CN117912781A - Resistance motherboard - Google Patents

Abstract

The invention provides a resistance motherboard, which relates to the technical field of resistance element manufacture, and comprises: a plurality of resistor areas and a plurality of connecting areas, wherein a first electrode area and a second electrode area are respectively arranged on two sides of each resistor area; the second electrode region of the resistance region is connected with the first electrode region of the next resistance region through the connecting region; the connecting width of the connecting region, the electrode width of the first electrode region and the electrode width of the second electrode region are equal; and the connecting region is used for filling the second electrode region or the first electrode region at the other end of the resistance region when the first electrode region or the second electrode region at one end of the resistance region is partially cut off. The connecting width of the connecting area is set to be the same as the electrode widths of the first electrode area and the second electrode area, a smooth straight line can be formed after the connecting area is cut, uneven electroplating can not be generated during subsequent electroplating, meanwhile, the connecting area can be filled with excessively cut resistor areas, new resistor areas with the same size as the resistor areas are formed, and the production yield is improved.

Description

Resistance motherboard

Technical Field

The invention relates to the technical field of manufacturing of resistor elements, in particular to a resistor motherboard.

Background

In the prior art, for mass production of resistor elements, a resistor motherboard is divided into a plurality of resistor areas, so that a machine can conveniently process all resistor areas on the whole resistor motherboard in batches. Electrode regions are arranged at two ends of each resistor region, opposite electrode regions between adjacent resistor regions are connected through a narrow connecting region structure with conductive characteristics, and the narrow connecting regions are only connected with partial regions of the electrode regions. In the resistor manufacturing process, cutting and electroplating processes are involved, if the cutting is greatly deviated, the narrow connection area structure around the electrode area is remained too long, and the narrow connection area together with the remained insulating ink area is too large. Because the electrode area is electroplated and the narrow connecting area structure is electroplated, electroplating unevenness is easy to occur at the joint of the electrode area and the narrow connecting area structure, so that a bulge phenomenon is generated, the edge insulating ink of the electrode area is overlarge in proportion, the adhesive force among all structures in the resistor element is reduced, the produced resistor element is poor in quality and easy to fall off and disassemble, and the reliability is lower.

Disclosure of Invention

The invention provides a resistor motherboard, which aims to solve the technical problem of how to improve the production quality of a resistor element.

To achieve the above object, an embodiment of the present invention provides a resistive motherboard, including: a plurality of resistor areas and a plurality of connecting areas, wherein both sides of each resistor area are respectively provided with a first electrode area and a second electrode area;

The second electrode region of the resistance region is connected with the first electrode region of the next resistance region through the connection region;

the connecting width of the connecting region, the electrode widths of the first electrode region and the second electrode region are equal;

And the connecting region is used for filling the second electrode region or the first electrode region at the other end of the resistance region when the first electrode region or the second electrode region at one end of the resistance region is partially cut off so as to form a new resistance region with the same size as the resistance region.

Optionally, the resistive region includes: a first conductor, a resistor, and an insulating layer;

The first conductors are located in the first electrode area and the second electrode area, the first conductors located at two ends of the resistor area are electrically connected through resistors, and the surface of each resistor is covered with the insulating layer.

Optionally, the resistor is disposed between the first electrode region and the second electrode region within the resistive region, and does not exceed each side of the resistive region.

Optionally, the resistive area not covering the first electrical conductor and the resistive body is provided with the insulating layer.

Optionally, the first conductor does not completely cover the first electrode region and the second electrode region, and the first electrode region and the second electrode region that do not cover the first conductor are provided with the insulating layer.

Optionally, the resistor body is subjected to patterning treatment, and the shape of the resistor body is in a preset pattern.

Optionally, the resistor is not patterned.

Optionally, the connection region includes: a second conductor;

The second conductor is electrically connected with the first conductors of the first electrode region and the second electrode region which are connected with each other.

Optionally, the connection region further includes: an insulating layer;

the second conductor does not completely cover the connection region, and the insulating layer is arranged on the surface of the connection region which is not covered by the second conductor.

Optionally, the first electrical conductor is of a different material than the second electrical conductor.

The embodiment of the invention provides a resistance motherboard, which comprises: a plurality of resistor areas and a plurality of connecting areas, wherein both sides of each resistor area are respectively provided with a first electrode area and a second electrode area; the second electrode region of the resistance region is connected with the first electrode region of the next resistance region through the connection region; the connecting width of the connecting region, the electrode widths of the first electrode region and the second electrode region are equal; and the connecting region is used for filling the second electrode region or the first electrode region at the other end of the resistance region when the first electrode region or the second electrode region at one end of the resistance region is partially cut off so as to form a new resistance region with the same size as the resistance region. The connecting width of the connecting area is set to be the same as the electrode widths of the first electrode area and the second electrode area, after the connecting area is cut, the edge of the first electrode area or the edge of the second electrode area can form a smooth straight line, and when electroplating is carried out subsequently, electroplating bulges can not be generated due to uneven electroplating to influence the adhesive force of the resistor structure, so that the resistor element is prevented from falling off in the manufacturing process, and the reliability of the resistor element is improved. Meanwhile, the connecting area can be filled with the excessively cut resistor area to form a new resistor area with the same size as the resistor area, so that the connecting area is minimized without excessively considering the cutting precision requirement, the number of the resistor areas on the resistor motherboard is increased, the scrapping phenomenon caused by cutting offset is reduced, the production yield is improved, the utilization rate of the resistor motherboard is improved, and the cost is saved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a partial area structure of a first embodiment of a resistive motherboard according to the present invention;

FIG. 2 is a schematic diagram of a partial region of a resistive motherboard with a narrow connection area structure used in the prior art;

FIG. 3 is a schematic diagram of a prior art cutting offset;

FIG. 4 is a schematic diagram of a connection region filling a first electrode region or a second electrode region;

FIG. 5 is a schematic view showing a partial sectional structure of a resistive motherboard according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a partial area structure of a second embodiment of a resistive motherboard according to the present invention;

FIG. 7 is a schematic view of another partial area structure of a second embodiment of a resistive motherboard according to the present invention;

FIG. 8 is a schematic view showing the overall structure area division of the resistive motherboard of the present invention.

The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

The present invention provides a resistor motherboard, and referring to fig. 1, fig. 1 is a schematic view of a local area structure of a first embodiment of the resistor motherboard of the present invention.

As shown in fig. 1, in this embodiment, the resistive motherboard includes:

a plurality of resistor areas and a plurality of connecting areas, wherein both sides of each resistor area are respectively provided with a first electrode area and a second electrode area;

The second electrode region of the resistance region is connected with the first electrode region of the next resistance region through the connection region;

the connecting width of the connecting region, the electrode widths of the first electrode region and the second electrode region are equal;

And the connecting region is used for filling the second electrode region or the first electrode region at the other end of the resistance region when the first electrode region or the second electrode region at one end of the resistance region is partially cut off so as to form a new resistance region with the same size as the resistance region.

In the present embodiment, the connection structure between two adjacent resistor areas 10 is shown in a partial area of the resistor motherboard in fig. 1. Each resistor region 10 is provided with a first electrode region 11 and a second electrode region 12 on both sides, and each resistor region 10 may be arranged in sequence, and a cutting region (not shown) is provided between two adjacent resistor regions 10 in each row, and the cutting region may coincide with the connection region 20 in fig. 1. The cutting area refers to an area to be cut in the process flow of manufacturing the resistor through the resistor motherboard, and since the connection area 20 is overlapped with the cutting area, the connection area 20 between adjacent resistor areas 10 for connecting the first electrode area 11 and the second electrode area 12 is cut off when the resistor motherboard is subjected to the cutting process.

It should be understood that, referring to fig. 2, fig. 2 is a schematic structural view of a local area of a resistive motherboard of a narrow connection area structure adopted in the prior art, where the narrow connection area is provided as a part of a cutting area, and areas outside the narrow connection area are all insulating areas. Since the machining apparatus has a deviation of the cutting position, the first electrode region 11 or the second electrode region 12 may be excessively cut, and the connection region 20 connected to the first electrode region 11 or the second electrode region 12 may also have a cutting residue, as shown in fig. 3, fig. 3 is a schematic diagram of cutting deviation in the prior art. Referring to fig. 3, in the case of the narrow connection region structure of the prior art scheme, if a cutting offset occurs, the narrow connection region is not completely cut, i.e., the cut first electrode region 11 or second electrode region 12 may be connected to the remaining narrow connection region and the insulation region. Since the connection width of the narrow connection region occupies only a small part of the electrode width of the first electrode region 11 or the second electrode region 12, and the periphery is also provided with an insulating region where electroplating cannot be performed, uneven electroplating is very likely to occur, i.e., electroplating products are accumulated in a local region to generate protrusions. Correspondingly, a large amount of electroplating products are easily accumulated at the connection point between the narrow connection region remained after electroplating and the first electrode region 11 or the second electrode region 12, so that the surface of the first electrode region 11 or the second electrode region 12 of the resistor region 10 generates a bulge phenomenon. The first electrode region 11 or the second electrode region 12 after electroplating has protrusions and is uneven, and the periphery of the first electrode region or the second electrode region 12 also has residual insulating regions, the insulating regions comprise insulating ink with smooth surfaces, the adhesion is poor, and in addition, the first electrode region 11 or the second electrode region 12 at one end of the resistor region 10 has partial region missing, so that the resistor region 10 obtained after cutting is difficult to attach to other circuit boards due to the various reasons, and finally, the produced resistor element is easy to fall off, and the reliability of the finished product of the resistor element is seriously affected. In order to prevent the uneven plating from occurring in the resistor area 10, the first electrode area 11 and the second electrode area 12 are generally excessively cut inward during cutting, so that the area occupied by the actual resistor area 10 is smaller than the theoretical area, the internal contact surface of the finished resistor element is smaller, and the raised phenomenon caused by uneven plating is avoided, but the surface area of the resistor area 10 is smaller, the adhesive force is reduced, the finished resistor element is still easy to fall off, and the reliability is low.

In view of the above, as shown in fig. 1, the first electrode region 11 and the second electrode region 12 are connected between two adjacent resistive regions 10 through the connection region 20 of the full bridge structure, the electrode width of the first electrode region 11, the connection width of the connection region 20, and the electrode width of the second electrode are identical, and each of the first electrode region 11, the second electrode region 12, and the connection region 20 includes a conductor having a conductive property. Therefore, even in the case of slight cutting offset, the connecting region 20 left after cutting can be used as a part of the first electrode region 11 or the second electrode region 12, and two ends of the newly composed first electrode region 11 or second electrode region 12 are flat and smooth straight lines, in which case, the connection point between the residual narrow connecting region structure and the first electrode region 11 or the second electrode region 12 is not formed into a convex structure due to the electroplating, thereby preventing the influence on the subsequent process. Correspondingly, in the actual cutting process, the first electrode region 11 and the second electrode region 12 do not need to be excessively cut inwards, so that the size of the finished product resistor element produced by the resistor master plate structure is not smaller, the adhesive force of each structure in the finished product resistor element is improved, and the reliability is high.

The connection width of the connection region 20 refers to a length of a side corresponding to a side where the first electrode region 11 or the second electrode region 12 contacts; the electrode width of the first electrode region 11 and the electrode width of the second electrode region 12 are the side lengths corresponding to the sides where the corresponding connection regions 20 are in contact, respectively, which means that the space between the first electrode region 11 and the second electrode region 12, which are correspondingly connected between two adjacent resistive regions 10, is occupied by the connection regions 20.

In a specific implementation, as shown in fig. 4, fig. 4 is a schematic diagram of filling a connection region into a first electrode region or a second electrode region, because the connection region 20 can fill a resistive region of the first electrode region 11 or the second electrode region 12, when the entire resistive motherboard is cut, the connection region 20 between two adjacent resistive regions 10 is cut, if the cutting accuracy is insufficient and there is a cutting offset of the resistive regions 10, for example, a portion of the first electrode region 11 at one end of the resistive regions 10 is missing, and a portion of the second electrode region 12 at the other end of the resistive regions is left in the connection region 20, the remaining connection region 20 can be regarded as a first portion of the second electrode region 12 in the resistive regions 10, which can be understood as a new resistive region 10' with the same size as the originally preset resistive region 10 is formed by the remaining connection region 20. Thus, the size of the new resistor area 10' still accords with the size of the resistor element which is required to be manufactured in the original preset mode, the conduction function of the first electrode area 11 and the second electrode area 12 is not affected, the yield of manufacturing the resistor element is improved, meanwhile, the cutting precision requirement of a production machine is reduced, and the cost is saved.

It should be noted that, in the present embodiment, the maximum size of the acceptable cutting offset should be kept within a certain range, if the actual size of the cutting offset is too large, the missing portion of the first electrode region 11 or the second electrode region 12 at one end of the resistive region 10 is too large, which may result in too small an area occupied by the first electrode region 11 or the second electrode region 12, and the electrode of the resistive element to be fabricated may not be formed in the first electrode region 11 or the second electrode region 12, which may be understood that in an extreme case, the first electrode region 11 is completely lost due to the cutting offset, which is equivalent to that the new resistive region 10 'does not exist in the first electrode region 11, and the new resistive region 10' may not be used to fabricate the resistive element. Therefore, in practical situations, the present technical solution has a limit on the maximum size of the cutting offset, and the maximum size of the cutting offset should not exceed one tenth of the electrode length of the first electrode region 11 or the second electrode region 12, for example, the electrode length of the first electrode region 11 is 100um, and the acceptable range of the maximum size of the corresponding cutting offset may be 5-10 um. The electrode length is understood to be the edge length of the adjacent edge of the corresponding edge of the electrode width.

It should be noted that, referring to fig. 3, in the prior art, in the dicing process, due to the dicing accuracy to be considered, a cutter with a corresponding blade width is selected to dice the dicing area according to the connection length of the connection area 20. For example, if the width of the cutter is 70um, the cutter cuts from the center of the narrow connection region, and in order to avoid cutting the first electrode region 11 or the second electrode region 12 due to the cutting offset, the connection length of the narrow connection region needs to be made long, the connection length of the narrow connection region is at least 100um, and a cutting offset tolerance of 15um is reserved for the left and right sides. Meanwhile, the prior art cannot enlarge the areas of the first electrode region 11 and the second electrode region 12, so that the adhesion of the manufactured finished product of the resistor element is larger, and the length of the narrow connection region cannot be shortened, so that the resistor mother board with the same area can produce more resistor elements. Referring to fig. 4, by the technical solution of the present embodiment, since the connection region 20 can fill the first electrode region 11 and the second electrode region 12, the cutting precision is not excessively high, and the cutting width of the cutter is not excessively limited. The areas of the first electrode region 11 and the second electrode region 12 of the resistor region 10 can be made large, so that the internal structure of the finished resistor element can have stronger adhesive force, the resistor element is prevented from being separated due to unstable internal structure, and the quality of the finished resistor element is improved. Meanwhile, the connection length of the connection region 20 can be made as short as possible without considering the cutting precision and the width of the cutter too much, for example, if the cutter width of the cutter is 70um, the connection length of the connection region can be set to 80um only, and a cutting offset tolerance of 5um is reserved for the left and right sides, and since the connection region 20 can fill the first electrode region 11 and the second electrode region 12, the remaining cutting offset tolerance is compensated by the maximum size of the allowable cutting offset of the first electrode region 11 or the second electrode region 12. More resistor areas 10 can be arranged in the whole resistor master plate, namely, the utilization rate of the resistor master plate is higher, more resistor elements can be produced through the resistor master plate with the same area, the production cost is greatly saved, and the cutter type selection requirement and the cutting precision requirement can be reduced. The connection length is understood to mean the length of the distance between two adjacent resistor areas 10, and also the length of one side of the connection region 20.

The embodiment of the invention provides a resistance motherboard, which comprises: a plurality of resistor areas and a plurality of connecting areas, wherein both sides of each resistor area are respectively provided with a first electrode area and a second electrode area; the second electrode region of the resistance region is connected with the first electrode region of the next resistance region through the connection region; the connecting width of the connecting region, the electrode widths of the first electrode region and the second electrode region are equal; and the connecting region is used for filling the second electrode region or the first electrode region at the other end of the resistance region when the first electrode region or the second electrode region at one end of the resistance region is partially cut off so as to form a new resistance region with the same size as the resistance region. The connecting width of the connecting area is set to be the same as the electrode widths of the first electrode area and the second electrode area, after the connecting area is cut, the edge of the first electrode area or the edge of the second electrode area can form a smooth straight line, and when electroplating is carried out subsequently, electroplating bulges can not be generated due to uneven electroplating to influence the adhesive force of the resistor structure, so that the resistor element is prevented from falling off in the manufacturing process, and the reliability of the resistor element is improved. Meanwhile, the connecting area can be filled with the excessively cut resistor area to form a new resistor area with the same size as the resistor area, so that the connecting area is minimized without excessively considering the cutting precision requirement, the number of the resistor areas on the resistor motherboard is increased, the scrapping phenomenon caused by cutting offset is reduced, the production yield is improved, the utilization rate of the resistor motherboard is improved, and the cost is saved.

Based on the first embodiment of the resistive motherboard, a second embodiment of the resistive motherboard of the present invention is provided, and referring to fig. 5 to 8, fig. 5 is a schematic sectional view of a partial area of the resistive motherboard according to an embodiment of the present invention, fig. 6 is a schematic sectional view of a partial area of the second embodiment of the resistive motherboard according to the present invention, fig. 7 is a schematic sectional view of another partial area of the second embodiment of the resistive motherboard according to the present invention, and fig. 8 is a schematic sectional view of an overall structural area of the resistive motherboard according to the present invention.

As shown in fig. 5, in the present embodiment, the resistive region 10 includes: a first conductor 31, a resistor 34, and an insulating layer 33;

The first conductors 31 are located in the first electrode region 11 and the second electrode region 12, the first conductors 31 located at two ends of the resistor region 10 are electrically connected through a resistor 34, and the surface of the resistor 34 is covered with the insulating layer 33.

It should be noted that fig. 5 is only used to describe the connection relationship and the relative positions of the structures in the resistive region 10, and is not used to define the absolute positions of the entities of the structures in the resistive region 10, and it should be understood that the structures shown in fig. 5 may be regarded as describing the approximate positions of the structures in two adjacent resistive regions 10 relative to each other, rather than the precise positions.

It is to be understood that the resistor area 10 may have various structures, and in the same resistor area 10, a resistor 34 having an impedance function is required, and two ends of the resistor 34 are connected to the first conductor 31 forming a conductive loop with an external electronic component. The resistor 34 may be electrically connected to the first conductive body 31 of the first electrode region 11 and the conductive layer of the second electrode region 12, respectively, and the connection manner may be extrusion, mosaic or adhesion (the relative positions of the resistor 34 and the first conductive body 31 in the mosaic or adhesion case cannot be fully referred to as shown in fig. 5).

It should be noted that the mosaic type refers to a case where both ends of the resistor 34 are wrapped with the first conductor 31, and the attachment refers to a case where bottom surfaces of both ends of the resistor 34 are attached to top surfaces of the first conductor 31 of the first electrode region 11 and top surfaces of the first conductor 31 of the second electrode region 12, respectively, which are required to consider contact areas of the conductors with the first conductor 31, and it is difficult to control resistance values of the finished resistive element, and thus extrusion type may be preferable in consideration of cost and processing machine precision.

It should be noted that, as shown in fig. 5, the relative position between the resistor 34 and the first conductor 31 may be understood as a case of the above-mentioned extrusion structure, where the two ends of the resistor 34 are extruded by the first conductor 31 of the first electrode region 11 and the second conductor 32 of the second electrode region 12, where only whether the impedance value of the resistor 34 meets the standard or not is considered, and the influence of other factors on the impedance value of the resistor 34 is not considered too much, which has low requirements on the precision of the processing machine.

In order to ensure the impedance accuracy of the resistor 34, an insulating layer 33 is provided on the contact surface between the resistor 34 and the outside, so that abrasion caused by contact between the resistor 34 and the outside can be prevented, the impedance accuracy of the resistor 34 is ensured, and leakage of the resistor 34 is prevented.

It should be noted that, in fig. 5, the case where the insulating layer 33 is disposed on the surface of the resistor 34 does not mean that the total thickness of the insulating layer 33 and the resistor 34 must exceed the thickness of the first conductor 31, but the relationship between the two is not limited, and the relationship may be any one of greater than, equal to or less than three cases, but none of the three cases causes the resistor 34 to leak outside.

Further, in this embodiment, the connection region 20 includes: a second conductor 32;

the second conductor 32 is electrically connected to the first conductor 31 of the connected first electrode region 11 and second electrode region 12, respectively.

It will be readily appreciated that the second electrical conductor 32 also has the same or similar conductive properties as the first electrical conductor 31 and fills in between the correspondingly connected first electrical conductors 31 of two adjacent resistive areas 10, and that the second electrical conductor 32 may optionally fill in the first electrical conductor 31 in the desired resistive area 10 in the event of a dicing offset to ensure that the newly formed resistive area 10 does not change in size. Meanwhile, the problem that uneven electroplating bulges appear in subsequent electroplating and the reliability of a finished product resistor element is affected due to uneven cutting openings is avoided.

Further, as shown in fig. 6, in the present embodiment, the resistor 34 is disposed between the first electrode region 11 and the second electrode region 12 within the resistor region 10, and does not exceed each side of the resistor region 10.

It should be noted that, in the present embodiment, the situation corresponding to fig. 6 may be understood as one of the above-mentioned extrusion structures, and in this case, the resistor 34 fills the area between the first electrode region 11 and the second electrode region 12, and does not contact each side of the resistor region 10, and is kept as much as possible in the geometric center of the resistor region 10.

Further, the resistive area 10 not covering the first conductive body 31 and the resistive body 34 is provided with the insulating layer.

It is easy to understand that in the above structure, the insulating layer 33 is disposed on the surface of the resistor 34 and the area of the resistor area 10, which is not covered by the resistor 34 and the area other than the first conductor 31, so that the resistor 34 is not exposed, the leakage phenomenon of the resistor 34 is prevented, and the problem of deviation of the impedance value caused by abrasion of the side surface of the resistor 34 is also prevented.

Further, in this embodiment, the resistor 34 is patterned, and the shape of the resistor 34 is a predetermined pattern.

It should be noted that, as an option in this embodiment, the resistor 34 may be subjected to patterning, and the patterned resistor 34 may take various shapes such as serpentine, bar, etc., so as to increase the heat dissipation capability; in addition, the resistor 34 after patterning can also improve the actual impedance effect, obtain larger impedance under the same space occupation rate, and save space.

Further, in the present embodiment, the resistor 34 is not subjected to patterning.

Alternatively, the resistor 34 may not be patterned, and the resistor 34 not patterned may have higher impedance accuracy.

Further, in the present embodiment, the first conductor 31 does not entirely cover the first electrode region 11 and the second electrode region 12, and the first electrode region 11 and the second electrode region 12 which do not cover the first conductor 31 are provided with the insulating layer 33.

It is to be understood that, as another case of the partial structure of the resistive motherboard in the present embodiment, as shown in fig. 7, the first electrode region 11 or the second electrode region 12 may be provided as a plurality of conductive units, and two first conductors 31 in the first electrode region 11 or the second electrode region 12 in any one of the resistive regions 10 in fig. 7 may be referred to, and the finished resistive element may be provided with a plurality of electrodes, which may improve the impedance accuracy of the finished resistive element. The two first conductors 31 are likewise filled with an insulating layer 33, wherein the structure of the insulating layer 33 is generally more stable than the structure of the first conductors 31, so that the above-described structure can increase the structural stability in the resistor region 10.

Further, in this embodiment, the connection region 20 further includes: an insulating layer 33;

The second conductor 32 does not completely cover the connection region 20, and the surface of the connection region 20 not covered by the second conductor 32 is provided with the insulating layer 33.

It is easy to understand that, in correspondence with another case of the partial structure of the resistive motherboard in the present embodiment, as shown in fig. 7, the second conductive body 32 of the connection region 20 is only used to fill the region where the first electrode region 11 and the first conductive body 31 of the second electrode region 12, which are correspondingly connected to two adjacent resistive regions 10, are connected. If the first conductor 31 does not completely cover the first electrode region 11 and the second electrode region 12, the second conductor 32 in the connection region 20 does not completely cover the connection region 20, but only the second conductor 32 in the connection region 20 fills the region between the first conductors 31 on both sides, and the insulating layer 33 in the connection region 20 fills the region between the first electrode region 11 and the insulating layer 33 in the second electrode region 12 on both sides. Thus, even if the dicing offset occurs, the cut formed by the dicing process of the first conductor 31 or the second conductor 32 for conducting is smooth, and the subsequent plating uniformity is not affected.

Further, in the present embodiment, the first electrical conductor 31 and the second electrical conductor 32 are made of different materials.

The second conductor 32 may serve as a substitute for the first conductor 31. In consideration of the optimal splicing scheme, in order to enable the first conductor 31 and the second conductor 32 to be in good contact, the material of the second conductor 32 may be the same as that of the first conductor 31. The second electrical conductor 32 may be an unnecessary electrical conductor in view of cost savings. At this time, the material of the second conductive body 32 may be selected from other conductive materials which are cheaper than the first conductive body 31.

Further, in this embodiment, each of the resistor areas 10 is parallel to each other and arranged in an array;

In the first direction, adjacent resistor areas 10 are separated by a first preset distance;

In the second direction, adjacent resistor areas 10 are separated by a second predetermined distance.

It will be readily appreciated that, referring to fig. 8, for ease of mass production of the resistive elements, the individual resistive areas 10 on the resistive motherboard may be arranged in an array to facilitate mass processing of their individual structures by the processing machine. For example, in fig. 8, the left-right direction of fig. 8 may be a first direction in which adjacent respective resistive regions 10 may be spaced apart by a first predetermined distance; the up-down direction of fig. 8 may be a second direction in which adjacent respective resistive regions 10 may be spaced apart by a second predetermined distance. Wherein the first preset distance and the second preset distance need to meet the working accuracy of the processing machine, such as a cutting machine. The processing efficiency is not affected too far, and the processing precision is not affected too close.

It is noted that in the second direction, the first electrode region 11 and the second electrode region 12 of two rows of vertically adjacent resistive regions 10 are opposite, and the first electrode region 11 of the resistive region 10 may be connected to the second electrode region 12 of the adjacent resistive region 10 through the connection region 20. It is understood here that the structure of the connection region 20 as described above may also exist between the first electrode region 11 and the second electrode region 12 corresponding to the two adjacent resistive regions 10 in the second direction, which corresponds to the beneficial effect of the connection region 20 as described above.

Further, in the present embodiment, the first electrode regions 11 are equal in size to the second electrode regions 12, and a straight line where each of the first electrode regions 11 meets the corresponding connected connection region 20 is parallel to a straight line where the second electrode region 12 meets the corresponding connected connection region 20.

It is to be understood that, in the present embodiment, to better set the shape of the connection region 20, the first electrode region 11 and the second electrode region 12 may be equally large regions with the same pattern, and may specifically be two equally large rectangles that can be horizontally overlapped. Correspondingly, the connection region 20 should also be rectangular between the first electrode region 11 and the second electrode region 12, such that the line of connection of the first electrode region 11 to the connection region 20 is parallel to the line of connection of the second electrode region 12 to the connection region 20. The structure is more convenient for program setting of a cutting machine in the cutting process flow and program setting of other processing machines in other flows, and improves the processing efficiency or the manufacturing efficiency of the resistance element.

The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but is intended to cover all equivalent structures modifications, direct or indirect application in other related arts, which are included in the scope of the present invention.

Claims (10)

1. A resistive motherboard, the resistive motherboard comprising:

a plurality of resistor areas and a plurality of connecting areas, wherein both sides of each resistor area are respectively provided with a first electrode area and a second electrode area;

The second electrode region of the resistance region is connected with the first electrode region of the next resistance region through the connection region;

the connecting width of the connecting region, the electrode widths of the first electrode region and the second electrode region are equal;

And the connecting region is used for filling the second electrode region or the first electrode region at the other end of the resistance region when the first electrode region or the second electrode region at one end of the resistance region is partially cut off so as to form a new resistance region with the same size as the resistance region.

2. The resistive motherboard of claim 1, wherein said resistive region comprises: a first conductor, a resistor, and an insulating layer;

The first conductors are located in the first electrode area and the second electrode area, the first conductors located at two ends of the resistor area are electrically connected through resistors, and the surface of each resistor is covered with the insulating layer.

3. The resistive motherboard of claim 2, wherein said resistor body is disposed between said first electrode region and said second electrode region within said resistive region and does not extend beyond each side of said resistive region.

4. A resistive motherboard according to claim 2, wherein the resistive areas not covered by the first electrical conductor and the resistive body are provided with the insulating layer.

5. The resistive motherboard of claim 2, wherein said resistor is patterned, and wherein said resistor has a shape that is a predetermined pattern.

6. The resistive motherboard of claim 2, wherein said resistor body is not patterned.

7. The resistive motherboard of claim 2, wherein said first conductor does not completely cover said first electrode region and said second electrode region, said first electrode region and said second electrode region not covering said first conductor being provided with said insulating layer.

8. The resistive motherboard of claim 2, wherein said connection region comprises: a second conductor;

The second conductor is electrically connected with the first conductors of the first electrode region and the second electrode region which are connected with each other.

9. The resistive motherboard of claim 8, wherein said connection region further comprises: an insulating layer;

the second conductor does not completely cover the connection region, and the insulating layer is arranged on the surface of the connection region which is not covered by the second conductor.

10. The resistive motherboard of claim 8, wherein said first electrical conductor is a different material than said second electrical conductor.