CN117850034A

CN117850034A - Color combining optical engine module

Info

Publication number: CN117850034A
Application number: CN202211211619.8A
Authority: CN
Inventors: 杜佳玮; 刘冰玉; 李泓; 徐钦锋; 李潍; 许晨祥; 干洪锋
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2024-04-09

Abstract

The application discloses close color optical engine module, wherein, close color optical engine module includes mirror seat portion, optical portion and at least one projection subassembly, wherein, optical portion with at least one projection subassembly is fixed in the mirror seat portion, projection subassembly include the circuit board with the electricity connect in the luminous chip of circuit board, the luminous chip include luminous region with set up in luminous region week side's non-luminous region, non-luminous region has a plurality of conduction points, a plurality of adjacent two conduction points in the conduction point establish ties each other after with the circuit board electricity is connected. By connecting at least two adjacent conducting points in series, the number of wires used for electrical connection between the light emitting chip and the circuit board is reduced, so that the manufacturing flow can be simplified.

Description

Color combining optical engine module

Technical Field

The invention relates to the field of optical machine imaging, in particular to a color combining optical machine module.

Background

With the development of electronic technology, technologies such as Virtual Reality (VR) and Augmented Reality (AR) are favored by consumers, especially the research and development of existing Micro LED chips and the gradual maturation of mass production technologies, AR optomachines based on Micro LED chips become hot spots in the global AR field, and the number of AR optomachine devices configured with AR optomachines is also significantly increased.

The AR glasses are one of devices equipped with AR light machines, the form of the AR glasses is similar to that of glasses worn by daily people, the space on which the AR light machines can be mounted on the glasses worn daily is limited, and how to reduce the size of the AR light machines so that the AR light machines are suitable to be mounted in the limited space is a problem to be solved in the prior art for realizing the miniaturization of the AR light machines. Further, the existing AR light machine is basically of a single-color structure, in order to improve the imaging quality of the AR light machine, a color combining light machine structure is provided at present, that is, a plurality of Micro LED chips are arranged in the same AR light machine structure to improve the imaging quality of the AR light machine, and the color combining light machine structure itself has higher requirements on the mounting positions of the chips, so that how to ensure the accuracy of the positions of the chips in the color combining light machine is a key for improving the imaging quality of the AR light machine.

Meanwhile, as the optical machine chip images based on the self luminescence of the chip in the imaging process, the chip can generate heat in the working process, and a plurality of chips in the color combining optical machine can effectively improve the imaging quality of the optical machine, the generated heat can influence the imaging of the optical machine, how to solve the problems of the heat generated by the color combining optical machine in the imaging process, and the like, reduce the power consumption of the color combining optical machine structure and obtain the optical machine structure with high brightness and high contrast.

Based on the above problems, the present invention provides a light combining camera structure with low power consumption and small size, which can effectively solve some or most of the problems described above.

Disclosure of Invention

An object of the present invention is to provide a projection module and a color combining camera module, in which the projection module integrally encapsulates and fixes a light emitting chip and a circuit board by using a molding process, thereby achieving miniaturization of an overall encapsulation structure while ensuring stable circuit connection.

An object of the present invention is to provide a projection module and a color combining optical engine module, wherein a plurality of projection modules are assembled in the same optical engine module, and each projection module emits light with different colors for imaging.

The invention provides a projection assembly and a color combining camera module, which are used for connecting conducting points on a light emitting chip of the projection assembly in series and conducting single-row welding spots arranged on a circuit board of the projection assembly, so that the space occupied by a conducting circuit of the light emitting chip can be effectively reduced.

An object of the present invention is to provide a projection module and a color combining optical engine module, which adopts a cube color combining prism to emit light rays emitted by a plurality of projection modules with different colors in the same direction, so as to solve the problem of inconsistent transmission paths of the light rays emitted by the projection modules.

An object of the present invention is to provide a projection module and a color combiner module, in which an optical lens and a color combiner are mounted and fixed on the same lens base, and the consistency of the optical path between the optical lens and the color combiner is ensured by the structure of the lens base, so that the subsequent assembly process is simplified.

An object of the present invention is to provide a projection assembly and a color combiner module, in which a lens mounting body and a prism mounting body in a lens base are integrally formed, the lens base is directly formed by injection molding with a mold, and the precision of the installation of the optical lens and the color combiner prism can be improved by the structure of the lens base, so that the subsequent process assembly is convenient.

An object of the present invention is to provide a projection module and a color combiner module, in which a baffle structure is provided at a position of a lens holder portion where the projection module is not mounted, so that the structural strength of the lens holder portion itself is enhanced and the occurrence of stray light is prevented.

The invention aims to provide a projection assembly and a color combining optical machine module, wherein a metal substrate is arranged on the bottom surface of a light emitting chip, and a heat radiation body is correspondingly arranged on the back surface of the projection assembly, so that heat generated in the working process of the light emitting chip can be effectively led out, the working temperature of the optical machine module is reduced, and the imaging quality of the optical machine module is ensured.

In order to achieve the above purpose, the invention adopts the following technical scheme:

according to an aspect of the present application, there is provided a color combining camera module, including:

a lens base;

an optical unit; and

the projection assembly comprises a circuit board and a light-emitting chip electrically connected to the circuit board, wherein the light-emitting chip comprises a light-emitting area and a non-light-emitting area arranged on the periphery of the light-emitting area, the non-light-emitting area is provided with a plurality of conducting points, and at least two adjacent conducting points in the conducting points are connected in series and then electrically connected with the circuit board.

In some embodiments, the circuit board includes a hard circuit board and a flexible circuit board led out from one end of the hard circuit board, the hard circuit board has a through hole, and the light emitting chip is accommodated in the through hole of the hard circuit board.

In some embodiments, the projection assembly further includes a metal substrate disposed on a lower surface of the hard wiring board, and the light emitting chip is attached to the metal substrate.

In some embodiments, the color combining camera module further includes a heat dissipation portion disposed at a peripheral side of the lens holder portion, the heat dissipation portion being attached to the metal substrate.

In some embodiments, the color combining camera module further includes a heat dissipation part disposed at a peripheral side of the lens part, and the heat dissipation part is attached to a back surface of the light emitting chip.

In some embodiments, the lens mount includes a lens mount and a prism mount, the optical part includes an optical lens mounted to the lens mount and a color combining prism mounted to the prism mount, the prism mount has at least two side openings, at least one of the side openings corresponds to the optical lens, and the remaining side opening faces correspond to the projection assembly, and a projection path of the projection assembly converges to a center of the color combining prism and projects to the optical lens.

In some embodiments, the at least one projection assembly includes three projection assemblies, i.e., a first projection assembly, a second projection assembly, and a third projection assembly, the light emitting chips are eccentrically disposed with respect to the circuit board, and the eccentric arrangement directions of the light emitting chips of the three projection assemblies are all close to the same side wall of the prism mounting body.

In some embodiments, the heat sink includes first, second, and third heat sinks in a U-shaped distribution, the first heat sink corresponding to a back side of the first projection assembly, the second heat sink corresponding to a back side of the second projection assembly, and the third heat sink corresponding to a back side of the third projection assembly.

In some embodiments, the projection assembly further includes a light-transmitting cover plate disposed above the light-emitting chip, the light-transmitting cover plate being eccentrically disposed at one side of the projection assembly.

In some embodiments, the projection assembly further includes a molding base integrally formed on an upper surface of the circuit board, and the molding base forms a light window corresponding to the light emitting chip.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a specific optomechanical module according to the present invention;

FIG. 2 is a schematic diagram of an exploded module of the opto-mechanical module according to the present invention;

FIG. 3 is a schematic perspective view of the projection assembly of the present application;

FIG. 3A is a schematic diagram of an embodiment of a projection module of the opto-mechanical module according to the present invention;

FIG. 3B is a schematic view of another embodiment of a projection module of the optical engine module according to the present invention;

FIG. 3C is a schematic view of another embodiment of a projection module of the optical engine module according to the present invention;

FIG. 3D is a schematic view of another embodiment of a projection module of the optical engine module according to the present invention;

FIG. 4A is a diagram illustrating an embodiment of a lens module according to the present invention;

FIG. 4B is a diagram of an embodiment of a lens module according to the present invention;

FIG. 5 is a schematic cross-sectional view of an optical lens according to the present invention;

FIG. 6 is a schematic view showing a structure of a projection assembly of an optical engine module fixed on a lens base according to the present invention;

FIG. 7 is a schematic diagram of an optomechanical module with a heat sink according to the present invention;

FIG. 8 is a schematic view of a color combining prism according to the present invention;

fig. 9 is a schematic diagram of another embodiment of the overall structure of the optical-mechanical module according to the present invention.

Detailed Description

The present invention will be further described with reference to the following specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

In the description of the present invention, it should be noted that, for the azimuth words such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present invention that the device or element referred to must have a specific azimuth configuration and operation.

It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

The terms "comprises" and "comprising," along with any variations thereof, in the description and claims of the present application are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.

In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or both elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Along with the development of Micro LED chips and the gradual maturation of mass production technology, an AR optical machine based on the Micro LED chips becomes a hot spot in the global AR field, and is widely applied to various AR products due to the advantages of high brightness, high contrast, low energy consumption, small size and the like. The multiple chips are used for imaging in the color combining optical machine, so that the imaging quality of AR products is obviously improved, the multiple chips are arranged in the same optical machine structure, and in order to effectively ensure the imaging quality, the mounting accuracy of the chips is required to be ensured. Furthermore, the application of the optical machine structure on the glasses to form the AR glasses has a limited space for installing the optical machine on the AR glasses, and how to realize the miniaturization of the integral structure of the color combining optical machine is also a problem to be solved at present.

The present invention provides an optical module 1, as shown in fig. 1, 2 and 7, which includes at least one projection module 10, an optical portion 20, a lens portion 30 and a heat dissipation portion 40. In one embodiment, the projection assembly 10 includes at least one projector, in particular a Micro LED chip, and a circuit board 130, which is electrically connected and packaged to the circuit board 130 to form a light-emitting assembly. The optical portion 10 is disposed on a light emitting path of the projection assembly, the optical portion 20 includes a color combining prism 21 and an optical lens 22, and the specific projection path of the projection assembly is converged at a center of the color combining prism 22 of the optical portion 10 and projected to the optical lens 22, wherein the color combining prism 21 is mainly used for changing a light path, and the optical lens 22 is mainly used for diffusing the converged color combining light path. The lens holder 30 is used for fixing the optical lens 22 and the color combining prism 21, the lens holder 30 includes a lens mounting body 31 and a prism mounting body 32, and the lens mounting body 31 and the prism mounting body 32 can be integrally formed into the lens holder 30, wherein the lens mounting body 31 is used for mounting the lens 22, and the prism mounting body is used for accommodating the color combining prism 21. Further, the prism mounting body 32 has at least two side openings, and in the embodiment of the present invention, the prism mounting body 32 has four side openings, wherein at least one side opening is used for correspondingly disposing the optical lens 22, the other side opening is used for correspondingly disposing the projection assembly 10, and the lens mounting body 31 and the prism mounting body 32 are disposed for ensuring the consistency of the optical paths of the projection assembly 10 and the optical portion 20. The heat dissipation portion 40 is disposed on the peripheral side of the lens portion 30, and covers at least a portion of the structure of the projection assembly 10, so as to conduct the heat generated by the projection assembly 10 to the outside, and reduce the heat generated by the overall optical module 1, so as to ensure the normal operation of the optical module 1.

In comparison with a conventional optical engine module structure, the optical engine module 1 of the present invention includes a plurality of projection assemblies, as shown in fig. 1 and 2, in a specific embodiment, the projection assembly 10 includes three projection assemblies, namely a first projection assembly 11, a second projection assembly 12 and a third projection assembly 13, respectively, and the Micro LED chips packaged in the projection assemblies can emit light in any of R, G, B colors. The light beams emitted from the first projection component 11, the second projection component 12 and the third projection component 13 can be projected and imaged through the optical lens 22 along the same light path through the turning action of the color combining prism 21. In order to ensure the imaging quality, the installation positions of the first projection component 11, the second projection component 12 and the third projection component 13 need to be strictly controlled, so that the light rays emitted by the three projection components are projected along the same optical path after passing through the turning action of the color combining prism 21.

As shown in fig. 1 and 2, the precision of the projection assembly installation is controlled by the lens holder part 30 in the present application, and in particular, the lens holder part 30 may be formed by an injection molding process, which is manufactured by a pre-designed mold, and the lens holder part 30 includes a lens mounting body 31 and a prism mounting body 32. The lens mounting body 31 may be used for fixing the optical lens 22, the prism mounting body 32 may be used for mounting the color combining prism 31, and the light emitted by the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 may be made to pass through the turning action or the polarization action or the light splitting and refracting action of the color combining prism 21 by the action of the lens base 30, and finally the color light path is combined and projected through the optical lens 22. The specific structure of the lens base 30 can be determined according to the number of the projection assemblies 10, the color combining prism 21 and the mounting position of the optical lens 22, and the specific structure of the lens base 30 in the present application will be described in detail in conjunction with a color combining camera module of a specific example, which will not be described in detail herein.

The specific structure of the projection assembly 10 will be described below, the projection assembly 10 being fixed to the mirror base 30, the mounting positions of the first, second and third projection assemblies 11, 12 and 13 being determined by the structure of the mirror base 30. Specifically, in order to further achieve miniaturization of the overall structure of the optomechanical module 1, the packaging structures of the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 may be correspondingly configured so that the volume of the projection assemblies is reduced to be better accommodated on the optomechanical module 30. The lens portion 30 includes a lens mounting body 31 and a prism mounting body 32, and the prism mounting body 32 is mainly used for fixing the color combining prism 21, so that the light beams emitted from the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 are projected out through the same optical path under the turning action of the color combining prism 21.

The projection assembly 10 in the present application may include a plurality of projection assemblies, specifically, the projection assembly 10 includes a first projection assembly 11, a second projection assembly 12 and a third projection assembly 13, where the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 are respectively fixed on three sidewalls of the lens base 30 and respectively correspond to three side openings of the prism mounting portion 32 to form a projection screen in cooperation with the color combining prism 21. As shown in fig. 3, in a specific embodiment, the first projection assembly 11 further includes a light emitting chip 110, a light-transmitting cover plate 120, a circuit board 130, a metal substrate 140 and a molding base 150, wherein the light emitting chip 110 is disposed on the upper surface of the circuit board 130, and the light emitting chip 110 is electrically connected to the circuit board 130 through wires to ensure electrical connection of the light emitting chip 110. Meanwhile, the light-transmitting cover plate 120 is disposed on the upper surface of the light-emitting chip 110, i.e., the light-emitting surface of the light-emitting chip 110, and in one example of the present application, the light-transmitting cover plate 120 is directly attached to the upper surface of the light-emitting chip 110; in another example of the present application, the light-transmitting cover plate 120 is disposed on the upper surface of the molding base 150, and further the light-transmitting cover plate 120 is disposed on a sinking step of the molding base 150 corresponding to a light window formed on the light-emitting surface of the light-emitting chip 110, so as to ensure that a certain distance is disposed on the upper surface of the light-emitting chip 120, the light-transmitting cover plate 120 may be used for protecting the light-emitting chip 110, in other words, the light-transmitting cover plate 120 is disposed above the light-emitting chip 110 and keeps a fixed distance between the light-transmitting cover plate 120 and the light-emitting chip 110. In order to reduce the height of the first projection assembly 11, in a preferred embodiment, the light-transmitting cover plate 120 is directly attached to the upper surface of the light-emitting chip 110.

As shown in fig. 3, further, a metal substrate 140 is disposed on the lower surface of the circuit board 130 of the first projection module 11, and the metal substrate 140 is attached to the lower surface of the circuit board 130 and at least partially corresponds to the attaching area of the light emitting chip 110. In some alternative embodiments, the area of the metal substrate 140 is larger than twice the area of the light emitting chip 110, and the metal substrate 140 can effectively conduct part of the heat generated by the light emitting chip 110 while enhancing the strength of the circuit board 130, so as to ensure the long-acting normal operation of the optical machine module 1. The molding base 150 is integrally formed on the upper surface of the circuit board 130 and forms a light window corresponding to the light emitting chip 110, wherein the molding base 150 is manufactured by a molding process, and the wires conducted between the circuit board 130 and the light emitting chip 110 can be encapsulated inside the molding base 150, so that the conduction stability of the light emitting chip 110 and the circuit board 130 can be ensured. Specifically, the light emitting chip 110 has a light emitting area 111 and a non-light emitting area 112, the light emitting area 111 is disposed in a middle area of the light emitting chip 110, the non-light emitting area 112 is disposed in a peripheral area of the light emitting chip 110, the non-light emitting area 112 is provided with a line conducting point of the light emitting chip 110, and the light emitting chip 110 can be conducted with the circuit board 130 through the line conducting point of the non-light emitting area 112 to provide a current required for the operation of the light emitting chip 110. Meanwhile, the molding base 150 integrally encapsulates at least a portion of the upper surface of the circuit board 130 and at least a portion of the non-light emitting region 112 of the light emitting chip 110, and in some alternative embodiments, as shown in fig. 3A and 3C, the molding base 150 further integrally encapsulates the sidewall of the light transmissive cover plate 120 and/or the upper surface peripheral region of the light transmissive cover plate 120.

In some alternative embodiments, the light-transmitting cover plate 120 is preset on the light-emitting chip 110, and the molded base 150 is prepared by a molding process to integrally encapsulate at least a part of the upper surface of the circuit board 130 and at least a part of the non-light-emitting area 112 of the light-emitting chip 110. Since the molded base 150 may generate a partial stress concentration during the packaging process, the thickness of the light-transmitting cover plate 120 is preferably not less than 0.2mm to alleviate warpage of a possible light-emitting chip. In some alternative embodiments, the thickness of the transparent cover 120 is less than the thickness of the molded base 150 to avoid scratching the transparent cover. In some alternative embodiments, the upper surface of the transparent cover 120 is flush with the top surface of the molded base 150 to provide a flat upper surface for subsequent attachment. In some alternative implementations, the flat upper surface may be obtained by direct press-fitting of an upper mold, or by grinding the top surfaces of the light-transmissive cover plate and the molded base 150.

In order to further reduce the size of the projection assembly 10, and in particular to reduce the thickness of the projection assembly, in the present invention, the circuit board 130 has a sunken groove thereon, and in some alternative embodiments, the circuit board 130 has a through hole, and the light emitting chip 110 is disposed in a corresponding sunken groove or through hole area, such that the bottom surface of the light emitting chip 110 is lower than the upper surface of the circuit board 130 or is flush with the bottom surface of the circuit board 130. In some alternative embodiments, the light emitting chip 110 is disposed on the surface of the metal substrate 140 and electrically connected to the circuit board 130.

The shape of the sinking groove or the through hole in the circuit board 130 is identical to or similar to the shape of the light emitting chip 110, and the area or the aperture of the through hole or the sinking groove in the circuit board 130 is greater than or equal to the area of the light emitting chip 110. In a preferred embodiment, the area of the through hole or the countersunk recess on the circuit board 130 is larger than the area of the light emitting chip 110, so that the light emitting chip 110 is completely accommodated in the countersunk recess or the through hole or the countersunk recess of the circuit board 130 and is conducted with the circuit board 130 through the conducting point on the non-light emitting area 112 on the light emitting chip 110. Meanwhile, in order to further support the light emitting chip 110, the lower surface of the circuit board 130 is provided with a metal substrate 140, and the area of the metal substrate 140 is the same as or similar to the area of the circuit board 130, preferably more than twice or more than the area of the light emitting chip 110. The metal substrate 140 is fixed on the lower surface of the circuit board 130, and the lower surface of the light emitting chip 110 is contacted with or attached to the upper surface of the metal substrate 140, so as to improve the mounting stability of the light emitting chip 110 through the supporting function of the metal substrate 140, and meanwhile, the flatness of the light emitting chip 110 is improved through the flat surface of the metal substrate 140. In an alternative embodiment of the present invention, the area of the through hole or the countersink recess on the circuit board 130 is larger than the area of the light emitting chip 110, the light emitting chip is accommodated in the countersink recess or the through hole or the countersink recess of the circuit board 130, and the metal substrate provides a flat surface for flat mounting the light emitting chip 110, so as to alleviate the risk of warpage of the circuit board or inclination of chip mounting, which may occur when the molding base 150 integrally seals at least part of the upper surface of the circuit board 130 and at least part of the non-light emitting area 112 of the light emitting chip 110, and improve heat dissipation of the assembly.

In the present invention, the circuit board 130 is mainly conducted with an external circuit to provide the current required by the operation of the light emitting chip 110, as shown in fig. 3, in a specific embodiment, the circuit board 130 further includes a hard circuit board 131 and a flexible circuit board 132, one end of the hard circuit board 131 leads out of the flexible circuit board 132, one end of the flexible circuit board 132 is conducted with the hard circuit board 131, and the other end of the flexible circuit board 132 is conducted with an external power supply to provide the current required by the operation of the light emitting chip 110 through the conduction of the flexible circuit board 132. The flexible circuit board 132 has a connector 133 at the end connected to the external power source, and the connector 133 is disposed at the end of the circuit board 130 connected to the external power source to convert the externally input voltage so as to meet the current requirement required by the operation of the light emitting chip 110.

As shown in fig. 3, in the present invention, the light emitting chip 110 and the circuit board 130 are integrally packaged and fixed by using the molding base 150, and the molding base 150 molds the wires for conducting the light emitting chip 110 and the circuit board 130 inside the structure thereof, so that the conducting stability of the light emitting chip 110 can be further ensured. Meanwhile, the upper surface of the molding base 150 can be ensured to have flatness by a molding process, and the upper surface of the molding base 150 is fixed on the lens base 30 of the optical module 1, so that the connection between the first projection assembly 11 and the lens base 30 is more stable, and the stability of the overall structure of the optical module 1 is improved. Further, the molding base 150 can be directly formed on the circuit board 130 by using a molding process, so as to simplify the process flow of the first projection assembly 11, and in the optical mechanical module 1 provided by the invention, the number of the first projection assemblies 11 is plural, and the mass production of the first projection assemblies 11 can be performed by using the molding base 150, so as to improve the production efficiency of the first projection assemblies 11. The structure of the first projection assembly 11 shown in fig. 3A to 3D has certain advantages in terms of the packaging scheme using the molding base 150, and the specific packaging mode may be selected according to the type of the optical lens 22 selected in the opto-mechanical module 1, where the structure of the selected first projection assembly 11 is not limited specifically.

As shown in fig. 3 and fig. 3A and fig. 3C, the light-transmitting cover 120 is eccentrically disposed on one side of the projection assembly 10 (the first projection assembly 11 is illustrated in the drawings), and in some alternative embodiments, the light-transmitting cover 120 is eccentrically disposed on one side of the circuit board 130 and/or the light-emitting chip 110. In some alternative embodiments, the light-transmitting cover plate 120 and/or the light-emitting chip 110 is eccentrically disposed on one side of the upper surface of the circuit board 130, and in particular, the light-transmitting cover plate 120 and/or the light-emitting chip 110 is disposed on a side region of the light-emitting direction of the projection assembly 10, which is far from the flexible circuit board 132. By virtue of the process advantages of the integrated package of the molded base 150, such as reduced package size and the continued cutting of the package, the space for avoiding the need for conventional base attachment processes can be saved, and extremely narrow sides can be formed corresponding to the non-wire connection ends 1312 of the rigid circuit board.

Referring to fig. 2 and 3, the molding base 150 integrally encapsulates the light emitting chip 110 on the circuit board 130, and the top surface of the molding base 150 forms at least one narrow top surface and at least one wide top surface around the transparent cover 120. In some alternative embodiments, the top surface of the molded base 150 has a three-sided narrow top surface and a one-sided wide top surface, the wide top surface of the molded base 150 being adjacent to the flexible circuit board 132. In some alternative embodiments, a wide top surface is located on one side of the light-transmissive cover plate 120, and a narrow top surface is located on the opposite side of the light-transmissive cover plate 120. When the plurality of projection assemblies 10 are assembled to the prism mounting body 32, the light-transmitting cover plate 120 of the plurality of projection assemblies 10 (the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 are shown in the figure) and/or the light-emitting chip 110 are eccentrically disposed with respect to the circuit board 130, and meanwhile, the eccentric disposed directions are all close to the same side wall of the prism mounting body 32, and meanwhile, the flexible circuit boards 132 of the plurality of projection assemblies 10 extend towards opposite directions opposite to the side wall of the prism mounting body 32.

As shown in fig. 3A, in order to further reduce the height of the first projection module 11, the circuit board 130 is mainly disposed on the hard circuit board 131, and in a specific embodiment, the hard circuit board 132 has a through hole 1311, a non-circuit connection terminal 1312, and a circuit connection terminal 1313. The wire connection end 1313 is a circuit board on one side for conducting with the light emitting chip 110, and the other side of the hard circuit board 131, where no wire conducting point is provided, is a non-wire connection end 1312. In the present invention, the molding base 150 can fix the light emitting chip 110 on the circuit board 130, and a light-passing hole is formed in the middle of the molding base 150, and the light-passing hole is mainly used for passing the light of the light emitting chip 110, so that the light-passing hole of the molding base 150 is approximately the same as the size of the light emitting area 111 of the light emitting chip 110, so that the light of the light emitting chip 110 completely passes through the light-passing hole, and the imaging quality of the optical machine module 1 is improved. The hard circuit board 131 has a through hole 1311, a non-circuit connection end 1312, and a circuit connection end 1313, wherein the through hole 1311 is eccentrically disposed on one side of the hard circuit board 131, the non-circuit connection end 1312 and the circuit connection end 1313 are located around the through hole 1311, and in a specific embodiment, the non-circuit connection end 1312 is located on at least one side of the hard circuit board 131, and the other side is the circuit connection end 1313. In some alternative embodiments, the wire connection end 1313 is located near a connection portion between the hard circuit board 131 and the flexible circuit board 132, where the width of the non-wire connection end 1312 (i.e. the distance from the edge of the sinking groove or the through hole to the outer edge of the adjacent hard circuit board) is smaller than the width of the wire connection end 1313, so that the miniaturization of the overall structure can be effectively ensured while reserving the wire connection position of the light emitting chip 110. By adopting the arrangement mode of the molding base 150, compared with the conventional mode of adopting the lens base package, the size of the projection assembly 10 can be significantly reduced, and referring to fig. 3, the size of the first projection assembly 11 in the X direction is smaller than or equal to 4.1mm, the size of the first projection assembly in the Y direction is smaller than or equal to 6mm, and the size of the first projection assembly in the Z direction is smaller than or equal to 1.1mm, so as to meet the requirement of miniaturization of the projection assembly 10.

Specifically, the first projection assembly 11 includes a light emitting chip 110, a light-transmitting cover plate 120, a circuit board 130, a metal substrate 140 and a molding base 150, wherein the light emitting chip 110, the circuit board 130 and the molding base 150 have various arrangements, and a specific structure of the first projection assembly 11 will be described below. Fig. 3A shows an embodiment of the first projection assembly 11, specifically, the transparent cover 120 is attached to the upper surface of the light emitting chip 110, where the thickness of the transparent cover 120 is less than or equal to 0.25mm, the light emitting chip 110 with the transparent cover 120 is attached in the through hole 1311 of the circuit board 130, the light emitting chip 110 and the circuit board 130 are conducted by wires, and the molding base 150 is disposed in a partial area of the light emitting chip 110 and the transparent cover 120. Specifically, the molding base 150 is disposed on the non-light emitting region 112 of the light emitting chip 110, and the molding base 150 may cover a part of the non-light emitting region 112 or all of the non-light emitting region 112 of the light emitting chip 110.

Fig. 3B shows an alternative embodiment of the projection assembly 10, in which the conductive points on the non-light emitting areas 112 of the light emitting chip 110 are connected to the wire connection terminals 1313 on the hard wire board 131. In order to further reduce the size of the connection between the hard circuit board 131 and the light emitting chip 110, the circuit connection end 1313 of the circuit board 130 is configured as a single row of pads compared to the conventional dual row pad design, and in some alternative embodiments, the distance between the pads and the edge of the hard circuit board 131 is less than or equal to 0.1mm. In order to ensure stable line connection between the light emitting chip 110 and the circuit board 130, by improving the circuit design of the light emitting chip 110, the conducting points on the light emitting chip 110 are connected in series, and in some alternative embodiments, at least two adjacent conducting points of the light emitting chip 110 are selected to be connected in series; further, the conducting point on the light emitting chip 110 after being connected in series is electrically connected with the line connection end 1313, and the series line can effectively ensure that the line of the light emitting chip 110 is conducted to the circuit board 130, and simultaneously reduce the space occupied by the line connection of the light emitting chip 110.

Further, the transparent cover plate 120 is directly attached to the upper surface of the light emitting chip 120, wherein the thickness of the transparent cover plate is less than or equal to 0.25mm, the light emitting chip 110 attached with the transparent cover plate 120 is disposed in a through hole 1311 reserved in the circuit board 130, the light emitting chip 110 is conducted with the circuit board 130 by using a wire, and the metal substrate 140 is fixed on the lower surface of the hard circuit board 131, so that the lower surface of the light emitting chip 110 is supported on the metal substrate 140 to better conduct out the heat generated by the light emitting chip 110. The connection portion between the light emitting chip 110 and the circuit board 130 is molded by the molding base 150 to form the first projection assembly 11, such that the dimension of the first projection assembly 11 in the X direction is 4.1mm or less, the dimension in the Y direction is 5.5mm or less, and the dimension in the Z direction is 1.1mm or less, so as to achieve miniaturization of the entire projection assembly 10.

Fig. 3C shows an alternative embodiment of the first projection assembly 11, where the transparent cover 120 is attached to the upper surface of the light emitting chip 110, and the thickness of the transparent cover 120 is less than or equal to 0.3mm, and the light emitting chip 110 and the circuit board 130 are conducted through wires. The molding base 150 is disposed at the connection between the light emitting chip 110 and the circuit board 130, and the size of the transparent cover 120 is smaller than or equal to the size of the light emitting chip 110, i.e. the transparent cover 120 is attached to the light emitting area 111 of the light emitting chip 110. The bottom surface of the molding base 150 covers at least a portion of the non-light emitting region 112 of the light emitting chip 110, and the molding base 150 does not cover the top surface of the light-transmitting cover plate 120, such that the light-transmitting cover plate 120 is limited to the inner side of the molding base 150. By adopting the packaging method, the thickness of the transparent cover plate 120 can be reduced, the assembly of the subsequent process is facilitated, the dimension of the first projection component 11 in the X direction is smaller than or equal to 4.8mm, the dimension of the first projection component in the Y direction is smaller than or equal to 6.2mm, and the dimension of the first projection component in the Z direction is smaller than or equal to 1.1mm, so that the miniaturization of the whole projection component 10 is realized.

Fig. 3D shows another alternative embodiment of the projection assembly 10, wherein the first projection assembly 11 of one of the projection assemblies 10 has a certain gap between the transparent cover plate 120 and the light emitting chip 110, and the thickness of the transparent cover plate 120 is less than or equal to 0.21mm in order to reduce the height of the first projection assembly 11. Specifically, the light emitting chip 110 is disposed in the through hole 1311 reserved in the circuit board 130, the metal substrate 140 is fixed on the lower surface of the hard circuit board 131, and the upper surface of the metal substrate 140 contacts with the lower surface of the light emitting chip 110 to better conduct out the heat generated by the light emitting chip 110. The molding base 150 fixes the light emitting chip 110 and the circuit board 130, the inner side of the molding base 150 has a step structure, and the transparent cover 120 is fixed on the step structure, so that the transparent cover 120 is disposed on the upper surface of the light emitting chip 110, and plays a corresponding role in protecting the light emitting chip 110. The transparent cover plate 120 is fixed on the step structure of the molding base 150, so that a certain gap is formed between the transparent cover plate 120 and the light emitting chip, and the size of the first projection assembly 11 can be reduced, so that the size of the first projection assembly 11 in the X direction is less than or equal to 4.9mm, the size of the first projection assembly 11 in the Y direction is less than or equal to 6.1mm, and the size of the first projection assembly 11 in the Z direction is less than or equal to 1.1mm, thereby realizing miniaturization of the whole first projection assembly 11.

With the design of fig. 1 to 3D, the projection module 10 encapsulated by molding is expected to be reduced by 20% in volume and by 32% in volume with the through-hole or sink-groove structure, while the opto-mechanical module 1 can be reduced by 20% in volume, compared to the conventional assembly structure.

In some alternative embodiments, the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 have the same structure, but the light source colors emitted by the light emitting chip 110 in the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 are different, wherein the light emitting color of the light emitting chip 110 may be any one of R (red), G (green) and B (blue). The package structure of the first projection module 11 is consistent with the structures of the second projection module 12 and the third projection module 13, and may be any of the package structures shown in fig. 3A-3D, and the light emitting chip 110 and the circuit board 130 are packaged by using the molding base 150 to form a plurality of identical projection modules, so that the identical projection modules are matched with each other to obtain high-quality imaging. In the invention, a plurality of the projection assemblies 10 are integrally formed through a molding and packaging process, and besides the miniaturization advantage, the projection assemblies 10 realized through the molding and packaging process can provide a flat attaching upper surface through the die imposition and packaging and the flatness advantage brought by a forming die; in addition, the plurality of projection modules 10 can reduce manufacturing variations and assembly tolerances between the projection modules 10 by the processes of assembling, integrally packaging, assembling, cutting, separating, etc., so that the projection modules can be assembled to the prism mounting body 32 with higher uniformity.

Further, the optical module 1 of the present invention further includes an optical portion 20, as shown in fig. 8, the optical portion 20 is mainly used for transmitting light from the light emitting chip 110, the optical portion 20 includes a color combining prism 21 and an optical lens 22, and the color combining prism 21 is mainly used for changing a light transmission path of the light emitting chip 110. Specifically, in the present application, the colors of the light emitted by the light emitting chips in the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 are not identical, and are respectively mounted on the sidewalls of the mirror base 30 in different directions, so that the light emitted by the light emitting chips in the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13 is converged to the same direction for emitting, and the color combining prism 21 is set to converge the light of the light emitting chips in the same direction. In a specific embodiment, the color combining prism 21 may be configured as a cube structure, and includes at least one light emitting surface and at least one light entering surface, in an alternative embodiment of the present invention, the first projection component 11, the second projection component 12 and the third projection component 13 are respectively disposed on different light entering surfaces of the color combining prism, the color combining prism 21 receives R, G, B three-color light emitted from the light emitting chip of each projection component, and the three primary colors are combined into a color image through the color combining prism 21, and finally emitted through the light emitting surface of the color combining prism 21.

Referring to fig. 4A to 7, the color combining prism 21 is installed inside the prism installation body 32 reserved for the prism installation body 30, and the projection assembly 10 is fixed in the projection assembly installation position 360 at the side of the prism installation body 32 such that the first, second and third projection assemblies 11, 12 and 13 are installed at the prism installation body 30 and correspond to the color combining prism 21, specifically, the first, second and third projection assemblies 11, 12 and 13 are respectively provided to correspond to three sidewall openings of the prism installation body 32. In order to make the color combining prism 21 stably mounted, as shown in fig. 8, the color combining prism 21 includes a prism body 210 and a prism chamfer 211, wherein the prism body 210 is limited inside the prism mounting body 32, and the prism chamfer 211 is disposed at least at one edge of the color combining prism 21. In a specific embodiment, the prism chamfer 211 is a circular chamfer, and a space is reserved through the prism chamfer 211, so that a glue overflow position of the excessive glue glued by the color combining prism 21 and the prism mounting body 31 is reserved, and the excessive glue is prevented from overflowing and concentrating and deforming during baking or curing to affect the mounting accuracy of the color combining prism 21.

In order to further ensure the imaging quality of the opto-mechanical module 1, the accuracy of the mounting position of the color combining prism 21 needs to be strictly controlled during the mounting, the color combining prism 21 is fixed in the lens holder portion 30, the mounting position of the color combining prism 21 is formed on the prism mounting body 32, and the mounting accuracy of the color combining prism 21 can be further ensured by controlling the molding accuracy of the lens holder portion 30 itself.

In the present invention, the light of the light emitting chip 110 is diffused through the optical lens 22 to obtain an image suitable for receiving by human eyes. As shown in fig. 5, the optical lens 22 includes a lens barrel 220 and at least one lens group 230, the lens group 230 being disposed inside the lens barrel 220 to form the imageable optical lens, wherein the lens barrel 220 has a lens mounting end 221 and a lens bearing end 222, the lens mounting end 221 being mainly used for mounting the lens group 230 such that the lens group 230 is accommodated inside the lens barrel 220. Further, the lens barrel 220 further has a lens supporting end 222, the lens supporting end 222 is disposed on the lens base 30 and fixed with the lens mounting body 31, the lens mounting body 31 includes a lens barrel accommodating portion 330, a lens avoiding groove 340 and a lens light emitting hole 350, and the lens supporting end 222 of the lens barrel 220 is disposed in the lens barrel accommodating portion 330 to fix the lens barrel 220 with the lens mounting body 31.

In order to improve the imaging quality of the optical lens 22, the number of the lens groups 230 is at least one, and in a specific embodiment, the number of the lens groups 230 is four, namely, the first lens 231, the second lens 232, the third lens 233 and the fourth lens 234, wherein the lens sizes of the lens groups 230 sequentially increase, that is, the diameter of the fourth lens 234 is the largest. Furthermore, a spacer is provided between each lens to keep a certain gap between each lens, and the effect of the spacer can be utilized to make the connection between each lens and the lens barrel 220 more stable, so as to prevent stray light generated by reflection between the lens barrel 220 and the spacer, and to perform blackening treatment on the lens barrel 220 and the spacer, and to perform extinction treatment on the spacer, so as to reduce stray light generation and improve the imaging quality of the optical lens 22. Further, the optical axis of the optical lens 22 is consistent with the light emitting direction of the color combining prism 21, the optical lens 22 and the color combining prism 21 are fixed by the lens base 30, and the light emitting direction of the color combining prism 21 is consistent with the optical axis direction of the optical lens 22 by the structural design of the lens base 30. In order to ensure the consistency of the optical paths of the optical machine module 1, that is, to make the light emitted from the color combining prism 21 pass through the optical lens 22, the overall structure of the lens base 30 needs to be designed correspondingly, the present invention also provides a lens base 30 that meets the installation position requirements of the color combining prism 21 and the optical lens 22, and the structure of the lens base 30 will be described in detail below.

Fig. 4A to 4B show the structure of the lens holder portion 30, the lens holder portion 30 includes a lens mount 31 and a prism mount 32, and the lens mount 31 and the prism mount 32 are joined together or integrally formed to form the lens holder portion 30; the lens housing portion 30 is used to provide support for various components either internal or external thereto. Specifically, the lens mounting body 31 and the prism mounting body 32 of the lens base 30 may be molded, for example, integrally injection molded or metal injection molded, and if metal injection molded is used, the lens mounting body and the prism mounting body may be finished by removing material based on the molding process.

Fig. 4A shows an embodiment of the lens holder 30, specifically, the lens mounting body 31 has a ring structure, and has a lens barrel accommodating cavity 330 therein, the lens barrel accommodating cavity 330 forms a through cavity in the lens mounting body 31 and corresponds to at least one opening of the prism mounting body 32, meanwhile, the light emitting surface of the color combining prism 21 is disposed towards the lens barrel accommodating cavity 330, the optical lens 22 is mounted in the lens barrel accommodating cavity 330 of the lens mounting body 31, one side of the lens accommodating position 330 forms a lens light emitting hole 350, the lens light emitting hole 350 is communicated with the lens barrel accommodating position 330, the overall shape of the lens mounting body 31 is similar to the shape of the outermost ring of the lens barrel 220, and the size of the lens barrel accommodating position 330 is slightly larger than the size of the outermost ring of the lens barrel 220 so as to accommodate the lens barrel 220 with sufficient space; the lens mounting body 31 further has a lens avoiding groove 340, the lens avoiding groove 340 is located at two opposite sides of the lens mounting body 31 and is communicated with the lens barrel accommodating cavity 330, when the lens barrel 220 and the lens mounting body 31 are assembled, the lens barrel 220 and the lens mounting body 31 are fixed by the adhesive, the lens avoiding groove 340 can provide overflow space for the redundant adhesive, and the adhesive is prevented from deforming and extruding the lens barrel 220 when heated and baked.

The prism mounting body 32 has a prism mounting position 360 formed therein, the color combining prism 21 is mounted in the prism mounting position 360 in the prism mounting body 32, and the prism mounting body 32 is formed as a cube as a whole, wherein four side walls have openings. The openings are generally rectangular, and at least one opening has a size slightly larger than the side wall size of the color combining prism 21, and in some alternative embodiments, three openings have a size slightly smaller than the side wall size of the corresponding color combining prism 21. Four side walls of the prism mounting body 32 have four openings, and the four side openings are all communicated with the prism mounting position 360, the other two side walls of the prism mounting body 32 are closed, the two side walls are opposite side walls, one side opening faces the lens mounting body 31, at least three side walls of the prism mounting body 32 having openings are used for mounting the first projection assembly 11, the second projection assembly 12 and the third projection assembly 13, and the other opening having the side wall having the opening is an imaging through hole 361, so that light can be projected from the color combining prism 21 to the optical lens 22. The rib formed in the area of the side wall opening periphery of the prism mounting body 32 forms a fixing frame 362, one side of the fixing frame 362 is open to face the lens mounting body 31, and a step 363 is provided on the other three sides of the fixing frame 362, respectively, for attaching the first projection module 11, the second projection module 12 and the third projection module 13, specifically, for attaching the wide top side surface of the projection module 10 correspondingly.

The prism mounting body 32 further includes a baffle 370 and a bearing body 380, the baffle 370 further includes a first baffle 371 and a second baffle 372, the baffle 370 is disposed on two sealing surfaces of the prism mounting body 32, i.e. the first baffle 371 is located on one sealing surface of the prism mounting body 32, and the second baffle 372 is located on the opposite sealing surface of the prism mounting body 32 to bear against the color combining prism 21; the bearing body 380 is located between the lens mounting body 31 and the prism mounting body 32, the bearing body 380 includes a bearing frame 381, a first light outlet 382 is provided in the middle of the bearing body 380, the shape of the first light outlet 382 is the same as the opening shape of the prism mounting body 32, i.e. the size of the first light outlet 382 is slightly larger than the size of the color combining prism 382; the supporting frame 381 is square, and the outer diameter of the supporting frame 381 is the maximum outer diameter of the lens base 30, i.e. the outer frame of the supporting frame 381 protrudes out of the prism mounting body 32, and the protruding structure of the supporting frame 381 is convenient for clamping the lens mounting body 31 and/or the prism mounting body 32 during the assembly of the optical module 1, so as to facilitate the assembly of the optical lens 22 and the projection assembly 10; the supporting frame 381 is integrally formed with the fixed frame 362 of the prism mounting body 32, and the other side is spliced with the lens mounting body 31, i.e. one side of the first light outlet 382 is communicated with the lens light outlet 350 of the lens mounting body 31, and the other side is communicated with the imaging through hole 361 of the prism mounting body 32, in other words, the first light outlet 382 is communicated with the lens barrel accommodating cavity 330 of the lens mounting body 31 and the prism mounting position 360 of the prism mounting body 32; in addition, the side of the supporting frame 381 near the lens mount 32 may be used to support the optical lens 22.

The color combining prism 21 is mounted on the prism mounting position 360 of the prism mounting body 32 through the first light exit 382 of the support body 380, and is adhered and fixed to the prism mounting body 32 by an adhesive.

In some alternative embodiments, for convenience of maintenance or adjustment, the lens mounting body 31 and the prism mounting body 32 are usually detachably spliced, and by setting a sealing structure at the splice, external moisture and dust can be prevented from entering the lens barrel accommodating position 330 of the lens mounting body 31 or the prism mounting position 360 of the prism mounting body 32 through the splice opening, thereby ensuring the working reliability of the optical machine.

Fig. 4B shows another embodiment of the lens holder 30, in which the lens mounting body 31 and the prism mounting body 32 are integrally formed, and the integrally formed structure may be formed by a molding process, such as integral injection molding or metal die casting, and if the integrally formed structure is formed by metal die casting, the precision of mounting the optical lens 22 and the color combining prism 21 may be improved by the structure of the lens holder 30, so that the subsequent process assembly is facilitated.

Specifically, the lens mounting body 31 has a lens barrel accommodation position 330 therein, the lens accommodation cavity 330 penetrates through the entire lens mounting body 31, so that the lens mounting body 31 is in an annular structure, the optical lens 22 is mounted in the lens barrel accommodation cavity 330 of the lens mounting body 31, a lens light outlet 350 is formed at one side of the lens accommodation position 330, the lens light outlet 350 is communicated with the lens barrel accommodation position 330, the overall shape of the lens mounting body 31 is similar to the shape of the outermost ring of the lens barrel 220, and the size of the lens barrel accommodation position 330 is slightly larger than the size of the outermost ring of the lens barrel 220, so as to accommodate the lens barrel 220 in a sufficient space; the lens mounting body 31 further has a lens avoiding groove 340, the lens avoiding groove 340 is located at two opposite sides of the lens mounting body 31 and is communicated with the lens barrel accommodating cavity 330, when the lens barrel 220 and the lens mounting body 31 are assembled, the lens barrel 220 and the lens mounting body 31 are fixed by the adhesive, the lens avoiding groove 340 can provide overflow space for the redundant adhesive, and the adhesive is prevented from deforming and extruding the lens barrel 220 when heated and baked.

In the invention, since the light is emitted by the light emitting chip 110, the light emitting chip 110 has higher loss, and generates more heat, the heat can raise the temperature inside the optical machine module 1, thereby affecting the imaging quality of the optical machine module 1, and the metal substrate 140 arranged at the bottom of the first projection component 11 assists in heat dissipation, and the invention also provides another heat dissipation structure to fully guide out the heat generated in the working process of the optical machine module 1 and ensure the imaging quality of the optical machine module 1. As shown in fig. 7, the present invention further includes a heat dissipation portion 40, wherein the heat dissipation portion 40 is mainly composed of a heat dissipation body 41, the heat dissipation body 41 is disposed on the outer side of the lens holder portion 30 to form a coating effect on a part of the lens holder portion 30, and specifically, the heat dissipation body 41 is further composed of three U-shaped side surfaces, namely, a first heat dissipation fin 410, a second heat dissipation fin 420 and a third heat dissipation fin 430.

In one embodiment, the first heat sink 410 corresponds to cover the bottom surface of the first projection assembly 11, the second heat sink 420 corresponds to cover the bottom surface of the second projection assembly 11, and the third heat sink 430 corresponds to cover the bottom surface of the third projection assembly 13, wherein the first heat sink 410, the second heat sink 420 and the third heat sink 430 are attached to the back surface of the projection assembly, and the first heat sink 410, the second heat sink 420 and the third heat sink 430 may be copper foils, or other metals or heat sinks with good heat dissipation properties, without limitation. In another alternative embodiment, the first heat sink 410, the second heat sink 420 and the third heat sink 430 in the heat sink 41 may be integrally formed into a single structure, and the heat sink 41 is attached and fixed along the mounting positions of the first projection module 11, the second projection module 12 and the third projection module 13, so that the heat sink 41 after fixing can cover part of the structure of the projection module inside the heat sink 41 to form a good heat dissipation effect on the optomechanical module 1, and further increase the heat dissipation area.

In some alternative embodiments, the heat sink 41 is directly attached to the bottom surface of the light emitting chip 110, and the non-light emitting area 112 of the light emitting chip 110 and the circuit board 130 can be integrally packaged by the molding base 150 by virtue of the integral packaging of the molding base 150, without fixing the light emitting chip 110 and the circuit board 130 through a metal substrate.

In the optical-mechanical module 1 provided by the invention, as shown in fig. 9, a plurality of light emitting chips with different colors are combined to form a color-combining optical-mechanical module, in order to ensure that light rays emitted by the light emitting chips in the optical-mechanical module 1 are combined and finally emitted along the same direction, that is, the light rays emitted by the light emitting chips are converged by the color-combining prism 21 to be emitted in one direction, wherein the color-combining prism 21 has a cube structure, and a plurality of light emitting chips can be arranged on different sides of the color-combining prism 21. In order to ensure that the light collected by the color combining prism 21 is emitted through the optical lens 22, it is necessary to make the light emitting direction of the light emitting prism 21 coincide with the optical axis direction of the optical lens 22, that is, to ensure the accuracy of the mounting positions of the optical lens 22 and the color combining prism 21. By designing the structure of the lens base 30 so that the optical lens 22 and the color combining prism 21 are fixed on the same lens base 30, the lens base 30 specifically comprises a lens mounting body 31 and a prism mounting body 32, the consistency of the optical paths of the optical lens 22 and the color combining prism 21 is ensured by the structure of the lens base 30, and the subsequent assembly process can be simplified while the mounting precision of the optical lens 22 and the color combining prism 21 is improved.

In summary, the present application provides a color combining camera module 1, which includes a lens portion 30; an optical unit 20; and at least one projection assembly 10, wherein the lens holder 30 comprises a lens mounting body 31 and a prism mounting body 32, the optical portion 20 comprises an optical lens 22 mounted on the lens mounting body 31 and a color combining prism 21 mounted on the prism mounting body 32, the prism mounting body 32 has at least two side openings, at least one side opening corresponds to the optical lens 22, the other side openings correspond to the projection assembly 10, the projection path of the projection assembly 10 is converged at the center of the color combining prism 21 and projected to the optical lens 22, the projection assembly 10 comprises a circuit board 130 and a light emitting chip 110 electrically connected to the circuit board 130, and the light emitting chip 110 is eccentrically arranged relative to the circuit board 130. By the eccentric arrangement of the light emitting chips 110, all the projection assemblies 10 can be biased toward the same side wall of the prism mount 32, so that the module can be miniaturized.

Specifically, in one example, at least one of the projection assemblies 10 includes three projection assemblies, i.e., the first projection assembly 11, the second projection assembly 12, and the third projection assembly 13, and the light emitting chips 110 of the three projection assemblies are eccentrically disposed in directions close to the same side wall of the prism mounting body. The prism mount 32 has four side openings, one of which corresponds to the optical lens 22, and the remaining three side openings correspond to the first projection assembly 11, the second projection assembly 12, and the third projection assembly 13, respectively. Further, the circuit board 130 includes a hard circuit board 131 and a flexible circuit board 132 led out from one end of the hard circuit board 131, the light emitting chip 110 is eccentrically disposed with respect to the hard circuit board 132, and the extending direction of the flexible circuit board 132 of the three projection components is opposite to the eccentric direction of the light emitting chip 110, wherein the extending direction of the flexible circuit board 132 refers to the extending direction of the flexible circuit board 132 after being led out from one end of the hard circuit board 131. Through the eccentric arrangement, the three flexible circuit boards 132 are further extended towards one direction, so that the color combining camera module 1 is simpler and easier to install.

Specifically, in one example, the light emitting chip 110 is conducted with the hard wiring board 131 of the wiring board 130 by a wire, the hard wiring board 131 has a non-wiring connection end 1312 and a wiring connection end 1313, the wiring connection end 1313 is a side of the hard wiring board 131 for conducting with the light emitting chip 110, the non-wiring connection end 1312 is a side of the hard wiring board 131 where a wiring conducting point for conducting with the light emitting chip 110 is not provided, and the non-wiring connection end 1312 is located in an eccentric direction of the light emitting chip 110.

Specifically, in one example, the hard wiring board 131 has a through hole 1311, the light emitting chip 110 is accommodated in the through hole 1311 of the hard wiring board 131, the projection assembly 10 further includes a metal substrate 140 disposed on the lower surface of the hard wiring board 131, and the light emitting chip 110 accommodated in the through hole 1311 of the hard wiring board 131 is attached to the metal substrate 140.

Specifically, in one example, the color combining camera module 1 further includes a heat dissipation portion 40 provided on the peripheral side of the prism mounting body 32 of the lens holder portion 30, the heat dissipation portion 40 covering at least a portion of the projection assembly 10. In one example of the present application, the light emitting chip 110 is attached to the metal substrate 140, the heat dissipating part 40 is provided at the peripheral side of the lens part 30, and the heat dissipating part 40 is attached to the metal substrate 140, thereby indirectly dissipating heat of the light emitting chip 110; in another example of the present application, the heat sink 40 is directly attached to the back surface of the light emitting chip 110, and the front surface of the light emitting chip 110 is adapted to emit light, and the back surface of the light emitting chip 110 is opposite to the front surface thereof.

Specifically, in one example, the heat sink 40 includes a first heat sink 410, a second heat sink 420, and a third heat sink 430 distributed in a U-shape, the first heat sink 410 corresponding to the back surface of the first projection assembly 11, the second heat sink 420 corresponding to the back surface of the second projection assembly 12, and the third heat sink 430 corresponding to the back surface of the third projection assembly 13.

Specifically, in one example, the projection assembly 10 further includes a molded base 150 integrally formed on the circuit board 130. The molding base 150 integrally formed on the circuit board 130 through the molding process not only has a flat top surface, but also improves the heat dissipation performance of the hybrid camera module 1. In a specific example, the molding base 150 is integrally formed on the upper surface of the hard wiring board 131, wherein the light emitting chip 110 includes a light emitting region 111 and a non-light emitting region 112 disposed at a peripheral side of the light emitting region 111, and the molding base 150 further covers at least a portion of the non-light emitting region 112.

Specifically, in one example, the light emitting chip 110 is eccentrically disposed to the hard wiring board 131, and the top surface of the molding base 150 has three sides of a narrow top surface and one side of a wide top surface, wherein the molding base 150 has a narrower width at one side of the eccentric disposition of the light emitting chip 110, and the wide top surface of the molding base 150 is adjacent to the flexible wiring board 132. One side of the molded base 150 having a wide top surface is coated with wires electrically connecting the light emitting chip 110 and the hard wiring board 131, so that the projection assembly 10 has an extremely narrow side, thereby enabling the size of the color combining camera module to be reduced.

Specifically, in one example, the non-light emitting region 112 of the light emitting chip 110 has a plurality of conductive points, and at least two adjacent conductive points of the plurality of conductive points are electrically connected to the hard circuit board 131 of the circuit board 130 after being connected in series. Since the light emitting chip is generally a general-purpose element having a plurality of conducting points for different applications from a scene, in the present application, at least two adjacent conducting points are connected in series by using wires and then electrically connected to the circuit board 130, the number of wires can be greatly reduced, thereby simplifying the manufacturing process and simplifying the structure of the projection assembly.

The foregoing has outlined the basic principles, features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A color combining camera module, comprising:

a lens base;

an optical unit; and

2. The color combining camera module of claim 1, wherein the circuit board comprises a hard circuit board and a flexible circuit board led out from one end of the hard circuit board, the hard circuit board having a through hole, the light emitting chip being accommodated in the through hole of the hard circuit board.

3. The hybrid optoelectronic module of claim 2, wherein the projection assembly further includes a metal substrate disposed on a lower surface of the rigid wiring board, the light emitting chip being attached to the metal substrate.

4. The color combiner module according to claim 3, further comprising a heat sink portion provided on a peripheral side of the lens holder portion, the heat sink portion being attached to the metal substrate.

5. The color combining camera module according to claim 2, further comprising a heat dissipation portion provided on a peripheral side of the lens portion, the heat dissipation portion being attached to a back surface of the light emitting chip.

6. The color combiner module according to any one of claims 1 to 5, wherein the lens mount comprises a lens mount and a prism mount, the optical part comprises an optical lens mounted to the lens mount and a color combining prism mounted to the prism mount, the prism mount has at least two side openings, at least one of the side openings corresponds to the optical lens, the remaining side openings correspond to the projection assembly, and a projection path of the projection assembly is converged to a center of the color combining prism and projected to the optical lens.

7. The color combining camera module of claim 6, wherein at least one of the projection assemblies comprises three projection assemblies, namely a first projection assembly, a second projection assembly and a third projection assembly, wherein the light emitting chips are eccentrically arranged relative to the circuit board, and the eccentric arrangement directions of the light emitting chips of the three projection assemblies are all close to the same side wall of the prism mounting body.

8. The hybrid camera module of claim 7, wherein the heat sink includes first, second, and third heat sinks in a U-shaped distribution, the first heat sink corresponding to the back of the first projection assembly, the second heat sink corresponding to the back of the second projection assembly, and the third heat sink corresponding to the back of the third projection assembly.

9. The color combining camera module of claim 7, wherein the projection assembly further comprises a light transmissive cover plate disposed over the light emitting chip, the light transmissive cover plate being eccentrically disposed to one side of the projection assembly.

10. The color combining camera module of claim 6, wherein the projection assembly further comprises a molded base integrally formed on the upper surface of the circuit board, the molded base forming a light window corresponding to the light emitting chip.