CN117929405A

CN117929405A - Defect detection method and device

Info

Publication number: CN117929405A
Application number: CN202311848192.7A
Authority: CN
Inventors: 郑华; 汤深富; 白绳武
Original assignee: Shenzhen Nuoxing Optoelectronic Technology Co ltd
Current assignee: Shenzhen Nuoxing Optoelectronic Technology Co ltd
Priority date: 2023-12-28
Filing date: 2023-12-28
Publication date: 2024-04-26

Abstract

The application is applicable to the technical field of semiconductors and relates to a defect detection method and device. The method comprises the following steps: acquiring a global image of an object on a mobile platform; controlling the mobile platform to move, wherein the movement of the mobile platform has a plurality of movement stages; acquiring a detection image of the object at each of a plurality of movement phases; a movement locus of each of the plurality of movement phases except the first movement phase is determined based on the global image and the detection image acquired at the last movement phase; and after the movement of the moving platform is finished, detecting the defects of the object according to all the acquired detection images. The accuracy of defect detection can be improved.

Description

Defect detection method and device

Technical Field

The application belongs to the technical field of semiconductors, and particularly relates to a defect detection method and device.

Background

Semiconductors are important materials for manufacturing electronic products. By detecting the defects of the semiconductor, potential manufacturing defects can be found and repaired, and the quality of the electronic product is ensured to meet the stipulated standard. Currently, defect detection is commonly performed on semiconductors by adopting a graph measurement mode. However, in the process of image acquisition measurement, due to the complex surface characteristics of the semiconductor and the view angle limitation of the image acquisition, each part of the semiconductor is difficult to accurately represent through the acquired image, which causes the problem of low defect detection accuracy.

Disclosure of Invention

In a first aspect, an embodiment of the present application provides a defect detection method, which may improve accuracy of defect detection, where the method may include:

Acquiring a global image of an object on a mobile platform; controlling the mobile platform to move, wherein the movement of the mobile platform has a plurality of movement stages; acquiring a detection image of the object at each of a plurality of movement phases; a movement locus of each of the plurality of movement phases except the first movement phase is determined based on the global image and the detection image acquired at the last movement phase; and after the movement of the moving platform is finished, detecting the defects of the object according to all the acquired detection images.

In the implementation process, the moving track of the moving platform can be planned in real time based on the global image of the object and the detection image of the object acquired in each moving stage, so that the acquired detection image can represent each part of the object. And (3) determining the moving track of the next stage of the moving platform by path planning according to the position of the object, ensuring the object to perform stable movement, improving the stability of acquiring the detection image, and further improving the accuracy of defect detection.

In one possible implementation, acquiring a global image of an object on a mobile platform may include:

Acquiring a plurality of appearance images of an object on a mobile platform through a first shooting device; and performing image fusion operation on the plurality of appearance images to obtain a global image.

In the implementation process, the global image of the object is obtained by fusing the position information of the wafer and the acquired multiple appearance images, so that the overall characteristics and the appearance state of the object can be comprehensively displayed. The global image obtained by fusion has higher data consistency, and the information of a plurality of angles and positions is integrated in one image, so that the difference between appearance images can be reduced, and the subsequent data processing is facilitated.

In one possible implementation manner, controlling the mobile platform to move may include:

Taking the first moving stage as a current moving stage; controlling the mobile platform to move according to the moving track of the current moving stage in the current moving stage; when the current moving stage is finished, determining the object position corresponding to the detection image according to the global image and the detection image acquired in the current moving stage; determining a moving track of a next moving stage according to the object position, taking the next moving stage as a current moving stage, and re-executing the step and the subsequent steps of controlling the moving platform to move according to the moving track of the current moving stage in the current moving stage.

In the implementation process, the global image and the detection image acquired after one movement stage are analyzed to determine the object position corresponding to the detection image, and then the path planning is performed according to the object position to determine the movement track of the next stage of the moving platform, so that the object can be ensured to perform stable movement, each detection area of the object can be ensured to be covered, and missing detection or repeated detection is avoided, thereby improving the efficiency and accuracy of defect detection.

In one possible implementation, determining the movement track of the next movement stage according to the object position may include:

Acquiring a target position of a mobile platform; determining the displacement amount and the displacement direction of the mobile platform according to the target position and the object position; and determining the moving track of the next moving stage according to the displacement amount and the displacement direction.

In the implementation process, the target position and the object position are used as input, the displacement amount and the displacement direction of the mobile platform are determined to control the moving track, the distance and the direction required to be moved can be accurately determined, the mobile platform is ensured to be accurately moved to the target position and aligned with the object or maintain the required relative position relationship, the stability of acquiring the detection image can be improved, and then the accuracy of defect detection is improved.

In one possible implementation, the object is subjected to defect detection based on all acquired detection images. May include:

All the acquired detection images are spliced to obtain a spliced image; performing image recognition on the spliced images to obtain an image recognition result; and determining one or more of defect types, defect number and defect physical coordinates of the object according to the image recognition result.

In the above implementation, more detailed object surface information can be obtained by stitching the detection images of multiple viewing angles. And the spliced image can cover a larger object surface area, so that a more comprehensive defect detection result can be obtained, and then the object can be subjected to comprehensive defect detection in one detection process, and the defect detection efficiency is improved.

In one possible implementation, the defect detection method may further include:

acquiring illumination parameters in each of a plurality of moving stages, wherein the illumination parameters are parameters representing illumination conditions of an object; determining exposure time according to the illumination parameters; the object is exposed according to the exposure time.

In the implementation process, the object determines the strategy of using the long and short exposure time according to the illumination condition of the object under different illumination conditions corresponding to different moving stages in the moving platform, so that the influence of illumination unevenness on the defect detection result is reduced, and the defect detection reliability can be improved. By using different long and short exposure strategies, the contrast of the image can be improved, the image with longer exposure time can display darker defects, and the image with shorter exposure time can display brighter defects, so that the detection capability of the defect detection device can be enhanced.

In one possible implementation, the global image is determined by a plurality of appearance images acquired by an area camera and the detection image is acquired by a line scan camera.

In a second aspect, an embodiment of the present application provides a defect detecting apparatus, which may include:

And the first image acquisition device is used for acquiring a global image of the object on the mobile platform.

The mobile platform driving device is used for controlling the mobile platform to move, and the movement of the mobile platform is provided with a plurality of movement stages.

Second image acquisition means for acquiring a detection image of the object at each of a plurality of moving stages; the movement locus of each of the plurality of movement phases except the first movement phase is determined from the global image and the detection image acquired at the last movement phase.

And the defect detection device is used for detecting the defects of the object according to all the acquired detection images after the movement of the mobile platform is finished.

In one possible implementation, the defect detection apparatus may further include:

A light source device;

the material fixing device is arranged on the moving platform and is used for fixing objects;

and the lens adjusting device is connected with the first image acquisition device and the second image acquisition device respectively and is used for adjusting the lens positions and the lens focal lengths of the first image acquisition device and the second image acquisition device.

and the detection lens selection unit is used for controlling the first image acquisition device or the second image acquisition device to enter a working state.

And a detection lens driving unit for controlling lens positions of the first image acquisition device and the second image acquisition device.

The mobile platform driving unit is used for controlling the mobile platform driving device to drive the mobile platform to move.

And the image deviation rectifying unit is used for determining the moving track of each moving stage except the first moving stage in the plurality of moving stages.

Compared with the prior art, the embodiment of the application has the beneficial effects that: the movement track of the mobile platform can be planned in real time based on the global image of the object and the detection image of the object acquired at each movement stage, so that the acquired detection image can characterize various parts of the object. And (3) determining the moving track of the next stage of the moving platform by path planning according to the position of the object, ensuring the object to perform stable movement, improving the stability of acquiring the detection image, and further improving the accuracy of defect detection.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of steps of a defect detection method according to an embodiment of the present application.

Fig. 2 is a schematic diagram of steps for acquiring a global image according to an embodiment of the present application.

Fig. 3 is a schematic diagram of steps for controlling a mobile platform to move according to an embodiment of the present application.

Fig. 4 is a schematic diagram of steps for determining a movement track of a next movement stage according to a position of an object according to an embodiment of the present application.

Fig. 5 is a schematic diagram of steps for performing defect detection on an object according to an embodiment of the present application.

Fig. 6 is a schematic diagram illustrating steps of an exposure strategy according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a defect detecting apparatus according to an embodiment of the present application.

Fig. 8 is a schematic diagram of an integrated detection device according to an embodiment of the present application.

Detailed Description

Embodiments of the technical scheme of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present application, and thus are merely examples, and are not intended to limit the scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.

In the description of embodiments of the present application, the technical terms "first," "second," and the like merely distinguish one entity or operation from another entity or operation, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features, a particular order, or a primary or secondary relationship indicated. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless specifically defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The application provides a defect detection method for improving the accuracy of defect detection. Referring to fig. 1, fig. 1 is a schematic diagram illustrating steps of a defect detection method according to an embodiment of the application. The defect detection method provided by the embodiment of the application can be applied to defect detection equipment and is used for detecting objects. The defect detection method may include the steps of:

s1, a defect detection device acquires a global image of an object on a mobile platform.

In some embodiments, the object may be a product requiring defect detection, particularly products requiring high precision, high reliability, and safety, such as semiconductor chips, aircraft parts, medical instruments, and the like. In the embodiment of the present application, defect detection of a wafer will be described as an example.

The mobile platform is a platform for placing objects to be detected in the defect detection equipment, has a moving function and can drive the placed objects to move to various positions.

The global image is an image which is synthesized and reflects the integral characteristics of the object by analyzing and fusing appearance images of a plurality of acquired objects. It includes not only information on the overall visual effect, overall shape, overall color and texture of the object, but also other metadata or context information such as lighting conditions, object size, shooting angle, etc.

In some embodiments, please refer to fig. 2, fig. 2 is a schematic diagram illustrating steps for acquiring a global image according to an embodiment of the present application. The step of acquiring a global image of the object may comprise:

s11, the defect detection equipment acquires a plurality of appearance images of the object on the mobile platform through the first shooting device.

In some embodiments, the first camera may be an area camera. An area camera is an image sensor arranged in rows and columns in a two-dimensional plane in the form of an array of pixels. The area camera can acquire the whole appearance image at one time by acquiring the whole image area simultaneously by having a plurality of rows of pixels.

The defect detection equipment can control the fixing device to fix the wafer on the moving platform, locate the current position of the wafer, acquire relevant data information of the wafer, and determine the initial position of the wafer according to the current position and the data information of the wafer.

After the initial position of the wafer for drawing is determined, the defect detection equipment can control the mobile platform to perform uninterrupted uniform motion according to a preset planned path. In the moving process of the moving platform, the defect detection equipment can call the light source data of the wafer, and configure the light source data required by the area array camera to the light source so as to illuminate the wafer, and the area array camera acquires the appearance image of the product to be detected in real time.

S12, performing image fusion operation on the plurality of appearance images by the defect detection equipment to obtain a global image.

In some embodiments, the area array camera collects position information of the wafer, the position information may include one or more of point position information, point-to-point distance information, line segment length information, circle center position information, radius information of a circle, and included angle information, and the defect detection device fuses the position information with a plurality of appearance images to obtain a global image.

For example, the acquired plurality of appearance images may be registered first, ensuring that they are aligned and registered according to the positional information of the wafer, which may be achieved by image processing algorithms, computer vision techniques, or specific registration means. After the image registration, the registered appearance images can be fused together by utilizing the position information of the wafer based on an image superposition, fusion algorithm or image stitching mode so as to generate a global image reflecting the whole characteristics of the wafer.

In some other embodiments, the first photographing device may be a bar camera, and the bar camera may acquire an appearance image of the wafer in a progressive scan manner. The bar camera may scan line by line along the perimeter of the wafer, capturing surface details of the wafer. By appropriate processing and stitching, multiple progressive images can be synthesized as a global image of the wafer. The implementation of synthesizing the progressive image into the global image of the wafer can refer to the image fusion process in the above description, and will not be repeated here.

S2, the defect detection equipment controls the mobile platform to move, and the movement of the mobile platform has a plurality of movement stages.

Wherein the movement locus of each of the plurality of movement phases except the first movement phase is determined based on the global image and the detection image acquired in the last movement phase.

Referring to fig. 3, fig. 3 is a schematic diagram illustrating steps for controlling a mobile platform to move according to an embodiment of the present application. In some embodiments, the step of controlling the mobile platform to move may include:

S21, taking the first moving stage as the current moving stage.

In the embodiment of the application, the moving process of the moving platform is divided into a plurality of moving stages, and each moving stage is divided by taking one detection image of the acquired object as a node. The moving process of the moving platform may be divided into a first moving stage, a second moving stage, a third moving stage, etc., and so on.

S22, the defect detection equipment controls the mobile platform to move according to the moving track of the current moving stage.

The movement track of the first movement stage may be a preset movement track, may be the same section of movement track as the global image is acquired, or may be a detection image acquired at the starting position and determined according to the global image and the detection image. The embodiment of the application does not limit the moving track of the first moving process.

And S23, when the current moving stage is finished, the defect detection equipment determines the object position corresponding to the detection image according to the global image and the detection image acquired in the current moving stage.

After the moving platform finishes moving in the first moving stage, the second shooting device acquires a detection image of the wafer.

In some embodiments, the second camera may be a line scan camera. A line scan camera is a special type of image acquisition device that captures images of moving objects or large scenes. Unlike a common area array camera, a line scan camera has only one line of pixels, and a complete detection image is acquired by a progressive scanning manner. The working principle of the line scan camera to acquire the detection image of the wafer is to establish a motion relationship between the wafer or the camera. When the wafer moves at a certain speed, the line scanning camera starts scanning line by line from one side of the wafer according to a fixed frequency. Each time a line is scanned, the camera stores the pixel data collected line by line, and finally a complete detection image is formed.

When the line scan camera acquires a detection image of the wafer, the defect detection equipment can acquire light source data required by the line scan camera and configure the light source data into the light source so as to irradiate the wafer. The detection image collected by the line scanning camera can comprise one or more of point position information, point-to-point distance information, line segment length information, circle center position information, radius information of a circle, included angle information, scratch information, dirt information, unfilled corner information, indentation information and damage information of the wafer.

In some embodiments, the defect detection apparatus may first analyze the global image using an image processing algorithm to extract the position, posture and boundary information of the wafer. And then processing and analyzing the detection image obtained by the current line scanning camera, and identifying the position on the wafer where the current detection image is shot by using an image processing or machine learning algorithm.

S24, determining a moving track of a next moving stage according to the object position, taking the next moving stage as a current moving stage, and re-executing the step and the subsequent steps of controlling the moving platform to move according to the moving track of the current moving stage in the current moving stage.

Referring to fig. 4, fig. 4 is a schematic diagram illustrating steps of determining a movement track of a next movement stage according to a position of an object according to an embodiment of the present application. The step of determining the movement trajectory of the next movement phase according to the object position may include:

s241, the defect detection equipment acquires the target position of the mobile platform.

The target position of the moving platform can be determined by the target area of the wafer to be detected in the next moving stage.

The target area or the area sequence to be detected in the next step, namely the part which needs to be detected in detail on the wafer, can be determined by combining the results of the global image and the line scan image after the currently shot detection image corresponds to the position on the wafer. The defect detection equipment can calculate the target position corresponding to the next moving track of the moving platform by using a path planning algorithm according to the position and the size of the target region to be shot on the wafer, so that the target region can be covered to the greatest extent, and the enough image acquisition time of each position of the wafer is ensured.

S242, the defect detection equipment determines the displacement amount and the displacement direction of the mobile platform according to the target position and the object position.

The defect detection apparatus may calculate displacement vectors corresponding to the target position and the object position based on a vector operation manner, and obtain a displacement amount and a displacement direction from the current position to the target position.

S243, the defect detection device determines the moving track of the next moving stage according to the displacement amount and the displacement direction.

For example, the defect detection apparatus may decompose the displacement vector into displacement amounts in the horizontal direction and the vertical direction. And representing the moving track of the next moving stage of the moving platform by using the displacement quantities in the horizontal direction and the vertical direction. The displacement in the horizontal direction can be used for adjusting the horizontal position of the mobile platform, and the displacement in the vertical direction can be used for adjusting the vertical position of the mobile platform. And then the displacement vector is converted into a specific movement instruction so as to control the movement of the mobile platform. Therefore, the line scanning camera can be ensured to accurately acquire the detection image, and the required area is ensured to be covered.

In some embodiments, the defect detection device may generate a new control instruction according to the manner in which the calculated movement track controls the moving platform, and based on this control instruction, control the moving platform to move according to the movement track.

In some other embodiments, the defect detecting device may preset a movement track of each movement process of the moving platform, calculate a correction instruction according to the steps in the above description after a movement stage is finished, and adjust the preset movement track according to the correction instruction.

S3, the defect detection device acquires a detection image of the object in each of a plurality of moving stages.

After determining the movement track of the next movement stage and controlling the movement platform to move, the defect detection device may repeatedly perform the steps of acquiring the detection image and determining the movement track of the next movement stage according to the global image and the detection image acquired in the current movement stage until all movement stages are completed or a specified movement end position is reached.

And S4, after the movement of the mobile platform is finished, the defect detection equipment detects the defects of the object according to all the acquired detection images.

Referring to fig. 5, fig. 5 is a schematic diagram illustrating steps for performing defect detection on an object according to an embodiment of the present application. The step of defect detection of the object may comprise:

s41, the defect detection equipment splices all the acquired detection images to obtain spliced images.

In some embodiments, the defect detection apparatus may first align all of the acquired inspection images to ensure that they are in the same plane. After the images are aligned, feature points can be extracted from each detected image, and then feature point matching algorithms, such as FLANN, RANSAC and the like, are used for matching the feature points between adjacent detected images, so that the matching relation of the feature points is determined. Based on the matching relation of the feature points, adjacent detection images are spliced by calculating a transformation matrix between the detection images. Common stitching algorithms may include Homography, closed curve stitching, and the like. And sequentially overlapping and fusing corresponding areas in adjacent detection images through the transformation matrix to finally obtain a spliced image.

In some other embodiments, the stitched image may also be corrected using an image correction algorithm, such as a camera correction algorithm, perspective transformation correction, or the like, to obtain a better visual effect. And some blank areas may appear in the stitched image, which areas may be filled in using interpolation algorithms to complete the stitched image. In addition, in order to make the transition of the spliced image natural, image smoothing processing can be performed to reduce the sense of discontinuity at the spliced position.

S42, performing image recognition on the spliced images by the defect detection equipment to obtain an image recognition result.

For example, the defect detection apparatus may perform defect recognition on the wafer in the stitched image based on computer vision and image processing techniques, and determine each defect of the wafer.

S43, the defect detection equipment determines one or more of defect types, defect number and defect physical coordinates of the object according to the image recognition result.

For example, after determining all defects of the wafer, the defect inspection apparatus may classify the identified defects according to a supervised classification model or rules engine. After classification is completed, the number of defects of different kinds can be counted. And then converting the defect center point or the boundary frame coordinate obtained according to the image recognition result into the physical coordinate of the wafer through image processing, thereby determining each defect physical coordinate.

One or more of defect type, defect number and defect physical coordinates of the detected object can be determined according to specific detection requirements. And can generate detection reports according to the corresponding data for inspection by detection personnel.

In an alternative embodiment, the object may be exposed based on a short exposure strategy when acquiring the inspection image of the object, thereby enhancing the inspection capability of the defect inspection apparatus. Referring to fig. 6, fig. 6 is a schematic diagram illustrating steps of an exposure strategy according to an embodiment of the application. The exposure strategy may include:

S61, the defect detection equipment acquires illumination parameters in each of a plurality of moving stages, wherein the illumination parameters are parameters representing illumination conditions of the object.

The defect detection device can be provided with devices such as an illumination intensity sensor or a spectrometer, and illumination parameters such as illumination intensity and spectrum can be acquired when a detection image of an object is required to be acquired after each movement stage is finished.

S62, the defect detection equipment determines exposure time according to the illumination parameters.

In some embodiments, the defect detection apparatus may automatically adjust the exposure time as the illumination parameters change according to a configured automatic exposure control algorithm. The appropriate exposure time may be calculated in real time based on changes in the illumination intensity or other relevant parameters and control signals generated to control the light source to expose, such as exposing the object with a long exposure time at low illumination intensity or exposing the object with a short exposure time at high illumination intensity to obtain consistent quality detection images under different illumination conditions.

In some other embodiments, the defect detection device may also determine the exposure time based on the illumination model and a predictive algorithm. The illumination intensity, the light source position and other environmental factors are modeled, the exposure time is adjusted according to the prediction result, and a control signal is generated to control the light source to perform exposure, so that detection images with consistent quality can be obtained under different illumination conditions.

S63, the defect detection equipment exposes the object according to the exposure time.

After determining the exposure time, the defect detection device may generate and send a control signal to the light source, where the control signal carries the set exposure time, so as to control the light source to expose the object with the set exposure time.

In some other embodiments, the defect detection apparatus may further use a feedback control method to continuously adjust the exposure time according to the current illumination parameter and the image quality index, and iterate through a feedback mechanism until the optimal exposure effect is achieved.

Please refer to fig. 7. Fig. 7 is a schematic diagram of a defect detecting apparatus according to an embodiment of the present application. The defect detection apparatus 70 may include a first image acquisition device 71, a moving platform driving device 72, a second image acquisition device 73, and a defect detection device 74.

In an embodiment of the present application, the first image capturing device 71 is configured to capture a global image of an object on a mobile platform. The moving platform driving device 72 is used for controlling the moving platform to move, and the moving platform has a plurality of moving stages. The second image acquisition means 73 is for acquiring a detection image of the object at each of a plurality of moving stages; the movement locus of each of the plurality of movement phases except the first movement phase is determined from the global image and the detection image acquired at the last movement phase. The defect detecting device 74 is configured to detect a defect of the object according to all the acquired detection images after the movement of the moving platform is completed.

In some embodiments, defect detection apparatus 70 may further include a light source 75 for illuminating and exposing the object. And a material fixing device 76, which is arranged on the moving platform and is used for fixing objects. And a lens adjusting means 77 for adjusting the lens positions and the lens focal lengths of the first image capturing means and the second image capturing means.

In some embodiments, the mobile platform drive 72 may be embodied as three differently oriented drive shafts, which may be an X-axis drive shaft, a Y-axis drive shaft, and a θ -axis drive shaft. The three driving shafts are respectively connected with the moving platform and are used for driving the moving platform to move in three directions.

In some embodiments, the defect detection apparatus 70 may implement the steps of the defect detection method described above through the integrated detection device 78. Referring to fig. 8, fig. 8 is a schematic diagram of an integrated detection device according to an embodiment of the application. The integrated detection device 78 may include:

A detection lens selection unit 781, a detection lens driving unit 782, a moving platform driving unit 783, and an image correction unit 784.

In the embodiment of the present application, the detection lens selection unit 781 is configured to control the first image capturing device or the second image capturing device to enter a working state. The detection lens driving unit 782 is used to control lens positions of the first image capturing device and the second image capturing device. The mobile platform driving unit 783 is used for controlling the mobile platform driving device to drive the mobile platform to move. The image rectification unit 784 is configured to determine a movement trajectory of each of the plurality of movement phases except for the first movement phase.

The integrated detection device 78 is an executable program, and may be disposed in a processor of the defect detection apparatus 70, and executed by the processor when receiving a corresponding instruction.

The Processor of the defect detection device 70 may be a central processing unit (Central Processing Unit, CPU), but the Processor may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL Processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), off-the-shelf Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. The general purpose processor may be a microprocessor or may be any conventional processor.

In some embodiments, the integrated detection device 78 may further include a global image making unit 785 and an image defect detecting unit 786, where the first image obtaining device 71 may collect a plurality of appearance images of the object, send the appearance images to the global image making unit 785, and obtain a global image obtained by fusing the plurality of appearance images from the global image making unit 785.

The defect detecting device 74 may process the obtained detection image based on the image defect detecting unit 786 and perform defect detection on the object.

It should be noted that: the defect detecting device provided based on the above embodiment only exemplifies the division of the above functional modules when detecting the defect of the object, and in practical application, the above functional allocation may be performed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above.

The functional units and modules in the above embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the embodiments of the present application.

The defect detection device and the defect detection method provided in the foregoing embodiments belong to the same concept, and specific working processes and technical effects of the units and modules in the foregoing embodiments may be referred to in a method embodiment section, which is not described herein again.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

It should be understood that, because the content of information interaction between the above devices/units, execution process, etc. is based on the same concept as the method embodiment of the present application, specific functions and technical effects thereof may be referred to in the method embodiment section, and will not be described herein again. For convenience and brevity of description, only the division of the above functional units and modules is illustrated, and in practical application, the above functional allocation may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules, so as to perform all or part of the functions described above. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, the specific names of the functional units and modules are only for distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.

Alternatively, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present invention, in whole or in part.

The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in or transmitted from one computer-readable storage medium to another, for example, by wired (e.g., coaxial cable, optical fiber, digital Subscriber Line (DSL)), or wireless (e.g., infrared, wireless, microwave, etc.).

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A defect detection method, comprising:

acquiring a global image of an object on a mobile platform;

controlling the mobile platform to move, wherein the movement of the mobile platform has a plurality of movement stages;

Acquiring a detection image of the object at each of the plurality of movement phases; a movement locus of each of the plurality of movement phases except for a first movement phase is determined from the global image and the detection image acquired at a previous movement phase;

And after the movement of the mobile platform is finished, performing defect detection on the object according to all the obtained detection images.

2. The method of claim 1, wherein the acquiring a global image of the object on the mobile platform comprises:

acquiring a plurality of appearance images of the object on the mobile platform through a first shooting device;

and performing image fusion operation on the appearance images to obtain the global image.

3. The method of claim 1, wherein the controlling the mobile platform to move comprises:

Taking the first moving stage as a current moving stage;

Controlling the mobile platform to move according to the moving track of the current moving stage in the current moving stage;

When the current moving stage is finished, determining an object position corresponding to the detection image according to the global image and the detection image acquired in the current moving stage;

Determining a moving track of a next moving stage according to the object position, taking the next moving stage as a current moving stage, and re-executing the step and the subsequent steps of controlling the moving platform to move according to the moving track of the current moving stage in the current moving stage.

4. A method according to claim 3, wherein said determining a movement trajectory of a next movement phase from said object position comprises:

Acquiring a target position of the mobile platform;

determining the displacement amount and the displacement direction of the mobile platform according to the target position and the object position;

And determining the moving track of the next moving stage according to the displacement and the displacement direction.

5. The method of claim 1, wherein said performing defect detection on said object based on all of said detected images acquired comprises:

splicing all the obtained detection images to obtain spliced images;

Performing image recognition on the spliced images to obtain an image recognition result;

and determining one or more of defect types, defect numbers and defect physical coordinates of the object according to the image recognition result.

6. The method according to claim 1, wherein the method further comprises:

Acquiring illumination parameters in each of the plurality of movement phases, the illumination parameters being parameters characterizing the illumination conditions of the object;

determining exposure time according to the illumination parameter;

and exposing the object according to the exposure time.

7. The method of any of claims 1-6, wherein the global image is determined from a plurality of appearance images acquired by an area camera and the detection image is acquired by a line scan camera.

8. A defect inspection apparatus, comprising:

the first image acquisition device is used for acquiring a global image of an object on the mobile platform;

the mobile platform driving device is used for controlling the mobile platform to move, and the movement of the mobile platform is provided with a plurality of movement stages;

Second image acquisition means for acquiring a detection image of the object at each of the plurality of movement phases; a movement locus of each of the plurality of movement phases except for a first movement phase is determined from the global image and the detection image acquired at a previous movement phase;

9. The apparatus as recited in claim 8, further comprising:

A light source device;

The material fixing device is arranged on the mobile platform and is used for fixing the object;

and the lens adjusting device is respectively connected with the first image acquisition device and the second image acquisition device and is used for adjusting the lens positions and the lens focal lengths of the first image acquisition device and the second image acquisition device.

10. The apparatus as recited in claim 9, further comprising:

The detection lens selection unit is used for controlling the first image acquisition device or the second image acquisition device to enter a working state;

A detection lens driving unit for controlling lens positions of the first image acquisition device and the second image acquisition device;

the mobile platform driving unit is used for controlling the mobile platform driving device to drive the mobile platform to move;