CN117920685A - A remove gluey equipment for brilliant support - Google Patents
A remove gluey equipment for brilliant support Download PDFInfo
- Publication number
- CN117920685A CN117920685A CN202410332259.XA CN202410332259A CN117920685A CN 117920685 A CN117920685 A CN 117920685A CN 202410332259 A CN202410332259 A CN 202410332259A CN 117920685 A CN117920685 A CN 117920685A
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- CN
- China
- Prior art keywords
- glue
- laser
- support
- crystal
- crystal support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003292 glue Substances 0.000 claims abstract description 203
- 239000013078 crystal Substances 0.000 claims abstract description 146
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 13
- 229920000715 Mucilage Polymers 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the field of silicon wafer production, and particularly provides a photoresist removing device for a wafer support. A remove gluey equipment for brilliant support includes bearing device, shovel glues device and laser and removes mucilage binding and put, and bearing device is used for bearing the brilliant support, and shovel glues the device and establishes on bearing device for the incomplete glue on the support is removed to the shovel, and laser removes mucilage binding and put and establish on shovel gluey device or bearing device, is used for removing the gluey to brilliant support laser. According to the glue removing device for the crystal support, the glue residues on the crystal support are removed through the cooperation of the glue shoveling device and the laser glue removing device, the frequency of reciprocating glue shoveling is reduced, even the reciprocating glue shoveling is not needed, the efficiency and the glue removing effect of the glue removing device are improved, the laser glue removing device and the glue shoveling device are arranged on the supporting device, and are not needed to be arranged independently, so that the glue removing device is simple in structure and small in size, the laser glue removing device cannot cause the temperature of the crystal support to be too high, the crystal support is not needed to be cooled after glue removal, the efficiency of the glue removing device is further improved, water resources are not consumed in the glue removing process, and the crystal support is environment-friendly.
Description
Technical Field
The invention relates to the field of silicon wafer production, in particular to a photoresist removing device for a crystal support.
Background
The silicon chip is formed by cutting the crystal bar through the slicing machine, the crystal bar is required to be adhered to the crystal support in the cutting process, the silicon chip is taken down from the crystal support after being cut, and the residual glue on the crystal support is removed, so that the crystal support can be reused. In the related art, the residual glue on the crystal support is shoveled down through the glue shoveling machine, and the glue removal effect of the glue shoveling machine is poor, so that a steam box is further arranged in front of the glue shoveling machine, the residual glue is melted through the steam box, and then the glue shoveling is carried out, so that the glue removal effect is improved. But set up the steam ager and can make the holistic structural complexity and the structure volume promotion of gumming equipment to still need to cool down to the brilliant support after the shovel glues, the steam ager needs to consume a large amount of water resource simultaneously.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent. Therefore, the invention provides the glue removing equipment for the crystal support, which has the advantages of simple structure, small volume, no consumption of water resources and high glue removing efficiency.
The invention relates to a photoresist removing device for a crystal support, which comprises:
The bearing device is used for bearing the crystal support;
The glue shoveling device is arranged on the supporting device and used for shoveling residual glue on the crystal support;
the laser glue removing device is arranged on the glue shoveling device or the supporting device and is used for removing glue from the crystal support laser.
Further, the laser gumming device can move along a first direction relative to the bearing device, laser emitted by the laser gumming device covers the crystal support along a second direction, and the second direction is orthogonal to the first direction.
Further, the laser gumming device comprises a laser emitter and a first sensor, wherein the first sensor is electrically connected with the laser emitter, and the first sensor is used for detecting the crystal support and controlling the opening and closing of the laser emitter.
Further, the glue shoveling device can move along a first direction relative to the bearing device, the glue shoveling device covers the crystal support along a second direction, and the second direction is orthogonal to the first direction.
Further, the glue removing device for the crystal support further comprises a support, the support is arranged on the supporting device and can move along the first direction relative to the supporting device, the support is provided with the glue shoveling device and the laser glue removing device, and the glue shoveling device is located at the front end of the laser glue removing device along the moving direction of the support in the glue removing process.
Further, the shoveling device includes:
The mounting seat is arranged on the bracket and can move along the vertical direction relative to the bracket;
the shovel is hinged with the mounting seat and can rotate around the second direction relative to the mounting seat, and the size of the shovel along the second direction covers the crystal support;
The first driving piece extends along the vertical direction and is arranged on the bracket, and the first driving piece is connected with the mounting seat so as to drive the mounting seat to move along the vertical direction;
the second driving piece extends along the first direction and is arranged on the bracket or the mounting seat, and the second driving piece is connected with the shovel so as to drive the shovel to rotate around the second direction.
Further, the shovel is provided with a first shovel blade and a second shovel blade, the sizes of the first shovel blade and the second shovel blade along the second direction cover the crystal support, the first shovel blade and the second shovel blade are distributed at intervals along the first direction in a horizontal projection plane, one of the first shovel blade and the second shovel blade, which is positioned at the front side, is higher than the other of the first shovel blade and the second shovel blade, which is positioned at the rear side, in the moving direction of the shovel in the photoresist removing process, and the second driving piece is used for adjusting the distance between the first shovel blade and the second shovel blade in a vertical projection plane.
Further, the support device comprises:
the base is provided with the glue shoveling device and the laser glue removing device;
The conveying line is arranged on the base and used for bearing the crystal support and driving the crystal support to move along a first direction;
And the stop assembly is at least partially movable relative to the conveying line in a vertical direction so as to stop and release the crystal support on the conveying line.
Further, the supporting device further comprises a jacking component, the jacking component is located at the rear end of the stopping component along the conveying direction of the conveying line, and at least part of the jacking component can move in the vertical direction relative to the conveying line so as to be used for jacking the crystal support.
Further, the jacking assembly comprises a jacking piece, the jacking piece can move along the vertical direction relative to the conveying line, the jacking piece is provided with at least two abutting portions, the two abutting portions are arranged at intervals along the first direction, each abutting portion is provided with a first limiting portion and a second limiting portion, the first limiting portions are used for being arranged on one side of the crystal support corresponding to the first direction so as to limit the position of the crystal support relative to the jacking piece in the first direction, the second limiting portions are used for being arranged in open grooves in the bottom surface of the crystal support so as to limit the position of the crystal support relative to the jacking piece in the second direction, and the second direction is orthogonal to the first direction.
According to the glue removing equipment for the crystal support, the glue shoveling device and the laser glue removing device are matched to remove residual glue on the crystal support, the frequency of reciprocating glue shoveling of the glue shoveling device is reduced, even the reciprocating glue shoveling of the glue shoveling device is not needed, the efficiency of the glue removing equipment is improved, the glue removing effect is good, the laser glue removing device and the glue shoveling device are arranged on the supporting device, independent arrangement is not needed, the glue removing equipment is simple in structure and small in size, the laser glue removing device cannot cause overhigh temperature of the crystal support, therefore the crystal support is not needed to be cooled after glue removal, the efficiency of the glue removing equipment is further improved, water resources are not consumed in the glue removing process, and the glue removing equipment is environment-friendly.
Drawings
FIG. 1 is a schematic diagram of a photoresist remover for a wafer carrier according to an embodiment of the present invention;
FIG. 2 is a schematic view of a part of a photoresist remover for a wafer carrier according to an embodiment of the present invention;
FIG. 3 is a schematic view of a portion of the shoveling apparatus and bracket of FIG. 2;
FIG. 4 is a schematic view of the jacking assembly of FIG. 2;
FIG. 5 is a schematic diagram of a crystal holder according to an embodiment of the invention.
Reference numerals:
1. A support device; 11. a base; 12. a conveying line; 13. a stop assembly; 14. a jacking assembly; 141. a jacking member; 1411. an abutting portion; 1412. a first limit part; 1413. a second limit part; 142. a third driving member; 143. a base; 2. a glue shoveling device; 21. a mounting base; 22. a spade; 221. a first blade; 222. a second blade; 23. a first driving member; 24. a second driving member; 25. a buffer assembly; 3. a laser glue removing device; 4. a bracket; 5. a linear module; 6. a frame; 7. an alarm lamp; 8. a control screen; 9. a crystal support; 91. an open slot.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
A photoresist removing apparatus for a wafer tray according to an embodiment of the present invention is described below with reference to fig. 1 to 5.
As shown in fig. 1 to 5, the photoresist removing device for a crystal support according to an embodiment of the present invention includes a supporting device 1, a photoresist shoveling device 2, and a laser photoresist removing device 3.
The supporting device 1 is used for carrying a crystal support 9. The glue shoveling device 2 is arranged on the supporting device 1 and is used for shoveling residual glue on the crystal support 9. The laser glue removing device 3 is arranged on the glue shoveling device 2 or the supporting device 1 and is used for removing glue from the crystal support 9 by laser.
As shown in fig. 1 and 2, the supporting device 1 is used for bearing the crystal support 9, the glue shoveling device 2 and the laser glue removing device 3 are both arranged on the supporting device 1, the glue shoveling device 2 is used for shoveling residual glue on the crystal support 9, and the laser glue removing device 3 is used for laser glue removing on the crystal support 9.
According to the glue removing equipment for the crystal support, the glue shoveling device and the laser glue removing device are matched to remove residual glue on the crystal support, the frequency of reciprocating glue shoveling of the glue shoveling device is reduced, even the reciprocating glue shoveling of the glue shoveling device is not needed, the efficiency of the glue removing equipment is improved, a good glue removing effect is achieved, the laser glue removing device and the glue shoveling device are arranged on the supporting device, independent arrangement is not needed, the glue removing equipment is simple in structure and small in size, the laser glue removing device cannot cause the temperature of the crystal support to be too high, the crystal support is not required to be cooled after glue removal, the efficiency of the glue removing equipment is further improved, water resources are not consumed in the glue removing process, and the glue removing equipment is environment-friendly.
In some embodiments, the laser glue removing device 3 can move along a first direction (front-back direction as shown in fig. 1) relative to the supporting device 1, and the laser light emitted by the laser glue removing device 3 covers the crystal support 9 along a second direction (left-right direction as shown in fig. 1), and the second direction is orthogonal to the first direction.
As shown in fig. 2, the laser glue removing device 3 is disposed on the supporting device 1 and can move along the front-back direction relative to the supporting device 1, so that the moving path of the laser emitted by the laser glue removing device 3 along the front-back direction can cover the top surface of the crystal support 9, meanwhile, the laser emitted by the laser glue removing device 3 covers the crystal support 9 along the left-right direction, specifically, the laser emitted by the laser glue removing device 3 can be a bar shape extending along the left-right direction, the dimension of the bar laser along the left-right direction is greater than or equal to the dimension of the top surface of the crystal support 9 along the left-right direction, the laser emitted by the laser glue removing device 3 can also point the laser, the point laser moves along the left-right direction, and the moving path of the point laser along the left-right direction covers the dimension of the top surface of the crystal support 9 along the left-right direction.
It will be appreciated that the laser glue removal device is not limited to laser glue removal on the top surface of the crystal support, and in other embodiments, the laser glue removal device can also perform laser glue removal on the front and rear end surfaces of the crystal support in the process of moving along the front and rear directions, and meanwhile, the parts of the laser glue removal device are positioned on the left and right sides of the crystal support so as to perform laser glue removal on the left and right end surfaces of the crystal support.
In some embodiments, the glue shoveling device 2 is movable relative to the support device 1 in a first direction, the glue shoveling device 2 covering the wafer support 9 in a second direction, the second direction being orthogonal to the first direction.
As shown in fig. 2, the glue shoveling device 2 is disposed on the supporting device 1 and can move along the front-back direction relative to the supporting device 1, and the glue shoveling device 2 covers the crystal support 9 along the left-right direction, so that the glue shoveling area formed by the movement of the glue shoveling device 2 along the front-back direction can cover the top surface of the crystal support 9, and therefore residual glue on the top surface of the crystal support 9 can be shoveled out by the glue shoveling device 2.
It will be appreciated that the glue shoveling device is not limited to shoveling the top surface of the crystal support, and in other embodiments, the glue shoveling device can shoveling the front and rear end surfaces of the crystal support through movement in the vertical direction in the process of movement in the front and rear directions, and meanwhile, parts of the glue shoveling device are located on the left and right sides of the crystal support so as to shovel the left and right end surfaces of the crystal support.
In some embodiments, the photoresist removing apparatus for a crystal support according to the embodiments of the present invention further includes a support 4, where the support 4 is disposed on the supporting device 1 and is movable along a first direction relative to the supporting device 1, the support 4 is provided with a photoresist shoveling device 2 and a laser photoresist removing device 3, and the photoresist shoveling device 2 is located at a front end of the laser photoresist removing device 3 along a moving direction of the support 4 in a photoresist removing process.
As shown in fig. 2, the supporting device 1 extends along the front-back direction, the upper end of the supporting device 1 is provided with a bracket 4, the bracket 4 can move along the front-back direction relative to the supporting device 1, preferably, the upper end of the supporting device 1 is provided with two linear modules 5, the two linear modules 5 are arranged at intervals along the left-right direction, each linear module 5 extends along the front-back direction, the crystal support 9 is arranged between the two linear modules 5, and the bracket 4 is arranged on the two linear modules 5 and moves along the front-back direction under the synchronous driving of the two linear modules 5.
The vertical setting of support 4 and along controlling the direction and extending a section distance, the front end of support 4 is equipped with shovel mucilage binding and put 2, the rear end of support 4 is equipped with laser and removes mucilage binding and put 3, remove the in-process of gluing, support 4 is held in the palm 9 from the back to the front for the brilliant top that holds in the palm 9 to pass through, shovel mucilage binding put 2 at first with the incomplete gum on holding in the palm 9 to with the most of incomplete gum is shoveled, then laser that laser removes mucilage binding put 3 sent contacts the incomplete gum of shovel surplus little portion, with carry out laser to the incomplete gum of surplus little portion and remove the gum.
It should be noted that, according to the material difference of the residual glue on the crystal support 9, the light wave, the power and the frequency of the laser emitted by the laser glue removing device 3 are different, and according to the glue amount of the residual glue after the glue is shoveled on the crystal support 9, the laser glue removing device 3 can volatilize all the residual glue after the glue is shoveled on the crystal support 9, and can only melt the residual glue after the glue is shoveled on the crystal support 9, when the laser glue removing device 3 melts the residual glue, a purging device or a wiping device is also required to be arranged at the downstream of the bracket 4 so as to remove the melted residual glue in a gas purging or wiping mode.
It will be appreciated that the shoveling device and the laser glue removal device are not limited to being movable in a front-to-back direction relative to the support device, and in other embodiments, the shoveling device and the laser glue removal device are fixedly arranged on the support device, and the crystal support is pushed by the pushing device to move in the front-to-back direction on the support device and pass under the shoveling device and the laser glue removal device in the moving process.
In some embodiments, the laser glue removing device 3 comprises a laser emitter and a first sensor, wherein the first sensor is electrically connected with the laser emitter, and the first sensor is used for detecting the crystal support 9 and controlling the start and stop of the laser emitter.
As shown in fig. 2, the laser emitter and the first sensor are all disposed at the rear end of the support 4, the first sensor is electrically connected with the laser emitter, preferably, the laser emitter and the first sensor are arranged at intervals along the left-right direction, in the process that the laser gumming device 3 moves along the front-back direction, the first sensor is used for detecting whether the first sensor and the lower part of the laser emitter have a crystal support 9 or not, and sending an opening signal when the crystal support 9 is detected, so that the laser emitter is opened, and laser is sent to perform laser gumming, and the first sensor sends a closing signal when the crystal support is not detected, so that the laser emitter is closed.
In some embodiments, the glue shoveling device 2 includes a mount 21, a shovel 22, a first drive 23, and a second drive 24. The mount 21 is provided on the bracket 4 and is movable in a vertical direction with respect to the bracket 4. The shovel 22 is hinged to the mounting base 21 and is rotatable relative to the mounting base 21 about a second direction, and the dimension of the shovel 22 in the second direction covers the wafer carrier 9. The first driving member 23 extends in the vertical direction and is disposed on the bracket 4, and the first driving member 23 is connected to the mounting base 21 to drive the mounting base 21 to move in the vertical direction. The second driving member 24 extends along the first direction and is disposed on the bracket 4 or the mounting seat 21, and the second driving member 24 is connected to the shovel 22 to drive the shovel 22 to rotate around the second direction.
As shown in fig. 3, the front end of the bracket 4 is provided with a mounting seat 21, the mounting seat 21 is connected with the bracket 4 through a guide rail extending along the vertical direction, so that the mounting seat 21 can move along the vertical direction relative to the bracket 4, the upper end of the mounting seat 21 is provided with a first driving piece 23, the first driving piece 23 is arranged at the front end of the bracket 4, and the first driving piece 23 is preferably a telescopic cylinder so as to drive the mounting seat 21 to move along the vertical direction.
The lower end of the mounting seat 21 is provided with a shovel 22, the shovel 22 extends along the left-right direction, the size of the shovel in the left-right direction can cover the size of the crystal support 9 in the left-right direction, so that residual glue on the crystal support 9 is shoveled by the shovel 22, and the shovel 22 is preferably a shovel blade. The middle part of the shovel 22 is connected with the mounting seat 21 in a hinged manner capable of rotating around the left and right directions, and preferably, the left and right ends of the shovel 22 are respectively provided with a rotating shaft part extending along the left and right directions, and the rotating shaft part is connected with the mounting seat 21 so that the shovel 22 can rotate around the left and right directions relative to the mounting seat 21.
The second driving member 24 extends in the front-rear direction and is provided on the bracket 4, and the middle portion of the second driving member 24 is connected to the hinge of the bracket 4 rotatable in the left-right direction, one end of the second driving member 24 extends forward and passes through the bracket 4 and the mounting seat 21, and then is connected to the hinge of the top of the shovel 22 rotatable in the left-right direction, and the second driving member 24 is preferably a telescopic cylinder to drive the shovel 22 to rotate in the left-right direction relative to the mounting seat 21.
The mounting seat 21 and the shovel 22 are driven to move up and down through the telescopic action of the first driving piece 23 along the vertical direction so as to adjust the height position of the shovel 22 relative to the crystal support 9, so that the shovel 22 can shovel residual glue on the crystal support 9, the thickness and the shoveling amount of the residual glue can be adjusted through the shovel 22, and the inclination angle of the shovel 22 relative to the crystal support 9 is adjusted through the telescopic action of the second driving piece 24 along the front-back direction so as to adjust the shoveling effect of the shovel 22 and the resistance of the residual glue.
It will be appreciated that the connection of the second drive member, the bracket and the blade is not limited to the configuration shown in fig. 3, and in other embodiments, the second drive member is fixedly disposed on the bracket, and the second drive member is connected to the blade via a linkage.
Preferably, the first driving member 23 is connected with the mounting seat 21 through the buffer assemblies 25 extending along the vertical direction, the buffer assemblies 25 are multiple, the buffer assemblies 25 are distributed at intervals around the vertical direction, each buffer assembly 25 comprises a connecting plate, a guide rod and an elastic member, the connecting plate is horizontally arranged at the bottom of the first driving member 23, one end of the guide rod is fixedly connected with one of the connecting plate and the mounting seat 21, the other end of the guide rod is arranged on the other one of the connecting plate and the mounting seat 21 in a penetrating manner, the other one of the guide rod and the mounting seat 21 can slide along the vertical direction relative to the other one of the connecting plate and the mounting seat 21, the elastic member is connected between the connecting plate and the mounting seat 21, preferably, the elastic member is sleeved on the periphery of the guide rod, and the elastic member is preferably a spring. The buffer assembly 25 plays a role in buffering the shovel 22 when the first driving piece 23 drives the shovel 22 to move from top to bottom and contact with residual glue on the crystal support 9, so that the shovel 22 is attached to the end face of the crystal support 9 under the action of elastic damping pressure of the buffer assembly 25.
It will be appreciated that the structure of the cushioning assembly is not limited to that shown in fig. 3, and in other embodiments the cushioning assembly includes a spring telescoping rod.
In some embodiments, the shovel 22 has a first shovel blade 221 and a second shovel blade 222, the first shovel blade 221 and the second shovel blade 222 each cover the wafer support 9 along the second direction, the first shovel blade 221 and the second shovel blade 222 are arranged at intervals along the first direction in the horizontal projection plane, one of the first shovel blade 221 and the second shovel blade 222 located on the front side is higher than the other of the first shovel blade 221 and the second shovel blade 222 located on the rear side along the moving direction of the shovel 22 in the photoresist removing process, and the second driving piece 24 is used for adjusting the distance between the first shovel blade 221 and the second shovel blade 222 in the vertical projection plane.
As shown in fig. 3, the shovel 22 has a first shovel edge 221 and a second shovel edge 222 for shoveling the glue, the first shovel edge 221 and the second shovel edge 222 each extend in the left-right direction, and the size in the left-right direction can each cover the size of the wafer tray 9 in the left-right direction, and preferably the size in the left-right direction of the first shovel edge 221 and the second shovel edge 222 is the same. The projections of the first blade 221 and the second blade 222 in the horizontal projection plane are arranged at intervals in the front-rear direction and the projections in the vertical projection plane are arranged at intervals in the vertical direction, and preferably, the first blade 221 is located on the front upper side of the second blade 222, in other words, the distance between the first blade 221 and the crystal support 9 is greater than the distance between the second blade 222 and the crystal support 9, and the first blade 221 is first contacted with the residual glue on the crystal support 9 along the moving direction of the shovel 22 from rear to front.
The second driving member 24 drives the shovel 22 to rotate around the left-right direction to adjust the distance between the first shovel blade 221 and the second shovel blade 222 in the vertical projection plane, in other words, the second driving member 24 is used for adjusting the inclination angle of the first shovel blade 221 and the second shovel blade 222 relative to the top surface of the crystal support 9.
In the process of shoveling the glue by the shoveling tool 22, the first shoveling edge 221 is firstly contacted with the residual glue on the crystal support 9, and shovels a part of the residual glue on the crystal support 9, so that the residual glue on the crystal support 9 is thinned, then the second shoveling edge 222 is contacted with the residual glue on the crystal support 9 after the glue is shoveled by the first shoveling edge 221, and the residual glue on the crystal support 9 is continuously shoveled by the other part, the residual glue on the crystal support 9 is shoveled twice by the first shoveling edge 221 and the second shoveling edge 222, so that the resistance of the shoveling edge to the residual glue is reduced, the efficiency of shoveling the glue is improved, the service life of the shoveling tool 22 is prolonged, meanwhile, the residual glue on the crystal support 9 can be shoveled by the laser glue removing device 3 after the glue is shoveled twice by the first shoveling edge 221 and the second shoveling edge 222, the glue shoveling effect of the glue is ensured, and the laser glue removing device 3 is matched by the first shoveling edge 221 and the second shoveling edge 222, the glue removing device 3 is moved once, and the glue removing efficiency of the shoveling tool 22 can be avoided, and the glue removing device can be moved reciprocally, and the glue removing device is avoided.
The thickness of the residual glue can be removed by adjusting the first blade 221 and the second blade 222 by driving the shovel 22 to rotate around the left-right direction by the second driving member 24.
In some embodiments, the holding fixture 1 includes a base 11, a conveyor line 12, and a stop assembly 13. The base 11 is provided with a glue shoveling device 2 and a laser glue removing device 3. The conveying line 12 is disposed on the base 11, and is used for carrying the crystal support 9 and driving the crystal support 9 to move along the first direction. At least part of the stopping assembly 13 is movable in a vertical direction with respect to the conveyor line 12 to stop and release the wafer carrier 9 on the conveyor line 12.
As shown in fig. 2, the base 11 extends along the front-rear direction, and corresponding linear modules 5 are respectively arranged on the left and right sides of the base 11, so as to be used for bearing and driving the bracket 4 to move along the front-rear direction, thereby driving the glue shoveling device 2 and the laser glue removing device 3 to move along the front-rear direction.
The base 11 is provided with a conveying line 12 in the middle of the left-right direction, the conveying line 12 extends along the front-rear direction for bearing and driving the crystal support 9 to move along the front-rear direction, preferably, the conveying line 12 comprises a plurality of rollers which are arranged at intervals along the front-rear direction, extend along the left-right direction and are positioned between the two linear modules 5.
Wherein be equipped with backstop subassembly 13 between two roller, backstop subassembly 13 can follow vertical direction for base 11 and transfer chain 12 and remove to make the top of backstop subassembly 13 can be located transfer chain 12 top, thereby backstop crystal support 9 on the transfer chain 12, make shovel mucilage binding device 2 and laser remove mucilage binding device 3 can remove the glue to the crystal support 9 of being stopped, the top of backstop subassembly 13 removes to transfer chain 12 below after removing the glue, in order to release the crystal support 9 after removing the glue, make crystal support 9 remove to the next station under the drive of transfer chain 12.
Preferably, the supporting device 1 further includes a second sensor, the second sensor is disposed on the base 11 and located at the start end of the conveying line 12, the second sensor is electrically connected with the conveying line 12, the second sensor is used for detecting whether the start end of the conveying line 12 has the crystal support 9, and the second sensor sends out a start signal after detecting the crystal support 9, so that the conveying line 12 starts to operate and drives the crystal support 9 to move towards the stop component 13.
Preferably, before the conveyor line 12 starts to run, the top end of the stopping component 13 is located above the conveyor line 12, after the glued bundle is removed by the crystal support 9 of the stopping component 13, the stopping component 13 descends to release the crystal support 9 after glue removal, after the crystal support 9 after glue removal is driven to the next station by the conveyor line 12, the conveyor line 12 is stopped, and the stopping component 13 ascends to a position where the top end is located above the conveyor line 12.
Preferably, the stop assembly 13 comprises a stop block and a fourth driving member, and the fourth driving member is preferably a vertically arranged lifting cylinder, and the top of the fourth driving member is provided with the stop block so as to drive the stop block to move along the vertical direction to stop and release the crystal support 9.
It will be appreciated that the configuration of the stop assembly and conveyor line is not limited to that shown in fig. 2, and in other embodiments the conveyor line is a belt mechanism with the stop assembly being located on either side of the belt mechanism.
In some embodiments, the holding device 1 further comprises a jacking assembly 14, the jacking assembly 14 being located at the rear end of the stop assembly 13 in the conveying direction of the conveyor line 12, at least part of the jacking assembly 14 being movable in a vertical direction with respect to the conveyor line 12 for jacking the wafer carrier 9.
As shown in fig. 2, the supporting device 1 further includes a lifting assembly 14, the lifting assembly 14 is located at the rear end of the stopping assembly 13 along the conveying direction of the conveying line 12 for conveying the crystal support 9, preferably, the conveying line 12 conveys the crystal support 9 from back to front, the lifting assembly 14 is located at the rear end of the stopping assembly 13, at least part of the lifting assembly 14 can move vertically relative to the conveying line 12 to lift the crystal support 9 stopped by the stopping assembly 13 on the conveying line 12 upwards and separate from the conveying line 12, so that the glue shoveling device 2 and the laser glue removing device 3 are convenient for removing glue, and the crystal support 9 is lowered back onto the conveying line 12 after removing glue so as to be conveyed to the next station by the conveying line 12.
In some embodiments, the jacking assembly 14 includes a jacking member 141, where the jacking member 141 is movable in a vertical direction relative to the conveyor line 12, the jacking member 141 has at least two abutment portions 1411, where the two abutment portions 1411 are spaced apart along a first direction, each abutment portion 1411 has a first stop 1412 and a second stop 1413, the first stop 1412 is configured to be disposed on a corresponding side of the tray 9 in the first direction to define a position of the tray 9 relative to the jacking member 141 in the first direction, and the second stop 1413 is configured to be disposed within the open slot 91 in the bottom surface of the tray 9 to define a position of the tray 9 relative to the jacking member 141 in a second direction, the second direction being orthogonal to the first direction.
As shown in fig. 2and 4, the jacking assembly 14 includes a jacking member 141, the jacking member 141 extends in a front-rear direction, front and rear ends of the jacking member 141 are respectively provided with corresponding abutment portions 1411, the abutment portions 1411 extend in a vertical direction, and the jacking member 141 is movable in the vertical direction with respect to the conveying line 12, so that the abutment portions 1411 can move in the vertical direction between corresponding adjacent two rollers to move upward above the conveying line 12 and lift the crystal tray 9, and descend below the conveying line 12 and drop the crystal tray 9 back on the conveying line 12.
The top of the abutment 1411 is provided with a first stopper 1412 and a second stopper 1413, the first stopper 1412 extends in the left-right direction and is located at one end of the abutment 1411 away from the other abutment 1411, and the second stopper 1413 extends in the front-rear direction.
As shown in fig. 4 and 5, when the jacking members 141 jack the crystal support 9, the bottom of the crystal support 9 is located between the first limiting portions 1412 of the two jacking members 141, so that the positions of the crystal support 9 in the front-rear direction relative to the jacking members 141 are limited by the two first limiting portions 1412, the bottom of the crystal support 9 is provided with an open slot 91 extending in the front-rear direction and penetrating the crystal support 9, and the second limiting portions 1413 of the two jacking members 141 are embedded in the open slot 91, so that the positions of the crystal support 9 in the left-right direction relative to the jacking members 141 are limited by the two second limiting portions 1413, and therefore the crystal support 9 is ensured not to be displaced and rocked when being removed by the glue shoveling device 2 and the laser glue removing device 3, and is separated from the jacking members 141.
Preferably, the first limiting portion 1412 and the second limiting portion 1413 are both configured in a shape with a cross section decreasing from top to bottom, and the first limiting portion 1412 and the second limiting portion 1413 on the same abutting portion 1411 are arranged in a T shape.
Preferably, the jacking assembly 14 further comprises a base 143 and a third driving member 142, the base 143 is fixed in position relative to the base 11, the third driving member 142 is disposed on the base 143, the third driving member 142 is preferably a lifting cylinder extending along a vertical direction, and the jacking member 141 is disposed on top of the third driving member 142, so that the jacking member 141 is driven to move in a lifting manner by the third driving member 142.
It will be appreciated that the structure of the holding device is not limited to that shown in fig. 2, and in other embodiments, the holding device is a platform for carrying the wafer tray, and the wafer tray is taken and placed on the holding device by a mechanical arm.
In some embodiments, the photoresist removing apparatus for a crystal support of the embodiment of the present invention further includes a frame 6, an alarm lamp 7, and a control screen 8. As shown in fig. 1, the supporting device 1, the glue shoveling device 2, the laser glue removing device 3 and the bracket 4 are all located inside the frame 6, the base 11, the fourth driving piece of the stop component 13 and the base 143 of the jacking component 14 are all arranged on the frame 6, a controller is further arranged inside the frame 6, and the controller is electrically connected with the linear module 5, the first driving piece 23, the second driving piece 24, the third driving piece, the fourth driving piece, the first sensor, the second sensor and the laser transmitter to receive signals sent by the first sensor and the second sensor, and control the opening and closing of the linear module 5, the first driving piece 23, the second driving piece 24, the third driving piece, the fourth driving piece and the laser transmitter, and preferably, the moving speed of the linear module 5, the power of the laser transmitter and other information can be controlled.
The alarm lamp 7 is arranged on the stand 6 and is electrically connected with the controller, and when the controller finds abnormal operation, the alarm lamp 7 is triggered to send out an alarm signal.
The control screen 8 is provided on the housing 6 and electrically connected to the controller, and instructions and information are input through the control screen 8 to control the controller.
In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between and not for indicating or implying a relative importance or an implicit indication of the number of features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While the above embodiments have been shown and described, it should be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the invention.
Claims (10)
1. A remove gluey equipment for brilliant support, characterized by, include:
The supporting device (1) is used for bearing the crystal support (9);
The glue shoveling device (2) is arranged on the supporting device (1) and is used for shoveling residual glue on the crystal support (9);
the laser glue removing device (3), the laser glue removing device (3) is arranged on the glue shoveling device (2) or the supporting device (1) and is used for removing glue from the crystal support (9) by laser.
2. The gumming device for a crystal support according to claim 1, characterized in that the laser gumming device (3) is movable with respect to the support means (1) along a first direction, the laser emitted by the laser gumming device (3) covering the crystal support (9) along a second direction, which is orthogonal to the first direction.
3. The glue removal device for a crystal support according to claim 2, wherein the laser glue removal device (3) comprises a laser emitter and a first sensor, the first sensor is electrically connected with the laser emitter, and the first sensor is used for detecting the crystal support (9) and controlling the opening and closing of the laser emitter.
4. Glue removal device for a crystal support according to claim 1, characterized in that the glue shoveling device (2) is movable in a first direction with respect to the support device (1), the glue shoveling device (2) covering the crystal support (9) in a second direction, which is orthogonal to the first direction.
5. The glue removal device for a crystal support according to claim 2 or 4, further comprising a support (4), wherein the support (4) is arranged on the supporting device (1) and is movable relative to the supporting device (1) along the first direction, the support (4) is provided with the glue shoveling device (2) and the laser glue removal device (3), and the glue shoveling device (2) is positioned at the front end of the laser glue removal device (3) along the moving direction of the support (4) in the glue removal process.
6. The glue removal apparatus for a crystal tray according to claim 5, wherein the glue shoveling device (2) comprises:
the mounting seat (21) is arranged on the bracket (4) and can move along the vertical direction relative to the bracket (4);
The shovel (22) is hinged with the mounting seat (21) and can rotate around the second direction relative to the mounting seat (21), and the size of the shovel (22) along the second direction covers the crystal support (9);
the first driving piece (23), the first driving piece (23) extends along the vertical direction and is arranged on the bracket (4), and the first driving piece (23) is connected with the mounting seat (21) so as to drive the mounting seat (21) to move along the vertical direction;
The second driving piece (24) extends along the first direction and is arranged on the bracket (4) or the mounting seat (21), and the second driving piece (24) is connected with the shovel (22) so as to drive the shovel (22) to rotate around the second direction.
7. The gumming device for a crystal support according to claim 6, characterized in that the spade (22) has a first spade edge (221) and a second spade edge (222), the first spade edge (221) and the second spade edge (222) each cover the crystal support (9) in the dimension of the second direction, the first spade edge (221) and the second spade edge (222) are arranged at intervals along the first direction in a horizontal projection plane, one of the first spade edge (221) and the second spade edge (222) located at the front side is higher than the other of the first spade edge and the second spade edge (222) located at the rear side along the moving direction of the spade (22) during gumming, and the second driving member (24) is used for adjusting the distance of the first spade edge (221) and the second spade edge (222) in a vertical projection plane.
8. The de-gluing device for crystal trays according to claim 1, characterized in that the supporting means (1) comprise:
The base (11), the said base (11) has said shovel glue device (2) and said laser removes the mucilage binding to put (3);
The conveying line (12) is arranged on the base (11) and used for bearing the crystal support (9) and driving the crystal support (9) to move along a first direction;
-a stop assembly (13), at least part of the stop assembly (13) being movable in a vertical direction with respect to the conveyor line (12) to stop and release the wafer carrier (9) on the conveyor line (12).
9. The de-glue apparatus for a crystal tray according to claim 8, wherein the holding device (1) further comprises a jacking assembly (14), the jacking assembly (14) being located at the rear end of the stop assembly (13) in the conveying direction of the conveying line (12), at least part of the jacking assembly (14) being movable in a vertical direction with respect to the conveying line (12) for jacking the crystal tray (9).
10. The de-glue apparatus for a crystal tray according to claim 9, wherein the jacking assembly (14) comprises a jacking member (141), the jacking member (141) being movable in a vertical direction with respect to the conveyor line (12), the jacking member (141) having at least two abutment portions (1411), wherein the two abutment portions (1411) are arranged at intervals along the first direction, each abutment portion (1411) having a first limit portion (1412) and a second limit portion (1413), the first limit portion (1412) being for being provided on a respective side of the crystal tray (9) in the first direction to define a position of the crystal tray (9) in the first direction with respect to the jacking member (141), the second limit portion (1413) being for being provided within an open slot (91) in a bottom surface of the crystal tray (9) to define a position of the crystal tray (9) in a second direction with respect to the jacking member (141), the second direction being orthogonal to the first direction.
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| CN202410332259.XA CN117920685B (en) | 2024-03-22 | 2024-03-22 | A remove gluey equipment for brilliant support |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100007835U (en) * | 2009-01-29 | 2010-08-06 | 김성우 | scaling device for a cutting material |
| CN204448740U (en) * | 2015-01-04 | 2015-07-08 | 厦门安耐伟业新材料有限公司 | A kind of blade construction clearing up cull |
| CN205711940U (en) * | 2016-05-11 | 2016-11-23 | 山东汇强重工科技有限公司 | A kind of Deformable double-edge snow shovel |
| CN107217254A (en) * | 2017-05-24 | 2017-09-29 | 南京工程学院 | A kind of devices and methods therefor for improving laser equipment utilization ratio |
| CN209255126U (en) * | 2018-10-10 | 2019-08-16 | 江苏金迪木业股份有限公司 | A kind of simple type glue doctor kiss coater |
| CN211306988U (en) * | 2019-12-18 | 2020-08-21 | 青岛高测科技股份有限公司 | Automatic stick platform that glues of crystal silicon |
| CN112170385A (en) * | 2020-08-31 | 2021-01-05 | 江苏大学 | Laser cleaning device and method for sealing and glue removing of composite material hot-pressing tool |
| JP2021164963A (en) * | 2020-04-06 | 2021-10-14 | トヨタ自動車株式会社 | Blade structure of skiving cutter |
| CN216174535U (en) * | 2021-08-24 | 2022-04-05 | 银川隆基光伏科技有限公司 | Crystal support glue removing device and glue removing equipment |
| CN218691816U (en) * | 2022-11-21 | 2023-03-24 | 上海斌威酒店成套设备工程有限公司 | Angle modulation formula shovel rubber cutter |
| CN219850924U (en) * | 2023-04-27 | 2023-10-20 | 上海朴席自动化工程有限责任公司 | Glue shoveling machine device |
| CN117564905A (en) * | 2023-12-05 | 2024-02-20 | 东莞市鼎力自动化科技有限公司 | Automatic crystal support surface glue removing system |
-
2024
- 2024-03-22 CN CN202410332259.XA patent/CN117920685B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100007835U (en) * | 2009-01-29 | 2010-08-06 | 김성우 | scaling device for a cutting material |
| CN204448740U (en) * | 2015-01-04 | 2015-07-08 | 厦门安耐伟业新材料有限公司 | A kind of blade construction clearing up cull |
| CN205711940U (en) * | 2016-05-11 | 2016-11-23 | 山东汇强重工科技有限公司 | A kind of Deformable double-edge snow shovel |
| CN107217254A (en) * | 2017-05-24 | 2017-09-29 | 南京工程学院 | A kind of devices and methods therefor for improving laser equipment utilization ratio |
| CN209255126U (en) * | 2018-10-10 | 2019-08-16 | 江苏金迪木业股份有限公司 | A kind of simple type glue doctor kiss coater |
| CN211306988U (en) * | 2019-12-18 | 2020-08-21 | 青岛高测科技股份有限公司 | Automatic stick platform that glues of crystal silicon |
| JP2021164963A (en) * | 2020-04-06 | 2021-10-14 | トヨタ自動車株式会社 | Blade structure of skiving cutter |
| CN112170385A (en) * | 2020-08-31 | 2021-01-05 | 江苏大学 | Laser cleaning device and method for sealing and glue removing of composite material hot-pressing tool |
| CN216174535U (en) * | 2021-08-24 | 2022-04-05 | 银川隆基光伏科技有限公司 | Crystal support glue removing device and glue removing equipment |
| CN218691816U (en) * | 2022-11-21 | 2023-03-24 | 上海斌威酒店成套设备工程有限公司 | Angle modulation formula shovel rubber cutter |
| CN219850924U (en) * | 2023-04-27 | 2023-10-20 | 上海朴席自动化工程有限责任公司 | Glue shoveling machine device |
| CN117564905A (en) * | 2023-12-05 | 2024-02-20 | 东莞市鼎力自动化科技有限公司 | Automatic crystal support surface glue removing system |
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| CN117920685B (en) | 2024-07-16 |
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