CN117937292A - Explosion-proof industry high-low pressure cabinet - Google Patents

Explosion-proof industry high-low pressure cabinet Download PDF

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Publication number
CN117937292A
CN117937292A CN202410086047.8A CN202410086047A CN117937292A CN 117937292 A CN117937292 A CN 117937292A CN 202410086047 A CN202410086047 A CN 202410086047A CN 117937292 A CN117937292 A CN 117937292A
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CN
China
Prior art keywords
fixedly connected
sealing
heat
low voltage
heat dissipation
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Pending
Application number
CN202410086047.8A
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Chinese (zh)
Inventor
蔡怀虎
薛志鹏
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Chongqing Herunji New Energy Co ltd
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Chongqing Herunji New Energy Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Chongqing Herunji New Energy Co ltd filed Critical Chongqing Herunji New Energy Co ltd
Priority to CN202410086047.8A priority Critical patent/CN117937292A/en
Publication of CN117937292A publication Critical patent/CN117937292A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an explosion-proof industrial high-low voltage cabinet, which comprises a mounting bottom plate, wherein the upper end surface of the mounting bottom plate is fixedly connected with a protective cover and a thickening storage box, the upper end surface of the mounting bottom plate is provided with a heat dissipation mechanism, the left end of the thickening storage box is provided with a contact absorption mechanism, a storage mechanism is arranged in a storage cavity, and the upper end of the thickening storage box is provided with a sealing mechanism; according to the invention, the heat dissipation mounting box, the heat dissipation grouping pipe, the circulation header pipe, the circulation compression pump, the heat pipe, the heat transfer substrate, the semiconductor heat dissipation end and the semiconductor refrigeration end are arranged, so that the heat dissipation transfer efficiency and the sealing performance of the high-low voltage cabinet are improved, the stability of the internal space of the high-low voltage cabinet is improved, and the service life of the high-low voltage cabinet in a severe environment is prolonged; through setting up walk line sealed lid, fixed spool, cooperation sealing plug, walk line outlet pipe, sealed stopper and maintenance door, improved the waterproof dustproof ability of high-low voltage cabinet, reduced the influence of external factor to high-low voltage cabinet, improved high-low voltage cabinet's efficiency and security.

Description

Explosion-proof industry high-low pressure cabinet
Technical Field
The invention relates to the field of high-low voltage cabinets, in particular to an explosion-proof industrial high-low voltage cabinet.
Background
One of the core technologies of the high-low voltage power distribution cabinet is that when the power distribution cabinet operates, the temperature in the high-low voltage power distribution cabinet is increased due to the generation of electric heat, so that the temperature rise is simply called as temperature rise, the service performance of the power distribution cabinet is seriously affected by the overlarge temperature rise, even an electrical short circuit accident is generated, the temperature in the high-low voltage power distribution cabinet is reduced, and the high-low voltage power distribution cabinet is also a technical target jointly pursued by the power distribution industry; in the past, wind holes are usually formed in a power distribution cabinet door plate, then gauze is welded, and the temperature is reduced in the mode, so that firstly, the temperature reducing effect is not obvious, and natural heat dissipation lacks convection conditions; secondly, the protection level can not reach the national standard because the vent holes are formed; thirdly, the severe pollution environment can not be met; in the industry, a fan is additionally arranged on a door plate or a cabinet top in some factories to forcedly dissipate heat, firstly, the fan needs to be resistant to high temperature, needs to be connected with a power supply and needs to be firmly installed, because the three conditions often lead to the loss of the heat dissipation function of the high-low voltage power distribution cabinet, even if the purpose of heat dissipation is achieved, the protection grade of the high-low voltage power distribution cabinet cannot be achieved, and in some industrial fields with severe environments, the efficiency of the high-low voltage power distribution cabinet determines the quality of industrial production;
In view of the above, the chinese patent publication No. CN101540481a discloses a dry type phase change integrated radiator for a high-low voltage power distribution cabinet, a cavity is excavated on a main board of the radiator, a plurality of copper invagination short heat dissipation pipes are additionally arranged at the bottom of the cavity, phase change materials are filled in the cavity, and a cavity cover plate is arranged on the cavity; a plurality of main board grooves are excavated on the main board of the radiator and serve as airflow channels, the main board grooves are located on one side of the containing cavity and are communicated with the containing cavity through connecting grooves, holes are drilled in the main board grooves for outward heat dissipation, cover plates are arranged on the grooves, cover plate grooves corresponding to the main board grooves are arranged on the inner sides of the cover plates, the airflow channels of the main board grooves and the cover plate grooves form a cross, and outward heat dissipation holes are drilled in the cover plate grooves and staggered with hole sites on the main board grooves; the invention fundamentally solves the heat dissipation problem of the high-low voltage power distribution cabinet, does not need any additional facilities, does not consume any energy, and has the characteristic of repeated use, and the service life can reach 30 years of the element mounting frame; the phase change material is replaced when necessary;
however, in the patent of the invention, the heat dissipation effect of the heat dissipation mode without consuming energy is poor, the use energy efficiency in the industrial-grade high-low voltage cabinet is low, and the use effect is reduced after long-time use.
Disclosure of Invention
The invention aims to provide an explosion-proof industrial high-low voltage cabinet so as to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an explosion-proof industry high-low voltage board, includes mounting plate, mounting plate up end fixedly connected with protection casing and thickening containing box, be equipped with in the thickening containing box and accomodate the chamber, the protection casing with the thickening containing box is mutually supported, the mounting plate up end is equipped with cooling mechanism, cooling mechanism includes fixed connection be in the cooling fan of mounting plate up end, cooling mechanism can exchange the heat of absorbing high-low voltage board, thickening containing box left end is equipped with contact absorption mechanism, contact absorption mechanism includes fixed connection the vacuum isolation cover of thickening containing box left end face, be equipped with the vacuum isolation chamber in the vacuum isolation cover, contact absorption mechanism can transmit the inside heat that produces of high-low voltage board, be equipped with storage mechanism in the chamber, storage mechanism can install and accomodate high-low voltage board components and parts, thickening containing box upper end is equipped with sealing mechanism, sealing mechanism can seal high-low voltage board.
The heat dissipation mechanism comprises a heat dissipation installation box fixedly connected with the upper end face of the installation bottom plate, two groups of heat dissipation grouping pipes which are symmetrical around the front end face and the rear end face of the heat dissipation installation box are fixedly connected with each other, the right end face of the heat dissipation installation box is fixedly connected with a circulation compression pump, the front end face and the rear end face of each circulation compression pump are fixedly connected with a circulation header pipe, and the two circulation header pipes are mutually communicated and matched with the two groups of heat dissipation grouping pipes through heat pipes.
The contact absorption mechanism comprises two groups of first sealing sleeves which are symmetrically arranged in the front and back and are fixedly connected in the left end wall of the vacuum isolation cavity, the left end surface of the vacuum isolation cover is fixedly connected with the circulating compression pump, and heat pipes are fixedly connected in the two groups of first sealing sleeves;
a heat transfer cavity is arranged in the left end wall of the storage cavity, a semiconductor radiating end is fixedly connected in the right end wall of the heat transfer cavity, the semiconductor radiating end penetrates through the right end wall of the heat transfer cavity, the right end surface of the semiconductor radiating end is fixedly connected with a semiconductor refrigerating end, a connection mounting sleeve is fixedly connected in the left end wall of the storage cavity, and the semiconductor refrigerating end is fixedly connected in the connection mounting sleeve;
the semiconductor heat dissipation end left end face is fixedly connected with a heat transfer substrate, the heat transfer substrate is made of a material with higher heat conduction efficiency, the heat transfer substrate left end face is fixedly connected with the heat pipe, the heat pipe is matched with the semiconductor heat dissipation end, two groups of symmetrical second sealing sleeves are fixedly connected in the heat transfer cavity left end wall, and the two groups of second sealing sleeves are fixedly connected with the heat pipe.
The semiconductor cooling end comprises a semiconductor cooling end, a semiconductor storage end, a storage mechanism, a connecting sleeve and a connecting sleeve, wherein the storage mechanism comprises a mounting main board fixedly connected with the right end face of the semiconductor cooling end, the left end face of the mounting main board is fixedly connected with the connecting sleeve, a group of component mounting frames distributed up and down are fixedly connected with the right end face of the mounting main board, and the component mounting frames are mutually matched with the storage cavity.
The wire sealing mechanism comprises a wire sealing cover fixedly connected to the upper end face of the thickened storage box, a wire sealing cavity is formed in the wire sealing cover, a fixed wire pipe is fixedly connected to the upper end wall of the storage cavity, a fixed wire hole is formed in the fixed wire pipe, and the wire sealing cavity is mutually communicated with the storage cavity through the fixed wire hole;
The fixed wire hole is internally and slidably connected with two matched sealing plugs which are symmetrical front and back, a wire outlet pipe is fixedly connected in the right end wall of the wire sealing cavity, the two matched sealing plugs are fixedly connected by threads, and the matched sealing plugs are made of expansion corrosion-resistant materials;
The storage cavity right end wall is internally provided with a sealing limiting cavity, a sealing limiting block is fixedly connected in the sealing limiting cavity, the right end face of the thickened storage box is rotationally connected with a maintenance door, and the maintenance door is mutually matched with the sealing limiting block.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the heat radiation mounting box, the heat radiation grouping pipe, the circulation header pipe, the circulation compression pump, the heat pipe, the heat transfer substrate, the semiconductor heat radiation end and the semiconductor refrigeration end are arranged, so that the heat generated by the high-low voltage cabinet can be absorbed by the semiconductor refrigeration end and then transferred to the semiconductor heat radiation end, after the heat is transferred through the contact of the mounting main board and the sealing limiting cavity, the heat of the high-low voltage cabinet is driven by the flow of heat efficiency gas to be pulled by the circulation compression pump to enter the heat radiation mounting box through the cooperation of the circulation header pipe and the heat radiation grouping pipe for heat radiation, the heat radiation transfer efficiency and the sealing performance of the high-low voltage cabinet are improved, the stability of the internal space of the high-low voltage cabinet is improved, and the service life of the high-low voltage cabinet in a severe environment is prolonged;
Through setting up the sealed lid of walking the line, fixed spool, cooperation sealing plug, walk line outlet pipe, sealed stopper and maintenance door, can be with the bus of high low-voltage cabinet through fixed spool, cooperation sealing plug and walk line outlet pipe intercommunication to external to stable work under the sealed circumstances of walking the line sealed lid, maintenance door and sealed high low-voltage cabinet of sealed stopper cooperation when maintaining has improved the waterproof dustproof ability of high low-voltage cabinet, has reduced the influence of external factor to high low-voltage cabinet, has improved the efficiency and the security of high low-voltage cabinet.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the present invention;
FIG. 3 is a right side view of the illustration of FIG. 2 in accordance with the present invention;
FIG. 4 is a schematic top view of FIG. 2 in accordance with the present invention;
FIG. 5 is an enlarged partial schematic view of the fixed wiring conduit of FIG. 2 in accordance with the present invention;
FIG. 6 is an enlarged view of a portion of the mounting board of FIG. 2 according to the present invention;
FIG. 7 is an enlarged partial schematic view of the second seal sleeve of FIG. 2 in accordance with the present invention;
FIG. 8 is an enlarged schematic view of a portion of the semiconductor refrigeration terminal of FIG. 2 in accordance with the present invention;
Fig. 9 is a three-dimensional schematic view of the heat dissipating mounting case of fig. 2 according to the present invention.
In the figure: 11. a heat dissipation mechanism; 12. a contact absorption mechanism; 13. a storage mechanism; 14. a sealing mechanism; 15. a mounting base plate; 16. a protective cover; 17. a heat radiation fan; 18. a heat radiation mounting box; 19. a flow-through header; 20. a vacuum isolation cover; 21. a first sealing sleeve; 22. a second sealing sleeve; 23. a wiring sealing cover; 24. fixing the wiring pipe; 25. matching with a sealing plug; 26. a trace outlet pipe; 27. sealing a limiting block; 28. sealing the limiting cavity; 29. installing a main board; 30. a component mounting rack; 31. a semiconductor cool-down end; 32. a storage chamber; 33. thickening the storage box; 34. a semiconductor heat dissipation end; 35. a flow-through compression pump; 36. a fixed wiring hole 37 and a vacuum isolation cavity; 38. a heat pipe; 39. a heat transfer substrate; 40. a heat transfer chamber; 41. connecting the mounting sleeve; 42. a heat radiation grouping pipe; 43. a wiring sealing cavity; 44. and (5) maintaining the door.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1:
Referring to fig. 1-9, the present invention provides a technical solution: the utility model provides an explosion-proof industry high-low pressure cabinet, includes mounting plate 15, mounting plate 15 up end fixedly connected with protection casing 16 and thickening containing box 33, be equipped with in the thickening containing box 33 and accomodate chamber 32, protection casing 16 with the inside heat that produces of thickening containing box 33 mutually support, mounting plate 15 up end is equipped with cooling mechanism 11, cooling mechanism 11 includes fixed connection and is in the cooling fan 17 of mounting plate 15 up end, cooling mechanism 11 can exchange the heat of absorbing the high-low pressure cabinet, thickening containing box 33 left end is equipped with contact absorption mechanism 12, contact absorption mechanism 12 includes fixed connection is in the vacuum isolation cover 20 of thickening containing box 33 left end face, be equipped with vacuum isolation chamber 37 in the vacuum isolation cover 20, contact absorption mechanism 12 can transfer the inside heat that produces of high-low pressure cabinet, be equipped with containing mechanism 13 in the containing chamber 32, containing mechanism 13 can install and accomodate high-low pressure cabinet components and parts, 33 upper end is equipped with sealing mechanism 14, sealing mechanism 14 can seal the high-low pressure cabinet.
The heat dissipation mechanism 11 comprises a heat dissipation installation box 18 fixedly connected to the upper end face of the installation bottom plate 15, two groups of heat dissipation grouping pipes 42 which are symmetrical front and back are fixedly connected to the front end face and the back end face of the heat dissipation installation box 18, a circulation compression pump 35 is fixedly connected to the right end face of the heat dissipation installation box 18, a circulation header pipe 19 is fixedly connected to the front end face and the back end face of the circulation compression pump 35, the two circulation header pipes 19 are mutually communicated and matched with the two groups of heat dissipation grouping pipes 42 through heat pipes, heat efficiency gas in the heat pipes 38 flows into the heat dissipation installation box 18 through the circulation header pipes 19 and the heat dissipation grouping pipes 42, and the heat dissipation fan 17 is started to dissipate heat of the heat dissipation installation box 18 so that the refrigeration cycle of the high-low voltage cabinet can be realized.
The contact absorbing mechanism 12 comprises two groups of first sealing sleeves 21 which are symmetrically arranged in the front and back and fixedly connected in the left end wall of the vacuum isolation cavity 37, the left end surface of the vacuum isolation cover 20 is fixedly connected with the circulating compression pump 35, and heat pipes 38 are fixedly connected in the two groups of first sealing sleeves 21;
A heat transfer cavity 40 is arranged in the left end wall of the accommodating cavity 32, a semiconductor heat dissipation end 34 is fixedly connected in the right end wall of the heat transfer cavity 40, the semiconductor heat dissipation end 34 penetrates through the right end wall of the heat transfer cavity 40, a semiconductor refrigeration end 31 is fixedly connected with the right end surface of the semiconductor heat dissipation end 34, a connection mounting sleeve 41 is fixedly connected in the left end wall of the accommodating cavity 32, and the semiconductor refrigeration end 31 is fixedly connected in the connection mounting sleeve 41;
The left end face of the semiconductor heat dissipation end 34 is fixedly connected with a heat transfer substrate 39, the heat transfer substrate 39 is made of a material with higher heat conduction efficiency, the left end face of the heat transfer substrate 39 is fixedly connected with the heat pipe 38, the heat pipe 38 is matched with the semiconductor heat dissipation end 34, two groups of symmetrical second sealing sleeves 22 are fixedly connected in the left end wall of the heat transfer cavity 40, the two groups of second sealing sleeves 22 are fixedly connected with the heat pipe 38, the semiconductor refrigeration end 31 and the semiconductor heat dissipation end 34 are started, the semiconductor heat dissipation end 34 absorbs heat generated on the semiconductor refrigeration end 31, the heat generated in the storage cavity 32 is exchanged, the circulation compression pump 35 is started, the two circulation manifolds 19 drive heat-efficiency gas in the heat pipe 38 to flow, and the heat in the semiconductor heat dissipation end 34 is carried and circulated through the contact between the heat pipe 38 and the heat transfer substrate 39 after passing through the first sealing sleeve 21 and the second sealing sleeve 22.
The containing mechanism 13 comprises a mounting main board 29 fixedly connected to the right end face of the semiconductor refrigerating end 31, the left end face of the mounting main board 29 is fixedly connected with the connecting mounting sleeve 41, the right end face of the mounting main board 29 is fixedly connected with a group of component mounting frames 30 which are distributed up and down, and the component mounting frames 30 are mutually matched with the containing cavity 32.
The sealing mechanism 14 comprises a wire sealing cover 23 fixedly connected to the upper end surface of the thickened storage box 33, a wire sealing cavity 43 is arranged in the wire sealing cover 23, a fixed wire pipe 24 is fixedly connected to the upper end wall of the storage cavity 32, a fixed wire hole 36 is arranged in the fixed wire pipe 24, and the wire sealing cavity 43 is mutually communicated with the storage cavity 32 through the fixed wire hole 36;
Two matched sealing plugs 25 which are symmetrical in front and back are slidably connected in the fixed wiring hole 36, a wiring outlet pipe 26 is fixedly connected in the right end wall of the wiring sealing cavity 43, the two matched sealing plugs 25 are fixedly connected by threads, and the matched sealing plugs 25 are made of expansion corrosion-resistant materials;
The utility model discloses a wire harness is characterized in that a sealed spacing chamber 28 is arranged in the right end wall of the accommodating chamber 32, a sealed limiting block 27 is fixedly connected in the sealed spacing chamber 28, a maintenance door 44 is rotationally connected to the right end surface of the thickened accommodating box 33, the maintenance door 44 is mutually matched with the sealed limiting block 27, a high-low voltage cabinet component is installed on an installation main board 29 and an element installation frame 30 through the sealed spacing chamber 28, a bus is installed in a fixed wire harness tube 24 through two matched sealing plugs 25 and is sealed, and the bus is installed in a wire harness sealing cover 23 through a wire harness outlet tube 26.
Working principle:
When the bus wire sealing device is used, after the maintenance door 44 is opened, high-low voltage cabinet components are installed and fixed on the installation main board 29 and the element installation frame 30 through the sealing limiting cavity 28, then the bus is clamped through the two matched sealing plugs 25 and then is installed in the fixed wire pipe 24 in an interference mode for sealing, and then the towed bus is installed in the wire sealing cover 23 in a sealing mode after passing through the wire outlet pipe 26, so that wire sealing installation is completed;
When heat generated in the high-low voltage cabinet is transferred, the semiconductor refrigeration end 31 and the semiconductor heat dissipation end 34 are started, the semiconductor heat dissipation end 34 absorbs the heat generated in the semiconductor refrigeration end 31, so that the heat generated in the storage cavity 32 is exchanged, meanwhile, the circulation compression pump 35 is started, the heat efficiency gas in the heat pipe 38 is driven to flow through the two circulation manifolds 19, and the heat in the semiconductor heat dissipation end 34 is carried and circulated through the heat pipe 38 and the heat transfer substrate 39 after passing through the first sealing sleeve 21 and the second sealing sleeve 22;
During cooling circulation, the heat-efficiency gas in the heat pipe 38 flows into the heat radiation mounting box 18 through the flow main pipe 19 and the heat radiation grouping pipe 42, and the heat radiation fan 17 is started to radiate the heat radiation mounting box 18, so that the refrigerating circulation of the high-low voltage cabinet can be realized.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. The utility model provides an explosion-proof industry high-low pressure cabinet, includes mounting plate (15), mounting plate (15) up end fixedly connected with protection casing (16) and thickening containing box (33), be equipped with in the thickening containing box (33) and accomodate chamber (32), protection casing (16) with the thickening containing box (33) is mutually supported, its characterized in that, mounting plate (15) up end is equipped with cooling body (11), cooling body (11) are in including fixed connection cooling fan (17) of mounting plate (15) up end, cooling body (11) can exchange the heat of absorbing high-low pressure cabinet, containing box (33) left end is equipped with contact absorption mechanism (12), contact absorption mechanism (12) are in including fixed connection vacuum isolation cover (20) of thickening containing box (33) left end face, be equipped with vacuum isolation chamber (37) in vacuum isolation cover (20), contact absorption mechanism (12) can transmit the heat that high-low pressure cabinet inside produced, be equipped with containing body (13) in containing chamber (32), containing body (13) can exchange the heat of absorbing body, containing body (33) can be equipped with high-low pressure side sealing device (14), high-pressure cabinet (14).
2. An explosion-proof industrial high-low voltage cabinet according to claim 1, wherein the heat dissipation mechanism (11) comprises a heat dissipation installation box (18) fixedly connected to the upper end face of the installation bottom plate (15), two groups of heat dissipation grouping pipes (42) which are symmetrical in front and back are fixedly connected to the front end face and the back end face of the heat dissipation installation box (18), a circulation compression pump (35) is fixedly connected to the right end face of the heat dissipation installation box (18), a circulation header pipe (19) is fixedly connected to the front end face and the back end face of the circulation compression pump (35), and the two circulation header pipes (19) are mutually communicated and matched with the two groups of heat dissipation grouping pipes (42) through heat pipes.
3. An explosion-proof industrial high-low voltage cabinet according to claim 1, wherein the contact absorption mechanism (12) comprises two groups of first sealing sleeves (21) which are fixedly connected in the left end wall of the vacuum isolation cavity (37) and are symmetrical back and forth, the left end surface of the vacuum isolation cover (20) is fixedly connected with the circulating compression pump (35), and heat pipes (38) are fixedly connected in the two groups of first sealing sleeves (21).
4. An explosion-proof industrial high-low voltage cabinet according to claim 3, characterized in that, be equipped with heat transfer chamber (40) in accomodating chamber (32) left end wall, fixedly connected with semiconductor heat dissipation end (34) in heat transfer chamber (40) right end wall, semiconductor heat dissipation end (34) run through heat transfer chamber (40) right end wall, semiconductor heat dissipation end (34) right-hand member face fixedly connected with semiconductor cold junction (31), fixedly connected with connection installation cover (41) in accomodating chamber (32) left end wall, connection installation cover (41) internal fixation connection semiconductor cold junction (31).
5. An explosion-proof industrial high-low voltage cabinet according to claim 3, wherein the left end face of the semiconductor radiating end (34) is fixedly connected with a heat transfer substrate (39), the heat transfer substrate (39) is made of a material with higher heat conduction efficiency, the left end face of the heat transfer substrate (39) is fixedly connected with the heat pipe (38), the heat pipe (38) is matched with the semiconductor radiating end (34), two groups of symmetrical second sealing sleeves (22) are fixedly connected in the left end wall of the heat transfer cavity (40), and the two groups of second sealing sleeves (22) are fixedly connected with the heat pipe (38).
6. An explosion-proof industrial high-low voltage cabinet according to claim 1, wherein the containing mechanism (13) comprises a mounting main board (29) fixedly connected to the right end face of the semiconductor refrigerating end (31), the left end face of the mounting main board (29) is fixedly connected with the connecting mounting sleeve (41), the right end face of the mounting main board (29) is fixedly connected with a group of component mounting frames (30) distributed up and down, and the component mounting frames (30) are mutually matched with the containing cavity (32).
7. An explosion-proof industrial high-low voltage cabinet according to claim 1, characterized in that the sealing mechanism (14) comprises a wire sealing cover (23) fixedly connected to the upper end face of the thickening storage box (33), a wire sealing cavity (43) is arranged in the wire sealing cover (23), a fixed wire pipe (24) is fixedly connected to the upper end wall of the storage cavity (32), a fixed wire hole (36) is arranged in the fixed wire pipe (24), and the wire sealing cavity (43) is mutually communicated with the storage cavity (32) through the fixed wire hole (36).
8. An explosion-proof industrial high-low voltage cabinet according to claim 7, characterized in that two matched sealing plugs (25) which are symmetrical back and forth are connected in a sliding manner in the fixed wiring hole (36), a wiring outlet pipe (26) is fixedly connected in the right end wall of the wiring sealing cavity (43), the two matched sealing plugs (25) are fixed by using threaded connection, and the matched sealing plugs (25) are made of expansion corrosion-resistant materials.
9. The explosion-proof industrial high-low voltage cabinet according to claim 7, wherein a sealing limiting cavity (28) is arranged in the right end wall of the accommodating cavity (32), a sealing limiting block (27) is fixedly connected in the sealing limiting cavity (28), a maintenance door (44) is rotatably connected to the right end surface of the thickened accommodating box (33), and the maintenance door (44) is mutually matched with the sealing limiting block (27).
CN202410086047.8A 2024-01-22 2024-01-22 Explosion-proof industry high-low pressure cabinet Pending CN117937292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410086047.8A CN117937292A (en) 2024-01-22 2024-01-22 Explosion-proof industry high-low pressure cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202410086047.8A CN117937292A (en) 2024-01-22 2024-01-22 Explosion-proof industry high-low pressure cabinet

Publications (1)

Publication Number Publication Date
CN117937292A true CN117937292A (en) 2024-04-26

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Application Number Title Priority Date Filing Date
CN202410086047.8A Pending CN117937292A (en) 2024-01-22 2024-01-22 Explosion-proof industry high-low pressure cabinet

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021147A (en) * 2011-07-12 2013-01-31 Panasonic Corp Electrical box
CN114899721A (en) * 2022-06-06 2022-08-12 合肥峰创不锈钢装饰工程有限公司 Anticreep warning formula block terminal
CN220042780U (en) * 2023-06-13 2023-11-17 国网福建省电力有限公司闽侯县供电公司 Explosion-proof power distribution cabinet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021147A (en) * 2011-07-12 2013-01-31 Panasonic Corp Electrical box
CN114899721A (en) * 2022-06-06 2022-08-12 合肥峰创不锈钢装饰工程有限公司 Anticreep warning formula block terminal
CN220042780U (en) * 2023-06-13 2023-11-17 国网福建省电力有限公司闽侯县供电公司 Explosion-proof power distribution cabinet

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