CN117922122A - Sealing plate for capacitor and capacitor - Google Patents
Sealing plate for capacitor and capacitor Download PDFInfo
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- CN117922122A CN117922122A CN202410332939.1A CN202410332939A CN117922122A CN 117922122 A CN117922122 A CN 117922122A CN 202410332939 A CN202410332939 A CN 202410332939A CN 117922122 A CN117922122 A CN 117922122A
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- phenolic resin
- capacitor
- modified
- sealing plate
- inorganic particles
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- 239000003990 capacitor Substances 0.000 title claims abstract description 58
- 238000007789 sealing Methods 0.000 title claims abstract description 54
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000000843 powder Substances 0.000 claims abstract description 50
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 44
- 239000005011 phenolic resin Substances 0.000 claims abstract description 44
- 239000010954 inorganic particle Substances 0.000 claims abstract description 36
- 239000003607 modifier Substances 0.000 claims abstract description 26
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 11
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000013013 elastic material Substances 0.000 claims abstract description 8
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 5
- 229920000742 Cotton Polymers 0.000 claims abstract description 4
- 239000004744 fabric Substances 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 239000002655 kraft paper Substances 0.000 claims abstract description 4
- 239000000123 paper Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 17
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 15
- 239000003063 flame retardant Substances 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 235000013824 polyphenols Nutrition 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 8
- 239000002585 base Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 7
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 6
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 claims description 6
- 150000001299 aldehydes Chemical class 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 5
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 claims description 3
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical class CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 claims description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 229920005549 butyl rubber Polymers 0.000 claims description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 150000001896 cresols Chemical class 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 229920001973 fluoroelastomer Polymers 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- 229920002866 paraformaldehyde Polymers 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 238000007718 adhesive strength test Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
In order to overcome the problems of insufficient flame retardance and separation of sealing layers in the existing cover plate for the capacitor, the invention provides a sealing plate for the capacitor, which comprises a sealing layer made of an elastic material and a supporting layer laminated on the sealing layer, wherein the supporting layer comprises a composite material of a base material and modified phenolic resin; the substrate is at least one selected from kraft paper, non-woven fabric, glass fiber cloth or cotton paper; the modified phenolic resin comprises phenolic resin and modified powder, wherein the modified powder is selected from inorganic particles modified by a modifier, and the modifier is selected from at least one of 1, 8-diazabicyclo [5.4.0] undec-7-ene and 1, 5-diazabicyclo [4.3.0] non-5-ene. Meanwhile, the invention also discloses a capacitor comprising the sealing plate for the capacitor. The sealing plate for the capacitor has higher flame retardance and structural stability, and improves the safety and service life of the capacitor.
Description
Technical Field
The invention belongs to the technical field of capacitors, and particularly relates to a sealing plate for a capacitor and the capacitor.
Background
The capacitor cover plate is a main mounting and sealing part of a large-sized aluminum electrolytic capacitor, and is generally formed by compounding a layer of temperature-resistant rubber (sealing layer) and a resin plate (supporting layer), and the requirements of the sealing material of the electrolytic capacitor are met by combining excellent electric insulation property, mechanical property and chemical resistance of the resin plate with excellent air tightness, moisture resistance, water resistance, electric insulation property, oil resistance and the like of the rubber.
The safety of the capacitor is a major concern for the people all the time, in order to prevent the capacitor from further burning in fire, the flame retardant performance of the used capacitor cover plate is important, the development of phenolic resin glue with flame retardant performance is a feasible scheme, the phenolic resin can be endowed with higher flame retardant performance by adding flame retardant into the phenolic resin, the conventional flame retardant is mainly an organic flame retardant and an inorganic flame retardant, wherein the inorganic flame retardant is widely used in terms of low price and simple operation, chinese patent CN 103131128A reports that the aluminum hydroxide powder is used for modifying the phenolic resin to improve the flame retardant performance of the resin, but the compatibility of the inorganic powder and the phenolic resin is poor, the flame retardant performance is reduced due to easy agglomeration of the inorganic powder along with the increase of the adding amount of the phenolic resin, the adhesive performance of the resin is gradually reduced, delamination is caused between a sealing layer and a supporting layer, and liquid leakage is caused after the capacitor is used for a long time, and the use requirement of the capacitor is finally not met.
Disclosure of Invention
Aiming at the problems of insufficient flame retardance and separation of sealing layers of the existing cover plate for the capacitor, the invention provides a sealing plate for the capacitor and the capacitor.
The technical scheme adopted by the invention for solving the technical problems is as follows:
In one aspect, the present invention provides a sealing plate for a capacitor, comprising a sealing layer made of an elastic material and a supporting layer laminated on the sealing layer, wherein the supporting layer comprises a composite material of a base material and a modified phenolic resin;
The elastic material is at least one selected from butyl rubber, butadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, fluororubber, silicone rubber and chloroprene rubber;
The substrate is at least one selected from kraft paper, non-woven fabric, glass fiber cloth or cotton paper;
The modified phenolic resin comprises phenolic resin and modified powder, wherein the modified powder is selected from inorganic particles modified by a modifier, the modifier is selected from at least one of 1, 8-diazabicyclo [5.4.0] undec-7-ene and 1, 5-diazabicyclo [4.3.0] non-5-ene, and the inorganic particles are selected from inorganic particles with flame retardant effect.
Optionally, the modified phenolic resin is prepared by the following method:
Mixing water, inorganic particles and a modifier, fully stirring, filling the mixture into an autoclave with a polytetrafluoroethylene lining, reacting for 72-168 hours at the temperature of 140-180 ℃, filtering, cleaning and drying to obtain modified powder;
Mixing the modified powder with a phenolic resin oligomer to obtain a modified phenolic resin prepolymer;
and curing the modified phenolic resin prepolymer to obtain the modified phenolic resin.
Optionally, the inorganic particles include one or more of aluminum hydroxide and silicon dioxide.
Optionally, the particle size of the inorganic particles is 10nm-600nm.
Optionally, the mass ratio of the inorganic particles to the modifier is 1: (10-20); the added mass of the water is 0.5-3% of the total mass of the inorganic particles and the modifier.
Optionally, after adding the modified powder, the reaction system is kept at 30-50 ℃ for 10-20 min.
Optionally, the mass ratio of the modified powder to the phenolic resin oligomer is 1: (10-20).
Optionally, the phenolic resin oligomer is prepared by the following method:
Mixing phenolic substances and aldehyde substances in a molar ratio of 1 (1.1-1.9), adding alkali to adjust the pH value to 8-10, heating to 85-95 ℃, and preserving heat for 60-80 min under normal pressure; and (3) after the reaction is finished, decompressing and dehydrating, and controlling the viscosity of the resin to be 100-180 mpa.s to obtain the phenolic resin oligomer.
Optionally, the phenolic substance comprises one or more of phenol, cresols, ethylphenols, butylphenols, para-alkylphenols, halophenols, monophenol substituents and polyphenols; the aldehyde substance comprises one or more of formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde and polyoxymethylene.
In yet another aspect, the present invention provides a capacitor comprising a sealing plate for a capacitor as described above.
According to the sealing plate for the capacitor, the modified powder is added into the phenolic resin, and the modified powder adopts at least one of 1, 8-diazabicyclo [5.4.0] undec-7-ene and 1, 5-diazabicyclo [4.3.0] non-5-ene as the modifier for modification treatment, so that the occurrence of agglomeration of the modified powder in the phenolic resin can be effectively reduced after the treatment of the modifier, the flame retardance of the modified powder to the phenolic resin is effectively improved, meanwhile, the modified powder after the treatment of the modifier has better affinity with the phenolic resin and is fully wrapped by the phenolic resin after the phenolic resin is added, the adverse influence of the addition of the modified powder on the bonding performance of the phenolic resin is avoided, the bonding strength between a supporting layer and a rubber layer is ensured, the separation problem of the rubber layer is avoided, and the safety and the service life of the capacitor are improved.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
An embodiment of the present invention provides a sealing plate for a capacitor, including a sealing layer made of an elastic material and a supporting layer laminated on the sealing layer, the supporting layer including a composite material of a base material and a modified phenolic resin;
The elastic material is at least one selected from butyl rubber, butadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, fluororubber, silicone rubber and chloroprene rubber;
The substrate is at least one selected from kraft paper, non-woven fabric, glass fiber cloth or cotton paper;
The modified phenolic resin comprises phenolic resin and modified powder, wherein the modified powder is selected from inorganic particles modified by a modifier, the modifier is selected from at least one of 1, 8-diazabicyclo [5.4.0] undec-7-ene and 1, 5-diazabicyclo [4.3.0] non-5-ene, and the inorganic particles are selected from inorganic particles with flame retardant effect.
The modified powder is modified by at least one of 1, 8-diazabicyclo [5.4.0] undec-7-ene and 1, 5-diazabicyclo [4.3.0] non-5-ene serving as a modifier, and the occurrence of agglomeration of the modified powder in the phenolic resin can be effectively reduced after the modification is carried out, the flame retardance of the modified powder to the phenolic resin is effectively improved, meanwhile, the modified powder treated by the modifier has better affinity with the phenolic resin, is fully wrapped by the phenolic resin after the phenolic resin is added, and avoids the exposure of the modified powder, thereby avoiding the adverse influence of the addition of the modified powder on the bonding performance of the phenolic resin, ensuring the bonding strength between the supporting layer and the rubber layer, and avoiding the problem of separation of the rubber layer.
In some embodiments, the modified phenolic resin is prepared by the following method:
Mixing water, inorganic particles and a modifier, fully stirring, filling the mixture into an autoclave with a polytetrafluoroethylene lining, reacting for 72-168 hours at the temperature of 140-180 ℃, filtering, cleaning and drying to obtain modified powder;
Mixing the modified powder with a phenolic resin oligomer to obtain a modified phenolic resin prepolymer;
and curing the modified phenolic resin prepolymer to obtain the modified phenolic resin.
Under high temperature and high pressure, 1, 8-diazabicyclo [5.4.0] undec-7-ene or 1, 5-diazabicyclo [4.3.0] non-5-ene performs ring opening reaction on the surfaces of inorganic particles, so that free amino groups are formed on the surfaces of the inorganic particles, and the modified powder obtained by the method has better dispersibility and better compatibility with phenolic resin, and can further increase the adhesiveness of a system.
In some embodiments, the inorganic particles comprise one or more of aluminum hydroxide and silica.
At high temperature, aluminum hydroxide can decompose and release crystal water to absorb a large amount of heat, so that the surface temperature of the material is reduced, and flame spread is effectively prevented. The decomposition temperature is as high as 210 ℃, so that the material has good thermal stability.
The silica as an inorganic particle enhances the strength of the support layer by its physical properties, preventing heat and substances from being transferred during combustion, thereby exerting a flame retarding effect. Furthermore, the low thermal conductivity of silica helps to avoid thermal bridging effects.
In some embodiments, the inorganic particles have a particle size of 10nm to 600nm.
Specifically, the particle size of the inorganic particles may be 10nm、30nm、60nm、100nm、120nm、150nm、180nm、200nm、220nm、250nm、280nm、300nm、320nm、350nm、380nm、400nm、420nm、450nm、480nm、500nm、520nm、550nm、580nm or 600nm.
If the particle size of the inorganic particles is too small, agglomeration problems are easily caused; if the particle size of the inorganic particles is too large, sedimentation is easily caused by the dead weight problem, and the uniform dispersion of the modified powder in the system is also not facilitated.
In some embodiments, the mass ratio of the inorganic particles and the modifying agent may be 1: (10-20); the added mass of the water is 0.5-3% of the total mass of the inorganic particles and the modifier.
Specifically, the mass ratio of the inorganic particles and the modifier may be (1:10), (1:11), (1:12), (1:13), (1:14), (1:15), (1:16), (1:17), (1:18), (1:19), or (1:20). The water may be added in an amount of 0.5%, 0.8%, 1%, 1.2%, 1.4%, 1.8%, 2%, 2.3%, 2.5%, 2.8% or 3% of the total mass of the inorganic particles and the modifier.
When the addition amount of the modifier is too low, it is difficult to ensure sufficient soaking of the inorganic particles, thereby affecting the surface modification range of the inorganic particles; when the addition amount of the modifier is too high, material waste is caused, and energy consumption such as heating is large.
In some embodiments, after the modified powder is added, the reaction system is incubated at 30-50 ℃ for 10-20 min.
In some embodiments, the mass ratio of the modified powder to the phenolic resin oligomer is 1: (10-20).
Specifically, the mass ratio of the modified powder to the phenolic resin oligomer may be (1:10), (1:11), (1:12), (1:13), (1:14), (1:15), (1:16), (1:17), (1:18), (1:19) or (1:20).
If the addition amount of the modified powder is too small, the flame retardant performance of the phenolic resin is difficult to be improved; if the amount of the modified powder added is too large, the impact resistance of the sealing plate for the capacitor is lowered, and the adhesive strength between the supporting layer and the rubber layer is also affected.
In some embodiments, the phenolic resin oligomer is prepared by the following method:
Mixing phenolic substances and aldehyde substances in a molar ratio of 1 (1.1-1.9), adding alkali to adjust the pH value to 8-10, heating to 85-95 ℃, and preserving heat for 60-80 min under normal pressure; and (3) after the reaction is finished, decompressing and dehydrating, and controlling the viscosity of the resin to be 100-180 mpa.s to obtain the phenolic resin oligomer.
In some embodiments, the base is 25% -28% ammonia by mass.
In some embodiments, the phenolic species include one or more of phenols, cresols, ethylphenols, butylphenols, para-alkylphenols, halophenols, monophenol substituents, and polyphenols; the aldehyde substance comprises one or more of formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde and polyoxymethylene.
In some embodiments, after the modified phenolic resin prepolymer is obtained, an organic solvent is added to dilute the modified phenolic resin prepolymer to 45-65% by mass.
In some embodiments, the organic solvent is selected from methanol or ethanol.
In some embodiments, the modified phenolic resin is cured from a modified phenolic resin prepolymer by:
mixing the base material with the modified phenolic prepolymer, and fully impregnating the base material with the modified phenolic resin prepolymer to obtain phenolic prepreg;
and (3) laminating a plurality of phenolic prepregs, performing hot pressing treatment, curing the laminated phenolic prepregs into a whole to obtain a composite material of a base material and modified phenolic resin, and performing hot pressing treatment on the composite material of the base material and the modified phenolic resin and an elastic material to obtain the sealing plate for the capacitor.
Another embodiment of the present invention provides a capacitor including the capacitor sealing plate as described above or the sealing plate for a capacitor prepared by the preparation method as described above.
By adopting the sealing plate for the capacitor, the capacitor has better flame retardance and stability, and further the safety and the service life of the capacitor are improved.
The invention is further illustrated by the following examples.
Example 1
The embodiment is used for explaining a preparation method of the sealing plate for the capacitor, and comprises the following operation steps:
Synthesis of phenolic resin oligomer: adding phenol and formaldehyde with the molar ratio of 1:1.5 into a reaction container, adding ammonia water with the mass fraction of 26% to adjust the pH value to 9, heating to 95 ℃, preserving heat for 70min under normal pressure, decompressing and dehydrating, and controlling the viscosity of the resin to 150mpa.s;
Preparation of modified powder: aluminum hydroxide and 1, 8-diazabicyclo [5.4.0] undec-7-ene are mixed according to the mass ratio of 1:15, adding deionized water with the mass percent of 2% into the mixture, magnetically stirring the mixture for 30min at the temperature of 30 ℃, placing the mixture into an autoclave with a polytetrafluoroethylene lining after stirring, heating the mixture, standing the mixture at the temperature of 150 ℃ for 3-7 days, taking the mixture out, naturally cooling the mixture to room temperature, filtering the mixture, taking filter residues, washing the filter residues by using absolute ethyl alcohol, putting the filter residues into an oven after washing, and drying the filter residues at the temperature of 80 ℃ for 12h to obtain a modified powder product.
Synthesis of modified phenolic resin prepolymer: mixing the phenolic resin oligomer and the modified powder according to the mass ratio of 17:1, preserving heat for 15min at 40 ℃, and then adding methanol for dissolution to prepare the modified phenolic resin prepolymer with the mass fraction of 50%.
Preparation of the supporting layer: placing the non-woven fabric into a modified phenolic prepolymer, and impregnating to obtain a prepreg; and laminating and hot-pressing four phenolic prepregs, and curing to form a whole to obtain the support layer.
Preparation of a sealing plate for a capacitor: and overlapping the supporting layer and ethylene propylene rubber, and performing hot pressing treatment to obtain the sealing plate for the capacitor.
Example 2
This example is for explaining the preparation method of the sealing plate for a capacitor disclosed in the present invention, including most of the operations in example 1, which is different in that:
In the synthesis operation of the modified phenolic resin prepolymer: mixing phenolic resin oligomer and modified powder according to a mass ratio of 10:1.
Example 3
This example is for explaining the preparation method of the sealing plate for a capacitor disclosed in the present invention, including most of the operations in example 1, which is different in that:
In the synthesis operation of the modified phenolic resin prepolymer: mixing phenolic resin oligomer and modified powder according to a mass ratio of 5:1.
Example 4
This example is for explaining the preparation method of the sealing plate for a capacitor disclosed in the present invention, including most of the operations in example 1, which is different in that:
in the preparation operation of the modified powder: silicon dioxide is adopted to replace aluminum hydroxide.
Example 5
This example is for explaining the preparation method of the sealing plate for a capacitor disclosed in the present invention, including most of the operations in example 1, which is different in that:
in the preparation operation of the modified powder: 1, 5-diazabicyclo [4.3.0] non-5-ene was used in place of 1, 8-diazabicyclo [5.4.0] undec-7-ene.
Comparative example 1
This comparative example is a comparative illustration of the method of manufacturing a sealing plate for a capacitor disclosed in the present invention, including most of the operations in example 1, except that:
the modification operation of aluminum hydroxide is not performed;
in the synthesis operation of the modified phenolic resin prepolymer: the unmodified aluminum hydroxide is adopted to replace the modified powder for mixing.
Performance testing
The sealing plate for the capacitor prepared by the method or the components thereof are subjected to the following performance tests:
Flame retardant performance test: the oxygen index of the seal plate supporting layer was tested by a test method prescribed in chinese standard GB/T2406.
Notched impact strength test: the notch impact strength of the supporting layer of the sealing plate is tested by adopting a test method specified in Chinese standard GB/T18743.1.
And (3) adhesive strength test: the bonding strength of the sealing plate supporting layer and the sealing layer is tested by adopting a test method specified in Chinese standard GB/T2790.
The test results obtained are filled in Table 1:
as can be seen from the test results in Table 1, the sealing plate obtained by the preparation method provided by the invention has good flame retardant property, and meanwhile, the sealing layer and the supporting layer of the plate have higher adhesiveness.
From the test results of examples 1,2 and 3, it can be seen that the flame retardant property of the sealing plate gradually increases as the addition amount of the modified powder in the phenolic resin oligomer increases, but the addition of excessive amount causes serious deterioration of the notched impact strength of the product.
As can be seen from the test results of example 1 and comparative example 1, the compatibility between the inorganic powder and the phenolic resin is poor, so that the notch impact strength of the product and the adhesiveness between the supporting layer and the sealing layer are not satisfied, and the above properties are obviously improved after the powder is modified, so that the above modification process is necessary.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. A sealing plate for a capacitor, comprising a sealing layer made of an elastic material and a supporting layer laminated on the sealing layer, wherein the supporting layer comprises a composite material of a base material and a modified phenolic resin;
The elastic material is at least one selected from butyl rubber, butadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, fluororubber, silicone rubber and chloroprene rubber;
The substrate is at least one selected from kraft paper, non-woven fabric, glass fiber cloth or cotton paper;
The modified phenolic resin comprises phenolic resin and modified powder, wherein the modified powder is selected from inorganic particles modified by a modifier, the modifier is selected from at least one of 1, 8-diazabicyclo [5.4.0] undec-7-ene and 1, 5-diazabicyclo [4.3.0] non-5-ene, and the inorganic particles are selected from inorganic particles with flame retardant effect.
2. The sealing plate for a capacitor as claimed in claim 1, wherein the modified phenolic resin is prepared by:
Mixing water, inorganic particles and a modifier, fully stirring, filling the mixture into an autoclave with a polytetrafluoroethylene lining, reacting for 72-168 hours at the temperature of 140-180 ℃, filtering, cleaning and drying to obtain modified powder;
Mixing the modified powder with a phenolic resin oligomer to obtain a modified phenolic resin prepolymer;
and curing the modified phenolic resin prepolymer to obtain the modified phenolic resin.
3. The sealing plate for a capacitor as claimed in claim 2, wherein the inorganic particles comprise one or more of aluminum hydroxide and silica.
4. The sealing plate for a capacitor as claimed in claim 2, wherein the particle diameter of the inorganic particles is 10nm to 600nm.
5. The sealing plate for a capacitor according to claim 2, wherein the mass ratio of the inorganic particles to the modifier is 1: (10-20); the added mass of the water is 0.5-3% of the total mass of the inorganic particles and the modifier.
6. The sealing plate for a capacitor according to claim 2, wherein after the modified powder is added, the reaction system is kept at 30 ℃ to 50 ℃ for 10 to 20 minutes.
7. The sealing plate for a capacitor according to claim 2, wherein a mass ratio of the modified powder to the phenolic resin oligomer is 1: (10-20); the added mass of the water is 0.5-3% of the total mass of the inorganic particles and the modifier.
8. The sealing plate for a capacitor as claimed in claim 2, wherein the phenolic resin oligomer is prepared by:
Mixing phenolic substances and aldehyde substances in a molar ratio of 1 (1.1-1.9), adding alkali to adjust the pH value to 8-10, heating to 85-95 ℃, and preserving heat for 60-80 min under normal pressure; and (3) after the reaction is finished, decompressing and dehydrating, and controlling the viscosity of the resin to be 100-180 mpa.s to obtain the phenolic resin oligomer.
9. The gasket for a capacitor according to claim 8, wherein the phenol substance comprises one or more of phenol, cresols, ethylphenols, butylphenols, para-alkylphenols, halophenols, monophenols substitutes and polyphenols; the aldehyde substance comprises one or more of formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde and polyoxymethylene.
10. A capacitor comprising the sealing plate for a capacitor according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410332939.1A CN117922122B (en) | 2024-03-22 | Sealing plate for capacitor and capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410332939.1A CN117922122B (en) | 2024-03-22 | Sealing plate for capacitor and capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117922122A true CN117922122A (en) | 2024-04-26 |
| CN117922122B CN117922122B (en) | 2024-06-21 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1054736A (en) * | 1991-04-09 | 1991-09-25 | 陈元寿 | Refractory low-chlorine-radical layered board and production method thereof |
| JPH08109311A (en) * | 1994-10-13 | 1996-04-30 | Sumitomo Bakelite Co Ltd | Resin composition for semiconductor sealing |
| CN110139901A (en) * | 2016-12-28 | 2019-08-16 | 纳美仕有限公司 | Surface treated silica filler and resin combination containing surface treated silica filler |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1054736A (en) * | 1991-04-09 | 1991-09-25 | 陈元寿 | Refractory low-chlorine-radical layered board and production method thereof |
| JPH08109311A (en) * | 1994-10-13 | 1996-04-30 | Sumitomo Bakelite Co Ltd | Resin composition for semiconductor sealing |
| CN110139901A (en) * | 2016-12-28 | 2019-08-16 | 纳美仕有限公司 | Surface treated silica filler and resin combination containing surface treated silica filler |
Non-Patent Citations (1)
| Title |
|---|
| 段予忠等编著: "塑料母料生产及应用技术", 31 August 1999, 中国轻工业出版社, pages: 108 - 109 * |
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