CN117915547A - Heat conduction type circuit carrier plate - Google Patents
Heat conduction type circuit carrier plate Download PDFInfo
- Publication number
- CN117915547A CN117915547A CN202211249593.6A CN202211249593A CN117915547A CN 117915547 A CN117915547 A CN 117915547A CN 202211249593 A CN202211249593 A CN 202211249593A CN 117915547 A CN117915547 A CN 117915547A
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- China
- Prior art keywords
- layer
- circuit carrier
- heat
- heat conducting
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 230000001668 ameliorated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat conduction type circuit carrier plate which comprises a circuit board, a plurality of heat conduction pads, a plurality of heat conduction columns and a metal layer. The circuit board comprises an insulating layer, and a top conductive layer and a bottom conductive layer which are respectively formed on the opposite sides of the insulating layer. The circuit board is concavely provided with a plurality of component placing grooves from the top conducting layer towards the insulating layer, and a plurality of through holes communicated with the component placing grooves from the bottom conducting layer. The heat conducting pads are respectively formed in the piece placing grooves. The heat conduction columns are respectively filled in the through holes and are respectively connected with the heat conduction pads. The metal layer is formed on the bottom conductive layer and connected with the heat conducting columns. Each piece accommodating groove can be used for accommodating an electronic element so as to be abutted against the corresponding heat conducting pad.
Description
Technical Field
The present invention relates to a carrier, and more particularly to a thermally conductive circuit carrier without embedded electronic components.
Background
Based on the development of semiconductor technology, the requirement of the circuit carrier board for the heat dissipation efficiency of the electronic components mounted thereon is gradually increased, so that operators often need to embed the corresponding electronic components in the existing circuit carrier board according to the downstream requirement thereof, and conduct the heat dissipation of the electronic components through the corresponding heat conducting structure. However, the existing circuit carrier has technical and equipment requirements for embedding and corresponding processing of electronic components, and the existing circuit carrier is equivalent to customized products and is difficult to be widely applied, which forms a certain threshold for manufacturers to step into the field, thereby reducing the development and popularization of the industry in an intangible way.
Accordingly, the present inventors considered that the above-mentioned drawbacks could be ameliorated, and have intensively studied and combined with the application of scientific principles, and finally, have proposed an invention which is reasonable in design and effectively ameliorates the above-mentioned drawbacks.
Disclosure of Invention
The embodiment of the invention provides a heat conduction type circuit carrier plate, which can effectively improve the defects possibly generated by the existing circuit carrier plate.
The embodiment of the invention discloses a heat conduction type circuit carrier plate, which comprises: a circuit board, comprising: an insulating layer; a top conductive layer formed on one side of the insulating layer; a bottom conductive layer formed on the other side of the insulating layer; at least one circuit layer buried in the insulating layer; the circuit board is concavely provided with a plurality of component placing grooves from the top conducting layer towards the insulating layer and a plurality of perforations communicated with the bottoms of the component placing grooves from the bottom conducting layer, and the bottoms of the component placing grooves are spaced with the bottom conducting layer by a preset distance; the heat conducting pads are respectively formed at the bottoms of the plurality of workpiece placing grooves; the heat conducting columns are filled in the through holes respectively and connected with the heat conducting pads respectively; the metal layer is flaky and formed on the bottom conductive layer, and the metal layer is connected with the heat conducting columns; any one of the component placing grooves of the heat-conducting circuit carrier board can be used for at least partially accommodating an electronic element therein and is abutted against the corresponding heat-conducting pad, so that heat energy generated by the electronic element is transferred to an external space through the corresponding heat-conducting pad, the plurality of heat-conducting columns and the metal layer.
The embodiment of the invention also discloses a heat conduction type circuit carrier plate, which comprises: a circuit board, comprising: an insulating layer; a top conductive layer formed on one side of the insulating layer; a bottom conductive layer formed on the other side of the insulating layer; at least one circuit layer buried in the insulating layer; wherein, the circuit board is concavely provided with a piece placing groove from the top conducting layer towards the insulating layer, and a plurality of perforations communicated to the bottom of the piece placing groove are concavely formed from the bottom conducting layer, and the bottom of the piece placing groove is separated from the bottom conducting layer by a preset distance; the heat conducting pad is formed at the bottom of the workpiece placing groove; the heat conducting columns are filled in the through holes respectively and connected with the heat conducting pads; the metal layer is flaky and formed on the bottom conductive layer, and the metal layer is connected with the heat conducting columns; the heat conducting type circuit carrier plate comprises a heat conducting pad, a plurality of heat conducting columns and a metal layer, wherein the heat conducting type circuit carrier plate is arranged on the heat conducting pad, the heat conducting columns are arranged on the heat conducting type circuit carrier plate, and the metal layer is arranged on the heat conducting type circuit carrier plate.
In summary, in the thermally conductive circuit carrier according to the embodiments of the present invention, the formed accommodating groove is not limited to the type of electronic component that can be accommodated therein, and the top conductive layer and the bottom conductive layer can be formed with corresponding circuit layouts according to the type of electronic component. That is, the heat-conducting circuit carrier board has a wider application range, so as to facilitate the improvement of the commonality or the circulation property thereof, thereby effectively reducing the overall production cost.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are included to illustrate and not to limit the scope of the invention.
Drawings
Fig. 1 is a schematic perspective view of a heat conductive circuit carrier according to a first embodiment of the present invention;
FIG. 2 is a schematic top view of FIG. 1;
FIG. 3 is a schematic bottom view of FIG. 1;
FIG. 4 is a schematic cross-sectional view of FIG. 1 along section line IV-IV;
FIG. 5 is a schematic diagram of a variation of FIG. 4;
FIG. 6 is a schematic view of the heat sink fin of FIG. 4;
fig. 7 is a schematic perspective view of a heat conductive circuit carrier according to a second embodiment of the invention;
fig. 8 is a schematic cross-sectional view of fig. 7 along section line VIII-VIII.
Symbol description
100: Heat conduction type circuit carrier plate
1: Circuit board
11: Insulating layer
12: Circuit layer
13: Top conductive layer
14: Bottom conductive layer
2. 2': Heat conduction pad
21: First layer
22: Second layer
3. 3': Heat conduction column
4. 4': Metal layer
5: Electroplated layer
6: Heat radiation fin
S, S': workpiece placing groove
S1: tank bottom
S2: side wall
S3: annular explosion-proof groove
H: perforation
T: in the thickness direction
DS1: preset distance
WS3: width of (L)
Detailed Description
The following specific embodiments are described in order to explain the present invention, and one skilled in the art will appreciate the advantages and effects of the present invention based on the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
Please refer to fig. 1 to 7, which illustrate a first embodiment of the present invention. As shown in fig. 1 to 3, the present embodiment discloses a heat conductive circuit carrier 100, in which no electronic component is embedded. That is, the heat-conducting circuit carrier 100 in this embodiment excludes any circuit board with electronic components embedded therein.
As shown in fig. 4, the thermally conductive circuit carrier 100 in the present embodiment includes a circuit board 1, a plurality of thermal pads 2 disposed in the circuit board 1, a plurality of thermal conductive pillars 3 extending from the plurality of thermal pads 2, a metal layer 4 disposed on one side of the circuit board 1 and respectively connected to the plurality of thermal conductive pillars 3, and a plating layer 5 disposed on the other side of the circuit board 1, but the invention is not limited thereto. For example, in other embodiments of the invention not shown, the thermally conductive circuit carrier 100 may also omit the plating layer 5 or replace it with other structures according to design requirements. The following describes the structure of each element of the thermally conductive circuit carrier 100 and the connection relationship thereof.
In this embodiment, the circuit board 1 includes an insulating layer 11, at least one circuit layer 12 embedded in the insulating layer 11, a top conductive layer 13 formed on one side (e.g., top side) of the insulating layer 11, and a bottom conductive layer 14 formed on the other side (e.g., bottom side) of the insulating layer 11. The number of at least one circuit layer 12 is preferably plural and is spaced apart from each other along the thickness direction T, and the thickness of the top conductive layer 13 is substantially equal to the thickness of the bottom conductive layer 14 and is smaller than the thickness of the insulating layer 11, but the invention is not limited thereto.
More specifically, the circuit board 1 is provided with a plurality of mounting grooves S recessed from the top conductive layer 13 toward the insulating layer 11, and a plurality of through holes H recessed from the bottom conductive layer 14 to communicate with the bottoms S1 of the plurality of mounting grooves S. The bottom S1 of each placement groove S is spaced from the bottom conductive layer 14 by a predetermined distance DS1, so as to prevent the placement groove S from penetrating or exposing the bottom conductive layer 14. That is, any recess having a through shape or a conductive layer at the bottom is different from the placement groove S according to the present embodiment.
Furthermore, each of the placement slots S does not touch at least one of the circuit layers 12 (i.e., the sidewall S2 of each of the placement slots S preferably does not expose any circuit layer 12; or, the placement slots S are formed so as not to damage any circuit layer 12), and the predetermined distance DS1 is preferably at least 2 mils.
The depth of the placement slots S (or the preset distances DS 1) are illustrated in fig. 4 as having the same values, but the specific shape and the actual depth of the placement slots S may be adjusted and changed according to the design requirement (e.g., the placement slots S may be square slots or circular slots and the depth may be 20 mils). For example, as shown in fig. 5, the circuit board 1 may be formed with a plurality of placement slots S having different depths (i.e., a plurality of placement slots S corresponding to a plurality of the predetermined distances DS1 of the bottom conductive layer 14 include at least two different values) to meet a wider range of requirements.
Accordingly, the type of electronic components (not shown) that can be accommodated by the thermally conductive circuit carrier 100 is not limited by the placement slot S in the present embodiment, and the top conductive layer 13 and the bottom conductive layer 14 can be formed with corresponding circuit layouts according to the type of electronic components. That is, the heat conductive circuit carrier 100 has a wide application range, so as to facilitate improving the commonality or the flow-through property thereof, thereby effectively reducing the overall production cost.
The plurality of thermal pads 2 are respectively formed at the groove bottoms S1 of the plurality of component placing grooves S (that is, the groove bottom S1 of each component placing groove S is configured with one thermal pad 2), and each thermal pad 2 is not contacted with the side wall S2 of the corresponding component placing groove S in the present embodiment to form an annular explosion-proof groove S3 therebetween, and the width WS3 of the annular explosion-proof groove S3 is preferably at least 0.5 millimeter (mm), but the specific value of the width WS3 can be adjusted and changed according to the actual requirement, which is not limited herein.
Accordingly, the heat-conducting circuit carrier 100 disclosed in this embodiment separates the corresponding heat-conducting pad 2 from the sidewall S2 of the component placement groove S by forming the annular explosion-proof groove S3, so as to prevent heat energy from being rapidly transferred from any one of the heat-conducting pads 2 to the insulating layer 11, and further effectively reduce the probability of explosion or delamination of the heat-conducting circuit carrier 100.
In more detail, each of the thermal pads 2 has a double-layer structure in this embodiment, and includes a first layer 21 and a second layer 22 stacked on the first layer 21. The first layer 21 of each heat conducting pad 2 is formed at the bottom S1 of the corresponding mounting groove S and connected to a plurality of the heat conducting posts 3, and the edge of the second layer 22 is aligned with the edge of the first layer 21 for mounting the electronic component thereon.
Furthermore, the materials of the first layer 21 and the second layer 22 of each thermal pad 2 may be the same material or different materials according to design requirements (e.g., the first layer 21 is a material suitable for bonding the insulating layer 11, and the second layer 22 is a material suitable for soldering the electronic component), which is not limited in this disclosure.
The plurality of heat conductive pillars 3 are respectively filled in the plurality of through holes H and respectively connected to the plurality of heat conductive pads 2, the metal layer 4 is formed on the bottom conductive layer 14, and the metal layer 4 is connected to the plurality of heat conductive pillars 3. That is, one end of each of the heat conductive posts 3 is buried in the insulating layer 11 and connected to the corresponding heat conductive pad 2, and the other end of each of the heat conductive posts 3 is buried in the bottom conductive layer 14 and connected to the metal layer 4.
In this embodiment, any one of the heat conductive posts 3 has a truncated cone shape and the cross-sectional area thereof gradually increases from the heat conductive pad 2 toward the metal layer 4 (or from the heat conductive pad 2 toward a far direction), so that heat energy can be smoothly transferred from any one of the heat conductive pads 2. Furthermore, the thickness of each heat-conducting pad 2 is greater than the thickness of the metal layer 4 (e.g. the thickness of the second layer 22 is equal to the thickness of the metal layer 4), but the invention is not limited thereto.
As described above, each of the component placement slots S of the thermally conductive circuit carrier 100 in the present embodiment can be used for at least a portion of the electronic component to be accommodated therein to be abutted against the corresponding thermally conductive pad 2, so that the heat energy generated by the electronic component can be transferred to the external space through the corresponding thermally conductive pad 2, the plurality of thermally conductive posts 3, and the metal layer 4.
Furthermore, the plurality of placement grooves S sharing the metal layer 4 in the present embodiment is not limited to the electronic component that can only be used for providing heat; for example, in other embodiments of the present invention, which are not shown, one of the accommodating grooves S may accommodate a heat-generating electronic component, and the other accommodating groove S accommodates an object for dissipating heat, so that the heat generated by the electronic component can be effectively absorbed through the metal layer 4.
Further, the metal layer 4 is in a sheet shape in the present embodiment, and the plurality of heat conductive pads 2 are projected toward a projection area formed by orthographic projection of the metal layer 4, which is located within an outer contour of the metal layer 4. Accordingly, as shown in fig. 6, the thermally conductive circuit carrier 100 may further include a heat dissipation fin 6 selectively fixed to the metal layer 4, so as to further enhance the heat dissipation performance of the thermally conductive circuit carrier 100.
In addition, the plating layer 5 is formed on the top conductive layer 13, and the thickness of the plating layer 5 is preferably equal to the thickness of the metal layer 4, so that the metal layer 4 and the plating layer 5 are formed in the same plating process.
It should be noted that at least one of the circuit layer 12, the top conductive layer 13, the bottom conductive layer 14, the plurality of thermal pads 2, the plurality of thermal conductive pillars 3, the electroplated layer 5, and the metal layer 4 may be made of the same material (e.g. copper) or different materials according to design requirements.
Please refer to fig. 7 and 8, which illustrate a second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the same parts of the two embodiments will not be described again, and the differences between the present embodiment and the first embodiment are described as follows:
In this embodiment, the thermally conductive circuit carrier 100 can be concavely formed with at least one placement groove S from the top conductive layer 13 of the circuit board 1 toward the insulating layer 11, and the thermally conductive circuit carrier 100 can be concavely formed with at least one placement groove S 'from the bottom conductive layer 14 toward the insulating layer 11, which is also matched with a thermal pad 2' located inside, a plurality of thermal conductive columns 3 'connected with the thermal conductive pad 2', and a metal layer 4 'formed on the top conductive layer 13 and respectively connected with a plurality of thermal conductive columns 3'.
As described above, in this embodiment, at least one component placement groove S, S' is formed on each of the different sides of the thermally conductive circuit carrier 100, so as to provide a more multi-component structural design manner, so as to meet more various requirements, thereby being beneficial to improving the commonality or the flow-through property of the thermally conductive circuit carrier 100.
In summary, in the thermally conductive circuit carrier according to the embodiments of the present invention, the formed accommodating groove is not limited to the type of electronic component that can be accommodated therein, and the top conductive layer and the bottom conductive layer can be formed with corresponding circuit layouts according to the type of electronic component. That is, the heat-conducting circuit carrier board has a wider application range, so as to facilitate the improvement of the commonality or the circulation property thereof, thereby effectively reducing the overall production cost.
Furthermore, the heat-conducting circuit carrier board disclosed by the embodiment of the invention is separated from each other by forming the annular explosion-proof groove between any one of the heat-conducting pads and the side wall corresponding to the part placing groove, so that heat energy is prevented from being rapidly transferred from any one of the heat-conducting pads to the insulating layer, and the probability of explosion or layering of the heat-conducting circuit carrier board is effectively reduced.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, as all changes which come within the meaning and range of equivalency of the description and drawings are therefore intended to be embraced therein.
Claims (10)
1. A thermally conductive circuit carrier, comprising:
The circuit board includes:
An insulating layer;
a top conductive layer formed on one side of the insulating layer;
the bottom conductive layer is formed on the other side of the insulating layer; and
At least one circuit layer buried in the insulating layer;
The circuit board is concavely provided with a plurality of piece placing grooves from the top conducting layer towards the insulating layer and a plurality of perforations communicated with the bottoms of the piece placing grooves from the bottom conducting layer, and the bottoms of the piece placing grooves are spaced with the bottom conducting layer by a preset distance;
The heat conducting pads are respectively formed at the bottoms of the plurality of workpiece placing grooves;
The heat conducting columns are filled in the through holes respectively and connected with the heat conducting pads respectively; and
The metal layer is flaky and formed on the bottom conductive layer, and the metal layer is connected with the plurality of heat conducting columns;
any one of the component placing grooves of the heat-conducting circuit carrier board can be used for accommodating at least part of an electronic element therein and is abutted against the corresponding heat-conducting pad, so that heat energy generated by the electronic element is transferred to an external space through the corresponding heat-conducting pad, the plurality of heat-conducting columns and the metal layer.
2. The thermally conductive circuit carrier of claim 1, wherein each of the placement slots does not touch at least one of the circuit layers and the predetermined distance is at least greater than 2 mils.
3. The circuit carrier of claim 2, wherein the plurality of predetermined distances corresponding to the bottom conductive layer comprise at least two different values.
4. The thermally conductive circuit carrier of claim 1, wherein within each of the mounting slots, the thermal pads are not in contact with the sidewalls of the mounting slots to form annular explosion-proof slots therebetween, and the annular explosion-proof slots have a width of at least 0.5 millimeters (mm).
5. The thermally conductive circuit carrier of claim 1, wherein each of the thermal pads comprises:
the first layer is formed at the bottom of the groove corresponding to the piece placing groove and connected with the heat conducting columns; and
And a second layer stacked on the first layer, wherein the thickness of the second layer is equal to that of the metal layer.
6. The thermally conductive circuit carrier of claim 5, wherein the first and second layers of each of the thermal pads are of a material different from each other.
7. The thermally conductive circuit carrier of claim 1, wherein any one of the thermally conductive posts has a truncated cone shape and a cross-sectional area that gradually increases from the corresponding thermally conductive pad toward the metal layer.
8. The thermally conductive circuit carrier of claim 1, wherein the thermally conductive circuit carrier further comprises a plating layer formed on the top conductive layer, and the plating layer has a thickness equal to the thickness of the metal layer.
9. The thermally conductive circuit carrier of claim 1, further comprising heat sink fins selectively secured to the metal layer.
10. A thermally conductive circuit carrier, comprising:
The circuit board includes:
An insulating layer;
a top conductive layer formed on one side of the insulating layer;
the bottom conductive layer is formed on the other side of the insulating layer; and
At least one circuit layer buried in the insulating layer;
wherein, the circuit board is concavely provided with a piece placing groove from the top conducting layer towards the insulating layer, and a plurality of perforations communicated to the bottom of the piece placing groove are concavely formed from the bottom conducting layer, and the bottom of the piece placing groove is separated from the bottom conducting layer by a preset distance;
The heat conducting pad is formed at the bottom of the accommodating part groove;
the heat conducting columns are filled in the through holes respectively and connected with the heat conducting pads; and
The metal layer is flaky and formed on the bottom conductive layer, and the metal layer is connected with the plurality of heat conducting columns;
The heat conducting type circuit carrier plate comprises a heat conducting pad, a plurality of heat conducting columns and a metal layer, wherein the heat conducting type circuit carrier plate is arranged on the heat conducting pad, the heat conducting columns are arranged on the heat conducting type circuit carrier plate, the heat conducting type circuit carrier plate is arranged on the heat conducting type circuit carrier plate, and the heat conducting type circuit carrier plate is arranged on the heat conducting type circuit carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211249593.6A CN117915547A (en) | 2022-10-12 | 2022-10-12 | Heat conduction type circuit carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211249593.6A CN117915547A (en) | 2022-10-12 | 2022-10-12 | Heat conduction type circuit carrier plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117915547A true CN117915547A (en) | 2024-04-19 |
Family
ID=90693181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211249593.6A Pending CN117915547A (en) | 2022-10-12 | 2022-10-12 | Heat conduction type circuit carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117915547A (en) |
-
2022
- 2022-10-12 CN CN202211249593.6A patent/CN117915547A/en active Pending
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