CN117835531A - Flexible circuit, manufacturing method thereof and electronic device - Google Patents
Flexible circuit, manufacturing method thereof and electronic device Download PDFInfo
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- CN117835531A CN117835531A CN202410091924.0A CN202410091924A CN117835531A CN 117835531 A CN117835531 A CN 117835531A CN 202410091924 A CN202410091924 A CN 202410091924A CN 117835531 A CN117835531 A CN 117835531A
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- flexible circuit
- flexible substrate
- dielectric layer
- flexible
- layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- -1 Polydimethylsiloxane Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920005839 ecoflex® Polymers 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The disclosure provides a flexible circuit, a manufacturing method thereof and an electronic device. The flexible circuit includes: a flexible substrate; a dielectric layer formed as a dielectric pattern disposed on the flexible substrate and having a wrinkled microstructure; and an electrode layer, the wrinkled microstructure being configured such that, when the electrode layer is formed by coating a conductive material on the flexible substrate, the conductive material adheres to the dielectric layer such that the electrode layer is formed as an electrode pattern located between the dielectric patterns.
Description
Technical Field
The disclosure relates to the technical field of flexible circuit preparation, in particular to a flexible circuit with a wrinkled microstructure, a manufacturing method thereof and an electronic device.
Background
Current methods for manufacturing flexible circuits mainly include modification of the shape of the wires (e.g., providing a curve), and patterning of the wires with flexible conductive materials. However, the flexible circuit is manufactured by using the shape of the improved wire, the manufacturing process is complex, and the manufacturing cost is high. The conductive wire prepared from the flexible conductive material has lower conductivity, and a circuit pattern with higher precision is difficult to form due to the material characteristics of the flexible conductive material, so that a finer flexible circuit is difficult to manufacture.
Disclosure of Invention
In order to at least partially overcome at least one of the above-mentioned technical defects or other technical defects of the invention, at least one embodiment of the present disclosure provides a flexible circuit, a manufacturing method thereof, and an electronic device, and a flexible circuit with higher precision can be manufactured.
In view of this, embodiments of the present disclosure provide a flexible circuit comprising: a flexible substrate; a dielectric layer formed as a dielectric pattern disposed on the flexible substrate and having a pleated microstructure; and an electrode layer configured to prevent the conductive material from adhering to the dielectric layer when the electrode layer is formed by coating the conductive material on the flexible substrate such that the electrode layer is formed as an electrode pattern between the dielectric patterns.
Optionally, the dielectric layer comprises a carbon layer.
Optionally, the electrical material comprises a semi-liquid metal.
Optionally, the semi-liquid metal includes any one of a gallium-based alloy, a bismuth-based alloy, and a bismuth-based alloy.
Optionally, the electrode layer comprises at least one wire, the wire having a width of less than 10 μm.
The embodiment of the disclosure provides a manufacturing method suitable for the flexible circuit, which comprises the following steps: step S1: stretching the flexible substrate; step S2: preparing an initial dielectric layer with a graphic structure on the stretched flexible substrate; step S3: restoring the shape of the flexible substrate, and forming a wrinkled microstructure on the initial dielectric layer to form a dielectric layer; step S4: and forming an electrode layer on a part of the flexible substrate which is not covered by the dielectric layer, so as to form the flexible circuit.
Optionally, step S2 includes: printing carbon powder particles on a thermal transfer substrate in a certain pattern; covering a heat transfer printing substrate with carbon powder particles on the stretched flexible substrate; and transferring the carbon powder particles to a flexible substrate by pressurizing and heating to separate the carbon powder particles from the thermal transfer substrate, thereby forming the initial dielectric layer with the graphic structure.
Optionally, step S4 includes: coating semi-liquid metal on the surface of the elastic roller; and rolling the semi-liquid metal on the portion of the flexible substrate not covered by the dielectric layer based on the corrugated microstructure using a resilient roller coated with the semi-liquid metal.
Optionally, the manner in which the flexible substrate is stretched includes uniaxial stretching and multiaxial stretching.
The embodiment of the disclosure provides an electronic device, comprising: a flexible circuit as described above; an electronic patch disposed on the flexible circuit; an electronic component disposed on the electronic patch and electrically connected to the flexible circuit based on the electronic patch; and an encapsulation layer covering a portion of the flexible circuit not covered by the electronic patch.
According to the flexible circuit, the manufacturing method thereof and the electronic device, the medium layer is formed into the medium pattern with the wrinkled microstructure, the wrinkled microstructure can prevent conductive materials from adhering to the medium layer, the electrode layer can form electrode patterns between the medium patterns, and therefore the electrode patterns can be indirectly formed in a mode of coating the conductive materials, namely, the electrode patterns can be determined through the medium patterns, and further the flexible circuit with high precision can be manufactured.
Drawings
Fig. 1 is a partial top view of a flexible circuit according to an exemplary embodiment of the present disclosure.
Fig. 2 is a partial front view of a flexible circuit according to an exemplary embodiment of the present disclosure.
Fig. 3 is a perspective view of a flexible circuit according to an exemplary embodiment of the present disclosure, wherein the dielectric layer is not shown.
Fig. 4-5 are comparative diagrams of a flexible substrate before and after stretching according to an exemplary embodiment of the present disclosure.
Fig. 6 is a side view of an initial dielectric layer prepared on a stretched flexible substrate according to an exemplary embodiment of the present disclosure.
Fig. 7 is a perspective view of an electronic device according to an exemplary embodiment of the present disclosure.
In the drawings, the reference numerals specifically have the following meanings:
100. a flexible circuit;
1. a flexible substrate;
2. a dielectric layer;
21. a pleated microstructure;
3. an electrode layer;
31. a wire;
4. an initial dielectric layer;
200. an electronic patch;
300. an electronic component;
400. and an encapsulation layer.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
It should be understood that the description is only exemplary and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In addition, in the following description, descriptions of well-known techniques are omitted so as not to unnecessarily obscure the concepts of the present disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The term "comprising" as used herein indicates the presence of a feature, step, operation, but does not preclude the presence or addition of one or more other features.
Where expressions like at least one of "A, B and C, etc. are used, the expressions should generally be interpreted in accordance with the meaning as commonly understood by those skilled in the art (e.g.," a system having at least one of A, B and C "shall include, but not be limited to, a system having a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a formulation similar to at least one of "A, B or C, etc." is used, in general such a formulation should be interpreted in accordance with the ordinary understanding of one skilled in the art (e.g. "a system with at least one of A, B or C" would include but not be limited to systems with a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).
Fig. 1 is a partial top view of a flexible circuit according to an exemplary embodiment of the present disclosure. Fig. 2 is a partial front view of a flexible circuit according to an exemplary embodiment of the present disclosure. Fig. 3 is a perspective view of a flexible circuit according to an exemplary embodiment of the present disclosure, wherein the dielectric layer is not shown.
As shown in fig. 1-3, embodiments of the present disclosure provide a flexible circuit. The flexible circuit may include a flexible substrate 1, a dielectric layer 2, and an electrode layer 3. The flexible substrate 1 may be made of a high molecular polymer material. Preferably, the high polymer material may be one of Polydimethylsiloxane (PDMS), ecoflex, thermoplastic polyurethane elastomer (Thermoplastic polyurethanes, TPU), and thermoplastic elastomer. The thermoplastic elastomer may be styrene (Styrenic Block Copolymers, SBS). The media layer 2 may be formed as a pattern of media disposed on the flexible substrate 1 and have a pleated microstructure 21. The media pattern may have gaps. The pleated microstructure 21 may be configured to prevent the conductive material from adhering to the dielectric layer 2 when the electrode layer 3 is formed by coating the conductive material on the flexible substrate 1. The conductive material has a difference in adhesion between the wrinkled microstructure 21 and the flexible substrate 1, respectively. The pleated microstructure 21 may prevent the conductive material from adhering to the dielectric layer 2 during the application of the conductive material to the flexible substrate 1. I.e. the conductive material may be coated only on the portions of the flexible substrate 1 not covered by the dielectric layer 2, so that the electrode layer 3 may be formed as an electrode pattern located between the dielectric patterns.
According to the flexible circuit, the manufacturing method thereof and the electronic device of the above embodiments of the present disclosure, the medium layer 2 is formed into the medium pattern having the wrinkled microstructure 21, the wrinkled microstructure 21 can prevent the conductive material from adhering to the medium layer 2, so that the electrode layer 3 can form the electrode pattern between the medium patterns, and the electrode pattern can be indirectly formed by using the manner of coating the conductive material, that is, the electrode pattern can be determined by the medium pattern, and further the flexible circuit with higher precision can be manufactured.
In some embodiments, dielectric layer 2 may comprise a carbon layer. The carbon layer may be made of graphite.
In some embodiments, the electrical material comprises a semi-liquid metal. The semi-liquid metal may be a metal having a lower melting point. For example, an alloy that can be kept in a liquid state at room temperature may be used.
In some embodiments, the semi-liquid metal may include any one of a gallium-based alloy, a bismuth-based alloy, and a bismuth-based alloy. The electrode layer 3 may include at least one wire 31. The conductive line 31 may form an electrode pattern. Since the electrode pattern can be determined by the dielectric pattern, the wire 31 having a narrow width can be prepared. The width of the wire 31 may be less than 10 μm. The conductivity and structural stability of the wire 31 can be improved by preparing the wire 31 using semi-liquid metal. The electrode layer 3 is prepared by using semi-liquid metal, so that the preparation is simpler, and the raw materials are less in loss and energy consumption.
Fig. 4-5 are comparative diagrams of a flexible substrate before and after stretching according to an exemplary embodiment of the present disclosure. Fig. 6 is a side view of an initial dielectric layer prepared on a stretched flexible substrate according to an exemplary embodiment of the present disclosure.
Embodiments of the present disclosure provide a method of manufacturing a flexible circuit suitable for use in the above-described illustration. The method may include the following steps S1 to S4.
In step S1, the flexible substrate 1 is stretched. For example, the flexible substrate 1 is stretched from the state of fig. 4 to the state of fig. 5.
In step S2, an initial dielectric layer 4 having a patterned structure is prepared on the flexible substrate 1 after stretching. The initial dielectric layer 4 may be as shown in fig. 6.
In step S3, the flat shape of the flexible substrate 1 is restored, and the original dielectric layer 4 is formed into the pleated microstructure 21 to form the dielectric layer 2, as shown in fig. 2.
In step S4, the electrode layer 3 is formed on the portion of the flexible substrate 1 not covered with the dielectric layer 2, forming a flexible circuit, as shown in fig. 1. The part of the flexible circuit not covered by the initial dielectric layer 4 is in a flat shape, and the flexible substrate 1 of the flexible circuit covered by the initial dielectric layer 4 is in a flat shape.
In some embodiments, step S2 may include: the toner particles are printed on the thermal transfer substrate in a pattern. A thermal transfer substrate with toner particles is overlaid on the flexible substrate 1 after stretching. After the thermal transfer substrate is covered on the flexible substrate 1, the toner particles can be transferred onto the flexible substrate 1 by pressurizing and heating the toner particles away from the thermal transfer substrate. After the carbon powder particles are transferred onto the flexible substrate 1, an initial dielectric layer 4 having a patterned structure may be formed. The pattern of the toner particles may be set according to a preset circuit structure, thereby obtaining a target electrode pattern. The front and back sides of the thermal transfer substrate can be made of materials with different adhesion to carbon powder. The toner particles may be printed on the thermal transfer substrate using a laser printer.
In some embodiments, step S4 may include: semi-liquid metal is coated on the surface of the elastic roller. Semi-liquid metal is roll coated onto the flexible substrate 1 using a resilient roller coated with semi-liquid metal. Based on the low adhesion of the wrinkled microstructure 21 to the semi-liquid metal, the wrinkled microstructure 21 can prevent the semi-liquid metal from adhering to the dielectric layer 2 during the roll coating of the semi-liquid metal, so that the semi-liquid metal only adheres to the part of the flexible substrate 1 not covered by the dielectric layer 2.
In some embodiments, the manner in which the flexible substrate 1 is stretched includes uniaxial stretching and multiaxial stretching, i.e., single-direction stretching and multiple-direction stretching.
Fig. 7 is a perspective view of an electronic device according to an exemplary embodiment of the present disclosure.
As shown in fig. 7, an embodiment of the present disclosure further provides an electronic device. The electronic device may include a flexible circuit 100, an electronic patch 200, an electronic component 300, and an encapsulation layer 400 as shown above. The electronic patch 200 may be disposed on the flexible circuit 100. The electronic patch 200 may be printed on a preset position of the electrode pattern by means of screen printing. For example, the end of the wire 31 (the left end of the wire 31 as viewed in fig. 3). The electronic component 300 may be disposed on the electronic patch 200. The electronic component 300 may be electrically connected with the flexible circuit 100 based on the electronic patch 200. The end of the flexible circuit 100 remote from the electronic patch 200 (the right end of the wire 31 as viewed in fig. 3) may be connected with a power supply device to supply power to the electronic element 300. The end of the flexible circuit 100 remote from the electronic patch 200 (the right end of the wire 31 as viewed in fig. 3) may be connected with a detection device for detecting the electronic component 300. The flexible circuit 100 and the detection means or power supply means may be via a rigid metal wire 31. The rigid metal wire 31 may include, but is not limited to, copper and gold. The detection device may have a wireless transmission function to meet the requirements of the wearable application. The encapsulation layer 400 covers the portion of the flexible circuit 100 not covered by the electronic patch 200. The encapsulation layer 400 may be made of a flexible material according to an application scenario. The electronic patch 200 may be made of a conductive polymer (PEDOT: PSS).
According to the flexible circuit 100, the manufacturing method thereof and the electronic device of the above-mentioned embodiments of the present disclosure, the medium layer 2 is formed into the medium pattern having the wrinkled microstructure 21, the wrinkled microstructure 21 can prevent the conductive material from adhering to the medium layer 2, so that the electrode layer 3 can form the electrode pattern between the medium patterns, and thus the electrode pattern can be indirectly formed by coating the conductive material, that is, the electrode pattern can be determined by the medium pattern, and further the flexible circuit 100 with finer conductive wires 31, higher precision and strong stretchability can be manufactured, and the manufacturing method is simple, the operation is convenient, the processing efficiency is high, and the like. The electronic device may include a flexible electrode. The flexible electrode can realize high-flux and high-precision detection of various physiological electric signals of a human body, and can be used in various fields of medicine, intelligent robots, consumer electronics and the like.
Thus, embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the components are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
It should also be noted that, in the specific embodiments of the disclosure, unless otherwise noted, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present disclosure. In particular, all numbers expressing dimensions, range conditions, and so forth, used in the specification and claims are to be understood as being modified in all instances by the term "about". In general, the meaning of expression is meant to include a variation of + -10% in some embodiments, a variation of + -5% in some embodiments, a variation of + -1% in some embodiments, and a variation of + -0.5% in some embodiments by a particular amount.
Those skilled in the art will appreciate that the features recited in the various embodiments of the disclosure and/or in the claims may be provided in a variety of combinations and/or combinations, even if such combinations or combinations are not explicitly recited in the disclosure. In particular, the features recited in the various embodiments of the present disclosure and/or the claims may be variously combined and/or combined without departing from the spirit and teachings of the present disclosure. All such combinations and/or combinations fall within the scope of the present disclosure.
The foregoing embodiments have been provided for the purpose of illustrating the general principles of the present disclosure, and are not meant to limit the disclosure to the particular embodiments disclosed, but to limit the scope of the disclosure to the particular embodiments disclosed.
Claims (10)
1. A flexible circuit (100), comprising:
a flexible substrate (1);
a dielectric layer (2) formed as a dielectric pattern provided on the flexible substrate (1) and having a wrinkled microstructure (21); and
-an electrode layer (3), the corrugated microstructure (21) being configured such that, when the electrode layer (3) is formed by coating a conductive material on the flexible substrate (1), the conductive material adheres to the dielectric layer (2) such that the electrode layer (3) is formed as an electrode pattern located between the dielectric patterns.
2. The flexible circuit (100) of claim 1, wherein the dielectric layer (2) comprises a carbon layer.
3. The flexible circuit (100) of claim 1, wherein the electrical material comprises a semi-liquid metal.
4. A flexible circuit (100) according to claim 3, wherein the semi-liquid metal comprises any one of a gallium-based alloy, a bismuth-based alloy, and a bismuth-based alloy.
5. The flexible circuit (100) according to claim 1, wherein the electrode layer (3) comprises at least one wire (31), the wire (31) having a width of less than 10 μm.
6. A method of manufacturing a flexible circuit (100) suitable for use in any of the preceding claims 1 to 5, comprising:
step S1: stretching the flexible substrate (1);
step S2: preparing an initial dielectric layer (4) with a graphic structure on the stretched flexible substrate (1);
step S3: restoring the shape of the flexible substrate (1) to form the initial dielectric layer (4) into a pleated microstructure (21) to form a dielectric layer (2); and
step S4: an electrode layer (3) is formed on a portion of the flexible substrate (1) not covered by the dielectric layer (2), forming the flexible circuit (100).
7. The method of manufacturing according to claim 6, wherein step S2 includes:
printing carbon powder particles on a thermal transfer substrate in a certain pattern;
covering a heat transfer substrate with carbon powder particles on the flexible substrate (1) after stretching; and
the carbon powder particles are separated from the thermal transfer substrate and transferred onto a flexible substrate (1) through pressurization and heating, so that the initial medium layer (4) with the graphic structure is formed.
8. The method of claim 7, wherein step S4 includes:
coating semi-liquid metal on the surface of the elastic roller; and
semi-liquid metal is roll coated on the part of the flexible substrate (1) not covered by the dielectric layer (2) based on the corrugated microstructure (21) using a resilient roller coated with semi-liquid metal.
9. The method of manufacturing according to claim 6, characterized in that the way of stretching the flexible substrate (1) comprises uniaxial stretching and multiaxial stretching.
10. An electronic device, comprising:
the flexible circuit (100) of any of the above claims 1 to 5;
an electronic patch (200) disposed on the flexible circuit (100);
an electronic component (300) disposed on the electronic patch (200) and electrically connected to the flexible circuit (100) based on the electronic patch (200); and
and an encapsulation layer (400) covering a portion of the flexible circuit (100) not covered by the electronic patch (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410091924.0A CN117835531A (en) | 2024-01-23 | 2024-01-23 | Flexible circuit, manufacturing method thereof and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410091924.0A CN117835531A (en) | 2024-01-23 | 2024-01-23 | Flexible circuit, manufacturing method thereof and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117835531A true CN117835531A (en) | 2024-04-05 |
Family
ID=90511663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410091924.0A Pending CN117835531A (en) | 2024-01-23 | 2024-01-23 | Flexible circuit, manufacturing method thereof and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117835531A (en) |
-
2024
- 2024-01-23 CN CN202410091924.0A patent/CN117835531A/en active Pending
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