CN117677142A - Immersion cooling system - Google Patents
Immersion cooling system Download PDFInfo
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- CN117677142A CN117677142A CN202211592098.5A CN202211592098A CN117677142A CN 117677142 A CN117677142 A CN 117677142A CN 202211592098 A CN202211592098 A CN 202211592098A CN 117677142 A CN117677142 A CN 117677142A
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- coolant
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- temperature
- cooling system
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- 238000001816 cooling Methods 0.000 title claims abstract description 60
- 238000007654 immersion Methods 0.000 title claims description 51
- 239000002826 coolant Substances 0.000 claims abstract description 147
- 239000007788 liquid Substances 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000005431 greenhouse gas Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A soak cooling system for a server system includes a pressure seal box, electronics, a pressure equalization tube, and an exhaust valve. The pressure seal tank is for storing a coolant, and has a vapor space located above a liquid surface of the coolant within the pressure seal tank. The electronic device is completely immersed in the coolant. The pressure balance pipe has a gas collection length, and the first port of pressure balance pipe sets up in the top surface of pressure seal box. The exhaust valve is arranged at a second port of the pressure balance pipe, and the second port is far away from the top surface of the pressure seal box relative to the first port. The gas collection length of the pressure equalization tube is such that the vaporized coolant concentration at the first port is greater than the vaporized coolant concentration at the second port.
Description
Technical Field
The present disclosure relates to immersion cooling systems, and more particularly, to immersion cooling systems with pressure equalization tubes.
Background
With the advancement of technology, electronic devices are becoming more and more popular. In particular, various communication devices such as a server device have become an integral part of daily life. These electronic devices generate a large amount of heat energy during operation, and immersion cooling systems are also currently provided for these electronic devices. However, the existing immersion cooling system still has room for improvement in terms of use cost and environmental efficiency.
In conventional immersion cooling systems, the electronics operate to evaporate the liquid coolant, causing the pressure in the tank of the immersion cooling system to rise and, in turn, forcing the pressure valve to open to relieve the pressure. At this time, a large amount of the gaseous coolant is released to the external environment. Generally, gaseous coolants are considered greenhouse gases, which are susceptible to environmental negative effects, such as: the release of large amounts of gaseous coolant may not meet GWP (Global Warming Potential) specifications. In addition, the large release of gaseous coolant tends to greatly slip down the inventory of coolant in the immersion cooling system, so more frequent dispatch personnel are required to fill the coolant, resulting in a significant increase in maintenance costs.
Therefore, it would be an unprecedented issue for an immersion cooling system how to effectively reduce the emissions of gaseous coolants.
Disclosure of Invention
Some embodiments of the present disclosure provide a soak cooling system for a server system, comprising: pressure seal box, electronic equipment, pressure balance pipe and discharge valve. The pressure seal tank is for storing a coolant, and has a vapor space located above a liquid surface of the coolant within the pressure seal tank. The electronic device is completely immersed in the coolant. The pressure balance pipe has a gas collection length, and the first port of pressure balance pipe sets up in the top surface of pressure seal box. The exhaust valve is arranged at a second port of the pressure balance pipe, and the second port is far away from the top surface of the pressure seal box relative to the first port. When the electronic device is operated, part of the coolant evaporates to raise the air pressure value in the pressure seal box. When the air pressure value in the pressure seal box exceeds the first air pressure value, the air outlet valve is automatically opened so that the vapor space is communicated with the environment outside the pressure seal box along the air collecting length of the pressure balance pipe. The gas collection length of the pressure equalization tube is such that the vaporized coolant concentration at the first port is greater than the vaporized coolant concentration at the second port.
Drawings
The concepts of the embodiments of the disclosure will be better understood from the following detailed description in conjunction with the accompanying drawings. It should be noted that the various features of the drawings are not necessarily drawn to scale in accordance with standard practices of the industry. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. Like features are labeled with like numerals throughout the specification and drawings.
FIG. 1 illustrates a schematic diagram of an immersion cooling system according to some embodiments of the present disclosure;
FIG. 2 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure;
FIG. 3 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure;
FIG. 4 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure;
fig. 5 illustrates a partial enlarged schematic view of an immersion cooling system according to some embodiments of the present disclosure.
Description of the reference numerals
100 soaking type cooling system
110 pressure seal box
111 top surface
111A opening
111B coolant replenishment port
112 bottom part
113 partition wall
110A, a first accommodation space
110B, a second accommodation space
115 coolant
115A liquid surface
115B vapor space
115S water level sensor
116 sealing cover
117A coolant outlet
117B coolant inlet
118 liquid distributor
120 electronic device
121 top surface
130 pressure balance tube
131 first port
132 second port
140 exhaust valve
150 heat exchanger
160 coolant circulation loop
161 inlet port
162 outlet port
165 pump
167 first flowmeter
170 water circulation loop
171 inlet
172 outlet port
175 water tower
177 second flowmeter
181 first temperature sensor
182 second temperature sensor
183 third temperature sensor
184 fourth temperature sensor
185 fifth temperature sensor
186 sixth temperature sensor
190 controller
230,330,430 pressure equalization tube
231,331,431 first port
232,332,432 second port
333 bending part
433 spiral part
Length of gas collection
W1 width
Theta angle
Detailed Description
The following describes an electronic device of an embodiment of the present disclosure. However, it will be readily appreciated that the disclosed embodiments provide many suitable authoring concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to use the disclosure and are not intended to limit the scope of the disclosure.
Moreover, relative terms such as "below" or "bottom" and "above" or "top" may be used in embodiments to describe one element's relative relationship to another element of the figures. It will be appreciated that if the device of the drawings is turned upside down, elements described as "below" would then be oriented "above" elements.
It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, materials, and/or sections, these elements, materials, and/or sections should not be limited by these terms, and these terms are used solely to distinguish between different elements, materials, and/or sections. Thus, a first element, material, and/or portion discussed below could be termed a second element, material, and/or portion without departing from the teachings of some embodiments of the present disclosure, and, unless specifically defined, the first or second element, material, and/or portion described in the claims should be construed as any element, material, and/or portion in the specification without departing from the teachings of some embodiments of the present disclosure.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be appreciated that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. Furthermore, the terms "substantially," "about," or "approximately" are also used herein to describe a substantially consistent and completely consistent condition or scope. It should be noted that unless otherwise defined, even if the above terms are not described in the description, they should be interpreted in the same sense as the terms in which the above abbreviations are described.
Referring initially to fig. 1, fig. 1 illustrates a schematic diagram of an immersion cooling system 100 according to some embodiments of the present disclosure. In some embodiments, the immersion cooling system 100 may be used, for example, in a server system, but the disclosure is not so limited. As shown in fig. 1, the immersion cooling system 100 may include: a pressure sealed box 110, electronics 120, a pressure equalization tube 130, and an exhaust valve 140. In some embodiments, the pressure sealing case 110 may have a top surface 111, a bottom 112, and a partition wall 113, the partition wall 113 being vertically disposed on the bottom 112 within the pressure sealing case 110 such that the inside of the pressure sealing case 110 is divided into a first receiving space 110A and a second receiving space 110B. In some embodiments, the first accommodating space 110A is larger than the second accommodating space 110B, but the disclosure is not limited thereto.
The pressure containment tank 110 may be used to store coolant 115 and electronics 120. The coolant 115 may be located in both the first and second receiving spaces 110A and 110B. For example, the coolant 115 may include a fluorine-containing compound or other suitable polymer compound, but the disclosure is not limited thereto. The electronic device 120 may be disposed in the first accommodating space 110A and completely immersed in the coolant 115. In this way, the heat energy generated during the operation of the electronic device 120 can be taken away by the flow of the coolant 115, so that the electronic device 120 is maintained at a proper operating temperature, and the probability of failure of the electronic device 120 due to overheating is reduced. For example, the electronic device 120 may include a plurality of electronic apparatuses (e.g., server apparatuses, not shown separately), but the disclosure is not limited thereto.
In some embodiments, the height of partition 113 is below liquid surface 115A and above top surface 121 of electronic device 120. In addition, the top surface 111 of the pressure sealing box 110 has an opening 111A, and the opening 111A is adjacent to the pressure balance tube 130 and can be in communication with the first accommodating space 110A. The electronic device 120 is placed in the pressure-tight box 110 via the opening 111A. The immersion cooling system 100 further includes a sealing cover 116 for sealing the opening 111A such that a vapor space 115B may be formed above the liquid surface 115A of the coolant 115.
In some embodiments, there is a vapor space 115B within the pressure seal box 110 above the liquid surface 115A of the coolant 115. More specifically, when the electronic device 120 is operating, a portion of the coolant 115 evaporates to generate vapor, and the vapor is located in the vapor space 115B. In this way, the saturated vapor pressure of the coolant 115 will increase the air pressure value (e.g., the sum of one atmosphere and the saturated vapor pressure of the coolant 115) in the pressure seal box 110.
In order to reduce the possibility of damage to the pressure seal box 110 due to an excessively high internal air pressure, an air release valve 140 is provided to connect the pressure seal box 110. The air pressure value in the pressure sealing box 110 can be maintained within an acceptable range by opening and closing the air outlet valve 140. In the present embodiment, a pressure balance pipe 130 is provided to be connected between the exhaust valve 140 and the pressure seal case 110. When the air pressure within the pressure containment vessel 110 exceeds a first air pressure value (e.g., about 103 kPa), the vent valve 140 automatically opens such that the vapor space 115B communicates with an environment external to the pressure containment vessel 110 along the pressure equalization pipe 130. In contrast, when the air pressure within the pressure containment vessel 110 is below a second air pressure value (e.g., about 101.5 kPa), the vent valve 140 automatically closes, isolating the vapor space 115B from the environment outside the pressure containment vessel 110. It should be appreciated that the first air pressure value may be greater than the second air pressure value, and that the air pressure within the pressure containment vessel 110 may be maintained between the first air pressure value and the second air pressure value by the design described above.
Generally, the coolant 115 used in the immersion cooling system 100 is a polymeric fluoride having a molecular weight ranging from about 250kg/kmole to about 700kg/kmole, much higher than the molecular weight of air (28.9 kg/kmole). As such, once the coolant 115 evaporates into a gas, the vapor density of the coolant 115 is about 10 to 25 times that of air. Thus, after the coolant 115 forms vapor and mixes with air, the concentration of the coolant 115 vapor may decrease as the height increases due to the difference in density of the coolant 115 vapor and air. A pressure balance pipe 130 is provided between the upper side of the pressure sealing case 110 and the exhaust valve 140, and the height of the pressure balance pipe 130 may be designed according to the concentration distribution of the coolant 115. In this way, once the exhaust valve 140 opens the exhaust gas (including air and the coolant 115 vapor) to reduce the pressure in the pressure seal box 110, the exhaust gas can be exhausted at a relatively high position by the arrangement of the pressure balance pipe 130, so that the coolant 115 vapor is exhausted at a relatively low concentration. Further description will be provided below with reference to fig. 2.
As described above, by providing the pressure balance pipe 130, the amount of vapor of the coolant 115 escaping to the outside of the pressure seal box 110 via the exhaust valve 140 can be reduced, and the maintenance cost of the immersion cooling system 100 can be reduced. Specifically, if the vapor of the coolant 115 is exhausted by the exhaust valve 140 with the air in the pressure seal case 110, the coolant 115 in the pressure seal case 110 needs to be frequently replenished (for example, the coolant 115 is replenished through the coolant replenishment port 111B located on the top surface 111 of the pressure seal case 110). In addition, since the existing coolant 115 components are generally regarded as greenhouse gases, reducing the vapor of the coolant 115 is also environmentally friendly.
In addition, the coolant outlet 117A is disposed at the bottom of the second accommodating space 110B and spatially opposite (e.g., toward) the partition wall 113. In some embodiments, the immersion cooling system 100 further includes a heat exchanger 150, the heat exchanger 150 including a coolant circulation loop 160 and a water circulation loop 170. The coolant circulation loop 160 has an inlet 161 and an outlet 162. The inlet 161 may be connected to the coolant outlet 117A to receive the coolant 115 into the heat exchanger 150. The water circulation loop 170 has an inlet 171 and an outlet 172, the inlet 171 being connectable to a water tower 175 for receiving cold water into the heat exchanger 150. In this way, the coolant 115 and the cold water exchange heat in the heat exchanger 150 through the water circulation circuit 170 and the coolant circulation circuit 160, so that the temperature of the coolant 115 in the coolant circulation circuit 160 is reduced. The heat exchanged coolant 115 may exit the coolant circulation loop 160 through an outlet 162 and the heat exchanged water exits the water circulation loop 170 through an outlet 172.
In some embodiments, a pump 165 is connected between the inlet 161 and the coolant outlet 117A of the coolant circulation loop 160. In some embodiments, the pump 165 outputs a power such that the coolant 115 in the second receiving space 110B flows into the inlet 161 of the coolant circulation loop 160 via the coolant outlet 117A. In addition, a liquid distributor 118 is provided to connect between the outlet 162 of the coolant circulation loop 160 and the bottom of the electronic device 120. After the coolant 115 has completed heat exchange in the heat exchanger 150, the coolant 115 in the coolant circulation loop 160 may be allowed to flow into the liquid distributor 118 via the outlet 162 of the coolant circulation loop 160 and the coolant inlet 117B (e.g., at the bottom 112) of the pressure seal tank 110 by the power output from the pump 165. By the power output from the pump 165, the liquid dispenser 118 can uniformly distribute the coolant 115 flowing into the first accommodation space 110A and flowing through the inside of the electronic apparatus 120 (e.g., the surfaces of the plurality of electronic devices disposed therein).
In summary, the temperature of the coolant 115 flowing through the electronic device 120 increases due to the absorption of the thermal energy from the electronic device 120. The effect of the warmed coolant 115 cooling the electronic device 120 may be reduced. At this time, the warmed coolant 115 flows to the second accommodation space 110B across the partition wall 113 by the power output from the pump 165, and exchanges heat (cools) to the heat exchanger 150 via the coolant outlet 117A. The cooled coolant 115 is then refilled into the pressure seal tank 110 via the coolant inlet 117B to the liquid distributor 118, completing the coolant 115 cycle. In this way, the re-injected coolant 115 may restore the effect of cooling the electronic device 120.
In some embodiments, a first flow meter 167 may be provided between the inlet 161 of the coolant circulation loop 160 and the pump 165 to detect whether the flow of the coolant 115 is within an acceptable range. Similarly, a second flow meter 177 may be provided between the inlet 171 of the water circulation loop 170 and the water tower 175 to detect if the flow of cold water is within an acceptable range. The immersion cooling system 100 has a controller 190, and when the controller 190 detects that the flow of coolant 115 and/or cold water exceeds a threshold, a warning signal is output to inform an operator to check whether each connection line is normal.
In some embodiments, the immersion cooling system 100 further includes a first temperature sensor 181 disposed on top of the electronic device 120 and adapted to sense a first temperature of the coolant 115. In addition, the immersion cooling system 100 further includes a second temperature sensor 182 disposed at the bottom of the electronic device 120 and adapted to sense a second temperature of the coolant 115. The controller 190 of the immersion cooling system 100 may obtain a first temperature difference between the first temperature and the second temperature. Specifically, the first temperature difference may represent a temperature difference of the coolant 115 before and after flowing through the electronic device 120 (i.e., before and after the coolant 115 exchanges heat with the electronic device 120). In some embodiments, the controller 190 reduces the power output by the pump 165 when the controller 190 detects that the first temperature difference is less than or equal to a temperature threshold. In this way, unnecessary circulation of the coolant 115 may be reduced, thereby reducing the operating cost of the immersion cooling system 100.
In addition, the immersion cooling system 100 further comprises a third temperature sensor 183, arranged in a line connecting the outlet 162 of the coolant circulation loop 160 and the liquid distributor 118, adapted to sensing a third temperature of the coolant 115. The immersion cooling system 100 further comprises a fourth temperature sensor 184 arranged in a line connecting the inlet 161 of the coolant circulation loop 160 and the pump 165, adapted to sense a fourth temperature of the coolant 115. As such, if the controller 190 cannot obtain the first temperature difference (e.g., between the first temperature and the second temperature), the controller 190 may obtain the second temperature difference between the third temperature and the fourth temperature as an alternative. When the controller 190 detects that the second temperature difference is less than or equal to the temperature threshold, the controller 190 reduces the power output by the pump 165. In this way, unnecessary circulation of the coolant 115 may be reduced, thereby reducing the operating cost of the immersion cooling system 100.
In some embodiments, the immersion cooling system 100 further comprises a fifth temperature sensor 185 disposed in a line connecting the inlet 171 of the water circulation loop 170 and the water tower, adapted to sense a fifth temperature of the water. The immersion cooling system 100 further comprises a sixth temperature sensor 186, provided in a line connecting the outlet 172 of the water circulation loop 170 and the water tower, adapted to sense a sixth temperature of the water. If the controller 190 cannot obtain the first temperature difference and the second temperature difference, the controller 190 may obtain a third temperature difference between the fifth temperature and the sixth temperature as an alternative. When the controller detects that the third temperature difference is less than or equal to the above temperature threshold, the controller 190 reduces the power output by the pump 165. In this way, unnecessary circulation of the coolant 115 may be reduced, thereby reducing the operating cost of the immersion cooling system 100.
In some embodiments, the immersion cooling system 100 further includes a water level sensor 115S for detecting the location of the liquid surface 115A of the coolant 115. The controller 190 may detect whether the liquid surface is lower than the top surface 121 of the electronic device 120 through the water level sensor 115S. When the controller 190 detects that the liquid surface 115A is below the top surface 121 of the electronic device 120, the controller 190 outputs a warning signal to inform an operator to supplement the coolant 115 to maintain the heat dissipation effect on the electronic device 120.
Fig. 2 illustrates a partial enlarged schematic view of an immersion cooling system 100 according to some embodiments of the present disclosure. It should be understood that only a partial structure of the pressure seal case 110 is shown in the present embodiment for the sake of brevity. Those skilled in the art will be able to combine the structure of this embodiment with the pressure seal box 110 described in fig. 1 in light of this disclosure. As shown in fig. 2, the first port 131 of the pressure balance tube 130 is disposed at the top surface 111 of the pressure seal box 110. The exhaust valve 140 is disposed at the second port 132 of the pressure balance tube 130, and the second port 132 is far from the top surface 111 of the pressure seal box 110 relative to the first port 131.
The pressure equalization tube 130 has a gas collection length H and a width W1. The gas collection length H of the pressure equalization tube 130 allows the vaporized coolant concentration of the first port 131 to be greater than the vaporized coolant concentration of the second port 132. For example, the vaporized coolant concentration of the first port 131 is at least 20% greater than the vaporized coolant concentration of the second port 132. In some embodiments, the gas collection length H of the pressure equalization tube 130 is between 200 millimeters and 1500 millimeters, but the disclosure is not so limited. For example, the gas collection length H of the pressure balance tube 130 may be a distance measured from the first port 131 to the second port 132 in a vertical direction (e.g., Z-axis). Specifically, the gas collection length H of the pressure equalization pipe 130 may be changed according to the kind of the coolant 115, so long as the vaporized coolant concentration of the first port 131 is made greater than the vaporized coolant concentration of the second port 132 and the amount of vapor of the coolant 115 discharged through the exhaust valve 140 is effectively reduced. In addition, the pressure equalization tube 130 may have any suitable cross-sectional shape in a horizontal plane (e.g., an X-Y plane), such as rectangular, circular, polygonal, other regular or irregular shapes, and the like.
Fig. 3 illustrates a partial enlarged schematic view of an immersion cooling system 100 according to some embodiments of the present disclosure. It should be understood that only a partial structure of the pressure seal case 110 is shown in the present embodiment for the sake of brevity. One skilled in the art should be able to combine the structure of this embodiment with the pressure seal case 110 described in fig. 1 in light of this disclosure. As shown in fig. 3, a pressure balance pipe 230 is provided instead of the pressure balance pipe 130. The first port 231 of the pressure equalization tube 230 is disposed at the top surface 111 of the pressure containment vessel 110. The exhaust valve 140 is disposed at a second port 232 of the pressure balance pipe 230, and the second port 232 is remote from the top surface 111 of the pressure seal box 110 with respect to the first port 231.
In some embodiments, a non-right angle θ may be formed between the sidewall of the pressure equalization tube 230 and the top surface 111 of the pressure containment vessel 110. In other words, the angle θ may be an acute angle or an obtuse angle. For example, the gas collection length H of the pressure equalization tube 230 may be a distance measured in a vertical direction (e.g., Z-axis) from the first port 231 to the second port 232. The amount of vapor of the coolant 115 discharged through the exhaust valve 140 can be effectively reduced by the above-described design.
Fig. 4 illustrates a partial enlarged schematic view of an immersion cooling system 100 according to some embodiments of the present disclosure. It should be understood that only a partial structure of the pressure seal case 110 is shown in the present embodiment for the sake of brevity. One skilled in the art should be able to combine the structure of this embodiment with the pressure seal case 110 described in fig. 1 in light of this disclosure. As shown in fig. 4, a pressure balance pipe 330 is provided instead of the pressure balance pipe 130. The first port 331 of the pressure equalization tube 330 is disposed at the top surface 111 of the pressure containment vessel 110. The exhaust valve 140 is disposed at a second port 332 of the pressure balance tube 330, and the second port 332 is remote from the top surface 111 of the pressure seal box 110 with respect to the first port 331.
In some embodiments, the first port 331 and the second port 332 of the pressure balance tube 330 may be provided with a bend 333. In this embodiment, the bending portion 333 may extend in a direction parallel to a horizontal plane (e.g., an X-Y plane). In some embodiments, the fold 333 may extend in a direction that is non-parallel to the vertical direction (e.g., the Z-axis). For example, the gas collection length H of the pressure equalization tube 330 may be a distance measured in a vertical direction (e.g., Z-axis) from the first port 331 to the second port 332. The amount of vapor of the coolant 115 discharged through the exhaust valve 140 can be effectively reduced by the above-described design.
Fig. 5 illustrates a partial enlarged schematic view of an immersion cooling system 100 according to some embodiments of the present disclosure. It should be understood that only a partial structure of the pressure seal case 110 is shown in the present embodiment for the sake of brevity. One skilled in the art should be able to combine the structure of this embodiment with the pressure seal case 110 described in fig. 1 in light of this disclosure. As shown in fig. 5, a pressure balance pipe 430 is provided instead of the pressure balance pipe 130. The first port 431 of the pressure balance pipe 430 is disposed at the top surface 111 of the pressure seal box 110. The exhaust valve 140 is disposed at a second port 432 of the pressure balance tube 430, and the second port 432 is far from the top surface 111 of the pressure seal box 110 relative to the first port 431.
In some embodiments, the first and second ports 431, 432 of the pressure balance tube 430 may be provided with a spiral 433. In this embodiment, the spiral portion 433 may have a spiral structure having a Z axis as a central axis. In some embodiments, the central axis of the spiral 433 may not be parallel to the Z-axis. For example, the gas collection length H of the pressure balance tube 430 may be a distance measured in a vertical direction (e.g., Z-axis) from the first port 431 to the second port 432. The amount of vapor of the coolant 115 discharged through the exhaust valve 140 can be effectively reduced by the above-described design.
In summary, the present disclosure provides a submerged cooling system with a pressure balancing pipe. By arranging the pressure balance pipe, the amount of vapor of the coolant dissipated to the outside of the pressure seal box through the exhaust valve can be reduced, and the maintenance cost of the soaking type cooling system is reduced. In this way, frequent replenishment of the coolant in the pressure seal tank is unnecessary. In addition, the temperature, the liquid surface, the flow rate and the like of the coolant can be detected in real time so as to ensure the normal operation of the soaking type cooling system. The immersion cooling system also comprises a coolant circulation loop and a water circulation loop, and can exchange heat of the coolant flowing through the electronic equipment for recycling.
However, the embodiments of the present disclosure and their advantages have been disclosed above, but it should be understood that modifications, substitutions and alterations can be made by those skilled in the art without departing from the spirit and scope of the disclosure. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, and those of skill in the art will appreciate from the present disclosure that any process, machine, manufacture, composition of matter, means, methods and steps which may be practiced in the present disclosure or with respect to the presently existing or future developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein. Accordingly, the present disclosure is intended to cover such processes, machines, manufacture, compositions of matter, means, methods, or steps, presently adapted to carry out the present disclosure without departing from the spirit or essential characteristics of the present disclosure. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes combinations of the individual claims and embodiments.
Claims (12)
1. A soak cooling system for a server system, comprising:
a pressure seal tank for storing a coolant and having a vapor space within the pressure seal tank above a liquid surface of the coolant;
an electronic device completely immersed in the coolant;
a pressure balance pipe having a gas collection length, and a first port of the pressure balance pipe being disposed at a top surface of the pressure seal box; and
the exhaust valve is arranged at a second port of the pressure balance pipe, and the second port is far away from the top surface of the pressure seal box relative to the first port;
wherein when the electronic apparatus is operated, a part of the coolant evaporates so that the air pressure value in the pressure seal box rises;
wherein when the air pressure value within the pressure containment vessel exceeds a first air pressure value, the vent valve automatically opens such that the vapor space communicates with an environment external to the pressure containment vessel along the gas collection length of the pressure equalization tube;
wherein the gas collection length of the pressure equalization tube is such that the vaporized coolant concentration of the first port is greater than the vaporized coolant concentration of the second port.
2. The immersion cooling system for a server system according to claim 1, wherein the pressure seal box includes:
the dividing wall is vertically arranged at the bottom of the pressure sealing box, so that the pressure sealing box is divided into a first accommodating space and a second accommodating space, and the first accommodating space is larger than the second accommodating space; and
a coolant outlet arranged at the bottom of the second accommodating space and spatially opposite to the partition wall;
the electronic equipment is placed in the first accommodating space, and the height of the partition wall is lower than the surface of the liquid and higher than the top surface of the electronic equipment.
3. The immersion cooling system for a server system according to claim 2, further comprising:
a heat exchanger comprising a water circulation loop and a coolant circulation loop, wherein the water circulation loop is connected to a water tower to receive cold water;
a pump connected between the inlet of the coolant circulation circuit and the coolant outlet;
wherein the pump outputs power such that the coolant in the second accommodation space flows into the inlet of the coolant circulation circuit via the coolant outlet;
wherein the coolant and the cold water exchange heat in the heat exchanger through the water circulation loop and the coolant circulation loop such that the coolant temperature in the coolant circulation loop is lowered.
4. The immersion cooling system for a server system according to claim 3, further comprising:
a liquid distributor connected between an outlet of the coolant circulation circuit and a bottom of the electronic device;
wherein after the coolant completes the heat exchange in the heat exchanger, the coolant in the coolant circulation loop is caused to flow into the liquid distributor through the outlet of the coolant circulation loop by the power output from the pump;
wherein the liquid distributor uniformly distributes the coolant flowing through the inside of the electronic device by the power output from the pump.
5. The immersion cooling system for a server system according to claim 4, wherein the power is output by the pump, and the coolant flowing through the electronic device flows into the first accommodating space.
6. The immersion cooling system for a server system according to claim 4, further comprising:
a first temperature sensor, disposed on top of the electronic device, adapted to sense a first temperature of the coolant;
a second temperature sensor, disposed at the bottom of the electronic device, adapted to sense a second temperature of the coolant; and
a controller that obtains a first temperature difference between the first temperature and the second temperature;
wherein the controller reduces the pump from outputting the power when the controller detects that the first temperature difference is less than or equal to a temperature threshold.
7. The immersion cooling system for a server system according to claim 6, further comprising:
a third temperature sensor disposed in a line connecting the outlet of the coolant circulation loop and the liquid dispenser, adapted to sense a third temperature of the coolant; and
a fourth temperature sensor provided in a line connecting the inlet of the coolant circulation circuit and the pump, adapted to sense a fourth temperature of the coolant;
wherein if the controller cannot obtain the first temperature difference between the first temperature and the second temperature, the controller obtains a second temperature difference between the third temperature and the fourth temperature;
wherein the controller reduces the power output by the pump when the controller detects that the second temperature difference is less than or equal to the temperature threshold.
8. The immersion cooling system for a server system according to claim 1, further comprising:
a water level sensor for detecting the liquid surface of the coolant; and
a controller that detects whether the liquid surface is lower than a top surface of the electronic device through the water level sensor;
wherein the controller outputs a warning signal when the controller detects that the liquid surface is below the top surface of the electronic device.
9. The immersion cooling system for a server system of claim 1, wherein the top surface of the pressure seal box has an opening, and the opening is adjacent to the first port of the pressure equalization tube;
wherein the electronic device is placed in the pressure-tight box via the opening;
wherein the immersion cooling system further comprises a sealing cover and the sealing cover is for sealing the opening such that the vapor space is formed above the liquid surface of the coolant.
10. The immersion cooling system for a server system according to claim 1, wherein the gas collection length of the pressure equalization tube is between 200 millimeters and 1500 millimeters.
11. The immersion cooling system for a server system according to claim 1, wherein when the air pressure within the pressure seal box is below a second air pressure value, the vent valve automatically closes such that the vapor space is isolated from the environment outside the pressure seal box;
wherein the first air pressure value is greater than the second air pressure value.
12. The immersion cooling system for a server system of claim 1, wherein the vaporized coolant concentration of the first port is at least 20% greater than the vaporized coolant concentration of the second port.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/314,466 US20240074119A1 (en) | 2022-08-26 | 2023-05-09 | Immersion cooling system |
EP23174925.0A EP4329450A1 (en) | 2022-08-26 | 2023-05-23 | Immersion cooling system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US202263401365P | 2022-08-26 | 2022-08-26 | |
US63/401,365 | 2022-08-26 |
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CN117677142A true CN117677142A (en) | 2024-03-08 |
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CN202211592098.5A Pending CN117677142A (en) | 2022-08-26 | 2022-12-12 | Immersion cooling system |
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CN (1) | CN117677142A (en) |
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