CN117866572A - Protective adhesive combination for single-sided AG glass alkali etching process and use method - Google Patents
Protective adhesive combination for single-sided AG glass alkali etching process and use method Download PDFInfo
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- CN117866572A CN117866572A CN202311755893.6A CN202311755893A CN117866572A CN 117866572 A CN117866572 A CN 117866572A CN 202311755893 A CN202311755893 A CN 202311755893A CN 117866572 A CN117866572 A CN 117866572A
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- glass
- sided
- epoxy resin
- etching process
- adhesive
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- 239000011521 glass Substances 0.000 title claims abstract description 77
- 239000000853 adhesive Substances 0.000 title claims abstract description 53
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 44
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 41
- 238000005530 etching Methods 0.000 title claims abstract description 38
- 239000003513 alkali Substances 0.000 title claims abstract description 33
- 230000001681 protective effect Effects 0.000 title claims abstract description 32
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 22
- 238000011049 filling Methods 0.000 claims abstract description 16
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 15
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 9
- 239000012952 cationic photoinitiator Substances 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 238000007650 screen-printing Methods 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- 239000007864 aqueous solution Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 24
- -1 4- (phenylthio) phenyldiphenylsulfonium hexafluorophosphate Chemical compound 0.000 claims description 21
- 238000003756 stirring Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 claims description 6
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 6
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000005340 laminated glass Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 claims description 3
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 3
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 claims description 3
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- FXIVKZGDYRLHKF-UHFFFAOYSA-N C(C)OP(OC(C1=C(C=C(C=C1C)C)C)=O)(=O)C1=CC=CC=C1 Chemical compound C(C)OP(OC(C1=C(C=C(C=C1C)C)C)=O)(=O)C1=CC=CC=C1 FXIVKZGDYRLHKF-UHFFFAOYSA-N 0.000 claims description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 150000001993 dienes Chemical class 0.000 claims description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 239000011499 joint compound Substances 0.000 claims description 3
- 229940095102 methyl benzoate Drugs 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 3
- UGFMBZYKVQSQFX-UHFFFAOYSA-N para-methoxy-n-methylamphetamine Chemical compound CNC(C)CC1=CC=C(OC)C=C1 UGFMBZYKVQSQFX-UHFFFAOYSA-N 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 5
- 230000007062 hydrolysis Effects 0.000 abstract description 3
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000000796 flavoring agent Substances 0.000 description 12
- 235000019634 flavors Nutrition 0.000 description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 235000015067 sauces Nutrition 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 239000005357 flat glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- FODCFYIWOJIZQL-UHFFFAOYSA-N 1-methylsulfanyl-3,5-bis(trifluoromethyl)benzene Chemical compound CSC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 FODCFYIWOJIZQL-UHFFFAOYSA-N 0.000 description 1
- ATYCHUNXPSPHLD-UHFFFAOYSA-N 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylbutan-1-one Chemical compound CCC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 ATYCHUNXPSPHLD-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a protective adhesive combination for a single-sided AG glass alkali etching process and a use method thereof, comprising a UV thermosetting joint filling adhesive and a frame UV hydrolysis adhesive, wherein the UV thermosetting joint filling adhesive comprises bisphenol A type epoxy resin, alicyclic epoxy resin, modified epoxy resin, a silane coupling agent, a latent thermosetting epoxy curing agent and a cationic photoinitiator as raw materials; the frame UV hydrolytic gum comprises water-soluble UV resin, water-soluble UV monomer, photoinitiator and filler. The protective adhesive combination only needs to be removed by aqueous solution in the degumming process, and does not need to be removed by traditional strong acid and alkali, so that the protective adhesive combination is safer and more environment-friendly compared with the traditional protective adhesive combination. In the conventional single-sided AG glass etching process, the whole screen printing glass is required to protect the printing ink on the non-processing surface generally, and the protective glue combination only needs screen printing and glue dispensing on the periphery and the edge of the non-processing surface, so that the printing ink/glue consumption is greatly reduced, the material cost is saved, and the efficiency is improved.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to a protective adhesive combination for a single-sided AG glass alkali etching process and a use method thereof.
Background
AG is Anti-Glare, namely Anti-reflection or Anti-Glare glass AG treatment, namely, the glass AG treatment is a diffuse reflection surface which changes the original glass surface into matte after special chemical treatment is carried out on the glass surface, and the principle of AG treatment is that the single side or the double sides of a high-quality glass sheet are subjected to special chemical surface processing treatment, so that the glass sheet has 'lower reflectivity' in the same direction compared with the common glass surface, the reflectivity of light is reduced from 8% to below 1%, clear and transparent visual effect is created, and consumers have better visual experience.
There are currently 3 mature AG treatment methods: sticking film, spraying and etching. The technical principle of AG film sticking for cover plate glass surface treatment is as follows: and a layer of specially treated film is added on the surface of the glass, and the surface of the film is subjected to micro concave-convex processing, so that light is prevented from directly entering eyes, and glare and reflected light are effectively reduced. The AG spraying technology principle is as follows: and spraying special liquid medicine to the surface of the cleaned cover plate glass through spraying equipment to form a layer of coating which cannot be seen by naked eyes on the surface of the glass, and curing at high temperature to achieve the anti-glare effect. The existing cover plate glass surface treatment AG etching technology principle is as follows: spraying special liquid medicine on the surface of the glass, and processing the glass by a special chemical process, wherein the reflecting surface of the glass becomes a matte diffuse reflecting surface. Among them, the AG etching process processes glass, which has high strength after processing, scratch resistance, and excellent touch feeling and aesthetic expressive force, has been increasingly the preferred cover plate material for electronic displays of Xu Duogong control devices due to its superior performance.
Glass protective ink with a protective effect is generally used in the single-sided glass etching process, the glass protective ink is usually silk-screened on the surface of glass on a non-treated surface, the glass treated surface is etched after the ink is solidified, and finally strong alkali or strong acid is used for removing or dissolving the ink at a certain temperature, so that the ink does not remain on the non-treated surface of the glass. In the process of removing glass protection printing ink, strong acid and alkali are generally used, such as concentrated sulfuric acid, concentrated nitric acid, high-concentration sodium hydroxide and the like, and unsafe factors such as strong corrosion and the like exist in the process, and harmful substances such as waste liquid and waste solid of the strong acid and alkali are also generated.
Disclosure of Invention
The invention aims to provide a protective adhesive combination for a single-sided AG glass alkali etching process and a use method thereof, so as to solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the protective adhesive combination for the single-sided AG glass alkali etching process comprises UV thermosetting joint filling adhesive and frame UV hydrolysis adhesive, wherein the UV thermosetting joint filling adhesive comprises the following raw materials in parts by weight:
the frame UV hydrolytic gum comprises the following raw materials in parts by weight:
further, bisphenol A epoxy resin is a high molecular compound prepared by condensing bisphenol A and epichlorohydrin under alkaline condition, washing with water, and refining by eluting solvent;
the alicyclic epoxy resin is a non-bisphenol a type epoxy resin prepared by oxidizing a diene in an alicyclic structure with peracetic acid.
Further, the modified epoxy resin includes polyurethane modified epoxy resin, silicone modified epoxy resin, polyether modified epoxy resin and rubber modified epoxy resin.
Further, the silane coupling agent has a molecular structural formula of Y-R-Si (OR) 3, wherein Y is an organic functional group, siOR is a siloxy group, and the silane coupling agent comprises: any one or a mixture of at least two of KH560, KH570, KH550, KH 540.
Further, the cationic photoinitiator includes any one or a mixture of at least two of 4- (phenylthio) phenyldiphenylsulfonium hexafluorophosphate, 4- (phenylthio) phenyldiphenylsulfonium hexafluoroantimonate, 4-isobutylphenyl-4 '-methylphenyl iodonium hexafluorophosphate, triarylsulfonium hexafluorophosphate, 6-Isopropylcyclopentadienyl Iron (II) hexafluorophosphate, 4-isobutylphenyl-4' -methylphenyl iodonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, 4 '-xylyliodonium hexafluorophosphate, bis (4-tert-butylphenyl) iodonium hexafluorophosphate, 4-isopropyl-4' -methyldiphenyliodonium tetrakis (pentafluorophenyl) borate, triaryltetrakis (pentafluorophenyl) borate.
Further, the preparation of the UV thermosetting joint compound is as follows:
bisphenol A epoxy resin, alicyclic epoxy resin, modified epoxy resin, silane coupling agent, latent thermosetting epoxy curing agent and cationic photoinitiator are mixed and stirred for 400-1000 r/min multiplied by 3min, the mixture is ground for at least 3 times by a three-roller grinder after being uniformly stirred, the fineness of glue is less than or equal to 10 mu m, and then centrifugal defoaming is carried out by a centrifugal machine for 1500-3500 r/min multiplied by 3min until no bubbles are visible.
Further, the water-soluble UV resin is a water-soluble urethane acrylate;
the water-soluble UV monomers include: acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate and polyethylene glycol acrylate.
Further, the photoinitiator comprises: 1-hydroxycyclohexylphenyl ketone, 2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, ethyl 2,4, 6-trimethylbenzoyl phenylphosphonate, 2-hydroxy-2-methyl-1- [4- (2-hydroxyethoxy) phenyl ] -1-propanone, methyl benzoate, 2-dimethylamino-2-benzyl-1- [4- (4-morpholinyl) phenyl ] -1-butanone, or a mixture of at least two thereof;
the filler comprises any one or a mixture of at least two of silicon dioxide, aluminum oxide, PMMA, PS and calcium carbonate.
Further, the preparation of the UV hydrolytic adhesive for the frame is as follows:
mixing and stirring the water-soluble UV resin, the water-soluble UV monomer, the photoinitiator and the filler components according to the formula amount for 400-1000 r/min multiplied by 3min, and after uniformly stirring, centrifugally defoaming by using a centrifugal machine for 500-3000 r/min multiplied by 3min until no bubbles are visible.
In order to achieve the above purpose, the present invention further provides the following technical solutions:
the application method of the protective adhesive combination for the single-sided AG glass alkali etching process specifically comprises the following steps:
step 1: fixing 1 piece of glass on a platform, enabling the non-part to face upwards, and screen-printing the UV hydrolytic adhesive of the frame around the glass according to a certain pattern;
step 2: the other glass is stacked on the glass in the step 1 in a downward alignment way, and then is subjected to UV irradiation and solidification to form 2 stacked glass with solidification energy of 500-2000 mj/cm < 2 >;
step 3: covering gaps around the laminated 2 glass sections with UV thermosetting joint filling glue, curing by UV irradiation with the curing energy of 300-1500 mj/cm < 2 >, and placing the laminated glass into an oven at the temperature of 70-100 ℃ for 20-40 min after curing.
Step 4: etching the glass in the step 3 by strong alkali, and etching for 2.5-3 hours at 130 ℃;
step 5: degumming the glass in the step 4 by using an aqueous solution after etching, wherein the temperature is as follows: 50-90 ℃ for the time of: the UV thermosetting joint filling glue and the UV hydrolytic glue of the frame can completely fall off within 1 to 30 minutes;
step 6: and (5) cleaning the degummed glass in the step (5) with pure water.
Compared with the prior art, the invention has the beneficial effects that:
the protective adhesive combination used in the single-sided AG glass alkali etching process at present only needs to be removed by aqueous solution in the degumming process, and does not need to be removed by traditional strong acid and alkali, so that the method is safer and more environment-friendly compared with the traditional method. In addition, in the traditional single-sided AG glass etching process, the whole screen printing glass is generally required for protecting the printing ink on the non-treated surface, and the protective adhesive combination only needs screen printing and adhesive dispensing on the periphery and the edge of the non-treated surface, so that the consumption of the printing ink/adhesive is greatly reduced, the material cost is saved, and the efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a single-sided AG glass alkali etching process using a combination of protective adhesives according to the present invention.
Fig. 2 is a cross-sectional view of fig. 1 of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the terms "upper end," "lower end," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like indicate an azimuth or a positional relationship based on that shown in the drawings, merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "sleeved," "connected," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 to 2, the present invention provides a technical solution:
the invention relates to a protective adhesive combination for a single-sided AG glass alkali etching process, which is respectively UV frame adhesive (or frame UV hydrolytic adhesive) and UV thermosetting joint filling adhesive.
The invention relates to a protective adhesive combination for a single-sided AG glass alkali etching process, which comprises the following steps: the UV thermosetting joint filling adhesive comprises the following components in parts by weight:
bisphenol A epoxy resin is a high molecular compound prepared by condensing bisphenol A and epichlorohydrin under alkaline condition, washing with water, and refining by solvent stripping. Comprising the following steps: any one or a mixture of at least two of Japanese jER 827, japanese jER 828, japanese jER 834, japanese jER 4005P, japanese jER YL980, japanese ADEKA EP-4000L, japanese ADEKA EP-4100HF, south Asia NPEL-127, south Asia NPEL 128, south Asia NPEL 134, E44, E51 in an amount of 30% to 70%.
Alicyclic epoxy resins, which are a class of non-bisphenol a type epoxy resins made by the oxidation of dienes in an alicyclic structure with peracetic acid, include: the dosage of any one or a mixture of at least two of Tatel TTA3150, tatel TTA21S, tatel TTA21L, tatel TTA21P, tatel TTA26, ERH-186, dow ERL4421C, japanese cellophane 2021P, complex EPR-3150, complex EPR-2081 and complex EPR-2000 is 10-30%.
Modified epoxy resins, i.e., modified epoxy resins with polyurethane, silicone, polyether, rubber, and the like, including polyurethane modified epoxy resins, silicone modified epoxy resins, polyether modified epoxy resins, rubber modified epoxy resins, and the like, include: the amount of any 1 or 2 of sauce ERS133, sauce XP830, sauce ERS105, sauce ERS Si1200, sauce ERS Si1700, japanese ADEKA EPU 73B, japanese ADEKA EPR-2007, japanese ADEKA EPR-1630, complex EPU-105, complex EPU-253, complex EPU-303, complex EPSI-6262, complex EPSI-6878, silikonG121, dow F201 is 15% -50%.
The silane coupling agent generally has a molecular structural formula of Y-R-Si (OR) 3 (wherein Y is an organic functional group, siOR is a siloxy). Comprising the following steps: KH560, KH570, KH550, KH540 or a mixture of at least two of them, the dosage is 1% -10%.
A latent thermosetting epoxy curing agent comprising: the dosage of the composition is 0.1-10% of any one or a mixture of at least two of flavor PN-23, flavor PN-23J, flavor PN-40, flavor PN-31J, flavor PN-8401, flavor ICAM-8406, flavor ICAM-8409, flavor ICAM-8418, flavor ICAM-8439, flavor CTI-100, flavor CTI-200 and flavor CTI-300.
Cationic photoinitiators, including any one or a mixture of at least two of 4- (phenylthio) phenyldiphenylsulfonium hexafluorophosphate, 4- (phenylthio) phenyldiphenylsulfonium hexafluoroantimonate, 4-isobutylphenyl-4 '-methylphenyl iodonium hexafluorophosphate, triarylsulfonium hexafluorophosphate, 6-isopropylbenzene ferrocene (II) hexafluorophosphate, 4-isobutylphenyl-4' -methylphenyl iodonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, 4 '-xylyliodonium hexafluorophosphate, bis (4-tert-butylphenyl) iodohexafluorophosphate, 4-isopropyl-4' -methyldiphenyliodonium tetrakis (pentafluorophenyl) borate, triaryltetrakis (pentafluorophenyl) borate, and the like, in an amount of 0.1 to 10%.
The invention relates to a protective adhesive combination for a single-sided AG glass alkali etching process, which comprises the following steps: the preparation method of the UV thermosetting joint filling adhesive comprises the following steps: mixing and stirring bisphenol A type epoxy resin, alicyclic epoxy resin, modified epoxy resin, silane coupling agent, latent thermosetting epoxy curing agent and cationic photoinitiator components in a formula amount for 400-1000 r/min multiplied by 3min, grinding at least 3 times by a three-roller grinder after uniformly stirring, enabling the fineness of glue to be less than or equal to 10 mu m, and then centrifugally defoaming by using a centrifugal machine for 1500-3500 r/min multiplied by 3min until no bubbles exist visually.
The invention relates to a protective adhesive combination for a single-sided AG glass alkali etching process, which comprises the following steps: the UV frame glue comprises the following components in parts by weight:
water-soluble UV resins, typically water-soluble urethane acrylates, include: the dosage of the mixture of any one or at least two of Youyang GP-5102, youyang GP-5120, youyang GP-5128, youyang GP-5132, zhuangxingjingat 7718, blue Ke Lu L-9821, changxing 6148T-85 and Changxing 6123 is 60-90 percent.
Water-soluble UV monomers, generally include: acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, polyethylene glycol acrylate, and the like.
A photoinitiator, comprising: 1-hydroxycyclohexylphenyl ketone, 2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, ethyl 2,4, 6-trimethylbenzoyl phenylphosphonate, methyl 2-hydroxy-2-methyl-1- [4- (2-hydroxyethoxy) phenyl ] -1-propanone, methyl benzoate, 2-dimethylamino-2-benzyl-1- [4- (4-morpholinyl) phenyl ] -1-butanone or a mixture of at least two thereof, in an amount of 0.1% -10%.
And the filler comprises any one or a mixture of at least two of silicon dioxide, aluminum oxide, PMMA, PS and calcium carbonate, and the dosage is 0.1-5%.
The invention relates to a protective adhesive combination for a single-sided AG glass alkali etching process, which comprises the following steps: the preparation method of the frame UV hydrolytic adhesive comprises the following steps: mixing and stirring the water-soluble UV resin, the water-soluble UV monomer, the photoinitiator and the filler components according to the formula amount for 400-1000 r/min for 3min, and centrifugally defoaming by using a centrifugal machine for 500-3000 r/min for 3min until no bubbles are visible after uniform stirring.
The invention relates to a protective adhesive combination for a single-sided AG glass alkali etching process, which comprises the following steps: the UV thermosetting joint filling adhesive and the frame UV hydrolysis adhesive are characterized in that the application is as follows:
step 1: fixing 1 piece of glass on a platform, enabling the non-part to face upwards, and screen-printing the UV hydrolytic adhesive of the frame around the glass according to a certain pattern;
step 2: the other glass is stacked on the glass in the step 1 in a downward alignment way, the frame UV hydrolytic glue is not overflowed, and then the high-pressure mercury lamp/LED lamp UV irradiates and cures, and the curing energy is 500-2000 mj/cm < 2 >;
step 3: covering gaps around the 2 laminated glass sections in the step 2 with UV thermosetting joint filling glue, curing by UV irradiation of a high-pressure mercury lamp/LED lamp with the curing energy of 300-1500 mj/cm < 2 >, and placing the laminated glass into an oven at the temperature of 70-100 ℃ for 20-40 min after curing.
Step 4: etching the glass in the step 3 by strong alkali (50% sodium hydroxide solution) (130 ℃ C. Multiplied by 2.5-3 h);
step 5: degumming the glass in the step 4 by using an aqueous solution after etching, wherein the temperature is as follows: 50-90 ℃ for the time of: the UV thermosetting joint filling glue and the UV hydrolytic glue of the frame can completely fall off within 1 to 30 minutes;
step 6: and (5) cleaning the degummed glass in the step (5) with pure water.
Fig. 1 is a top view of 2 sheets of glass stacked together, non-treated side to non-treated side, sandwiched border glue in between, blue section, border glue width: 1-100 mm. FIG. 2 is a cross-sectional view, specifically a cross-sectional or longitudinal cross-sectional view of FIG. 1, with 2 sheets of glass stacked together, non-treated facing non-treated side, with a border glue in between, and with the peripheral-to-ring gap of 2 sheets of glass covered with a joint compound glue, yellow in color.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The protective adhesive combination for the single-sided AG glass alkali etching process is characterized by comprising UV thermosetting joint filling adhesive, wherein the UV thermosetting joint filling adhesive comprises the following raw materials in parts by weight:
2. the protective adhesive combination for a single-sided AG glass alkali etching process according to claim 1, wherein the adhesive combination comprises a frame UV hydrolytic adhesive, and the frame UV hydrolytic adhesive comprises the following raw materials in parts by weight:
3. the protective adhesive composition for single-sided AG glass alkali etching process as in claim 1, wherein bisphenol A epoxy resin is a high molecular compound prepared by condensing bisphenol A and epichlorohydrin under alkaline condition, washing with water, and refining by solvent stripping;
the alicyclic epoxy resin is a non-bisphenol a type epoxy resin prepared by oxidizing a diene in an alicyclic structure with peracetic acid.
4. The protective adhesive composition for single-sided AG glass alkali etching process according to claim 1, wherein the modified epoxy resin comprises polyurethane modified epoxy resin, silicone modified epoxy resin, polyether modified epoxy resin and rubber modified epoxy resin;
the molecular structural formula of the silane coupling agent is Y-R-Si (OR) 3, wherein Y is an organic functional group, siOR is a siloxy group, and the silane coupling agent comprises: any one or a mixture of at least two of KH560, KH570, KH550, KH 540.
5. The resist composition for single sided AG glass alkali etching process according to claim 1, wherein the cationic photoinitiator comprises any one or a mixture of at least two of 4- (phenylthio) phenyldiphenylsulfonium hexafluorophosphate, 4- (phenylthio) phenyldiphenylsulfonium hexafluoroantimonate, 4-isobutylphenyl-4 '-methylphenyl iodonium hexafluorophosphate, triarylsulfonium hexafluorophosphate, 6-isopropylcyclopentadienyl iron (ii) hexafluorophosphate, 4-isobutylphenyl-4' -methylphenyl iodonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, 4 '-xylyliodonium hexafluorophosphate, bis (4-tert-butylphenyl) iodohexafluorophosphate, 4-isopropyl-4' -methyldiphenyliodide tetrakis (pentafluorophenyl) borate, triaryltetrakis (pentafluorophenyl) boric acid.
6. The combination of protective glue for single-sided AG glass alkali etching process as claimed in claim 1, wherein the UV thermosetting joint compound is prepared as follows:
bisphenol A epoxy resin, alicyclic epoxy resin, modified epoxy resin, silane coupling agent, latent thermosetting epoxy curing agent and cationic photoinitiator are mixed and stirred for 400-1000 r/min multiplied by 3min, the mixture is ground for at least 3 times by a three-roller grinder after being uniformly stirred, the fineness of glue is less than or equal to 10 mu m, and then centrifugal defoaming is carried out by a centrifugal machine for 1500-3500 r/min multiplied by 3min until no bubbles are visible.
7. A single sided AG glass alkali etching process protective adhesive combination according to claim 1 wherein the water soluble UV resin is a water soluble urethane acrylate;
the water-soluble UV monomers include: acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxypropyl acrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate and polyethylene glycol acrylate.
8. A single sided AG glass alkali etch process protective paste composition according to claim 1 wherein the photoinitiator comprises: 1-hydroxycyclohexylphenyl ketone, 2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, ethyl 2,4, 6-trimethylbenzoyl phenylphosphonate, 2-hydroxy-2-methyl-1- [4- (2-hydroxyethoxy) phenyl ] -1-propanone, methyl benzoate, 2-dimethylamino-2-benzyl-1- [4- (4-morpholinyl) phenyl ] -1-butanone, or a mixture of at least two thereof;
the filler comprises any one or a mixture of at least two of silicon dioxide, aluminum oxide, PMMA, PS and calcium carbonate.
9. The protective adhesive combination for single-sided AG glass alkali etching process according to claim 1, wherein the preparation of the UV hydrolytic adhesive for the frame is as follows:
mixing and stirring the water-soluble UV resin, the water-soluble UV monomer, the photoinitiator and the filler components according to the formula amount for 400-1000 r/min multiplied by 3min, and after uniformly stirring, centrifugally defoaming by using a centrifugal machine for 500-3000 r/min multiplied by 3min until no bubbles are visible.
10. A method of using the single-sided AG glass alkali etching process protective adhesive composition according to claim 2, comprising the steps of:
step 1: fixing 1 piece of glass on a platform, enabling the non-part to face upwards, and screen-printing the UV hydrolytic adhesive of the frame around the glass according to a certain pattern;
step 2: the other glass is stacked on the glass in the step 1 in a downward alignment way, and then is subjected to UV irradiation and solidification to form 2 stacked glass with solidification energy of 500-2000 mj/cm < 2 >;
step 3: covering gaps around the laminated 2 glass sections with UV thermosetting joint filling glue, curing by UV irradiation with the curing energy of 300-1500 mj/cm < 2 >, and placing the laminated glass into an oven at the temperature of 70-100 ℃ for 20-40 min after curing.
Step 4: etching the glass in the step 3 by strong alkali, and etching for 2.5-3 hours at 130 ℃;
step 5: degumming the glass in the step 4 by using an aqueous solution after etching, wherein the temperature is as follows: 50-90 ℃ for the time of: the UV thermosetting joint filling glue and the UV hydrolytic glue of the frame can completely fall off within 1 to 30 minutes;
step 6: and (5) cleaning the degummed glass in the step (5) with pure water.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311755893.6A CN117866572A (en) | 2023-12-19 | 2023-12-19 | Protective adhesive combination for single-sided AG glass alkali etching process and use method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311755893.6A CN117866572A (en) | 2023-12-19 | 2023-12-19 | Protective adhesive combination for single-sided AG glass alkali etching process and use method |
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| CN202311755893.6A Pending CN117866572A (en) | 2023-12-19 | 2023-12-19 | Protective adhesive combination for single-sided AG glass alkali etching process and use method |
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| CN (1) | CN117866572A (en) |
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