CN117906827A - Core unit and differential pressure sensor - Google Patents
Core unit and differential pressure sensor Download PDFInfo
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- CN117906827A CN117906827A CN202310506797.1A CN202310506797A CN117906827A CN 117906827 A CN117906827 A CN 117906827A CN 202310506797 A CN202310506797 A CN 202310506797A CN 117906827 A CN117906827 A CN 117906827A
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- pressure
- chip
- core unit
- electrically connected
- sealing
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- 238000007789 sealing Methods 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 11
- 239000004033 plastic Substances 0.000 claims abstract description 9
- 229920003023 plastic Polymers 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000012945 sealing adhesive Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The application discloses a core unit with low cost and higher packaging degree and a differential pressure sensor comprising the core unit. The core unit includes: the packaging body is made of plastic with low thermal expansion coefficient, one side of the packaging body is adhered with a pressure chip, a pressure sensing circuit and a processing circuit which are electrically connected are integrated on the pressure chip, the packaging body is positioned on the same side and/or opposite sides of the pressure chip and protrudes outwards to form a sealing flange, and the pressure chip is positioned on the inner side of the sealing flange on the same side; and a plurality of connection terminals encapsulated in the encapsulation body and electrically connected with the processing circuit.
Description
Technical Field
The application relates to the technical field of pressure sensors, in particular to a core unit and a differential pressure sensor.
Background
Pressure sensors are sensors for measuring the pressure of an environment or medium, and MEMS (microelectromechanical systems) are currently widely used due to low cost and small volume, which measure the pressure by the piezoresistive effect of semiconductor silicon. The middle part of the silicon core body is provided with a film shape, the pressure applied to the silicon film on two sides changes the resistance value of the doped resistor on the silicon film, and a current or voltage signal output by a measuring circuit formed by connecting a plurality of resistors can be further processed by a conditioning circuit and then the measuring result is output. When a vacuum cavity is arranged on one side of the diaphragm in the silicon chip, the measured pressure is the pressure applied by the other side relative to the vacuum pressure, namely the absolute pressure; when atmospheric pressure is introduced into one side of the diaphragm, the measured pressure is the pressure relative to the atmosphere, namely gauge pressure; when other pressures are respectively introduced to the two sides of the diaphragm, the measured pressure is the difference between the pressures of the two sides, namely the differential pressure. The pressure core can be arranged on a ceramic matrix or a metal matrix with a special thermal expansion coefficient to avoid precision reduction and even stress damage caused by temperature expansion coefficient mismatch, and the conditioning circuit is arranged on a printed circuit board fixed with the matrix.
In general, the ceramic substrate and the printed circuit board are bonded together, which leads to an increase in production cost, and the pressure core has poor versatility due to insufficient packaging.
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Disclosure of Invention
In order to overcome the defects in the prior art, the application provides a core unit which has lower production cost and higher packaging degree.
To achieve the above object, the present application provides a core unit comprising:
The packaging body is made of plastic with low thermal expansion coefficient, one side of the packaging body is adhered with a pressure chip, a pressure sensing circuit and a processing circuit which are electrically connected are integrated on the pressure chip, the packaging body is positioned on the same side and/or opposite sides of the pressure chip and protrudes outwards to form a sealing flange, and the pressure chip is positioned on the inner side of the sealing flange on the same side;
and a plurality of connection terminals encapsulated in the encapsulation body and electrically connected with the processing circuit.
Preferably, it comprises: the thermal expansion coefficient of the plastic is 2 ppm-10 ppm.
Preferably, the pressure chip is adhered in a chip mounting groove formed on the surface of the corresponding side of the package body, a plurality of bonding pads electrically connected with the pressure sensing circuit are arranged around the chip mounting groove, the pressure chip is electrically connected with the bonding pads through wires, and first protection gel is filled in the chip mounting groove.
Preferably, the package body is provided with a pressure receiving hole for providing a reference pressure to the pressure chip.
Preferably, the pressure receiving hole is filled with a second protective gel.
Preferably, the same side and/or the opposite side of the package body located on the pressure chip are outwards protruded to form a glue separating ring, and the glue separating ring is located on the inner side of the sealing flange on the same side.
The present application also provides a differential pressure sensor comprising:
The shell is internally provided with a mounting cavity and two pressure cavities, the bottom of the mounting cavity is provided with a mounting surface, two through holes which are communicated with the two pressure cavities in one-to-one correspondence are formed in the mounting surface, and two second sealing grooves which are correspondingly arranged around the two through holes in one-to-one correspondence are formed in the mounting surface;
The two core units as claimed in any one of claims to arranged at the bottom of the mounting cavity, and the two core units are plugged at the upper ends of the two through holes in a one-to-one correspondence manner; one side of the pressure chip is communicated with the corresponding pressure cavity or communicated with the corresponding pressure cavity through the pressure receiving hole, and a sealing flange of the core unit, which faces to one side of the second sealing groove, is fixed in the corresponding second sealing groove through second sealing adhesive;
The two pressure input ports to be measured are arranged on the shell and are communicated with the two pressure cavities in a one-to-one correspondence manner;
and a plurality of pins fixed on the housing and electrically connected with a plurality of connection terminals of the pressure chips of the two core units.
Preferably, the plurality of pins are electrically connected to the plurality of connection terminals through a plurality of electrical connectors integrally formed within the housing.
Preferably, the shell comprises a shell body and an upper cover, the upper end of the shell body forms a circle of first sealing groove, the upper cover comprises a cover plate and a circle of first sealing flange formed by downwards protruding the periphery of the cover plate, and the first sealing flange is fixed in the first sealing groove through first bonding sealant.
Preferably, the underside of the cover plate is provided with a plurality of reinforcing ribs; the inner side and the outer side of the first sealing groove of the first sealing flange correspondingly form a circle of inner peripheral wall and a circle of outer peripheral wall, and the inner peripheral wall is provided with a yielding groove for yielding the reinforcing rib.
Drawings
FIG. 1 is an exploded view of a differential pressure sensor according to a first embodiment of the present application;
FIG. 2 is a perspective view (with the upper cover removed) of a differential pressure sensor according to a first embodiment of the present application;
FIG. 3 is a cross-sectional view of a differential pressure sensor according to a first embodiment of the application;
Fig. 4 is a perspective view of a core unit according to a first embodiment of the present application;
fig. 5 is a cross-sectional view of a core unit of a first embodiment of the present application;
FIG. 6 is a perspective view showing a part of the structure of a differential pressure sensor according to a first embodiment of the present application;
fig. 7 is a cross-sectional view of a core unit of a second embodiment of the present application;
Fig. 8 is a cross-sectional view of a core unit of a third embodiment of the present application;
fig. 9 is a cross-sectional view of a core unit of a fourth embodiment of the present application;
Fig. 10 is a cross-sectional view of a core unit of a fifth embodiment of the present application;
In the figure: 100. a differential pressure sensor; 101. a housing; 102. a mounting part; 103. a connecting bushing; 104a, pins; 104b, pins; 104c, inserting needles; 104. an electrical connector; 1051. a peripheral wall; 1052. an inner peripheral wall; 105. a first seal groove; 106. a relief groove; 107. a mounting surface; 108. a through hole; 109a, a pressure chamber; 109. a pressure input port to be measured; 110a, electrical connections; 110b, electrical connections; 110c, electrical connections; 110. an electrical connection assembly; 111. a second seal groove; 201a, connection terminals; 201b, connection terminals; 201c, connection terminals; 201d, connection terminals; 202a, test terminals; 202b, test terminals; 202c, testing terminals; 20. a pressure receiving hole; 21. a package; 22a, a first support surface; 22b, a second support surface; 23. a chip mounting groove; 24a, a second sealing flange; 24b, a second sealing flange; 25. a first protective gel; 26. a pressure chip; 27. an electrical connection; 28. a wire; 29. a glue separating ring; 2. a core unit; 301. a cover plate; 302. a first sealing flange; 303. a convex portion; 304. a steel ball hole; 305. steel balls; 3. an upper cover;
Detailed Description
The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. The following examples are illustrative only and are not to be construed as limiting the application. In the following description, the same reference numerals are used to designate the same or equivalent elements, and duplicate descriptions are omitted.
In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships in which the product of the present application is conventionally put in use, or the directions or positional relationships in which those skilled in the art conventionally understand are merely for convenience of describing the present application and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present application.
In addition, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.
It should be further understood that the term "and/or" as used in the present description and the corresponding claims refers to any and all possible combinations of one or more of the listed items.
As shown in fig. 1 to 3. In the first embodiment of the present application, the differential pressure sensor 100 includes a housing including a case 101 and an upper cover 3. The upper end of the housing 101 forms a circular first seal groove 105. The upper cover 3 includes a cover plate 301 and a ring of first sealing flanges 302 formed by downwardly projecting the peripheral edge of the cover plate 301. The first seal flange 302 is secured within the first seal groove 105 by a first adhesive sealant. The housing 101 and the upper cover 3 enclose a mounting cavity (not labeled). Preferably, the underside of the cover plate 301 is provided with a plurality of reinforcing ribs. The first seal flange 302 defines a ring of inner walls 1052 and a ring of outer walls 1051 on opposite sides of the first seal groove 105. The inner wall 1052 is provided with a yielding groove 106 for yielding the reinforcing rib. A plurality of protrusions 303 may be formed on the outer wall of the first seal flange 302 to protrude outward to mate with the first seal groove 105 to aid in positioning. The cover plate 301 can be provided with a steel ball hole 304, steel balls 305 are blocked in the steel ball hole 304, and sealant is covered outside the steel balls 305.
Wherein two pressure chambers 109a are formed in the housing 101. The casing 101 is provided with two pressure input ports 109 to be measured, which are communicated to the two pressure chambers 109a in a one-to-one correspondence to convey pressure medium into the pressure chambers 109a. The bottom of the mounting cavity forms a mounting surface 107. The mounting surface 107 is provided with two through holes 108 which are communicated to the two pressure chambers 109a in one-to-one correspondence. Two second seal grooves 111 are formed on the mounting surface 107 around the two through holes 108 in one-to-one correspondence.
The differential pressure sensor 100 of the present embodiment further includes two core units 2 disposed at the bottom of the mounting chamber. Referring to fig. 4 to 5, two core units 2 of the present embodiment are plugged at the upper ends of two through holes 108 in a one-to-one correspondence. The core unit 2 comprises an encapsulation 21, the encapsulation 21 preferably being made of a plastic with a low Coefficient of Thermal Expansion (CTE), such as a Liquid Crystal Polymer (LCP) plastic or other modified engineering plastic, for example modified by adding particles or fibres with a negative coefficient of thermal expansion (e.g. ZrV 2O7、Li2Al2Si2O8 etc.) to the plastic. The thermal expansion coefficient of these plastics is preferably limited to 2ppm to 10ppm, so that cracking or peeling can be avoided even for larger-sized silicon-based chips.
A pressure chip 26 is bonded to one side of the package 21. Integrated on the pressure chip 26 are electrically connected pressure sensing circuitry and processing circuitry. The processing circuit may be used for signal amplification and analog-to-digital conversion and outputs a voltage signal outwards. Wherein, the same side of the package 21 located on the pressure chip 26 protrudes outwards to form a second sealing flange 24a, and the pressure chip 26 is located inside the sealing flange 24 a. The second seal flange 24a is fixed in the second seal groove 111 by a second sealant (not shown). The pressure chip 26 may be an absolute pressure chip, that is, absolute pressure of pressure medium introduced through two pressure input ports 109 to be measured is measured respectively, and the difference between the absolute pressure and the absolute pressure is calculated by a processing circuit of one of the pressure chips 26.
One end of the plurality of connection terminals 201a, 201b, 201c is packaged in the package 21 for power supply and signal output of the pressure chip 26. The voltage signal measured by one of the core units 2 is transmitted to the processing circuit of the other core unit through a plurality of connection terminals 201a, 201b, 201c integrally formed on the housing 101 to perform a process such as taking a difference, and then is output to an external device through a plurality of pins 104a, 104b, 104c fixed on the housing. Wherein pins 104a, 104b, 104c are also used by external devices to power pressure die 26.
The core unit 2 of the second embodiment is obtained by performing a small change on the basis of the first embodiment, as shown in fig. 7, the package 21 is further provided with a pressure receiving hole 20 for providing a reference pressure to the pressure chip 26, the pressure chip 26 may be a differential pressure chip, the core unit measures a relative pressure with respect to the reference pressure, and the processing circuit of one of the pressure chips 26 calculates the difference between the two relative pressures. The pressure receiving bore 20 may have a second protective gel encapsulated therein.
With a slight modification to the second embodiment, the core unit 2 of the third embodiment is provided with a second sealing flange 24b protruding outward on the opposite side of the package 21 from the pressure chip 26, as shown in fig. 8. In this way, the pressure receiving hole 20 can be formed on the package body 21, and the package body 21 can be installed upside down, and at this time, a ring of glue isolating ring 29 can be formed by protruding outwards on the side of the second sealing flange 24b, so as to protect the pressure receiving hole 20 from being blocked by the second sealing glue.
The core unit 2 of the fourth embodiment can be obtained with a small variation on the basis of the second embodiment, and as shown in fig. 9, the second sealing flange 24b and the rubber barrier ring 29 can be omitted in this embodiment.
The core unit 2 of the fifth embodiment may be obtained by making a small variation on the fourth embodiment, and as shown in fig. 10, the pressure receiving hole 20 may be further omitted in this embodiment, and the pressure chip 26 may be an absolute pressure chip.
As mentioned above, a single core unit 2 as described above may also be used to measure absolute, gauge or differential pressure. The application itself should not be limited to the differential pressure sensor shown in the present application.
The first protective gel and the second protective gel may be fluorosilicone gel.
The scope of the present disclosure is not limited by the detailed description. But by the claims and their equivalents. And all modifications that come within the scope of the claims and equivalents thereto are intended to be embraced therein.
Claims (10)
1. A core unit, comprising:
A package body (21) made of plastic with low thermal expansion coefficient, one side of which is adhered with a pressure chip (26), wherein a pressure sensing circuit and a processing circuit which are electrically connected are integrated on the pressure chip (26), the same side and/or opposite side of the package body (21) positioned on the pressure chip (26) are outwards protruded to form a sealing flange (24 a/24 b), and the pressure chip (26) is positioned on the inner side of the sealing flange (24 a/24 b) on the same side;
and a plurality of connection terminals (201 a,201b,201c,201 d) encapsulated in the encapsulation body (21), which are electrically connected with the processing circuit.
2. The core unit according to claim 1, comprising: the thermal expansion coefficient of the plastic is 2 ppm-10 ppm.
3. The core unit according to claim 1, wherein the pressure chip (26) is adhered in a chip mounting groove (23) formed on a corresponding side surface of the package body (21), a plurality of bonding pads electrically connected with the pressure sensing circuit are arranged around the chip mounting groove (23), the pressure chip (26) is electrically connected with the bonding pads through wires (28), and a first protection gel (25) is encapsulated in the chip mounting groove (23).
4. The core unit according to claim 1, wherein the package (21) is provided with a pressure receiving hole (20) for providing a reference pressure to the pressure chip (26).
5. The core unit according to claim 4, wherein the pressure receiving hole (20) is filled with a second protective gel.
6. The core unit according to claim 1, characterized in that the same side and/or the opposite side of the package (21) on the pressure chip (26) is outwardly convex forming a glue barrier ring (29), the glue barrier ring (29) being located inside the sealing flange on the same side.
7. A differential pressure sensor, comprising:
The shell is internally provided with a mounting cavity and two pressure cavities (109 a), the bottom of the mounting cavity is provided with a mounting surface (107), the mounting surface (107) is provided with two through holes (108) which are communicated with the two pressure cavities (109 a) in one-to-one correspondence, and the mounting surface (107) is provided with two second sealing grooves (111) which are correspondingly surrounded around the two through holes (108) in one-to-one correspondence;
The two core units (2) as claimed in any one of claims 1 to 6 arranged at the bottom of the mounting cavity, wherein the two core units (2) are plugged at the upper ends of the two through holes (108) in a one-to-one correspondence manner; one side of the pressure chip (26) is communicated with a corresponding pressure cavity (109 a), or is communicated with the corresponding pressure cavity (109 a) through the pressure receiving hole (20), and a sealing flange (24 a/24 b) of the core unit (2) facing one side of the second sealing groove (111) is fixed in the corresponding second sealing groove (111) through second sealing adhesive;
two pressure input ports (109) to be measured, which are arranged on the shell (101), are communicated with the two pressure cavities (109 a) in a one-to-one correspondence manner;
and a plurality of pins (104 a,104b,104 c) fixed to the housing and electrically connected to a plurality of connection terminals (201 a,201b,201c,201 d) of the pressure chip (26) of the two core units (2).
8. The differential pressure sensor of claim 7, wherein the plurality of pins (104 a,104b,104 c) are electrically connected to the plurality of connection terminals (201 a,201b,201c,201 d) through a plurality of electrical connectors (110 a) integrally formed within the housing.
9. The differential pressure sensor according to claim 7, wherein the housing comprises a case (101) and an upper cover (3), the upper end of the case (101) forms a ring of first seal grooves (105), the upper cover (3) comprises a cover plate (301) and a ring of first seal flanges (302) formed by downwardly protruding peripheral edges of the cover plate (301), and the first seal flanges (302) are fixed in the first seal grooves (105) by first adhesive sealant.
10. The differential pressure sensor according to claim 9, characterized in that the underside of the cover plate (301) is provided with a plurality of stiffening ribs; the inner side and the outer side of the first sealing groove (105) of the first sealing flange (302) correspondingly form a circle of inner surrounding wall (1052) and a circle of outer surrounding wall (1051), and the inner surrounding wall (1052) is provided with a yielding groove (106) for yielding the reinforcing rib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310506797.1A CN117906827A (en) | 2023-05-07 | 2023-05-07 | Core unit and differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310506797.1A CN117906827A (en) | 2023-05-07 | 2023-05-07 | Core unit and differential pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117906827A true CN117906827A (en) | 2024-04-19 |
Family
ID=90682549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310506797.1A Pending CN117906827A (en) | 2023-05-07 | 2023-05-07 | Core unit and differential pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117906827A (en) |
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2023
- 2023-05-07 CN CN202310506797.1A patent/CN117906827A/en active Pending
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