CN117855108A - Wafer self-cleaning device - Google Patents
Wafer self-cleaning device Download PDFInfo
- Publication number
- CN117855108A CN117855108A CN202410257043.1A CN202410257043A CN117855108A CN 117855108 A CN117855108 A CN 117855108A CN 202410257043 A CN202410257043 A CN 202410257043A CN 117855108 A CN117855108 A CN 117855108A
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- Prior art keywords
- supporting
- wafer
- plate
- limiting
- cleaning
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 67
- 230000007246 mechanism Effects 0.000 claims abstract description 60
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000003860 storage Methods 0.000 claims abstract description 24
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 claims abstract description 9
- 238000001802 infusion Methods 0.000 claims description 41
- 238000009423 ventilation Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 48
- 239000007921 spray Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910001172 neodymium magnet Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses an automatic wafer cleaning device, which belongs to the technical field of wafer cleaning and comprises a protective shell, wherein a supporting mechanism for supporting a wafer, a feeding mechanism for supporting the supporting mechanism and a cleaning mechanism for cleaning and drying the wafer are arranged in the protective shell, the cleaning mechanism is arranged at the top of the feeding mechanism, the supporting mechanism is arranged in the cleaning mechanism, the feeding mechanism comprises a water storage tank, a water pump is arranged at one end of the water storage tank, a collecting box is arranged on the lower surface of the water storage tank, and a plurality of drain pipes are arranged at the bottom of the collecting box; through the mutually supporting of many structures, make clean shower nozzle rotate to at the rotatory in-process of clean shower nozzle, drive wafer floats the slope, thereby carries out all-round, the quick, the abundant cleanness at no dead angle to the wafer, makes belt cleaning device better to the cleaning effect of wafer.
Description
Technical Field
The invention belongs to the technical field of wafer cleaning, and particularly relates to an automatic wafer cleaning device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, and a corresponding cleaning device is used when the wafer is cleaned;
the traditional cleaning device comprises a base, a box body, a cleaning plate, a servo motor, a screw rod, a cleaning head, a water pipe, a water pump, a water inlet, a water outlet, a first water tank, a heating plate, a second water tank and other structures, and has the advantages that a plurality of wafers can be cleaned;
however, when the conventional cleaning device is used, the wafer is simply cleaned only through the transverse movement of the cleaning head, and a cleaning dead angle exists, so that the cleaning effect of the cleaning device on the wafer is not ideal, and improvement is urgently needed.
Disclosure of Invention
The present invention is directed to an automatic wafer cleaning device, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a wafer self-cleaning device, includes the protective housing, the inside of protective housing is provided with the supporting mechanism that is used for playing the supporting role to the wafer, be used for playing the feeding mechanism of supporting role to the supporting mechanism, be used for cooperating supporting mechanism and feeding mechanism to play clean and dry effect's wiper mechanism to the wafer, wiper mechanism sets up the top at feeding mechanism, supporting mechanism sets up the inside at wiper mechanism, feeding mechanism includes the water storage tank, and the one end of water storage tank is provided with the water pump, and the lower surface of water storage tank is provided with the collecting box, and the bottom of collecting box is provided with a plurality of drain pipe, and the one end that the drain pipe is close to the collecting box is provided with the solenoid valve, and the top of collecting box is provided with a plurality of hot air-blower, wiper mechanism includes the cavity infusion cover that rotates with the collecting box sealing connection, is provided with a plurality of clean shower nozzle on the inner wall at cavity infusion cover top, one side of cavity infusion cover is provided with the driver, and the top of driver is provided with the driving gear, and the bottom fixedly connected with and the driven gear that is connected with the driving gear meshing of cavity infusion cover.
As a further scheme of the invention: the bottom cover of cavity infusion cover is equipped with the spacing support piece with water storage tank fixed connection, and the bottom fixedly connected with of cavity infusion cover is used for cooperating spacing support piece to play the spacing disc of supporting role to the cavity infusion cover, spacing disc and spacing support piece sliding connection.
As still further aspects of the invention: the inner wall of the hollow infusion cover is also provided with a first limit supporting plate, and one end of the upper surface of the first limit supporting plate is provided with a first driving plate.
As still further aspects of the invention: the supporting mechanism comprises a third limiting supporting plate, the lower surface of the third limiting supporting plate is provided with a hollow supporting tube fixedly connected with the collecting box, the top of the hollow supporting tube is provided with a plurality of ventilation through holes, one end, close to the ventilation through holes, of the hollow supporting tube is provided with a plurality of plugging discs connected with the hollow infusion cover in a sealing and rotating mode, the upper side of the third limiting supporting plate is provided with a second limiting supporting plate, the upper surface of the third limiting supporting plate is provided with a plurality of elastic supporting pieces used for supporting the second limiting supporting plate, the lower surface of the second limiting supporting plate is provided with a plurality of second driving plates used for being matched with the first driving plates to play an angle adjusting role on the second limiting supporting plate, and the upper surface of the second limiting supporting plate is movably connected with a bearing plate used for playing a supporting role on a wafer.
As still further aspects of the invention: the lower surface of loading board is provided with first elasticity antiskid ribbed tile, and the upper surface of the spacing backup pad of second is provided with the second elasticity antiskid ribbed tile.
As still further aspects of the invention: the first limiting fixing plate is embedded in the first elastic antiskid plate, and the second limiting fixing plate which is used for being matched with the first limiting fixing plate to fix the first elastic antiskid plate is embedded in the second elastic antiskid plate.
As still further aspects of the invention: the side of protective housing is provided with a plurality of warning piece that is used for playing the warning effect.
As still further aspects of the invention: the warning piece is a handwriting fluorescent plate or an LED lamp panel.
Compared with the prior art, the invention has the beneficial effects that: the invention has simple structure, practicality and convenience, and can drive the wafer to float and incline in the rotating process of the cleaning spray head by the mutual matching of a plurality of structures, thereby carrying out the omnibearing and dead angle-free rapid and full cleaning on the wafer, leading the cleaning effect of the cleaning device on the wafer to be better, and being capable of carrying out the rapid and full drying on the cleaned wafer, thereby being worthy of popularization and use.
Drawings
FIG. 1 is a schematic view of a wafer automatic cleaning apparatus;
FIG. 2 is a schematic view of a cleaning mechanism in an automatic wafer cleaning apparatus;
FIG. 3 is a schematic view of a limiting support in an automatic wafer cleaning apparatus;
FIG. 4 is a schematic view of a supporting mechanism in an automatic wafer cleaning apparatus;
FIG. 5 is a schematic view of a second limiting support plate in an automatic wafer cleaning apparatus;
FIG. 6 is a schematic view of a feeding mechanism in an automatic wafer cleaning apparatus;
in the figure: 1-warning part, 2-cleaning mechanism, 3-supporting mechanism, 4-feeding mechanism, 5-protective housing, 20-spacing disc, 21-driven gear, 22-first spacing backup pad, 23-first drive plate, 24-cavity infusion cover, 25-cleaning nozzle, 26-driving gear, 27-driver, 28-spacing support, 30-shutoff disc, 31-elastic support, 32-second drive plate, 33-second spacing backup pad, 34-loading board, 35-first elastic antiskid plate, 36-first spacing fixed plate, 37-second spacing fixed plate, 38-second elastic antiskid plate, 391-third spacing backup pad, 392-ventilation through hole, 393-cavity stay tube, 40-drain pipe, 41-solenoid valve, 42-hot air blower, 43-water pump, 44-water storage tank, 45-collecting box.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed.
The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1, the embodiment provides an automatic wafer cleaning device, which comprises a protective housing 5, wherein a supporting mechanism 3 for supporting a wafer, a feeding mechanism 4 for supporting the supporting mechanism 3, and a cleaning mechanism 2 for cleaning and drying the wafer by matching the supporting mechanism 3 and the feeding mechanism 4 are arranged in the protective housing 5, the cleaning mechanism 2 is arranged at the top of the feeding mechanism 4, and the supporting mechanism 3 is arranged in the cleaning mechanism 2.
Referring to fig. 1 and 6, in one embodiment, in order to make the use of the feeding mechanism 4 more reliable, in this embodiment, preferably, the feeding mechanism 4 includes a water storage tank 44, the water storage tank 44 is fixedly connected with the protective housing 5, a water pump 43 is disposed at one end of the water storage tank 44, a collecting tank 45 is disposed on the lower surface of the water storage tank 44, a plurality of drain pipes 40 are disposed at the bottom of the collecting tank 45, an electromagnetic valve 41 is disposed at one end of the drain pipe 40 close to the collecting tank 45, a plurality of hot air blowers 42 are disposed at the top of the collecting tank 45, and hot air discharged by the hot air blowers 42 is collected by the collecting tank 45 during use, and the water delivery amount of the hollow supporting tube 393 is smaller than the water delivery amount of the plurality of drain pipes 40.
In another embodiment, the feeding mechanism 4 comprises a water storage tank 44, a water pump 43 is arranged at one end of the water storage tank 44, a collecting tank 45 is arranged on the lower surface of the water storage tank 44, a plurality of water draining pipes 40 are arranged at the bottom of the collecting tank 45, a valve is arranged at one end, far away from the collecting tank 45, of the water draining pipes 40, a plurality of hot air blowers 42 are arranged at the top of the collecting tank 45, and hot air exhausted by the hot air blowers 42 is collected through the collecting tank 45 in use.
Referring to fig. 1, 2 and 3, in one embodiment, in order to make the use of the cleaning mechanism 2 more reliable, preferably, in this embodiment, the cleaning mechanism 2 includes a hollow infusion cover 24 that is connected with a water storage tank 44 in a sealing and rotating manner, the hollow infusion cover 24 is connected with a protection housing 5 in a rotating manner through a bearing, a plurality of cleaning nozzles 25 are disposed on an inner wall of a top of the hollow infusion cover 24, a driver 27 is disposed on one side of the hollow infusion cover 24, the driver 27 is a motor, a driving gear 26 is disposed on a top of the driver 27, a driven gear 21 engaged with the driving gear 26 is fixedly connected to a bottom of the hollow infusion cover 24, a limit support 28 fixedly connected with the water storage tank 44 is sleeved on a bottom of the hollow infusion cover 24, a limit disk 20 for supporting the hollow infusion cover 24 is fixedly connected with the limit support 28 in a sliding manner, a first limit support plate 22 is disposed on an inner wall of the hollow infusion cover 24, a first limit support plate 22 is fixedly connected with the hollow infusion cover 24, a first drive plate 23 is disposed on an upper surface of the first limit support plate 22, and a first drive plate 23 is a neodymium magnetic plate.
In another embodiment, the cleaning mechanism 2 comprises a hollow infusion cover 24 which is connected with a water storage tank 44 in a sealing and rotating manner, a plurality of cleaning spray heads 25 are arranged on the inner wall of the top of the hollow infusion cover 24, a driver 27 is arranged on one side of the hollow infusion cover 24, the driver 27 is an air motor, a driving gear 26 is arranged on the top of the driver 27, a driven gear 21 which is meshed with the driving gear 26 is fixedly connected to the bottom of the hollow infusion cover 24, a limiting support piece 28 which is fixedly connected with the water storage tank 44 is sleeved on the bottom of the hollow infusion cover 24, a limiting disc 20 which is used for being matched with the limiting support piece 28 to play a supporting role on the hollow infusion cover 24 is fixedly connected to the bottom of the hollow infusion cover 24 in a sliding manner, a first limiting support plate 22 is further arranged on the inner wall of the hollow infusion cover 24, the first limiting support plate 22 is fixedly connected with the hollow infusion cover 24, and one end of the upper surface of the first limiting support plate 22 is provided with a first driving plate 23 which is an electromagnetic plate.
Referring to fig. 1, fig. 4 and fig. 5, in an embodiment, in order to make the use of the supporting mechanism 3 more reliable, preferably, in this embodiment, the supporting mechanism 3 includes a third limit supporting plate 391, a hollow supporting tube 393 fixedly connected with the collecting box 45 is provided on the lower surface of the third limit supporting plate 391, the hollow supporting tube 393 is fixedly connected with the third limit supporting plate 391, a plurality of ventilation through holes 392 are provided on the top of the hollow supporting tube 393, a plurality of plugging discs 30 in sealing rotation connection with the hollow transfusion cover 24 are provided on one end of the hollow supporting tube 393 close to the ventilation through holes 392, a second limit supporting plate 33 is provided above the third limit supporting plate 391, a plurality of elastic supporting members 31 for supporting the second limit supporting plate 33 are provided on the upper surface of the third limit supporting plate 391, the elastic supporting members 31 are springs, the swing of the elastic supporting members 31 provide structural support for the second limit supporting plate 33, a plurality of second driving plates 32 for matching the first driving plates 23 to play an angle adjusting role in the second limit supporting plates 33, a plurality of driving plates 32 are provided on the vertical supporting plates 34 for supporting the second limit supporting plates 34, and the first driving plates are used for supporting the vertical plates are placed on the vertical plates 34 for supporting the wafer 34 to be mutually placed on the first driving plates and the vertical plates for supporting the wafer 34;
referring to fig. 4, in an embodiment, in order to enrich the functions of the supporting mechanism 3, preferably, a first elastic anti-slip plate 35 is disposed on the lower surface of the carrier plate 34, a second elastic anti-slip plate 38 is disposed on the upper surface of the second limiting supporting plate 33, the first elastic anti-slip plate 35 and the second elastic anti-slip plate 38 are both rubber plates, a first limiting fixing plate 36 is inlaid in the first elastic anti-slip plate 35, a second limiting fixing plate 37 for fixing the first elastic anti-slip plate 35 in cooperation with the first limiting fixing plate 36 is inlaid in the second elastic anti-slip plate 38, the first limiting fixing plate 36 is an iron plate, and the second limiting fixing plate 37 is a neodymium-iron-boron magnetic plate.
In another embodiment, the supporting mechanism 3 includes a third spacing supporting plate 391, the lower surface of the third spacing supporting plate 391 is provided with a hollow supporting tube 393 fixedly connected with the collecting box 45, the hollow supporting tube 393 is fixedly connected with the third spacing supporting plate 391, a plurality of ventilation through holes 392 are formed at the top of the hollow supporting tube 393, one end of the hollow supporting tube 393 close to the ventilation through holes 392 is provided with a plurality of plugging disks 30 which are in sealed rotation connection with the hollow transfusion cover 24, a second spacing supporting plate 33 is arranged above the third spacing supporting plate 391, the upper surface of the third spacing supporting plate 391 is provided with a plurality of elastic supporting pieces 31 which are used for supporting the second spacing supporting plate 33, the elastic supporting pieces 31 are metal elastic sheets, the elastic supporting pieces 31 are arranged to provide structural support for swinging of the second spacing supporting plate 33, the lower surface of the second spacing supporting plate 33 is provided with a plurality of second driving plates 32 which are used for matching with the first driving plates 23 to play an angle adjusting role, the second driving plates 32 are neodymium-iron-boron magnetic plates, the second driving plates 32 are mutually adsorbed with the first driving plates 23, the upper surface of the second spacing supporting plates 33 are provided with a plurality of elastic supporting plates 34 which are used for bearing the wafer 34 to be placed on the carrier plates 34;
in another embodiment, a first elastic anti-slip plate 35 is disposed on the lower surface of the bearing plate 34, a second elastic anti-slip plate 38 is disposed on the upper surface of the second limiting support plate 33, the first elastic anti-slip plate 35 and the second elastic anti-slip plate 38 are both silica gel plates, a first limiting and fixing plate 36 is inlaid in the first elastic anti-slip plate 35, a second limiting and fixing plate 37 for fixing the first elastic anti-slip plate 35 in cooperation with the first limiting and fixing plate 36 is inlaid in the second elastic anti-slip plate 38, the first limiting and fixing plate 36 is a neodymium-iron-boron magnetic plate, and the second limiting and fixing plate 37 is an iron plate.
Referring to fig. 1, in an embodiment, in order to enrich the functions of the cleaning device, in this embodiment, preferably, a plurality of warning elements 1 for playing a warning role are disposed on a side surface of a protective housing 5, the warning elements 1 are handwriting fluorescent boards, and when in use, warning marks are written on the warning elements 1, and the warning marks are displayed by the warning elements 1 to play a warning role.
In another embodiment, the side of the protective casing 5 is provided with a plurality of warning pieces 1 for playing a warning role, the warning pieces 1 are LED lamp panels, and when in use, warning marks are displayed through the warning pieces 1 to play a warning role.
The working principle and the using flow of the invention are as follows: when the cleaning device is used, the water pump 43 is connected to a water source through a pipeline, wafers to be cleaned are placed on the upper surface of the bearing plate 34 at intervals, then the electromagnetic valve 41 is controlled to enable the drain pipe 40 to be in a drainage state, the water pump 43 is connected with a power supply of the water pump 43, at the moment, the water in the water storage tank 44 enters the hollow transfusion cover 24 through the bottom of the hollow transfusion cover 24, then the water in the hollow transfusion cover 24 is sprayed out through the cleaning spray nozzle 25, so that the wafers are washed, impurities such as dust and the like remained on the wafers are removed, the used sewage enters the hollow support pipe 393 through the ventilation through holes 392, enters the collecting box 45 after being conveyed through the hollow support pipe 393, and is directly discharged through the drain pipe 40 at the bottom of the collecting box 45;
secondly, in the process of cleaning the wafer, the hollow infusion cover 24 is driven to rotate through the driver 27, at the moment, the cleaning spray head 25 rotates to enable the cleaning spray head 25 to clean the wafer at different positions, meanwhile, the rotation of the hollow infusion cover 24 drives the first driving plate 23 to move, when the first driving plate 23 moves to the position right below the second driving plate 32, the second limiting support plate 33 is inclined through the mutual matching of the first driving plate 23 and the second driving plate 32, and accordingly, along with the rotation of the first driving plate 23, the second limiting support plate 33 is driven to incline by different second driving plates 32, so that the second limiting support plate 33 is inclined in an all-round floating way by 360 degrees, the cleaned wafer is inclined in a multi-angle way, and the cleaning spray head 25 rotates in a matching way, so that the wafer is cleaned in an all-round and dead angle-free manner;
the waste water generated in the cleaning process is discharged through the drain pipe 40 in real time, after the wafer is cleaned, the power supply of the water pump 43 is disconnected, the electromagnetic valve 41 is controlled to enable the drain pipe 40 to be in a disconnected state, then the power supply of the hot air blower 42 is connected, hot air discharged by the hot air blower 42 is quickly filled in the collecting box 45 at the moment, then the hot air in the collecting box 45 is conveyed through the hollow supporting pipe 393 and then is discharged from the ventilation through hole 392 to enter the top of the hollow infusion cover 24, so that the cleaned wafer is quickly dried through the hot air, and meanwhile, the rotary cleaning spray head 25 plays a stirring role on the air in the hollow infusion cover 24, so that the air in the hollow infusion cover 24 is constantly subjected to position change, the drying effect and the drying speed of the hot air on the wafer are improved, and the subsequent processing of the wafer by a user is facilitated;
therefore, through the mutual matching of a plurality of structures, the cleaning spray head 25 rotates, and in the process of rotating the cleaning spray head 25, the wafer is driven to float and incline, so that the wafer is cleaned quickly and fully in all directions without dead angles, the cleaning effect of the cleaning device on the wafer is better, and secondly, the cleaned wafer can be dried quickly and fully.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (8)
1. The utility model provides a wafer self-cleaning device, includes protective housing, its characterized in that: the inside of protective housing is provided with the supporting mechanism that is used for playing the supporting role to the wafer, is used for playing the feeding mechanism of supporting role to the supporting mechanism, is used for cooperating supporting mechanism and feeding mechanism to play the wiper mechanism of clean and dry effect to the wafer, and wiper mechanism sets up at the top of feeding mechanism, and supporting mechanism sets up the inside at wiper mechanism, feeding mechanism includes the water storage tank, and the one end of water storage tank is provided with the water pump, and the lower surface of water storage tank is provided with the collecting box, and the bottom of collecting box is provided with a plurality of drain pipe, and the one end that the drain pipe is close to the collecting box is provided with the solenoid valve, and the top of collecting box is provided with a plurality of hot air-blower, be provided with a plurality of clean shower nozzle on the inner wall at cavity infusion cover top, one side of cavity infusion cover is provided with the driver, and the top of driver is provided with the driving gear, the bottom fixedly connected with of cavity infusion cover is connected with the driven gear with the driving gear of driving gear meshing.
2. The wafer automatic cleaning apparatus according to claim 1, wherein: the bottom cover of cavity infusion cover is equipped with the spacing support piece with water storage tank fixed connection, and the bottom fixedly connected with of cavity infusion cover is used for cooperating spacing support piece to play the spacing disc of supporting role to the cavity infusion cover, spacing disc and spacing support piece sliding connection.
3. The wafer automatic cleaning apparatus according to claim 2, wherein: the inner wall of the hollow infusion cover is also provided with a first limit supporting plate, and one end of the upper surface of the first limit supporting plate is provided with a first driving plate.
4. The wafer automatic cleaning apparatus according to claim 3, wherein: the supporting mechanism comprises a third limiting supporting plate, the lower surface of the third limiting supporting plate is provided with a hollow supporting tube fixedly connected with the collecting box, the top of the hollow supporting tube is provided with a plurality of ventilation through holes, one end, close to the ventilation through holes, of the hollow supporting tube is provided with a plurality of plugging discs connected with the hollow infusion cover in a sealing and rotating mode, the upper side of the third limiting supporting plate is provided with a second limiting supporting plate, the upper surface of the third limiting supporting plate is provided with a plurality of elastic supporting pieces used for supporting the second limiting supporting plate, the lower surface of the second limiting supporting plate is provided with a plurality of second driving plates used for being matched with the first driving plates to play an angle adjusting role on the second limiting supporting plate, and the upper surface of the second limiting supporting plate is movably connected with a bearing plate used for playing a supporting role on a wafer.
5. The wafer automatic cleaning apparatus according to claim 4, wherein: the lower surface of loading board is provided with first elasticity antiskid ribbed tile, and the upper surface of the spacing backup pad of second is provided with the second elasticity antiskid ribbed tile.
6. The automatic wafer cleaning apparatus according to claim 5, wherein: the first limiting fixing plate is embedded in the first elastic antiskid plate, and the second limiting fixing plate which is used for being matched with the first limiting fixing plate to fix the first elastic antiskid plate is embedded in the second elastic antiskid plate.
7. The automatic wafer cleaning apparatus according to any one of claims 1 to 6, wherein: the side of protective housing is provided with a plurality of warning piece that is used for playing the warning effect.
8. The wafer automatic cleaning apparatus according to claim 7, wherein: the warning piece is a handwriting fluorescent plate or an LED lamp panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410257043.1A CN117855108B (en) | 2024-03-07 | 2024-03-07 | Wafer self-cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410257043.1A CN117855108B (en) | 2024-03-07 | 2024-03-07 | Wafer self-cleaning device |
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| CN117855108A true CN117855108A (en) | 2024-04-09 |
| CN117855108B CN117855108B (en) | 2024-05-14 |
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| CN114042678A (en) * | 2021-11-12 | 2022-02-15 | 山东理工职业学院 | Solar panel cleaning and maintaining device for photovoltaic power generation installation |
| KR20240009002A (en) * | 2022-07-12 | 2024-01-22 | 세메스 주식회사 | Apparatus and method for cleaning wafer |
| CN116053188A (en) * | 2023-01-13 | 2023-05-02 | 江苏亚电科技有限公司 | Wafer inclined rotation bearing device and wafer cleaning and drying method |
| CN116748206A (en) * | 2023-07-13 | 2023-09-15 | 中合智腾建设有限公司 | Automatic dust collector of photovoltaic power generation board convenient to remove |
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