CN117889597A - Refrigeration assembly and refrigeration equipment - Google Patents

Abstract

The application provides refrigeration subassembly and refrigeration plant, refrigeration subassembly includes: a refrigerating member; the defrosting device comprises a defrosting main body, a refrigerating piece and a refrigerating piece, wherein the refrigerating piece is arranged opposite to the defrosting main body, the defrosting main body comprises an electrode and an insulating medium, and the insulating medium is attached to one side of the electrode, which faces the refrigerating piece; the power supply system comprises a high-voltage output end and a low-voltage output end, wherein the high-voltage output end is electrically connected with one of the refrigerating piece or the electrode, the low-voltage output end is electrically connected with the other one of the refrigerating piece or the electrode to form plasma, and the thermal effect of the plasma is utilized to directly act on the frost on the surface of the refrigerating piece, so that water molecules are converted into liquid or gas from solid, the response speed of the refrigerating assembly is high, the discharge is stable, the heating efficiency is high, the melting speed of the frost on the surface of the refrigerating piece is high, the defrosting efficiency is high, and the technical problem of low defrosting efficiency of the refrigerating piece in the prior art is solved.

Description

Refrigeration assembly and refrigeration equipment

Technical Field

The application belongs to the technical field of refrigeration, and particularly relates to a refrigeration assembly and refrigeration equipment.

Background

In the process of cooling ambient air, a refrigerating piece in the refrigerating equipment, such as an evaporator, is easy to condense into frost on the surface of the evaporator after cooling because of higher freezing point of water molecules. For the existing evaporator, a heating pipe is generally arranged at the bottom of the evaporator to defrost the evaporator. Because the top of the evaporator is far away from the heating pipe, if the frost on the top of the evaporator is completely melted, the evaporator needs to be heated for a long time, so that defrosting efficiency is low. Therefore, how to provide a refrigeration assembly to improve the defrosting efficiency of the refrigeration member is a technical problem to be solved in the art.

Disclosure of Invention

The application provides a refrigeration subassembly and refrigeration plant to solve among the prior art the low technical problem of defrosting efficiency of refrigeration piece.

In order to solve the technical problems, the technical scheme adopted by the application is as follows: a refrigeration assembly, the refrigeration assembly comprising: a refrigerating member; the defrosting device comprises a defrosting main body, a refrigerating piece and a refrigerating piece, wherein the refrigerating piece is arranged opposite to the defrosting main body, the defrosting main body comprises an electrode and an insulating medium, and the insulating medium is attached to one side of the electrode, which faces the refrigerating piece; the power supply system comprises a high-voltage output end and a low-voltage output end, wherein the high-voltage output end is electrically connected with one of the refrigerating piece or the electrode, and the low-voltage output end is electrically connected with the other of the refrigerating piece or the electrode.

The projection of the refrigerating piece on the defrosting main body completely falls on the defrosting main body.

The electrode comprises a sub-electrode and a separator, wherein a first accommodating groove is formed in one side, facing the insulating medium, of the separator, and the sub-electrode is arranged in the first accommodating groove.

Wherein a surface of a side of the sub-electrode facing the insulating medium is flush with a surface of a side of the spacer facing the insulating medium.

Wherein, the side of the sub-electrode facing the insulating medium is at least partially protruded out of the first accommodating groove.

The insulating medium is provided with a second accommodating groove matched with the part of the sub-electrode protruding out of the first accommodating groove, and the part of the sub-electrode protruding out of the first accommodating groove is inserted into the second accommodating groove.

Wherein the separator is made of super-hydrophobic insulating material.

The refrigerating piece is an evaporator, and the evaporator is a fin type evaporator.

Wherein, the end of the inlet and outlet pipeline of the refrigerating piece is provided with an insulating piece.

The refrigerating assembly comprises a defrosting main body, wherein the defrosting main body is arranged on one side of the refrigerating piece; or, the refrigeration assembly comprises two defrosting main bodies, and the two defrosting main bodies are oppositely arranged at two sides of the refrigeration piece.

Wherein the sub-electrodes are in a square structure.

The sub-electrode comprises a plurality of sub-electrode plates which are arranged at intervals, and the sub-electrode plates are in a strip-shaped structure.

The low-voltage output end is grounded, and the high-voltage output end outputs high-voltage pulse electricity or alternating current.

The high-voltage output end is grounded, and the low-voltage output end outputs negative high voltage.

A refrigeration apparatus includes the refrigeration assembly.

Different from the prior art, the beneficial effect of this application embodiment is: the refrigerating assembly comprises a refrigerating piece, a defrosting body and a power supply system, the refrigerating piece and the defrosting body are oppositely arranged, the defrosting body comprises an electrode and an insulating medium, the insulating medium is attached to one side of the electrode, which faces the refrigerating piece, the insulating medium faces away from the electrode, one side of the insulating medium is close to the refrigerating piece, the power supply system comprises a high-voltage output end and a low-voltage output end, the high-voltage output end is electrically connected with one of the refrigerating piece or the electrode, the low-voltage output end is electrically connected with the other one of the refrigerating piece or the electrode, the defrosting body is arranged on one side of the refrigerating piece through the defrosting body, the defrosting body and the refrigerating piece form a medium blocking structure to generate plasma, the thermal effect of the plasma is utilized to directly act on frost on the surface of the refrigerating piece, so that water molecules are converted into liquid or gas from solid state, the refrigerating assembly is high in heating efficiency, stable in discharging and high in response speed, the melting rate of the frost is improved, and the energy consumption is reduced. The plasma contains a large amount of high-energy electrons, the high-energy electrons can physically collide with frost on the surface of the refrigeration piece, so that chemical bonds among frozen water molecules are broken, the purpose of deicing is achieved, the high-efficiency and low-energy-consumption defrosting device has the advantages of being rapid, efficient and low in energy consumption, and the technical problem that defrosting efficiency of the refrigeration piece is low in the prior art is solved.

Drawings

For a clearer description of the technical solutions in the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:

FIG. 1 is a schematic structural view of one embodiment of a defrosting body provided herein;

FIG. 2 is a schematic structural view of another embodiment of a defrosting body provided herein;

FIG. 3 is a schematic view of a first embodiment of a refrigeration assembly provided herein;

FIG. 4 is a schematic diagram of a first mating relationship between the sub-electrodes and the power system provided in FIG. 3;

FIG. 5 is a schematic diagram of a second mating relationship between the sub-electrodes and the power system provided in FIG. 3;

FIG. 6 is a schematic view of a second embodiment of a refrigeration assembly provided herein;

FIG. 7 is a schematic diagram of a first mating relationship between the sub-electrodes and the power system provided in FIG. 6;

FIG. 8 is a schematic diagram of a second mating relationship between the sub-electrodes and the power system provided in FIG. 6;

FIG. 9 is a schematic view of a third embodiment of a refrigeration assembly provided herein;

FIG. 10 is a schematic diagram of a first mating relationship between the sub-electrodes and the power system provided in FIG. 9;

FIG. 11 is a schematic diagram of a second mating relationship between the sub-electrodes and the power system provided in FIG. 9;

FIG. 12 is a schematic view of a first mating relationship of a neutron electrode and a power supply system in a fourth embodiment of a refrigeration assembly provided herein;

fig. 13 is a schematic structural view of a second mating relationship of a neutron electrode and a power supply system in a fourth embodiment of a refrigeration assembly provided herein.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

Referring to fig. 1 to 5, fig. 1 is a schematic structural diagram of an embodiment of a defrosting body provided in the present application; FIG. 2 is a schematic structural view of another embodiment of a defrosting body provided herein; FIG. 3 is a schematic view of a first embodiment of a refrigeration assembly provided herein; FIG. 4 is a schematic diagram of a first mating relationship between the sub-electrodes and the power system provided in FIG. 3; fig. 5 is a schematic structural diagram of a second mating relationship between the sub-electrodes and the power supply system provided in fig. 3.

The present application provides a refrigeration assembly 100 and a refrigeration device 500, the refrigeration assembly 100 being disposed in the refrigeration device 500. The refrigeration assembly 100 includes a refrigeration unit 10, the refrigeration unit 10 being configured to provide cool air to a refrigeration compartment of a refrigeration appliance 500. In the process of heat exchange of the surrounding air by the refrigeration piece 10, because the freezing point of water molecules is higher, after the water molecules are cooled, the water molecules are easy to condense into frost on the surface of the refrigeration piece 10, so that the heat exchange efficiency of the refrigeration piece 10 is reduced. Therefore, defrosting of the refrigeration unit 10 is required to improve the heat exchange efficiency of the refrigeration unit 10.

In some embodiments, the refrigeration 10 may include a coil 12 and a number of heat dissipating fins 11. The plurality of heat dissipation fins 11 are fixed by the coil pipes 12, and any two adjacent heat dissipation fins 11 can be separated by a certain distance to form a heat dissipation channel 10a. The refrigerating assembly 100 includes a defrosting body 20, and the defrosting body 20 is disposed at one side of the refrigerating member 10. The defrosting body 20 is disposed opposite to the refrigerating part 10. The defrosting body 20 can also be closely attached to the refrigerating piece 10, at this time, the plane where the defrosting body 20 is located can be perpendicular to the plane where the radiating fins 11 are located or set at a certain angle, so that the defrosting body 20 can seal the radiating channel 10a on one side of the refrigerating piece 10 close to the defrosting body 20. Alternatively, the defrosting body 20 and the refrigerating member 10 may be spaced apart from each other by a certain distance, and at this time, a gap between the defrosting body 20 and the refrigerating member 10 communicates with the heat dissipation passage 10a.

The defrosting body 20 includes an electrode 21 and an insulating medium 22. An insulating medium 22 is applied to the side of the electrode 21 facing the refrigerating element 10. The side of the insulating medium 22 facing away from the electrode 21 abuts against the refrigerating element 10 to form a plasma in the heat dissipation channel 10a and on the surface of the heat dissipation fins 11. Of course, the defrosting body 20 and the refrigerating element 10 may be arranged at a certain distance, a differential voltage is input to the electrode 21 and the refrigerating element 10, and a plasma is generated in the gap between the defrosting body 20 and the refrigerating element 10.

In some embodiments, the refrigeration assembly 100 further includes a power system 30, the power system 30 including a high voltage output 31 and a low voltage output 32, the high voltage output 31 being electrically connected to one of the refrigeration member 10 or the electrode 21, the low voltage output 32 being electrically connected to the other of the refrigeration member 10 or the electrode 21.

The power supply system 30 inputs a differential voltage to the electrode 21 and the refrigerating element 10, and a discharge space, that is, an electric field, is formed between the electrode 21 and the refrigerating element 10. The insulating medium 22 is placed in the electric field so that the gas passing through the electric field is in an unbalanced state. When a sufficiently high differential voltage is applied between the electrode 21 and the cooling member 10, charged particles obtaining kinetic energy collide with gas molecules under the action of an electric field, so that the surface gas in the heat dissipation channel 10a and the heat dissipation fins 11 is broken down to discharge, and if a gap is formed between the defrosting body 20 and the cooling member 10, the gas between the defrosting body 20 and the cooling member 10 is broken down to discharge, that is, dielectric barrier discharge is generated, so that plasma is generated. Dielectric barrier discharge can also be called streamer discharge or silent discharge, and can work in a high pressure and wide frequency range, and in general, the working frequency can be 50Hz-100kHz, and the working voltage can be 5V-50kV. The plasma is generated through dielectric barrier discharge, and the device has the advantages of small limitation of discharge space, simple structure, quick dynamic response, low energy consumption, wide excitation frequency band, no noise and the like, and has good application prospect.

The electrode 21 includes a sub-electrode 212 and a spacer 211, the spacer 211 having a first accommodation groove 211a on a side facing the insulating medium 22, the sub-electrode 212 being disposed in the first accommodation groove 211a. The surface of the side of the sub-electrode 212 facing the insulating medium 22 is flush with the surface of the side of the spacer 211 facing the insulating medium 22, so that the sub-electrode 212 is completely accommodated in the first accommodating groove 211a. The separator 211 can isolate the sub-electrode 212 from the external environment, so that short circuit is avoided during operation, and the working safety is ensured. The spacers 211 also prevent the sub-electrodes 212 from reacting with oxygen and moisture in the air, and prevent the sub-electrodes 212 from being corroded, thereby protecting the sub-electrodes 212.

The spacer 211 may be selected from superhydrophobic insulating materials. The spacer 211 may have a plate-like structure having a certain thickness so as to open the first receiving groove 211a. The spacer 211 may also be a superhydrophobic coating film coated on a side of the sub-electrode 212 facing away from the insulating medium 22 and an end surface of the sub-electrode 212 in the thickness direction, or coated on a portion of the insulating medium 22 facing the side of the sub-electrode 212 and not contacting the sub-electrode 212, thereby enhancing the insulating effect. The specific material of the spacer 211 may be determined according to the specific situation, and only the above condition needs to be satisfied.

The insulating medium 22 has a certain high resistivity and a high dielectric constant. In some embodiments, the insulating medium 22 may be selected from a polytetrafluoroethylene member, an organic glass member, a quartz glass member, a ceramic member, a temperature-resistant borosilicate glass member, or an epoxy resin member, and may be made of any two or more insulating materials such as polytetrafluoroethylene, organic glass, quartz glass, ceramic, wen Guipeng glass, and epoxy resin. The insulating medium 22 should have a certain thickness so as to avoid breakdown. Some of the insulating medium 22 is also a superhydrophobic insulating material, such as polytetrafluoroethylene. When the insulating medium 22 is selected from the super-hydrophobic insulating materials, the material of the spacer 211 may be the same as that of the insulating medium 22. The polytetrafluoroethylene member has excellent chemical stability, corrosion resistance, sealing property, high lubrication non-stick property, electrical insulation property and good aging resistance, and can be used as the insulating medium 22 and the spacer 211.

The sub-electrodes 212 may be mesh electrodes woven from metal wires or sheet electrodes made from metal sheets. The material of the sub-electrode 212 may be selected from simple substances such as gold, silver, copper, platinum, palladium, or graphite, and may be selected from metal alloys having conductivity, oxidation resistance, and corrosion resistance. To enhance the discharge capability of the sub-electrode 212, a conductive coating may be provided on the surface of the sub-electrode 212, and the conductive coating may be selected from a graphite layer, a graphene layer, a fullerene layer, an activated carbon layer, an acetylene layer, an organic carbon layer, and the like.

The high voltage output 31 is electrically connected to one of the refrigerator 10 or the sub-electrode 212, and the low voltage output 32 is electrically connected to the other of the refrigerator 10 or the sub-electrode 212. When the refrigerating element 10 is electrically connected to the high voltage output terminal 31, the sub-electrode 212 is electrically connected to the low voltage output terminal 32; when the cooling member 10 is electrically connected to the low voltage output terminal 32, the sub-electrode 212 is electrically connected to the high voltage output terminal 31. The low voltage output terminal 32 is grounded, and the high voltage output terminal 31 outputs high voltage pulse electricity or alternating current. The specific embodiment of the power supply system 30 may be specific, and only a certain potential difference between the refrigerating element 10 and the sub-electrode 212 needs to be ensured. The dielectric barrier discharge may be driven by an ac voltage or a high voltage pulse voltage, and thus the power supply system 30 may be an ac power supply or a high voltage pulse power supply.

The sub-electrodes 212 may have a square structure. Under the driving action of the power supply system 30, a relatively uniform electric field is formed, large-area stable discharge is realized, and the stability of the refrigeration assembly 100 is ensured.

When the power supply system 30 applies a differential voltage to the refrigerating element 10 and the sub-electrode 212, the state of the gas molecules in the heat dissipation channel 10a and the gas molecules on the surface of the heat dissipation fin 11 undergo three-stage changes along with the increase of the voltage supplied by the power supply system 30, and if a gap is formed between the defrosting body 20 and the refrigerating element 10, the state of the gas molecules between the defrosting body 20 and the refrigerating element 10 also undergo three-stage changes, that is, the state gradually transits from the insulating state to the discharging state, and finally breakdown occurs.

The surfaces of the heat dissipation channels 10a and the heat dissipation fins 11 are discharge regions 40. If there is a gap between the defrosting body 20 and the refrigerating element 10, the gap is also a discharge area 40. When the voltage supplied by the power supply system 30 is too low, although some gas molecules are ionized and diffused freely in the discharge region 40, the current is zero because the ionized gas molecules are too few and the current is too small, so that the gas molecules in the discharge region 40 are subjected to plasma reaction. As the voltage supplied by the power supply system 30 increases, the number of electrons in the discharge region 40 increases, but when the breakdown voltage of the gas molecules is not reached, the electric field strength between the refrigerating element 10 and the sub-electrode 212 is weak, and thus, sufficient energy cannot be provided to cause inelastic collision of the gas molecules. Because of the lack of inelastic collisions, the number of electrons cannot be increased significantly, and thus the gas molecules in the discharge region 40 remain in an insulating state, and no discharge can be generated, the current at this time increases slightly with an increase in the voltage supplied by the power supply system 30, but is almost zero.

If the power supply system 30 continues to supply voltage, electrons transfer energy to the gas molecules in the discharge region 40 when the electric field strength between the cooling member 10 and the sub-electrode 212 is strong enough to cause inelastic collisions of the gas molecules, and the gas molecules are excited. After the gas molecules are excited, electron avalanches occur in the discharge region 40, forming an intrinsic electric field which is superimposed with the initial electric field between the refrigerating element 10 and the electrode 21, forming a strong local electric field, causing the electrons to be further accelerated. Therefore, the discharge area 40 can form a great amount of micro-fine wire pulse streamer micro-discharge very fast, so that a great amount of plasmas are formed in the discharge area 40, and the plasmas have a thermal effect, so that the dielectric barrier discharge process can be accompanied with the temperature rise, the surface of the refrigeration piece 10 is heated fast, and the frost covered on the surface of the refrigeration piece 10 is melted, thereby achieving the defrosting purpose.

The dielectric barrier discharge is utilized to generate plasma in the discharge area 40, and the thermal effect of the plasma is utilized to directly act on the frost on the surface of the refrigerating piece 10, so that the response speed is high, the frost melting rate is improved, the energy consumption is low, and the energy conservation is facilitated. The plasma contains a large amount of high-energy electrons, and the high-energy electrons can physically collide with frost on the surface of the refrigerating piece 10, so that chemical bonds among frozen water molecules are broken, the purpose of deicing is achieved, and the device has the advantages of being rapid, efficient, low in energy consumption and the like.

The projection of the refrigerating element 10 on the defrosting body 20 completely falls on the defrosting body 20, and ensures that the refrigerating element 10 is completely positioned in the discharge area 40, so that plasma generated in the dielectric barrier discharge process is fully acted on the surface of the refrigerating element 10, and the defrosting rate is ensured. The surface area of the side of the defrosting body 20 opposite to the refrigerating part 10 may be equal to or slightly larger than the sectional area of the maximum section of the defrosting body 20, so that the plasma can be sufficiently covered on the ice coating of the surface of the refrigerating part 10 to ensure that the frost of the surface of the refrigerating part 10 can be sufficiently melted, and the defrosting rate is further improved.

During the dielectric barrier discharge, electrons will make an accelerated migration motion in the discharge region 40, and the plasma will rapidly cover the frost on the surface of the refrigerating member 10. The dielectric barrier discharge process is an integral and rapid process, so that the scheme of removing frost by the conventional heating pipe can be replaced, the defrosting efficiency is improved on the premise of greatly reducing the energy consumption, and the scheme of mechanically crushing ice can be replaced, so that the refrigerating piece 10 is prevented from being mechanically damaged. The dielectric barrier discharge is utilized to remove the frost on the surface of the refrigerating piece 10, and the dielectric barrier discharge type refrigerating piece has the advantages of high heating efficiency, stable discharge, simple structure, high response speed, energy conservation, environmental protection and the like, has obvious defrosting effect, is easy to realize, and has good application scene.

An insulating medium 22 is arranged between the refrigerating element 10 and the electrode 21, which has a very important ballasting effect on the formation of pulsed streamer microdischarges. On the one hand, the existence of the insulating medium 22 effectively limits the movement of charged particles so as to prevent the unlimited increase of discharge current, thereby avoiding the formation of spark discharge or arc discharge in the discharge area 40, preventing energy loss, saving energy and conforming to the low-carbon environment-friendly concept; on the other hand, the existence of the insulating medium 22 can uniformly and stably distribute the pulsed streamer micro-discharge in the whole discharge area 40, which is beneficial to obtaining a large amount of plasmas and ensuring defrosting efficiency and defrosting effect.

During the dielectric barrier discharge process, neutral gas molecules in the discharge region 40 are largely ionized, and a large amount of active substances such as high-energy electrons, active radicals and strong oxidizing molecules, and a small amount of ozone are formed, possibly accompanied by the generation of ultraviolet light. These active substances may degrade organic contaminants flowing through the discharge region 40 into carbon dioxide molecules and water molecules, thereby decomposing odor molecules and inhibiting bacterial activity. Moreover, the active material, ultraviolet light and ozone generated in the discharge region 40 can sterilize the refrigerating member 10, thereby achieving the enhanced sterilization and purification effects and thus the effect of purifying air.

The refrigeration member 10 may be an evaporator, which may be a fin evaporator. Of course, the evaporator may be a plate tube evaporator or other type of evaporator. The refrigerating element 10 can be a large-sized evaporator or a small-sized evaporator, and the refrigerating assembly 100 has high response speed and high defrosting efficiency and has good market application value.

The end of the inlet and outlet line of the refrigerating element 10 is provided with an insulating element. Specifically, an insulating pipe section may be disposed at the end of the inlet and outlet pipe of the refrigeration unit 10, and the current connected to the refrigeration unit 10 is prevented from being conducted into the external pipe by the insulating pipe section, thereby playing a role of leakage protection.

The refrigeration assembly 100 also includes a water tray (not shown) that may be provided on the side of the refrigeration unit 10 adjacent the floor. The condensate water that utilizes the water collector to collect refrigeration piece 10 to produce can thoroughly drain the condensate water that the water collector was collected through the drain pipe, avoids the unable discharge of condensate water to cause secondary frosting, leads to refrigeration piece 10 heat exchange inefficiency to improve refrigeration piece 10's heat exchange efficiency.

Referring to fig. 6 to 8, fig. 6 is a schematic structural diagram of a second embodiment of a refrigeration assembly provided in the present application; FIG. 7 is a schematic diagram of a first mating relationship between the sub-electrodes and the power system provided in FIG. 6; FIG. 8 is a schematic diagram of a second mating relationship between the sub-electrodes and the power system as provided in FIG. 6. The side of the sub-electrode 212 facing the insulating medium 22 protrudes at least partially from the first accommodating groove 211a. The insulating medium 22 has a second accommodating groove 22a which is matched with the part of the sub-electrode 212 protruding from the first accommodating groove 211a, and the part of the sub-electrode 212 protruding from the first accommodating groove 211a is inserted into the second accommodating groove 22a. The surfaces of the insulating medium 22 and the spacers 211 that are in contact with each other need to be kept in sealing connection, thereby ensuring the isolating effect of the sub-electrodes 212. The sub-electrodes 212 are disposed in the first and second accommodation grooves 211a and 22a, so that the influence of thermal expansion and contraction on the overall structure of the defrosting body 20 can be avoided to some extent. The stability of the structure of the defrosting body 20 is ensured, and the electric field of the discharge region 40 is more stable, thereby improving ionization efficiency and plasma generation efficiency, and further improving the melting efficiency of the frost on the surface of the refrigerating member 10.

In some embodiments, the refrigeration assembly 100 has a refrigeration compartment 101, with the refrigeration assembly 100 disposed in the refrigeration compartment 101. The cooling bin 101 has an air supply port 101a and an air return port 101b, the air supply port 101a and the air return port 101b being adapted to be connected to a cooling compartment of the cooling apparatus 500.

Referring to fig. 9 to 11 together, fig. 9 is a schematic structural diagram of a third embodiment of a refrigeration assembly provided in the present application; FIG. 10 is a schematic diagram of a first mating relationship between the sub-electrodes and the power system provided in FIG. 9; FIG. 11 is a schematic diagram of a second mating relationship between the sub-electrodes and the power system as provided in FIG. 9. The sub-electrode 212 includes a number of sub-plates 212a. The sub-plates 212a are arranged at intervals, and the sub-plates 212a are in a strip-shaped structure. The separator 211 has a plurality of first accommodating grooves 211a matched with a plurality of sub-plates 212a, and the plurality of sub-plates 212a are disposed in the first accommodating grooves 211a one by one. The refrigeration assembly 100 may be disposed between the air supply port 101a and the air return port 101b, and the length direction of the refrigeration assembly 100 may be consistent with the air flowing direction in the refrigeration compartment 101, and the plurality of sub-electrode plates 212a are disposed at intervals in the air flowing direction. The sub-polar plates 212a are arranged at a plurality of positions of the refrigerating bin 101, so that a plurality of electric fields are formed between the sub-polar plates 212a and the refrigerating bin 101, and the plasmas are driven to do acceleration motion under the action of the electric fields, so that the diffusion of the plasmas is promoted, and the ionic wind with higher wind speed is formed. Because the ion wind is different from the wind formed by the air flow, the ion wind mainly consists of plasmas moving at high speed, when the plasmas moving at high speed strike the frost surface of the refrigerating element 10, the energy carried by the plasmas is absorbed by water molecules on the frost surface, so that the kinetic energy of the water molecules is improved, and the melting speed of the water molecules is increased. Meanwhile, the plasmas are deposited on the surface of the frost to improve the heat conduction rate of the frost, so that the frost can absorb heat from the surrounding environment more quickly, and the melting speed of the frost is improved. The plasma contains a large amount of high-energy electrons, and the high-energy electrons can physically collide with frost on the surface of the refrigerating piece 10, so that chemical bonds among frozen water molecules are broken, and the purpose of deicing is achieved.

The thickness of the frost formed varies due to the different locations of the cooling element 10. The moisture content in the air gradually decreases in the direction from the return air inlet 101b to the air outlet 101a of the cooling compartment 101. The thickness of the frost formed on the cooling element 10 gradually decreases in the direction from the return air inlet 101b to the supply air inlet 101a of the cooling chamber 101. A number of sub-plates 212a are arranged in parallel. When the refrigerating element 10 is electrically connected with the high-voltage output end 31, the plurality of sub-polar plates 212a are electrically connected with the low-voltage output end 32 after being connected in parallel, at this time, the high-voltage output end 31 is grounded, the electric potential thereof is zero, the low-voltage output end 32 outputs negative high voltage, and the power supply system 30 can be a negative high-voltage direct current power supply. When the refrigerating element 10 is electrically connected to the low-voltage output end 32, the plurality of sub-polar plates 212a are electrically connected to the high-voltage output end 31 after being connected in parallel, the low-voltage output end 32 is grounded, the electric potential is zero, the high-voltage output end 31 outputs high-voltage pulse electricity or alternating current, and the power supply system 30 can be a high-voltage pulse power supply or an alternating current power supply.

In the direction from the return air inlet 101b to the air supply outlet 101a of the cooling bin 101, the thickness of the frost formed by the cooling element 10 gradually decreases, so that the input voltage of the sub-polar plate 212a may correspondingly gradually decrease. The thicker area of the refrigerating piece 10 is frosted by using a higher-intensity electric field, so that the defrosting effect is improved; the thinner areas of the refrigeration member 10 are frosted with a lower electric field to reduce energy consumption. Defrosting the refrigerating piece 10 according to the requirement can reduce energy consumption and enhance defrosting effect. The sub-electrode 212 is composed of a plurality of sub-electrode plates 212a, and an adjustable voltage is provided for each sub-electrode plate 212a according to the requirement, so that time-controllable and intensity-controllable defrosting of the corresponding area of the refrigerating piece 10 is realized, defrosting efficiency is improved, and defrosting energy consumption is reduced.

Referring to fig. 12 to 13 together, fig. 12 is a schematic structural diagram illustrating a first matching relationship between a neutron electrode and a power system in a fourth embodiment of a refrigeration assembly according to the present disclosure; fig. 13 is a schematic structural view of a second mating relationship of a neutron electrode and a power supply system in a fourth embodiment of a refrigeration assembly provided herein. The refrigerating assembly 100 includes two defrosting bodies 20, the size and shape of the defrosting bodies 20 are set corresponding to those of the refrigerating member 10, and the two defrosting bodies 20 are mirror images of each other. The two defrosting bodies 20 are oppositely arranged at two sides of the refrigerating piece 10, namely, one defrosting body 20 is arranged at one side of the refrigerating piece 10, and the other defrosting body 20 is arranged at the other side of the refrigerating piece 10. In some embodiments, the refrigerating element 10 is electrically connected to the high-voltage output terminal 31, the sub-electrodes 212 corresponding to the two defrosting bodies 20 are electrically connected to the low-voltage output terminal 32, and the low-voltage output terminal 32 may be grounded; alternatively, the refrigerating unit 10 is electrically connected to the low voltage output terminal 32, the sub-electrodes 212 corresponding to the two defrosting bodies 20 are electrically connected to the high voltage output terminal 31, and the low voltage output terminal 32 is grounded. By providing two defrosting bodies 20, the refrigerating part 10 can be simultaneously defrosted from both sides, thereby further improving defrosting efficiency.

The refrigeration assembly 100 may also include a sensor (not shown) for detecting the condition of frost on the surface of the refrigeration member 10 and a controller (not shown). In some embodiments, when the sensor detects that the thickness of the frost on the surface of the refrigerator 10 is greater than a first preset thickness, the refrigerator assembly 100 exits the refrigerator mode and enters the defrost mode. The controller regulates the power supply system 30 such that the power supply system 30 applies a differential voltage to the refrigerator 10 and the sub-electrodes 212 to generate dielectric barrier discharge and plasma, thereby removing frost from the surface of the refrigerator 10. The defrosting speed of the refrigerating element 10 can be adjusted by adjusting the differential voltage applied to the refrigerating element 10 and the sub-electrode 212 by the power supply assembly 39. When the sensor detects that the thickness of the frost on the surface of the cooling element 10 is smaller than the second preset thickness, the cooling assembly 100 exits the defrosting mode and enters the cooling mode.

The application provides refrigeration subassembly and refrigeration plant, refrigeration subassembly includes the refrigeration piece, defrosting main part and electrical power generating system, refrigeration piece sets up relatively with the defrosting main part, the defrosting main part includes electrode and insulating medium, insulating medium pastes and covers in electrode one side towards the refrigeration piece, insulating medium deviates from one side of electrode and is close to the refrigeration piece, electrical power generating system includes high-pressure output and low-pressure output, high-pressure output is connected with one of refrigeration piece or electrode electricity, low-pressure output is connected with another one of refrigeration piece or electrode electricity, through setting up the defrosting main part, and set up the defrosting main part in one side of refrigeration piece, make defrosting main part and refrigeration piece form the medium and block the structure, in order to produce plasma, utilize the frost of the direct effect on refrigeration piece surface of plasma, thereby make the hydrone convert liquid or gaseous from the solid state, refrigeration subassembly heating efficiency is high, discharge stability, response speed is fast, the rate of melting of ice has been improved, and the energy consumption is reduced. The plasma contains a large amount of high-energy electrons, the high-energy electrons can physically collide with frost on the surface of the refrigeration piece, so that chemical bonds among frozen water molecules are broken, the purpose of deicing is achieved, the high-efficiency and low-energy-consumption defrosting device has the advantages of being rapid, efficient and low in energy consumption, and the technical problem that defrosting efficiency of the refrigeration piece is low in the prior art is solved.

The foregoing description is only the embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (15)

1. A refrigeration assembly, the refrigeration assembly comprising:

a refrigerating member;

the defrosting device comprises a defrosting main body, a refrigerating piece and a refrigerating piece, wherein the refrigerating piece is arranged opposite to the defrosting main body, the defrosting main body comprises an electrode and an insulating medium, and the insulating medium is attached to one side of the electrode, which faces the refrigerating piece;

the power supply system comprises a high-voltage output end and a low-voltage output end, wherein the high-voltage output end is electrically connected with one of the refrigerating piece or the electrode, and the low-voltage output end is electrically connected with the other of the refrigerating piece or the electrode.

2. A refrigeration assembly according to claim 1,

and the projection of the refrigerating piece on the defrosting main body completely falls on the defrosting main body.

3. The refrigeration assembly of claim 2, wherein the electrode comprises a sub-electrode and a spacer, the spacer having a first receiving groove on a side facing the insulating medium, the sub-electrode being disposed in the first receiving groove.

4. A refrigeration assembly according to claim 3, wherein the surface of the side of said sub-electrode facing said insulating medium is flush with the surface of the side of said separator facing said insulating medium.

5. A refrigeration assembly according to claim 3, wherein a side of said sub-electrode facing said insulating medium protrudes at least partially out of said first receiving groove.

6. The refrigeration assembly of claim 5, wherein said dielectric medium has a second receiving groove in cooperation with a portion of said sub-electrode protruding from said first receiving groove, said portion of said sub-electrode protruding from said first receiving groove being inserted into said second receiving groove.

7. The refrigeration assembly of any of claims 3-6, wherein the separator is a superhydrophobic insulating material.

8. The refrigeration assembly of claim 7, wherein the refrigeration member is an evaporator, and wherein the evaporator is a fin evaporator.

9. The refrigeration assembly of claim 8, wherein an end of the inlet and outlet line of the refrigeration member is provided with an insulator.

10. The refrigeration assembly of claim 9, wherein said refrigeration assembly includes one of said defrosting bodies disposed on one side of said refrigeration member;

or, the refrigeration assembly comprises two defrosting main bodies, and the two defrosting main bodies are oppositely arranged at two sides of the refrigeration piece.

11. The refrigeration assembly of claim 10, wherein the sub-electrodes are square in configuration.

12. The refrigeration assembly of claim 10, wherein the sub-electrode comprises a plurality of sub-plates, the plurality of sub-plates being spaced apart, the sub-plates being in a bar-like configuration.

13. The refrigeration assembly of claim 1, wherein the low voltage output is grounded and the high voltage output outputs high voltage pulsed electricity or alternating current.

14. The refrigeration assembly of claim 1, wherein the high voltage output is grounded and the low voltage output outputs a negative high voltage.

15. A refrigeration device comprising a refrigeration assembly according to any one of claims 1 to 14.