CN117943650A - Superhard cutter and brazing method thereof - Google Patents
Superhard cutter and brazing method thereof Download PDFInfo
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- CN117943650A CN117943650A CN202410288055.0A CN202410288055A CN117943650A CN 117943650 A CN117943650 A CN 117943650A CN 202410288055 A CN202410288055 A CN 202410288055A CN 117943650 A CN117943650 A CN 117943650A
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- 238000005219 brazing Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000009713 electroplating Methods 0.000 claims abstract description 39
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 239000000945 filler Substances 0.000 claims abstract description 29
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 21
- 238000000151 deposition Methods 0.000 claims abstract description 18
- 239000011159 matrix material Substances 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 51
- 239000010949 copper Substances 0.000 claims description 42
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052709 silver Inorganic materials 0.000 claims description 29
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 26
- 239000004332 silver Substances 0.000 claims description 26
- 238000004544 sputter deposition Methods 0.000 claims description 24
- 239000010936 titanium Substances 0.000 claims description 23
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 38
- 239000000463 material Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000008367 deionised water Substances 0.000 description 11
- 229910021641 deionized water Inorganic materials 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 238000003756 stirring Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 238000004506 ultrasonic cleaning Methods 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- WBZKQQHYRPRKNJ-UHFFFAOYSA-L disulfite Chemical compound [O-]S(=O)S([O-])(=O)=O WBZKQQHYRPRKNJ-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- YWJQGSHYTRHJJH-UHFFFAOYSA-N [Co].[Ti].[W] Chemical compound [Co].[Ti].[W] YWJQGSHYTRHJJH-UHFFFAOYSA-N 0.000 description 1
- ATCDNCMWCPJXNQ-UHFFFAOYSA-N [Nb].[Ta].[Ti].[W] Chemical compound [Nb].[Ta].[Ti].[W] ATCDNCMWCPJXNQ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000005270 abrasive blasting Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- JPNWDVUTVSTKMV-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co].[W] JPNWDVUTVSTKMV-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 description 1
- 229940043349 potassium metabisulfite Drugs 0.000 description 1
- 235000010263 potassium metabisulphite Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Abstract
The invention provides a superhard cutter and a brazing method thereof, and relates to the technical field of brazing. Specifically: the brazing method comprises the following steps: preparing a brazing filler metal layer at the welding surface of the hard alloy matrix and/or the PcBN tool bit by a deposition method, and then assembling and brazing the hard alloy matrix and the PcBN tool bit; wherein the deposition method comprises at least one of electroplating or magnetron sputtering. The invention can effectively avoid part of manual operation steps in the superhard cutter preparation process, thereby effectively avoiding a series of technical defects caused by manually smearing soldering paste, having the advantages of uniform welding seam width, high assembly efficiency, high strength of welding surface joints and the like, and having good application prospect.
Description
Technical Field
The invention relates to the technical field of brazing, in particular to a superhard cutter and a brazing method thereof.
Background
Polycrystalline cubic boron nitride (Polycrystalline cubic Boron Nitride, pcBN) belongs to one of superhard materials, and is widely used for polishing tools and other precision workpieces due to its excellent grinding performance as a novel material synthesized by an artificial method and having hardness inferior to natural diamond. The through-welded or composite PcBN tool has the advantages of low cost, high machining efficiency and the like, and at least one PcBN tool bit is welded on a hard alloy substrate during tool preparation. Generally, workers are required to smear paste-like solder or soldering paste on a part to be welded on a hard alloy substrate, then assemble a PcBN tool bit and the hard alloy substrate coated with the soldering paste together, and finally weld the parts in a furnace. However, the manual smearing of the soldering paste on the hard alloy substrate and the assembling of the PcBN tool bit depend on experience of operators, and the situations of low assembling efficiency, excessive extrusion of the soldering paste, uneven welding seam gaps and the like easily occur, so that adverse effects are caused on abrasion and service life of the tool bit.
In view of this, the present invention has been made.
Disclosure of Invention
The first aim of the invention is to provide a brazing method of a superhard cutter, which is mainly used for solving the technical defects of low assembly efficiency, extremely easy occurrence of excessive extrusion of soldering paste, uneven weld gaps and the like caused by manual coating of soldering paste on a superhard alloy substrate and a PcBN tool bit; the brazing method can achieve good brazing effect and has the advantages of uniform weld width, high assembly efficiency, high strength of welded joints and the like.
The second object of the invention is to provide a superhard tool manufactured by the brazing method of the superhard tool.
In order to achieve the above object of the present invention, the following technical solutions are specifically adopted:
A method of brazing a superhard cutter comprising the steps of: preparing a brazing filler metal layer at the welding surface of the hard alloy matrix and/or the PcBN tool bit by a deposition method, and then assembling and brazing the hard alloy matrix and the PcBN tool bit;
wherein the deposition method comprises at least one of electroplating or magnetron sputtering.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the brazing filler metal layer is preset at the welding surface of the hard alloy substrate and/or the PcBN tool bit, so that the manual step of the superhard tool can be effectively avoided, and a series of technical defects caused by manually smearing soldering paste are avoided; meanwhile, the brazing method has the advantages of uniform weld width, high assembly efficiency, high strength of the welded joint and the like.
Detailed Description
The technical solution of the present invention will be clearly and completely described in conjunction with the specific embodiments, but it will be understood by those skilled in the art that the examples described below are some, but not all, examples of the present invention, and are intended to be illustrative only and should not be construed as limiting the scope of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
The invention is carried out by the following specific embodiments: a method of brazing a superhard cutter comprising the steps of: preparing a brazing filler metal layer at the welding surface of the hard alloy matrix and/or the PcBN tool bit by a deposition method, and then assembling and brazing the hard alloy matrix and the PcBN tool bit; wherein the deposition method comprises at least one of electroplating or magnetron sputtering.
Before the PcBN tool bit is welded to the hard alloy substrate, a brazing filler metal layer with required brazing filler metal components is prefabricated on the hard alloy substrate or at one or two welding surfaces of the PcBN tool bit, namely, a plating layer is deposited in a plating or magnetron sputtering mode to serve as the brazing filler metal layer, so that manual smearing of the brazing filler metal is not needed when the tool bit and the substrate are assembled, the efficiency is improved, and the defect of uneven welding seams caused by manual work is avoided.
As a preferred embodiment, the brazing filler metal layer is prepared by a deposition method on one of the welding surface of the cemented carbide substrate, the welding surface of the PcBN tip, or the welding surface of the cemented carbide substrate and the PcBN tip. Since the shapes of the tool bit and the substrate are not limited in the invention, the deposition position can be selected by a person skilled in the art according to the requirement of convenience in operation under actual working conditions.
As a preferred embodiment, the materials of the cemented carbide substrate include, but are not limited to, tungsten cobalt, tungsten titanium cobalt or tungsten titanium tantalum niobium, and any of the YG, YN, YT, YW series cemented carbide substrates can be selected by one skilled in the art.
As a preferred embodiment, the solder used for the solder layer includes one of silver-based solder or copper-based solder; the skilled person can control the solder general class and specific components thereof based on the material of the cemented carbide substrate.
As a more preferred embodiment, the silver-based solder includes, in weight percent: 20-30% of Cu, 3-10% of Ti and the balance of Ag.
As an alternative embodiment, the silver-based solder includes, in weight percent: cu 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%; 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10% of Ti; the balance of Ag; the weight percentage can be any point value as described above, or a numerical range formed by any two point values.
As a more preferred embodiment, the copper-based solder includes, in weight percent: 15-25% of Sn, 5-15% of Ti and the balance of Cu.
As an alternative embodiment, the copper-based solder includes, in weight percent: 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25% of Sn; ti 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%; the balance of Cu; the weight percentage can be any point value as described above, or a numerical range formed by any two point values.
As a further preferred embodiment, the silver-based solder comprises at least one of ag68.8cu26.7ti4.5, ag69.7cu27ti3.3 or ag70.5cu27.5ti2; the copper-based solder includes Cu71Sn19Ti10.
As a preferred embodiment, the method further comprises, before deposition: and carrying out surface treatment on the welding surface of the hard alloy substrate and/or the PcBN tool bit.
As a more preferred embodiment, the surface treatment includes, but is not limited to, one or more of sanding, abrasive blasting, polishing, degreasing, pickling, water washing, ultrasonic or drying, and the like.
As a preferred embodiment, the thickness of the brazing filler metal layer is 15 μm to 30 μm.
As an alternative embodiment, the thickness of the solder layer includes, but is not limited to, any point value or any two point values of 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30 (μm).
As a preferred embodiment, the electroplating comprises the steps of: electroplating simple substance components of constituent elements in the brazing filler metal layer by layer to the welding surface of the hard alloy substrate and/or the PcBN tool bit.
As a more preferred embodiment, the electroplating comprises the steps of: and taking the hard alloy matrix and/or the PcBN tool bit after surface treatment as a plating base material, setting a plating solution and an electrode, and then electrifying and electroplating.
As a more preferred embodiment, when the silver-based brazing filler metal is used, the elemental components are Cu, ti, and Ag in the plating order; as a more preferred embodiment, when the copper-based solder is employed, the elemental components are Cu, ti, and Sn in the plating order.
Copper is used as a first layer of electroplated metal, and can be well attached to a base material to be used as a priming layer for subsequent electroplating; titanium is an active element in the brazing filler metal, is used as a second layer of intermediate plating layer, can be effectively protected, is convenient to diffuse to base materials on two sides, increases wetting of the interface of the base materials during brazing, and improves brazing strength; silver or tin is the outermost layer plating layer, and can protect the active titanium plating layer.
As a preferred embodiment, the electroplating is performed at room temperature; the plating solution is kept at room temperature.
As a preferred embodiment, the current at the time of silver plating was 0.4A/dm 2, the current at the time of titanium plating was 0.6A/dm 2, the current at the time of copper plating was 1.2A/dm 2, and the current at the time of tin plating was 1.0A/dm 2.
As a more preferred embodiment, for the plating, the plating thickness of each of the elemental components is calculated from the content and density of the elemental components. Further, the plating deposition rate and the plating time can be controlled by those skilled in the art according to the thickness requirements of the individual elemental components, and only the thickness range after plating needs to be kept within the above-mentioned preferred range control.
For example: if the brazing filler metal for welding the PcBN tool bit is Ag68.8Cu26.7Ti4.5, the total thickness of the brazing filler metal layer required to be deposited is 20 mu m, according to the density of Ag of 10.5g/cm 3, the density of Cu of 9g/cm 3 and the density of Ti of 4.5g/cm 3, the brazing filler metal layer with the required composition is obtained only by depositing the Ag plating layer with the thickness of 12.5 mu m, the copper plating layer with the thickness of 5.6 mu m and the Ti plating layer with the thickness of 1.9 mu m.
As a preferred embodiment, the magnetron sputtering includes the steps of: under vacuum condition, taking the welding surface of the hard alloy matrix and/or the PcBN tool bit as a loading base material and brazing alloy as a target material; and activating the target material, and then sputtering to obtain the hard alloy substrate and/or the PcBN tool bit, wherein the surface of the hard alloy substrate is plated with the brazing filler metal layer.
As a more preferred embodiment, the magnetron sputtering includes the steps of: setting argon atmosphere under vacuum, applying direct current voltage between a cathode (columnar target or plane target) and an anode (film plating chamber wall), and generating magnetic control type abnormal glow discharge in the film plating chamber; electrons collide with argon atoms in the process of flying to the substrate under the action of an electric field, so that the argon is ionized (Ar atoms are ionized into Ar+ ions and electrons under the action of high pressure), and incident ions (Ar+) bombard the target under the action of the electric field, so that neutral atoms or molecules on the surface of the target obtain enough kinetic energy to be separated from the surface of the target, and further the neutral atoms or molecules are deposited on the surface of the substrate to form a film.
As a preferred embodiment, the magnetron sputtering is direct current sputtering, and the sputtering current is 0.22A to 0.32A, including but not limited to any one point value or any two point values of 0.22, 0.23, 0.24, 0.25, 0.26, 0.27, 0.28, 0.29, 0.3, 0.31, and 0.32 (a).
As a preferred embodiment, the duration of the magnetron sputtering is 1 h-5 h, including but not limited to any point value or any numerical interval formed by two point values of 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5 and 5 (h).
As a preferred embodiment, the background vacuum degree of the magnetron sputtering is less than 1 multiplied by 10 -3 Pa.
As a preferred embodiment, the working air pressure of the magnetron sputtering is 1Pa to 5Pa, including but not limited to any one point value or any two point values of 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5 and 5 (Pa).
As a preferred embodiment, the argon flow is 60cm 3/min～100cm3/min, including but not limited to any one point value or any two point value of 60, 65, 70, 75, 80, 85, 90, 95, 100 (cm 3/min).
As a preferred embodiment, the brazing of the cemented carbide substrate and the PcBN tips is vacuum brazing.
As a more preferable embodiment, when the silver-based brazing filler metal is used, the welding temperature is 830-860 ℃ and the heat preservation time is 2-5 min.
As an alternative embodiment, when the silver-based solder is used, the soldering temperature includes, but is not limited to, any one point value or any two point values of 830, 835, 840, 845, 850, 855, 860 (°c), and the holding time includes, but is not limited to, any one point value or any two point values of 2, 2.5, 3, 3.5, 4, 4.5, 5 (min).
As a more preferable embodiment, when the copper-based solder is used, the soldering temperature is 880-930 ℃ and the holding time is 2-5 min.
As an alternative embodiment, when the copper-based solder is used, the soldering temperature includes, but is not limited to, any one point value or any two point value of 880, 885, 890, 895, 900, 905, 910, 915, 920, 925, 930 (°c), and the holding time includes, but is not limited to, any one point value or any two point value of 2, 2.5, 3, 3.5, 4, 4.5, 5 (min).
Example 1
The solder used in this example was ag68.8cu26.7ti4.5; and the deposition of the solder layer is performed by electroplating.
Taking the PcBN tool bit as an electroplating substrate, firstly carrying out acetone ultrasonic cleaning on the substrate, and then carrying out pretreatment of deionized water cleaning and drying; the pretreated substrate is placed in a copper electroplating solution for electroplating treatment, wherein the copper electroplating solution is prepared by the following method: adding concentrated sulfuric acid (10 mL) and polyethylene glycol (10 mL) into deionized water, stirring until the concentrated sulfuric acid and the polyethylene glycol are dissolved, then weighing copper sulfate (110 g) and copper chloride (70 g) to be added into the solution, stirring until the concentrated sulfuric acid and the polyethylene glycol are dissolved at normal temperature, then adding sodium sulfate (55 g) and potassium sulfate (90 g) into the solution, and stirring uniformly to obtain a copper electroplating solution; the current was set at 1.2A/dm 2, and then the plating was performed by applying electric current to obtain a copper plating layer having a thickness of 5.6 μm on the surface of the substrate.
Placing a substrate of an electroplated copper layer in an electroplated titanium solution; wherein the titanium electroplating solution is prepared by the following method: firstly pouring alcohol (150 mL) into a container, heating to a proper temperature, then adding tetrabutyl titanate (100 mL) into the alcohol, stirring uniformly, slowly adding concentrated sulfuric acid (15 mL), continuing stirring until all the solution is dissolved, adding a sodium chloride aqueous solution with the concentration of 3% into the solution until 1L of solution is obtained, stirring uniformly, and finally filtering through filter paper to obtain a titanium electroplating solution; the current was set at 0.6A/dm 2, and then the plating was conducted, thereby obtaining a titanium plating layer having a thickness of 1.9 μm on the surface of the substrate.
Placing a copper and titanium electroplated substrate in a silver electroplating solution; wherein the silver electroplating solution is prepared by the following method: firstly, dissolving 250g of sodium thiosulfate in deionized water (500 mL), then respectively dissolving 50g of silver nitrate and 50g of potassium metabisulfite in distilled water (100 mL), mixing under continuous stirring to obtain a silver metabisulfite mixed solution, then mixing the sodium thiosulfate solution with the silver metabisulfite mixed solution, continuously stirring and adding deionized water until 1L of solution is obtained, then adding 0.5g of activated carbon and filtering to obtain a silver electroplating solution; the current was set at 0.4A/dm 2, and then the plating was performed by applying electricity to obtain a silver plating layer having a thickness of 12.5 μm on the surface of the substrate. The total thickness of the solder coating is 20 mu m.
Example 2
The solder used in this example was ag68.8cu26.7ti4.5; and the deposition of the solder layer is performed by electroplating.
(1) Firstly taking a PcBN tool bit as an electroplating substrate, firstly carrying out acetone ultrasonic cleaning, then carrying out deionized water cleaning and drying pretreatment on the substrate, then placing the substrate in the copper electroplating solution in the embodiment 1, setting the current to be 1.2A/dm 2, and then electrifying and electroplating to obtain a copper plating layer with the thickness of 2.8 mu m on the surface of the substrate. Further, the plating solution was placed in the titanium plating solution of example 1, and the plating was conducted after setting a current of 0.6A/dm 2, so as to obtain a titanium plating layer having a thickness of 0.9 μm on the surface of the substrate. Further, the plating solution was placed in the silver plating solution of example 1, and the plating was conducted after setting a current of 0.4A/dm 2, to obtain a silver plating layer having a thickness of 6.3 μm on the surface of the substrate. The total thickness of the solder coating is 10 mu m.
(2) And (2) taking the YG6 hard alloy matrix as an electroplating substrate, performing ultrasonic acetone cleaning, deionized water cleaning and drying pretreatment on the substrate, then placing the substrate in the copper electroplating solution in the step (1), setting the current to be 1.2A/dm 2, and then electrifying and electroplating to obtain the copper plating layer with the thickness of 2.8 mu m on the surface of the substrate. Further placing the substrate in the titanium electroplating solution in the step (1), setting the current to be 0.6A/dm 2, then electrifying and electroplating to obtain the titanium plating layer with the thickness of 1.0 mu m on the surface of the substrate. Further placing the substrate in the silver electroplating solution in the step (1), setting the current to be 0.4A/dm 2, then electrifying and electroplating to obtain a silver plating layer with the thickness of 6.2 mu m on the surface of the substrate. The total thickness of the solder coating is also 10 μm.
Example 3
The solder used in this example was ag68.8cu26.7ti4.5; and the deposition of the solder layer is carried out by means of magnetron sputtering.
The specific operation method comprises the following steps: taking YG6 hard alloy matrix and PcBN tool bit as base materials, performing ultrasonic cleaning on the base materials, performing pre-treatment of deionized water cleaning and drying, and putting the base materials into a magnetron sputtering chamber to use three targets of Cu, ti and Ag; the magnetron sputtering chamber is vacuumized to a vacuum degree of 5 multiplied by 10 -4 Pa, argon is then introduced, the argon flow is 80cm 3/min, the working air pressure of the magnetron sputtering chamber is kept to be 3Pa, cu coating sputtering is firstly carried out, the sputtering voltage is 400V, the sputtering current is 0.25A, the sputtering time is 1.5 hours, ti coating sputtering is carried out, the sputtering voltage is 400V, the sputtering current is 0.22A, the sputtering time is 1 hour, ag coating sputtering is carried out, the sputtering voltage is 500V, the sputtering current is 0.3A, and the total thickness of the brazing filler metal coating with the thickness of 10 mu m is obtained on YG6 hard alloy and PcBN tool bits.
Example 4
The solder used in this example was Cu71Sn19Ti10; and the deposition of the solder layer is performed by electroplating.
The YG6 hard alloy matrix is used as an electroplating substrate, the substrate is firstly subjected to acetone ultrasonic cleaning, then is subjected to deionized water cleaning and drying pretreatment, then is placed in the copper electroplating solution in the embodiment 1, is provided with the current of 1.2A/dm 2, and is electrified and is subjected to electroplating, so that a copper plating layer with the thickness of 12.4 mu m on the surface of the substrate is obtained.
Further, the plating solution was placed in the titanium plating solution of example 1, and the plating was conducted after setting a current of 0.6A/dm 2, to thereby obtain a titanium plating layer having a thickness of 3.5. Mu.m on the surface of the substrate.
Further placed in a tin plating solution, wherein the tin plating solution is prepared by: adding 100mL of concentrated sulfuric acid into 350mL of deionized water, adding 50g of stannous sulfate, stirring for dissolution, preparing beta-naphthol (10 mL) and 10% gelatin aqueous solution (50 mL), adding the solution into the solution, uniformly mixing, and adding deionized water to 1L to obtain tin electroplating solution; the current was set at 1.0A/dm 2, and then the plating was performed by applying electric current to obtain a tin plating layer having a thickness of 4.1 μm on the surface of the substrate. The total thickness of the solder coating was 20 μm.
Example 5
The solder used in this example was Cu71Sn19Ti10; and the deposition of the solder layer is carried out by means of magnetron sputtering.
The specific operation method comprises the following steps: the YG6 hard alloy matrix and the PcBN tool bit are used as base materials, the base materials are firstly subjected to ultrasonic cleaning by acetone, then are subjected to pretreatment of deionized water cleaning and drying, and are placed into a magnetron sputtering chamber, and three targets of Cu, ti and Sn are used; the magnetron sputtering chamber is vacuumized to a vacuum degree of 5 multiplied by 10 -4 Pa, argon is then introduced, the argon flow is 80cm 3/min, the working air pressure of the magnetron sputtering chamber is kept at 3Pa, the Cu coating is sputtered firstly, the sputtering voltage is 500V, the sputtering current is 0.3A, the sputtering time is 5 hours, the Ti coating is sputtered again, the sputtering voltage is 400V, the sputtering current is 0.22A, the sputtering time is 1 hour, the Sn coating is sputtered again, the sputtering voltage is 450V, the sputtering current is 0.25A, and the total thickness of the brazing filler metal coating with the thickness of 10 mu m is obtained on the YG6 hard alloy and PcBN tool bit.
Test examples
And assembling the treated hard alloy matrix or the PcBN tool bit, and then performing vacuum brazing. For silver-based solder, the brazing temperature was 840℃and the holding time was 4min. For copper-based solder, the brazing temperature is 900 ℃ and the heat preservation time is 4min. The weld strength after brazing was tested and the results are shown in table 1 below.
TABLE 1
| Weld width (um) | Shear strength (MPa) | |
| Example 1 | 22 | 105 |
| Example 2 | 24 | 112 |
| Example 3 | 21 | 98 |
| Example 4 | 23 | 126 |
| Example 5 | 20 | 133 |
While the invention has been illustrated and described with reference to specific embodiments, it is to be understood that the above embodiments are merely illustrative of the technical aspects of the invention and not restrictive thereof; those of ordinary skill in the art will appreciate that: modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some or all of the technical features thereof, without departing from the spirit and scope of the present invention; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions; it is therefore intended to cover in the appended claims all such alternatives and modifications as fall within the scope of the invention.
Claims (10)
1. A method of brazing a superhard cutter, the method comprising the steps of: preparing a brazing filler metal layer at the welding surface of the hard alloy matrix and/or the PcBN tool bit by a deposition method, and then assembling and brazing the hard alloy matrix and the PcBN tool bit;
wherein the deposition method comprises at least one of electroplating or magnetron sputtering.
2. The brazing method of superhard cutter according to claim 1, wherein the brazing filler metal used for the brazing filler metal layer comprises one of silver-based brazing filler metal or copper-based brazing filler metal;
preferably, the silver-based solder comprises, in weight percent: 20-30% of Cu, 3-10% of Ti and the balance of Ag;
Preferably, the copper-based solder comprises the following components in percentage by weight: 15-25% of Sn, 5-15% of Ti and the balance of Cu.
3. The method of brazing a superhard cutter of claim 2, wherein the silver-based braze comprises at least one of ag68.8cu26.7ti4.5, ag69.7cu27ti3.3 or ag70.5cu27.5ti2;
And/or the copper-based solder comprises Cu71Sn19Ti10.
4. The method of brazing a superhard cutter of claim 2, wherein the electroplating is: electroplating simple substance components of constituent elements in the brazing filler metal layer by layer to a welding surface of the hard alloy substrate and/or the PcBN tool bit;
Preferably, when the silver-based brazing filler metal is used, the plating order of the elemental components is Cu, ti, and Ag;
Preferably, when the copper-based solder is employed, the elemental components are electroplated in the order Cu, ti, and Sn.
5. The brazing method of superhard cutter according to claim 4, wherein the brazing layer has a thickness of 15 μm to 30 μm;
Preferably, the plating thickness of each of the elemental components is calculated from the content and density of the elemental components.
6. The brazing method of superhard cutter according to claim 4, wherein the current during silver plating is 0.4A/dm 2, the current during titanium plating is 0.6A/dm 2, the current during copper plating is 1.2A/dm 2, and the current during tin plating is 1.0A/dm 2.
7. The brazing method of superhard cutters according to claim 1, wherein the magnetron sputtering is direct current sputtering with a sputtering current of 0.22A to 0.32A;
preferably, the duration of the magnetron sputtering is 1 h-5 h.
8. The method of brazing a superhard cutter according to claim 1, wherein the background vacuum of magnetron sputtering is < 1 x 10 -3 Pa;
Preferably, the working air pressure of the magnetron sputtering is 1 Pa-5 Pa, and the argon flow is 60cm 3/min～100cm3/min.
9. The brazing method of superhard cutters according to claim 2, wherein the brazing of the cemented carbide substrate and the PcBN tips is vacuum brazing;
preferably, when the silver-based brazing filler metal is adopted, the welding temperature is 830-860 ℃ and the heat preservation time is 2-5 min;
Preferably, when the copper-based brazing filler metal is adopted, the welding temperature is 880-930 ℃, and the heat preservation time is 2-5 min.
10. A superhard tool obtainable by a method of brazing a superhard tool according to any one of claims 1 to 9.
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