CN117863069B - Wafer bearing assembly convenient for double-sided grinding - Google Patents
Wafer bearing assembly convenient for double-sided grinding Download PDFInfo
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- CN117863069B CN117863069B CN202311758055.4A CN202311758055A CN117863069B CN 117863069 B CN117863069 B CN 117863069B CN 202311758055 A CN202311758055 A CN 202311758055A CN 117863069 B CN117863069 B CN 117863069B
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- wall
- base
- carrier
- wafer
- grinding disc
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- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 42
- 238000003466 welding Methods 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 60
- 230000009471 action Effects 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229940095676 wafer product Drugs 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention relates to the technical field of grinding devices, in particular to a wafer bearing assembly convenient for double-sided grinding, which comprises a base, wherein a bracket is connected to the outer wall of the top of the base through bolts, a motor is welded to the outer wall of the top of the bracket, a clamping block is welded to the outer wall of a main shaft of the motor, and a disc-shaped carrier is rotationally inserted to the outer wall of the top of the base. According to the invention, the lower grinding disc and the upper grinding disc are finally abutted against the rollers through the rollers, so that the carrier is prevented from being polished, the diameters of the rollers are the thickness of the finished wafer, the rollers with different diameters can be replaced according to the thickness of the finished wafer, the situation that the traditional carrier needs to be replaced frequently is avoided, the practicability is greatly improved, and the side, close to the jacking column, of the finished wafer is inclined upwards through the blanking mechanism, and further the finished wafer is smoothly fed into the blanking inclined frame, so that the effect of automatic efficiency is realized, and the working efficiency is greatly improved.
Description
Technical Field
The invention belongs to the technical field of grinding devices, and particularly relates to a wafer bearing assembly convenient for double-sided grinding.
Background
With the development of semiconductor technology, a higher requirement is put on the polishing rate of the wafer surface, and double-sided polishing is one of the most effective technical means for accelerating the thickness removal rate and improving the surface flatness of the wafer.
However, when the wafer is polished to the thickness of the finished product, the polishing plate also contacts the carrier, resulting in abrasion of the carrier, so that the carrier must be frequently replaced, and the existing carrier cannot realize automatic blanking, resulting in lower work.
Disclosure of Invention
The invention provides a wafer bearing assembly convenient for double-sided grinding, which aims to solve the problems in the background art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The utility model provides a wafer bears subassembly convenient to two-sided grinding, includes the base, there is the support through bolted connection on the top outer wall of base, the welding has the motor on the top outer wall of support, the welding has the fixture block on the main shaft outer wall of motor, it has disc carrier to rotate the grafting on the top outer wall of base, the draw-in groove has been seted up to the top outer wall center department of carrier, the fixture block slides and peg graft in the draw-in groove, set up a plurality of equidistant circumference distributed's grip hole on the top outer wall of carrier, it has a plurality of equidistant circumference distributed's gyro wheels to peg graft through the bolt rotation on the cylinder outer wall of carrier, gyro wheel and grip hole one-to-one, grinding groove, feed opening, through-hole and ejection slot have been seted up on the outer wall of base, grinding groove, feed opening, through-hole and ejection slot are around the centre of a circle equidistance circumference distribution of carrier, the downdisc rotates the grafting in the grinding groove, the face of downdisc and the top outer wall of base, the welding has the electric putter on the top outer wall of base, the output of electric putter rotates and has the mill, coaxial with the mill that distributes with the downfacing mechanism.
In the above-mentioned wafer bearing assembly convenient to two-sided grinding, every all bond the elastic washer on the inner wall of centre gripping hole, grinding groove, feed opening and ejection slot all with centre gripping hole looks adaptation, the welding has the magazine on the bottom outer wall of base, feed opening and magazine intercommunication.
In the above-mentioned wafer bearing assembly convenient to two-sided grinding, the top outer wall butt of gyro wheel and base, go up mill and lower mill and gyro wheel looks adaptation.
In the above-mentioned wafer bearing assembly convenient to two-sided grinding, unloading mechanism includes the unloading frame, the welding has the unloading to one side frame on the outer wall of base, a set of material mouth has been seted up on the outer wall of unloading to one side frame, the material mouth aligns with the ejection slot, sliding grafting has the unloading frame in the ejection slot.
In the wafer bearing assembly convenient for double-sided grinding, a plurality of semi-cylindrical jacking columns are welded on the outer wall of the blanking frame, the jacking columns are matched with the ejection grooves, a plurality of semicircular sliding columns are connected to the outer wall of the blanking frame in a sliding and inserting mode, the sliding columns correspond to the jacking columns one to one, a first spring is arranged between the outer wall of the bottom of the sliding column and the outer wall of the top of the blanking frame, a baffle is welded on the outer wall of the bottom of the sliding column, and the baffle cannot pass through the ejection grooves.
In the wafer bearing assembly convenient for double-sided grinding, the second rack is welded on the outer wall of the blanking frame, the first rack is welded on the outer wall of the output end of the electric push rod, the gear is rotationally inserted on the outer wall of one side of the base between the first rack and the second rack, and the first rack and the second rack are meshed with the gear.
In the above-mentioned wafer bearing assembly convenient to two-sided grinding, feed mechanism includes the material loading frame, the bottom outer wall center department welding of carrier has the lead screw, the material loading frame has been cup jointed through screw-thread fit on the outer wall of lead screw, the one end that the lead screw was kept away from to the material loading frame slides and pegs graft in the magazine.
In the above-mentioned wafer bearing assembly convenient to two-sided grinding, sliding grafting has a plurality of slide on the outer wall of material loading frame, slide and feed opening looks adaptation, every all be provided with the spring two between the bottom outer wall of slide and the top outer wall of material loading frame.
Compared with the prior art, the invention has the beneficial effects that:
1. through the roller, the carrier is rotatably supported on the top outer wall of the base by the roller, abrasion is avoided in the carrier rotating process, meanwhile, when the lower grinding disc and the upper grinding disc rotate at the same speed in the opposite direction to grind the wafer in the clamping hole, the lower grinding disc and the upper grinding disc are finally abutted with the roller, so that the carrier is prevented from being ground, the diameter of the roller is the thickness of a finished wafer product, the rollers with different diameters can be replaced according to the thickness of the finished wafer product, the situation that the traditional carrier needs to be replaced frequently is avoided, and the practicability is greatly improved;
2. Through the blanking mechanism, after the wafer is polished, a carrier is driven to rotate through a motor, so that a finished wafer is transported to the lower part of the material receiving opening, and the wafer to be polished is transported to the lower grinding disc, when the charged push rod drives the upper grinding disc to move downwards, the blanking frame moves upwards under the transmission effect of the gear, so that the jack post and the sliding column jack the finished wafer into the material receiving opening, when the finished wafer enters the blanking inclined frame, the baffle table is abutted with the base, so that the sliding column cannot continuously ascend, at the moment, the jack post continuously ascends, one side of the finished wafer close to the jack post is inclined upwards, and the finished wafer is smoothly fed into the blanking inclined frame, so that the automatic efficiency is realized, and the working efficiency is greatly improved;
to sum up, through the gyro wheel that sets up for lower mill and last mill eventually can with the gyro wheel butt, thereby avoid the carrier to be polished, the diameter size of gyro wheel is wafer finished product thickness, can change the gyro wheel of different diameters according to wafer finished product thickness, avoided traditional carrier to need frequent the condition of changing, and the practicality is improved greatly, through the unloading mechanism of setting, make the finished product wafer be close to the one side upward sloping of jack-up, and then make the finished product wafer smooth go into in the unloading oblique frame, realize automatic efficiency's effect, work efficiency has been improved greatly.
Drawings
Fig. 1 is a perspective view of the whole structure of the present invention.
Fig. 2 is a schematic perspective view of a gear according to the present invention.
Fig. 3 is a schematic perspective view of a carrier according to the present invention.
Fig. 4 is a schematic perspective view of the blanking frame of the present invention.
Fig. 5 is a schematic perspective top view of the base of the present invention.
Fig. 6 is a schematic bottom perspective view of the base of the present invention.
Fig. 7 is a schematic plan view of the working state of the carrier of the present invention.
Fig. 8 is a schematic perspective view of the working state of the blanking mechanism of the present invention.
In the figure: 1. a base; 11. a bracket; 13. grinding a groove; 131. a lower grinding disc; 14. a magazine; 141. a feeding port; 15. a through hole; 16. an ejection groove; 17. blanking an inclined frame; 171. a material receiving port; 2. a motor; 21. a clamping block; 3. a carrier; 31. a clamping groove; 32. a clamping hole; 321. an elastic washer; 33. a roller; 34. a screw rod; 4. an electric push rod; 41. an upper millstone; 42. a first rack; 5. a gear; 6. a blanking frame; 61. a second rack; 62. a top column; 63. a spool; 631. a first spring; 632. a baffle; 7. a feeding frame; 71. a slide plate; 711. and a second spring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1-8, the present invention provides a technical solution: comprises a base 1, a bracket 11 is connected on the top outer wall of the base 1 through bolts, a motor 2 is welded on the top outer wall of the bracket 11, a clamping block 21 is welded on the outer wall of a main shaft of the motor 2, a disc-shaped carrier 3 is rotationally inserted on the top outer wall of the base 1, a clamping groove 31 is formed in the center of the top outer wall of the carrier 3, the clamping block 21 is slidingly inserted in the clamping groove 31, a plurality of groups of clamping holes 32 distributed at equal intervals are formed on the top outer wall of the carrier 3, a plurality of rollers 33 distributed at equal intervals are rotationally inserted on the cylindrical outer wall of the carrier 3 through bolts, the rollers 33 are in one-to-one correspondence with the clamping holes 32, grinding grooves 13, feeding ports 141, through holes 15 and ejection grooves 16 are formed on the outer wall of the base 1, the grinding groove 13, the feeding port 141, the through holes 15 and the ejection groove 16 are distributed circumferentially around the circle center of the carrier 3 at equal intervals, the grinding groove 13 is internally and rotationally inserted with the lower grinding disc 131, the grinding surface of the lower grinding disc 131 is flush with the top outer wall of the base 1, the top outer wall of the base 1 is welded with the electric push rod 4, the output end of the electric push rod 4 is rotationally inserted with the upper grinding disc 41, the upper grinding disc 41 and the lower grinding disc 131 are coaxially distributed, the base 1 is provided with a blanking mechanism and a feeding mechanism, the inner wall of each clamping hole 32 is respectively adhered with an elastic gasket 321, the grinding groove 13, the feeding port 141 and the ejection groove 16 are respectively matched with the clamping holes 32, the bottom outer wall of the base 1 is welded with the material box 14, the feeding port 141 is communicated with the material box 14, the roller 33 is abutted with the top outer wall of the base 1, and the upper grinding disc 41 and the lower grinding disc 131 are respectively matched with the roller 33.
The clamping holes 32 are matched with the wafer, the edge of the wafer is prevented from being worn by the elastic washer 321, pulleys can be additionally arranged on the outer wall of the base 1 of the transferring path for reducing the wear generated in the transferring process of the wafer, the four groups of clamping holes 32 are used for facilitating the following description, the motor 2 is a stepping motor, ninety degrees of rotation is performed each time, so that the wafer is transferred, the upper grinding disc 41 and the lower grinding disc 131 rotate at the same speed and in the opposite direction through a driving assembly which is not shown in the drawing, and the diameter of the roller 33 is larger than the thickness of the carrier 3, so that the carrier 3 is ensured not to be polished.
The above is further elucidated: the carrier 3 is rotated by the gyro wheel 33 and supported on the top outer wall of base 1, avoid carrier 3 to rotate the in-process and produce wearing and tearing, simultaneously when lower mill 131 and last mill 41 are equi-speed reverse rotation to polish the wafer in the centre gripping hole 32, lower mill 131 and last mill 41 can finally abut with gyro wheel 33 to avoid carrier 3 to be polished, the diameter size of gyro wheel 33 is wafer finished product thickness, can change gyro wheel 33 of different diameters according to wafer finished product thickness, avoided carrier 3 to need frequent circumstances of changing, and the practicality is improved greatly
Specifically, the unloading mechanism includes unloading frame 6, the welding has unloading sloping frame 17 on the outer wall of base 1, a set of material 171 has been seted up on the outer wall of unloading sloping frame 17, the material 171 aligns with ejection groove 16, the internal sliding grafting has unloading frame 6 in ejection groove 16, the welding has a plurality of semi-cylindrical jack post 62 on the outer wall of unloading frame 6, jack post 62 and ejection groove 16 looks adaptation, the sliding grafting has a plurality of semicircular slide post 63 on the outer wall of unloading frame 6, slide post 63 and jack post 62 one-to-one, be provided with spring one 631 between the bottom outer wall of every slide post 63 and the top outer wall of unloading frame 6, the welding has fender post 632 on the bottom outer wall of every slide post 63, the welding has rack two 61 on the outer wall of unloading frame 6 unable through ejection groove 16, the welding has rack one 42 on the output outer wall of electric putter 4, the rotation grafting has gear 5 on the outer wall of one side of base 1 between rack one 42 and two 61, rack one 42 and two 61 all intermesh with gear 5.
In the initial state, under the action of the first spring 631, the end of the jack post 62 is flush with the end of the slide post 63, so that the wafer is uniformly stressed when being ejected, and the inner wall of the blanking inclined frame 17 is rotationally inserted with a pulley, thereby reducing the abrasion of the wafer.
Further explanation is made for the above-mentioned blanking mechanism: when the polishing of the wafer is finished, the carrier 3 is driven to rotate by the motor 2, so that the finished wafer is transported to the lower part of the material receiving opening 171, and the wafer to be polished is transported to the lower grinding disc 131 from the material loading opening 141, when the charged push rod 4 drives the upper grinding disc 41 to move downwards, the lower material frame 6 moves upwards under the transmission action of the gear 5, so that the jack post 62 and the slide post 63 jack the finished wafer into the material receiving opening 171, when the finished wafer enters the material discharging inclined frame 17, the baffle table 632 is abutted with the base 1, so that the slide post 63 cannot continuously ascend, at the moment, the jack post 62 continuously ascends, one side of the finished wafer close to the jack post 62 is inclined upwards, and then the finished wafer is smoothly fed into the material discharging inclined frame 17, so that the automatic material discharging effect is realized, the working efficiency is greatly improved, after the subsequent wafer is polished again, the charged push rod 4 drives the upper grinding disc 41 to move upwards, the lower material frame 6 moves downwards under the action of the gear 5, so that the jack post 62 and the slide post 63 automatically contract back into the material discharging groove 16 again, and the automatic material discharging is realized.
Specifically, feed mechanism includes material loading frame 7, and the bottom outer wall center department welding of carrier 3 has lead screw 34, has cup jointed material loading frame 7 through screw-thread fit on the outer wall of lead screw 34, and material loading frame 7 is kept away from the one end slip grafting of lead screw 34 in magazine 14, and the slip grafting has a plurality of slide 71 on the outer wall of material loading frame 7, slide 71 and feed opening 141 looks adaptation, all are provided with spring two 711 between the bottom outer wall of every slide 71 and the top outer wall of material loading frame 7.
The wafers are stacked in the material box 14, the number of the wafers which can be contained in the material box 14 is an integer, and in an initial state, the upper surface of the uppermost wafer in the material box 14 is flush with the outer wall of the top of the base 1.
The above feeding mechanism is further described: the motor 2 drives the screw rod 34 to rotate, and every ninety degrees are rotated to the screw rod 34, the loading frame 7 rises a wafer thickness to make the upper most wafer in the magazine 14 pushed out of the magazine 14, make the lower surface of upper most wafer and the outer wall parallel and level of base 1 top simultaneously, when centre gripping hole 32 aligns with the feed inlet 141, the wafer gets into in the centre gripping hole 32, and then makes the wafer can be along with carrier 3 transport to polish between lower mill 131 and the last mill 41, realize the effect of automatic feeding, improve work efficiency greatly.
The working principle and the using flow of the invention are as follows: stacking the wafers in the material box 14, controlling the motor 2 to rotate ninety degrees each time, pushing the uppermost wafer in the material box 14 out of the material box 14 under the action of the feeding mechanism, enabling the wafers to enter the clamping holes 32 when the clamping holes 32 are aligned with the feeding holes 141, realizing the effect of automatic feeding, driving the upper grinding disc 41 to move downwards through the electric push rod 4 when the wafers are transferred onto the lower grinding disc 131, realizing double-sided grinding of the wafers, wherein the thickness of finished wafers is the diameter of the roller 33, and pushing the finished wafers into the material receiving holes 171 by the jacking posts 62 and the sliding posts 63 under the action of the discharging mechanism after grinding is finished, and enabling one side of the finished wafers close to the jacking posts 62 to incline upwards, further enabling the finished wafers to slide into the material discharging inclined frame 17, and realizing the effect of automatic discharging.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (4)
1. The utility model provides a wafer bears subassembly convenient to two-sided grinding, includes base (1), its characterized in that: the utility model discloses a motor, including base (1) and base, support (11) are connected through the bolt on the top outer wall of base (1), the welding has motor (2) on the top outer wall of support (11), the welding has fixture block (21) on the main shaft outer wall of motor (2), it has disc carrier (3) to rotate the grafting on the top outer wall of base (1), draw-in groove (31) have been seted up at the top outer wall center department of carrier (3), fixture block (21) slip grafting is in draw-in groove (31), a plurality of equidistant circumference distributed's of centre gripping hole (32) have been seted up on the top outer wall of carrier (3), the utility model discloses a wafer polishing device, including a base (1), a carrier (3), a grinding groove (13), a feeding hole (141), a through hole (15) and an ejection groove (16) are arranged on the outer wall of the base (1), a plurality of rollers (33) which are distributed at equal intervals in circumference are rotationally inserted on the outer wall of the cylindrical surface of the carrier (3) through bolts, the rollers (33) are in one-to-one correspondence with the clamping holes (32), the rollers (33) are abutted against the outer wall of the top of the base (1), the carrier (3) is rotationally supported on the outer wall of the top of the base (1) by the rollers (33), when a lower grinding disc (131) and an upper grinding disc (41) rotate at equal speed and in opposite directions to polish the wafer in the clamping holes (32), the lower grinding disc (131) and the upper grinding disc (41) are abutted against the rollers (33) finally, the grinding groove (13), the feeding hole (141), the through hole (15) and the ejection groove (16) are arranged on the outer wall of the base (1), the grinding groove (13), the feeding port (141), the through hole (15) and the ejection groove (16) are distributed circumferentially around the circle center of the carrier (3) at equal intervals, a lower grinding disc (131) is inserted in the grinding groove (13) in a rotating mode, the grinding surface of the lower grinding disc (131) is flush with the top outer wall of the base (1), an electric push rod (4) is welded on the top outer wall of the base (1), an upper grinding disc (41) is inserted in the output end of the electric push rod (4) in a rotating mode, the upper grinding disc (41) and the lower grinding disc (131) are matched with the idler wheels (33), the upper grinding disc (41) and the lower grinding disc (131) are distributed coaxially, and a discharging mechanism and a feeding mechanism are arranged on the base (1);
The blanking mechanism comprises a blanking frame (6), a plurality of semicircular sliding columns (63) are welded on the outer wall of the base (1), a group of material receiving openings (171) are formed in the outer wall of the blanking frame (17), the material receiving openings (171) are aligned with ejection grooves (16), the blanking frame (6) is inserted in the ejection grooves (16) in a sliding mode, a plurality of semi-cylindrical jacking columns (62) are welded on the outer wall of the blanking frame (6), the jacking columns (62) are matched with the ejection grooves (16), a plurality of semicircular sliding columns (63) are connected to the outer wall of the blanking frame (6) in a sliding mode, the sliding columns (63) are in one-to-one correspondence with the jacking columns (62), a first spring (631) is arranged between the bottom outer wall of each sliding column (63) and the top outer wall of the blanking frame (6), a blocking table (632) cannot pass through the ejection grooves (16) in a sliding mode, a first gear (61) is welded on the bottom outer wall of each sliding column (63), a second gear (42) is welded on the outer wall of the blanking frame (6), a first gear (42) is welded on the outer wall of the first gear (61), the first rack (42) and the second rack (61) are meshed with the gear (5).
2. The wafer carrier assembly of claim 1, wherein: elastic washers (321) are adhered to the inner walls of the clamping holes (32), the grinding grooves (13), the feeding holes (141) and the ejection grooves (16) are matched with the clamping holes (32), the material boxes (14) are welded on the outer walls of the bottoms of the bases (1), and the feeding holes (141) are communicated with the material boxes (14).
3. The wafer carrier assembly of claim 1, wherein: the feeding mechanism comprises a feeding frame (7), a screw rod (34) is welded at the center of the outer wall of the bottom of the carrier (3), the feeding frame (7) is sleeved on the outer wall of the screw rod (34) through threaded fit, and one end, far away from the screw rod (34), of the feeding frame (7) is slidably inserted into the material box (14).
4. A wafer carrier assembly for facilitating double-sided lapping as claimed in claim 3, wherein: the outer wall of the feeding frame (7) is slidably inserted with a plurality of sliding plates (71), the sliding plates (71) are matched with the feeding holes (141), and springs II (711) are arranged between the outer wall of the bottom of each sliding plate (71) and the outer wall of the top of the feeding frame (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311758055.4A CN117863069B (en) | 2023-12-20 | 2023-12-20 | Wafer bearing assembly convenient for double-sided grinding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311758055.4A CN117863069B (en) | 2023-12-20 | 2023-12-20 | Wafer bearing assembly convenient for double-sided grinding |
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| CN117863069A CN117863069A (en) | 2024-04-12 |
| CN117863069B true CN117863069B (en) | 2024-07-26 |
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|---|---|---|---|---|
| CN212122665U (en) * | 2020-05-15 | 2020-12-11 | 嘉兴钢球厂 | Two-side grinding device for ball valve seat |
| CN115213810A (en) * | 2022-06-13 | 2022-10-21 | 浙江避泰电气科技有限公司 | Resistor disc grinding device and process thereof |
| CN219212557U (en) * | 2023-03-06 | 2023-06-20 | 襄阳奥莱特光电仪器有限公司 | Double-sided grinder for glass sheets |
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|---|---|
| CN117863069A (en) | 2024-04-12 |
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