CN117894905A - Optical patch, display screen and preparation method thereof - Google Patents

Abstract

The application discloses an optical patch, a display screen and a preparation method thereof, and relates to the technical field of display. The optical patch comprises a light absorption layer and a cementing layer; the light absorption layer is provided with a plurality of pixel alignment through holes which are separated from each other; the glue joint layer is arranged on the lower surface of the light absorption layer and avoids the pixel alignment through holes; the bonding layer is used for bonding the manufacturing process substrate, a plurality of LED chips are arranged on the manufacturing process substrate, and each pixel alignment through hole is used for exposing at least one corresponding LED chip; the lower surface of the light absorption layer is lower than the upper surface of the LED chip, and the upper surface of the light absorption layer is higher than the upper surface of the LED chip. The LED display device can improve the light-emitting efficiency under the conditions of improving the contrast ratio of a display picture and reducing the pollution to the LED chip.

Description

Optical patch, display screen and preparation method thereof

Technical Field

The application relates to the technical field of display, in particular to an optical patch, a display screen and a preparation method thereof.

Background

The LED display screen is usually manufactured by directly punching an LED chip on a semiconductor process substrate (hereinafter referred to as a process substrate) covered with a metal circuit and a control element, and the display screen is irradiated by external ambient light to generate obvious reflected light, so that the contrast of the display screen is reduced.

The bonding pad area of the process substrate for the LED chip bonding is called a first area, and other areas of the process substrate except the first area are called a second area. In order to improve the contrast of the display screen, in the prior art, a black light blocking material is directly sprayed on the metal circuit in the second area of the process substrate, and in this process, in order to avoid pollution to the LED chip, a film layer with an isolation function needs to be covered on the LED chip in advance, so that the complexity of the structure is improved, and the complexity of the process is improved.

Therefore, how to improve the light extraction efficiency while improving the contrast of the display screen and reducing the pollution to the LED chip is a technical problem that the skilled person is urgent to solve.

Disclosure of Invention

In view of the above, the present application provides an optical patch, a display screen and a method for manufacturing the same.

To achieve the above object, one of the technical solutions adopted in the present application is to provide an optical patch, which includes:

the light absorption layer is provided with a plurality of pixel alignment through holes which are separated from each other;

the glue joint layer is arranged on the lower surface of the light absorption layer and avoids the pixel alignment through holes;

the bonding layer is used for bonding the manufacturing process substrate, a plurality of LED chips are arranged on the manufacturing process substrate, and each pixel alignment through hole is used for exposing at least one corresponding LED chip; the lower surface of the light absorption layer is lower than the upper surface of the LED chip, and the upper surface of the light absorption layer is higher than the upper surface of the LED chip.

Optionally, the light absorption layer includes a carrying layer and a light absorption portion, the pixel alignment through hole is disposed on the carrying layer, the light absorption portion is disposed on the lower surface of the carrying layer, and the light absorption portion is disposed on the carrying layer while avoiding the pixel alignment through hole; the bonding layer is arranged on the lower surface of the light absorption part.

Optionally, the plurality of pixel alignment vias are distributed in an array on the optical patch.

Optionally, the carrier layer has flexibility to be able to follow the process substrate deformation.

In order to solve the technical problem, another technical scheme adopted by the application is to provide a display screen, wherein the display screen comprises a display substrate and an optical patch; the display substrate comprises a process substrate and a plurality of LED chips arranged on the process substrate; the optical patch is the optical patch;

wherein, the cementing layer of the optical patch adheres to the area of the process substrate where the LED chips are not arranged, and each pixel of the optical patch exposes at least one corresponding LED chip to the alignment through hole.

Optionally, convex lenses are correspondingly stacked on the LED chips; the upper surface of the convex lens is a convex curved surface.

Optionally, a first scratch-resistant layer is disposed on the upper surface of the optical patch, and/or a second scratch-resistant layer extending along the convex curved surface of the convex lens is disposed on the convex curved surface of the convex lens facing away from the LED chip.

Optionally, the upper surface of the optical patch is provided with a first scratch-resistant layer, and the top of the convex curved surface of the convex lens is lower than the upper surface of the first scratch-resistant layer.

Optionally, the process substrate has flexibility to enable flexible deformation.

In order to solve the technical problem, another technical scheme adopted by the application is to provide a preparation method of the display screen, which comprises the following steps:

providing a display substrate and an optical patch, wherein the display substrate comprises a process substrate and a plurality of LED chips arranged on the process substrate; the optical patch is the optical patch;

and bonding the bonding layer of the optical patch to the area of the process substrate where the LED chips are not arranged, so that the pixel alignment through holes of the optical patch expose at least one corresponding LED chip.

The beneficial effects are that: there are at least three advantageous effects in this application, as distinguished from the prior art. In the first aspect, the contrast of the display screen can be improved by the light absorption effect of the light absorption layer in the display screen. In the second aspect, when the display screen is manufactured, the optical patch and the display substrate can be separately manufactured and respectively molded, so that pollution to the LED chip in the manufacturing process of the optical patch can be avoided. In the third aspect, when the adhesive layer of the optical patch is adhered to the area of the process substrate of the display substrate, where the LED chips are not arranged, the corresponding at least one LED chip in the display substrate can be exposed through each pixel alignment through hole, so that a film layer for covering the LED chips to play an isolation role is not required between the light absorption layer and the process substrate, and further, the light extraction efficiency of the display screen can be improved. Therefore, the display device and the display method can improve the light-emitting efficiency under the condition that the contrast of a display picture is improved and pollution to the LED chip is reduced.

Drawings

FIG. 1 is a schematic cross-sectional view of a display screen of the present application;

FIG. 2 is a schematic top view of a display screen of the present application;

fig. 3 is a schematic diagram of a combined structure of an LED chip, a convex lens, and a second scratch-resistant layer of the display screen of the present application;

FIG. 4 is a schematic flow chart of a method of manufacturing a display screen of the present application;

fig. 5 to 7 are schematic structural views of stages of the first embodiment to the third embodiment of the manufacturing method of a display screen of the present application;

fig. 8 to 11 are schematic structural views of stages of a fourth embodiment of a method for manufacturing a display screen of the present application.

Reference numerals illustrate:

10-a display screen; 100-an optical patch; 101-pixel alignment via holes; 200-processing a substrate; 310-a first scratch resistant layer; 320-a second scratch resistant layer;

110-a light absorbing layer; 111-a carrier layer; 112-light absorbing portion; 120-a cement layer; 210-processing a substrate; 220-pixel units; a 221-LED chip; 222-convex lens.

Detailed Description

In order to better understand the technical solutions of the present application, the following describes the present application in further detail with reference to the drawings and the detailed description. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, based on the embodiments herein, which would be apparent to one of ordinary skill in the art without undue burden are within the scope of the present application.

Referring to fig. 1-3, a display screen 10 of the present application includes a display substrate 200 and an optical patch 100. The display substrate 200 includes a process substrate 210 and a plurality of LED chips 221 disposed on the process substrate 210. The optical patch 100 includes a light absorbing layer 110 and an adhesive layer 120.

The light absorbing layer 110 is provided with a plurality of pixel alignment through holes 101 spaced apart from each other. The bonding layer 120 is disposed on the lower surface of the light absorbing layer 110, and is disposed on the light absorbing layer 110 to avoid the pixel alignment via 101. Wherein, the adhesive layer 120 adheres the area of the display substrate 200 where the LED chips are not disposed, and each pixel alignment via 101 exposes at least one corresponding LED chip 221.

It should be noted that, in the present application, a surface of the process substrate 210 on a side facing away from the LED chip 221 is referred to as a bottom surface, and a surface of each structure of the display screen 10 on a side relatively close to the reference surface is referred to as an upper surface. It should be appreciated that the reference surface is also referred to as the lower surface of the process substrate 210.

In this way, there are at least three beneficial effects. In the first aspect, in the display panel 10, the contrast of the display screen can be improved by the light absorption effect of the light absorption layer 110. In the second aspect, in manufacturing the display screen 10, since the optical patch 100 and the display substrate 200 can be separately manufactured and molded, contamination of the LED chip 221 during the manufacturing process of the optical patch 100 can be avoided. In the third aspect, when the adhesive layer 120 of the optical patch 100 is adhered to the area of the process substrate 210 of the display substrate 200 where the LED chips 221 are not disposed, each pixel alignment via 101 can expose at least one corresponding LED chip 221 in the display substrate 200, so that a film layer for covering the LED chips 221 to perform an isolation function is not required between the light absorbing layer 110 and the process substrate 210, and thus the light emitting efficiency of the display screen 10 can be improved. Therefore, the present application can improve the light extraction efficiency while improving the contrast of the display screen and reducing the contamination of the LED chip 221.

In another aspect, the display 10 of the present application requires less current than existing displays, and thus the display 10 of the present application can reduce power consumption, with the same light extraction efficiency.

Preferably, as shown in fig. 1, the lower surface of the light absorbing layer 110 is lower than the upper surface of the LED chip 221, and the upper surface of the light absorbing layer 110 is higher than the upper surface of the LED chip 221.

Further, referring to fig. 1-3, the light absorbing layer 110 includes a carrier layer 111 and a light absorbing portion 112, the pixel alignment via 101 is disposed on the carrier layer 111, the light absorbing portion 112 is disposed on the lower surface of the carrier layer 111, and is disposed on the carrier layer 111 avoiding the pixel alignment via 101. The adhesive layer 120 is disposed on the lower surface of the light absorbing portion 112.

Alternatively, the lower surface of the light absorbing part 112 is lower than the upper surface of the LED chip 221, and the upper surface of the light absorbing part 112 is higher than the upper surface of the LED chip. Thus, optical crosstalk between different pixel alignment vias 101 can be more fully avoided or reduced.

By way of example and not limitation, the material of the light absorbing portion 112 may include one or more of a black ink, a black photoresist, and the like that have a low light transmittance.

Optionally, the process substrate 210 has flexibility to enable flexible deformation. This facilitates the process substrate 210 to change various shapes to change the shape of the display 10, so that the display 10 is formed as a flexible display 10. Optionally, the carrier layer 111 has flexibility to follow the deformation of the process substrate 210, so that the adhesive layer 120 is adhered to the process substrate 210.

By way of example and not limitation, the carrier layer 111 may have light transmission and anti-reflection properties, but is not limited thereto, and in some examples the carrier layer 111 may have light transmission and not have anti-reflection properties.

Optionally, a plurality of pixel alignment vias 101 are distributed in an array on the optical patch 100. The at least one LED chip 221 thus aligned and exposed through the single pixel alignment via 101 can realize the light emitting function of a single pixel of the display screen 10.

By way of example and not limitation, as shown in fig. 1, the plurality of LED chips 221 are divided into a plurality of pixel units 220 disposed at intervals from each other, each pixel unit 220 including at least one LED chip 221, and a single pixel exposing a corresponding one of the pixel units 220 to the through-hole 101. In this way, the control of the light emitting state of the single pixel can be realized by controlling the LED chips 221 in the single pixel unit 220, and the dynamic change of the display screen 10 can be realized by controlling the LEDs of all the pixel units 220 on the whole process substrate 210.

Alternatively, the pixel unit 220 includes a red LED chip 221, a green LED chip 221, and a blue LED chip 221. Such different light emitting combinations in the red LED chip 221, the green LED chip 221, and the blue LED chip 221 enable a single pixel to emit light of a plurality of colors.

Further, as shown in fig. 1 to 3, the LED chip 221 is correspondingly stacked with a convex lens 222. The convex lens 222 has an upper surface with a convex curved surface. Thus, the convex lens 222 is beneficial to improving the light-emitting type of the display screen 10, such as increasing the uniformity of the side-view color, so as to reduce the side-view character deviation.

By way of example, and not limitation, the lower surface of the convex lens 222 covers the LED chip 221.

Optionally, the lower surface of the carrier layer 111 is lower than the top of the convex curved surface of the convex lens 222. Thus, the structure between the carrier layer 111 and the process substrate 210 is more compact, and the effect of thinning is achieved.

Optionally, the upper surface of the optical patch 100 is provided with a first scratch-resistant layer 310. This can protect the surface of the carrier layer 111.

Optionally, a second scratch-resistant layer 320 extending along the convex curved surface of the convex lens 222 is disposed on the convex curved surface of the convex lens 222 facing away from the LED chip 221. This protects the convex curved surface of the convex lens 222.

In an example, the top of the convex curved surface of the convex lens 222 is higher than the upper surface of the first scratch-resistant layer 310.

In another example, the top of the convex curved surface of the convex lens 222 is lower than the upper surface of the first scratch-resistant layer 310. Thus, the second scratch-resistant layer 320 is not provided, and the scratch-resistant protection effect is provided for the convex lens 222. Specifically, when the display screen 10 contacts with an external object, since the convex lens 222 is integrally located at the lower side of the upper surface of the first scratch-resistant layer 310, the first scratch-resistant layer 310 can stop the external object after contacting with the external object, so that the external object can be prevented from further contacting with the convex lens 222, and thus the scratch-resistant effect on the convex lens 222 can be achieved.

Alternatively, the convex lens 222 has a convex curved surface with a top higher than the lower surface of the carrier layer 111. Thus, the space utilization rate can be improved more fully, and the size of the convex lens 222 is not too small to realize the function.

By way of example and not limitation, the top of the convex curved surface of the convex lens 222 is lower than the upper surface of the first scratch-resistant layer 310 and higher than the lower surface of the first scratch-resistant layer 310, for example. Or, for example, the top of the convex curved surface of the convex lens is lower than the upper surface of the carrier layer 111 and higher than the lower surface of the carrier layer 111.

The following describes a method of manufacturing the display screen 10.

Example 1

The method for manufacturing the display screen 10 of the first embodiment includes steps S11 to S12.

Step S11: a display substrate and an optical patch are provided.

Specifically, as shown in fig. 6, the display substrate 200 includes a process substrate 210 and a plurality of LED chips 221 disposed on the process substrate 210.

Specifically, as shown in fig. 5, the optical patch 100 includes a light absorbing layer 110 and an adhesive layer 120. The light absorbing layer 110 is provided with a plurality of pixel alignment through holes 101 spaced apart from each other. The bonding layer 120 is disposed on the lower surface of the light absorbing layer 110, and is disposed on the light absorbing layer 110 to avoid the pixel alignment via 101.

Step S12: the optical patch is attached to the display substrate.

Specifically, referring to fig. 7 in conjunction with fig. 5-6, the adhesive layer 120 of the optical patch 100 is adhered to the area of the process substrate 210 where the LED chips 221 are not disposed, so that the pixel alignment through holes 101 of the optical patch 100 expose the corresponding at least one LED chip 221. Wherein, the lower surface of the light absorbing layer 110 is lower than the upper surface of the LED chip 221, and the upper surface of the light absorbing layer 110 is higher than the upper surface of the LED chip 221.

Example two

The method for manufacturing the display screen 10 of the second embodiment is not repeated in the same parts as those of the first embodiment, and is further limited as follows.

As shown in fig. 5, the light absorbing layer 110 of the optical patch 100 provided in step S11 includes a carrier layer 111 and a light absorbing portion 112, the pixel alignment via 101 is disposed on the carrier layer 111, the light absorbing portion 112 is disposed on the lower surface of the carrier layer 111 and is disposed on the carrier layer 111 avoiding the pixel alignment via 101. The adhesive layer 120 is disposed on the lower surface of the light absorbing portion 112.

The pixel alignment via 101 may be perforated by, but not limited to, laser or precision machining.

As shown in fig. 6, the convex lens 222 is correspondingly stacked on the LED chip 221 of the display substrate 200 provided in step S11. The convex lens 222 has an upper surface with a convex curved surface.

The convex lens 222 is formed by, but not limited to, ink-Jet Printing (IJP) or injection molding.

Example III

The preparation method of the display screen 10 of the third embodiment is the same as that of the second embodiment, and is not repeated, and is further limited as follows.

As shown in fig. 5, the upper surface of the optical patch 100 provided in step S11 is provided with a first scratch-resistant layer 310.

As shown in fig. 6, a second scratch-resistant layer 320 extending following the convex curved surface of the convex lens 222 is provided on the convex curved surface of the display substrate 200 provided in step S11 facing away from the LED chip 221.

As shown in fig. 7, the scratch-resistant layer formed in step S12 is a first scratch-resistant layer 310 and a second scratch-resistant layer 320 that are separately provided.

Example IV

The same parts of the method for manufacturing the display 10 of the fourth embodiment as those of the third embodiment are not described again, and the differences from the method for manufacturing the display 10 of the third embodiment are as follows.

Referring to fig. 8 in contrast to fig. 5, the optical patch 100 provided in step S11 is provided with no first scratch-resistant layer 310 on the upper surface.

Referring to fig. 6 and referring to fig. 9, the convex lens 222 of the display substrate 200 provided in step S11 is not provided with the second scratch-resistant layer 320 extending along the convex curved surface of the convex lens 222 on the convex curved surface facing away from the LED chip 221.

Referring to fig. 10 in contrast to fig. 7, in step S12, the first scratch-resistant layer 310 and the second scratch-resistant layer 320 are not formed.

Step S12 is followed by a further step S13: the anti-scratch layers are integrally connected and respectively cover the bearing layer and the convex lens.

Referring to fig. 11 in conjunction with fig. 10, the scratch-resistant layer includes a first scratch-resistant layer 310 and a second scratch-resistant layer 320 integrally connected, wherein the first scratch-resistant layer 310 covers the carrier layer 111, and the second scratch-resistant layer 320 covers the convex lens 222.

The foregoing is only the embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (10)

1. An optical patch, the optical patch comprising:

the light absorption layer is provided with a plurality of pixel alignment through holes which are separated from each other;

the glue joint layer is arranged on the lower surface of the light absorption layer and is arranged on the light absorption layer in a way of avoiding the pixel alignment through holes;

the bonding layer is used for bonding the process substrate, a plurality of LED chips are arranged on the process substrate, and each pixel alignment through hole is used for exposing at least one corresponding LED chip; the lower surface of the light absorption layer is lower than the upper surface of the LED chip, and the upper surface of the light absorption layer is higher than the upper surface of the LED chip.

2. The optical patch of claim 1, wherein the light absorbing layer comprises a carrier layer and a light absorbing portion, the pixel alignment via is disposed on the carrier layer, the light absorbing portion is disposed on a lower surface of the carrier layer, and the light absorbing portion is disposed on the carrier layer while avoiding the pixel alignment via; the bonding layer is arranged on the lower surface of the light absorption part.

3. The optical patch of claim 1, wherein a plurality of the pixel alignment vias are distributed in an array across the optical patch.

4. The optical patch of claim 2, wherein the carrier layer has flexibility to be able to follow the process substrate deformations.

5. The display screen is characterized by comprising a display substrate and an optical patch; the display substrate comprises a processing substrate and a plurality of LED chips arranged on the processing substrate; the optical patch of any one of claims 1-4;

the bonding layer of the optical patch bonds the area of the manufacturing process substrate where the LED chips are not arranged, and each pixel alignment through hole of the optical patch exposes at least one corresponding LED chip.

6. The display screen of claim 5, wherein convex lenses are correspondingly stacked on the LED chips; the upper surface of the convex lens is a convex curved surface.

7. The display screen according to claim 6, wherein the upper surface of the optical patch is provided with a first scratch-resistant layer, and/or the convex lens is provided with a second scratch-resistant layer extending along the convex curved surface of the convex lens away from the convex curved surface of the LED chip.

8. The display screen of claim 6, wherein the upper surface of the optical patch is provided with a first scratch-resistant layer, and the top of the convex curved surface of the convex lens is lower than the upper surface of the first scratch-resistant layer.

9. The display screen of claim 5, wherein the process substrate has flexibility to enable flexible deformation.

10. The preparation method of the display screen is characterized by comprising the following steps of:

providing a display substrate and an optical patch, wherein the display substrate comprises a manufacturing process substrate and a plurality of LED chips arranged on the manufacturing process substrate; the optical patch of any one of claims 1-4;

and bonding the bonding layer of the optical patch to the area of the manufacturing process substrate where the LED chips are not arranged, so that at least one corresponding LED chip is exposed by the pixel alignment through holes of the optical patch.