CN117894582B - Integrally formed inductor and preparation method thereof - Google Patents
Integrally formed inductor and preparation method thereof Download PDFInfo
- Publication number
- CN117894582B CN117894582B CN202410198926.XA CN202410198926A CN117894582B CN 117894582 B CN117894582 B CN 117894582B CN 202410198926 A CN202410198926 A CN 202410198926A CN 117894582 B CN117894582 B CN 117894582B
- Authority
- CN
- China
- Prior art keywords
- powder
- integrally formed
- glue
- epoxy resin
- mixed powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 35
- 239000006247 magnetic powder Substances 0.000 claims abstract description 35
- 239000011812 mixed powder Substances 0.000 claims abstract description 34
- 239000003822 epoxy resin Substances 0.000 claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 27
- 239000002904 solvent Substances 0.000 claims abstract description 23
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 239000002270 dispersing agent Substances 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 16
- 239000007822 coupling agent Substances 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 238000011049 filling Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 238000001723 curing Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- -1 lewis base compound Chemical class 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 6
- 238000013035 low temperature curing Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- NKDDWNXOKDWJAK-UHFFFAOYSA-N dimethoxymethane Chemical compound COCOC NKDDWNXOKDWJAK-UHFFFAOYSA-N 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000008096 xylene Substances 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002879 Lewis base Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 150000002462 imidazolines Chemical class 0.000 claims description 3
- 150000002825 nitriles Chemical class 0.000 claims description 3
- 125000002467 phosphate group Chemical class [H]OP(=O)(O[H])O[*] 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 238000005336 cracking Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 3
- 230000005291 magnetic effect Effects 0.000 description 3
- 239000000539 dimer Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940083254 peripheral vasodilators imidazoline derivative Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Soft Magnetic Materials (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention relates to an integrally formed inductor and a preparation method thereof. The preparation method comprises the following steps: preparing soft magnetic powder, first glue and second glue, wherein the soft magnetic powder comprises one or more of iron-based alloy powder, reduced iron powder and carbonyl iron powder, the first glue comprises epoxy resin, modified resin, passivating agent, dispersing agent, coupling agent and solvent, and the second glue comprises curing agent, catalyst, dispersing agent, coupling agent and solvent; mixing the soft magnetic powder with the first glue, granulating after the solvent volatilizes, and granulating to obtain mixed powder A; mixing the soft magnetic powder with the second glue, granulating after the solvent volatilizes, and granulating to obtain mixed powder B; mixing the mixed powder A and the mixed powder B to obtain mixed powder C; carrying out die filling; performing pressure forming; and cooling or solidifying the pressure formed product at room temperature to obtain the inductor. The inductor manufactured by the invention can avoid cracking and provide an inductor with better performance.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to an integrally formed inductor and a preparation method thereof.
Background
As electronic terminal products continue to develop toward miniaturization, integration, multifunction, high power, etc., conventional plug-in inductors cannot meet the requirements of downstream complete machines, and integrated inductors with small volume, low cost, low loss, excellent shielding performance, high reliability, and suitable for high-density surface mounting are widely used in fields of consumer electronics, digital products, mobile communication, computers, high-resolution televisions, set-top boxes, switches, routers, optical fiber communication devices, broadcasting, satellites, automotive electronics, industrial control, etc., and gradually become the main stream direction of the inductor market. The integrated inductor has the advantages of closed magnetic circuit, good magnetic shielding performance, no interference to surrounding components, no interference to adjacent components, good EMI performance, high-density installation of the components, integrated monolithic structure, high density, good mechanical strength, high reliability, heat resistance, good weldability, regular shape and uniformity, and is suitable for a modern automatic surface mounting assembly line production process. The integrated inductor is an integrated structure inductor which is formed by winding an air coil by a numerical control automatic winding machine, implanting a specific die, filling magnetic core powder, performing high-pressure compression molding, and adding an anti-oxidation coating after high-temperature curing.
The current manufacturing method of the integrally formed inductor generally comprises the steps of mixing soft magnetic powder with liquid glue, granulating after volatilizing a solvent, carrying out pressure forming on a coil and the magnetic powder together through a die, heating, baking and curing after the pressure forming, and manufacturing the inductor under the condition that the curing temperature is 100-180 ℃. However, due to the different thermal expansion coefficients of the copper coil and the soft magnetic powder, side cracks are easy to appear in the heating and curing process due to the expansion of the coil, so that the product is bad, and the function and the application of the inductor are affected.
Accordingly, improvements are needed in the art.
Disclosure of Invention
In the prior art, the copper coil and the soft magnetic powder have different thermal expansion coefficients, so that side cracks are easy to appear due to expansion of the coil in the heating and curing process, the product is bad, and the functions and the application of the inductor are affected.
To achieve the above object, in a first aspect, the present invention provides a method for manufacturing an inductor, which specifically includes the following steps:
S1, preparing raw materials: preparing soft magnetic powder, first glue and second glue, wherein the soft magnetic powder comprises one or more of iron-based alloy powder, reduced iron powder and carbonyl iron powder, the first glue comprises epoxy resin, modified resin, passivating agent, dispersing agent, coupling agent and solvent, and the epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol A phenolic epoxy resin and o-methyl phenolic epoxy resin; the second glue comprises a curing agent, a catalyst, a dispersing agent, a coupling agent and a solvent.
S2, mixing soft magnetic powder and glue: mixing soft magnetic powder and the first glue, granulating after the solvent volatilizes, and obtaining mixed powder A; mixing the soft magnetic powder with the second glue, granulating after the solvent volatilizes, and obtaining mixed powder B; mixing the mixed powder A and the mixed powder B to obtain mixed powder C;
S3, die filling: welding a coil on a bracket, placing the coil in an inductor mould, filling the mixed powder C in the inductor mould, and performing pressure forming under a compression bar;
s4, pressure forming: forming the mixture in the inductor mold into a desired shape by pressurizing;
S5, curing: and cooling or solidifying the pressure formed product at room temperature to obtain the inductor.
In one implementation, in S1, the modified resin includes one or more of a nitrile modified epoxy resin, an alkyl modified epoxy resin, a silicone modified epoxy resin, a polyurethane modified epoxy resin, and a dimer acid glycidyl ester.
In one implementation, in S1, the passivating agent includes one or more of a phosphate derivative, an N-acyl sarcosine derivative, an imidazoline derivative.
In one implementation, in S1, the coupling agent is a silane coupling agent containing an amino group or an epoxy group.
In one implementation, in S1, the solvent is one or more of acetone, butanone, methyl butanone, toluene, xylene, methylal.
In one implementation, in S1, the curing agent includes one or more of a polyamide resin, a cycloaliphatic amine epoxy adduct, and a modified mannich amine epoxy adduct, and the catalyst is a lewis base compound.
In one implementation, in S1, the dispersant is a polyether modified polysiloxane or polyacrylate dispersant.
In one implementation, in S2, the mixed powder a and the mixed powder B are as follows (5 to 10): 1 to obtain the mixed powder C.
In one implementation, in S5, the low-temperature curing condition is heating at 50-70 ℃ for 1.5-2.5 hours.
In a second aspect, the present invention further provides an integrally formed inductor, which is manufactured by using the method for manufacturing an integrally formed inductor as described in any one of the above.
The beneficial effects are that: according to the preparation method of the integrally formed inductor, the soft magnetic powder and the glue are mixed step by step, and the integrally formed inductor is manufactured in a room temperature or low temperature curing mode after pressure forming, so that the high temperature curing process in the traditional process is avoided, the problem of side cracking in the heating curing process caused by different thermal expansion coefficients of a copper coil and the soft magnetic powder is avoided, the product yield of the preparation process is increased, and the integrally formed inductor with long service life is provided.
Drawings
Fig. 1 is a flow chart of steps of a method for manufacturing an integrally formed inductor according to the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. Furthermore, the descriptions of the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., described below mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily for the same embodiment or example. The technical features of the respective embodiments of the present invention may be combined with each other as long as they do not collide with each other.
Referring specifically to fig. 1, fig. 1 is a flowchart illustrating steps of a method for manufacturing an integrally formed inductor according to the present invention. The invention provides a preparation method of an integrally formed inductor, which specifically comprises the following steps:
S1, preparing raw materials: preparing soft magnetic powder, first glue and second glue, wherein the soft magnetic powder comprises one or more of iron-based alloy powder, reduced iron powder and carbonyl iron powder, the first glue comprises epoxy resin, modified resin, passivating agent, dispersing agent, coupling agent and solvent, and the epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol A phenolic epoxy resin and o-methyl phenolic epoxy resin; the second glue comprises a curing agent, a catalyst, a dispersing agent, a coupling agent and a solvent.
S2, mixing soft magnetic powder and glue: mixing soft magnetic powder and the first glue, granulating after the solvent volatilizes, and obtaining mixed powder A; mixing the soft magnetic powder with the second glue, granulating after the solvent volatilizes, and obtaining mixed powder B; mixing the mixed powder A and the mixed powder B to obtain mixed powder C;
S3, die filling: welding a coil on a bracket, placing the coil in an inductor mould, filling the mixed powder C in the inductor mould, and performing pressure forming under a compression bar;
s4, pressure forming: forming the mixture in the inductor mold into a desired shape by pressurizing;
s5, curing: and cooling or solidifying the pressure formed product at room temperature to obtain the integrally formed inductor.
Specifically, in S1, the modified resin includes one or more of nitrile modified epoxy resin, alkyl modified epoxy resin, silicone modified epoxy resin, polyurethane modified epoxy resin, and dimer acid glycidyl ester. The passivating agent comprises one or more of phosphate derivatives, N-acyl sarcosine derivatives and imidazoline derivatives. The coupling agent is a silane coupling agent containing amino or epoxy groups. The solvent is one or more of acetone, butanone, methyl butanone, toluene, xylene and methylal.
Wherein the soft magnetic powder is made of iron or other magnetic materials and can enhance magnetism in the heat treatment process, and specifically comprises ferromagnetic powder, ferrite, nickel-zinc soft magnetic ferrite, nanocrystalline soft magnetic powder and the like. The first glue is used for combining the soft magnetic powder, and the epoxy resin and the modified resin enable the manufactured integrated inductor to have good adhesion, bear high temperature and not have obvious influence on the performance of the integrated inductor.
In the second glue, the curing agent comprises one or more of polyamide resin, alicyclic amine epoxy adduct and modified mannich amine (modified MANNICH AMINE) epoxy adduct, and the catalyst is a Lewis base compound. The dispersing agent is polyether modified polysiloxane or polyacrylate dispersing agent. The coupling agent is a silane coupling agent containing amino or epoxy groups. The solvent is one or more of acetone, butanone, methyl butanone, toluene, xylene and methylal.
In S2, further, the weight ratio of the soft magnetic powder to the first glue is: the magnetic powder comprises soft magnetic powder 100, epoxy resin (2-4), modified resin (2-4), passivating agent (0.1-0.3), dispersing agent (0.1-0.3), coupling agent (0.1-0.3) and solvent; the soft magnetic powder and the first glue are mixed according to the following weight ratio: soft magnetic powder 100, a curing agent (0.1-0.3), a catalyst (0.1-0.3), a dispersing agent (0.1-0.3), a coupling agent (0.1-0.3) and a solvent. The mixed powder A and the mixed powder B are prepared from (5-10): 1 to obtain the mixed powder C. The granulating process of the raw materials comprises the steps of drying and adding an adhesive into the ground powder to obtain mixed powder A and mixed powder B which have good fluidity and particle size of about 0.1 mm.
In S4, the pressurizing condition is 1.8-3.5T/cm 2, and the pressure maintaining time is 50-120S. Specifically, when the mixture in the inductor die is heated to 130-150 ℃, the mixture is softened for 30-60 s, so that compressed air is attached to the surface of the inductor die, and after cooling, the compressed air is used for blowing out a pressure molded product through the bottom of the die.
In the step S5, the low-temperature curing condition is that heating is carried out for 1.5-2.5 hours at the temperature of 50-70 ℃. Preferably, the low temperature curing condition is to heat at a low temperature of 60 ℃ for 2 hours for curing.
The invention also provides an integrally formed inductor which is manufactured by adopting the manufacturing method provided by the invention.
In summary, in the method for manufacturing the integrally formed inductor provided by the invention, the soft magnetic powder and the glue are mixed step by selecting the glue, and the integrally formed inductor is manufactured by adopting a mode of room temperature or low temperature curing after pressure forming, so that the high temperature curing process in the traditional process is avoided, the problem of side cracking in the heating curing process caused by different thermal expansion coefficients of the copper coil and the soft magnetic powder is avoided, the product yield of the manufacturing process is increased, and the integrally formed inductor with long service life is provided.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (10)
1. The preparation method of the integrally formed inductor is characterized by comprising the following steps of:
s1, preparing raw materials: preparing soft magnetic powder, first glue and second glue, wherein the soft magnetic powder comprises one or more of iron-based alloy powder, reduced iron powder and carbonyl iron powder, the first glue comprises epoxy resin, modified resin, passivating agent, dispersing agent, coupling agent and solvent, and the epoxy resin comprises one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol A phenolic epoxy resin and o-methyl phenolic epoxy resin; the second glue comprises a curing agent, a catalyst, a dispersing agent, a coupling agent and a solvent;
S2, mixing soft magnetic powder and glue: mixing soft magnetic powder and the first glue, granulating after the solvent volatilizes, and obtaining mixed powder A; mixing the soft magnetic powder with the second glue, granulating after the solvent volatilizes, and obtaining mixed powder B; mixing the mixed powder A and the mixed powder B to obtain mixed powder C;
S3, die filling: welding a coil on a bracket, placing the coil in an inductor mould, filling the mixed powder C in the inductor mould, and performing pressure forming under a compression bar;
s4, pressure forming: forming the mixture in the inductor mold into a desired shape by pressurizing;
s5, curing: and cooling or solidifying the pressure formed product at room temperature to obtain the integrally formed inductor.
2. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S1, the modified resin includes one or more of nitrile modified epoxy resin, alkyl modified epoxy resin, silicone modified epoxy resin, urethane modified epoxy resin, and glycidyl dimer acid.
3. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S1, the passivating agent includes one or more of a phosphate derivative, an N-acyl sarcosine derivative, and an imidazoline derivative.
4. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S1, the coupling agent is a silane coupling agent containing an amino group or an epoxy group.
5. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S1, the solvent is one or more of acetone, methyl ethyl ketone, toluene, xylene, and methylal.
6. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S1, the curing agent includes one or more of a polyamide resin, a cycloaliphatic amine epoxy adduct, and a modified mannich amine epoxy adduct, and the catalyst is a lewis base compound.
7. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S1, the dispersant is a polyether modified polysiloxane-based or polyacrylate-based dispersant.
8. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S2, the mixed powder a and mixed powder B are mixed in the following amounts (5 to 10): 1 to obtain the mixed powder C.
9. The method of manufacturing an integrally formed inductor according to claim 1, wherein in S5, the low temperature curing is performed under a condition of heating at 50 to 70 ℃ for 1.5 to 2.5 hours.
10. An integrally formed inductor, characterized in that it is manufactured by the method for manufacturing an integrally formed inductor according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410198926.XA CN117894582B (en) | 2024-02-22 | 2024-02-22 | Integrally formed inductor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410198926.XA CN117894582B (en) | 2024-02-22 | 2024-02-22 | Integrally formed inductor and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117894582A CN117894582A (en) | 2024-04-16 |
| CN117894582B true CN117894582B (en) | 2024-09-17 |
Family
ID=90646860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410198926.XA Active CN117894582B (en) | 2024-02-22 | 2024-02-22 | Integrally formed inductor and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117894582B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102007549A (en) * | 2008-04-15 | 2011-04-06 | 东邦亚铅株式会社 | Composite magnetic material and method of manufacturing the same |
| CN103578679A (en) * | 2013-10-28 | 2014-02-12 | 任静儿 | Soft-magnetic inductive iron core material and manufacturing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5232717B2 (en) * | 2009-04-27 | 2013-07-10 | 株式会社タムラ製作所 | Powder magnetic core and manufacturing method thereof |
| JP6297281B2 (en) * | 2013-05-27 | 2018-03-20 | 日東電工株式会社 | Soft magnetic resin composition, soft magnetic adhesive film, soft magnetic film laminated circuit board, and position detection device |
| CN114974872A (en) * | 2022-06-21 | 2022-08-30 | 苏州锦鳞电子科技有限公司 | Molded inductor and manufacturing method thereof |
| CN115966360A (en) * | 2022-11-28 | 2023-04-14 | 安徽大学绿色产业创新研究院 | Impregnation liquid and application thereof, and preparation method and application of magnetic powder core |
-
2024
- 2024-02-22 CN CN202410198926.XA patent/CN117894582B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102007549A (en) * | 2008-04-15 | 2011-04-06 | 东邦亚铅株式会社 | Composite magnetic material and method of manufacturing the same |
| CN103578679A (en) * | 2013-10-28 | 2014-02-12 | 任静儿 | Soft-magnetic inductive iron core material and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117894582A (en) | 2024-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112397295A (en) | Manufacturing method of integrally formed inductor | |
| JP7511319B2 (en) | Thermosetting resin composition, coil having magnetic core and/or exterior member, and method for manufacturing molded article | |
| EP3579254B1 (en) | Powder compact core, method for manufacturing powder compact core, electric/electronic component provided with powder compact core, and electric/electronic apparatus having electric/electronic component mounted therein | |
| EP3249664B1 (en) | Powder core, method for producing same, electric/electronic component provided with same, and electric/electronic device having said electric/electronic component mounted thereon | |
| EP3252787B1 (en) | Method for manufacturing coil-embedded inductor by using soft magnetic molding solution, and coil-embedded inductor manufactured using same | |
| KR102696995B1 (en) | Low-loss powder for integrally molded inductor and method for manufacturing the same | |
| CN112908677B (en) | Preparation method of high-permeability low-loss integrated inductance material | |
| KR20130051930A (en) | Composition for producing magnetic or magnetizable moldings, and process for producing the same | |
| TW201712132A (en) | Dust core, method for producing said dust core, inductor provided with said dust core, and electronic/electrical device on which said inductor is mounted | |
| KR102119173B1 (en) | Hybrid type inductor | |
| JP7318422B2 (en) | Resin composition and molded product | |
| CN117894582B (en) | Integrally formed inductor and preparation method thereof | |
| CN117098621A (en) | Magnetic powder, composite, molded body, bonded magnet, and compressed powder magnetic core | |
| US11987695B2 (en) | Resin composition for forming magnetic member and method for manufacturing magnetic member | |
| US20240006121A1 (en) | Integrated co-fired inductor and preparation method therefor | |
| JP2022180555A (en) | Resin composition and molded article | |
| CN103646750A (en) | Magnetic sealing compound winding type power inductor and preparation method thereof | |
| CN114664670A (en) | Chip packaging method and chip packaging assembly | |
| CN117393307B (en) | High-frequency low-loss soft magnetic composite material for integrated inductor and preparation method thereof | |
| CN116348516B (en) | Resin molding material, molded article, and method for producing the molded article | |
| CN111937098A (en) | Dust core, method for producing the same, electric/electronic component, and electric/electronic device | |
| US20240062944A1 (en) | Low-loss inductor and manufacturing method thereof | |
| CN203644498U (en) | Magnetic sealing adhesive wound power inductor | |
| EP4227340A1 (en) | Resin molding material, molded body, and method for producing said molded body | |
| CN117511201A (en) | Resin composite, and inductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |