CN117891143A - Photoetching hot spot detection method based on 2D overlapping judgment - Google Patents
Photoetching hot spot detection method based on 2D overlapping judgment Download PDFInfo
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Abstract
The invention relates to the technical field of chip manufacturing, in particular to a photoetching hot spot detection method based on 2D overlapping judgment, which comprises the following steps: dividing a plurality of orthogonal polygons according to a circuit module in a chip 2D layout, wherein the orthogonal polygons are subjected to rectangular decomposition based on a preset decomposition method; dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout; determining an accurate region in a chip 2D layout to be matched and a fuzzy region extending from the accurate region; and carrying out matching judgment on the orthogonal polygons and the accurate region and/or the fuzzy region in each matching region based on a preset matching rule, so as to obtain a lithography hotspot detection result. The invention improves the judging speed and the matching efficiency of the photoetching hot spot detection.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a photoetching hot spot detection method based on 2D overlapping judgment.
Background
Defects in the chip manufacturing process are important factors affecting the chip yield, and can be generally classified into systematic defects and non-systematic defects according to causes. Wherein systematic defects are typically introduced by photolithography, etching, chemical mechanical polishing, etc., and are closely related to the layout. To avoid lithography hotspots, the physical layout is verified by Design Rule Checking (DRC) and Optical Proximity Correction (OPC) prior to mask synthesis.
In advanced integrated circuit fabrication, as the sub-wavelength lithographic gap increases, the lithographic hot spot can cause an open circuit or a short circuit between two wires on the metal or multi-wire segment, thereby disrupting the function of the circuit. Therefore, the problem of lithography hotspot detection is widely studied and many techniques have been proposed.
The prior art is mainly divided into the following categories: lithography simulation, accurate layout pattern matching and machine learning-based layout pattern matching.
The lithography simulation precision is highest, but the calculation is complex, the running time is long, and in the physical verification stage, the full-chip layout is difficult to analyze within a reasonable turnaround time; accurate layout pattern matching is fastest and accurate if the test pattern is perfectly matched with the predefined hotspot pattern, but not well recognized if the test pattern is partially different from the predefined hotspot pattern; in the machine learning method, a classification model is built through training data sets of hot spot and non-hot spot modes, and then the hot spot is detected from a test layout by using the model. However, machine learning methods require a tradeoff between runtime and detection accuracy.
Disclosure of Invention
The invention aims to solve the problem that efficiency and accuracy cannot be balanced in the method for identifying the lithography hotspots in the prior art.
Specifically, the invention provides a lithography hotspot detection method based on 2D overlap judgment, which comprises the following steps:
Dividing a plurality of orthogonal polygons according to a circuit module in a chip 2D layout, wherein the orthogonal polygons are subjected to rectangular decomposition based on a preset decomposition method;
dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout;
determining an accurate region in a chip 2D layout to be matched and a fuzzy region extending from the accurate region;
and carrying out matching judgment on the orthogonal polygons and the accurate region and/or the fuzzy region in each matching region based on a preset matching rule, so as to obtain a lithography hotspot detection result.
Still further, the step of performing rectangular decomposition on the orthogonal polygon based on a preset decomposition method includes the following substeps:
Classifying each side of the orthogonal polygon as a skyline or a geoline based on a ray method;
based on a plane coordinate system, forming a decomposition rectangle according to the current astronomical line and a ground line which is closest to the current astronomical line in the Y-axis direction and can completely cover the current astronomical line in the X-axis direction; wherein:
if the projection of the ground line in the X-axis direction can not completely cover the current astronomical line, cutting the current astronomical line into a cover part and a residual part according to the cover position, forming a decomposition rectangle according to the cover part and the ground line, and taking the residual part as a new astronomical line;
Repeating the steps until the orthogonal polygons are completely rectangular decomposed.
Further, the step of dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout specifically includes:
constructing an envelope rectangle according to all the orthogonal polygons divided in the chip 2D layout;
And taking the left lower vertex of the envelope rectangle as the origin of a plane coordinate system, taking the left lower vertex of each orthogonal polygon as the coordinate position of the plane coordinate system, and dividing a plurality of matching areas in the plane coordinate system according to the number of all the orthogonal polygons and a preset density rule.
Further, in the step of performing a matching judgment on the orthogonal polygon and the accurate region and/or the fuzzy region in each matching region based on a preset matching rule to obtain a lithography hotspot detection result, the matching judgment is performed on the orthogonal polygon and the accurate region and/or the fuzzy region based on the decomposition rectangle obtained by decomposing the orthogonal polygon.
Further, the matching rule based on the preset is specifically:
If the overlapping area of any decomposition rectangle in the orthogonal polygons and the precise area is smaller than the area of the precise area, the decomposition rectangles are not matched;
If the overlapping area of any one of the decomposition rectangles in the orthogonal polygons and the precise area is equal to the area of the precise area, and the vertex number of the orthogonal polygon in the precise area and the fuzzy area is not equal to the vertex number of the area formed by the precise area and the fuzzy area, the two areas are not matched;
and if the overlapping area of any one of the decomposition rectangles and the precise area is equal to the area of the precise area, and the vertex number of the orthogonal polygon in the precise area and the fuzzy area is equal to the vertex number of an area formed by the precise area and the fuzzy area, matching, wherein a circuit module corresponding to the orthogonal polygon has photoetching hot spots when the circuit module is overlapped with the 2D layout of the chip to be matched.
Further, based on a preset matching rule, in each matching area, performing matching judgment on the orthogonal polygon and the accurate area and/or the fuzzy area to obtain a lithography hotspot detection result, which comprises the following substeps:
judging whether the precise area has the extended fuzzy area, if not, overlapping one vertex of the decomposed rectangle obtained by decomposing the orthogonal polygon with the vertex of the precise area, carrying out matching judgment on the decomposed rectangle and the precise area according to the preset matching rule, and outputting a matching result; if yes:
Judging whether a pair of coincident adjacent edges exist between the precise area and the fuzzy area, if so, overlapping one vertex of the decomposition rectangle with the vertex which is not connected with the coincident adjacent edges in the precise area, and carrying out matching judgment on the decomposition rectangle and the precise area according to the preset matching rule, and outputting a matching result; if no:
And attaching one side of the decomposition rectangle to the side which is not overlapped with the fuzzy area in the accurate area, moving the decomposition rectangle along the connected side, overlapping one vertex of the decomposition rectangle with any vertex in the accurate area, carrying out matching judgment on the decomposition rectangle and the accurate area according to the preset matching rule, and outputting a matching result.
The invention has the beneficial effects that a photoetching hot spot detection method based on overlapping judgment on a 2D layout is provided, and the method classifies three conditions for truncation and blurring problems and solves the three conditions respectively; aiming at the time consumption problem of overlapping judgment of orthogonal polygons, a rectangular decomposition method is adopted to decompose the orthogonal polygons into a plurality of rectangles, and the rectangles are used for overlapping judgment, so that the overlapping judgment speed is improved; aiming at the problem of low efficiency of traversing the graph set when matching is judged, a region division strategy is adopted to divide the layout into a plurality of sub-regions, and only graphs in the region overlapped with the current template are considered when matching is judged, so that the matching efficiency is improved.
Drawings
FIG. 1 is a flow chart of steps of a method for detecting a lithography hotspot based on 2D overlay determination according to an embodiment of the present invention;
FIG. 2 is a rectangular exploded view of an orthogonal polygon provided by an embodiment of the present invention;
FIG. 3 is an overlapping schematic view of orthogonal polygons provided by an embodiment of the present invention;
FIG. 4 is a schematic illustration of a radiology provided by an embodiment of the present invention;
FIG. 5 is an exploded rectangular schematic view of a ray method composition provided by an embodiment of the present invention;
FIG. 6 is a schematic view of a truncated astronomical line provided by an embodiment of the present invention;
FIG. 7 is a schematic diagram of a ray-based completion decomposition rectangle provided by an embodiment of the present invention;
FIG. 8 is a schematic diagram of a ray-method-completed multi-hole polygon decomposition rectangle according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a region division strategy according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of pattern matching provided by an embodiment of the present invention;
FIG. 11 is a schematic diagram of graph matching based on a region division strategy according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of another graph matching based on a region partitioning strategy provided by an embodiment of the present invention;
FIG. 13 is a schematic diagram of orthogonal polygon matching with precise region according to an embodiment of the present invention;
FIG. 14 is a schematic diagram of orthogonal polygon matching with fuzzy regions according to an embodiment of the present invention;
FIG. 15 is a schematic diagram of a first case of a preset matching rule according to an embodiment of the present invention;
FIG. 16 is a schematic diagram of a second case of a preset matching rule according to an embodiment of the present invention;
Fig. 17 is a schematic diagram of a third case of a preset matching rule according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1, fig. 1 is a step flowchart of a method for detecting a lithography hot spot based on 2D overlay determination according to an embodiment of the present invention, where the method for detecting a lithography hot spot based on 2D overlay determination includes the following steps: the method comprises the following steps:
S1, dividing a plurality of orthogonal polygons according to a circuit module in a chip 2D layout, wherein the orthogonal polygons are subjected to rectangular decomposition based on a preset decomposition method;
S2, dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout;
S3, determining an accurate region in the 2D layout of the chip to be matched and a fuzzy region extending from the accurate region;
and S4, carrying out matching judgment on the orthogonal polygons and the accurate region and/or the fuzzy region in each matching region based on a preset matching rule, and obtaining a photoetching hot spot detection result.
Specifically, in the graph matching algorithm, the most core part is to judge whether two polygons overlap, and a simple method is to judge whether any two polygons overlap according to the following 2 conditions:
Whether the edges of two polygons intersect;
whether the vertices of two polygons are inside the other polygon.
If either of the above conditions is satisfied, it is indicated that the two polygons overlap. This method is applicable to polygons of arbitrary shape, but it is slow and inefficient.
Another advanced method is to adopt an efficient convex polygon overlap judgment algorithm (such as GJK algorithm, SAT algorithm, etc.) to carry out overlap judgment on any two convex polygons, and for non-convex polygons, the non-convex polygons can be firstly cut into a plurality of convex polygons and then judged one by one.
Combining the characteristics of the orthogonal polygons, decomposing the orthogonal polygons into a plurality of rectangles based on the advanced thought of decomposition and judgment, judging whether the respective rectangles of the two orthogonal polygons are overlapped, and if any pair of rectangles are overlapped, indicating that the two orthogonal polygons are overlapped. As shown in fig. 2 and 3, fig. 2 shows an exploded rectangular schematic view of some simple orthogonal polygons, and there is no pair of rectangles overlapping each other in the two orthogonal polygons in fig. 3a, so that there is no overlap between the two polygons, and conversely, there is a pair of rectangles overlapping each other in fig. 3b, so that the two polygons overlap.
Based on the above viewpoints, the embodiments of the present invention have the following reasoning: the upper bottom and the lower bottom of the rectangle obtained after decomposition are coincident with two sides of the orthogonal polygon, a certain area is necessarily reserved between the two sides, no other sides are reserved in the area, and once the area meeting the condition is found, the area can form a rectangle.
According to the above deduction, the step of rectangular decomposition of the orthogonal polygon based on a preset decomposition method includes the following sub-steps:
Classifying each side of the orthogonal polygon as a skyline or a geoline based on a ray method;
based on a plane coordinate system, forming a decomposition rectangle according to the current astronomical line and a ground line which is closest to the current astronomical line in the Y-axis direction and can completely cover the current astronomical line in the X-axis direction; wherein:
if the projection of the ground line in the X-axis direction can not completely cover the current astronomical line, cutting the current astronomical line into a cover part and a residual part according to the cover position, forming a decomposition rectangle according to the cover part and the ground line, and taking the residual part as a new astronomical line;
Repeating the steps until the orthogonal polygons are completely rectangular decomposed.
Specifically, as shown in fig. 4, each side of the orthogonal polygon is traversed, a ray is emitted from the left end point of the side from bottom to top, each side is numbered (from 1) according to the order in which the ray passes through the side, the side numbered odd is classified as a ground line, the side numbered even is classified as an astronomical line, and it should be noted that the end point of the ray passing through the side does not pass through the side.
After classifying each side of the polygon, a set of astronomical lines and a set of geodesic lines are obtained, it being readily apparent that the intersection between them must be empty. Traversing the set of the astronomical lines, if the geoline closest to the current astronomical line in the Y direction can completely wrap the astronomical line in the X direction, the geoline can be said to completely bear the astronomical line, and at this time, the area between the astronomical line and the geoline can form a rectangle, as shown in fig. 5.
When the ground line cannot fully bear the astronomical line, the astronomical line needs to be cut into two parts, one part is a part which can be fully borne by the ground line, and the other part is the rest part of the astronomical line. The remainder will be added as a new astronomical line to the end of the collection of astronomical lines, while the portion that can be fully carried by the ground line will be used directly to construct a rectangle, as shown in fig. 6.
The final shape of the rectangular decomposition is shown in fig. 7, where fig. 7 decomposes an orthogonal polygon with 16 vertices into 6 rectangles that do not overlap each other. Moreover, the method of the embodiment of the present invention is also applicable to an orthogonal polygon having holes, as shown in fig. 8.
The above procedure is only directed to rectangular decomposition of the pattern, whereas it cannot be applied directly to rectangular decomposition of blank parts in the template. However, in the implementation process, the upper and lower boundaries of the template can be respectively used as default astronomical lines and geodesic lines to be added into the set, so that the blank part of the template can be rectangular decomposed by the above process.
Aiming at the problem that the efficiency of traversing the whole graph set is low when matching is judged, the embodiment of the invention adopts the region division strategy to divide the layout into a plurality of sub-regions, and only the graph in the region overlapped with the current template is considered when matching is judged, so that the matching efficiency can be greatly improved. The ideal region division ensures that the number of polygons contained in each region is the same as much as possible, so that the scale reduction effect caused by the region division can be maximized.
The step of dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout specifically comprises the following steps:
constructing an envelope rectangle according to all the orthogonal polygons divided in the chip 2D layout;
And taking the left lower vertex of the envelope rectangle as the origin of a plane coordinate system, taking the left lower vertex of each orthogonal polygon as the coordinate position of the plane coordinate system, and dividing a plurality of matching areas in the plane coordinate system according to the number of all the orthogonal polygons and a preset density rule.
9 fig. 9 shows a schematic diagram of a density-based region division strategy, in which black dots represent orthogonal polygons, black boxes represent envelope rectangles of all the orthogonal polygons, the entire envelope rectangle is divided into 9 regions (3*3), and broken lines are cut lines.
In the region dividing strategy based on density, traversing the orthogonal polygon graph set, obtaining ascending arrangement de-duplication sets X and Y of the horizontal coordinate and the vertical coordinate of the left lower corner of the orthogonal polygon enveloping rectangle, obtaining the times sets C X and C Y of the occurrence of the corresponding coordinate values, and then searching the dividing lines on the corresponding dimension according to the dividing number of the dividing lines, thereby dividing the region according to the dividing lines. The embodiment of the invention realizes region division through the algorithm pseudo code for searching the segmentation line of a certain dimension shown in the table 1.
TABLE 1 algorithmic pseudocode to find a cut line of a dimension
By calling the FindCutLines function described above, the sets of dicing line coordinates R X and R Y in the X and Y directions can be obtained, and then the regions are divided by R X and R Y.
As shown in fig. 10, if the position of the template is to be determined to match the pattern in the layout when the region division policy is not applied, all the patterns need to be traversed to determine whether they overlap the blank portion of the template. Obviously, this process is very inefficient because there are many patterns that do not significantly overlap the template and a decision is made.
After adding the region division strategy, the whole layout is divided into 9 regions according to the density, and if the position of the selection frame is matched with the pattern in the layout, only the pattern in the region (lower right corner) intersected with the red frame is required to be judged to be overlapped with the blank part of the template. Therefore, the region division strategy can greatly improve the matching efficiency and reduce the algorithm time. Fig. 12 can also illustrate the enormous efficiency gains from the zoning strategy.
And carrying out matching judgment on the orthogonal polygons and the accurate region and/or the fuzzy region in each matching region based on a preset matching rule, and carrying out matching judgment on the accurate region and/or the fuzzy region based on the decomposition rectangle obtained by decomposing the orthogonal polygons in the step of obtaining the photoetching hot spot detection result.
The following section describes how to determine whether the orthogonal polygon matches the chip layout.
The preset matching rule is specifically:
If the overlapping area of any decomposition rectangle in the orthogonal polygons and the precise area is smaller than the area of the precise area, the decomposition rectangles are not matched;
If the overlapping area of any one of the decomposition rectangles in the orthogonal polygons and the precise area is equal to the area of the precise area, and the vertex number of the orthogonal polygon in the precise area and the fuzzy area is not equal to the vertex number of the area formed by the precise area and the fuzzy area, the two areas are not matched;
and if the overlapping area of any one of the decomposition rectangles and the precise area is equal to the area of the precise area, and the vertex number of the orthogonal polygon in the precise area and the fuzzy area is equal to the vertex number of an area formed by the precise area and the fuzzy area, matching, wherein a circuit module corresponding to the orthogonal polygon has photoetching hot spots when the circuit module is overlapped with the 2D layout of the chip to be matched.
Specifically, as shown in fig. 13b, the orthogonal polygon overlaps with the blank portion of the layout, so that the templates of the orthogonal polygon are not matched at that position. Conversely, if the orthogonal polygon does not overlap with the blank portion of the layout, the templates of the orthogonal polygon may match at that location. Further, it is necessary to determine whether the templates match using the overlapping area of the decomposition rectangle and the precision area. It is apparent that when the exact region has no fuzzy boundary, if the overlapping area of the decomposition rectangle and the exact region is exactly equal to the total area of the exact region, the templates illustrating the orthogonal polygons are matched at that position, otherwise not matched, as shown in fig. 13c and 13 d.
When there is a blurred region extending from the precise region, a schematic diagram corresponding to the above-mentioned judgment rule is shown in fig. 14.
Based on a preset matching rule, in each matching area, performing matching judgment on the orthogonal polygon and the accurate area and/or the fuzzy area to obtain a photoetching hot spot detection result, wherein the method comprises the following substeps:
judging whether the precise area has the extended fuzzy area, if not, overlapping one vertex of the decomposed rectangle obtained by decomposing the orthogonal polygon with the vertex of the precise area, and carrying out matching judgment on the decomposed rectangle and the precise area according to the preset matching rule, and outputting a matching result, wherein the situation is shown in fig. 15; if yes:
Judging whether a pair of coincident adjacent edges exist between the precise area and the fuzzy area, if so, overlapping one vertex of the decomposition rectangle with the vertex which is not connected with the coincident adjacent edges in the precise area, and carrying out matching judgment on the decomposition rectangle and the precise area according to the preset matching rule, and outputting a matching result, wherein the situation is shown in fig. 16; if no:
and attaching one side of the decomposition rectangle to the side which is not overlapped with the fuzzy area in the accurate area, moving the decomposition rectangle along the connected side, overlapping one vertex of the decomposition rectangle with any vertex in the accurate area, and carrying out matching judgment on the decomposition rectangle and the accurate area according to the preset matching rule to output a matching result, wherein the situation is shown in figure 17.
In fig. 17, because at least one edge of the precise area is a non-fuzzy boundary, points used for positioning in the precise area are only attached and are matched in a moving way along the non-fuzzy boundary during matching, so that two conditions of moving matching in the x-axis direction and moving matching in the y-axis direction in the same decomposition rectangle to be matched cannot occur simultaneously (the x-axis direction is similar to the y-axis direction, the embodiment of the invention is illustrated in the x-axis direction), in fig. 17a, moving matching is performed in the x-axis direction only when the bottom edge is the non-fuzzy boundary, an A point is selected as a positioning point, then a proper vertex is searched for positioning, for example, the points A and E are overlapped, so that the coordinates of the moved decomposition rectangle are determined, then matching judgment is performed by using the preset matching rule, and a matching result and the coordinates are output if the matching is performed; and continuing to move rightwards, each time moving a unit, carrying out matching judgment on the current position by using the preset matching rule until the point B and the point G coincide, wherein the blue area is contained in the red area in the whole process.
The invention has the beneficial effects that a photoetching hot spot detection method based on overlapping judgment on a 2D layout is provided, and the method classifies three conditions for truncation and blurring problems and solves the three conditions respectively; aiming at the time consumption problem of overlapping judgment of orthogonal polygons, a rectangular decomposition method is adopted to decompose the orthogonal polygons into a plurality of rectangles, and the rectangles are used for overlapping judgment, so that the overlapping judgment speed is improved; aiming at the problem of low efficiency of traversing the graph set when matching is judged, a region division strategy is adopted to divide the layout into a plurality of sub-regions, and only graphs in the region overlapped with the current template are considered when matching is judged, so that the matching efficiency is improved.
Those skilled in the art will appreciate that implementing all or part of the above-described methods in accordance with the embodiments may be accomplished by way of a computer program stored on a computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), a random access memory (Random Access Memory, RAM) or the like.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one " does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising instructions for causing a terminal (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the method according to the embodiments of the present invention.
While the embodiments of the present invention have been illustrated and described in connection with the drawings, what is presently considered to be the most practical and preferred embodiments of the invention, it is to be understood that the invention is not limited to the disclosed embodiments, but on the contrary, is intended to cover various equivalent modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (6)
1. The photoetching hot spot detection method based on 2D overlap judgment is characterized by comprising the following steps of:
Dividing a plurality of orthogonal polygons according to a circuit module in a chip 2D layout, wherein the orthogonal polygons are subjected to rectangular decomposition based on a preset decomposition method;
dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout;
determining an accurate region in a chip 2D layout to be matched and a fuzzy region extending from the accurate region;
and carrying out matching judgment on the orthogonal polygons and the accurate region and/or the fuzzy region in each matching region based on a preset matching rule, so as to obtain a lithography hotspot detection result.
2. The method for detecting a lithography hotspot based on 2D overlay judgment according to claim 1, wherein the step of performing rectangular decomposition on the orthogonal polygon based on a preset decomposition method comprises the following sub-steps:
Classifying each side of the orthogonal polygon as a skyline or a geoline based on a ray method;
based on a plane coordinate system, forming a decomposition rectangle according to the current astronomical line and a ground line which is closest to the current astronomical line in the Y-axis direction and can completely cover the current astronomical line in the X-axis direction; wherein:
if the projection of the ground line in the X-axis direction can not completely cover the current astronomical line, cutting the current astronomical line into a cover part and a residual part according to the cover position, forming a decomposition rectangle according to the cover part and the ground line, and taking the residual part as a new astronomical line;
Repeating the steps until the orthogonal polygons are completely rectangular decomposed.
3. The method for detecting a lithography hotspot based on 2D overlay judgment according to claim 2, wherein the step of dividing a plurality of matching areas according to the orthogonal polygons divided in the chip 2D layout is specifically as follows:
constructing an envelope rectangle according to all the orthogonal polygons divided in the chip 2D layout;
And taking the left lower vertex of the envelope rectangle as the origin of a plane coordinate system, taking the left lower vertex of each orthogonal polygon as the coordinate position of the plane coordinate system, and dividing a plurality of matching areas in the plane coordinate system according to the number of all the orthogonal polygons and a preset density rule.
4. The method for detecting a lithography hotspot based on 2D overlay judgment according to claim 3, wherein in the step of performing a matching judgment on the orthogonal polygon and the precise region and/or the blurred region in each of the matching regions based on a preset matching rule, a matching judgment is performed on the precise region and/or the blurred region based on the decomposition rectangle obtained by decomposing the orthogonal polygon in the step of obtaining a lithography hotspot detection result.
5. The method for detecting a lithography hotspot based on 2D overlay determination according to claim 4, wherein the preset matching rule is specifically:
If the overlapping area of any decomposition rectangle in the orthogonal polygons and the precise area is smaller than the area of the precise area, the decomposition rectangles are not matched;
If the overlapping area of any one of the decomposition rectangles in the orthogonal polygons and the precise area is equal to the area of the precise area, and the vertex number of the orthogonal polygon in the precise area and the fuzzy area is not equal to the vertex number of the area formed by the precise area and the fuzzy area, the two areas are not matched;
and if the overlapping area of any one of the decomposition rectangles and the precise area is equal to the area of the precise area, and the vertex number of the orthogonal polygon in the precise area and the fuzzy area is equal to the vertex number of an area formed by the precise area and the fuzzy area, matching, wherein a circuit module corresponding to the orthogonal polygon has photoetching hot spots when the circuit module is overlapped with the 2D layout of the chip to be matched.
6. The method for detecting a lithography hotspot based on 2D overlay judgment according to claim 5, wherein the step of performing a matching judgment on the orthogonal polygon and the precise region and/or the fuzzy region in each matching region based on a preset matching rule to obtain a lithography hotspot detection result comprises the following sub-steps:
judging whether the precise area has the extended fuzzy area, if not, overlapping one vertex of the decomposed rectangle obtained by decomposing the orthogonal polygon with the vertex of the precise area, carrying out matching judgment on the decomposed rectangle and the precise area according to the preset matching rule, and outputting a matching result; if yes:
Judging whether a pair of coincident adjacent edges exist between the precise area and the fuzzy area, if so, overlapping one vertex of the decomposition rectangle with the vertex which is not connected with the coincident adjacent edges in the precise area, and carrying out matching judgment on the decomposition rectangle and the precise area according to the preset matching rule, and outputting a matching result; if no:
And attaching one side of the decomposition rectangle to the side which is not overlapped with the fuzzy area in the accurate area, moving the decomposition rectangle along the connected side, overlapping one vertex of the decomposition rectangle with any vertex in the accurate area, carrying out matching judgment on the decomposition rectangle and the accurate area according to the preset matching rule, and outputting a matching result.
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