CN117926371A - Single-side horizontal electroplating equipment for solar silicon wafer - Google Patents

Abstract

The invention discloses single-sided horizontal electroplating equipment for a solar silicon wafer, which comprises a frame, a conveying line module, a spraying module and a rectifier module; the spraying module and the rectifier module are both arranged on the frame, an electroplating cavity is formed in the frame, and the conveying line module is arranged on the frame and penetrates through the electroplating cavity; the electroplating cavity is internally provided with an electroplating bath, a plating eliminating bath, a driving module and a conductive channel module; an upper titanium net is arranged in the plating tank, and an electrolytic titanium net is arranged in the plating tank; a plurality of groups of conducting rod assemblies are arranged in the driving module. The invention shortens the length of the electroplating bath, increases the electroplating efficiency, simultaneously avoids isolating the cathode conductive contact from the electroplating bath solution, and realizes the deplating of the cathode conductive contact under the condition of not influencing normal electroplating, thereby ensuring the electroplating effect of the solar silicon wafer; the sprayed electroplating liquid is prevented from overflowing outwards from the conveying line module, and meanwhile, the electroplating liquid on the surface of the solar silicon wafer can be scraped off, so that the environmental pollution caused by electroplating overflowing equipment is prevented.

Description

Single-side horizontal electroplating equipment for solar silicon wafer

Technical Field

The invention belongs to the field of electroplating equipment, and particularly relates to single-sided horizontal electroplating equipment for a solar silicon wafer.

Background

Electroplating Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing the electrolysis principle, and is a process of adhering a metal film on the surface of the metal or other material parts by utilizing the electrolysis so as to play roles of preventing oxidation (such as rust) of the metal, improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate) and attractive appearance.

At present, horizontal electroplating equipment is often adopted on the electroplating of solar silicon wafer, during electroplating, the solar silicon wafer is tiled on a conveying line and sequentially conveyed to an electroplating bath, and the solar silicon wafer is completely soaked in the electroplating bath, so that electroplating is realized, although the electroplating mode can shorten the length of the electroplating bath and increase the electroplating efficiency, in the electroplating process of the solar silicon wafer, a cathode conductive contact cannot be isolated outside an electroplating bath liquid, so that the cathode conductive contact can be electroplated, uneven contact surfaces of the cathode conductive contact and a workpiece are caused, and the electroplating effect of the solar silicon wafer is seriously affected.

Disclosure of Invention

In order to solve the problems in the prior art, the invention aims to provide single-sided horizontal electroplating equipment for a solar silicon wafer, which shortens the length of an electroplating bath, increases the electroplating efficiency, simultaneously avoids isolating a cathode conductive contact from the electroplating bath liquid, and realizes the deplating of the cathode conductive contact under the condition of not influencing normal electroplating, thereby ensuring the electroplating effect of the solar silicon wafer.

In order to achieve the technical purposes and effects, the invention is realized by the following technical scheme:

a single-sided horizontal electroplating device for a solar silicon wafer comprises a frame, a conveying line module, a spraying module and a rectifier module; the spraying module and the rectifier module are both arranged on the frame, an electroplating cavity is formed in the frame, and the conveying line module is arranged on the frame and penetrates through the electroplating cavity; the electroplating cavity is internally provided with an electroplating bath, a plating tank, a driving module and a conductive channel module; an upper titanium net is arranged in the electroplating tank, and an electrolytic titanium net is arranged in the plating tank; a plurality of groups of conducting rod assemblies are arranged in the driving module, and the conducting rod assemblies can circularly move between the electroplating bath and the plating-removing bath along the conducting channel module by driving of the driving module, and in the moving process, electroplating liquid is sprayed into the electroplating bath and the plating-removing bath through the spraying module; the conductive channel module, the upper titanium mesh and the electrolytic titanium mesh are respectively connected with the rectifier module through corresponding circuits.

Further, the conveying line module adopts a roller conveying line and comprises a plurality of groups of first rollers, the first rollers are connected through gear assemblies, and the gear assemblies are connected with a first driving motor through transmission devices.

Further, the spraying module consists of two groups of spraying units; each group of spraying units comprises an upper spraying pipeline and a lower spraying pipeline, the upper spraying pipeline and the lower spraying pipeline are connected with a liquid outlet of an infusion pump through an infusion pipeline, the infusion pump is fixed on the frame, and a liquid inlet of the infusion pump sinks into a cavity for storing electroplating liquid in the frame.

Further, a water retaining roller group is respectively arranged at the front end and the rear end of the electroplating bath.

Further, the driving module adopts a sprocket chain driving module, and comprises a pair of oppositely arranged sprocket chain groups, wherein the pair of sprocket chain groups are connected through a pair of rotating shafts, and one end of one rotating shaft is connected with a second driving motor through a coupler.

Further, each of the sprocket-chain sets includes a first gear, a second gear, and a first chain disposed between the first gear and the second gear.

Further, the conductive path module includes a pair of lower conductive paths and a pair of upper conductive paths.

Further, the conductive rod assemblies are uniformly arranged between the driving modules.

Further, the conducting rod assembly comprises a pair of conducting shafts, each conducting shaft is provided with a conducting plate capable of rotating on the conducting shafts, a conducting rod is arranged between the conducting plates, and a plurality of pairs of conducting contacts are arranged on the conducting rod.

Further, the rectifier module comprises an electroplating rectifier and a deplating rectifier.

The beneficial effects of the invention are as follows:

1. According to the invention, the electroplating bath and the plating tank are arranged, and the driving module for driving the conductive rod assembly to move is arranged between the electroplating bath and the plating tank, so that the conductive contact can move circularly between the electroplating bath and the plating tank, the length of the electroplating bath is shortened, the electroplating efficiency is increased, the cathode conductive contact is not required to be isolated from the electroplating bath solution, and the cathode conductive contact can be subjected to plating elimination under the condition of not affecting normal electroplating, and the electroplating effect of a solar silicon wafer is ensured;

2. The front end and the rear end of the electroplating bath are respectively provided with the water retaining roller groups, so that the electroplating bath can effectively prevent the sprayed electroplating liquid from overflowing outwards from the conveying line module, and simultaneously, the electroplating bath can scrape the electroplating liquid on the surface of the solar silicon wafer when the solar silicon wafer is output from the electroplating bath after the electroplating of the solar silicon wafer is finished, thereby effectively preventing the electroplating overflowing equipment from causing environmental pollution.

The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings. Specific embodiments of the present invention are given in detail by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic diagram of the overall structure of the device of the present invention;

FIG. 2 is a schematic illustration of a frame with portions broken away of the apparatus of the present invention;

FIG. 3 is a schematic view of a portion of an apparatus of the present invention;

FIG. 4 is a cross-sectional view of a conveyor line module of the present invention;

FIG. 5 is an enlarged view of the invention at A in FIG. 4;

FIG. 6 is a schematic diagram of a spray module according to the present invention;

FIG. 7 is a schematic diagram showing the connection of the spray module to the electroplating tank and the plating tank;

FIG. 8 is a schematic view of a water retaining roller set according to the present invention;

FIG. 9 is a schematic diagram of the connection of the water deflector roller set and the conveyor line module according to the present invention;

FIG. 10 is a schematic diagram of a driving module according to the present invention;

FIG. 11 is a schematic diagram of a conductive rod assembly connection according to the present invention;

FIG. 12 is a schematic view of a conductive rod assembly according to the present invention;

fig. 13 is a schematic view of the working state of the present invention.

The reference numerals in the figures illustrate: 1. a frame; 2. a conveyor line module; 3. a spray module; 4. a rectifier module; 5. plating bath; 6. a plating tank; 7. a driving module; 8. a conductive channel module; 9. coating a titanium net; 10. electrolytic titanium mesh; 11. a conductive rod assembly; 12. a water retaining roller group; 101. an electroplating cavity; 201. a first roller; 202. a gear assembly; 203. a transmission device; 204. a first driving motor; 2021. a third gear; 2022. a fourth gear; 2023. a rotation shaft; 2024. a connecting seat; 2031. a fifth gear; 2032. a sixth gear; 2033. a second chain; 301. a spraying unit; 3011. a spray pipe is arranged on the upper part; 3012. a lower spray pipe; 3013. an infusion tube; 3014. an infusion pump; 121. a second roller; 122. a third roller; 123. a seventh gear; 124. an eighth gear; 701. a sprocket chain set; 702. a rotating shaft; 703. a coupling; 704. a second driving motor; 7011. a first gear; 7012. a second gear; 7013. a first chain; 801. a lower conductive path; 802. an upper conductive path; 111. a conductive shaft; 112. a conductive plate; 113. a conductive rod; 114. a conductive contact; 401. electroplating a rectifier; 402. and (5) eliminating plating of a rectifier.

Detailed Description

The invention will be described in detail below with reference to the drawings in combination with embodiments.

It should be noted that all directional indicators (such as up, down, left, right, front, back, upper, lower, top, bottom … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indicators correspondingly change.

Referring to fig. 1-3, a single-sided horizontal electroplating device for a solar silicon wafer comprises a frame 1, a conveying line module 2, a spraying module 3 and a rectifier module 4; the spraying module 3 and the rectifier module 4 are both arranged on the frame 1, an electroplating cavity 101 is formed in the frame 1, and the conveying line module 2 is arranged on the frame 1 and penetrates through the electroplating cavity 101; the electroplating cavity 101 is internally provided with an electroplating bath 5, a plating bath 6, a driving module 7 and a conductive channel module 8; an upper titanium net 9 is arranged in the electroplating tank 5, and an electrolytic titanium net 10 is arranged in the plating tank 6; a plurality of groups of conducting rod assemblies 11 are arranged in the driving module 7, the conducting rod assemblies 11 can circularly move between the electroplating bath 5 and the plating tank 6 along the conducting channel module 8 by driving of the driving module 7, and in the moving process, electroplating liquid is sprayed into the electroplating bath 5 and the plating tank 6 through the spraying module 3; the conducting channel module 8, the upper titanium mesh 9 and the electrolytic titanium mesh 10 are respectively connected with the rectifier module 4 through corresponding circuits.

Further, referring to fig. 4, the conveyor line module 2 adopts a roller conveyor line, which includes a plurality of groups of first rollers 201, the first rollers 201 are connected through a gear assembly 202, and synchronous rotation between the first rollers 201 can be achieved through the gear assembly 202, the gear assembly 202 is connected with a first driving motor 204 through a transmission device 203, and the first driving motor 204 is fixed on the frame 1; in this embodiment, as shown in fig. 5, the gear assembly 202 includes a third gear 2021 sleeved on each set of the first rollers 201, a fourth gear 2022 meshed with each set of the third gears 2021, and a rotating shaft 2023 penetrating through all the fourth gears 2022, where the rotating shaft 2023 is connected to the frame 1 through a connection base 2024, and the rotating shaft 2023 can rotate in the connection base 2024, and the third gears 2021 and the fourth gears 2022 adopt bevel gears for 90 ° transmission; with continued reference to fig. 5, the transmission device 203 employs a sprocket chain module, which includes a fifth gear 2031 sleeved on the rotation shaft 2023, a sixth gear 2032 sleeved on the output shaft of the first driving motor 204, and a second chain 2033 disposed between the fifth gear 2031 and the sixth gear 2032, where the sixth gear and the fifth gear 2031 employ spur gears.

Further, referring to fig. 6 to 7, the spray module 3 is composed of two groups of spray units 301, and when installed, one group is used for spraying the electroplating solution into the electroplating tank 5, and the other group is used for spraying the electroplating solution into the plating tank 6; each group of spraying units 301 comprises an upper spraying pipe 3011 and a lower spraying pipe 3012, the upper spraying pipe 3011 and the lower spraying pipe 3012 are connected with a liquid outlet of a liquid delivery pump 3014 through a liquid delivery pipe 3013, the liquid delivery pump 3014 is fixed on the frame 1, and a liquid inlet of the liquid delivery pump 3014 sinks into a cavity for storing electroplating liquid in the frame 1; during spraying, the transfer pump 3014 transfers the plating solution to the upper spray pipe 3011 and the lower spray pipe 3012 through the transfer pipe 3013, and sprays the plating solution downward from above the plating tank 5 or the plating tank 6 through the upper spray pipe 3011, and sprays the plating solution upward from below the plating tank 5 or the plating tank 6 through the lower spray pipe 3012.

Further, referring to fig. 2, a water blocking roller set 12 is respectively disposed at the front and rear ends of the plating tank 5, in this embodiment, referring to fig. 8 to 9, the water blocking roller set 12 includes a second roller 121 and a third roller 122, a seventh gear 123 is respectively disposed on the same end of the second roller 121 and the third roller 122 as the gear assembly 202, the seventh gear 123 is in meshed connection, the seventh gear 123 after being meshed is in meshed connection with an eighth gear 124, and the eighth gear 124 is disposed on the first roller 201 in close proximity, so as to realize that the water blocking roller set 12 is driven to rotate when the conveying line module 2 operates; the seventh gear 123 and the eighth gear 124 are spur gears; during electroplating, the water retaining roller set 12 can effectively prevent sprayed electroplating liquid from overflowing outwards from the conveying line module 2, and can also scrape the electroplating liquid on the surface of the solar silicon wafer when the electroplating liquid is output from the electroplating tank 5 after the electroplating of the solar silicon wafer is completed.

Further, referring to fig. 10, the driving module 7 is a sprocket-chain driving module, and includes a pair of oppositely disposed sprocket-chain sets 701, wherein the pair of sprocket-chain sets 701 are connected by a pair of rotating shafts 702, the rotating shafts 702 are rotatably disposed on the frame 1, one end of one rotating shaft 702 is connected to a second driving motor 704 through a coupling 703, and the second driving motor 704 is fixed on the frame 1; and each of the sprocket-chain sets 701 includes a first gear 7011, a second gear 7012, and a first chain 7013 disposed between the first gear 7011 and the second gear 7012, the rotating shafts 702 are disposed between the first gears 7011 and between the second gears 7012 in a pair of the sprocket-chain sets 701, respectively, and the conductive rod assemblies 11 are disposed between the first chains 7013 in a pair of the sprocket-chain sets 701.

Further, referring to fig. 2-3 and 11, the conductive path module 8 includes a pair of lower conductive paths 801 and a pair of upper conductive paths 802; during installation, the pair of lower conductive channels 801 are arranged on the plating tank 5 side, the pair of upper conductive channels 802 are arranged on the plating tank 6 side, the conductive rod assembly 11 is driven by the driving module 7 to circularly move between the plating tank 5 and the plating tank 6 along the pair of lower conductive channels 801 and the pair of upper conductive channels 802, and in the moving process, contact connection between the lower conductive channels 801 and the upper conductive channels 802 and the conductive rod assembly 11 is realized.

Further, referring to fig. 11, the conductive rod assemblies 11 are uniformly disposed between the driving modules 7, that is, the conductive rod assemblies 11 are uniformly disposed between the first chains 7013; referring to fig. 12, the conductive rod assembly 11 includes a pair of conductive shafts 111 respectively connected to the first chains 7013 on the corresponding sides, a conductive plate 112 capable of rotating thereon is disposed on each group of conductive shafts 111, a conductive rod 113 is disposed between the conductive plates 112, a plurality of pairs of conductive contacts 114 are disposed on the conductive rod 113, in this embodiment, eight pairs of conductive contacts 114 are disposed on each group of conductive rods 113, so that each group of conductive rods 113 can simultaneously plate eight groups of solar silicon wafers, and of course, the number of the conductive contacts 114 is only one embodiment, the cost limits the scope of the application, and the conductive rod assembly can be set according to the size of the device and the production requirement in practical application, so long as the requirement is met; and when the conductive rod assembly 11 is moved by driving the driving module 7, the upper end of the conductive plate 112 moves in the lower conductive channel 801 and the upper conductive channel 802 and is in contact connection with the lower conductive channel 801 and the upper conductive channel 802.

Further, referring to fig. 2-3, the rectifier module 4 includes an electroplated rectifier 401 and a deplating rectifier 402; when in connection, the positive electrode of the electroplating rectifier 401 is connected with the upper titanium mesh 9 through a corresponding line, and the negative electrode of the electroplating rectifier 401 is connected with one of the lower conductive channels 801 through a corresponding line; the positive electrode of the deplating rectifier 402 is connected with the electrolytic titanium mesh 10 through a corresponding line, and the negative electrode of the deplating rectifier 402 is connected with one of the upper conductive channels 802 through a corresponding line.

The working principle of the invention is as follows:

When electroplating is performed on a solar silicon wafer, referring to fig. 13 (reference sign a in the figure represents the equipment, reference sign B in the figure represents the solar silicon wafer), equipment is started first, a transmission line module 2 and a driving module 7 drive a conductive rod assembly 11 to operate, and two groups of spraying units 301 spray electroplating liquid into an electroplating tank 5 and an electroplating tank 6 respectively through an upper spraying pipeline 3011 and a lower spraying pipeline 3012; then, sequentially placing the solar silicon wafers on a first roller 201 on the conveying line module 2, wherein at the moment, the number of the pairs of conductive contacts 114 arranged on each row of the conductive rod assemblies 11 on the conveying line module 2 is not more than the number of pairs of conductive contacts 114 arranged on each row of the conductive rod assemblies 11, and when each row of solar silicon wafers is horizontally conveyed into the electroplating bath 5 in the electroplating cavity 101 through the conveying line module 2, each row of solar silicon wafers is contacted with a pair of conductive contacts 114 on one group of conductive rod assemblies 11, and the conductive rod assemblies 11 contacted with each row of solar silicon wafers synchronously move forwards in the electroplating bath 5 along with the solar silicon wafers, so that the electroplating of the upper surfaces of the solar silicon wafers is completed; when each row of solar silicon wafers moves out of the electroplating tank 5, the solar silicon wafers are separated from the conducting rod assemblies 11 contacted with the solar silicon wafers, the solar silicon wafers are output through the conveying line module 2, the conducting rod assemblies 11 contacted with the solar silicon wafers are driven by the driving module 7, enter the plating tank 6, and perform plating elimination on the conducting contacts 114 in the moving process, and after the plating elimination is completed, the conducting rod assemblies 11 are driven by the driving module 7 to enter the next circulation.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A solar silicon wafer single-sided horizontal electroplating device is characterized in that: comprises a frame (1), a conveying line module (2), a spraying module (3) and a rectifier module (4); the spraying module (3) and the rectifier module (4) are both arranged on the frame (1), an electroplating cavity (101) is formed in the frame (1), and the conveying line module (2) is arranged on the frame (1) and penetrates through the electroplating cavity (101); an electroplating tank (5), an electroplating tank (6), a driving module (7) and a conductive channel module (8) are arranged in the electroplating cavity (101); an upper titanium net (9) is arranged in the electroplating tank (5), and an electrolytic titanium net (10) is arranged in the plating tank (6); a plurality of groups of conducting rod assemblies (11) are arranged in the driving module (7), the conducting rod assemblies (11) can circularly move between the electroplating bath (5) and the plating-removing tank (6) along the conducting channel module (8) by driving of the driving module (7), and in the moving process, electroplating liquid is sprayed into the electroplating bath (5) and the plating-removing tank (6) through the spraying module (3); the conducting channel module (8), the upper titanium net (9) and the electrolytic titanium net (10) are respectively connected with the rectifier module (4) through corresponding circuits.

2. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the conveying line module (2) adopts a roller conveying line and comprises a plurality of groups of first rollers (201), the first rollers (201) are connected through gear assemblies (202), and the gear assemblies (202) are connected with a first driving motor (204) through transmission devices (203).

3. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the spraying module (3) consists of two groups of spraying units (301); each group of spraying units (301) comprises an upper spraying pipeline (3011) and a lower spraying pipeline (3012), the upper spraying pipeline (3011) and the lower spraying pipeline (3012) are connected with a liquid outlet of an infusion pump (3014) through an infusion pipeline (3013), the infusion pump (3014) is fixed on the frame (1), and a liquid inlet of the infusion pump is sunk into a cavity for storing electroplating liquid in the frame (1).

4. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the front end and the rear end of the electroplating bath (5) are respectively provided with a water retaining roller group (12).

5. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the driving module (7) adopts a chain wheel and chain driving module, and comprises a pair of chain wheel and chain groups (701) which are oppositely arranged, wherein the pair of chain wheel and chain groups (701) are connected through a pair of rotating shafts (702), and one end of one rotating shaft (702) is connected with a second driving motor (704) through a coupler (703).

6. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 5, wherein: each set of sprocket and chain sets (701) comprises a first gear (7011), a second gear (7012) and a first chain (7013) arranged between the first gear (7011) and the second gear (7012).

7. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the conductive path module (8) includes a pair of lower conductive paths (801) and a pair of upper conductive paths (802).

8. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the conducting rod assemblies (11) are uniformly arranged between the driving modules (7).

9. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 8, wherein: the conductive rod assembly (11) comprises a pair of conductive shafts (111), each group of conductive shafts (111) is provided with a conductive plate (112) capable of rotating on the conductive shafts, a conductive rod (113) is arranged between the conductive plates (112), and a plurality of pairs of conductive contacts (114) are arranged on the conductive rod (113).

10. The solar silicon wafer single-sided horizontal electroplating equipment according to claim 1, wherein: the rectifier module (4) comprises an electroplating rectifier (401) and a deplating rectifier (402).