CN117906823A

CN117906823A - Pressure sensor

Info

Publication number: CN117906823A
Application number: CN202310907130.2A
Authority: CN
Inventors: 王小平; 曹万; 王红明; 张超军; 贺方杰; 梁世豪
Original assignee: Wuhan Finemems Inc
Current assignee: Wuhan Finemems Inc
Priority date: 2023-07-21
Filing date: 2023-07-21
Publication date: 2024-04-19

Abstract

In order to omit the aluminum wire bonding procedure and improve the universality of product components, the application provides the following technical scheme: a pressure sensor, comprising: the shell is provided with an inserting port, a mounting cavity is formed in the shell, and the shell comprises a main shell, an upper cover and a lower cover, wherein the upper cover is bonded on the upper side of the main shell in a sealing way, and the lower cover is integrally connected or bonded on the lower side of the main shell in a sealing way; a pressure sensing assembly having at least one pressure sensitive element and a plurality of electrical contacts and disposed within the mounting cavity, the pressure sensing assembly being connected to the main housing or lower cover; at least one pressure joint integrally connected to the lower cover, wherein a pressure introducing channel is formed in the pressure joint, and one end of the inner side of the pressure introducing channel is hermetically connected to a pressure sensing surface of the pressure sensitive element; the terminal button component is used for being electrically connected with an interface of external equipment and comprises a terminal button inserted in the inserting port and a plurality of metal pins connected to the terminal button, and one ends of the metal pins extend into the mounting cavity and are correspondingly electrically connected with the electric contact part.

Description

Pressure sensor

Technical Field

The application relates to the technical field of sensors, in particular to a pressure sensor.

Background

Pressure sensors are sensors for measuring the pressure of an environment or medium, which are currently implemented by MEMS (microelectromechanical systems), i.e. by the piezoresistive effect of semiconductor silicon. The middle part of the silicon core body is provided with a film shape, the pressure applied to the silicon film on two sides changes the resistance value of the doped resistor on the silicon film, and a current or voltage signal output by a measuring circuit formed by connecting a plurality of resistors can be further processed by a conditioning circuit and then the measuring result is output. When a vacuum cavity is arranged on one side of the diaphragm in the silicon chip, the measured pressure is the pressure applied by the other side relative to the vacuum pressure, namely the absolute pressure; when atmospheric pressure is introduced into one side of the diaphragm, the measured pressure is the pressure relative to the atmosphere, namely gauge pressure; when other pressures are respectively introduced to the two sides of the diaphragm, the measured pressure is the difference between the pressures of the two sides, namely the differential pressure. In some other sensors, a temperature sensitive element may also be integrated to measure both the pressure and temperature of the medium.

These pressure sensors, as shown in CN109506828A, CN115790957A, CN218781935U, typically comprise a main housing and an upper cover made of plastic. The housing is internally provided with a mounting space for placing the pressure measuring component, a mechanical mounting part is integrally connected to the housing so as to be mechanically mounted on external equipment, a plug-in end button is integrally connected to the housing so as to be electrically connected with the external equipment, and at least one pressure interface is integrally connected to the housing so as to receive fluid medium from a medium container to be measured and couple the fluid medium with the pressure measuring component; other pressure sensors, such as that shown in CN218822926U, also include positioning structures to guide the positioning tube, etc. to assist in its installation on an external setting. On the other hand, since some non-standard designs of subsystems using pressure sensors (e.g. vehicle oil supply system, vehicle exhaust system) require that the pressure sensors have different structural parameters, in particular the length, aperture, axial spacing size and angle of the pressure ports, two opposite side arranged and communicating pressure ports in turn communicating as shown in CN 107830965A; in addition, due to the differences in application scenes, manufacturing standards, space arrangement and the like, different requirements are also placed on the structure and shape of the plug end button, such as the inclined plug end button shown in CN107588889 a. Because the main shell has a shape structure with a large number, the injection molding and die opening cost is high, so that the universality of the pressure sensor is poor, and particularly, the shell needs to be repeatedly designed and die opened, so that the design and production cost is greatly increased. Wherein, the contact pin of the terminal button and the bonding pad of the pressure sensing component are generally required to be bonded and connected with aluminum wires or aluminum strips by a bonding machine.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

Disclosure of Invention

In view of the shortcomings of the prior art, the present application provides a pressure sensor that addresses at least one of the shortcomings described above.

In order to omit the aluminum wire bonding procedure and improve the universality of product components, the application provides the following technical scheme: a pressure sensor, comprising:

The shell is provided with an inserting port, a mounting cavity is formed in the shell, and the shell comprises a main shell, an upper cover and a lower cover, wherein the upper cover is bonded on the upper side of the main shell in a sealing way, and the lower cover is integrally connected or bonded on the lower side of the main shell in a sealing way;

a pressure sensing assembly having at least one pressure sensitive element and a plurality of electrical contacts and disposed within the mounting cavity, the pressure sensing assembly being connected to the main housing or lower cover;

At least one pressure joint integrally connected to the lower cover, wherein a pressure introducing channel is formed in the pressure joint, and one end of the inner side of the pressure introducing channel is hermetically connected to a pressure sensing surface of the pressure sensitive element;

The terminal button component is used for being electrically connected with an interface of external equipment and comprises a terminal button inserted in the inserting port and a plurality of metal pins connected to the terminal button, and one ends of the metal pins extend into the mounting cavity and are correspondingly electrically connected with the electric contact part.

In order to further reduce the cost, preferably, one end of the metal pin is electrically connected with the corresponding electrical contact part in a contact manner through a metal spring, a proximal end part of one end of the metal spring facing the electrical contact part is abutted on the electrical contact part, and the corresponding end of the metal spring is lifted towards the upper left to form a guiding part.

In order to enable electrical connection from the vertical direction, preferably, one end of the metal pin is electrically connected with the corresponding electrical contact portion in a contact manner through a conductive spring, one end of the conductive spring is electrically contacted with one end of the inner side of the metal pin, the other end of the conductive spring is electrically contacted with the corresponding electrical contact portion, and a spring holding seat for holding the conductive spring is fixed on the end button assembly.

To further reduce costs, it is preferable that an interference fit be formed between the end button and the plug interface.

In order to improve the connection convenience, preferably, a plurality of buckles are formed at the inner end of the end button and buckled on a plurality of buckling parts formed on the inner wall of the shell.

In order to introduce atmospheric or ambient pressure into the mounting cavity through the end button and simultaneously avoid the intrusion of water vapor, preferably, the end button comprises a longitudinally extending cylindrical side wall and a bottom wall plugged at one end of the inner side of the side wall, the metal contact pin is integrally connected to the bottom, the inner end of the metal contact pin penetrates through the bottom wall inwards, and the outer side of the side wall is in sealing connection with the plug-in port; the bottom wall is provided with a vent hole communicated with the mounting cavity, and the inner side surface of the vent hole is adhered with a waterproof breathable film.

More preferably, the pressure sensing assembly is fixed to the upper surface of the lower cover.

To better adjust the dimensional matching of the components in the up-down direction, the pressure sensing assembly is preferably mounted on the upper surface of a base that is adhesively or integrally attached to the upper end of the lower cover.

In order to reduce the influence of the mounting stress on the pressure measurement, preferably, the pressure sensing assembly further comprises a ceramic circuit board, and the ceramic circuit board is hermetically adhered to the upper surface of the base station through a sealant; the pressure sensitive element and the electric contact parts are arranged on the upper surface of the ceramic circuit board; the opposite outer side of the base is thinned to a plate shape toward the upper side.

In order to measure the temperature of the medium simultaneously, preferably, the pressure sensor further comprises a temperature sensitive component, the temperature sensitive component comprises a temperature sensitive element arranged in one pressure introducing channel and close to the lower end part, two ends of the temperature sensitive element are respectively connected with a metal connecting piece, the metal connecting pieces penetrate through holes arranged in the base station and extend into the mounting cavity to be electrically connected with the ceramic circuit board, and sealant is arranged in the holes.

Drawings

FIG. 1 is a schematic diagram of a pressure sensor according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of a pressure sensor according to a second embodiment of the present invention;

FIG. 3 is a schematic diagram of a pressure sensor according to a third embodiment of the present invention;

FIG. 4 is a schematic diagram of a pressure sensor according to a fourth embodiment of the present invention;

FIG. 5 is a schematic diagram of a pressure sensor according to a fifth embodiment of the present invention;

In the figure: 100. a pressure sensor; 11b, a first cavity; 11c, a second cavity; 11. a housing; 121. a connection part; 12a, a plug interface; 12b, a second buckling part; 12c, mounting holes; 12d, a bushing; 12. a main housing; 131a, sealing adhesive; 131. a first sealing flange; 132a, a compression portion; 132b, a stopper; 132. a boss; 133. a first rib plate; 13a, a first buckling part; 13. an upper cover; 141a, sealing adhesive; 141. a second sealing flange; 14. a lower cover; 15a, pressure introduction channels; 15. a pressure joint; 16a, a glue groove; 16b, sealing adhesive; 16e, cavity; 16. a base station; 171a, pressure holes; 171. a ceramic circuit board; 172. a pressure sensitive element; 173. a surrounding frame; 174. protecting the gel; 175. a conditioning element; 176. other electronic components; 177a, sealing adhesive; 177. a sealing seat; 178. an electrical contact; 17. a pressure sensing assembly; 180a, sidewalls; 180b, sealing the flange; 180c, a sealing gasket; 180d, a bottom wall; 180. an end button; 181. a metal pin; 182a, a guide; 182. a metal spring plate; 183a, first clasp; 183b, a second catch; 18. an end button assembly; 200. a temperature and pressure sensor; 21a, a mounting cavity; 21. a housing; 221. a connection part; 22a, a plug interface; 22b, a second buckling part; 22c, mounting holes; 22d, a bushing; 22. a main housing; 23a, a first buckling part; 23. an upper cover; 241a, sealing adhesive; 241. a second sealing flange; 24. a lower cover; 25a, pressure introduction channels; 25. a pressure joint; 26a, a glue groove; 26b, sealing adhesive; 26e, cavity; 26. a base station; 271a, pressure holes; 271. a ceramic circuit board; 272. a pressure sensitive element; 273. a surrounding frame; 274. protecting the gel; 275. a conditioning element; 276. other electronic components; 278. an electrical contact; 27. a pressure sensing assembly; 280a, sidewalls; 280d, a bottom wall; 280e, a second stop; 280f, a waterproof breathable film; 280g, vent; 280. an end button; 281. a metal pin; 282a, a guide; 282. a metal spring plate; 283a, first clasp; 283b, a second clasp; 28. an end button assembly; 291. a temperature sensitive element; 292. a metal connector; 293. perforating; 294. a frame; 295. a third seal groove; 296. sealing and bonding glue; 29. a temperature sensitive component; 300. a pressure sensor; 31b, a first cavity; 31c, a second cavity; 31. a housing; 321. a connection part; 32a, a plug interface; 32b, a second fastening part; 32c, mounting holes; 32d, a bushing; 32. a main housing; 333. a second rib plate; 33a, a first fastening part; 33. an upper cover; 341a, sealing adhesive; 341. a second sealing flange; 34. a lower cover; 35a, a pressure introduction channel; 35. a pressure joint; 36a, a glue groove; 36b, sealing adhesive; 36e, cavity; 36. a base station; 371a, pressure holes; 371. a ceramic circuit board; 372. a pressure sensitive element; 373. a surrounding frame; 374. protecting the gel; 375. a conditioning element; 376. other electronic components; 37. a pressure sensing assembly; 380a, sidewalls; 380d, bottom wall; 380. an end button; 381. a metal pin; 382a, guide portion; 382. a metal spring plate; 383a, a first catch; 383b, a second buckle; 384. a fish eye contact pin; 385a, electrical contacts; 385b, fish-eye structure; 385. a fish eye contact pin; 38. an end button assembly; 394. a frame; 395. a third seal groove; 396. sealing and bonding glue; 400. a differential pressure sensor; 41a, a mounting cavity; 41. a housing; 421. a connection part; 42a, a plug interface; 42c, mounting holes; 42d, a bushing; 42. a main housing; 43. an upper cover; 441a, sealing adhesive; 441. a second sealing flange; 44a, a glue groove; 44b, sealing adhesive; 44. a lower cover; 45a, a pressure introduction channel; 45. a pressure joint; 46a, a glue groove; 46b, sealing adhesive; 46e, cavity; 46. a base station; 471a, pressure holes; 471. a ceramic circuit board; 472. a pressure sensitive element; 473. a surrounding frame; 474. protecting the gel; 475. a conditioning element; 476. other electronic components; 478. an electrical contact; 47. a pressure sensing assembly; 480a, sidewalls; 480d, bottom wall; 480. an end button; 481a, a flat portion; 481. a metal pin; 482. a conductive spring; 483. a buckle; 484. a spring holder; 48. an end button assembly; 500. a pressure sensor; 51a, a mounting cavity; 51. a housing; 521. a connection part; 52a, a plug interface; 52c, mounting holes; 52d, a bushing; 52. a main housing; 53. an upper cover; 541a, sealing adhesive; 541. a second sealing flange; 54a, a glue groove; 54b, sealing adhesive; 54. a lower cover; 55a, pressure introduction channels; 55. a pressure joint; 56a, a glue groove; 56b, sealing adhesive; 56e, cavity; 56. a base station; 571a, pressure holes; 571. a ceramic circuit board; 572. a pressure sensitive element; 573. a surrounding frame; 574. protecting the gel; 575. a conditioning element; 576. other electronic components; 578. an electrical contact; 57. a pressure sensing assembly; 580a, sidewalls; 580d, a bottom wall; 580. an end button; 581a, a flat portion; 581. a metal pin; 582. a conductive spring; 583. a buckle; 584. a spring holder; 58. an end button assembly; 594. a frame; 595. a third seal groove; 596. sealing and bonding glue;

Detailed Description

The following definitions of terms shall apply throughout this application:

The terms "upper", "lower", "left", "right", "front", "rear", "inner", "outer", "far", "near", and combinations thereof, etc. refer to an azimuth or positional relationship based on that shown in the drawings, or that is conventionally put in place when the product of the present application is used, or that is conventionally understood by those skilled in the art, merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific azimuth, be configured, operated, and used in a specific azimuth, and thus should not be construed as limiting the present application; the terms "horizontal" and "horizontal" refer to directions or planes substantially perpendicular to the directions of gravitational force when the special relationship between the horizontal and the gravitational force is not defined, and "vertical" and "horizontal" refer to two directions perpendicular to the horizontal when the plane is not defined;

The term "and/or" refers to any and all possible combinations of one or more of the listed items;

The terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art;

The term "comprising" is intended to include, but not be limited to, and should be interpreted in the manner commonly used in the patent context;

The terms "about" or "approximately" and the like, when used with a number, may mean the particular number, or alternatively, a range approaching the particular number as understood by those skilled in the art; and if the specification states a component or feature "may", "might", "could", "preferred", "preferably", "best", "particularly", "typically", "optionally", "e.g", "often", "particularly" (or other such words) be included or has a particular characteristic, then that particular component or feature is not necessarily included or has that characteristic, but is optional, i.e., such component or feature may optionally be included in some embodiments, or may be excluded;

The phrases "in one embodiment," "according to one embodiment," "in other embodiments," and the like generally mean that a particular feature, structure, or characteristic described in connection with the phrase may be included in at least one embodiment of the present invention and may be included in more than one embodiment of the present invention (importantly, such phrases do not necessarily refer to the same embodiment); if the specification describes something as "exemplary" or "example," it is to be understood as referring to a non-exclusive example;

The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. The following examples are illustrative only and are not to be construed as limiting the application. In the following description, the same reference numerals are used to designate the same or equivalent elements, and duplicate descriptions are omitted.

As shown in fig. 1, a first embodiment of the present application provides a pressure sensor 100. The pressure sensor 100 includes a housing 11, with a mounting cavity formed in the housing 11 for mounting the pressure sensing assembly 17. The housing 11 specifically includes a main housing 12, upper and lower covers 13 and 14 respectively sealingly attached to the upper and lower sides of the housing 11, and a knob assembly 18 sealingly combined to the right end of the main housing 12 toward the left. The terminal button assembly 18 includes a terminal button 180 and a plurality of metal pins 181 integrally formed on the terminal button 180. The left end (i.e., the inner end) of the end button 180 is inserted into the insertion opening 12a formed at the right end of the housing 31, and the end button 180 includes a tubular side wall 180a extending longitudinally and a bottom wall 180d blocked at the left end of the side wall 180 a. The metal pins 181 extend from left to right and penetrate through the bottom wall 180d, and the left ends thereof are electrically connected with the pressure sensing component 17 in a contact manner; the junction of the bottom wall 180d and the metal pins 181 may be coated with a sealant.

The pressure sensing component 17 may include a ceramic circuit board 171, a pressure sensing element 172 disposed on an upper surface of the ceramic circuit board 171, and a plurality of electrical contacts 178, where the electrical contacts 178 are preferably plate-shaped and disposed parallel to the upper surface of the ceramic circuit board 171. At least one pressure joint 15 is integrally connected to the lower end of the lower cover 14, and a pressure introduction passage 15a is provided in the pressure joint 15, and the lower end of the pressure introduction passage 15a is connected to a pipe or a container containing a medium to be measured. The ceramic circuit board 171 is provided with a pressure hole 171a, the pressure sensitive element 172 is connected to the upper surface of the ceramic circuit board 171 in an adhesive manner, the first sensing surface of the pressure sensitive element is blocked at the upper end of the pressure hole 171a, and the lower end of the pressure hole 171a is in sealing butt joint with the upper end of the pressure introducing channel 15 a. The ceramic circuit board 171 may be sealingly adhered to the upper end surface fixed to the lower cover 14 directly by the sealing adhesive 16b with a seal formed between the lower end of the pressure hole 171a and the upper end of the pressure introducing passage 15a, or preferably, a glue groove 16a surrounding the pressure introducing passage 15a to accommodate the sealing adhesive 16b is provided on the upper end surface of the lower cover 14 with a seal formed between the lower end of the pressure hole 171a and the upper end of the pressure introducing passage 15 a. The pressure sensor 172 may be any suitable pressure sensor known in the art, such as a strain gauge pressure sensor, or preferably a semiconductor pressure chip. Pressure sensing element 172 and conditioning element 175 are connected to ceramic circuit board 171 by leads. Pressure sensing element 172 and conditioning element 175 are electrically connected to ceramic circuit board 171 by leads.

The benefit of this configuration of the present embodiment is that one can easily replace the different end button assemblies 18 that have been made for different device interfaces, or the end button assemblies 18 can be made otherwise at a lower cost than the prior art configuration in which the end buttons 180 are integrally connected to the main housing 12, without the need to remanufacture the main housing 12 and the structure integrally connected thereto; secondly, compared with the prior art that the bonding pad on the pressure sensing component 17 and the inner end of the metal pin 181 are electrically connected by an aluminum wire bonding process, the aluminum wire bonding or similar process can be omitted; thirdly, compared with the prior art that the pressure sensing component 17 is arranged on a concave (relative to the upper end opening) structure formed in the main shell 12 and the upper cover is arranged at the same time, the dispensing operation can be more conveniently performed by arranging the pressure sensing component 17 on the upper surface of the lower cover 14; fourth, since the terminal 180 is usually plugged into the socket of the external device when in use, even if no additional sealing is performed between the terminal 180 and the main housing 12, the corrosive media such as water vapor in the environment are difficult to enter the installation cavity, and compared with the prior art, the waterproof and breathable film is additionally provided to block the corrosive media such as water vapor in the environment, so that the manufacturing process can be simplified.

Preferably, the upper end of the main housing 12 is provided with an upper end opening (not marked) corresponding to the upper cover 13, a first sealing groove (not marked) is formed around the upper end opening, the upper cover 13 protrudes towards one side of the main housing 12 to form a circle of first sealing flange 131, and the first sealing flange 131 protrudes into the first sealing groove and is bonded and sealed by sealing adhesive 131 a. Similarly, the lower end of the main housing 12 is provided with a lower end opening (not labeled) corresponding to the lower cover 14, a second sealing groove (not labeled) is formed around the lower end opening, the lower cover 14 protrudes toward one side of the main housing 12 to form a circle of second sealing flange 141, and the second sealing flange 141 protrudes into the second sealing groove and is bonded and sealed by the sealing adhesive 141 a. In other embodiments, the sealing flange and the sealing groove are not necessary, and for example, a corresponding sealant may be applied to the connection surface of the upper cover 13 or the lower cover 14 and the main housing 12 and the adjacent surface thereof, so that simple sealing bonding may be performed.

In another embodiment, the ceramic circuit board 171 and the lower cover 14 may be indirectly connected through a base 16, in which case the sealant 16b and the sealant groove 16a may be provided on the upper surface of the base 16, the ceramic circuit board 171 is sealingly adhered to the upper end surface of the base 16 through the sealant 16b, and the upper end of the pressure introduction passage 15 extends into the base 16 and communicates to the lower end of the pressure hole 171a through the vertically penetrating cavity 16e provided in the base 16.

The upper surface of the ceramic circuit board 171 is also provided with conditioning elements 175 or conditioning circuitry is integrated on pressure sensitive elements 172 made of semiconductor material. The upper surface of the ceramic circuit board 171 may also be provided with other electronic components 176. Preferably, a surrounding frame 173 is fixed on the upper surface of the ceramic circuit board 171 to surround the surrounding frame 173 of the pressure sensitive element 172 and/or the conditioning element 175, and a protective gel 174 may be encapsulated in the surrounding frame 173. In other embodiments, the upper opening of the pressure introducing channel 15a is relatively enlarged, so that pressure impact caused by pressure fluctuation of the medium to be measured can be buffered, and the pressure sensitive element 172, the surrounding frame 173 and the protective gel 174 can be disposed on the lower surface of the ceramic circuit board 171; at this time, when the pressure sensitive element 172 is an absolute pressure chip, the pressure hole 171a may be omitted, so that the risk of the pressure medium to be measured penetrating from the pressure hole 171a into the mounting cavity to corrode electronic components other than the pressure sensitive element 172 is avoided. In other embodiments, the pressure sensing component 17 may also be directly or indirectly secured to the inside of the upper cover 13 or the left side inner wall of the main housing 12.

To prevent the end knob 180 from being separated from the socket 12a, an interference fit may be formed between the outer portion of the side wall 180a and the socket 12a, or alternatively, a plurality of buckles may be fixed at the left end of the end knob 180 to form a buckle connection with a plurality of buckling portions correspondingly formed on the inner walls of the respective components of the housing 11, for example, the inner wall of the upper cover 13 protrudes toward the inside of the installation cavity to form a first buckling portion 13a and/or a second buckling portion 12b formed on the inner wall of the lower opening of the main housing 12, and a first buckle 183a fixed at the left end of the end knob 180 is buckled on the first buckling portion 13a and/or a second buckle 183b fixed at the left end of the end knob 180 is buckled on the second buckling portion 12 b. It should be appreciated that these snaps may be provided at any suitable location on the main housing 12. Typically, the left end of the main housing 12 is provided with a connection portion 121, the connection portion 121 is provided with a mounting hole 12c, and the mounting hole 12c is provided with a bush 12d therein to facilitate mechanical mounting on an external device.

In order to limit the insertion depth of the end button 180, the left end of the first buckle 183a may abut or abut against the first stop portion 132b of a protruding portion 132 formed on the inner wall of the upper cover 13 to protrude toward the inside of the installation cavity, and the left end of the second buckle 183b may abut or abut against the side wall of the lower cover 14 or the base 16; additionally or alternatively, the outer portion of the side wall 180a protrudes outwardly to form a sealing flange 180b, and the inner edge of the socket 12a is recessed downwardly to form a sealing groove, in which a gasket 180c is disposed, so that an additional seal is formed between the outer wall of the terminal 180 and the main housing 12, to better prevent moisture in the environment from entering the mounting cavity and corroding the electronic components.

Wherein the electrical contact 178 may make electrical contact with an inner end of the metal pin 181 by: one end of the inner side of the metal pin 181 is abutted or integrally connected with an elastic metal piece, and the other end of the elastic metal piece is abutted on the corresponding electric contact part 178. The elastic metal member may be a metal spring 182, where a proximal end of one end of the metal spring 182 facing the electrical contact 178 abuts against the electrical contact 178, and a corresponding end of the metal spring 182 is lifted (e.g. warped, inclined, etc.) to form a guiding portion 182a, so as to guide the metal spring 182 when the end button assembly 18 is inserted into the socket 12 a. Preferably, the protruding portion 132 may be formed from the inner wall of the main housing 12 toward the side of the electrical contact portion 178, and the metal spring piece 182 may have a pressing portion 132a pressed against the middle portion of the metal spring piece 182 with a certain pressure. In other embodiments, the elastic metal member may be a conductive spring (not shown), where one end of the conductive spring is electrically contacted to an inner end of the metal pin 181, and the other end is electrically contacted to the corresponding electrical contact portion 178; a spring holder (not shown) for holding each conductive spring is also fixed to the upper surface of the ceramic circuit board 171. The protruding portion 132 is preferably disposed on the inner side of the inner wall of the lower opening, so that the upper cover 13 and the main housing 12 can be easily integrally formed.

In other embodiments, the mounting cavity may be further divided into a first cavity 11b and a second cavity 11c by a first partition structure, and the second cavity 11c is close to and connected to the plug port 12a, and all or part of the other electronic components 176 are located in the second cavity 11 c. This allows for better isolation of other electronic components 176 from the pressure medium to be tested, especially high temperature acid gases, such as automobile exhaust. Preferably, the first blocking structure includes a first rib 133 formed by downwardly protruding the upper cover 13 and a sealing seat 177 fixed to the upper surface of the ceramic circuit board 171. The seal seat 177 includes at least two plate-shaped portions (not labeled) located on both sides of the first rib plate 133 in the thickness direction, and a seal adhesive 177a is filled between the two plate-shaped portions. Wherein, the two plate-shaped parts can be integrally connected or respectively fixed on the upper surface of the ceramic circuit board 171; in particular, the plate-shaped portion may be formed by stacking and curing quick-setting glue layer by layer.

As shown in fig. 2, a second embodiment of the present application provides a pressure sensor integrated with a temperature sensitive element, i.e., a temperature pressure sensor 200. The temperature and pressure sensor 200 includes a housing 21, and a mounting cavity 21a for mounting the pressure sensing component 27 is formed in the housing 21. The housing 21 specifically includes a main housing 22, upper and lower covers 23 and 24 respectively sealingly attached to upper and lower sides of the housing 21, and an end button assembly 28 sealingly combined to the right end of the main housing 22 toward the left, wherein the upper cover 23 is integrally attached to the main housing 22. The terminal assembly 28 includes a terminal 280 and a plurality of metal pins 281 integrally formed on the terminal 280. The left end (i.e., the inner end) of the end button 280 is inserted into the insertion opening 22a formed at the right end of the main housing 32, and the end button 280 includes a tubular side wall 280a extending longitudinally and a bottom wall 280d plugged at the left end of the side wall 280 a. The metal pins 281 extend from side to side and penetrate through the bottom wall 280d, and the left ends thereof are electrically connected to the pressure sensing component 27 in a contact manner.

The pressure sensing component 27 may include a ceramic circuit board 271, a pressure sensing element 272 disposed on an upper surface of the ceramic circuit board 271, and a plurality of electrical contacts 278, wherein the electrical contacts 278 are preferably plate-shaped and disposed parallel to the upper surface of the ceramic circuit board 271. At least one pressure joint 25 is integrally connected to the lower end of the lower cover 24, a pressure introduction passage 25a is provided in the pressure joint 25, and the lower end of the pressure introduction passage 25a is connected to a pipe or a container containing a medium to be measured. The ceramic circuit board 271 is fixedly integrally connected to the upper surface of a base 26 connected to the upper end of the lower cover 24, that is, the ceramic circuit board 271 is fixed to the upper end of the base 26, the lower end of the base 26 is integrally connected to the upper end of the lower cover 24, and the inner end of the pressure introducing passage 25a is communicated upwardly to the lower end of the pressure hole 471a through the vertically penetrating cavity 16e opened in the base 26. The ceramic circuit board 271 is provided with a pressure hole 271a, the pressure sensitive element 272 is connected to the upper surface of the ceramic circuit board 271 by bonding, the first sensing surface of the pressure sensitive element is blocked at the upper end of the pressure hole 1271a, the lower end of the pressure hole 271a is in sealing butt joint with the upper end of the pressure introducing channel 25a, for example, the ceramic circuit board 271 can be directly bonded to the upper end surface of the base 26 by sealing bonding glue 26b in a sealing manner, a seal is formed between the lower end of the pressure hole 271a and the upper end of the pressure introducing channel 25a, or preferably, a glue groove 16a surrounding the pressure introducing channel 25a for accommodating the sealing bonding glue 26b is arranged on the upper end surface of the base 26, and a seal is formed between the lower end of the pressure hole 271a and the upper end of the pressure introducing channel 25 a. The pressure sensor 272 may be any suitable type of known pressure sensor, such as a strain gauge pressure sensor, or preferably a semiconductor pressure chip, or the like. The pressure sensitive element 272 and the conditioning element 275 are connected to the ceramic circuit board 271 by leads. The pressure sensitive element 272 and the conditioning element 275 are electrically connected to the ceramic circuit board 271 by leads.

The temperature and pressure sensor 200 further includes a temperature sensing assembly 29, the temperature sensing assembly 29 includes a temperature sensing element 291 disposed at a position near the lower end of the pressure introducing channel 25a, two ends of the temperature sensing element 291 are respectively connected with a metal connecting member 292, and the metal connecting member 292 is disposed through a through hole 293 disposed in the base 26 and extends into the mounting cavity 21a to be electrically connected with the ceramic circuit board 271. A sealant (not shown) is provided in the penetration 293 for sealing the metal connector 292 and the penetration 293 to prevent the pressure medium to be measured from entering the mounting chamber 21a from the penetration 293.

In other embodiments, a third sealing groove 295 may be formed around the opening of the cavity 26e facing the pressure hole 271a, and a frame 294 may be fixed to the lower end of the ceramic circuit board 271, and the frame 294 may extend downward into the third sealing groove 295 and be bonded to and sealed with the base 26 by a sealing adhesive 296 filled in the third sealing groove 295.

In another embodiment, the ceramic circuit board 271 may be directly connected to the lower cover 24, and in this case, the sealing adhesive 26b and the adhesive groove 26a may be provided on the upper surface of the lower cover 24, and the ceramic circuit board 271 is sealingly adhered to the upper end surface of the lower cover 24 by the sealing adhesive 26 b.

The upper surface of the ceramic circuit board 271 is also provided with a conditioning element 275 or a conditioning circuit is integrated on a pressure sensitive element 272 made of a semiconductor material. The upper surface of the ceramic circuit board 271 may also be provided with other electronic components 276. Preferably, a surrounding frame 273 is fixed on the upper surface of the ceramic circuit board 271 so as to surround the surrounding frame 273 of the pressure sensitive element 272 and/or the conditioning element 275, and a protective gel 274 may be encapsulated in the surrounding frame 273.

Preferably, the lower end of the main housing 22 is provided with a lower end opening (not labeled) corresponding to the lower cover 24, a second sealing groove (not labeled) is formed around the lower end opening, the lower cover 24 protrudes toward one side of the main housing 22 to form a circle of second sealing flange 241, and the second sealing flange 241 protrudes into the second sealing groove and is bonded and sealed by the sealing adhesive 241 a. In other embodiments, the sealing flange and seal groove are not required, and for example, a corresponding sealant may be applied to the connection surface of the lower cover 24 and the main housing 22 and the adjacent surfaces thereof, so that a simple sealing bonding may be performed.

To prevent the end button 280 from being separated from the socket 22a, an interference fit may be formed between the outer portion of the side wall 280a and the socket 22a, or alternatively, a plurality of buckles may be fixed at the left end of the end button 280 to form a buckle connection with a plurality of buckling portions correspondingly formed on the inner walls of the components of the housing 21, for example, the inner wall of the upper cover 23 protrudes toward the inside of the installation cavity to form a first buckling portion 23a and/or a second buckling portion 22b formed on the inner wall of the lower opening of the main housing 22, and a first buckling portion 283a fixed at the left end of the end button 280 is buckled on the first buckling portion 23a and/or a second buckling portion 283b fixed at the left end of the end button 280 is buckled on the second buckling portion 22 b. It should be appreciated that these snaps may be provided at any suitable location on the main housing 22. Typically, the left end of the main housing 22 is provided with a connection portion 221, the connection portion 221 is provided with a mounting hole 22c, and the mounting hole 22c is provided with a bush 22d to facilitate mechanical mounting on an external device.

To limit the insertion depth of the button 280, a ring of protruding second stop portions 280e may be formed on the side wall 280a to abut or abut the socket 22 a. The second stopper 280e and the plug 22a can be sealed by a sealant. This also provides an additional seal between the outer wall of the button 280 and the main housing 22 to better prevent moisture from the environment from entering the mounting cavity and attacking the electronic components. In particular, a vent hole 280g may be formed in the bottom wall 280d and in communication with the mounting cavity, and a waterproof and breathable film 280f is preferably bonded to the inner surface of the vent hole 280g, so that the mounting cavity 21a is connected to the atmosphere (the end button 280 and the external device interface are generally unsealed in the prior art, i.e. have a gap therebetween) through the vent hole 280g and the mounting cavity 280, and the waterproof and breathable film 280f blocks water vapor in the environment.

Wherein the electrical contact 278 may make electrical contact with an inner side end of the metal pin 281 by: the inner end of the metal pin 281 is abutted or integrally connected with an elastic metal piece, and the other end of the elastic metal piece is abutted on the corresponding electric contact part 278. The elastic metal member may be a metal spring 282, where a proximal end of one end of the metal spring 282 facing the electrical contact 278 abuts against the electrical contact 278, and a corresponding end of the metal spring 282 is lifted (e.g. warped, inclined, etc.) to form a guiding portion 282a, so as to guide the metal spring 282 when the end button assembly 28 is inserted into the socket 22 a. In other embodiments, the elastic metal member may be a conductive spring (not shown), where one end of the conductive spring is electrically contacted to an inner end of the metal pin 281, and the other end is electrically contacted to the corresponding electrical contact 278; a spring holder (not shown) for holding each conductive spring is also fixed to the upper surface of the ceramic circuit board 271.

As shown in fig. 3, a third embodiment of the present application provides a pressure sensor 300. The pressure sensor 300 includes a housing 31, with a mounting cavity (not labeled) formed within the housing 31 for mounting the pressure sensing assembly 37. The housing 31 specifically includes a main housing 32, upper and lower covers 33 and 34 respectively sealingly attached to upper and lower sides of the housing 31, and an end button assembly 38 sealingly combined to the right end of the main housing 32 toward the left, wherein the upper cover 33 is integrally attached to the main housing 32. The terminal button assembly 38 includes a terminal button 380 and a plurality of metal pins 381 integrally formed on the terminal button 380. The left end (i.e., the inner end) of the end button 380 is inserted into the insertion opening 32a formed at the right end of the main housing 32, and the end button 380 includes a tubular side wall 380a extending longitudinally and a bottom wall 380d blocked at the left end of the side wall 380 a. The metal pins 381 extend laterally and penetrate through the bottom wall 380d, and the left ends thereof are electrically connected to the pressure sensing component 37 in a contact manner. The outer surface of the sidewall 380a may also be sealed with the plug interface 32a by a sealant or gasket. Typically, the left end of the main housing 32 is provided with a connection portion 321, the connection portion 321 is provided with a mounting hole 32c, and the mounting hole 32c is provided with a bushing 32d to facilitate mechanical installation on an external device.

In order to prevent the end button 380 from being separated from the socket 32a, an interference fit may be formed between the outer portion of the side wall 380a and the socket 32a, or alternatively, a plurality of buckles may be fixed at the left end of the end button 380 to form a buckle connection with a plurality of buckling portions correspondingly formed on the inner walls of the components of the housing 31, for example, the inner wall of the upper cover 33 protrudes toward the inside of the installation cavity to form a first buckling portion 33a and/or a second buckling portion 32b formed on the inner wall of the lower opening of the main housing 32, and a first buckle 383a fixed at the left end of the end button 380 is buckled on the first buckling portion 33a and/or a second buckle 383b fixed at the left end of the end button 380 is buckled on the second buckling portion 32 b.

The pressure sensing component 37 may include a ceramic circuit board 371, a pressure sensing element 372 disposed on an upper surface of the ceramic circuit board 371, and a plurality of electrical contacts 378, wherein the electrical contacts 378 are preferably plate-shaped and disposed parallel to the upper surface of the ceramic circuit board 371. At least one pressure joint 35 is integrally connected to the lower end of the lower cover 34, a pressure introduction passage 35a is provided in the pressure joint 35, and the lower end of the pressure introduction passage 35a is connected to a pipe or a container containing a medium to be measured. The ceramic circuit board 371 is fixed to an upper surface of a base 36 integrally connected to an upper end of the lower cover 34, that is, the ceramic circuit board 371 is fixed to an upper end of the base 36, a lower end of the base 36 is integrally connected to an upper end of the lower cover 34, and an inner end of the pressure introduction passage 35a is upwardly communicated to a lower end of the pressure hole 371a through a vertically penetrating cavity 36e provided in the base 36. The ceramic circuit board 371 has a pressure hole 371a formed thereon, the pressure sensitive element 372 is adhesively connected to the upper surface of the ceramic circuit board 371 and has a first sensing surface plugged to the upper end of the pressure hole 1271a, the lower end of the pressure hole 371a is in sealing abutment with the upper end of the pressure introducing channel 35a, for example, the ceramic circuit board 371 may be directly and sealingly adhered to the upper end surface of the base 36 by a sealing adhesive 36b and form a seal between the lower end of the pressure hole 371a and the upper end of the pressure introducing channel 35a, or preferably, a glue groove 16a surrounding the pressure introducing channel 35a to accommodate the sealing adhesive 36b is formed on the upper end surface of the base 36 and form a seal between the lower end of the pressure hole 371a and the upper end of the pressure introducing channel 35 a. The pressure sensor 372 may be any suitable pressure sensor known in the art, such as a strain gauge pressure sensor, or preferably a semiconductor pressure chip. Pressure sensing element 372 and conditioning element 375 are connected to ceramic circuit board 371 by leads. The pressure sensitive element 372 and conditioning element 375 are electrically connected to the ceramic circuit board 371 by leads.

The pressure sensing component 37 further includes a plurality of fisheye pins 385 integrally formed on the base 36, wherein one end of the fisheye pins 385 is penetrated through the base 36 to form a horizontal electrical contact part 385a, and the other end is formed with a fisheye structure 385b, and the fisheye structure 385b protrudes upward from the upper surface of the base 36 and is tightly fitted in a metallized connection hole on the ceramic circuit board 371 to form mechanical connection and electrical connection. Preferably, the pressure sensing component 37 further includes a plurality of fisheye pins 384 integrally formed on the base 36, wherein one end of the fisheye pins 384 is disposed upward and has a fisheye structure formed thereon, and the fisheye structure protrudes upward from the upper surface of the base 36 and is tightly fitted into a fitting hole (which may be a metallized connection hole) on the ceramic circuit board 371 to form a mechanical connection. In this way, the metal pins 381 may be electrically connected to the ceramic circuit board 371 through the fisheye pins 385, while the ceramic circuit board 371 may be fixed to the upper surface of the base 36 through the fisheye structure 385 b. In other embodiments, the abutment 36 and the lower cover 34 may be separate, which may be sealingly bonded to the upper surface of the lower cover 34 by a sealant.

In other embodiments, a third sealing groove 395 may be formed around the opening of the cavity 36e facing the pressure hole 371a, and a frame 394 may be fixed to the lower end of the ceramic circuit board 371, and the frame 394 may extend downward into the third sealing groove 395 and be adhered to and sealed with the base 36 by a sealing adhesive 396 filled in the third sealing groove 395.

In another embodiment, the ceramic circuit board 371 may be directly connected to the lower cover 34, and in this case, the sealing adhesive 36b and the adhesive groove 36a may be provided on the upper surface of the lower cover 34, and the ceramic circuit board 371 is sealingly adhered to the upper end surface of the lower cover 34 by the sealing adhesive 36 b.

The upper surface of the ceramic circuit board 371 is also provided with conditioning elements 375 or conditioning circuitry is integrated on pressure sensitive elements 372 made of semiconductor material. The upper surface of the ceramic circuit board 371 may also be provided with other electronic components 376. Preferably, the upper surface of the ceramic circuit board 371 is fixed with a surrounding frame 373 for surrounding the pressure sensitive element 372 and/or the conditioning element 375, and a protective gel 374 may be encapsulated in the surrounding frame 373.

Preferably, the lower end of the main housing 32 is provided with a lower end opening (not labeled) corresponding to the lower cover 34, a second sealing groove (not labeled) is formed around the lower end opening, the lower cover 34 protrudes toward one side of the main housing 32 to form a circle of second sealing flange 341, and the second sealing flange 341 protrudes into the second sealing groove and is bonded and sealed by a sealing bonding adhesive 341 a. In other embodiments, the sealing flange and seal groove are not required, and for example, a corresponding sealant may be applied to the connection surface of the lower cover 34 and the main housing 32 and the adjacent surfaces thereof, so that a simple sealing bonding may be performed.

Wherein, the electrical contact 378 may make electrical contact with an inner side end of the metal pin 381 by: one end of the inner side of the metal pin 381 is abutted or integrally connected with an elastic metal piece, and the other end of the elastic metal piece is abutted on the corresponding electrical contact portion 378. The elastic metal member may be a metal spring 382, where a proximal end of the metal spring 382 facing the electrical contact portion 378 is abutted against the electrical contact portion 378, and a corresponding end of the metal spring 382 is lifted (e.g. warped, inclined, etc.) to form a guiding portion 382a, so as to guide the metal spring 382 when the end button assembly 38 is inserted into the insertion port 32 a. In other embodiments, the elastic metal member may be a conductive spring (not shown), where one end of the conductive spring is electrically contacted to an inner end of the metal pin 381, and the other end is electrically contacted to the corresponding electrical contact 378; a spring holder (not shown) for holding each conductive spring is also fixed to the upper surface of the ceramic circuit board 371.

In other embodiments, the mounting cavity may be further divided into a first cavity 31b and a second cavity 31c by a second partition structure, and two ends of the fisheye pin 385 are respectively located in the second cavity 31b and the third cavity 31 c. The ceramic circuit board 371 and other electronic components 376 are located within the second cavity 31 b. The electrical contact 378 makes electrical contact with the electrical contact 385a within the third cavity 31 c. In this way, it is possible to avoid corrosion of the electronic component by moisture that may intrude from the plug interface 32 a. The second partition structure may include a fourth sealing groove 377b formed at the upper end of the base 36, and a second rib 333 formed by downwardly protruding lower end of the upper cover 33, where the second rib 333 downwardly protrudes into the fourth sealing groove 377b and is adhered and sealed by the sealing adhesive 377a filled in the fourth sealing groove 377 b; or the second partition structure may include a fourth sealing groove 377b formed by the upper cover 33 and a second rib 333 formed by the upper end of the base 36 protruding upward, the second rib 333 protruding upward into the fourth sealing groove 377b and being bonded and sealed by the sealing adhesive 377a filled in the fourth sealing groove 377 b.

In further embodiments, a first partition structure and a second partition structure may be simultaneously provided to divide the installation cavity into a first cavity, a second cavity and a third cavity in order, the pressure sensitive element 372 may be disposed in the first cavity, other electronic components than the pressure sensitive element 372 may be disposed in the second cavity, and the electrical contact 385a and the electrical contact 378 are electrically contacted in the three cavities. Thus, the electronic element can be prevented from being corroded by the pressure medium to be tested and the vapor in the atmosphere.

As shown in fig. 4, a fourth embodiment of the present application provides a differential pressure sensor 400, which includes a housing 41, a mounting cavity 41a for mounting a pressure sensing component 47 is formed in the housing 41. The housing 41 specifically includes a main housing 42, upper and lower covers 43 and 44 respectively sealingly connected to upper and lower sides of the housing 41, and an end button assembly 48 sealingly combined downward at an upper end of the main housing 42 or an upper end of the housing 41, wherein the upper cover 43 may be integrally connected to the main housing 42. The terminal assembly 48 includes a terminal 480 and a plurality of metal pins 481 integrally formed with the terminal 480. The lower end (i.e., the inner end) of the terminal 480 is inserted into the insertion opening 42a formed in the main housing 42 or the housing 41, and the terminal 480 includes a cylindrical side wall 480a extending up and down and a bottom wall 480d sealed to the lower end of the side wall 480 a. The metal pins 481 extend up and down and penetrate through the bottom wall 480d, and the lower ends thereof are electrically connected to the pressure sensing element 47 in a contact manner. The pressure sensor 472 may be any suitable pressure sensor known per se, for example, a strain gauge pressure sensor, or preferably a semiconductor pressure chip, etc. The pressure sensitive element 472 and the conditioning element 475 are connected to a ceramic circuit board 471 by leads. The pressure sensitive element 472 and the conditioning element 475 are electrically connected to the ceramic circuit board 471 by leads.

The pressure sensing component 47 may include a ceramic circuit board 471, a pressure sensitive element 472 disposed on an upper surface of the ceramic circuit board 471, and a plurality of electrical contacts 478, wherein the electrical contacts 478 are preferably plate-shaped and disposed parallel to the upper surface of the ceramic circuit board 471. The lower end of the lower cover 44 is integrally connected with two pressure joints 45, two pressure introduction passages 45a are provided in the pressure joints 45, and the lower ends of the pressure introduction passages 45a are respectively connected to two interfaces of a pipe or a container containing a medium to be measured to measure the difference of the pressures at the two places. When the pressures at the two measuring positions are the same, the sensors can respectively measure the pressures at the two measuring positions at the same time so as to improve redundancy, namely the dual-redundancy pressure sensor. The ceramic circuit board 471 is fixedly and integrally connected to the upper surface of a base 46 connected to the upper end of the lower cover 44, i.e., the ceramic circuit board 471 is fixed to the upper end of the base 46, the lower end of the base 46 is integrally connected to the upper end of the lower cover 44, and the inner ends of the two pressure introducing channels 45a extend upward and are upwardly communicated to the pressure holes 471a through two vertically penetrating cavities 46e opened in the base 46. The ceramic circuit board 471 is provided with a pressure hole 471a, the pressure sensitive element 472 is connected to the upper surface of the ceramic circuit board 471 by bonding, the first sensing surface of the pressure sensitive element 472 is blocked at the upper end of the pressure hole 1271a, the lower end of the pressure hole 471a is in sealing butt joint with the upper end of the pressure introducing channel 45a, for example, the ceramic circuit board 471 can be directly bonded to the upper end surface of the base 46 by sealing adhesive 46b in a sealing manner, a seal is formed between the lower end of the cavity 46e and the upper end of the pressure introducing channel 45a, or preferably, a glue groove 16a surrounding the pressure introducing channel 45a for accommodating the sealing adhesive 46b is arranged on the upper end surface of the base 46, and a seal is formed between the lower end of the pressure hole 471a and the upper end of the pressure introducing channel 45 a.

The base 46 and the lower cover 44 may be integrally connected, but more preferably, the base 46 and the lower cover are directly sealed by a sealing adhesive and the pressure introducing channel 45a is sealed, for example, an adhesive groove 44a may be formed on the opposite surface of one of the base 46 and the lower cover 44, and the sealing adhesive 44b is coated in the adhesive groove 44a and then bonded. In another embodiment, the ceramic circuit board 471 may be directly connected to the lower cover 44, and the sealing adhesive 46b and the adhesive groove 46a may be provided on the upper surface of the lower cover 44, and the ceramic circuit board 471 is sealingly adhered to the upper end surface of the lower cover 44 by the sealing adhesive 46 b. In this way, when the orifice size, the interval, etc. of the two pressure joints 45 are different, only the lower cover needs to be molded separately to match the two cavities 56e of the base 46, thereby reducing the manufacturing cost. Furthermore, it is only necessary to provide two chambers 46e on the base correspondingly, so that it is possible to commonly use a lower cover provided with one pressure joint or two joints, and it is preferable that the lower ends of the chambers 46e be provided larger or smaller than the upper ends of 45e, for example, even if the diameter differences thereof are large when both are provided in a circular shape, it is possible to apply to pressure joints of more sizes; in particular, the lower end of the chamber 46e is enlarged relative to the upper end of the chamber 46e, and the upper end of the pressure introduction passage 45a is received in a positioning flange (not shown) formed to protrude upward, which can facilitate positioning of both. One of the cavities 46e can form a matched limit with the corresponding flange in the horizontal longitudinal direction and the horizontal direction, and the lower end of the other cavity 46e limits the limit of the other positioning flange in the direction perpendicular to the arrangement direction of the two pressure connectors (the left-right direction in the figure) and enables the other positioning flange to perform certain movement in the arrangement direction of the two pressure connectors, so that the universality is improved.

The upper surface of the ceramic circuit board 471 is also provided with a conditioning element 475 or the conditioning circuit is integrated on a pressure sensitive element 472 made of semiconductor material. The upper surface of the ceramic circuit board 471 may also be provided with other electronic components 476. Preferably, a surrounding frame 473 is fixed on the upper surface of the ceramic circuit board 471 to surround the surrounding frame 473 of the pressure sensitive element 472 and/or the conditioning element 475, and a protective gel 474 may be encapsulated in the surrounding frame 473.

Preferably, the lower end of the main housing 42 is provided with a lower end opening (not labeled) corresponding to the lower cover 44, a second sealing groove (not labeled) is formed around the lower end opening, the lower cover 44 protrudes toward one side of the main housing 42 to form a circle of second sealing flange 441, and the second sealing flange 441 protrudes into the second sealing groove and is bonded and sealed by the sealing adhesive 441 a. In other embodiments, the sealing flange and seal groove are not required, and for example, a corresponding sealant may be applied to the connection surface of the lower cover 44 and the main housing 42 and the adjacent surfaces thereof, so that a simple sealing bonding may be performed.

To prevent the end knob 480 from being removed from the socket 42a, an interference fit may be formed between the outer portion of the side wall 480a and the socket 42a, or additionally/alternatively, a plurality of snap-fit hooks 483 may be fixed to the left end of the end knob 480 to form a snap-fit connection with corresponding snap-fit portions 42 formed on the inner walls of the respective component parts of the housing 41. It should be appreciated that these snaps may be provided at any suitable location on the main housing 42. Typically, the left end of the main housing 42 is provided with a connection portion 421, the connection portion 421 is provided with a mounting hole 42c, and a bushing 42d is provided in the mounting hole 42c to facilitate mechanical mounting on an external device.

The second stopper 480e and the plug 42a can be sealed by a sealant. This also provides an additional seal between the outer wall of the end button 480 and the main housing 42 to better prevent moisture from the environment from entering the mounting cavity and attacking the electronic components. In particular, the bottom wall may be provided with a vent hole, and the inner side surface of the vent hole is preferably bonded with a waterproof and breathable film, so that the installation cavity is communicated to the atmosphere (between the end button and the external equipment interface, in the prior art, the end button is generally unsealed, i.e. gaps are left, and water vapor in the environment is blocked by the waterproof and breathable film).

Wherein the electrical contact 478 may make electrical contact with an inner end of the metal pin 481 by: one end of the inner side of the metal pin 481 is abutted or integrally connected with an elastic metal piece, and the other end of the elastic metal piece is abutted on the corresponding electric contact part 478. The elastic metal member may be a conductive spring 482, wherein one end of the conductive spring is electrically contacted with a flat portion 481a formed at one end of the inner side of the metal pin 481 and perpendicular to the metal pin 481, and the other end is electrically contacted with a corresponding electrical contact portion 478; a spring holder 484 for holding each conductive spring is also fixed to the upper surface of the ceramic circuit board 471. The end of the conductive spring 482 remote from the electric contact portion 478 is formed with a tapered portion having a thin end, and a pressing surface for pressing the tapered portion toward the electric contact portion 478 is formed in the spring holder 484, so that the conductive spring 482 is conveniently held in the spring holder 484 to be in contact with the electric contact portion 478. In other embodiments, the elastic metal member may be a metal spring, where a proximal end of one end of the metal spring facing the electrical contact portion abuts against the electrical contact portion, and a corresponding end of the metal spring is lifted (e.g. warped, inclined, etc.) toward a side away from the electrical contact portion 478 to form a guiding portion, so as to guide the metal spring when the end button assembly is inserted into the socket.

As shown in fig. 5, a fifth embodiment of the present application provides a pressure sensor, i.e., a pressure sensor 500, the pressure sensor 500 including a housing 51, a mounting cavity 51a for mounting a pressure sensing component 57 being formed in the housing 51. The housing 51 specifically includes a main housing 52, upper and lower covers 53 and 54 respectively sealingly connected to upper and lower sides of the housing 51, and an end button assembly 58 sealingly combined downward to an upper end of the main housing 52 or an upper end of the housing 51, wherein the upper cover 53 may be integrally connected to the main housing 52. The terminal button assembly 58 includes a terminal button 580 and a plurality of metal pins 581 integrally formed on the terminal button 580. The lower end (i.e., the inner end) of the end button 580 is inserted into the insertion opening 52a formed in the main housing 52 or the housing 51, and the end button 580 includes a cylindrical side wall 580a extending up and down and a bottom wall 580d sealed at the lower end of the side wall 580 a. The metal pins 581 extend up and down and penetrate through the bottom wall 580d, and the lower ends thereof are electrically connected to the pressure sensing component 57 in a contact manner.

The pressure sensing component 57 may include a ceramic circuit board 571, a pressure sensing element 572 disposed on an upper surface of the ceramic circuit board 571, and a plurality of electrical contacts 578, wherein the electrical contacts 578 are preferably plate-shaped and disposed parallel to the upper surface of the ceramic circuit board 571. The lower end of the lower cover 54 is integrally connected with two pressure joints 55, two pressure introduction passages 55a are provided in the pressure joints 55, and the lower ends of the pressure introduction passages 55a are respectively connected to two interfaces of a pipe or a container containing a medium to be measured to measure the difference of the pressures at the two places. When the pressures at the two measuring positions are the same, the sensors can respectively measure the pressures at the two measuring positions at the same time so as to improve redundancy, namely the dual-redundancy pressure sensor. The ceramic circuit board 571 is fixedly integrally connected to the upper surface of a base 56 connected to the upper end of the lower cover 54, that is, the ceramic circuit board 571 is fixed to the upper end of the base 56, the lower end of the base 56 is integrally connected to the upper end of the lower cover 54, and the inner ends of the two pressure introducing passages 55a extend upward and are communicated upward to the pressure hole 571a through two vertically penetrating cavities 56e opened in the base 56. The ceramic circuit board 571 is provided with a pressure hole 571a, the pressure sensitive element 572 is connected to the upper surface of the ceramic circuit board 571 by bonding, and the first sensing surface thereof is blocked at the upper end of the pressure hole 1271a, the lower end of the pressure hole 571a is in sealing butt joint with the upper end of the pressure introducing channel 55a, for example, the ceramic circuit board 571 can be directly bonded to the upper end surface of the base 56 by sealing adhesive 56b in a sealing manner, and a seal is formed between the lower end of the cavity 56e and the upper end of the pressure introducing channel 55a, or preferably, a glue groove 16a surrounding the pressure introducing channel 55a for accommodating the sealing adhesive 56b is provided on the upper end surface of the base 56, and a seal is formed between the lower end of the pressure hole 571a and the upper end of the pressure introducing channel 55 a. The pressure sensitive element 572 may be any suitable known pressure sensitive element, such as a strain gauge pressure sensitive element, or preferably a semiconductor pressure chip. The pressure sensitive element 572 and the conditioning element 575 are connected to the ceramic circuit board 571 by leads. The pressure sensitive element 572 and the conditioning element 575 are electrically connected to the ceramic circuit board 571 by leads.

In other embodiments, a third sealing groove 595 may be formed around the opening of the cavity 56e facing the pressure hole 571a, and a frame 594 may be fixed to the lower end of the ceramic circuit board 571, and the frame 594 may extend downward into the third sealing groove 595 and be bonded to and sealed with the base 56 by a sealing adhesive 596 filled in the third sealing groove 395.

The base 56 and the lower cover 54 may be integrally connected, but more preferably, the base 56 and the lower cover are directly sealed by a sealing adhesive and the pressure introducing channel 55a is sealed, for example, an adhesive groove 54a may be formed on the opposite surface of one of the base 56 and the lower cover 54, and the sealing adhesive 54b is coated in the adhesive groove 54a and then bonded. In another embodiment, the ceramic circuit board 571 may be directly connected to the lower cover 54, and the sealing adhesive 56b and the adhesive groove 56a may be disposed on the upper surface of the lower cover 54, and the ceramic circuit board 571 is sealingly adhered to the upper end surface of the lower cover 54 by the sealing adhesive 56 b. In other embodiments, the opposite outer side of the base 56 may be thinned to the upper side to make the opposite outer side of the base 56 plate-like, which can improve the flexibility of the base 56 to reduce the influence of the mounting stress on the measurement result when the ceramic circuit board 571 is mounted.

The upper surface of the ceramic circuit board 571 is also provided with conditioning elements 575 or conditioning circuitry is integrated on pressure sensitive elements 572 made of semiconductor material. The upper surface of the ceramic circuit board 571 may also be provided with other electronic components 576. Preferably, a surrounding frame 573 is fixed on the upper surface of the ceramic circuit board 571 to surround the surrounding frame 573 of the pressure sensitive element 572 and/or the conditioning element 575, and a protective gel 574 may be encapsulated in the surrounding frame 573.

Preferably, the lower end of the main housing 52 is provided with a lower end opening (not labeled) corresponding to the lower cover 54, a second sealing groove (not labeled) is formed around the lower end opening, the lower cover 54 protrudes toward the side of the main housing 52 to form a circle of second sealing flange 541, and the second sealing flange 541 protrudes into the second sealing groove and is bonded and sealed by the sealing adhesive 541 a. In other embodiments, the sealing flange and seal groove are not required, and for example, a corresponding sealant may be applied to the connection surface of the lower cover 54 and the main housing 52 and the adjacent surfaces thereof, so that a simple sealing bond may be performed.

To prevent the end button 580 from being removed from the socket 52a, an interference fit may be provided between the exterior of the sidewall 580a and the socket 52a, or additionally/alternatively, a plurality of snap-fit tabs 583 may be secured to the left end of the end button 580 to form a snap-fit connection with corresponding ones of the snap-fit portions 42 formed on the inner walls of the components of the housing 51. It should be appreciated that these snaps may be provided at any suitable location on the main housing 52. Typically, the left end of the main housing 52 is provided with a connection portion 521, the connection portion 521 is provided with a mounting hole 52c, and the mounting hole 52c is provided with a bush 52d to facilitate mechanical mounting on an external device.

The second stopper 480e and the plug 52a can be sealed by a sealant. This also provides an additional seal between the outer wall of the terminal button 580 and the main housing 52 to better prevent environmental moisture from entering the mounting cavity and attacking the electronic components. In particular, the bottom wall may be provided with a vent hole, and the inner side surface of the vent hole is preferably bonded with a waterproof and breathable film, so that the installation cavity is communicated to the atmosphere (the end button and the external equipment interface are generally unsealed in the prior art, that is, a gap is left between the end button and the external equipment interface) through the vent hole and the end button installation cavity, and water vapor in the environment is blocked by the waterproof and breathable film.

Wherein the electrical contact 578 may make electrical contact with an inner end of the metal pin 581 by: the inner end of the metal pin 581 is abutted or integrally connected with an elastic metal member, and the other end of the elastic metal member is abutted against the corresponding electrical contact portion 578. The elastic metal member may be a conductive spring 582 (preferably disposed perpendicular to the ceramic circuit board 571), wherein one end of the conductive spring 582 is electrically contacted with a flat portion 581a formed at one end of the inner side of the metal pin 581 and perpendicular to the metal pin 581, and the other end is electrically contacted with a corresponding electrical contact portion 578; a spring holder 584 for holding each conductive spring is also fixed to the upper surface of the ceramic circuit board 571. The end of the conductive spring 582 remote from the electrical contact 578 is formed with a tapered portion having a thin end, and a pressing surface for pressing the tapered portion toward the electrical contact 578 is formed in the spring holder 584, so that the conductive spring 582 is conveniently held in the spring holder 584 to be in contact with the electrical contact 578. In other embodiments, the elastic metal member may be a metal spring, where a proximal end of the metal spring facing the electrical contact portion abuts against the electrical contact portion, and a corresponding end of the metal spring is lifted (e.g. warped, inclined, etc.) toward a side away from the electrical contact portion 578 to form a guiding portion, so as to guide the metal spring when the end button assembly is inserted into the socket.

In the above embodiments, the upper cover and the lower cover may be collectively referred to as a cover, and at least one of them is connected in combination (not integrally connected) with the main casing. The pressure sensing assembly may also be secured to a support structure (e.g., a support step surface) formed within the main housing, rather than to the base or lower cover, in which case both the upper and lower covers may be formed in a modular connection with the main housing for ease of molding of the main housing, or a cover having a pressure fitting may be integrally connected with the main housing and the other cover in a modular connection with the main housing. The abutment may also be part of the lower cover, while the cavity of the abutment may also be part of the pressure introduction channel. In the above embodiments, the terminal button may be simply integrally connected to the main housing, and the metal pins and the metal electrical contacts may be welded using aluminum wires or the like in the prior art, where the upper cover needs to be connected to the main housing in combination for welding operations and other operations (e.g., assembling the pressure sensing assembly in the housing).

The scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.

Claims

1. A pressure sensor, comprising:

2. The pressure sensor of claim 1, wherein one end of the metal pin is electrically connected to the corresponding electrical contact portion by a metal spring, a proximal end of one end of the metal spring facing the electrical contact portion is abutted to the electrical contact portion, and the corresponding end of the metal spring is lifted up in a left-upper direction to form a guide portion.

3. The pressure sensor of claim 1, wherein one end of the metal pin is electrically connected to the corresponding electrical contact portion in a contact manner by a conductive spring, one end of the conductive spring is electrically contacted to an inner end of the metal pin, the other end is electrically contacted to the corresponding electrical contact portion, and a spring holder for holding the conductive spring is fixed to the terminal button assembly.

4. The pressure sensor of claim 1, wherein an interference fit is formed between the end button and the plug interface.

5. The pressure sensor of claim 1, wherein the inner end of the end button is formed with a plurality of snap-fit fasteners which snap-fit onto a plurality of snap-fit portions formed on the inner wall of the housing.

6. The pressure sensor of claim 1, wherein the end button comprises a cylindrical side wall extending longitudinally and a bottom wall plugged at one end of the inner side of the side wall, the metal contact pin is integrally connected to the bottom and the inner end of the metal contact pin penetrates through the bottom wall inwards, and the outer side of the side wall is connected with the plug port in a sealing manner; the bottom wall is provided with a vent hole communicated with the mounting cavity, and the inner side surface of the vent hole is adhered with a waterproof breathable film.

7. The pressure sensor of claim 1, wherein the pressure sensing assembly is secured to an upper surface of the lower cover.

8. The pressure sensor of claim 1, wherein the pressure sensing assembly is mounted on an upper surface of a base, and the base is adhesively or integrally attached to the upper end of the lower cover.

9. The pressure sensor of claim 8, wherein the pressure sensing assembly further comprises a ceramic circuit board sealingly bonded to the upper surface of the base by a sealing adhesive; the pressure sensitive element and the electric contact parts are arranged on the upper surface of the ceramic circuit board; the opposite outer side of the base is thinned to a plate shape toward the upper side.

10. The pressure sensor of claim 8, further comprising a temperature sensitive assembly, wherein the temperature sensitive assembly comprises a temperature sensitive element arranged in one of the pressure introduction channels and close to the lower end, wherein both ends of the temperature sensitive element are respectively connected with a metal connecting piece, the metal connecting pieces penetrate through holes arranged in the base station and extend into the mounting cavity to be electrically connected with the ceramic circuit board, and sealant is arranged in the holes.