CN117856044A - White light laser - Google Patents
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- CN117856044A CN117856044A CN202410075707.2A CN202410075707A CN117856044A CN 117856044 A CN117856044 A CN 117856044A CN 202410075707 A CN202410075707 A CN 202410075707A CN 117856044 A CN117856044 A CN 117856044A
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- 239000000919 ceramic Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 13
- 238000005457 optimization Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 7
- 238000013507 mapping Methods 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 3
- 238000004134 energy conservation Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000005286 illumination Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 101100161752 Mus musculus Acot11 gene Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
A white light laser belongs to the technical field of white light laser. The invention comprises a copper-clad substrate, a ceramic bracket and an opaque ceramic plate, wherein the ceramic bracket is arranged at the upper end of the copper-clad substrate and surrounds the copper-clad substrate to form a containing cavity, the ceramic plate is arranged at the upper end of the ceramic bracket and seals the containing cavity, a fluorescent sheet is arranged on the ceramic plate, a first laser chip, a second laser chip and a reflecting mirror matched with the first laser chip and the second laser chip are arranged in the containing cavity, two rectangular light beams formed by the first laser chip and the second laser chip in a divergent mode are shaped and combined through a free curved surface of the reflecting mirror, rectangular light spots are formed above the free curved surface, and the fluorescent sheet is covered.
Description
Technical Field
The invention belongs to the technical field of white light lasers, and particularly relates to a white light laser.
Background
With the increasing demand for high-brightness illumination devices, semiconductor illumination technology is evolving toward high current, high power density, light weight, and small size, and laser illumination as a new generation illumination technology has arisen. Compared with the prior LED technology, the laser illumination technology not only avoids the problem of efficiency dip, but also has the characteristics of super high power, super high brightness, high collimation, long irradiation distance and the like, and can be applied to the fields of automobile headlamps, projection display, medical equipment, visible light communication and the like, and has huge market potential.
White light lasers are an illumination source technology that generates high brightness white light based on laser light. The main mode of generating white light by using laser at present is to irradiate blue laser on a ceramic fluorescent sheet, wherein the ceramic fluorescent sheet is excited by the blue laser and spontaneously radiates light with longer wavelength, and the newly generated light is mixed with the original blue light to generate white light. The white light laser in the current market has the following defects at the application end:
(1) The light conversion efficiency of the white light laser source is low;
(2) Most of the white light laser sources are designed based on a collimated laser beam, and when the collimated laser beam is applied to a beam with a divergence angle, the uniformity of energy distribution is reduced, and the sharpness of the spot edge is reduced.
There is therefore a need to propose a new solution to the above-mentioned problems.
Disclosure of Invention
The invention mainly solves the technical problems existing in the prior art and provides a white light laser.
The technical problems of the invention are mainly solved by the following technical proposal: the utility model provides a white light laser device, includes copper-clad base plate, ceramic support and opaque potsherd, the potsherd sets up in copper-clad base plate upper end and encloses into and hold the chamber, the potsherd sets up in the upper end of ceramic support and sealed holds the chamber, install the fluorescence piece on the potsherd, hold intracavity be equipped with first laser chip, second laser chip and with the speculum of first laser chip and second laser chip adaptation, two rectangular light beams that first laser chip and second laser chip diverge and form are through speculum freeform plastic beam combining, form the rectangle facula above the freeform to cover the fluorescence piece.
Preferably, a heat conducting plate positioned at the upper end of the copper-clad substrate is arranged in the accommodating cavity, and the first laser chip and the second laser chip are respectively arranged at two sides of the heat conducting plate.
Preferably, the anodes of the first and second laser chips are welded to the copper-clad layer of the copper-clad substrate, and the cathodes of the first and second laser chips are welded to the copper-clad layer of the copper-clad substrate through bonding wires.
Preferably, the upper end of the ceramic support is provided with a reinforced heat conducting sheet, and the ceramic sheet is positioned at the upper end of the reinforced heat conducting sheet.
Preferably, the MEMS pressure sensor for detecting the air tightness of the accommodating cavity is arranged in the accommodating cavity, the anode and the cathode of the MEMS pressure sensor are respectively welded to the copper-clad layer of the copper-clad substrate, and the output signal channel of the MEMS pressure sensor is connected to the copper-clad layer of the copper-clad substrate.
Preferably, the copper-clad substrate is provided with a first electrode, a second electrode, a third electrode, a fourth electrode, a fifth electrode and a sixth electrode which are connected with an upper copper-clad layer, the anodes of the first laser chip and the second laser chip are connected with the fifth electrode through the copper-clad layer, the cathodes of the first laser chip and the second laser chip are connected with the sixth electrode through the copper-clad layer, the anode of the MEMS pressure sensor is connected with the third electrode through the copper-clad layer, the cathode of the MEMS pressure sensor is connected with the fourth electrode through the copper-clad layer, and the output signal channel of the MEMS pressure sensor is connected with the first electrode and the second electrode through the copper-clad layer.
Preferably, the method for constructing the free-form surface of the reflector comprises the following steps:
step 1, equally dividing a light source surface S and a target surface T according to energy conservation, and determining coordinates of each point, wherein the coordinates of each point on the light source surface S are (x) si ，y sj ) The coordinates of each point on the target surface T are (x ti ，y tj )；
Step 2, according to the mapping relation between the light source surface S and the target surface T according to the principle of edge light, the incident light is IN i，j The emergent ray is OUT i，j ；
Step 3, constructing a free-form surface by using the mapping and Snell law;
step 4, determining initial parameters and modeling an initial structure of the free-form surface;
step 5, simulating the performance of the optical system by using a Monte Carlo ray tracing method, and determining a free-form surface if the performance meets the requirements; if the step 1 is not satisfied, the step 1 is iterated through reverse feedback optimization.
Preferably, step 3 comprises the steps of:
step 3.1, incident ray IN according to the vector form of Snell's law i，j Point P when passing through free-form surface i ，j(x i,j ,y i,j ,z i,j ) The normal vector of (2) is:
step 3.2, according to the differential geometry, the next ray IN i+1，j Will be in contact with the passing point P i，j Is intersected with point P i+1，j ，
Step 3.3, repeating the above process continuously, determining Z-axis coordinates of all points of the free-form surface in the X-axis direction and the Y-axis direction according to the following formula, thereby constructing the free-form surface,
z-axis coordinates in X-axis direction:
z-axis coordinates in Y-axis direction:
preferably, in step 5, the reverse feedback optimization iteration includes the following steps:
step 5.1, adopting divergent laser beams to trace the light of the initial structure of the free-form surface to obtain the radiant illuminance value E of the grid (i, j) on the target surface T i,j (0) Average value of illuminance
Step 5.2, keeping the grid division of the target surface T unchangedContinuously adjusting the grid area on the light source surface S according to feedback to ensure that the radiation illuminance value E of the grid (i, j) on the target surface T i,j (0) Adjust to eta i,j (0) Determined as follows:
in phi 0 Corresponding grid energy on the light source surface S; phi (phi) 1 Is the total energy of the light source surface S; m is the number of divided grids; η is the value of the feedback function,
the invention has the beneficial effects that:
1. in the invention, the free curved surface on the reflector shapes and combines two rectangular beams formed by the divergence of the first laser chip and the second laser chip, so as to improve the energy of the beam reflected to the fluorescent sheet, thereby improving the light conversion efficiency.
2. According to the invention, the MEMS pressure sensor is arranged, when the heat generated by the first laser chip and the second laser chip is too high, the MEMS pressure sensor is used for detecting the pressure change of the accommodating cavity, and signals are output to the external control circuit through the output signal channel, so that the driving current is disconnected, and the functions of controlling the circuits of the first laser chip and the second laser chip and improving the safety are achieved.
3. The invention provides a construction method based on a free-form surface with a divergence angle laser beam, and a reflector constructed by the method can meet the requirement of uniformity of illuminance of the beam radiation reflected to a fluorescent plate.
Drawings
FIG. 1 is a schematic view of a construction of the present invention;
FIG. 2 is a right side view of the present invention;
FIG. 3 is a schematic view of a copper-clad layer according to the present invention;
FIG. 4 is a state of use diagram of the present invention;
FIG. 5 is another usage state diagram of the present invention;
FIG. 6 is a flow chart of a free-form surface construction method of the present invention;
FIG. 7 is a schematic diagram of a free-form surface construction method of the present invention;
FIG. 8 is a free-form surface point P of the present invention i，j Is a graph of (1);
FIG. 9 is a schematic illustration of a surface shape of a free-form surface in accordance with the present invention;
FIG. 10 is a graph showing an illuminance distribution of a light beam on a free-form surface according to the present invention.
In the figure: 1. a copper-clad substrate; 2. a ceramic support; 3. a ceramic sheet; 4. a fluorescent sheet; 5. a first laser chip; 6. a second laser chip; 7. a reflecting mirror; 8. a free-form surface; 9. a heat conductive plate; 10. a copper-clad layer; 11. a bonding wire; 12. reinforcing the heat conducting fin; 13. a MEMS pressure sensor; 14. a first electrode; 15. a second electrode; 16. a third electrode; 17. a fourth electrode; 18. a fifth electrode; 19. and a sixth electrode.
Detailed Description
The technical scheme of the invention is further specifically described below through examples and with reference to the accompanying drawings.
Examples: 1-5, including covering copper base plate 1, ceramic support 2, and opaque potsherd 3, the potsherd 2 sets up in covering copper base plate 1 upper end and encloses into and hold the chamber, potsherd 3 sets up in the upper end of potsherd 2 and sealed holds the chamber, install fluorescence piece 4 on the potsherd 3, hold intracavity and be equipped with first laser chip 5, second laser chip 6, and with the speculum 7 of first laser chip 5 and second laser chip 6 looks adaptation, two rectangular light beams that first laser chip 5 and second laser chip 6 divergent formation are through speculum 7 free-form surface 8 plastic beam of a bundle, form rectangular facula above free-form surface 8, and cover fluorescence piece 4.
In operation, the first laser chip 5 and the second laser chip 6 emit light beams simultaneously, and the free-form surface 8 of the reflecting mirror 7 shapes and combines the light beams to improve the energy of the light beams reflected to the fluorescent sheet 4, thereby improving the light conversion efficiency. The first laser chip 5 and the second laser chip 6 have the same structure and are side-emitting blue laser chips, and light beams emitted by the first laser chip 5 and the second laser chip 6 form rectangular light spots near light outlets of the respective laser chips due to laser divergence, that is, the light beams emitted by the first laser chip 5 and the second laser chip 6 have divergence angles.
The reflecting mirror 7 is made of quartz glass, and shapes and combines two beams with divergence angles through the free curved surface 8 on the reflecting mirror, reflects the beams to the upper side of the free curved surface 8 to form a rectangular light spot, and covers the fluorescent sheet 4.
The fluorescent sheet 4 is used for generating white light by excitation with the shaped and combined light beam; during installation, a groove penetrating through the ceramic sheet 3 is formed in the ceramic sheet 3, and the fluorescent sheet 4 is installed in the groove; preferably, the upper end of the fluorescent sheet 4 is flush with the upper end of the ceramic sheet 3, so that on one hand, the fluorescent sheet 4 is convenient to clean, dust or small particle impurities are prevented from being attached to the upper end of the fluorescent sheet 4 or embedded in a groove, and the light emitting effect of white light is ensured; on the other hand, the aesthetic property is improved.
The ceramic plate 3 adopts opaque white ceramic, and is used for shielding the accommodating cavity on one hand and avoiding direct observation of devices arranged in the accommodating cavity from the outer side of the ceramic plate 3; on the other hand, blue laser can be effectively blocked.
A plurality of copper-clad layers 10 are provided on the copper-clad substrate 1 for connection with the first laser chip 5, the second laser chip 6, and the like.
Further, a heat conducting plate 9 positioned at the upper end of the copper-clad substrate 1 is arranged in the accommodating cavity, and the first laser chip 5 and the second laser chip 6 are respectively arranged at two sides of the heat conducting plate 9. The heat conducting plate 9 is made of high heat conducting materials such as diamond, siC, AIN and the like, and can strengthen heat conduction of heat generated by the first laser chip 5 and the first laser chip 5, conduct the heat to the copper-clad substrate 1 through a heat sink and radiate and dissipate the heat outwards through the copper-clad substrate 1 so as to reduce the temperature of the first laser chip 5 and the second laser chip 6.
Preferably, the first laser chip 5 and the second laser chip 6 are welded on the heat conduction pad of the heat conduction plate 9 through eutectic solder, the positive electrodes of the first laser chip 5 and the second laser chip 6 are welded to the corresponding copper-clad layer 10 of the copper-clad substrate 1, the negative electrodes of the first laser chip 5 and the second laser chip 6 are welded to the corresponding copper-clad layer 10 of the copper-clad substrate 1 through bonding wires 11, and the bonding wires 11 can adopt gold wires.
Further, the upper end of the ceramic support 2 is provided with a reinforced heat conducting fin 12, the ceramic plate 3 is positioned at the upper end of the reinforced heat conducting fin 12, and the upper end of the ceramic plate 3 is flush with the upper end of the ceramic support 2. The reinforced heat conducting fin 12 is made of diamond or other light-transmitting high heat conducting materials and is embedded in the inner wall of the upper end of the ceramic support 2. The reinforced heat conducting fin 12 has good heat conductivity and light transmittance, and can conduct heat generated by the first laser chip 5 and the second laser chip 6 to the ceramic support 2 while effectively guaranteeing the passing of the shaped and combined light beam, and radiate and dissipate heat outwards through the ceramic support 2 so as to reduce the temperature inside the accommodating cavity.
Further, a MEMS pressure sensor 13 is arranged in the accommodating cavity, and the MEMS pressure sensor 13 is welded on one side of the first laser chip 5 or the second laser chip 6 through eutectic solder and is used for detecting the air tightness of the accommodating cavity. The positive electrode and the negative electrode of the MEMS pressure sensor 13 are respectively welded to the corresponding copper-clad layers 10 of the copper-clad substrate 1, and the output signal channels of the MEMS pressure sensor 13 are connected to the corresponding copper-clad layers 10 of the copper-clad substrate 1.
By arranging the MEMS pressure sensor 13, when the heat generated by the first laser chip 5 and the second laser chip 6 is too high, the copper-clad substrate 1 is heated to deform, so that a gap is generated at the joint of the copper-clad substrate 1 and the ceramic bracket 2, and the outside air enters the accommodating cavity through the gap to change the pressure of the accommodating cavity; the MEMS pressure sensor 13 detects the pressure change, generates a signal, converts the signal into a digital signal, and outputs the digital signal to an external control circuit through an output signal channel, so that the driving current is disconnected, and the functions of controlling the circuits of the first laser chip 5 and the second laser chip 6 and improving the safety are achieved.
Further, as shown in fig. 3, the copper-clad substrate 1 is provided with a first electrode 14, a second electrode 15, a third electrode 16, a fourth electrode 17, a fifth electrode 18 and a sixth electrode 19 which are connected with the copper-clad layer 10 thereon, the anodes of the first laser chip 5 and the second laser chip 6 are connected with the fifth electrode 18 through the copper-clad layer 10, the cathodes of the first laser chip 5 and the second laser chip 6 are connected with the sixth electrode 19 through the copper-clad layer 10, and the fifth electrode 18 and the sixth electrode 19 are used for being connected with external driving current so that the first laser chip 5 and the second laser chip 6 work normally; the positive electrode of the MEMS pressure sensor 13 is connected with the third electrode 16 through the copper-clad layer 10, the negative electrode of the MEMS pressure sensor 13 is connected with the fourth electrode 17 through the copper-clad layer 10, the third electrode 16 and the fourth electrode 17 are used for being connected with external driving current, so that the MEMS pressure sensor 13 works normally, an output signal channel of the MEMS pressure sensor 13 is connected with the first electrode 14 and the second electrode 15 through the copper-clad layer 10, the first electrode 14 and the second electrode 15 are used for being connected with an external control end, when the MEMS pressure sensor 13 detects pressure change, a signal is generated, the signal is converted into a digital signal, and the digital signal is output to an external control circuit through the output signal channel, so that the driving current is disconnected, and the function of a protection circuit is realized.
Further, the construction method of the free curved surface 8 of the reflecting mirror 7, as shown in fig. 6-10, comprises the following steps:
step 1, equally dividing a light source surface S (i.e. a rectangular light spot formed by the first laser chip 5 and the second laser chip 6 near the light outlet of each laser chip) and a target surface T (i.e. the fluorescent sheet 4) according to energy conservation, and determining coordinates of each point, wherein the coordinates of each point on the light source surface S are (x) si ，y sj ) The coordinates of each point on the target surface T are (x ti ，y tj )，i＝1,2,3……M，j＝1,2,3……N；
Step 2, according to the mapping relation between the light source surface S and the target surface T according to the principle of edge light, the incident light is IN i，j The emergent ray is OUT i，j ；
Step 3, constructing a free-form surface 8 by using the mapping and Snell's law;
step 4, determining initial parameters and modeling an initial structure of the free-form surface 8;
step 5, simulating the performance of the optical system by using a Monte Carlo ray tracing method, and determining a free-form surface 8 if the performance meets the requirements; if the step 1 is not satisfied, the step 1 is iterated through reverse feedback optimization.
Wherein, step 3 includes the following steps:
step 3.1, incident ray IN according to the vector form of Snell's law i，j When passing through the free-form surface 8, the points Pi, j (x i,j ,y i,j ,z i,j ) The normal vector of (2) is:
step 3.2, according to the differential geometry, the next ray IN i+1，j Will be in contact with the passing point P i，j Is intersected with point P i+1，j ，
Step 3.3, repeating the above process, determining the Z-axis coordinates of all points of the free-form surface 8 in the X-axis direction and the Y-axis direction according to the following formula, thereby constructing the free-form surface 8,
z-axis coordinates in X-axis direction:
z-axis coordinates in Y-axis direction:
in step 5, the reverse feedback optimization iteration includes the following steps:
step 5.1, performing ray tracing on the initial structure of the free-form surface 8 by using the divergent laser beam to obtain the irradiance value E of the grid (i, j) on the target surface T i,j (0) Average value of illuminance
Step 5.2, keeping the grid division of the target surface T unchanged, and continuously adjusting the grid area on the light source surface S according to feedback to enable the radiation illuminance value E of the grid (i, j) on the target surface T i,j (0) Adjust to eta i,j (0) Determined as follows:
in phi 0 Corresponding grid energy on the light source surface S; phi (phi) 1 Is the total energy of the light source surface S; m is the number of divided grids; η is the value of the feedback function,
specific:
performing ray tracing on the initial structure of the free-form surface 8 by adopting divergent laser beams to acquire the radiant illuminance value E of the grid (i, j) on the target surface T i,j (0) Average value of illuminanceAfter ray tracing, the irradiance value E of each grid on the target surface T i,j (0) Will deviate from the irradiance mean +.>The objective of the reverse feedback optimization iteration is to adjust the surface shape of the free-form surface 8 of the reflector 7 to ensure that the radiation illuminance value E of each grid on the target surface T i,j (0) Gradually approach the irradiance average +.>In the feedback process, the grid division on the target surface T is kept unchanged, and the area of each grid on the light source surface S is continuously adjusted according to feedback.
Order theAs a feedback function, the irradiance value of grid (i, j) on target surface T is E i,j (0) To approximate the illuminance average +.>It should be adjusted to eta i,j (0) The method comprises the steps of carrying out a first treatment on the surface of the To achieve this, the corresponding grid energy on the source surface S is changed to be η times the original energy, i.e
In phi 1 Is the total energy of the light source surface S; m is the number of divided grids.
Assume that the original grid areas of the light source surface S are delta S i,i (0) In order to change the grid energy, the area of each grid is correspondingly changed to eta delta S i,i (0). Thus, a new grid distribution on the light source surface S is obtained, and with this new grid distribution a new free-form surface 8 can be designed. And obtaining a final free-form surface 8 after multiple times of optimization so as to meet the requirement of the radiation illuminance uniformity of the target surface T.
FIG. 9 is a schematic view of a surface shape of a free-form surface; fig. 10 is a graph showing an illuminance distribution of a light beam on a free-form surface.
Finally, it should be noted that the above embodiments are merely representative examples of the present invention. Obviously, the invention is not limited to the above-described embodiments, but many variations are possible. Any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention should be considered to be within the scope of the present invention.
Claims (9)
1. The utility model provides a white light laser, includes copper-clad base plate (1), ceramic support (2) and opaque potsherd (3), its characterized in that, potsherd (2) set up in copper-clad base plate (1) upper end and enclose into and hold the chamber, potsherd (3) set up in the upper end of potsherd (2) and sealed hold the chamber, install fluorescence piece (4) on potsherd (3), hold intracavity and be equipped with first laser chip (5), second laser chip (6) and with reflector (7) of first laser chip (5) and second laser chip (6) adaptation, two rectangular light beams that first laser chip (5) and second laser chip (6) diverge and form are bound through reflector (7) freeform (8) plastic, form rectangular facula above freeform and cover fluorescence piece (4).
2. A white light laser as claimed in claim 1, characterized in that a heat conducting plate (9) is arranged in the accommodating cavity and is positioned at the upper end of the copper-clad substrate (1), and the first laser chip (5) and the second laser chip (6) are respectively arranged at two sides of the heat conducting plate (9).
3. A white light laser as claimed in claim 2, characterized in that the anodes of the first and second laser chips (5, 6) are welded to the copper-clad layer (10) of the copper-clad substrate (1), and the cathodes of the first and second laser chips (5, 6) are welded to the copper-clad layer (10) of the copper-clad substrate (1) by means of bonding wires (11).
4. A white light laser as claimed in claim 1, characterized in that the upper end of the ceramic support (2) is provided with a reinforcing heat conducting fin (12), and the ceramic plate (3) is located at the upper end of the reinforcing heat conducting fin (12).
5. A white light laser according to claim 1, characterized in that the accommodating cavity is provided with a MEMS pressure sensor (13) for detecting the air tightness of the accommodating cavity, the anode and the cathode of the MEMS pressure sensor (13) are welded to the copper-clad layer (10) of the copper-clad substrate (1) respectively, and the output signal channel of the MEMS pressure sensor (13) is connected to the copper-clad layer (10) of the copper-clad substrate (1).
6. The white light laser according to claim 5, characterized in that the copper-clad substrate (1) is provided with a first electrode (14), a second electrode (15), a third electrode (16), a fourth electrode (17), a fifth electrode (18) and a sixth electrode (19) which are connected with the copper-clad layer (10), the anodes of the first laser chip (5) and the second laser chip (6) are connected with the fifth electrode (18) through the copper-clad layer (10), the cathodes of the first laser chip (5) and the second laser chip (6) are connected with the sixth electrode (19) through the copper-clad layer (10), the anodes of the MEMS pressure sensors (13) are connected with the third electrode (16) through the copper-clad layer (10), the cathodes of the MEMS pressure sensors (13) are connected with the fourth electrode (17) through the copper-clad layer (10), and the output signal channels of the MEMS pressure sensors (13) are connected with the first electrode (14) and the second electrode (15) through the copper-clad layer (10).
7. A white light laser as claimed in claim 1, characterized in that the method for constructing the free-form surface (8) of the mirror (7) comprises the following steps:
step 1, equally dividing a light source surface S and a target surface T according to energy conservation, and determining coordinates of each point, wherein the coordinates of each point on the light source surface S are (x) si ，y sj ) The coordinates of each point on the target surface T are (x ti ，y tj ）；
Step 2, according to the mapping relation between the light source surface S and the target surface T according to the principle of edge light, the incident light is IN i，j The emergent ray is OUT i，j ；
Step 3, constructing a free-form surface (8) by using mapping and Snell's law;
step 4, determining initial parameters and modeling an initial structure of the free-form surface (8);
step 5, simulating the performance of the optical system by using a Monte Carlo ray tracing method, and determining a free-form surface (8) if the performance meets the requirements; if the step 1 is not satisfied, the step 1 is iterated through reverse feedback optimization.
8. A white light laser as claimed in claim 7, wherein step 3 comprises the steps of:
step 3.1, incident ray IN according to the vector form of Snell's law i，j Point P when passing through the free-form surface (8) i，j The normal vector of (2) is:
；
step 3.2, according to the differential geometry, the next ray IN i+1，j Will be in contact with the passing point P i，j Is intersected with point P i+1，j ，
；
Step 3.3, repeating the above process continuously, determining Z-axis coordinates of all points of the free curved surface (8) in the X-axis direction and the Y-axis direction according to the following formula, thereby constructing the free curved surface (8),
z-axis coordinates in X-axis direction:；
z-axis coordinates in Y-axis direction:。
9. a white light laser as claimed in claim 7 wherein in step 5, the reverse feedback optimization iteration comprises the steps of:
step 5.1, adopting divergent laser beams to trace the light of the initial structure of the free curved surface (8) to obtain the radiation illuminance value of the grid (i, j) on the target surface TMean value of irradiance->；
Step 5.2, keeping the grid division of the target surface T unchanged, and continuously adjusting the grid area on the light source surface S according to feedback to enable the radiation illuminance value of the grid (i, j) on the target surface TAdjust to->Determined as follows:
；
in the method, in the process of the invention,corresponding grid energy on the light source surface S; />Is the total energy of the light source surface S; />Dividing the grid number into grid numbers; />As a feedback function +.>。
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| CN202410075707.2A CN117856044A (en) | 2024-01-18 | 2024-01-18 | White light laser |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222047A (en) * | 2014-06-13 | 2016-01-06 | 中强光电股份有限公司 | Lighting device |
| CN105372818A (en) * | 2015-12-02 | 2016-03-02 | 江南大学 | Beam shaping method of divergence laser beam |
| CN108489687A (en) * | 2018-04-04 | 2018-09-04 | 常州蓝森环保设备有限公司 | A kind of air-tightness detection device |
| CN109976080A (en) * | 2019-04-29 | 2019-07-05 | 杭州有人光电技术有限公司 | A kind of high-brightness projection lighting system using laser induced fluorescence |
| CN113419340A (en) * | 2021-05-31 | 2021-09-21 | 南京信息工程大学 | Free-form surface construction method for laser beam shaping |
| US20220149586A1 (en) * | 2017-09-30 | 2022-05-12 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Laser device and light guide member used with the same |
-
2024
- 2024-01-18 CN CN202410075707.2A patent/CN117856044A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105222047A (en) * | 2014-06-13 | 2016-01-06 | 中强光电股份有限公司 | Lighting device |
| CN105372818A (en) * | 2015-12-02 | 2016-03-02 | 江南大学 | Beam shaping method of divergence laser beam |
| US20220149586A1 (en) * | 2017-09-30 | 2022-05-12 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Laser device and light guide member used with the same |
| CN108489687A (en) * | 2018-04-04 | 2018-09-04 | 常州蓝森环保设备有限公司 | A kind of air-tightness detection device |
| CN109976080A (en) * | 2019-04-29 | 2019-07-05 | 杭州有人光电技术有限公司 | A kind of high-brightness projection lighting system using laser induced fluorescence |
| CN113419340A (en) * | 2021-05-31 | 2021-09-21 | 南京信息工程大学 | Free-form surface construction method for laser beam shaping |
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