CN212706145U - Wafer grinding machine - Google Patents
Wafer grinding machine Download PDFInfo
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- CN212706145U CN212706145U CN202020911011.6U CN202020911011U CN212706145U CN 212706145 U CN212706145 U CN 212706145U CN 202020911011 U CN202020911011 U CN 202020911011U CN 212706145 U CN212706145 U CN 212706145U
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- wafer
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Abstract
The utility model discloses a can realize grinding and wafer change can go on simultaneously, can improve grinding efficiency, improve the wafer grinding machine who grinds the quality. The wafer grinder comprises a base; a support column is arranged at the central position of the base; the base is provided with a support frame; a rotating disc is rotatably arranged on the supporting column; a plurality of mounting grooves are arranged in the rotating disc, and a rotating wheel is arranged in each mounting groove; a wafer mounting groove is formed in the rotating wheel; a fixed disc is arranged above the rotating disc; a grinding disc corresponding to the rotating wheel is arranged on the fixed disc; and a notch is arranged on the fixed disk, and the notch corresponds to one rotating wheel. By adopting the wafer grinding machine, the grinding and the replacement of the wafer can be carried out simultaneously, so that the efficiency can be improved; and the wafer can pass through the grinding of a plurality of millstones in turn, and different millstones are arranged, so that the grinding quality is improved in turn, and the quality of a final product is ensured.
Description
Technical Field
The utility model relates to a chip production technology, especially a wafer grinds machine.
Background
It is known that: in the production process of the chip, a wafer is firstly obtained, and then the wafer is required to be thinned, so that the thickness of the wafer meets the production requirement.
Thinning of the wafer is typically achieved by a grinding process. The existing wafer grinding equipment is realized by rotary grinding; the wafer is installed in the wafer installation groove, then the grinding disc is rotated, and the wafer is ground through relative rotation between the grinding disc and the wafer, so that the wafer is thinned.
In the existing wafer grinding equipment, because the grinding disc is always positioned above the wafer mounting groove when the wafer is ground, the wafer cannot be replaced while the wafer is ground; thereby making the production efficiency low.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a can realize grinding and the wafer is changed and can go on simultaneously, can improve grinding efficiency, improves the wafer grinding machine who grinds the quality.
The utility model provides a technical scheme that its technical problem adopted is: the wafer grinding machine comprises a base; a support column is arranged at the central position of the base;
the base is provided with a support frame; a rotating disc is rotatably arranged on the supporting column; the rotating disc is provided with mounting grooves which are uniformly distributed along the circumference; a driving motor for driving the rotating disc to rotate is arranged in the supporting column;
a rotating wheel is arranged in the mounting groove; the bottom surface of the rotating disc is provided with a driving device for driving the rotating wheel to rotate; the rotating wheel is provided with wafer mounting grooves which are uniformly distributed;
a fixed disc is arranged right above the rotating disc; the fixed disc is connected with the support frame through a vertical telescopic device;
the fixed disc is provided with mounting holes corresponding to the mounting grooves on the rotating disc; a grinding disc is arranged in the stepped mounting hole with the smaller diameter at the lower end of the mounting hole; the lower end of the grinding disc extends out of the lower end of the mounting hole;
a sealing cover is arranged at the upper end of the stepped mounting hole; the seal cover is provided with an adjusting bolt; one end of the adjusting bolt penetrates through the sealing cover and is in contact with the upper end of the grinding disc; the adjusting bolt is in threaded fit with the sealing cover; the grinding disc is provided with a flange, and a spring is arranged between the flange and a step platform of the step mounting hole;
a notch is formed in the fixed disc; the notch corresponds to one mounting groove on the rotating disc.
Furthermore, a surrounding plate is arranged on the outer side of the upper end of the rotating disc.
Preferably, the vertical telescopic device adopts a hydraulic cylinder.
Furthermore, a connecting hole matched with the upper end of the supporting column is formed in the bottom surface of the rotating disc;
a thrust bearing is arranged between the bottom of the connecting hole and the upper end of the support column; and a roller bearing is arranged between the outer surface of the upper end of the supporting column and the inner wall of the connecting hole.
Preferably, the driving device adopts a motor.
The utility model has the advantages that: the wafer grinding machine of the utility model is characterized in that a plurality of mounting grooves are arranged in the rotating disc, and a rotating wheel is arranged in each mounting groove; a wafer mounting groove is formed in the rotating wheel;
a fixed disc is arranged above the rotating disc; a grinding disc corresponding to the rotating wheel is arranged on the fixed disc; a notch is arranged on the fixed disc and corresponds to one rotating wheel; therefore, the wafers can be ground simultaneously by the rotating wheels, and the rotating wheels corresponding to the notches can be replaced by the wafers; therefore, the grinding and the replacement of the wafer can be carried out simultaneously, and the efficiency can be improved; and the wafer can pass through the grinding of a plurality of millstones in turn, and different millstones are arranged, so that the grinding quality is improved in turn, and the quality of a final product is ensured.
Drawings
Fig. 1 is a perspective view of a wafer grinder according to an embodiment of the present invention;
FIG. 2 is an exploded view of an embodiment of the wafer grinder of the present invention;
fig. 3 is a top view of a wafer grinder according to an embodiment of the present invention;
fig. 4 is a front view of the wafer grinder according to the embodiment of the present invention;
FIG. 5 is a sectional view A-A of FIG. 3;
FIG. 6 is a cross-sectional view B-B of FIG. 4;
FIG. 7 is an enlarged view of a portion C of FIG. 5;
FIG. 8 is an enlarged view of a portion D of FIG. 5;
the following are marked in the figure: 1-base, 2-support frame, 3-support column, 4-vertical telescopic device, 5-rotating disc, 6-rotating wheel, 7-driving device, 8-fence, 9-fixed disc, 10-grinding disc, 11-sealing cover, 12-adjusting bolt, 13-spring, 14-roller bearing and 15-thrust bearing.
Detailed Description
The present invention will be further explained with reference to the drawings and examples.
As shown in fig. 1 to 8, the wafer grinder of the present invention includes a base 1; a support column 3 is arranged at the center of the base 1;
the base 1 is provided with a support frame 2; a rotating disc 5 is rotatably arranged on the supporting column 3; the rotating disc 5 is provided with mounting grooves 51 which are uniformly distributed along the circumference; a driving motor 16 for driving the rotating disc 5 to rotate is arranged in the supporting column 3;
a rotating wheel 6 is arranged in the mounting groove 51; the bottom surface of the rotating disc 5 is provided with a driving device 7 for driving the rotating wheel 6 to rotate; the rotating wheel 6 is provided with wafer mounting grooves 61 which are uniformly distributed;
a fixed disc 9 is arranged right above the rotating disc 5; the fixed disc 9 is connected with the support frame 2 through the vertical telescopic device 4;
the fixed disc 9 is provided with a mounting hole corresponding to the mounting groove 51 on the rotating disc 5; a grinding disc 10 is arranged in the stepped mounting hole with the smaller diameter at the lower end of the mounting hole; the lower end of the grinding disc 10 extends out of the lower end of the mounting hole;
a sealing cover 11 is arranged at the upper end of the stepped mounting hole; the seal cover 11 is provided with an adjusting bolt 12; one end of the adjusting bolt 12 penetrates through the sealing cover 11 and is in contact with the upper end of the grinding disc 10; the adjusting bolt 12 is in threaded fit with the sealing cover 11; the grinding disc 10 is provided with a flange, and a spring 13 is arranged between the flange and a step platform of the step mounting hole;
a notch 91 is arranged on the fixed disc 9; the notch 91 corresponds to one of the mounting grooves 51 on the turn disc 5.
In the course of the application process,
the grinding disc 11 can be installed in the stepped installation hole; and the grinding grade is from low to high according to clockwise or anticlockwise; when the equipment is not started, the fixed disc 9 is lifted through the vertical telescopic device 4; when the wafer needs to be ground, installing the wafer to be ground in the wafer installation groove 61 of the runner 6 in the installation groove 51 corresponding to the lower part of the notch 91;
then the rotating disc 5 is driven to rotate by the driving motor 16, so that the installation groove 51 provided with the wafer is positioned below the lowest grinding low-level grinding disc 11; then, the vertical telescopic device 4 is started to enable the grinding disc to extend into the mounting groove 51 to be contacted with the wafer; simultaneously, the driving device 7 is started to enable the rotating wheel 6 to rotate to grind the wafer; then, installing a wafer to be ground in the wafer installation groove 61 of the rotary wheel 6 in the installation groove 51 below the notch 91; carrying out first grinding on the wafer which is installed at the moment; after the installation is finished, the driving device 7 is braked, the fixed disc 9 is lifted through the vertical telescopic device 4, the fixed disc rotates by one position, and then a wafer to be ground is installed in the wafer installation groove 61 of the rotary wheel 6 in the installation groove 51 below the sub-notch 91; and so on, finally making the first batch of wafers installed return to the lower part of the notch 91; at the moment, the wafer is ground, then the wafer is replaced, and the like, so that the continuous grinding of the wafer is realized.
To sum up, the wafer grinding machine of the utility model is provided with a plurality of mounting grooves in the rotating disc, and a rotating wheel is arranged in each mounting groove; a wafer mounting groove is formed in the rotating wheel;
a fixed disc is arranged above the rotating disc; a grinding disc corresponding to the rotating wheel is arranged on the fixed disc; a notch is arranged on the fixed disc and corresponds to one rotating wheel; therefore, the wafers can be ground simultaneously by the rotating wheels, and the rotating wheels corresponding to the notches can be replaced by the wafers; therefore, the grinding and the replacement of the wafer can be carried out simultaneously, and the efficiency can be improved; and the wafer can pass through the grinding of a plurality of millstones in turn, and different millstones are arranged, so that the grinding quality is improved in turn, and the quality of a final product is ensured.
To avoid powder generated during the grinding process from spilling out of the mounting groove 51; furthermore, a coaming plate 8 is arranged on the outer side of the upper end of the rotating disc 5.
For the convenience of control, it is preferable that the vertical telescopic device 4 is a hydraulic cylinder.
In order to prolong the service life, furthermore, the bottom surface of the rotating disc 5 is provided with a connecting hole matched with the upper end of the supporting column 31;
a thrust bearing 15 is arranged between the bottom of the connecting hole and the upper end of the support column 31; a roller bearing 14 is arranged between the outer surface of the upper end of the support column 31 and the inner wall of the connecting hole.
For the convenience of control, it is preferable that the driving device 7 employs a motor.
Claims (5)
1. The wafer grinding machine is characterized in that: comprises a base (1); a support column (3) is arranged at the central position of the base (1);
the base (1) is provided with a support frame (2); a rotating disc (5) is rotatably arranged on the supporting column (3); the rotating disc (5) is provided with mounting grooves (51) which are uniformly distributed along the circumference; a driving motor (16) for driving the rotating disc (5) to rotate is arranged in the supporting column (3);
a rotating wheel (6) is arranged in the mounting groove (51); the bottom surface of the rotating disc (5) is provided with a driving device (7) for driving the rotating wheel (6) to rotate; the rotating wheel (6) is provided with wafer mounting grooves (61) which are uniformly distributed;
a fixed disc (9) is arranged right above the rotating disc (5); the fixed disc (9) is connected with the support frame (2) through a vertical telescopic device (4);
the fixed disc (9) is provided with mounting holes corresponding to the mounting grooves (51) on the rotating disc (5); a grinding disc (10) is arranged in the stepped mounting hole with the smaller diameter at the lower end of the mounting hole; the lower end of the grinding disc (10) extends out of the lower end of the mounting hole;
a sealing cover (11) is arranged at the upper end of the stepped mounting hole; an adjusting bolt (12) is arranged on the sealing cover (11); one end of the adjusting bolt (12) penetrates through the sealing cover (11) and is in contact with the upper end of the grinding disc (10); the adjusting bolt (12) is in threaded fit with the sealing cover (11); the grinding disc (10) is provided with a flange, and a spring (13) is arranged between the flange and a step platform of the step mounting hole;
a notch (91) is arranged on the fixed disc (9); the notch (91) corresponds to one mounting groove (51) on the rotating disc (5).
2. The wafer grinder of claim 1, wherein: and a coaming plate (8) is arranged on the outer side of the upper end of the rotating disc (5).
3. The wafer grinder of claim 2, wherein: the vertical telescopic device (4) adopts a hydraulic cylinder.
4. The wafer grinder of claim 3, wherein: the bottom surface of the rotating disc (5) is provided with a connecting hole matched with the upper end of the support column (31);
a thrust bearing (15) is arranged between the bottom of the connecting hole and the upper end of the support column (31); and a roller bearing (14) is arranged between the outer surface of the upper end of the supporting column (31) and the inner wall of the connecting hole.
5. The wafer grinder of claim 4, wherein: the driving device (7) adopts a motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020911011.6U CN212706145U (en) | 2020-05-26 | 2020-05-26 | Wafer grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020911011.6U CN212706145U (en) | 2020-05-26 | 2020-05-26 | Wafer grinding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212706145U true CN212706145U (en) | 2021-03-16 |
Family
ID=74947553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020911011.6U Active CN212706145U (en) | 2020-05-26 | 2020-05-26 | Wafer grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212706145U (en) |
-
2020
- 2020-05-26 CN CN202020911011.6U patent/CN212706145U/en active Active
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