CN117835638A - Heat pipe radiating module - Google Patents
Heat pipe radiating module Download PDFInfo
- Publication number
- CN117835638A CN117835638A CN202211187673.3A CN202211187673A CN117835638A CN 117835638 A CN117835638 A CN 117835638A CN 202211187673 A CN202211187673 A CN 202211187673A CN 117835638 A CN117835638 A CN 117835638A
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- CN
- China
- Prior art keywords
- heat pipe
- heat
- copper powder
- pipe
- processor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000012530 fluid Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat pipe radiating module, which comprises a plurality of first heat pipes, wherein a plurality of narrow grooves and first copper powder are concavely formed on the inner wall surface of each first heat pipe, and the first copper powder is sintered outside the notch of each narrow groove; a plurality of second heat pipes, wherein a plurality of wide grooves and a plurality of second copper powder are concavely formed on the inner wall surface of each second heat pipe, and the second copper powder is sintered and filled in each wide groove; one end of each first heat pipe and one end of each second heat pipe are fixedly arranged on the heat dissipation device, and the other end of each first heat pipe is positioned between the other ends of each second heat pipe; by fixing the other end of each first heat pipe at the heat source position of a processor, the other end of each second heat pipe is fixed at the position adjacent to the outer side of the processor, and compared with the heat pipes with the same specification, the heat generated by the processor can be more effectively and uniformly transferred.
Description
Technical Field
The present invention relates to a heat dissipation device, and more particularly, to a heat pipe heat dissipation module for dissipating heat from a processor.
Background
The operation efficiency of the processor is increased year by year, the heat generated by the wafers arranged in the opposite inner parts is synchronously increased, the operation efficiency of the whole wafer is reduced and the service life is even influenced by high temperature, so the related product with the heat dissipation function is correspondingly provided, the main heat dissipation device mainly comprises a heat pipe for dissipating heat of the processor, the main structure of the heat pipe comprises a pipe body, the pipe body is a closed space, a plurality of grooves are formed on the inner wall surface of the pipe body, a sintering part formed by copper powder is formed on the surface of each groove, working fluid is filled in the pipe body, one end of the pipe body is connected with the processor to be a heat absorption end, the other end of the pipe body is connected with a heat dissipation device to be a heat dissipation end, and the working fluid in the pipe body is vaporized by virtue of the heat absorption end, is liquefied and then is conveyed to the heat absorption end by virtue of a capillary structure of the sintering part after moving to the heat dissipation end, so that the continuously circulated gas-liquid phase changes and back and forth convection, and the heat transfer effect of the pipe body is achieved.
At present, the form of the heat pipe includes a grooved heat pipe, a sintered heat pipe, a mesh-type braided heat pipe and a composite heat pipe according to the internal capillary structure, and the different capillary structures have advantages and limitations, wherein the composite heat pipe mainly improves the disadvantages of the existing heat pipe, specifically, because the working fluid in the heat pipe has two phases of vapor phase and liquid phase, and the flowing directions of the liquid phase and the vapor phase are opposite, the working fluid can interfere with each other in the flowing process, thereby influencing the heat dissipation efficiency of the heat pipe, and the composite heat pipe is composed of two or more capillary structures, for example, grooves are added with sintering, or grooves are added with a braided net, thereby improving the heat transfer amount and the flowing efficiency of two-phase flow.
However, even in the composite heat pipe, the increase of the volume of the internal capillary structure improves the flowing efficiency of the liquid working fluid, but the flowing space of the gaseous working fluid in the pipe is reduced, so that the heat dissipation efficiency is affected; therefore, how to effectively use the characteristics of the composite heat pipe to maximize the heat dissipation efficiency is a significant and improved problem.
Disclosure of Invention
In view of the shortcomings of the prior art, the invention provides a heat pipe heat dissipation module, which achieves the purpose of evenly dissipating heat of a processor by arranging a first heat pipe and a second heat pipe.
In order to achieve the above object, the present invention provides a heat pipe heat dissipation module, comprising:
the inner wall surface of each first heat pipe is concavely provided with a plurality of narrow grooves and first copper powder, each narrow groove extends towards the other end along one end of the first heat pipe, and the first copper powder is fixedly arranged outside the notch of each narrow groove;
the inner wall surface of each second heat pipe is concavely provided with a plurality of wide grooves and second copper powder, each wide groove extends towards the other end along one end of the second heat pipe, and the second copper powder is fixedly arranged and filled in each wide groove;
one end of each first heat pipe is fixedly arranged on the heat radiating device, one end of each second heat pipe is fixedly arranged on the heat radiating device, and the other end of each first heat pipe is positioned between the other ends of the second heat pipes.
Further, in the heat pipe heat dissipation module, the outer diameter of the first copper powder is larger than the width of each narrow groove.
Further, in the heat pipe heat dissipation module, the outer diameter of the second copper powder is smaller than the width of each wide groove.
Furthermore, the heat pipe heat dissipation module further comprises a connecting sheet, wherein the connecting sheet is a metal sheet, and the other end of each first heat pipe and the other end of each second heat pipe are fixedly arranged on one side surface of the connecting sheet.
Furthermore, the heat pipe heat dissipation module is characterized in that the heat dissipation device is a plurality of heat dissipation fins, and the heat dissipation fins are arranged at intervals.
In addition, the heat pipe heat dissipation module is characterized in that the other end of each first heat pipe and the other end of each second heat pipe are positioned on the same horizontal plane.
The invention has the advantages that by fixing one end of each first heat pipe at the heat source position of the processor and fixing one end of each second heat pipe at the position adjacent to the outer side of the processor, the invention can utilize the characteristics of the first heat pipes to conduct the heat generated by the heat source of the processor to the other end for radiating action in a mode of less heat conducted in unit time but more circulation times, and utilize the characteristics of the second heat pipes, namely the characteristics of fast heat absorption and slow back flow of working fluid, to conduct the heat generated by the outer side of the processor to the other end for radiating action in a mode of more heat conducted in unit time but less circulation times, thus compared with the heat pipes with the same specification, the invention can more uniformly transfer the heat generated by the processor, reduce the temperature difference of different positions of the processor body and improve the radiating effect.
Drawings
Fig. 1 is a schematic view of the appearance of the present invention.
Fig. 2 is a partial enlarged view of a first heat pipe according to the present invention.
Fig. 3 is a partial enlarged view of a second heat pipe according to the present invention.
Fig. 4 is an external view of another embodiment of the present invention.
Detailed Description
The technical means adopted by the present invention to achieve the intended purpose of the present invention will be further described below with reference to the drawings and the preferred embodiments of the present invention.
Referring to fig. 1, the heat pipe heat dissipation module of the present invention includes a plurality of first heat pipes 10, a plurality of second heat pipes 20, and at least one heat dissipation device 30.
Referring to fig. 1 and 2, the inner wall surface of each first heat pipe 10 is concavely formed with a plurality of narrow grooves 11 and first copper powder 12, each narrow groove 11 extends along one end of the first heat pipe 10 towards the other end, each narrow groove 11 forms an annular wavy shape as a whole when viewed from the cross section, in other words, the first copper powder 12 is fixedly arranged on the inner wall surface of each narrow groove 11 but not fixedly arranged in each narrow groove 11 of the first heat pipe 10, so that the inside of each narrow groove 11 can be kept as a smooth space, in this embodiment, the outer diameter of the first copper powder 12 is larger than the width of each narrow groove 11, but not limited thereto, only the first copper powder 12 can be reached without being fixedly arranged in each narrow groove 11.
Referring to fig. 1 and 3, the inner wall surface of each second heat pipe 20 is concavely formed with a plurality of wide grooves 21 and second copper powder 22, each wide groove 21 extends along one end of the second heat pipe 20 towards the other end, each wide groove 21 forms an annular wavy shape as a whole when viewed from the cross section, the second copper powder 22 is fixedly filled in each wide groove 21, in this embodiment, the outer diameter of the second copper powder 22 is smaller than the width of each wide groove 21, but the second copper powder 22 only needs to be fixedly filled in each wide groove 21, without limitation.
One end of each first heat pipe 10 is fixedly arranged on the heat dissipating device 30, one end of each second heat pipe 20 is fixedly arranged on the heat dissipating device 30, the other end of each first heat pipe 10 is positioned between the other ends of each second heat pipe 20, in this embodiment, the heat dissipating device 30 is a plurality of heat dissipating fins, each heat dissipating fin is arranged at intervals, one end of each first heat pipe 10 and one end of each second heat pipe 20 are fixedly arranged on the heat dissipating device 30 in a penetrating way, and the other ends of each first heat pipe 10 and the other ends of each second heat pipe 20 are positioned on the same horizontal plane, but not limited to this, the form of the heat dissipating device 30 can be changed according to the requirements of users.
When the heat pipe is used, as shown in fig. 1 to 3, the heat pipe can be implemented by matching with a processor 40, the other end of each first heat pipe 10 and the other end of each second heat pipe 20 are fixedly arranged on one side of the processor 40, specifically, the other end of each first heat pipe 10 is fixedly arranged at a position adjacent to the center of the processor 40, the center of the processor 40 is a heat source, the temperature is usually highest, the other end of each second heat pipe 20 is fixedly arranged at a position adjacent to the outer side of the processor 40, the temperature is usually lower, and the configuration mode is mainly based on the characteristics of the first heat pipe 10 and the second heat pipe 20, and the structural characteristics of the first heat pipe 10 are that the two sides of the first copper powder 12 are provided with clear narrow grooves 11 and flowing spaces, so that the heat pipe has the characteristics of low heat absorption and high power with high reflux of working fluid, and the heat generated by the heat source of the processor 40 can be conducted to the other end in a mode of less heat conduction quantity and more circulation times in unit time; the second heat pipe 20 is structurally characterized in that the second copper powder 22 fills the wide groove 21, so that the inner wall surface of the second heat pipe 20 is smooth, compared with the first heat pipe 10, the heat pipe has the characteristics of quick heat absorption and slow reflux of working fluid, and can conduct the heat generated by the outer side of the processor 40 at lower temperature to the other end for radiating action in a mode of more heat conducted in unit time but less cycle times, thus compared with the prior art which uses the heat pipe with the same specification, the heat generated by the processor 40 can be more efficiently and uniformly transferred, the temperature difference of different positions of the processor 40 body is reduced, and the radiating effect is improved.
Referring to fig. 4, in another embodiment of the present invention, the first heat pipe 10, the second heat pipe 20 and the heat dissipating device 30 are the same as those of the previous embodiments, and the main difference is that the heat dissipating device further comprises a connecting piece 50, wherein the connecting piece 50 is a metal sheet with good heat conductivity, such as a copper sheet, and the other end of each first heat pipe 10 and the other end of each second heat pipe 20 are fixed on one side of the connecting piece 50, but not limited thereto, the form of the connecting piece 50 can be changed according to the requirement of the user; in use, the other side of the connecting piece 50 is covered and fixed on one side of the processor 40, thereby increasing the contact area with the processor 40 and improving the heat conduction efficiency.
The present invention is not limited to the above embodiments, but is capable of modification in all aspects and variations in all aspects without departing from the spirit and scope of the present invention.
Claims (6)
1. A heat pipe heat dissipation module, comprising:
the inner wall surface of each first heat pipe is concavely provided with a plurality of narrow grooves and first copper powder, each narrow groove extends towards the other end along one end of the first heat pipe, and the first copper powder is fixedly arranged outside the notch of each narrow groove;
the inner wall surface of each second heat pipe is concavely provided with a plurality of wide grooves and second copper powder, each wide groove extends towards the other end along one end of the second heat pipe, and the second copper powder is fixedly arranged and filled in each wide groove;
one end of each first heat pipe is fixedly arranged on the heat radiating device, one end of each second heat pipe is fixedly arranged on the heat radiating device, and the other end of each first heat pipe is positioned between the other ends of the second heat pipes.
2. The heat pipe heat removal module as defined in claim 1, wherein the first copper powder has an outer diameter greater than the width of each of the narrow grooves.
3. A heat pipe heat removal module as claimed in claim 1 or 2, wherein said second copper powder has an outer diameter less than the width of each of said wide grooves.
4. The heat pipe heat dissipation module as set forth in claim 3, further comprising a connecting piece, wherein the connecting piece is a metal sheet, and the other end of each first heat pipe and the other end of each second heat pipe are fixed on a side surface of the connecting piece.
5. The heat pipe heat dissipation module as defined in claim 4, wherein the heat dissipation device is a plurality of heat dissipation fins, and each heat dissipation fin is arranged at intervals.
6. The heat pipe heat dissipation module as defined in claim 5, wherein the other end of each first heat pipe is located at the same level as the other end of each second heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211187673.3A CN117835638A (en) | 2022-09-28 | 2022-09-28 | Heat pipe radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211187673.3A CN117835638A (en) | 2022-09-28 | 2022-09-28 | Heat pipe radiating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117835638A true CN117835638A (en) | 2024-04-05 |
Family
ID=90513861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211187673.3A Pending CN117835638A (en) | 2022-09-28 | 2022-09-28 | Heat pipe radiating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117835638A (en) |
-
2022
- 2022-09-28 CN CN202211187673.3A patent/CN117835638A/en active Pending
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