film 30 can be manufactured by adopting a film pressing process, the solidified bubble film 30 is flatly paved on the surface of the protective film 20, and the used glue amount and the bubble number can be flexibly controlled when the protective film 20 and the bubble film 30 are formed in each surrounding dam by adjusting various steps and parameters in the film pressing process, so that the flatness of the surface of the lamp panel can be further increased.

In practical implementation, the protective film 20 should be formed on the light emitting chip 10 first, then the bubble film 30 should be formed on the protective film 20 after the protective film 20 is formed, and the thickness of the protective film 20 should be larger than that of the light emitting chip 10, so that the bubbles B in the bubble film 30 do not contact with the light emitting chip 10, and the light emitting chip 10 is prevented from being damaged due to chemical substances or other external factors in the foaming process, and the light emitting performance of the light emitting chip 10 is prevented from being affected.

Since the refractive index of the material used for forming the bubble film 30 is larger than the refractive index of the gas in each bubble B, when light is incident into each bubble B from the bubble-free portion of the bubble film 30, the light can be refracted and reflected by the bubble B, i.e., the bubble B can realize both optical effects of refraction and reflection.

A portion of the light incident on the bubble film 30 may be refracted by the bubble B, a portion may be reflected by the bubble B, and a portion may be directly transmitted by a portion of the bubble film 30 without the bubble, so that the refracted and transmitted light may reduce light loss from directly above the light emitting chip or from a region of the center of the light emitting chip.

Fig. 8 is a schematic diagram of an optical path according to an embodiment of the present invention.

As shown in fig. 8, the angle at which the light enters the bubble film 30 is related to the angle at which the light exits from the light emitting chip 10, and the light L1 entering the bubble film 30 at the bubble-free portion is refracted through the surface of the bubble film 30 on the side away from the light emitting chip 10; the light L2 can be emitted after being refracted by the bubble B and the bubble film 30 and being away from the surface of the light emitting chip 10; the light L3 is reflected by the bubble B, and the light reflected by the bubble B may propagate toward the protective film 20, may continue to propagate in the bubble film 30, or may be reflected and refracted again by the bubble B, the propagation process being related to the angle at which the light is incident on the bubble film 20 and the reflection angle; the light L4 incident on the side wall of the back wall is reflected by the back wall of the back wall and then enters the bubble film 30, and the light reflected by the back wall may be refracted or reflected by the bubble B in the bubble film 30.

FIG. 9 is a third schematic partial cross-sectional view of a lamp panel according to an embodiment of the present invention; FIG. 10 is a second schematic diagram of an optical path according to an embodiment of the present invention.

As shown in fig. 9 and 10, in the embodiment of the present invention, the multilayer protective film 20 and the multilayer bubble film 30 are disposed in each of the weirs H, and in a specific implementation, the multilayer protective film 20 may be sequentially formed on the light emitting chip 10 by a film pressing process, and then the multilayer bubble film 30 may be sequentially formed on the uppermost protective film. The number of layers of the protective film 20 and the bubble film 30 is determined by the height of the weirs H and the thickness of each film layer in the film pressing process, and the number of protective films and bubble films is not limited herein.

In some embodiments of the present invention, the number of the protective films 20 in each of the weirs H may be the same, and the number of the bubble films 30 in each of the weirs H may be the same, so that the thickness of the glue layer formed in each of the weirs H may be the same, and the flatness of the surface of the lamp panel may be improved.

Wherein, the sum of the thickness of each protection film 20 is larger than the thickness of the light-emitting chip 10, so that each bubble film is not contacted with the light-emitting chip, the damage of the light-emitting chip 10 caused by chemical substances or other external factors in the foaming process is prevented, the light-emitting performance of the light-emitting chip 10 is influenced, and meanwhile, the protection film 20 can also block water and oxygen, thereby being beneficial to prolonging the service life of the light-emitting chip 10.

In some embodiments of the present invention, to reduce the use of additional materials, the bubble film 30 may be made of the same material as the protective film 20, and each bubble B in the bubble film 30 may be formed only by doping a foaming agent into the material of the bubble film 30 after foaming.

The angle of incidence of the light to each bubble film 30 is related to the angle of emergence of the light from the light emitting chip 10, and after entering the bubble film 30, the light propagating at the bubble-free portion in the bubble film 30 and the light passing through the bubble B in the bubble film 30 only once are the same when the protective film 20 and the bubble film 30 are disposed in the display device, and will not be described herein. Referring to fig. 10, light L5 passing through the bubble B a plurality of times in the bubble film 30 is refracted by the bubble B a plurality of times and then exits through the surface of the bubble film 30 on the side away from the light emitting chip 10; or the light L6 passing through the bubble B many times in the bubble film 30 is refracted and reflected by the different bubble B and then propagates to the protective film 20. The light rays are refracted and reflected in the multi-layer bubble film 30 passing through each bubble B, and the number of times of refraction and reflection is related to the angle of incidence of the light rays to the bubble film 30 and the number and position distribution of the respective bubbles B, and the propagation process is complicated and is not shown here.

In the embodiment of the present invention, the thickness of the wall dam H should be greater than or equal to the sum of the thicknesses of the respective protective films 20 and bubble films 30 disposed in the wall dam H, so that it is ensured that the light emitted from the uppermost bubble film 30 is limited within the range of the wall dam H.

According to the first invention concept, the Mini LED chip or the Micro LED chip is used as a backlight source, so that the number of partitions in the backlight module can be increased, more refined partition control on the LCD backlight area is facilitated, and high-contrast display is realized.

According to the second inventive concept, the connection process between the light emitting chip and the lamp panel can be simplified and the light transmission performance of the light emitting chip can be enhanced using the light emitting chip of the flip-chip structure, thereby improving the contrast ratio of display.

According to the third inventive concept, the dams are made of materials containing reflective materials, each dam is arranged around at least one light emitting chip, and when light rays emitted by the light emitting chips in the range of the dams are transmitted to the dams, the light rays can be reflected by the dams, so that the light emitting range of the light emitting chips or the light emitting chip areas can be limited.

According to the fourth invention conception, a layer of protective film and a layer of bubble film are arranged in each surrounding dam, the protective film can prevent external foreign matters from entering the light-emitting chip, so that the influence of the external foreign matters on the performance of the light-emitting chip is avoided, and meanwhile, the protective film can also prevent water and oxygen, so that the service life of the light-emitting chip is prolonged; the bubbles in the bubble film can simultaneously realize two optical effects of refraction and reflection, and can reduce the brightness of the emergent light right above the light emitting chip or the regional central area of the light emitting chip on the premise of smaller light loss of the emergent light right above the light emitting chip or the regional central area of the light emitting chip, so that the emergent light of the backlight module is more uniform.

According to the fifth inventive concept, a plurality of protective films and a plurality of bubble films can be arranged in each of the weirs according to the height of the weirs H and the thickness of each film in the film pressing process, and light can be refracted and reflected for a plurality of times in each film, so that the finally emergent light is uniform.

According to the sixth invention conception, the number of the protective films and the bubble films in each surrounding dam is the same, so that the thickness of the adhesive layer formed in each surrounding dam is the same, and the flatness of the surface of the lamp panel is improved.

According to the seventh inventive concept, the thickness of the surrounding dam is set to be greater than or equal to the sum of the thicknesses of the respective protective films and bubble films disposed in the surrounding dam, so that it is possible to ensure that the light emitted from the uppermost bubble film is limited within the scope of the surrounding dam, and to prevent the light leakage phenomenon.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (10)

1. A display device, comprising:

a display panel for displaying an image;

The backlight module is positioned on the light incident side of the display panel; the backlight module comprises a lamp panel;

The lamp panel includes:

a plurality of light emitting chips as backlight sources;

A plurality of weirs, each of which is arranged around at least one of the light emitting chips, wherein the weirs are used for limiting the light emitting range of the light emitting chips;

At least one layer of protective film is positioned in each dam, and each protective film lamination covers the surface of the light-emitting chip;

At least one layer of bubble film is positioned in each surrounding dam, and each bubble film lamination is arranged on one side of all the protection films, which is away from the light-emitting chip; each layer of bubble film comprises a plurality of bubbles, and the bubbles are used for refracting and reflecting incident light rays.

2. The display device according to claim 1, wherein the at least one protective film and the at least one bubble film are each made of the same material, and each of the bubble films is foamed by doping a foaming agent to form the bubble;

The at least one protective film and the at least one bubble film are made of organic silica gel, and the plurality of dams are made of silica gel containing reflective substances.

3. The display device according to claim 1, wherein a thickness of the side dam is greater than or equal to a sum of thicknesses of the protective films and the bubble films provided in the side dam.

4. The display device according to claim 3, wherein one of the protective films and one of the bubble films are provided in each of the weirs; the bubble film is arranged on the surface of one side, away from the light-emitting chip, of the protective film;

the thickness of the protective film is larger than that of the light-emitting chip, and the bubble film is not contacted with the light-emitting chip.

5. The display device according to claim 3, wherein a plurality of layers of the protective films and a plurality of layers of the bubble films are provided in each of the weirs, a sum of thicknesses of the protective films being larger than a thickness of the light emitting chip, and each of the bubble films not being in contact with the light emitting chip.

6. The display device of claim 5, wherein the number of said protective films in each of said weirs is the same and the number of said bubble films in each of said weirs is the same.

7. The display device of any one of claims 1-6, wherein each of the weirs is disposed around one of the light emitting chips.

8. The display device according to any one of claims 1 to 6, wherein the plurality of light emitting chips are divided into a plurality of partitions, each of the partitions including at least two of the light emitting chips; each of the weirs is disposed around one of the sections.

9. The display device of claim 8, wherein each of said weirs forms a grid pattern exposing each of said sections.

10. The display device according to any one of claims 1 to 6, wherein the backlight module further comprises:

the lamp panel is positioned on the backboard;

the diffusion plate is positioned on the light emitting side of the lamp panel; the diffusion plate is separated from the lamp panel by a set distance;

the optical diaphragm is positioned at one side of the diffusion plate away from the lamp panel;

the light-emitting chip adopts a Mini LED chip or a Micro LED chip; the color of the emergent light of each light emitting chip is the same; the backlight module further comprises:

A color conversion layer between the diffusion plate and the optical film; the color conversion layer is used for emitting light of other colors under the excitation of the emitted light of the light emitting chip.