CN117915618A - Immersion cooling system - Google Patents

Abstract

A soaking type cooling system comprises a pressure sealing box, an electronic module, a blower and a flow equalizing plate. The pressure seal box is adapted to contain a cooling liquid and is provided with a gas outlet on the top or side wall and a gas inlet on the bottom of the pressure seal box. The gas outlet is above the liquid surface of the cooling liquid and the gas inlet. The electronic module is arranged in a pressure seal box and immersed in the cooling liquid. The blower is in communication with the pressure seal box and is adapted to draw gas from the gas outlet and inject gas into the pressure seal box from the gas inlet. The flow equalizing plate is arranged in the pressure sealing box and is positioned between the electronic module and the gas inlet.

Description

Immersion cooling system

Technical Field

The present disclosure relates to immersion cooling systems, and more particularly, to an immersion cooling system with a flow equalization plate in a pressure sealed box.

Background

With the advancement of technology, electronic modules are becoming more and more popular. In particular, various communication devices such as a server device have become an integral part of daily life. These electronic modules generate a large amount of heat energy during operation, and immersion cooling systems are also currently provided for these electronic modules. However, the conventional immersion cooling system still has room for improvement in terms of both the use cost and the heat dissipation efficiency.

In some conventional immersion cooling systems, a high density of insulating cooling liquid is used and the cooling liquid is forced to flow within a pressure tight tank by a pumping device. However, the limited flow rate provided by the pump device and the excessive flow area required by the cooling liquid in the pressure seal box result in a relatively slow flow rate of the cooling liquid through the electronic module, and the insufficient fluidity of the cooling liquid due to the relatively high viscosity coefficient of the cooling liquid (e.g., about 10 to 40 times of water), so that the heat dissipation capability of the immersion cooling system to the electronic module is insufficient. However, if a high-speed or large-capacity pump device is used to enhance the fluidity of the cooling liquid, the cost increases, and the energy consumption increases, which makes it impossible to save energy.

Therefore, how to effectively consider the use cost and the heat dissipation efficiency and achieve the energy-saving effect for the immersion cooling system is an unprecedented issue.

Disclosure of Invention

Some embodiments of the present disclosure provide an immersion cooling system comprising: pressure seal box, electronic module, air-blower and flow equalizing board. The pressure seal box is adapted to contain a cooling liquid and is provided with a gas outlet on the top or side wall and a gas inlet on the bottom of the pressure seal box. The gas outlet is above the liquid surface of the cooling liquid and the gas inlet. The electronic module is arranged in a pressure seal box and immersed in the cooling liquid. The blower is in communication with the pressure seal box and is adapted to draw gas from the gas outlet and inject gas into the pressure seal box from the gas inlet. The flow equalizing plate is arranged in the pressure sealing box and is positioned between the electronic module and the gas inlet.

Drawings

The concepts of the embodiments of the disclosure may be better understood from the following detailed description when considered in conjunction with the accompanying drawings. It should be noted that the various features of the drawings are not necessarily drawn to scale in accordance with standard practices of the industry. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion. Like features are labeled with like numerals throughout the specification and drawings.

FIG. 1 illustrates a schematic diagram of an immersion cooling system according to some embodiments of the present disclosure;

FIG. 2 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure;

FIG. 3 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure.

Description of the reference numerals

100 Soaking type cooling system

110 Pressure seal box

111 Top surface

111A opening

111B cooling liquid supplementing port

112 Bottom part

113 Partition wall

110A, a first accommodation space

110B, a second accommodation space

115 Cooling liquid

115A liquid surface

115B vapor space

115S water level sensor

116 Sealing cover

117A Cooling liquid Outlet of pressure seal case

117B pressure seal box cooling liquid inlet

118 Liquid distributor

120 Electronic module

121 Top surface of electronic module

130 Pressure balance tube

140 Exhaust valve

150 Heat exchanger

160 Cooling liquid circulation loop

161 Heat exchanger cooling liquid inlet

162 Heat exchanger cooling liquid outlet

165 Pump

167 First flowmeter

170 Water circulation loop

171 Water inlet pipe

172 Outlet pipe

175 Cooling water source

177 Second flowmeter

181 First temperature sensor

182 Second temperature sensor

183 Third temperature sensor

184 Fourth temperature sensor

185 Fifth temperature sensor

186 Sixth temperature sensor

190 Controller

191 Gas outlet

192 Gas inlet

193 Blower

194 Gas

195 Flow equalizing plate

196 Arrow head

D1 first distance

D2 second distance

Detailed Description

The following describes an electronic device of an embodiment of the present disclosure. However, it will be readily appreciated that the disclosed embodiments provide many suitable authoring concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to use the disclosure and are not intended to limit the scope of the disclosure.

Moreover, relative terms such as "below" or "bottom" and "above" or "top" may be used in embodiments to describe one element's relative relationship to another element of the figures. It will be appreciated that if the device of the drawings is turned upside down, elements described as "below" would then be oriented "above" elements.

It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, materials, and/or sections, these elements, materials, and/or sections should not be limited by these terms, and these terms are used solely to distinguish between different elements, materials, and/or sections. Thus, a first element, material, and/or portion discussed below could be termed a second element, material, and/or portion without departing from the teachings of some embodiments of the present disclosure, and, unless specifically defined, the first or second element, material, and/or portion recited in the claims should be construed as any element, material, and/or portion in the specification without departing from the scope of the present disclosure.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be appreciated that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. Furthermore, the terms "substantially," "about," or "approximately" are also used herein to describe a substantially consistent and completely consistent condition or scope. It should be noted that unless otherwise defined, even if the above terms are not described in the description, they should be interpreted in the same sense as the terms in which the above abbreviations are described.

Referring initially to fig. 1, fig. 1 illustrates a schematic diagram of an immersion cooling system 100 according to some embodiments of the present disclosure. In some embodiments, the immersion cooling system 100 may be used, for example, in a server system, but the disclosure is not so limited. As shown in fig. 1, the immersion cooling system 100 may include: a pressure seal box 110, an electronic module 120, a pressure balance pipe 130, and an exhaust valve 140. In some embodiments, the pressure sealing case 110 may have a top surface 111, a bottom 112, and a partition wall 113, the partition wall 113 being vertically disposed on the bottom 112 within the pressure sealing case 110 such that the inside of the pressure sealing case 110 is divided into a first receiving space 110A and a second receiving space 110B. In some embodiments, the first accommodating space 110A is larger than the second accommodating space 110B, but the disclosure is not limited thereto.

The pressure containment tank 110 may be used to store a cooling liquid 115 and an electronic module 120. The cooling liquid 115 may be located in both the first and second receiving spaces 110A and 110B. For example, the cooling liquid 115 may include a fluorine-containing compound or other suitable polymer compound, but the disclosure is not limited thereto. The electronic module 120 may be disposed in the first accommodating space 110A and completely immersed in the cooling liquid 115. In this way, the heat energy generated during the operation of the electronic module 120 can be taken away by the flow of the cooling liquid 115, so that the electronic module 120 is maintained at a proper working temperature, and the risk of failure of the electronic module 120 due to overheating is reduced. For example, the electronic module 120 may include a plurality of electronic devices (e.g., server devices, not shown separately), but the disclosure is not limited thereto.

In some embodiments, the height of partition 113 is below liquid surface 115A and above electronic module top surface 121 of electronic module 120. In addition, the top surface 111 of the pressure sealing box 110 has an opening 111A, and the opening 111A is adjacent to the pressure balance tube 130 and can be in communication with the first accommodating space 110A. The electronic module 120 is placed into the pressure seal box 110 via the opening 111A. The immersion cooling system 100 further comprises a sealing cover 116 for sealing the opening 111A such that a vapor space 115B may be formed above the liquid surface 115A of the cooling liquid 115.

In some embodiments, there is a vapor space 115B within the pressure containment tank 110 above the liquid surface 115A of the cooling liquid 115. More specifically, when the electronic module 120 is operating, a portion of the cooling liquid 115 evaporates to generate vapor, and the vapor is located in the vapor space 115B. In this way, the saturated vapor pressure of the cooling liquid 115 will increase the air pressure value (e.g., the sum of one atmosphere and the saturated vapor pressure of the cooling liquid 115) in the pressure sealed box 110.

In order to reduce the risk of damage to the pressure seal box 110 due to an excessively high internal air pressure value, an air outlet valve 140 is provided in connection with the pressure seal box 110. The air pressure value in the pressure sealing box 110 can be maintained within an acceptable range by opening and closing the air outlet valve 140. In some embodiments, a pressure equalization tube 130 is provided and connected between the vent valve 140 and the pressure seal case 110. When the air pressure within the pressure containment vessel 110 exceeds a first air pressure value (e.g., about 103 kPa), the vent valve 140 automatically opens such that the vapor space 115B communicates with an environment external to the pressure containment vessel 110 along the pressure equalization pipe 130. In contrast, when the air pressure within the pressure containment vessel 110 is below a second air pressure value (e.g., about 101.5 kPa), the vent valve 140 automatically closes, isolating the vapor space 115B from the environment outside the pressure containment vessel 110. It should be appreciated that the first air pressure value may be greater than the second air pressure value, and that the air pressure within the pressure containment vessel 110 may be maintained between the first air pressure value and the second air pressure value by the design described above.

For example, the cooling liquid 115 used within the immersion cooling system 100 is a polymeric fluoride. Once the cooling liquid 115 evaporates into a gas, the vapor density of the cooling liquid 115 is about 10 to 25 times that of air. Thus, after the cooling liquid 115 forms vapor and mixes with air, the cooling liquid 115 vapor concentration may decrease with increasing height due to the difference in density of the cooling liquid 115 vapor and air. A pressure balance pipe 130 is provided between the upper side of the pressure sealing case 110 and the exhaust valve 140, and the height of the pressure balance pipe 130 can be designed according to the concentration distribution of the cooling liquid 115. In this way, once the exhaust valve 140 opens the exhaust gas (including air and the cooling liquid 115 vapor) to reduce the pressure in the pressure sealed box 110, the exhaust gas can be exhausted at a relatively high position by the arrangement of the pressure balance pipe 130, so that the cooling liquid 115 vapor is exhausted at a relatively low concentration. As described above, by providing the pressure balance pipe 130, the amount of vapor of the cooling liquid 115 escaping to the outside of the pressure seal box 110 via the exhaust valve 140 can be reduced, and the maintenance cost of the immersion cooling system 100 can be reduced.

In addition, the pressure seal box cooling liquid outlet 117A is provided at the bottom of the second accommodation space 110B, and spatially opposed to (e.g., facing) the partition wall 113. In some embodiments, the immersion cooling system 100 further includes a heat exchanger 150, the heat exchanger 150 including a cooling liquid circulation loop 160 and a water circulation loop 170. The cooling liquid circulation circuit 160 has a heat exchanger cooling liquid inlet 161 and a heat exchanger cooling liquid outlet 162. The heat exchanger cooling liquid inlet 161 may be connected to the pressure seal box cooling liquid outlet 117A to receive the cooling liquid 115 into the heat exchanger 150. The water circulation circuit 170 has a water inlet pipe 171 and a water outlet pipe 172, wherein the water inlet pipe 171 can be connected with a cooling water source 175 to receive cold water into the heat exchanger 150. In this way, the cooling liquid 115 and the cold water exchange heat in the heat exchanger 150 through the water circulation circuit 170 and the cooling liquid circulation circuit 160, so that the temperature of the cooling liquid 115 in the cooling liquid circulation circuit 160 is reduced. The heat exchanged cooling liquid 115 may leave the cooling liquid circulation circuit 160 through the heat exchanger cooling liquid outlet 162, and the heat exchanged water may leave the water circulation circuit 170 through the water outlet 172.

In some embodiments, a pump 165 is connected between the heat exchanger cooling liquid inlet 161 and the pressure seal box cooling liquid outlet 117A of the cooling liquid circulation loop 160. In some embodiments, the pump 165 outputs a motive force such that the cooling liquid 115 within the second receiving space 110B flows into the heat exchanger cooling liquid inlet 161 of the cooling liquid circulation circuit 160 via the pressure seal box cooling liquid outlet 117A. In addition, a liquid distributor 118 is provided connected to the heat exchanger cooling liquid outlet 162 of the cooling liquid circulation circuit 160 and is located between the bottoms of the electronic modules 120. After the cooling liquid 115 has completed heat exchange in the heat exchanger 150, the cooling liquid 115 in the cooling liquid circulation circuit 160 can flow into the liquid distributor 118 through the heat exchanger cooling liquid outlet 162 of the cooling liquid circulation circuit 160 and the pressure seal box cooling liquid inlet 117B (e.g. at the bottom 112) of the pressure seal box 110 by the power output from the pump 165. By the power output from the pump 165, the liquid dispenser 118 can uniformly dispense the cooling liquid 115 into the first accommodation space 110A and flow through the inside of the electronic module 120 (e.g., the surface of the plurality of electronic devices disposed therein).

In summary, the temperature of the cooling liquid 115 flowing through the electronic module 120 increases due to the absorption of the thermal energy from the electronic module 120. The effect of the warmed cooling liquid 115 cooling the electronic module 120 is reduced. At this time, the warmed cooling liquid 115 flows to the second accommodation space 110B across the partition wall 113 by the power output from the pump 165, and exchanges heat (cools) to the heat exchanger 150 via the pressure seal tank cooling liquid outlet 117A. The cooled cooling liquid 115 is then refilled into the pressure sealed tank 110 via the pressure sealed tank cooling liquid inlet 117B to the liquid distributor 118, thereby completing the circulation of the cooling liquid 115. In this way, the re-injected cooling liquid 115 may restore the effect of cooling the electronic module 120.

In some embodiments, a first flow meter 167 may be provided between the heat exchanger cooling liquid inlet 161 of the cooling liquid circulation loop 160 and the pump 165 to detect if the flow of the cooling liquid 115 is within an acceptable range. Similarly, a second flow meter 177 may be provided between the water inlet pipe 171 of the water circulation loop 170 and the cooling water source 175 to detect whether the flow rate of the cold water is within an acceptable range. The immersion cooling system 100 has a controller 190, and when the controller 190 detects that the flow of cooling liquid 115 and/or cold water exceeds a threshold, a warning signal is output to inform an operator to check whether each connection line is normal.

In some embodiments, the immersion cooling system 100 further comprises a first temperature sensor 181 disposed on top of the electronic module 120 adapted to sense a first temperature of the cooling liquid 115. In addition, the immersion cooling system 100 further comprises a second temperature sensor 182 disposed at the bottom of the electronic module 120 and adapted to sense a second temperature of the cooling liquid 115. The controller 190 of the immersion cooling system 100 may obtain a first temperature difference between the first temperature and the second temperature. Specifically, the first temperature difference may represent a temperature difference between before and after the cooling liquid 115 flows through the electronic module 120 (i.e., before and after the cooling liquid 115 exchanges heat with the electronic module 120). In some embodiments, when the controller 190 detects that the first temperature difference is less than or equal to a temperature threshold, the controller 190 reduces the power output by the pump 165. In this way, unnecessary circulation of the cooling liquid 115 may be reduced, thereby reducing the operating cost of the immersion cooling system 100.

In addition, the immersion cooling system 100 further comprises a third temperature sensor 183 arranged in a line between the heat exchanger cooling liquid outlet 162 connecting the cooling liquid circulation circuit 160 and the liquid distributor 118, adapted to sense a third temperature of the cooling liquid 115. The immersion cooling system 100 further comprises a fourth temperature sensor 184 arranged in a line between the heat exchanger cooling liquid inlet 161 connecting the cooling liquid circulation circuit 160 and the pump 165, adapted to sense a fourth temperature of the cooling liquid 115. As such, if the controller 190 cannot obtain the first temperature difference between the first temperature and the second temperature (e.g., the first temperature sensor 181 or the second temperature sensor 182 is damaged), the controller 190 may obtain the second temperature difference between the third temperature and the fourth temperature as an alternative. When the controller 190 detects that the second temperature difference is less than or equal to the above temperature threshold, the controller 190 reduces the power output by the pump 165. In this way, unnecessary circulation of the cooling liquid 115 may be reduced, thereby reducing the operating cost of the immersion cooling system 100.

In some embodiments, the infusion cooling system 100 further comprises a fifth temperature sensor 185 disposed in the water inlet tube 171 (i.e., between the heat exchanger 150 and the cooling water source 175) connected to the water circulation loop 170, adapted to sense a fifth temperature of the water. The immersion cooling system 100 further comprises a sixth temperature sensor 186 arranged at the outlet pipe 172 connected to the water circulation circuit 170 (i.e. between the heat exchanger 150 and the cooling water source 175) adapted to sense a sixth temperature of the water. If the controller 190 cannot obtain the first temperature difference and the second temperature difference, the controller 190 may obtain a third temperature difference between the fifth temperature and the sixth temperature as an alternative. When the controller detects that the third temperature difference is less than or equal to the above temperature threshold, the controller 190 reduces the power output by the pump 165. In this way, unnecessary circulation of the cooling liquid 115 may be reduced, thereby reducing the operating cost of the immersion cooling system 100.

In some embodiments, the immersion cooling system 100 further includes a water level sensor 115S for detecting the position of the liquid surface 115A of the cooling liquid 115. The controller 190 may detect whether the liquid surface is lower than the electronic module top surface 121 of the electronic module 120 through the water level sensor 115S. When the controller 190 detects that the liquid surface 115A is below the electronic module top surface 121 of the electronic module 120, the controller 190 outputs a warning signal to inform the operator to supplement the cooling liquid 115 to maintain the heat dissipation effect on the electronic module 120.

Further, in the present embodiment, the immersion cooling system 100 includes a blower 193, wherein the blower 193 communicates with the pressure seal case 110 through a gas outlet 191 at the top of the pressure seal case 110 and a gas inlet 192 at the bottom of the pressure seal case 110. Specifically, the blower 193 may extract gas from the gas outlet 191 and inject the extracted gas back into the pressure seal box 110 from the gas inlet 192. In addition, the immersion cooling system 100 also includes a flow equalization plate 195 disposed in the pressure sealed box 110, and the flow equalization plate 195 is located between the electronic module 120 and the gas inlet 192. In some embodiments, the flow equalization plate 195 is disposed parallel to the bottom surface of the pressure seal case 110, but the present disclosure is not limited thereto. In this way, a gas circulation can be formed in the pressure seal box 110. The flow of the gas from bottom to top can increase the fluidity (e.g., increase the flow rate) of the cooling liquid 115, thereby significantly improving the heat dissipation effect on the electronic module 120.

FIG. 2 illustrates a partial enlarged schematic view of the immersion cooling system 100 according to some embodiments of the present disclosure. It should be understood that only a partial structure of the pressure seal case 110 is shown in the present embodiment for the sake of brevity. One skilled in the art will be able to combine the structure of this embodiment with the pressure seal case 110 described in fig. 1 in light of this disclosure.

As shown in fig. 2, the blower 193 is located outside the pressure seal box 110, and the gas outlet 191 and the gas inlet 192 are located on different surfaces of the pressure seal box 110, respectively. In some embodiments, the gas outlet 191 is located on the sidewall of the pressure seal box 110 above the liquid surface 115A of the cooling liquid 115, and the gas inlet 192 is located on the bottom surface of the pressure seal box 110, but the disclosure is not limited thereto. In other embodiments, the gas outlet 191 and the gas inlet 192 may be located on other surfaces of the pressure seal box 110 or the same surface such that the gas 194 extracted by the blower 193 may pass through the flow equalization plate 195 to generate relatively uniform bubbles. In some embodiments, the flow equalization plate 195 includes a porous structure. For example, the flow equalization plate 195 may be made of zeolite, a uniform gas supply structure, or other suitable porous material, but the disclosure is not so limited.

In some embodiments, the blower 193 is disposed above the liquid surface 115A of the cooling liquid 115. In this way, it is ensured that the cooling liquid 115 does not flow into the blower 193, reducing the risk of damage to the blower 193. In some embodiments, the first distance D1 between the flow equalization plate 195 and the electronic module 120 may be less than the second distance D2 between the flow equalization plate 195 and the gas inlet 192, but the disclosure is not limited thereto. In other embodiments, the first distance D1 between the flow equalization plate 195 and the electronic module 120 may be greater than or equal to the second distance D2 between the flow equalization plate 195 and the gas inlet 192. In some embodiments, gas 194 is injected into pressure seal box 110 at a flow rate in the range of about 0.05m/s to about 0.5m/s (i.e., including 0.05m/s, 0.5m/s, and all values therebetween, such as 0.1m/s, 0.2m/s, etc.), although the disclosure is not limited thereto. With the above configuration, a gas circulation may be formed within the pressure seal box 110, wherein the flow of the gas 194 from bottom to top (e.g., as indicated by arrow 196) may increase the fluidity (e.g., increase the flow rate) of the cooling liquid 115, thereby significantly improving the heat dissipation effect for the electronic module 120.

FIG. 3 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure. Similarly, only a partial structure of the pressure seal case 110 is shown in the present embodiment for the sake of brevity. One skilled in the art will be able to combine the structure of this embodiment with the pressure seal case 110 described in fig. 1 in light of this disclosure.

As shown in fig. 3, the blower 193 is located inside the pressure sealing case 110, and the gas outlet 191 and the gas inlet 192 are located on different sides of the pressure sealing case 110, respectively, but the present disclosure is not limited thereto. In other embodiments, the gas outlet 191 and the gas inlet 192 may be located on other sides or the same side of the pressure seal box 110 such that the gas 194 extracted by the blower 193 may pass through the flow equalization plate 195 to create relatively uniform bubbles.

Likewise, the blower fan 193 is disposed higher than the liquid surface 115A of the cooling liquid 115, whereby it can be ensured that the cooling liquid 115 does not flow into the blower fan 193, reducing the risk of damage to the blower fan 193. In some embodiments, gas 194 is injected into pressure seal box 110 at a flow rate in the range of about 0.05m/s to about 0.5m/s (i.e., including 0.05m/s, 0.5m/s, and all values therebetween, such as 0.1m/s, 0.2m/s, etc.), although the disclosure is not limited thereto. As described above, a gas circulation may be formed within the pressure seal box 110, wherein the flow of the gas 194 from bottom to top (e.g., as indicated by arrow 196) may increase the fluidity (e.g., increase the flow rate) of the cooling liquid 115, thereby significantly improving the heat dissipation effect for the electronic module 120.

It should be understood that, although the above embodiments are exemplified by the cooling liquid for heat dissipation, the cooling liquid for cooling purposes can be similarly applied, and will not be described in detail.

In summary, the present disclosure provides a submerged cooling system with a flow equalizing plate in a pressure sealed box. Specifically, the blower may draw gas from the gas outlet and inject the drawn gas from the gas inlet back into the pressure seal box. The gas may pass through the flow equalization plates to create relatively uniform bubbles. In this way, a gas circulation can be formed in the pressure seal box, so that the fluidity (such as the flow rate) of the cooling liquid can be increased, and the heat dissipation effect on the electronic module can be remarkably improved.

While the embodiments and advantages of the present disclosure have been disclosed above, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the disclosure. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, unless a person skilled in the art would appreciate from the present disclosure that the processes, machines, manufacture, compositions of matter, means, methods and steps described in the present disclosure are capable of performing substantially the same function or obtaining substantially the same result as the embodiments described herein. Accordingly, the present disclosure is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains and which fall within the limits of the appended claims. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes combinations of the individual claims and embodiments.

Claims (10)

1. A soaking cooling system comprising:

A pressure seal box adapted to contain a cooling liquid, wherein a gas outlet is provided on a top or a side wall of the pressure seal box, and a gas inlet is provided on a bottom of the pressure seal box, wherein the gas outlet is higher than a liquid surface of the cooling liquid and the gas inlet;

An electronic module disposed in the pressure seal box and immersed in the cooling liquid;

A blower in communication with the pressure seal box adapted to draw gas from the gas outlet and inject the gas into the pressure seal box from the gas inlet; and

And the flow equalizing plate is arranged in the pressure sealing box and is positioned between the electronic module and the gas inlet.

2. The immersion cooling system of claim 1, wherein there is a vapor space within the pressure seal box above the liquid surface of the cooling liquid; and

Wherein the blower draws the gas within the vapor space via the gas outlet.

3. The immersion cooling system of claim 1, wherein the blower is disposed above the liquid surface of the cooling liquid.

4. The immersion cooling system according to claim 1, wherein the flow equalization plate is provided in parallel to a bottom surface of the pressure seal case.

5. The immersion cooling system of claim 1, wherein a first distance between the flow equalization plate and the electronic module is less than a second distance between the flow equalization plate and the gas inlet.

6. The immersion cooling system of claim 1, wherein the blower is located within the pressure seal box.

7. The immersion cooling system of claim 1, wherein the blower is located outside of the pressure seal box and the gas outlet and the gas inlet are located on different surfaces of the pressure seal box.

8. The immersion cooling system of claim 1, wherein said flow equalization plate comprises a uniform air supply structure.

9. The immersion cooling system according to claim 1, wherein the gas is injected into the pressure seal box at a flow rate, and the flow rate is in a range of 0.05m/s to 0.5 m/s.

10. The immersion cooling system of claim 1, further comprising:

A heat exchanger, which is communicated with the pressure sealing box, is suitable for receiving the cooling liquid from the pressure sealing box to exchange heat and injecting the cooling liquid after the heat exchange into the pressure sealing box;

and the pump is connected with the heat exchanger and the pressure sealing box and outputs power to push the cooling liquid.