CN117829192A - Radio frequency chip and electronic equipment - Google Patents
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Abstract
The embodiment of the invention discloses a radio frequency chip and electronic equipment, wherein the radio frequency chip comprises a control module, a first functional module, a second functional module and a detection pad, the first functional module is connected between the control module and the detection pad, the second functional module is connected between the control module and the detection pad, the control module is used for determining the working mode of the radio frequency chip according to a packaging environment, and the connection between the first functional module or the second functional module and the detection pad is conducted according to the working mode. According to the technical scheme provided by the embodiment, the requirement that the radio frequency chips of the same version can adapt to different pad functions is met through the mode of multiplexing the detection pads, so that the external connection environment is self-adaptively adapted, and when different functions are applied, the radio frequency chips of multiple versions are not required to be arranged, thereby being beneficial to reducing the development cost.
Description
Technical Field
The embodiment of the invention relates to the technical field of radio frequency identification, in particular to a radio frequency chip and electronic equipment.
Background
At present, the radio frequency identification technology, in particular to an electronic tag, can be used as a data carrier to play roles in identification, article tracking and information acquisition. With the rapid development of radio frequency technology, electronic tags are gradually developed toward miniaturization and low cost.
Radio frequency chips are generally included in electronic tags, and in order to control the cost of the chip, the area design of the chip is small, but since the size of the chip pads is difficult to shrink as the size of the chip is reduced, the number of pads in which a small chip can be arranged is very limited. In the related art, different versions of chips are generally used to adapt to different pad functions, but the number of chips is increased, which is disadvantageous in reducing development cost.
Disclosure of Invention
The embodiment of the invention provides a radio frequency chip and electronic equipment, which are used for adapting different pad functions in a pad multiplexing mode so as to reduce the number of chips.
In a first aspect, an embodiment of the present invention provides a radio frequency chip, including: the device comprises a control module, a first functional module, a second functional module and a detection bonding pad;
the first functional module is connected between the control module and the detection bonding pad, the second functional module is connected between the control module and the detection bonding pad, and the control module is used for determining the working mode of the radio frequency chip according to the packaging environment and conducting connection of the first functional module or the second functional module and the detection bonding pad according to the working mode.
Optionally, the working mode of the radio frequency chip includes a pad detection mode and a digital bidirectional transmission mode, and the radio frequency chip further includes a ground pad, wherein in the pad detection mode, the detection pad is connected with the ground pad; in the digital bidirectional transmission mode, the detection pad is connected with an external chip.
Optionally, the first functional module includes detection pad and first switch unit, the control end of detection pad with control module's enable end is connected, the input of pad detection unit with first switch unit's first end is connected, first switch unit's second end with the detection pad is connected, the output of pad detection unit with control module's feedback end is connected, first switch unit's control end with control module's enable end is connected, control module still is used for according to the signal of pad detection unit feedback judges whether the radio frequency chip takes place to shift.
Optionally, the first switch unit includes a first transistor, a gate of the first transistor is connected to an enable terminal of the control module, a first pole of the first transistor is connected to an input terminal of the pad detection unit, and a second pole of the first transistor is connected to the detection pad.
Optionally, the second functional module includes a signal output control unit, a second switch unit, and a signal input control unit, where a control end of the signal output control unit is connected to a control end of the control module, an input end of the signal output control unit is connected to an output end of the control module, an output end of the signal output control unit is connected to a control end of the second switch unit, a first end of the second switch unit is connected to the detection pad, and a second end of the second switch unit is grounded;
the signal input control unit is connected between the detection bonding pad and the input end of the control module;
the signal input control unit and the signal output control unit are used for controlling the bidirectional transmission of digital signals between the radio frequency chip and an external chip.
Optionally, the signal input unit includes a comparator, a first input end of the comparator is connected with the detection pad, a second input end of the comparator is connected with a reference signal, an output end of the comparator is connected with an input end of the control module, the second switch unit includes a second transistor, a gate of the second transistor is connected with an output end of the signal output control unit, a first pole of the second transistor is connected with the detection pad, and a second pole of the second transistor is grounded.
Optionally, the radio frequency chip further includes a memory, the memory stores instructions mapping the working modes of the radio frequency chip, and the control module is configured to read the instructions in the memory, so as to control the first functional module to be turned on or control the second functional module to be turned on.
Optionally, the radio frequency chip further includes a first antenna pad and a second antenna pad, where the first antenna pad and the second antenna pad are used for connecting an antenna.
Optionally, the radio frequency chip further includes an electrostatic protection module, and the electrostatic protection module is connected with the detection pad.
Optionally, the area of the radio frequency chip is less than or equal to 500um by 500um.
In a second aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes the radio frequency chip provided in any embodiment of the present invention.
According to the technical scheme provided by the embodiment of the invention, the first functional module and the second functional module are respectively connected between the control module and the detection bonding pad, the working mode of the radio frequency chip is determined according to the packaging environment through the control module, and the first functional module or the second functional module is conducted according to the working mode, so that the first functional module or the second functional module is connected with the detection bonding pad, and different functions are realized through one detection bonding pad. Compared with the related art, the technical scheme provided by the embodiment realizes the requirement that the radio frequency chips of the same version can adapt to different pad functions by multiplexing the detection pads, thereby adapting to the external connection environment in a self-adaptive manner without setting the radio frequency chips of a plurality of versions, and being beneficial to reducing the development cost. And the method can provide strong flexibility and adaptability for the application of the radio frequency chip in different packaging environments, and provide reliable basic support for the performance optimization and application expansion of the whole system.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a radio frequency chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a schematic structural diagram of a radio frequency chip according to an embodiment of the present invention, and referring to fig. 1, the radio frequency chip provided in this embodiment includes a control module 100, a first functional module 1, a second functional module 2, and a detection pad 3, where the first functional module 1 is connected between the control module 100 and the detection pad 3, the second functional module 2 is connected between the control module 100 and the detection pad 3, and the control module 1 is configured to determine a working mode of the radio frequency chip according to a packaging environment, and conduct connection between the first functional module 1 or the second functional module 2 and the detection pad 3 according to the working mode.
Specifically, the packaging environment may be understood as a packaging environment of a radio frequency chip, and under different packaging environments, the radio frequency chip has different working modes and different functions implemented by the radio frequency chip. The first functional module 1 is respectively connected with the control module 100 and the detection bonding pad 3, the second functional module 2 is respectively connected with the control module 100 and the detection bonding pad 3, and the first functional module 1 and the second functional module 2 are not conducted simultaneously. After the control module 100 determines the working mode of the radio frequency chip according to the packaging environment, the first functional module 1 or the second functional module 2 is controlled to be conducted, and the control module 100 is connected with the detection bonding pad 3, so that different functions of the detection bonding pad 3 are realized.
According to the technical scheme provided by the embodiment of the invention, the first functional module 1 and the second functional module 2 are respectively connected between the control module 100 and the detection bonding pad 3, the working mode of the radio frequency chip is determined by the control module 100 according to the packaging environment, and the first functional module 1 or the second functional module 2 is conducted according to the working mode, so that the first functional module 1 or the second functional module 2 is connected with the detection bonding pad 3, and different functions are realized by one detection bonding pad 3. Compared with the related art, the technical scheme provided by the embodiment realizes the requirement that the radio frequency chips of the same version can adapt to different pad functions by multiplexing the detection pads 3, thereby adapting to the external connection environment in a self-adaptive manner without setting a plurality of versions of radio frequency chips, and being beneficial to reducing the development cost. And the method can provide strong flexibility and adaptability for the application of the radio frequency chip in different packaging environments, and provide reliable basic support for the performance optimization and application expansion of the whole system.
Optionally, the area of the radio frequency chip provided in this embodiment is less than or equal to 500um×500um, so as to reduce the development cost of the chip.
Fig. 2 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention, and referring to fig. 2, optionally, the working modes of the radio frequency chip include a pad detection mode and a digital bidirectional transmission mode based on the above embodiment. The pad inspection mode refers to that the pad inspection function is realized by inspecting the pad 3, for example, the anti-transfer function of the radio frequency chip (which may be packaged in the electronic tag) is realized by using the inspection function of the inspection pad 3. The digital bidirectional transmission mode refers to that when the radio frequency chip is externally connected with communication pins of other chips and needs to perform bidirectional communication with the other chips, the communication function of the radio frequency chip is realized through the detection bonding pad 3.
Specifically, as shown in fig. 2, the radio frequency chip further includes a ground pad 4. In the pad inspection mode, the inspection pad 3 is connected with the ground pad 4; in the digital bi-directional transmission mode, the sense pad 3 is connected with the external chip 6. The control module 100 determines the working mode of the radio frequency chip according to the packaging environment, if the detection bonding pad 3 is connected with the ground bonding pad 4, the working mode is determined to be a bonding pad detection mode, the control module 100 controls the first functional module 1 to be conducted, and the control module 100 is connected with the detection bonding pad 3 through the first functional module 1; if the detection pad 3 is connected with the external chip 6, the working mode is judged to be a digital bidirectional transmission mode, the control module 100 controls the second functional module 2 to be conducted, and the control module 100 is connected with the detection pad 3 through the second functional module 2.
According to the technical scheme provided by the embodiment, the control module 100 determines whether the radio frequency chip is in a pad detection mode or a digital bidirectional transmission mode through the packaging environment, and conducts the first functional module 1 or the second functional module 2 according to the determined working mode, so that the first functional module 1 or the second functional module 2 is connected with the detection pad 3, and the pad detection function or the digital bidirectional transmission function is realized under different packaging environments through one detection pad 3.
It should be understood that in the pad inspection mode, the signal passing over the inspection pad 3 is an analog signal; in the digital bidirectional transmission mode, the signal passing over the detection pad 3 is a digital signal. According to the embodiment, by setting different signal transmission paths, and the two functions of the same chip are different, the adverse effect of the digital signal on the analog signal is effectively avoided when the analog signal and the digital signal are multiplexed.
Fig. 3 is a schematic structural diagram of another radio frequency chip provided in the embodiment of the present invention, specifically, a schematic structural diagram of a radio frequency chip under the condition of implementing a pad detection function, referring to fig. 3, optionally, on the basis of the above embodiment, the first functional module 1 includes a pad detection unit 101 and a first switch unit 111, a control end of the pad detection unit 101 is connected with an enable end of the control module 100, an input end of the pad detection unit 101 is connected with a first end of the first switch unit 111, a second end of the first switch unit 111 is connected with a detection pad 3, an output end of the pad detection unit 101 is connected with a feedback end of the control module 100, a control end of the first switch unit 111 is connected with an enable end of the control module 100, and the control module 100 is further configured to determine whether the radio frequency chip is transferred according to a signal fed back by the pad detection unit 101.
The PAD detecting unit 101 is configured to detect a voltage v_pad on the detecting PAD 3, so as to determine a connection state between the detecting PAD 3 and the ground PAD 4 according to the v_pad, and the first switch unit 111 is configured to control a conductive state of the first functional module 1. Illustratively, in the pad inspection mode, when the inspection pad 3 is disconnected from the ground pad 4, the output signal det_out of the pad inspection unit 101 is at a high level; when the detection pad 3 is shorted with the ground pad 4, the output signal det_out of the pad detection unit 101 is low level.
Alternatively, the first switching unit 111 includes a first transistor Q1, a gate of the first transistor Q1 is connected to an enable terminal of the control module 100, a first pole of the first transistor Q1 is connected to an input terminal of the pad detection unit 101, and a second pole of the first transistor Q1 is connected to the detection pad 3.
Specifically, as shown in fig. 3, when the control module 100 determines that the radio frequency chip is in the pad detection mode according to the package environment of the radio frequency chip, the enable signal det_en output from the enable terminal of the control module 100 is at a high level, controls the pad detection unit 101 to start to operate, and controls the first transistor Q1 to be turned on, the pad detection unit 101 is in communication with the detection pad 3, and the first transistor Q1 transmits a pull-up current to the detection pad 3. The control terminal of the control module 100 outputs a corresponding control signal to turn off the second functional module 2.
If the detection PAD 3 is not connected to the ground PAD 4, the voltage v_pad on the detection PAD 3 is at a high level (e.g., the v_pad may be pulled up to a high level in the PAD detection unit 101) under the action of the pull-up current, the PAD detection unit 101 outputs a high level output signal det_out according to the high level v_pad, and the control module 100 determines that the detection PAD 3 is disconnected from the ground PAD 4 according to the received high level output signal det_out, so that it may be determined that the chip is transferred. If the detection PAD 3 is connected to the ground PAD 4, the v_pad voltage at the detection PAD 3 is pulled down to the ground under the pull-down action of the ground PAD 4, the v_pad is low, the output signal det_out of the output terminal of the PAD detection unit 101 is low, and the control module 100 determines that the detection PAD 3 remains connected to the ground PAD 4 according to the received low-level output signal det_out, so that it can be determined that the chip is not transferred.
According to the technical scheme provided by the embodiment of the invention, the first functional module 1 is turned on, the second functional module 2 is turned off, and the radio frequency chip is in a bonding pad detection mode by outputting corresponding signals through the enabling end and the control end of the control module 100. In the pad inspection mode, the control module 100 can accurately determine the connection state between the inspection pad 3 and the ground pad 4 by inspecting the output signal det_out of the output terminal of the pad inspection unit 101, thereby being able to determine whether the radio frequency chip is transferred.
Alternatively, when the radio frequency chip is in the pad inspection mode, the radio frequency chip may be encapsulated in a paper label to form a paper electronic label, and when the label is torn from the attached article, the inspection pad 3 is disconnected from the ground pad 4.
Fig. 4 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention, specifically, a schematic structural diagram of the radio frequency chip in a digital bidirectional transmission mode. Referring to fig. 4, optionally, the second functional module 2 includes a signal output control unit 201, a second switch unit 211, and a signal input control unit 221, where a control end of the signal output control unit 201 is connected to a control end of the control module 100, an input end of the signal output control unit 201 is connected to an output end of the control module 100, an output end of the signal output control unit 201 is connected to a control end of the second switch unit 211, a first end of the second switch unit 211 is connected to the detection pad 3, a second end of the second switch unit 211 is grounded, the signal input control unit 221 is connected between the detection pad 3 and an input end of the control module 100, and the signal input control unit 221 and the signal output control unit 201 are used for controlling bidirectional transmission of digital signals between the radio frequency chip and the external chip 6.
The control end of the signal output control unit 201 is configured to receive the control signal io_sel of the control module 100, and the signal output control unit 201 may be turned on or off in response to the control signal io_sel to control whether the output signal out_ext of the control module 100 can be transmitted to the second switch unit 211.
Alternatively, the second switching unit 211 includes a second transistor Q2, and the signal input control unit 221 includes a comparator U1. The first input end of the comparator U1 is connected with the detection bonding pad 3, the second input end of the comparator U1 is connected with a reference signal, and the output end of the comparator U1 is connected with the input end of the control module 100. The gate of the second transistor Q2 is connected to the output terminal of the signal output control unit 201, the first electrode of the second transistor Q2 is connected to the detection pad 3, and the second electrode of the second transistor Q2 is grounded.
The digital bidirectional transmission mode refers to that when the radio frequency chip is externally connected with a communication pin of the external chip 6 and needs to perform bidirectional communication with the external chip 6, the communication function of the radio frequency chip is realized through the detection bonding pad 3.
Specifically, as shown in fig. 4, when the control module 100 determines that the radio frequency chip is in the current digital bidirectional transmission mode according to the packaging environment of the radio frequency chip, the enable end of the control module 100 outputs a low-level enable signal det_en to control the first functional module 1 to be turned off. When the rf chip is used as a transmitting terminal to output a digital signal to the external chip 6, the signal output control unit 201 is turned on in response to the control signal io_sel output from the control terminal of the control module 100, and the output signal out_ext of the control module 100 is transmitted to the gate of the second transistor Q2 through the signal output control unit 201, where the comparator U1 does not operate. If the output signal out_ext of the control module 100 is a high level signal, the second transistor Q2 is turned on, and the voltage v_pad on the detection PAD 3 is pulled down to a low level; if the output signal out_ext of the control module 100 is a low level signal, the second transistor Q2 is turned off, and the voltage v_pad on the detection PAD 3 is pulled to a high potential of the external chip 6 (a high potential v_external to which the pull-up resistor 601 is connected as shown in fig. 5) under the effect of the pull-up resistor 601 of the external chip 6, thereby implementing that the control module 100 transmits a digital signal to the external chip 6.
When the radio frequency chip is used as a receiving end to input a digital signal from the external chip 6, the signal output control unit 201 responds to a control signal io_sel output by the control end of the control module 100 to turn off the second transistor Q2, the input signal of the external chip 6 enters the first input end of the comparator U1 through the detection pad 3 and is compared with an internal reference signal Verf of the radio frequency chip, according to different levels of the input signal of the external chip 6, the output signal in_ext of the output end of the comparator U1 is different, the comparator U1 transmits the own output signal in_ext to the input end of the control module 100, and the control module 100 performs corresponding processing according to the received digital signal.
In the technical scheme provided by the embodiment of the invention, when the radio frequency chip outputs a digital signal to the external chip 6 in the digital bidirectional transmission mode, the control end of the control module 100 outputs the control signal io_sel to enable the signal output control unit 201 to be conducted, and the output signal out_ext of the control module 100 is transmitted to the detection pad 3 through the second transistor Q2 and then transmitted to the external chip 6. When the radio frequency chip inputs a digital signal from an external chip, the control end of the control module 100 outputs a control signal io_sel to enable the signal output control unit 201 to be turned off so as to disconnect the output end of the control module 100 from the second transistor Q2, and simultaneously the control signal input control unit 221 starts to work, and the digital signal output by the external chip 6 is transmitted to the control module 100 through the comparator U1. The technical scheme provided by the embodiment realizes the bidirectional digital transmission function of the radio frequency chip and the external chip 6, and the embodiment ensures that the digital signal transmission and the pad detection mode adopt different transmission paths by controlling the first functional module 1 to be turned off, ensures that the two functions of the same chip are not used simultaneously, and effectively avoids the adverse effect of the digital signal on the analog signal when the analog signal and the digital signal are multiplexed.
Alternatively, in the present embodiment, when the rf chip outputs a digital signal to the external chip 6, the comparator U1 may be controlled to be disabled by the control module 100 or other modules inside the rf chip.
Fig. 5 is a schematic structural diagram of another radio frequency chip according to an embodiment of the present invention, referring to fig. 5, optionally, the radio frequency chip further includes a memory 8, the memory 8 may be connected to the control module 100, the memory 8 stores an instruction for mapping an operation mode of the radio frequency chip, and the control module 100 reads mapping contents corresponding to the corresponding operation mode to control the first functional module 1 to be turned on or control the second functional module 2 to be turned on, where the two functional modules are not turned on at the same time.
Specifically, the radio frequency chip maps the pad detection mode or the digital bidirectional transmission mode to a bit or a byte in the memory, and the pad detection mode or the digital bidirectional transmission mode cannot be used in the same radio frequency chip at the same time due to different packaging processes in the two modes. If the radio frequency chip determines that the radio frequency chip is in the pad detection mode, the control module 100 reads out the bit or byte in the memory 8, and the control module 100 outputs the control signal io_sel, so that the signal output control unit 201 is turned off, and the second transistor Q2 is controlled to be turned off forever, and at this time, the connection state between the detection pad 3 and the ground pad 4 is detected by the first functional module 1.
If the radio frequency chip determines that the radio frequency chip is in the digital bidirectional transmission mode, the control module 100 reads out the bit or byte in the memory 8 (the bit or byte is different from the bit or byte in the pad detection mode), and the control module 100 outputs the enable signal det_en with a low level, so that the first transistor Q1 is always turned off. Here, in the digital bidirectional transmission mode, whether the rf chip is in the input mode or the output mode may be determined by a communication protocol defined in advance between the rf chip and the external chip 6. Illustratively, the radio frequency chip is in an input mode by default, i.e. signals are input from the external chip 6, at power-up according to the communication protocol. According to the difference of the input signals of the external chip 6, the control module 100 switches the current input mode to the output mode, and the radio frequency chip transmits the corresponding digital signals to the external chip 6.
Alternatively, in the present embodiment, the control module 100 may be a digital protocol processing module.
For example, if the radio frequency chip outputs data to the external chip 6, the control terminal of the control module 100 outputs a control signal io_sel to enable the signal output control unit 201 to start operating, the output signal out_ext of the control module 100 is transmitted to the gate of the second transistor Q2 through the signal output control unit 201, when the output signal out_ext of the control module 100 is a high level signal, the second transistor Q2 is turned on, the voltage v_pad on the detection PAD 3 is pulled down to a low level, and when the output signal out_ext of the control module 100 is a low level signal, the second transistor Q2 is turned off, and the voltage v_pad on the detection PAD 3 is pulled to a high level of the external chip under the action of the pull-up resistor 601 inside the external chip 6. If the radio frequency chip inputs data from the external chip 6, the control end of the control module outputs a control signal io_sel to turn off the signal output control unit 201, the second transistor Q2 is turned off, the input signal of the external chip 6 enters the first input end of the comparator U1 through the detection pad 3 and is compared with the reference signal Verf inside the radio frequency chip, and according to different levels input by the external chip 6, the output signal in_ext at the output end of the comparator U1 is different, and the control module 100 performs corresponding processing according to the received output signal in_ext.
According to the technical scheme provided by the embodiment of the invention, the control module 100 reads the bit or the byte in the memory 8 to determine the working mode by mapping the working mode of the radio frequency chip to the bit or the byte in the memory 8, so that adverse effects on analog signals when the analog signals and the digital signals are multiplexed can be effectively avoided.
In the above embodiments, the first transistor Q1 and the second transistor Q2 are described by taking an N-type transistor as an example, and in other embodiments, the first transistor Q1 and the second transistor Q2 may be P-type transistors, or one may be an N-type transistor and the other may be a P-type transistor, and the same function may be achieved by adding a corresponding inverter in front of the gate of the P-type transistor.
With continued reference to fig. 5, the radio frequency chip optionally further comprises an electrostatic protection module 5, which is connected to the detection pad 3.
The electrostatic protection module 5 can effectively protect the radio frequency chip from electrostatic damage, and ensure normal operation of the radio frequency chip.
Optionally, the radio frequency chip further includes a first antenna pad and a second antenna pad (not shown in the figure), where the first antenna pad and the second antenna pad are used to connect to an antenna.
Wherein the antenna may be used to receive or transmit data.
Optionally, the embodiment of the invention further provides electronic equipment, which can be an electronic tag or other equipment for realizing the functions of transfer detection, data transmission and the like. The electronic equipment comprises the radio frequency chip provided by any embodiment of the invention, so the electronic equipment also has the beneficial effects provided by any embodiment.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. A radio frequency chip, comprising: the device comprises a control module, a first functional module, a second functional module and a detection bonding pad;
the first functional module is connected between the control module and the detection bonding pad, the second functional module is connected between the control module and the detection bonding pad, and the control module is used for determining the working mode of the radio frequency chip according to the packaging environment and conducting connection of the first functional module or the second functional module and the detection bonding pad according to the working mode.
2. The radio frequency chip of claim 1, wherein the operating modes of the radio frequency chip include a pad detection mode and a digital bidirectional transmission mode;
the radio frequency chip further comprises a ground pad;
wherein, in the pad inspection mode, the inspection pad is connected with a ground pad; in the digital bidirectional transmission mode, the detection pad is connected with an external chip.
3. The radio frequency chip according to claim 1, wherein the first functional module includes a pad detection unit and a first switching unit;
the control end of the pad detection unit is connected with the enabling end of the control module, the input end of the pad detection unit is connected with the first end of the first switch unit, the second end of the first switch unit is connected with the detection pad, the output end of the pad detection unit is connected with the feedback end of the control module, the control end of the first switch unit is connected with the enabling end of the control module, and the control module is further used for judging whether the radio frequency chip is transferred or not according to signals fed back by the pad detection unit.
4. The radio frequency chip of claim 3, wherein the first switching unit comprises a first transistor, a gate of the first transistor is connected to an enable terminal of the control module, a first pole of the first transistor is connected to an input terminal of the pad detection unit, and a second pole of the first transistor is connected to the detection pad.
5. The radio frequency chip according to claim 1, wherein the second functional module includes a signal output control unit, a second switching unit, and a signal input control unit;
the control end of the signal output control unit is connected with the control end of the control module, the input end of the signal output control unit is connected with the output end of the control module, the output end of the signal output control unit is connected with the control end of the second switch unit, the first end of the second switch unit is connected with the detection pad, and the second end of the second switch unit is grounded;
the signal input control unit is connected between the detection bonding pad and the input end of the control module;
the signal input control unit and the signal output control unit are used for controlling the bidirectional transmission of digital signals between the radio frequency chip and an external chip.
6. The radio frequency chip according to claim 5, wherein the signal input unit comprises a comparator, a first input end of the comparator is connected with the detection pad, a second input end of the comparator is connected with a reference signal, and an output end of the comparator is connected with an input end of the control module;
the second switch unit comprises a second transistor, the grid electrode of the second transistor is connected with the output end of the signal output control unit, the first electrode of the second transistor is connected with the detection bonding pad, and the second electrode of the second transistor is grounded.
7. The radio frequency chip of claim 1, further comprising a memory storing instructions mapping an operating mode of the radio frequency chip, the control module being configured to read the instructions in the memory to control the first functional module to be turned on or to control the second functional module to be turned on.
8. The radio frequency chip of claim 1, further comprising an electrostatic protection module connected to the detection pad;
the radio frequency chip further comprises a first antenna bonding pad and a second antenna bonding pad, and the first antenna bonding pad and the second antenna bonding pad are used for connecting antennas.
9. The radio frequency chip of claim 1, wherein the radio frequency chip has an area of 500um by 500um.
10. An electronic device comprising the radio frequency chip of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410002125.1A CN117829192A (en) | 2024-01-02 | 2024-01-02 | Radio frequency chip and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410002125.1A CN117829192A (en) | 2024-01-02 | 2024-01-02 | Radio frequency chip and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117829192A true CN117829192A (en) | 2024-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410002125.1A Pending CN117829192A (en) | 2024-01-02 | 2024-01-02 | Radio frequency chip and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN117829192A (en) |
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2024
- 2024-01-02 CN CN202410002125.1A patent/CN117829192A/en active Pending
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