CN117820819A - Electronic grade weather-resistant epoxy resin composition, and preparation method and application thereof - Google Patents
Electronic grade weather-resistant epoxy resin composition, and preparation method and application thereof Download PDFInfo
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- CN117820819A CN117820819A CN202311822121.XA CN202311822121A CN117820819A CN 117820819 A CN117820819 A CN 117820819A CN 202311822121 A CN202311822121 A CN 202311822121A CN 117820819 A CN117820819 A CN 117820819A
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- epoxy resin
- electronic grade
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- resin composition
- stirring
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 72
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 72
- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000003756 stirring Methods 0.000 claims abstract description 60
- 238000001132 ultrasonic dispersion Methods 0.000 claims abstract description 21
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 10
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 10
- 239000002270 dispersing agent Substances 0.000 claims abstract description 10
- 239000004611 light stabiliser Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000010248 power generation Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 15
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 12
- -1 2-hydroxypropyl Chemical group 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 claims description 8
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 claims description 8
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 7
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 7
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical group CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 6
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 4
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 4
- JYZSBRXMWUUVSP-UHFFFAOYSA-N C(CC(=O)OCCCCCCCCCCCC)(=S)OCCCCCCCCCCCC Chemical compound C(CC(=O)OCCCCCCCCCCCC)(=S)OCCCCCCCCCCCC JYZSBRXMWUUVSP-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 claims description 4
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 4
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims description 4
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 4
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 claims description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 claims description 3
- ARVUDIQYNJVQIW-UHFFFAOYSA-N (4-dodecoxy-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC(OCCCCCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 ARVUDIQYNJVQIW-UHFFFAOYSA-N 0.000 claims description 2
- SWFHGTMLYIBPPA-UHFFFAOYSA-N (4-methoxyphenyl)-phenylmethanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 SWFHGTMLYIBPPA-UHFFFAOYSA-N 0.000 claims description 2
- SQZCAOHYQSOZCE-UHFFFAOYSA-N 1-(diaminomethylidene)-2-(2-methylphenyl)guanidine Chemical compound CC1=CC=CC=C1N=C(N)N=C(N)N SQZCAOHYQSOZCE-UHFFFAOYSA-N 0.000 claims description 2
- ILEIGUXOYKZHRK-UHFFFAOYSA-N 1-(diaminomethylidene)-2-(4-methylphenyl)guanidine Chemical compound CC1=CC=C(N=C(N)N=C(N)N)C=C1 ILEIGUXOYKZHRK-UHFFFAOYSA-N 0.000 claims description 2
- VAZJLPXFVQHDFB-UHFFFAOYSA-N 1-(diaminomethylidene)-2-hexylguanidine Polymers CCCCCCN=C(N)N=C(N)N VAZJLPXFVQHDFB-UHFFFAOYSA-N 0.000 claims description 2
- PVOAHINGSUIXLS-UHFFFAOYSA-N 1-Methylpiperazine Chemical compound CN1CCNCC1 PVOAHINGSUIXLS-UHFFFAOYSA-N 0.000 claims description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- GUKULMCQRHXQPR-UHFFFAOYSA-N 2-(2-methylphenyl)-1h-imidazole Chemical compound CC1=CC=CC=C1C1=NC=CN1 GUKULMCQRHXQPR-UHFFFAOYSA-N 0.000 claims description 2
- CYCYSJGJOIJFEP-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-dipentylphenol Chemical compound CCCCCC1=CC(CCCCC)=C(O)C(N2N=C3C=CC=CC3=N2)=C1 CYCYSJGJOIJFEP-UHFFFAOYSA-N 0.000 claims description 2
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 claims description 2
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 2
- GMEONFUTDYJSNV-UHFFFAOYSA-N Ethyl levulinate Chemical compound CCOC(=O)CCC(C)=O GMEONFUTDYJSNV-UHFFFAOYSA-N 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- 229920002413 Polyhexanide Polymers 0.000 claims description 2
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 claims description 2
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- 229960004889 salicylic acid Drugs 0.000 claims 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 238000005054 agglomeration Methods 0.000 abstract description 3
- 230000002776 aggregation Effects 0.000 abstract description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000126 substance Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XSXYESVZDBAKKT-UHFFFAOYSA-N 2-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1O XSXYESVZDBAKKT-UHFFFAOYSA-N 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GPOGLVDBOFRHDV-UHFFFAOYSA-N (2-nonylphenyl) dihydrogen phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(O)O GPOGLVDBOFRHDV-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920003314 Elvaloy® Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- JXLYSJRDGCGARV-WWYNWVTFSA-N Vinblastine Natural products O=C(O[C@H]1[C@](O)(C(=O)OC)[C@@H]2N(C)c3c(cc(c(OC)c3)[C@]3(C(=O)OC)c4[nH]c5c(c4CCN4C[C@](O)(CC)C[C@H](C3)C4)cccc5)[C@@]32[C@H]2[C@@]1(CC)C=CCN2CC3)C JXLYSJRDGCGARV-WWYNWVTFSA-N 0.000 description 1
- 241000863480 Vinca Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- DUWWHGPELOTTOE-UHFFFAOYSA-N n-(5-chloro-2,4-dimethoxyphenyl)-3-oxobutanamide Chemical compound COC1=CC(OC)=C(NC(=O)CC(C)=O)C=C1Cl DUWWHGPELOTTOE-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- GLDOVTGHNKAZLK-UHFFFAOYSA-N n-octadecyl alcohol Natural products CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- KOODSCBKXPPKHE-UHFFFAOYSA-N propanethioic s-acid Chemical compound CCC(S)=O KOODSCBKXPPKHE-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 229960003048 vinblastine Drugs 0.000 description 1
- JXLYSJRDGCGARV-XQKSVPLYSA-N vincaleukoblastine Chemical compound C([C@@H](C[C@]1(C(=O)OC)C=2C(=CC3=C([C@]45[C@H]([C@@]([C@H](OC(C)=O)[C@]6(CC)C=CCN([C@H]56)CC4)(O)C(=O)OC)N3C)C=2)OC)C[C@@](C2)(O)CC)N2CCC2=C1NC1=CC=CC=C21 JXLYSJRDGCGARV-XQKSVPLYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides an electronic grade high weather-resistant epoxy resin composition, a preparation method and application thereof, and raw materials: 60-100 parts of electronic grade epoxy resin, 5-30 parts of curing agent, 0.05-5 parts of antioxidant, 0.1-5 parts of light stabilizer, 0.1-3 parts of curing accelerator and 0.05-5 parts of dispersing agent; compared with the prior art, the electronic-grade high-weather-resistance epoxy resin obtained by component design has excellent performance and high weather resistance. In the preparation, the epoxy resin composition is treated by an ultrasonic dispersion stirrer while adopting a small amount of dispersing agent, so that agglomeration and bubbles generated in the stirring process are effectively avoided, and the product is uniformly dispersed and has stable performance. The product has the advantages of simple preparation method, excellent performance and high weather resistance, and has good application prospect in the fields of wind power generation, new energy sources, electric automobiles and the like.
Description
Technical Field
The invention belongs to the technical field of electronic grade epoxy resin, and particularly relates to an electronic grade weather-resistant epoxy resin composition, and a preparation method and application thereof.
Background
The epoxy resin has excellent physical and mechanical properties, electrical insulation properties, chemical corrosion resistance, stable size and good adhesion performance with various materials, so that the epoxy resin is widely applied to the fields of coating, electronic and electrical appliances, adhesives, composite materials, civil engineering and the like and has special properties which are not possessed by other thermosetting plastics.
With the implementation of policy measures such as industry structure transformation and upgrading, the demand of high-performance epoxy resin is gradually vigorous, and particularly, the requirements of wind power blades used in the field of wind power generation, insulating materials, sealing adhesives and the like related to the field of new energy and electric automobiles on the performance of the epoxy resin are higher.
Compared with the traditional epoxy resin system, the electronic-grade epoxy resin has the advantages of small brittleness, nonflammability, high mechanical strength, strong corrosion resistance, good thermal stability and the like, and gradually becomes the main development direction in the future.
However, electronic grade epoxy resins are prone to chalking and light loss when used outdoors and have relatively poor weatherability. In addition, the traditional epoxy resin composition is produced by adopting common stirring, and bubbles and agglomeration are easy to generate in the process, so that the materials are unevenly mixed, and the material performance is uneven.
Therefore, it is necessary to develop electronic grade epoxy resin with high weather resistance, and the electronic grade epoxy resin has good application prospect in the fields of wind power generation, new energy sources, electric automobiles and the like.
Disclosure of Invention
The invention aims to provide an electronic-grade weather-resistant epoxy resin composition and a preparation method thereof. In the preparation, the epoxy resin composition is treated by an ultrasonic dispersion stirrer while adopting a small amount of dispersing agent, so that agglomeration and bubbles generated in the stirring process are effectively avoided, and the product is uniformly dispersed and has stable performance.
The invention also aims to provide application of the electronic-grade high-weather-resistance epoxy resin, which is used in the fields of wind power generation, new energy sources, electric automobiles and the like and has good application prospect.
The specific technical scheme of the invention is as follows:
the electronic grade weather-resistant epoxy resin composition comprises the following raw materials in parts by mass:
60-100 parts of electronic grade epoxy resin, 5-30 parts of curing agent, 0.05-5 parts of antioxidant, 0.1-5 parts of light stabilizer, 0.1-3 parts of curing accelerator and 0.05-5 parts of dispersing agent.
The electronic grade epoxy resin comprises at least one of electronic grade phenolic epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol A epoxy resin and hydrogenated bisphenol A epoxy resin;
the structural formulas of the electronic-grade phenolic epoxy resin, the o-cresol formaldehyde epoxy resin, the bisphenol A epoxy resin and the hydrogenated bisphenol A epoxy resin are respectively shown as the following formulas (1) (2) (3) (4), wherein n=1-30;
any one of the electronic-grade phenolic epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol A epoxy resin and hydrogenated bisphenol A epoxy resin has the hydrolyzable chlorine content less than or equal to 300ppm;
the form of the electronic-grade phenolic epoxy resin, the o-cresol formaldehyde epoxy resin, the bisphenol A epoxy resin and the hydrogenated bisphenol A epoxy resin is one of liquid, semi-solid and solid;
the curing agent is one or more of triethylamine, ethylenediamine, trimethyl-l, 6-hexamethylenediamine, 1, 3-diaminopropane, benzyl dimethylamine, m-phenylenediamine, N, N, N ', N' -tetra (2-hydroxyethyl) adipamide, N, N, N ', N' -tetra (2-hydroxypropyl) adipamide, adipic acid dihydrazide, salicylic acid hydrazide, succinic acid hydrazide, diaminodiphenyl sulfone, phthalic anhydride, methyl hexahydrophthalic anhydride, trimellitic anhydride, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-tolylimidazole, 2-phenyl-4-methylimidazole, dicyandiamide, o-tolylbiguanide, p-tolylbiguanide, polyhexamethylene biguanide and N-methylpiperazine;
the antioxidant is one or more of tri (2, 4-di-tert-butylphenyl) phosphite, beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propanoic acid stearyl alcohol ester, N' -bis- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl) hexamethylenediamine, tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propanoic acid ] pentaerythritol ester, 1,3, 5-trimethyl-2, 4, 6-tri (3, 5-di-tert-butyl-4-hydroxybenzyl) benzene, dilauryl thiomalonate and tri (nonylphenyl) phosphite.
The light stabilizer is one or more of p-methoxybenzophenone, 2 '-dihydroxy-4, 4' -dimethoxybenzophenone, 2', 4' -tetrahydroxybenzophenone, 2 '-dihydroxybenzophenone, 2-hydroxy-4-N-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, hydroquinone, 2, 6-di-tert-butyl-4-methylphenol, N-phenyl-alpha-naphthylamine, N-phenyl-beta-naphthylamine, diphenylamine, biphenyl, N' -diphenylurea, 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) benzotriazole, 2- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) -5-chlorobenzotriazole and 2- (2' -hydroxy-3 ',5' -dipentylphenyl) benzotriazole.
The curing accelerator is at least one of 2,4, 6-tri (dimethylaminomethyl) phenol, 4-nonylphenol, N-aminoethylpiperazine, ethyl levulinate and triethylene tetramine.
The dispersing agent is at least one of polyethylene oxide, acrylic ester copolymer and sodium polyacrylate.
The polyethylene oxide is selected from the group consisting of the Dow chemical model POLYOX WSR 308, the acrylic ester copolymer is selected from the group consisting of the Dow chemical model ELVALOY AC, and the sodium polyacrylate is selected from the group consisting of the Dow chemical model Acusol 445N.
The invention provides a preparation method of an electronic grade high weather-resistant epoxy resin composition, which comprises the following steps:
1) Firstly, mixing electronic grade epoxy resin with a formula amount and a curing agent, and simultaneously starting stirring and ultrasonic dispersing in an ultrasonic dispersing stirrer;
2) And adding a mixture of antioxidant, light stabilizer, curing accelerator and dispersing agent in the formula amount, starting stirring and ultrasonic wave, stopping stirring after stirring is finished, and continuing ultrasonic treatment.
In the step 1), the ultrasonic working frequency of the ultrasonic dispersion stirrer is 10-80KHz, the power is 300-3000W, the stirring speed is 200-1000rpm, and the ultrasonic and stirring time is 20+/-5 min;
in the step 2), stirring and ultrasonic wave are started, the stirring time is 20+/-5 min, and the stirring speed is 200-1000rpm; the working frequency of the ultrasonic wave is 10-80KHz, and the power is 300-3000W;
in the step 2), the ultrasonic treatment is continued, namely, the ultrasonic time is 10+/-2 min under the condition of the same parameters.
The electronic-grade weather-resistant epoxy resin is applied to wind power generation, new energy and electric automobile manufacturing, and is excellent in light retention, color retention, chalking grade and salt spray performance and high in weather resistance.
The electronic grade weather-resistant epoxy resin composition is obtained by adding a curing agent, an antioxidant, a light stabilizer, a curing accelerator and a dispersing agent into electronic grade epoxy resin and adopting an ultrasonic dispersion stirrer for treatment. The composition has the advantages of simple operation method, excellent performance and high weather resistance, and can have good application prospects in the fields of wind power generation, new energy sources, electric automobiles and the like.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The test materials, reagents and the like used in the examples described below are commercially available unless otherwise specified.
Those of skill in the art, without any particular mention of the techniques or conditions, may follow the techniques or conditions described in the literature in this field or follow the product specifications.
Example 1
An electronic grade weather-resistant epoxy resin composition is prepared by the following steps:
according to the mass portion of the electronic grade phenolic epoxy resin composition in the embodiment, firstly 100 portions of electronic grade phenolic epoxy resin (Taiwan vinblastine, model PNE 177) and 15 portions of m-phenylenediamine in Taiwan area are placed in an ultrasonic dispersion stirrer, stirring and ultrasonic wave are started, the ultrasonic working frequency is set to 40KHz, the power is 1000W, the stirring speed is 800rpm, after stirring for 20min, a mixture composed of 1.5 portions of tris (2, 4-di-tert-butylphenyl) phosphite, 1 portion of 2,2 '-dihydroxy-4, 4' -dimethoxybenzophenone, 1 portion of 2,4, 6-tris (dimethylaminomethyl) phenol and 0.5 portion of polyethylene oxide (Dow chemical, model POLYOX WSR 308) is slowly added into the ultrasonic dispersion stirrer, stirring is continued under the same parameters for 20min, stirring is stopped, and ultrasonic treatment is continued for 10min, so that the electronic grade weather-resistant epoxy resin composition is obtained.
Example 2
An electronic grade weather-resistant epoxy resin composition is prepared by the following steps:
according to the electronic grade o-cresol formaldehyde epoxy resin composition in the embodiment, firstly, 100 parts of electronic grade o-cresol formaldehyde epoxy resin (Taiwan vinca, model CNE-202) and 15 parts of N, N, N ', N' -tetra (2-hydroxyethyl) adipamide are placed in an ultrasonic dispersion stirrer, stirring and ultrasonic wave are started, the ultrasonic working frequency is set to 40KHz, the power is 1500W, the stirring speed is 900rpm, after stirring for 20 minutes, a mixture consisting of 2 parts of dilauryl thiomalonate, 1.5 parts of 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, 1 part of 4-nonylphenol and 0.5 part of polyethylene oxide (Dow chemical, model POLYOX WSR 308) is slowly added into the ultrasonic dispersion stirrer, stirring is continued under the same parameters for 20 minutes, stirring is stopped, and ultrasonic treatment is continued for 10 minutes, so that the electronic grade o-cresol formaldehyde epoxy resin composition is obtained.
Example 3
An electronic grade weather-resistant epoxy resin composition is prepared by the following steps:
according to the parts by weight of the electronic grade bisphenol A epoxy resin composition in the embodiment, firstly 100 parts of electronic grade bisphenol A epoxy resin (Kunshana, model 128E) and 10 parts of salicylic acid hydrazide are placed in an ultrasonic dispersion stirrer, stirring and ultrasonic wave are started, the ultrasonic working frequency is set to 40KHz, the power is 2500W, the stirring speed is 700rpm, after stirring for 20min, a mixture composed of 1.5 parts of dilauryl thiomalonate, 1.5 parts of 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, 1 part of 4-nonylphenol and 0.5 part of sodium polyacrylate (Dow chemical, model Acusol 445N) is slowly added into the ultrasonic dispersion stirrer, stirring is carried out under the same parameters for 20min, stirring is stopped, and ultrasonic treatment is continued for 10min, so that the electronic grade bisphenol A epoxy resin composition is obtained.
Example 4
An electronic grade weather-resistant epoxy resin composition is prepared by the following steps:
according to the electronic grade hydrogenated bisphenol A epoxy resin composition in the embodiment, firstly 100 parts of electronic grade hydrogenated bisphenol A epoxy resin (Ai Dike, model EP-4080E) and 10 parts of N, N, N ', N' -tetra (2-hydroxyethyl) adipamide are placed in an ultrasonic dispersion stirrer, stirring and ultrasonic wave are started, the ultrasonic working frequency is set to 40KHz, the power is 1500W, the stirring speed is 800rpm, after stirring for 20min, a mixture consisting of 2 parts of tris (nonylphenyl) phosphite, 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, 1 part of N-aminoethylpiperazine and 0.5 part of sodium polyacrylate (Dow chemical, model Acusol 445N) is slowly added into the ultrasonic dispersion stirrer, stirring is stopped for 20min under the same parameters, and ultrasonic treatment is continued for 10min, so that the hydrogenated bisphenol A epoxy resin composition is obtained.
Comparative example 1
An electronic grade epoxy resin composition, the preparation method is as follows:
this comparative example differs from example 1 in that in the electronic grade novolac epoxy resin compositionWithout the use of phosphorous acid Tris (2, 4-di-t-butylphenyl) ester and 2,2 '-dihydroxy-4, 4' -dimethoxybenzophenone.
According to the electronic grade phenolic epoxy resin composition in the comparative example, firstly, 100 parts of electronic grade phenolic epoxy resin and 15 parts of m-phenylenediamine are placed in an ultrasonic dispersion stirrer according to parts by weight, stirring and ultrasonic waves are started, the ultrasonic working frequency is set to 40KHz, the power is 1000W, the stirring speed is 800rpm, after stirring for 20min, a mixture consisting of 1 part of 2,4, 6-tris (dimethylaminomethyl) phenol and 0.5 part of polyethylene is slowly added into the ultrasonic dispersion stirrer to continue stirring and ultrasonic treatment for 20min under the same parameters, then stirring is stopped, and ultrasonic treatment is continued for 10min, so that the electronic grade weather-resistant epoxy resin composition is obtained.
Comparative example 2
An electronic grade epoxy resin composition, the preparation method is as follows:
the comparative example is different from example 2 in that in the electronic grade o-cresol formaldehyde epoxy resin compositionWithout the use of sulfur Dilauryl malonate and 2- (2 '-hydroxy-5'-methylphenyl) benzotriazole。
According to the electronic grade o-cresol formaldehyde epoxy resin composition in the comparative example, according to the mass parts, firstly, 100 parts of electronic grade o-cresol formaldehyde epoxy resin and 15 parts of N, N, N ', N' -tetra (2-hydroxyethyl) adipamide are placed in an ultrasonic dispersion stirrer, then stirring and ultrasonic wave are started, the working frequency of the ultrasonic wave is set to 40KHz, the power is 1500W, the stirring speed is 900rpm, after stirring for 20min, a mixture consisting of 1 part of 4-nonylphenol and 0.5 part of polyethylene oxide is slowly added into the ultrasonic dispersion stirrer, stirring and ultrasonic treatment are carried out for 20min under the same parameters, stirring is stopped, and ultrasonic treatment is continued for 10min, so that the electronic grade o-cresol formaldehyde epoxy resin composition is obtained.
Comparative example 3
An electronic grade epoxy resin composition, the preparation method is as follows:
this comparative example differs from example 3 in that in the electronic grade bisphenol A epoxy resin compositionWithout the use of thiopropionic acid Dilauryl diacid and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole。
According to the electronic grade bisphenol A epoxy resin composition in the comparative example, according to the parts by weight, firstly, 100 parts of electronic grade bisphenol A epoxy resin and 10 parts of salicylic acid hydrazide are placed in an ultrasonic dispersion stirrer, stirring and ultrasonic wave are started, the ultrasonic working frequency is set to 40KHz, the power is 2500W, the stirring speed is 700rpm, after stirring for 20min, a mixture consisting of 1 part of 4-nonylphenol and 0.5 part of sodium polyacrylate is slowly added into the ultrasonic dispersion stirrer, stirring and ultrasonic treatment are carried out for 20min under the same parameters, stirring is stopped, and ultrasonic treatment is continued for 10min, so that the electronic grade bisphenol A epoxy resin composition is obtained.
Comparative example 4
An electronic grade epoxy resin composition, the preparation method is as follows:
this comparative example differs from example 4 in that in the electronic grade hydrogenated bisphenol A epoxy resin compositionNo three are used (nonylphenyl) phosphite and 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole.
According to the electronic-grade hydrogenated bisphenol A epoxy resin composition in the comparative example, according to the parts by weight, firstly 100 parts of electronic-grade hydrogenated bisphenol A epoxy resin and 10 parts of N, N, N ', N' -tetra (2-hydroxyethyl) adipamide are placed in an ultrasonic dispersion stirrer, stirring and ultrasonic wave are started, the ultrasonic working frequency is set to 40KHz, the power is 1500W, the stirring speed is 800rpm, after stirring for 20min, a mixture consisting of 1 part of N-aminoethylpiperazine and 0.5 part of sodium polyacrylate is slowly added into the ultrasonic dispersion stirrer, stirring is stopped under the same parameters, stirring is stopped for 20min by ultrasonic wave, and ultrasonic treatment is continued for 10min, so that the electronic-grade hydrogenated bisphenol A epoxy resin composition is obtained.
The electronic grade weather-resistant epoxy resin compositions prepared in examples 1 to 4 and the electronic grade epoxy resin compositions of comparative examples 1 to 4 were poured into a mold (length 100mm, width 10mm, thickness 3 mm) respectively, cured at 80℃for 2 hours in a drying oven, and after cooling and demolding, impact resistance, pencil hardness, ultraviolet aging, neutral salt spray test was performed respectively, according to GB/T1732-2020, GB/T1771-2007, GB/T6739-2022, GB/T1865-2009, the performance of which is shown in Table 1.
Table 1 performance test of epoxy resin compositions of examples and comparative examples
The above underlined is not satisfactory for the present invention.
As can be seen from table 1, the addition of the antioxidant and the light stabilizer does not affect the appearance, impact resistance and pencil hardness of the examples, compared to the electronic grade epoxy resin composition of the comparative example. And after the antioxidant and the light stabilizer are added, the light retention, the color retention, the chalking grade and the salt fog performance of the examples are all greatly superior to those of the comparative examples, and the excellent high weather resistance is shown.
The above examples merely represent a few embodiments of the present invention, which facilitate a specific and detailed understanding of the technical solutions of the present invention, but are not to be construed as limiting the scope of the invention. It should be understood that, based on the technical solutions provided by the present invention, those skilled in the art obtain technical solutions through logical analysis, reasoning or limited experiments, all of which are within the scope of protection of the appended claims.
Claims (10)
1. The electronic grade weather-resistant epoxy resin composition is characterized by comprising the following raw materials in parts by mass:
60-100 parts of electronic grade epoxy resin, 5-30 parts of curing agent, 0.05-5 parts of antioxidant, 0.1-5 parts of light stabilizer, 0.1-3 parts of curing accelerator and 0.05-5 parts of dispersing agent.
2. The electronic grade weatherable epoxy composition of claim 1, wherein the electronic grade epoxy comprises at least one of an electronic grade phenolic epoxy, an o-cresol formaldehyde epoxy, a bisphenol a epoxy, a hydrogenated bisphenol a epoxy.
3. The electronic grade weather-resistant epoxy resin composition according to claim 1 or 2, wherein the curing agent is triethylamine, ethylenediamine, trimethyl-l, 6-hexamethylenediamine, 1, 3-diaminopropane, benzyl dimethylamine, m-phenylenediamine, N, N, N ', N' -tetra (2-hydroxyethyl) adipamide, N, N, N ', one or more of N' -tetra (2-hydroxypropyl) adipamide, adipic acid dihydrazide, salicylic acid dihydrazide, succinic acid dihydrazide, diamino diphenyl sulfone, phthalic anhydride, methyl hexahydrophthalic anhydride, trimellitic anhydride, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-tolylimidazole, 2-phenyl-4-methylimidazole, dicyandiamide, o-tolylbiguanide, p-tolylbiguanide, polyhexamethylene biguanide, N-methylpiperazine.
4. The electronic grade weather resistant epoxy resin composition according to claim 1 or 2, wherein the antioxidant is one or more of tris (2, 4-di-t-butylphenyl) phosphite, octadecyl beta- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate, hexamethylenediamine N, N' -bis- (3, 5-di-t-butyl-4-hydroxyphenyl) propionyl) hexamethylenediamine, pentaerythritol tetrakis [ beta- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate ], 1,3, 5-trimethyl-2, 4, 6-tris (3, 5-di-t-butyl-4-hydroxybenzyl) benzene, dilauryl thiomalonate, tris (nonylphenyl) phosphite.
5. The electronic grade weather resistant epoxy resin composition according to claim 1 or 2, wherein the light stabilizer is one or more of p-methoxybenzophenone, 2 '-dihydroxy-4, 4' -dimethoxybenzophenone, 2', 4' -tetrahydroxybenzophenone, 2 '-dihydroxybenzophenone, 2-hydroxy-4-N-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, hydroquinone, 2, 6-di-tert-butyl-4-methylphenol, N-phenyl- α -naphthylamine, N-phenyl- β -naphthylamine, diphenylamine, biphenyl, N' -diphenylurea, 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) benzotriazole, 2- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -dipentylphenyl) benzotriazole.
6. The electronic grade weather-resistant epoxy resin composition according to claim 1 or 2, wherein the curing accelerator is at least one of 2,4, 6-tris (dimethylaminomethyl) phenol, 4-nonylphenol, N-aminoethylpiperazine, ethyl levulinate and triethylenetetramine.
7. The electronic grade weather-resistant epoxy resin composition according to claim 1 or 2, wherein the dispersant is at least one of polyethylene oxide, an acrylic ester copolymer and sodium polyacrylate.
8. A method of preparing the electronic grade high weatherability epoxy resin composition of any one of claims 1-7, wherein the method of preparing comprises the steps of:
1) Firstly, mixing electronic grade epoxy resin with a formula amount and a curing agent, and simultaneously starting stirring and ultrasonic dispersing in an ultrasonic dispersing stirrer;
2) And adding a mixture of antioxidant, light stabilizer, curing accelerator and dispersing agent in the formula amount, starting stirring and ultrasonic wave, stopping stirring after stirring is finished, and continuing ultrasonic treatment.
9. The preparation method according to claim 8, wherein in the step 1), the ultrasonic dispersion stirrer has an ultrasonic working frequency of 10-80KHz, a power of 300-3000W, a stirring speed of 200-1000rpm, and an ultrasonic stirring time of 20+ -5 min;
in the step 2), stirring and ultrasonic wave are started, the stirring time is 20+/-5 min, and the stirring speed is 200-1000rpm; the working frequency of the ultrasonic wave is 10-80KHz, and the power is 300-3000W;
in the step 2), the ultrasonic treatment is continued, namely, the ultrasonic time is 10+/-2 min under the condition of the same parameters.
10. Use of an electronic grade high weatherability epoxy resin composition according to any of claims 1-7 for wind power generation, new energy and electric vehicle manufacturing.
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