CN117855368A - Wiring substrate, light-emitting panel, backlight module and display device - Google Patents
Wiring substrate, light-emitting panel, backlight module and display device Download PDFInfo
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- CN117855368A CN117855368A CN202211209699.3A CN202211209699A CN117855368A CN 117855368 A CN117855368 A CN 117855368A CN 202211209699 A CN202211209699 A CN 202211209699A CN 117855368 A CN117855368 A CN 117855368A
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- 229910004205 SiNX Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
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Abstract
The invention relates to the technical field of display equipment, and discloses a wiring substrate, a light-emitting panel, a backlight module and a display device, wherein the wiring substrate comprises a substrate; the metal wiring layer is positioned on one side of the substrate and comprises a plurality of metal wirings; the insulating layer is positioned on one side of the metal wiring layer far away from the substrate and is provided with a through hole; the through hole is used for exposing a partial area of the metal wire so as to define a bonding pad, and the insulating layer comprises at least two layers of sub-insulating layers which are arranged in a laminated mode, wherein refractive indexes of the adjacent two layers of sub-insulating layers are different. The wiring substrate can avoid the difference of brightness gains of the luminous panels and improve the product yield.
Description
Technical Field
The present invention relates to the technical field of display devices, and in particular, to a wiring substrate, a light-emitting panel, a backlight module, and a display device.
Background
At present, mini LEDs (sub-millimeter light emitting diode chips) and Micro LEDs (Micro light emitting diode chips) have excellent performances of lower power consumption, faster reaction, longer service life, better color saturation contrast and the like. With technological breakthroughs, mini LEDs and Micro LEDs will become the next generation display technology following LCDs, OLEDs.
In a Mini LED light-emitting panel, a reflective structure layer is usually formed on a wiring substrate, and the reflective structure layer is usually white oil. Because the wiring substrate needs to bind the electronic element, the reflective structure layer needs to be provided with a hollowed-out structure corresponding to the area binding the electronic element, and the hollowed-out structure is usually manufactured through a process of screen printing white oil.
Disclosure of Invention
The invention provides a wiring substrate, a light-emitting panel, a backlight module and a display device.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a wiring substrate, comprising:
a substrate;
the metal wiring layer is positioned on one side of the substrate and comprises a plurality of metal wirings;
the insulating layer is positioned at one side of the metal wiring layer far away from the substrate and is provided with a through hole; the through holes are used for exposing partial areas of the metal wires to define bonding pads, the insulating layers comprise at least two layers of sub-insulating layers which are arranged in a stacked mode, and refractive indexes of two adjacent layers of sub-insulating layers are different.
Optionally, in the insulating layer, along a direction that the substrate points to the insulating layer, a refractive index of a sub-insulating layer located in an odd layer is larger than a refractive index of a sub-insulating layer located in an even layer.
Optionally, the number of layers of the sub-insulating layers in the insulating layer is an odd number.
Optionally, in the insulating layer, along a direction that the substrate points to the insulating layer, a refractive index of a sub-insulating layer located in an odd layer is 1.8 to 2, and a refractive index of a sub-insulating layer located in an even layer is 1.4 to 1.5.
Optionally, in the insulating layer, along the direction that the substrate points to the insulating layer, the materials of the sub-insulating layers in the odd layers are the same, and the materials of the sub-insulating layers in the even layers are the same.
Optionally, the wiring substrate includes a pad group including at least two of the pads, each of the pads in the pad group being for coupling with the same electronic component.
Optionally, a reflective structure layer is also included; the reflecting structure layer is located on one side, far away from the substrate, of the insulating layer, the reflecting structure layer comprises a hollowed-out structure, and at least two adjacent orthographic projections of the through holes on the substrate are surrounded by orthographic projection outlines of the hollowed-out structure on the substrate.
Optionally, the material of the reflective structure layer is white ink.
Optionally, the device further comprises a reflection functional pattern, wherein the orthographic projection of the reflection functional pattern on the substrate is positioned in the orthographic projection of the hollowed-out structure on the substrate.
Optionally, the reflective functional pattern is located on the metal routing layer.
Optionally, at least two adjacent pads form a pad group, and the reflective functional pattern is disposed around the pad group.
Optionally, the reflective functional pattern is not connected to the metal trace.
The embodiment of the invention also provides a light-emitting panel, which comprises any wiring substrate provided in the technical scheme, and further comprises an electronic element positioned at one side of the insulating layer away from the substrate, wherein the electronic element is correspondingly coupled with the bonding pad, and the orthographic projection of the electronic element on the substrate is positioned in the orthographic projection of the hollowed-out structure on the substrate.
Optionally, the electronic element comprises a light emitting element.
Optionally, the orthographic projection of the reflective functional pattern on the substrate in the metal wiring layer is located between the orthographic projection of the hollowed-out structure on the substrate on the reflective structure layer and the orthographic projection of the electronic element on the substrate.
The embodiment of the invention also provides a backlight module, which comprises any one of the light-emitting panels provided in the technical scheme.
The embodiment of the invention also provides a display device which comprises the backlight module provided in the technical scheme.
The embodiment of the invention provides a wiring substrate, a light-emitting panel, a backlight module and a display device, wherein the wiring substrate comprises a substrate, a metal wiring layer positioned on one side of the substrate and an insulating layer positioned on one side of the metal wiring layer far away from the substrate, the metal wiring layer comprises a plurality of metal wirings, the insulating layer is provided with through holes, partial areas for exposing the metal wirings are used for limiting bonding pads, the insulating layer comprises at least two layers of sub-insulating layers which are arranged in a laminated way, the refractive indexes of the adjacent two layers of sub-insulating layers are different, the total reflection of light rays emitted by a light-emitting element can be realized through a laminated structure formed by a plurality of layers of sub-insulating layers with different refractive indexes in the insulating layer, the brightness gain of the light-emitting panel is improved, the size of the through holes on the insulating layer is smaller, the through holes can be directly covered by the electronic element after the electronic element is bound, the difference of the brightness gain of the light-emitting panel can be avoided, and the product yield is improved.
Drawings
Fig. 1 is a schematic structural diagram of a light-emitting panel in the related art;
fig. 2 is a schematic structural diagram of a wiring substrate according to an embodiment of the present invention;
fig. 3 is a schematic plan view of a metal wiring layer according to an embodiment of the present invention;
fig. 4 is a schematic plan view of a pad group according to an embodiment of the present invention;
fig. 5 is a schematic structural view of another wiring substrate according to an embodiment of the present invention;
FIG. 6 is a schematic plan view of another metal wiring layer according to an embodiment of the present invention;
fig. 7 is a schematic plan view of a pad group according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a light-emitting panel according to an embodiment of the present invention;
fig. 9 is a schematic plan view of a light-emitting panel according to an embodiment of the invention.
Icon:
1-a substrate; 2-metal wiring; 21-bonding pads; 3-an insulating layer; 301-through holes; a-a sub-insulating layer; 31-a first sub-insulating layer; 32-a second sub-insulating layer; 33-a third sub-insulating layer; 4-a buffer layer; a 5-reflective structural layer; 51-a hollow structure; 6-an electronic component; 61-a driving element; 62-a light emitting element; 71-a first set of pads; 72-a second set of pads; 8-reflective functional pattern.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the related art, the Mini LED light emitting panel may include a wiring substrate and an electronic component bound on the wiring substrate, and as shown in fig. 1, the wiring substrate may specifically include a substrate 01, a plurality of metal wires 02 located on the substrate, an insulating layer 03 located on a side of the plurality of metal wires away from the substrate, a reflective structure layer 04 located on a side of the insulating layer away from the substrate, and an electronic component 05 located on a side of the insulating layer away from the substrate. The insulating layer 03 has a through hole 031, the through hole 031 is used to expose a partial area of the metal wire to define a pad, and is used to couple with the electronic component 05 correspondingly, and one electronic component 05 couples with at least two pads correspondingly; the reflective structure layer 04 is used for improving brightness, the reflective structure layer 04 is provided with a hollow structure 041, one hollow structure 041 corresponds to a binding area of an electronic element 05, the reflective structure layer 04 is usually made of a screen printing white oil process, but the inventor of the application finds that the precision of the hollow structure made of the screen printing white oil process is lower, and in order to conveniently bind the electronic element, the size of the hollow structure is usually larger than that of the electronic element, so that the reflective structure layer is not covered between the edge of the hollow structure on the wiring substrate and the binding area of the electronic element, and further, the brightness gain of the light-emitting panel is different due to insufficient precision of the white oil hollow structure, and the product yield is affected. In order to avoid the reflective structure layer from affecting the binding of the electronic element, the size of the opening of the hollowed-out structure 041 is required to be larger than the size of the binding area of the electronic element, and the deviation of the capacity value of the typical screen printing white oil process compared with the photoetching process (more than 0.3 mm) is required, so that the distance between the edge of the hollowed-out structure and the binding area of the electronic element is usually at least larger than 0.3mm when the reflective structure layer is manufactured. That is, there is no reflective structure layer covering between the edge of the hollowed-out structure and the binding area of the electronic element.
However, through experimental researches of the inventor of the application, the influence of the opening sizes of different hollow structures on the reflecting structure layer on the brightness gain of the light-emitting panel is large, and the brightness gain of the light-emitting panel is different due to insufficient precision of the hollow structures, so that the product yield is influenced. For example, when the distance between the edge of the hollowed-out structure and the binding area of the electronic element is 0.2mm, the brightness gain of the light-emitting panel is 0.896, and when the distance between the edge of the hollowed-out structure and the binding area of the electronic element is 0.3mm, the brightness gain of the light-emitting panel is 0.828.
In order to overcome the above-described drawbacks, an embodiment of the present invention provides a wiring substrate, as shown in fig. 2, including:
a substrate 1;
the metal wiring layer is positioned on one side of the substrate 1 and comprises a plurality of metal wirings 2;
the insulating layer is positioned on one side of the metal wiring layer far away from the substrate 1, and the insulating layer 3 is provided with a through hole 301; the through hole 301 is used for exposing a partial area of the metal wire 2 to define the pad 21, and the insulating layer 301 includes at least two sub-insulating layers a stacked together, wherein refractive indexes of two adjacent sub-insulating layers a are different.
The wiring substrate provided by the embodiment of the invention comprises a substrate 1, a metal wiring layer positioned on one side of the substrate 1 and an insulating layer 3 positioned on one side of the metal wiring layer far away from the substrate 1, wherein the metal wiring layer comprises a plurality of metal wirings 2, the insulating layer 3 is provided with through holes 301, the through holes 301 are used for exposing partial areas of the metal wirings 2 to define bonding pads 21, and the insulating layer 3 comprises at least two layers of sub-insulating layers a which are arranged in a laminated manner, wherein the refractive indexes of the adjacent two layers of sub-insulating layers are different, the total reflection of light rays emitted by a light emitting element can be realized through a laminated structure consisting of a plurality of sub-insulating layers with different refractive indexes in the insulating layer 3, the brightness gain of the light emitting panel is improved, the size of the through holes 301 on the insulating layer 3 is smaller, and the through holes 301 can be directly covered by the electronic element for a large part after the electronic element is bound, so that the difference of the brightness gain of the light emitting panel can be avoided, and the product yield is improved.
The substrate 1 may be an FR4 type Printed Circuit Board (PCB), or any one of a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, and the like. Copper-clad technology is generally used to manufacture a metal wiring layer on a substrate, and the minimum thickness of the metal wiring layer can be about 36 μm.
In addition, after the metal wire 2 is formed on the wiring substrate, an electroless nickel plating process is required to be performed on the area where the bonding pad on the metal wire 2 is located, which is beneficial to binding the electronic element.
In the embodiment of the invention, the insulating layer is arranged in a plurality of layers, the light rays can be refracted for a plurality of times, and the total reflection of the light rays which are partially injected into the insulating layer can be realized by adjusting the layer number of the sub-insulating layers in the insulating layer and the refractive index of the sub-insulating layers, so that the brightness gain of the luminous panel can be improved.
Moreover, after the electroless nickel plating process is performed on the area where the bonding pad 21 is located on the metal trace 2, the phenomenon that the edge (the area where the non-bonding pad is located) of the metal trace 2 climbs to a long gold may occur, if the insulating layer is set to be one layer, the problem that the insulating layer forms a climbing fracture at the edge of the metal trace 2 is easily caused, but in the embodiment, the insulating layer 3 is set to be multiple layers, the metal trace 2 can be covered for multiple times through the laminated design, and the problem that the insulating layer 3 climbs to a fracture at the edge of the metal trace 2 can be improved.
In the above-mentioned wiring substrate, the buffer layer 4 and other wiring layers may be further provided between the substrate 1 and the metal wiring layer, and the present invention is not limited thereto, and the present invention is applicable to practical situations.
In the embodiment of the invention, in the insulating layer, along the direction that the substrate 1 points to the insulating layer 3, the refractive index of the sub-insulating layer a positioned in the odd-numbered layers can be larger than that of the sub-insulating layer a positioned in the even-numbered layers, and the refractive index of light rays injected into the insulating layer can be adjusted by alternately arranging the sub-insulating layers with large refractive indexes and the sub-insulating layers with small refractive indexes in the insulating layers, and the total reflection of the light rays can be realized by adjusting the refractive indexes of the multi-layer sub-insulating layers.
Specifically, the number of layers of the insulating layer a in the insulating layer 3 may be an odd number, and for example, the number of layers of the insulating layer a may be 3, 5, 7, or the like. As shown in fig. 2, the insulating layer 3 may include three sub-insulating layers a, specifically including a first sub-insulating layer 31, a second sub-insulating layer 32, and a third sub-insulating layer 33 that are sequentially stacked, where the sub-refractive index of the first sub-insulating layer 31 and the third sub-insulating layer 33 is greater than the sub-refractive index of the second sub-insulating layer 32; or, the insulating layer comprises five layers of sub-insulating layers, and specifically comprises a first sub-insulating layer, a second sub-insulating layer, a third sub-insulating layer, a fourth sub-insulating layer and a fifth sub-insulating layer which are sequentially stacked, wherein the refractive indexes of the first sub-insulating layer, the third sub-insulating layer and the fifth sub-insulating layer are larger than those of the second sub-insulating layer and the fourth sub-insulating layer. The number of layers of the sub-insulating layers in the insulating layer is not limited and depends on practical situations.
In the embodiment of the present invention, in the above-mentioned insulating layer, along the direction of the substrate 1 pointing to the insulating layer 3, the refractive index of the sub-insulating layer a located in the odd-numbered layers may be 1.8 to 2, and the refractive index of the sub-insulating layer a located in the even-numbered layers may be 1.4 to 1.5. Specifically, specific values of refractive indexes of the respective sub-insulating layers may not be limited herein, depending on practical situations.
In the embodiment of the present invention, in the above-mentioned insulating layers, along the direction of the substrate 1 pointing to the insulating layer 3, the materials of the sub-insulating layers located in the odd-numbered layers may be the same, and the materials of the sub-insulating layers located in the even-numbered layers may be the same, so that the manufacturing is convenient.
Specifically, the material of the insulating layer 3 above the metal wiring layer may be an inorganic material, and typically the material of the insulating layer may be silicon nitride (SiNx), in order to realize the stacked structure of the insulating layers, in the embodiment of the present invention, the material of the sub-insulating layers located in the odd-numbered layers may be silicon nitride (SiN x ) The material of the sub-insulating layer located at the even layer is silicon oxide (SiO 2 ). Among the insulating layers, the thickness of each sub-insulating layer may be determined according to practical situations, and is not limited herein.
For example, according to optical simulation, in order to achieve maximum reflectivity of the insulating layer, as shown in fig. 2, when the insulating layer includes three sub-insulating layers a, materials of the first, second and third sub-insulating layers 31, 32 and 33 may be SiNx, siO2 and SiNx, respectively, and thicknesses of the first, second and third sub-insulating layers 31, 32 and 33 may be 940A, 800A and 560A, respectively. When the insulating layer includes five sub-insulating layers, the materials of the first sub-insulating layer, the second sub-insulating layer, the third sub-insulating layer, the fourth sub-insulating layer and the fifth sub-insulating layer may be SiNx, siO2, siNx, siO2 and SiNx, respectively, and the thicknesses of the first sub-insulating layer, the second sub-insulating layer, the third sub-insulating layer, the fourth sub-insulating layer and the fifth sub-insulating layer may be 950A, 820A, 580A, 800A and 510A, respectively.
In an embodiment of the present invention, the wiring substrate may include a pad group including at least two pads, each pad in the pad group being used for coupling with the same electronic component.
Specifically, in the Mini LED backlight module, the wiring substrate may be divided into a plurality of functional areas distributed in an array, and a schematic plan view of the metal traces 2 and the pad groups corresponding to the functional areas on the wiring substrate may be shown in fig. 3. The metal wiring 2 may include a first voltage line 201, a second voltage line 202, a power signal line 203, an address signal line 204, a cascade line 205, a feedback signal line 206, and a connection line 207. By defining the through holes on the insulating layer, as shown in fig. 3, each functional area may have one first bonding pad group 71 and at least two second bonding pad groups 72, and in fig. 3, one functional area is shown to have four second bonding pad groups 72, and the second bonding pad groups 72 may be other numbers, which may not be limited, and are according to practical situations. The first pad group 71 may include at least 4 pads 21 therein for corresponding coupling with pins on the micro driving chip, and 4 pads may be provided in the second pad group 72 as shown in fig. 4; two pads 21 may be included in the second pad set 72 for corresponding coupling with two pins on the light emitting diode chip. The backlight module drives the light emitting diode chips to emit light through the micro driving chip.
The light emitting diode chip may be a sub-millimeter light emitting diode (Mini Light Emitting Diode, abbreviated as Mini LED) chip, or may be a Micro light emitting diode (Micro Light Emitting Diode, abbreviated as Micro LED) chip.
In an embodiment of the present invention, as shown in fig. 5, the wiring substrate further includes a reflective structure layer 5; the reflecting structure layer 5 is located one side of insulating layer far away from the substrate 1, and the reflecting structure layer 5 includes hollow out construction 51, and the outline of the orthographic projection of hollow out construction 51 on the substrate 1 encloses at least the orthographic projection of two adjacent through holes 301 on the substrate 1, through setting up reflecting structure layer 5, can improve the luminance of luminous panel. Specifically, the material of the reflective structure layer 5 may be white ink.
The reflective structure layer 5 may be formed by a screen printing ink process, and because the manufacturing precision of the screen printing ink process is poor, in order to avoid interfering with the binding of the electronic component, the outline of the hollow structure 51 in the reflective structure layer 5 may be set around the bonding pad group, where the bonding pad group may be the first bonding pad group 71 and the second bonding pad group 72, as shown in fig. 4, the outline (the dotted line in fig. 4) of the hollow structure 51 may be set around the second bonding pad group 72, so that the interference of the reflective structure layer 5 on the binding of the electronic component may be avoided, where the electronic component may be a micro driving chip and a light emitting diode chip, and an assembly gap may be formed between the edge of the hollow structure 51 and the binding area of the electronic component, so as to avoid affecting the binding of the electronic component. In the above wiring substrate, although there is a problem that the manufacturing accuracy of the reflection mechanism layer is poor, due to the arrangement of the sub-insulation layer laminated structure in the insulation layer, the light rays within the range of the hollow structure 51 of the reflection structure layer 5 can be totally reflected, the problem that the brightness gain of the light-emitting panel is different can be avoided, and the product yield can be improved.
In the embodiment of the present invention, as shown in fig. 6 and 7, the wiring substrate further includes a reflective functional pattern 8, where the front projection of the reflective functional pattern 8 on the substrate 1 is located in the front projection of the hollow structure 51 on the substrate 1 (the dotted line in fig. 6 corresponds to the outline of the hollow structure 51). The reflection functional pattern 8 may be a metal pattern, which has a reflection effect on light, and the reflection effect of the wiring board on light can be increased by providing the reflection functional pattern 8 in the area surrounded by the hollow structure 51, thereby further improving the brightness gain of the light emitting panel.
In particular, the reflective functional pattern 8 may be located at the metal routing layer. The reflection functional patterns 8 and the metal wires 2 in the metal wire layer are prepared by the same material and the same layer, so that the manufacturing process can be simplified, and the manufacturing cost can be saved. Alternatively, the reflective functional pattern 8 may be provided in another film layer of the wiring substrate, and is not limited thereto, depending on the actual situation.
In the embodiment of the present invention, at least two adjacent pads 21 constitute a pad group, and the reflection function pattern 8 is disposed around the pad group. For example, as shown in fig. 6 and 7, the reflective functional patterns 8 may be disposed around the first pad group 71 and the second pad group 72, and may reflect light incident through the hollow structure 51 of the reflective structure layer 5, thereby improving brightness of the display panel and avoiding a difference in brightness gain of the display panel.
Specifically, as shown in fig. 6 and 7, the reflective functional pattern 8 may not be connected to the metal trace 2, so that the reflective functional layer can be prevented from affecting the metal trace 2 and the pad 21. Alternatively, the reflective functional patterns 8 may be formed integrally with the metal traces 2, which can simplify the manufacturing process, but is not limited thereto, and it should be understood that the reflective functional patterns 8 are not simultaneously connected to more than one number of metal traces 2 according to practical situations.
The embodiment of the invention also provides a light-emitting panel, as shown in fig. 8, which comprises any one of the wiring substrates provided in the above technical scheme, and further comprises an electronic element 6 located at one side of the insulating layer far away from the substrate 1, wherein the electronic element 6 is correspondingly coupled with the bonding pad, and the orthographic projection of the electronic element on the substrate 1 is located in the orthographic projection of the hollowed-out structure 51 on the substrate 1.
In the light-emitting panel provided by the embodiment of the invention, since the insulating layer 3 comprises at least two layers of sub-insulating layers a which are stacked, the refractive indexes of the adjacent two layers of sub-insulating layers are different, the total reflection of light emitted by the light-emitting element can be realized through the stacked structure consisting of a plurality of layers of sub-insulating layers with different refractive indexes in the insulating layer 3, the brightness gain of the light-emitting panel is improved, the size of the through hole 301 on the insulating layer 3 is smaller, and the through hole 301 can be directly covered by the electronic element after the electronic element is bound, so that the difference of the brightness gain of the light-emitting panel can be avoided, and the product yield is improved.
Specifically, as shown in fig. 9, the electronic component may include a light emitting element 62 and a driving element 61, the light emitting element 62 may be a light emitting diode chip, and the driving element 61 may be a micro driving chip.
Specifically, as shown in fig. 9, the orthographic projection of the reflective functional pattern 8 on the substrate 1 in the metal wiring layer is located between the orthographic projection of the hollowed-out structure 51 on the reflective structure layer 5 on the substrate 1 and the orthographic projection of the electronic component on the substrate 1.
The embodiment of the invention also provides a backlight module, which comprises any one of the light-emitting panels provided in the technical scheme.
The embodiment of the invention also provides a display device which comprises the backlight module provided in the technical scheme.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (17)
1. A wiring substrate, comprising:
a substrate;
the metal wiring layer is positioned on one side of the substrate and comprises a plurality of metal wirings;
the insulating layer is positioned at one side of the metal wiring layer far away from the substrate and is provided with a through hole; the through holes are used for exposing partial areas of the metal wires to define bonding pads, the insulating layers comprise at least two layers of sub-insulating layers which are arranged in a stacked mode, and refractive indexes of two adjacent layers of sub-insulating layers are different.
2. The wiring substrate according to claim 1, wherein in the insulating layer, a refractive index of a sub-insulating layer located in an odd layer is larger than a refractive index of a sub-insulating layer located in an even layer in a direction in which the substrate is directed toward the insulating layer.
3. The wiring substrate according to claim 2, wherein the number of layers of the sub-insulating layers in the insulating layer is an odd number.
4. The wiring substrate according to claim 2, wherein in the insulating layer, a refractive index of a sub-insulating layer located at an odd layer is 1.8 to 2 and a refractive index of a sub-insulating layer located at an even layer is 1.4 to 1.5 in a direction in which the substrate is directed toward the insulating layer.
5. The wiring substrate according to claim 2, wherein in the insulating layer, a material of the sub-insulating layers located in an odd-numbered layer is the same and a material of the sub-insulating layers located in an even-numbered layer is the same in a direction in which the substrate is directed to the insulating layer.
6. The wiring substrate according to claim 1, wherein the wiring substrate comprises a pad group including at least two of the pads, each of the pads in the pad group being for coupling with the same electronic component.
7. The wiring substrate according to claim 1, further comprising a reflective structure layer; the reflecting structure layer is located on one side, far away from the substrate, of the insulating layer, the reflecting structure layer comprises a hollowed-out structure, and at least two adjacent orthographic projections of the through holes on the substrate are surrounded by orthographic projection outlines of the hollowed-out structure on the substrate.
8. The wiring board according to claim 7, wherein the reflective structure layer is made of white ink.
9. The wiring substrate according to any one of claims 1 to 8, further comprising a reflection function pattern, wherein an orthographic projection of the reflection function pattern on the substrate is located within an orthographic projection of the hollowed-out structure on the substrate.
10. The wiring substrate according to claim 9, wherein the reflection functional pattern is located in the metal wiring layer.
11. The wiring substrate according to claim 10, wherein at least two adjacent pads constitute a pad group, and the reflection function pattern is disposed around the pad group.
12. The wiring substrate according to claim 9, wherein the reflection functional pattern is not connected to the metal wiring.
13. A light-emitting panel, comprising the wiring substrate according to any one of claims 1 to 12, and further comprising an electronic component located on a side of the insulating layer away from the substrate, the electronic component being correspondingly coupled to the bonding pad, and an orthographic projection of the electronic component on the substrate being located in an orthographic projection of the hollowed-out structure on the substrate.
14. The light-emitting panel according to claim 13, wherein the electronic component comprises a light-emitting element.
15. The light-emitting panel of claim 13, wherein the orthographic projection of the reflective functional pattern on the substrate in the metal trace layer is located between the orthographic projection of the hollowed-out structure on the reflective structure layer on the substrate and the orthographic projection of the electronic component on the substrate.
16. A backlight module comprising a light emitting panel according to any one of claims 13-15.
17. A display device comprising the backlight module of claim 16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211209699.3A CN117855368A (en) | 2022-09-30 | 2022-09-30 | Wiring substrate, light-emitting panel, backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211209699.3A CN117855368A (en) | 2022-09-30 | 2022-09-30 | Wiring substrate, light-emitting panel, backlight module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117855368A true CN117855368A (en) | 2024-04-09 |
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| CN202211209699.3A Pending CN117855368A (en) | 2022-09-30 | 2022-09-30 | Wiring substrate, light-emitting panel, backlight module and display device |
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| Country | Link |
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| CN (1) | CN117855368A (en) |
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