CN117877824A

CN117877824A - High temperature resistant insulating film

Info

Publication number: CN117877824A
Application number: CN202311080805.7A
Authority: CN
Inventors: 苏润
Original assignee: Illinois Tool Works Inc
Current assignee: Illinois Tool Works Inc
Priority date: 2022-10-11
Filing date: 2023-08-25
Publication date: 2024-04-12
Also published as: CN221175879U

Abstract

The application discloses a method for producing a high temperature resistant insulating film, which comprises the following steps: coating the upper surface and the lower surface of the mica layer with a material in a non-cured state; curing the material in the uncured state. The high-temperature-resistant insulating film produced by the method disclosed by the application not only has excellent high-temperature resistance, excellent mechanical property and excellent insulating property, but also has simple production process and greatly lower cost than a common plastic film.

Description

High temperature resistant insulating film

Technical Field

The application relates to the field of films, in particular to a high-temperature-resistant insulating film.

Background

Insulating films are used to isolate various electronic devices or components to avoid failure of electronic components between or among the electronic devices or components due to short circuits, breakdown, etc. Some insulating films also need to have high temperature resistance to reduce the influence of local high temperature of electronic devices or components, thereby ensuring the normal operation of various electronic devices or components.

Disclosure of Invention

The purpose of the application is to provide a high temperature resistant insulating film which is used for electronic devices or components, can meet the requirements of the electronic devices or components on insulativity, and has better high temperature resistant capability. Meanwhile, the high-temperature resistant insulating film has the characteristics of good mechanical property and the like so as to meet the requirements of use environments.

The present application provides in a first aspect a method of producing a high temperature resistant insulating film comprising the steps of: coating the upper surface and the lower surface of the mica layer, which are insulated at high temperature, with a material in a non-cured state; and curing the material in the non-cured state to obtain an upper additional layer of high temperature resistant insulation attached to the upper surface of the mica layer and a lower additional layer of high temperature resistant insulation attached to the lower surface of the mica layer, the outer surface of the upper additional layer of high temperature resistant insulation forming a first outer surface of the high temperature resistant insulation film of high temperature resistant insulation, and the outer surface of the lower additional layer of high temperature resistant insulation forming a second outer surface of the high temperature resistant insulation film of high temperature resistant insulation.

According to the first aspect, the step of coating the upper and lower surfaces of the mica layer with the material in the uncured state is performed by a roll coating process, a blade coating process, or a spray coating process.

According to the first aspect described above, the step of curing the material in the uncured state is performed by radiation initiation.

According to the first aspect, the radiation is ultraviolet radiation, the wavelength of the ultraviolet radiation is 300-370 nm, and the radiation intensity of the ultraviolet light source is 60-120 w/cm.

According to the first aspect, the coating thickness of the material in the uncured state is 0.02 to 0.05mm.

According to the first aspect, the material in the uncured state is an epoxy resin coating, and the step of curing the material in the uncured state is performed by heating the material in the uncured state to 60 to 120 ℃.

According to the first aspect, the coating thickness of the epoxy resin coating in the uncured state is 0.02 to 0.1mm.

According to the first aspect, the material in the uncured state is a PU coating, and the step of curing the material in the uncured state is performed by drying.

According to the first aspect, the thickness of the mica layer high temperature resistant insulation is 0.1-3 mm, and the thickness of the cured upper additional layer high temperature resistant insulation and the lower additional layer high temperature resistant insulation is within 100 μm.

The present application provides in a second aspect a method of producing a high temperature resistant insulating film comprising the steps of: coating glue on the upper surface and the lower surface of the mica layer high-temperature resistant insulation to obtain an upper bonding layer high-temperature resistant insulation and a lower bonding layer high-temperature resistant insulation respectively; the upper additional layer high temperature resistant insulation is adhered to the upper surface of the mica layer high temperature resistant insulation through the upper bonding layer high temperature resistant insulation, and the lower additional layer high temperature resistant insulation is adhered to the lower surface of the mica layer high temperature resistant insulation through the lower bonding layer high temperature resistant insulation, so that the outer surface of the upper additional layer high temperature resistant insulation forms the first outer surface of the high temperature resistant insulation film high temperature resistant insulation, and the outer surface of the lower additional layer high temperature resistant insulation forms the second outer surface of the high temperature resistant insulation film high temperature resistant insulation.

According to the second aspect described above, the step of bonding the upper additional layer high temperature resistant insulation to the upper surface of the mica layer high temperature resistant insulation through the upper adhesive layer high temperature resistant insulation, and bonding the lower additional layer high temperature resistant insulation to the lower surface of the mica layer high temperature resistant insulation through the lower adhesive layer high temperature resistant insulation includes: plastic films are respectively applied to the upper adhesive layer high temperature resistant insulation and the lower adhesive layer high temperature resistant insulation, and the plastic films are bonded to the upper surface and the lower surface of the mica layer high temperature resistant insulation by a lamination process to obtain the upper additional layer high temperature resistant insulation and the lower additional layer high temperature resistant insulation.

According to the second aspect, the temperature of the lamination process is 95-125 ℃ and the pressure is 3-25 Mpa.

According to the second aspect, the speed of applying the upper additional layer high temperature resistant insulation and the lower additional layer high temperature resistant insulation is 2-20 m/min.

According to the second aspect, the coating thickness of the upper adhesive layer high temperature resistant insulation and the lower adhesive layer high temperature resistant insulation is 0.01 to 0.05mm.

According to the second aspect described above, the lamination process is such that the total thickness of the upper additional layer high temperature resistant insulation and the upper adhesive layer high temperature resistant insulation and the total thickness of the lower additional layer high temperature resistant insulation and the lower adhesive layer high temperature resistant insulation are both within 100 μm.

Drawings

Fig. 1A is a schematic perspective view of one embodiment of a high temperature resistant insulating film according to the present application;

fig. 1B is a cross-sectional view of the high temperature resistant insulating film shown in fig. 1A along line A-A;

fig. 1C is a schematic perspective view of another embodiment of a high temperature resistant insulating film according to the present application;

fig. 1D is a cross-sectional view of the high temperature resistant insulating film shown in fig. 1C along line B-B;

fig. 2A is a flowchart for producing the high temperature resistant insulating film shown in fig. 1A;

fig. 2B is a flowchart for producing the high temperature resistant insulating film shown in fig. 1A;

FIG. 2C is a schematic view of a spray coating device;

FIG. 2D is a schematic diagram of a lamination apparatus;

fig. 3A is a schematic perspective view of a battery module including the high temperature resistant insulating film shown in fig. 1A;

fig. 3B is an exploded view of the battery module shown in fig. 3A.

Detailed Description

Various embodiments of the present application are described below with reference to the accompanying drawings, which form a part hereof. It is to be understood that, although directional terms, such as "front", "rear", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", etc., may be used in this application to describe various example structural portions and elements of the present application, these terms are used herein for convenience of description only and are determined based on the example orientations shown in the drawings. Because the embodiments disclosed herein may be arranged in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting.

In this application, unless otherwise indicated, all units and materials are commercially available or are commonly used in the industry, and the methods described in the examples below are conventional in the art unless otherwise indicated.

The mica layer in the application is formed by bonding mica paper or mica powder with a binder and then heating and pressing. Wherein the mica accounts for about 90% by weight and the binder accounts for about 10% by weight. As one example, the binder is a silicone glue. The mica paper or mica powder may be phlogopite, muscovite or other synthetic mica. In certain embodiments, the mica layer is a commercially available mica sheet or mica board.

Fig. 1A and 1B illustrate a specific structure of a high temperature resistant insulating film 100 according to an embodiment of the present application. As shown in fig. 1A and 1B, the high temperature resistant insulating film 100 includes a mica layer 101, an upper additional layer 102, and a lower additional layer 103. As an example, the thickness of the mica layer 101 is 0.1 to 3mm, and the thickness of the upper and lower additional layers 102 and 103 is within 100 μm.

The inner surface of the upper additional layer 102 is attached to the upper surface of the mica layer 101, and the outer surface of the upper additional layer 102 forms the first outer surface (i.e., the upper outer surface) of the high temperature resistant insulating film 100. In the embodiment shown in fig. 1A and 1B, the inner surface of the upper additional layer 102 is directly attached to the upper surface of the mica layer 101. The inner surface of the lower additional layer 103 is attached to the lower surface of the mica layer 101, and the outer surface of the lower additional layer 103 forms the second outer surface (i.e., the lower outer surface) of the high temperature resistant insulating film 100. In this embodiment, the inner surface of the lower additional layer 103 is directly attached to the lower surface of the mica layer 101.

The upper and lower additional layers 102, 103 are of a different material than the mica layer 101. The upper and lower additional layers 102, 103 may be the same material or may be different materials. In this embodiment, the upper and lower additional layers 102, 103 are the same material. The materials of the upper and lower additional layers 102, 103 have a non-cured state and a cured state. When the materials of the upper and lower additional layers 102 and 103 are in a non-cured state, the upper and lower additional layers 102 and 103 are applied and bonded to the upper and lower surfaces of the mica layer 101. When the materials of the upper and lower additional layers 102 and 103 are converted to a cured state, the upper and lower additional layers 102 and 103 form upper and lower reinforcement layers, respectively. The upper and lower reinforcing layers refer to additional layers that can enhance the mechanical properties of the mica layer.

The cured state of the upper and lower additional layers 102, 103 is a chemically crosslinked cured coating. In the production process, the upper layer 102 and the lower layer 103 in the cured state can be obtained by coating the material in the uncured state on the upper surface and the lower surface of the mica layer 101 by a roll coating process, a knife coating process or a spray coating process, and then converting the material in the uncured state into the cured state. In some embodiments, the conversion of the upper and lower additional layers 102, 103 from the uncured state to the cured state is initiated by radiation. In a specific embodiment, the non-curable material capable of radiation-induced curing is a conventional commercially available UV light-curable glue coating having a coating thickness of 0.02-0.05 mm and which is capable of being converted to a cured state by irradiation with UV light having a wavelength of 300-370 nm and a light source radiation intensity of 60-120 w/cm. In other embodiments, the conversion of the upper and lower additional layers 102, 103 from the uncured state to the cured state is performed by heating or drying. In a specific embodiment, the material in the uncured state capable of initiating curing by heating or drying is an epoxy coating having a coating thickness of 0.02 to 0.1mm and which is convertible to the cured state by heating to 60 to 120 ℃. In another specific embodiment, the material in the uncured state capable of initiating curing by heating or drying is a PU (polyurethane) coating that is convertible to the cured state by drying in air.

Fig. 1C and 1D illustrate a specific structure of a high temperature resistant insulating film 130 according to another embodiment of the present application. As shown in fig. 1C and 1D, the high temperature resistant insulating film 130 includes a mica layer 101, an upper additional layer 102 and an upper adhesive layer 122, and a lower additional layer 103 and a lower adhesive layer 123. As an example, the thickness of the mica layer 101 is 0.1 to 3mm, the total thickness of the upper additional layer 102 and the upper adhesive layer 122 is within 100 μm, and the lower additional layer 103 and the lower adhesive layer 123 are also within 100 μm. In this embodiment, the upper and lower additional layers 102 and 103 cannot function as a bond, that is, cannot be directly attached to the upper and lower surfaces of the mica layer 101 by the upper and lower additional layers 102 and 103 alone. While the upper and lower adhesive layers 122 and 123 do not play a reinforcing role, that is, the upper and lower adhesive layers 122 and 123 do not enhance the mechanical properties of the mica layer 101.

In the embodiment shown in fig. 1C and 1D, the inner surface of the upper additional layer 102 is attached to the upper surface of the mica layer 101 by the upper adhesive layer 122, and the outer surface of the upper additional layer 102 forms the first outer surface (i.e., the upper outer surface) of the high temperature resistant insulating film 130. The inner surface of the lower additional layer 103 is attached to the lower surface of the mica layer 101 by the lower adhesive layer 123, and the outer surface of the lower additional layer 103 forms the second outer surface (i.e., the lower outer surface) of the high temperature resistant insulating film 130.

The upper and lower additional layers 102, 103 are of a different material than the mica layer 101. The upper and lower additional layers 102, 103 may be the same material or may be different materials. In this embodiment, the upper and lower additional layers 102, 103 are the same material. In some embodiments, the upper and lower additional layers 102, 103 are plastic films, for example, a PET (polyethylene terephthalate) film or a PP (polypropylene) film. The upper and lower adhesive layers 122 and 123 are glue, such as hot melt glue or heat-cured glue, etc. In this embodiment, the glue is a hot melt glue. The upper and lower additional layers 102 and 103 form an upper and lower reinforcing layer, respectively, that function to enhance the mechanical properties of the mica layer 101. While the upper and lower adhesive layers 122 and 123 do not serve as reinforcing layers.

Specifically, in the production process, after a hot melt adhesive is coated on the upper and lower surfaces of the mica layer 101 by a roll coating process, a blade coating process or a spray coating process to obtain an upper adhesive layer 122 and a lower adhesive layer 123, respectively, plastic films are applied to the upper and lower adhesive layers 122 and 123, respectively, and finally the plastic films are adhered to the upper and lower surfaces of the mica layer 101 by a lamination process to form an upper additional layer 102 and an upper adhesive layer 122, and a lower additional layer 103 and a lower adhesive layer 123. In some embodiments, the upper and lower adhesive layers 122 and 123 are coated to a thickness of 0.01 to 0.05mm.

Those skilled in the art will appreciate that the materials of the upper and lower additional layers 102, 103 are not limited to the embodiments described above.

The high-temperature resistant insulating film of each embodiment of the application has excellent high-temperature resistance, and the heat-resistant temperature can reach 600-700 ℃. And the high-temperature resistant insulating film has excellent high-temperature insulation property and still keeps insulation at the high temperature of 600-700 ℃. The high-temperature resistant insulating film also has good mechanical property, and the tensile strength can reach more than 100 Mpa. Compared with the conventional insulating film made of plastic, the high-temperature-resistant insulating film has the heat resistance at a higher temperature and is low in cost.

The applicant has found that generally commercially available mica sheets or mica boards are prone to chipping during transportation or installation to other components due to the need to adhere, press, etc. with an adhesive during production. In the application environment of some electronic products, the fallen scraps can influence the performance stability of the electronic products, and the environmental protection is not facilitated.

The surface of the high-temperature-resistant insulating film is not a mica layer, but the outer surface of each additional layer, so that the mica layer can be effectively prevented from generating scraps, and the scraps are not easy to fall off even if the scraps are generated, so that the performance stability of the electronic product is not influenced.

In addition, the applicant has found that although the thickness of the upper and lower additional layers is very thin relative to the mica layer, it is possible to exert a very good mechanical property improving effect on the mica layer. For example, compared with the existing mica sheet or mica plate, the high-temperature-resistant insulating film has better bending resistance and breakage resistance, and is not easy to break even if the high-temperature-resistant insulating film is bent under stress. As a specific example, existing mica boards are bent 2 times under 60 ° conditions, which breaks and falls off the chips. The high-temperature-resistant insulating film can be repeatedly bent for 7-9 times, and still can not break or fall off scraps.

The production method of the high temperature resistant insulating films 100 and 130 is specifically described below with reference to fig. 2A to 2D. Fig. 2A shows a flow of a production method of the high temperature resistant insulating film 100. Fig. 2B shows a flow of a production method of the high temperature resistant insulating film 130. Fig. 2C shows a schematic view of a spraying apparatus for applying a material in a non-cured state to the upper and lower surfaces of the mica layer 101. Fig. 2D shows a schematic view of a laminating apparatus for laminating a plastic film onto the adhesive layers 122 and 123 of the high temperature resistant insulating film 130.

As shown in fig. 2A and 2C, in step 231, a material in a non-cured state is applied to the upper and lower surfaces of the mica layer 101 through a spray process. Specifically, during production, a pair of spray heads 207 of the spray apparatus are secured above and below the mica layer 101, respectively. The mica layer 101 is conveyed from left to right between a pair of spray heads 207 to coat the upper and lower additional layers 102 and 103, respectively, in an uncured state on the upper and lower surfaces of the mica layer 101. After the spraying is completed, the process proceeds to step 232. In step 232, the upper and lower additional layers 102 and 103 in the uncured state are cured by radiation, heating, drying, or the like, thereby obtaining the high temperature resistant insulating film 100.

As shown in fig. 2B and 2D, in step 234, a hot melt adhesive is applied to the upper and lower surfaces of the mica layer 101, resulting in the mica layer 101 coated with the upper and lower adhesive layers 122 and 123. Then, in step 235, a plastic film is attached to the upper and lower adhesive layers 122 and 123 through a lamination process. Specifically, during the production process, the mica layer 101 coated with the upper and lower adhesive layers 122 and 123 is conveyed between the pair of rollers 206 from left to right, and the plastic film is conveyed through the pair of rollers 206 while the mica layer 101 is conveyed through the pair of rollers 206 to apply the plastic film from above the upper and lower adhesive layers 122 and 123, respectively. The speed of applying the plastic film is 2-20 m/min. A pair of rollers 206 are rotated in opposite directions and the plastic film is connected with the corresponding adhesive layers by heating and pressurizing, so that the plastic film is attached to the upper and lower surfaces of the mica layer 101. In this embodiment, the roller 206 above the mica layer 101 rotates in a counterclockwise direction and the roller 206 below the mica layer 101 rotates in a clockwise direction to press the plastic film onto the upper and lower adhesive layers 122 and 123, respectively. The two rollers 206 apply a pressure of 3 to 25Mpa to the mica layer 101 and the plastic film passing therebetween, and the temperature at which the mica layer 101 and the plastic film pass between the two rollers 206 (i.e., lamination temperature) is controlled to 95 to 125 ℃.

The high temperature resistant insulating film can be used for various electronic products or devices to help heat dissipation of the electronic products and the devices. Such an electronic product or device may be an electrical device such as a battery module, a heating coil, or a motor.

Fig. 3A and 3B are schematic structural views of one embodiment of a battery module including the high temperature resistant insulating film 100 of the present application, wherein fig. 3A illustrates an overall structure of the battery module 310 and fig. 3B illustrates an exploded structure of the battery module 310. As shown in fig. 3A and 3B, the battery module 310 includes a plurality of battery cells 312 and a case 311. The housing 311 includes a substantially square box 315 and an upper cover 313, the box 315 has a cavity 308 therein, and the upper cover 313 is disposed above the box 315 to close the cavity 308. A plurality of battery cells 312 are accommodated in the accommodation chamber 308 of the case 315. Each battery cell 312 has a respective connection terminal 305. The respective connection terminals 305 of the battery cells 312 are electrically connected together according to a predetermined circuit, and then externally supplied with power and/or charged through a general connection terminal (not shown) provided on the housing 311.

The high temperature resistant insulating film 100 is disposed between adjacent battery cells 312, and between each battery cell 312 and the case 105. In some embodiments, the high temperature resistant insulating film 100 is connected between adjacent battery cells 312 or between the battery cells 312 and the case 105 by fasteners such as bolts. In some embodiments, the high temperature resistant insulating film 100 is adhered between adjacent battery cells 312 or between the battery cells 312 and the case 105 by glue. The high temperature resistant insulating film 100 can insulate between adjacent battery cells 312, and can prevent the battery module 310 from being damaged as a whole due to excessive heat generation and excessive temperature of part of the battery cells 312.

In addition, the high temperature resistant insulating film 100 also plays a supporting role to some extent during the transportation of the battery module 310, preventing deformation caused by the mutual extrusion between the battery cells 312.

If a plastic film resistant to high temperature is used between the battery cells 312, not only is the cost high, but also the supporting effect is limited. Further, even though the heat-resistant temperature of the high-temperature-resistant plastic film is limited, if the temperature of the battery cell 312 is too high, the plastic film may be melted or damaged. However, if a generally commercially available mica sheet is used between the battery cells 312, although the heat resistance is improved, the mica sheet is prone to falling debris during transportation and installation, and the debris falls into the case 315, which may affect the performance of the battery module 310.

The mica sheet is used as the middle layer, and the additional layers are arranged above and below the mica layer, so that the mechanical property of the mica layer is enhanced on the basis of keeping the high temperature resistance of the mica layer, and the mica layer is prevented from falling off scraps, so that the high temperature resistant insulating film is convenient to transport and install. But also is particularly suitable for heat dissipation and support inside the battery cell.

Finally, the high temperature resistant insulating film of the present application has a number of beneficial technical effects, at least some of which are listed below:

1. the heat-resistant performance is excellent, the heat-resistant temperature can reach more than 600-700 ℃, and the heat-resistant requirement of electronic products and equipment can be met.

2. Excellent mechanical property, tensile strength up to more than 100Mpa, repeated bending, so that it is not damaged during transportation, packaging and processing and forming by electronic products and equipment manufacturers.

3. Excellent insulating property, especially at high temperature, and can meet the requirement of electronic products and equipment on insulativity.

4. The production process is simple.

5. Convenient use, cost saving and greatly lower cost than the common plastic film.

While the present disclosure has been described in conjunction with the examples of embodiments outlined above, various alternatives, modifications, variations, improvements, and/or substantial equivalents, whether known or that are or may be presently or later be envisioned, may be apparent to those of ordinary skill in the art. Accordingly, the examples of embodiments of the disclosure as set forth above are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit or scope of the disclosure. Accordingly, the present disclosure is intended to embrace all known or earlier developed alternatives, modifications, variations, improvements and/or substantial equivalents. The technical effects and problems of the present specification are illustrative and not restrictive. It should be noted that the embodiments described in the present specification may have other technical effects and may solve other technical problems.

Claims

1. A method for producing a high temperature resistant insulating film, characterized by comprising the steps of:

coating the upper surface and the lower surface of the mica layer (101) with a material in a non-cured state;

-curing the material in the uncured state, resulting in an upper additional layer (102) attached to the upper surface of the mica layer (101) and a lower additional layer (103) attached to the lower surface of the mica layer (101), the outer surface of the upper additional layer (102) forming a first outer surface of the high temperature resistant insulating film (100), the outer surface of the lower additional layer (103) forming a second outer surface of the high temperature resistant insulating film (100).

2. The method for producing a high temperature resistant insulating film according to claim 1, wherein:

the step of coating the upper and lower surfaces of the mica layer (101) with a material in a non-cured state is performed by a roll coating process, a blade coating process or a spray coating process.

3. The method for producing a high temperature resistant insulating film according to claim 1, wherein:

the step of curing the material in the uncured state is performed by radiation initiation.

4. A method for producing a high temperature resistant insulating film according to claim 3, wherein:

the radiation is ultraviolet radiation, the wavelength of the ultraviolet radiation is 300-370 nm, and the radiation intensity of an ultraviolet light source is 60-120 w/cm.

5. A method for producing a high temperature resistant insulating film according to claim 3, wherein:

the coating thickness of the material in the non-cured state is 0.02-0.05 mm.

6. The method for producing a high temperature resistant insulating film according to claim 1, wherein:

the material in the non-cured state is an epoxy resin coating, and the step of curing the material in the non-cured state is performed by heating the material in the non-cured state to 60 to 120 ℃.

7. The method for producing a high temperature resistant insulating film according to claim 6, wherein:

the coating thickness of the epoxy resin coating in the non-cured state is 0.02-0.1 mm.

8. The method for producing a high temperature resistant insulating film according to claim 4, wherein:

the material in the uncured state is a PU coating and the step of curing the material in the uncured state is performed by drying.

9. The method for producing a high temperature resistant insulating film according to claim 1, wherein:

the thickness of the mica layer (101) is 0.1-3 mm, and the thickness of the upper additional layer (102) and the lower additional layer (103) after curing is within 100 [ mu ] m.

10. A method for producing a high temperature resistant insulating film, characterized by comprising the steps of:

coating glue on the upper surface and the lower surface of the mica layer (101) to obtain an upper bonding layer (122) and a lower bonding layer (123) respectively;

an upper additional layer (102) is bonded to the upper surface of the mica layer (101) through the upper adhesive layer (122), and a lower additional layer (103) is bonded to the lower surface of the mica layer (101) through the lower adhesive layer (123) such that the outer surface of the upper additional layer (102) forms a first outer surface of the high temperature resistant insulating film (100), and the outer surface of the lower additional layer (103) forms a second outer surface of the high temperature resistant insulating film (100).

11. The method for producing a high temperature resistant insulating film according to claim 10, wherein:

the step of bonding the upper additional layer (102) to the upper surface of the mica layer (101) through the upper adhesive layer (122), and bonding the lower additional layer (103) to the lower surface of the mica layer (101) through the lower adhesive layer (123) comprises:

plastic films are applied to the upper and lower adhesive layers (122, 123), respectively, and the plastic films are adhered to the upper and lower surfaces of the mica layer (101) by a lamination process to obtain the upper and lower additional layers (102, 103).

12. The method for producing a high temperature resistant insulating film according to claim 11, wherein:

the temperature of the lamination process is 95-125 ℃ and the pressure is 3-25 Mpa.

13. The method for producing a high temperature resistant insulating film according to claim 11, wherein:

the speed of applying the upper (102) and lower (103) additional layers is 2-20 m/min.

14. The method for producing a high temperature resistant insulating film according to claim 10, wherein:

the upper adhesive layer (122) and the lower adhesive layer (123) have a coating thickness of 0.01-0.05 mm.

15. The method for producing a high temperature resistant insulating film according to claim 14, wherein:

the lamination process is such that the total thickness of the upper additional layer (102) and the upper adhesive layer (122) and the total thickness of the lower additional layer (103) and the lower adhesive layer (123) are both within 100 μm.