CN117813808A

CN117813808A - Flexible printed circuit board having waterproof structure and foldable electronic device including the same

Info

Publication number: CN117813808A
Application number: CN202280056026.0A
Authority: CN
Inventors: 姜智勋; 姜宗民; 崔忠一
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2021-08-09
Filing date: 2022-07-15
Publication date: 2024-04-02

Abstract

The electronic device may include: a first housing including a first through hole; a second housing pivotably connected to the first housing; an FPCB including a plurality of layers extending from the first case through the first through hole to the second case; and a first sealing member surrounding the FPCB within the first through hole. The FPCB may include a second lamination portion extending toward the first sealing member within the first through hole. The first layer and/or the second layer of the second laminate part may include a first valley extending in the longitudinal direction of the FPCB on a surface facing the adjacent layer, and the second laminate part may include a first adhesive layer interposed between the first layer and the second layer to fill in the first valley.

Description

Flexible printed circuit board having waterproof structure and foldable electronic device including the same

Technical Field

Embodiments of the present disclosure relate to a flexible printed circuit board having a waterproof structure and a foldable electronic device including the flexible printed circuit board.

Background

The foldable electronic device may include a first housing, a second housing, and a hinge structure disposed between the first housing and the second housing. The hinge structure may be connected to the first housing and the second housing to support a folding operation of the foldable electronic device. In order to connect electronic components provided in the interiors of the first and second housings, a connection member extending from the first housing to the second housing across the hinge structure may be required.

For example, the connection member may include a flexible printed circuit board (hereinafter, referred to as FPCB) that may be at least partially bent.

Disclosure of Invention

Technical problem

The FPCB may include a plurality of layers. When the FPCB is bent or deformed in the first case and/or the second case, the layers may be separated from each other.

Foreign matter such as moisture or dust may be introduced between one or more of the separate layers. To prevent the introduction of foreign matter, a plurality of layers may be laminated on each other. However, laminating these layers makes it difficult to achieve the desired flexibility, while also increasing the thickness of the FPCB and the electronic device.

In other cases, multiple layers may be laminated onto each other only in some sections, with the purpose of preventing the introduction of foreign matter. However, when the layers are separated from each other to bend or bend some sections, the layers may become permanently deformed, whereby the desired shape of the FPCB may not be maintained.

Technical proposal

Various embodiments of the present disclosure provide an FPCB capable of preventing foreign substances from being introduced and securing a desired shape by a stepped laminated structure, and an electronic device including the FPCB. According to an embodiment of the present disclosure, an electronic device includes: a first housing having a first through-hole, a first opening and a second opening of the first through-hole communicating with each other; and a second housing rotatably connected to the first housing. The flexible printed circuit board FPCB extends from the first case to the second case via the first through hole and includes a plurality of layers. The first sealing member is disposed in the first through hole and surrounds the FPCB. The FPCB includes: a first lamination portion extending in a direction different from an extending direction of the first through hole in the first case and including a portion in which a plurality of layers are at least partially laminated on each other; a first curved portion extending from the first laminated portion through the first opening and including a portion where the plurality of layers are separated from each other. The second lamination portion extends from the first bending portion toward the first sealing member, and the second bending portion extends from the second lamination portion toward the second housing via the second opening. The plurality of layers includes a first layer and a second layer. Portions of the first layer and/or the second layer correspond to the second laminate portion and include at least one first valley extending in the longitudinal direction of the FPCB from a surface facing an adjacent layer. The second laminate section includes a first adhesive layer interposed between the first layer and the second layer to fill in at least one first valley.

According to an embodiment of the present disclosure, a foldable electronic device includes: a first housing including a first through-hole, a first opening and a second opening of the first through-hole communicating with each other; and a second housing rotatably connected to the first housing. The flexible printed circuit board FPCB extends from the first case to the second case via the first through hole and includes a plurality of layers. The first sealing member is disposed in the first through hole to surround the FPCB and provides elastic force in a direction facing an inner wall of the first through hole and a direction facing the FPCB. The first waterproof member is located in the first through hole and formed on the first sealing member around the FPCB. The FPCB further includes a first curved portion extending from an outside of the first through hole to an inside of the first through hole via the first opening, wherein the first curved portion includes a section curved from a first point outside of the first opening to a second point in the inside of the first through hole. The first lamination portion includes a first segment extending from the first curved portion and a second segment extending from the first segment toward the first sealing member. The plurality of layers includes a first layer, a second layer laminated on the first layer, and a third layer laminated on the second layer. The first layer includes at least one first valley formed on a surface facing the second layer, and the second layer includes at least one second valley formed on a surface facing the third layer. The first laminate section includes a first adhesive layer interposed between the first layer and the second layer to fill in the at least one first valley, and a second adhesive layer interposed between the second layer and the third layer to fill in the at least one second valley. The extent of the portion of the second adhesive layer corresponding to the first segment is smaller than the extent of the portion of the first adhesive layer corresponding to the first segment by a first area. The first area is defined based on a center angle formed by the first point and a curved section of the second point relative to the first curved portion and a separation distance between the second layer and the third layer.

Advantageous effects

The electronic device according to the embodiments of the present disclosure can maintain the shape of the bent portion of the FPCB through the stepped laminated structure.

The FPCB according to the embodiments of the present disclosure can satisfy a desired shape of a bent portion of the FPCB by laminating a plurality of layers at different areas.

The electronic device according to the embodiments of the present disclosure may prevent foreign substances from being introduced between layers of the FPCB by the step-type laminated structure.

The FPCB according to the embodiments of the present disclosure can prevent foreign substances that may be introduced between layers of the FPCB in such a manner that valleys formed between the layers are filled by laminating the layers.

The FPCB according to the embodiments of the present disclosure can also satisfy desired waterproof/dustproof performance using a stepped laminate structure without increasing the total thickness of the FPCB.

In addition, the present disclosure may provide various effects that are directly or indirectly recognized.

Drawings

Fig. 1 is an exploded perspective view of an electronic device according to an embodiment.

Fig. 2a is a view showing a flat state of the electronic device according to the embodiment.

Fig. 2b is a view showing a folded state of the electronic device according to the embodiment.

Fig. 2c is a view showing a completely folded state of the electronic device according to the embodiment.

Fig. 3a is an exploded perspective view of an electronic device according to an embodiment.

Fig. 3b is a partial perspective view of an electronic device according to an embodiment.

Fig. 3c is a plan view of an electronic device according to an embodiment.

Fig. 3d is a view illustrating the first waterproof member and the FPCB disposed in the through hole according to an embodiment.

Fig. 4 is a cross-sectional view of an electronic device according to an embodiment.

Fig. 5a is a view illustrating a stepped laminate structure of the FPCB according to an embodiment.

Fig. 5b is a view illustrating a stepped laminate structure of the FPCB according to an embodiment.

Fig. 5c is a view illustrating a stepped laminate structure of the FPCB according to an embodiment.

Fig. 6a illustrates an FPCB having a stepped laminate structure of an electronic device according to another embodiment.

Fig. 6b is a view illustrating a stepped laminate structure of an FPCB according to another embodiment.

Fig. 6c is a view illustrating a stepped laminate structure of an FPCB according to another embodiment.

Fig. 6d is a view illustrating a stepped laminate structure of the FPCB according to another embodiment.

Fig. 6e is a view illustrating a stepped laminate structure of an FPCB according to another embodiment.

Fig. 7a shows the electronic device in a flat state according to an embodiment.

Fig. 7b shows the electronic device in a fully folded state according to an embodiment.

Fig. 7c is a view showing the electronic device in a flat state in a direction facing the hinge structure.

Fig. 8a illustrates an FPCB according to an embodiment.

Fig. 8b is a view illustrating a method for laminating a plurality of layers of the FPCB according to an embodiment.

Fig. 9a shows an electronic device according to an embodiment.

Fig. 9b shows a second laminate section corresponding to the area of fig. 9 a.

Fig. 10 illustrates an electronic device in a network environment, in accordance with various embodiments.

With respect to the description of the drawings, the same or similar components may be numbered with the same or similar reference numerals.

Detailed Description

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. Accordingly, those of ordinary skill in the art will recognize that various embodiments described herein can be variously modified, equivalent, and/or substituted without departing from the scope and spirit of the present disclosure.

Referring to fig. 1, an electronic device 100 (e.g., electronic device 1001 of fig. 10) according to an embodiment may include a first housing 110, a second housing 120, a hinge housing 130, a hinge structure 200, and a display 140.

In an embodiment, the first housing 110 may be connected to the second housing 120 by using the hinge structure 200. In an embodiment, the first housing 110 may include a first support member 111 and a first frame 112, the first support member 111 having the display 140 disposed thereon, the first frame 112 surrounding at least a portion of the first support member 111. In an embodiment, the first frame 112 of the first housing 110 may define a portion of a surface (e.g., a side surface) of the electronic device 100. In an embodiment, the first frame 112 and the first support member 111 may be connected (or coupled) to each other. In an embodiment, the display 140 may be disposed in the first support member 111. For example, the first region 141 and the folding region 143 of the display 140 may be at least partially disposed in the first support member 111 of the first housing 110. In an embodiment, the region of the first support member 111 where the display 140 is disposed may be formed to be substantially flat, but the present disclosure is not limited thereto. In an embodiment, at least a portion of the first housing 110 may be coupled to the display 140. For example, the first support member 111 of the first housing 110 may be coupled to the first region 141 of the display 140. Further, at least a portion of the outer circumference of the front surface of the first case 110 may be coupled to the outer circumference of the first region 141 of the display 140. In view of this, the electronic device 100 according to the embodiment may include an adhesive layer (not shown) interposed between the first case 110 and the display 140 to bond them together.

In an embodiment, the first rotation structure 210 of the hinge structure 200 may be connected to the first support member 111. In an embodiment, the first housing 110 connected to the first rotating structure 210 may rotate about the hinge structure 200.

In an embodiment, the first housing 110 may include a first decoration member 113 surrounding an outer circumference of the display 140, and a first rear plate (or first rear cover) 119 defining a surface of the electronic device 100 while facing the first support member 111. For example, the first decoration member 113 may be disposed to cover an outer circumference of the first region 141 of the display 140 and at least a portion of the folding region 143 of the display 140. For example, the first rear plate 119 may define a rear surface of the electronic device 100 in a flat state (e.g., fig. 2 a), and the display 140 may define a front surface of the electronic device.

In an embodiment, the second housing 120 may be connected to the first housing 110 by a hinge structure 200. In an embodiment, the second housing 120 may include a second support member 121 and a second frame 122, the second support member 121 having the display 140 disposed thereon, the second frame 122 surrounding at least a portion of the second support member 121. In an embodiment, the second frame 122 may define a portion of a surface (e.g., a side surface) of the electronic device 100. In an embodiment, the second support member 121 may be connected to the second frame 122. In an embodiment, the display 140 may be disposed in the second support member 121. For example, the second region 142 and the folding region 143 of the display 140 may be at least partially disposed in the second support member 121. In an embodiment, the region of the second support member 121 where the display 140 is disposed may be formed to be substantially flat, but the present disclosure is not limited thereto. In an embodiment, at least a portion of the second housing 120 may be coupled to the display 140. For example, the second support member 121 of the second housing 120 may be coupled to the second region 142 of the display 140. Further, at least a portion of the outer circumference of the front surface of the second case 120 may be coupled to the outer circumference of the second region 142 of the display 140. In view of this, the electronic device 100 according to the embodiment may include an adhesive layer (not shown) interposed between the second case 120 and the display 140 to bond them together.

In an embodiment, the second rotating structure 220 of the hinge structure 200 may be connected to the second support member 121 of the second housing 120. In an embodiment, the second housing 120 connected to the second rotating structure 220 may rotate about the hinge structure 200.

In an embodiment, the second case 120 may include a second decoration member 123 surrounding the outer circumference of the display 140, and a second rear plate (or a second rear cover) 129 defining the surface of the electronic device 100 while facing the second support member 121. For example, the second decoration member 123 may be disposed to cover an outer circumference of the second region 142 of the display 140 and at least a portion of the folded region 143 of the display 140. For example, the second back plate 129 may define a back surface of the electronic device 100 in a flat state (e.g., fig. 2 a), and the display 140 may define a front surface of the electronic device.

In an embodiment, the first housing 110 and/or the second housing 120 may include a metallic material, a non-metallic material (e.g., a resin), or a combination of metallic and non-metallic materials. For example, at least a portion of the first housing 110 and/or the second housing 120 may be formed of a metallic material, or may be formed of a non-metallic material. The first and second cases 110 and 120 may be formed of a material having a specific strength to support at least a portion of the display 140. In an embodiment, the portions of the first and second housings 110 and 120 facing each other may include depressions such that at least a portion thereof has a specific curvature, and thereby the first and second housings 110 and 120 may together define a space in which the hinge housing 130 is accommodated. In an embodiment, the hinge housing 130 may be at least partially disposed in a space defined by the first housing 110 and the second housing 120 together. In an embodiment, the hinge housing 130 disposed in the space may be exposed to the outside or at least partially covered by the first housing 110 and the second housing 120 according to a folded state of the electronic device 100. In an embodiment, the hinge housing 130 may have a shape extending long in the X-axis direction as a whole. A structure (e.g., a boss structure or a "hinge clip") for fixing the hinge structure 200 may be provided in a partial region of the inner surface of the hinge housing 130.

The electronic device 100 according to an embodiment may include a mesh structure (not shown) and/or a stand (not shown) disposed at an underside (e.g., -Z-axis direction) of the display 140. The mesh structure and/or the bracket may be interposed between the display 140 and the first and second housings 110 and 120. For example, the mesh structure and/or the bracket may be interposed between one or more adhesive layers for attaching the display 140 to the first and second housings 110 and 120 and the display 140. The lattice structure (or scaffold) may include a region at least partially overlapping the folded region 143. A plurality of slits may be formed in a region overlapping the folding region 143. The plurality of slits may extend along an extending direction (for example, an X-axis direction) of the folded region 143, respectively. The plurality of slits may support the folding region 143 that is a flat surface in a flat state (e.g., fig. 2 a), and may assist in the deformation of the folding region 143 in a folding operation or an unfolding operation.

In an embodiment, the first printed circuit board 151, the first battery 153, and the camera module 156 may be disposed in the interior of the first case 110. For example, the display 140 may be disposed at one side (e.g., +z-axis direction) of the first support member 111, and the first printed circuit board 151, the first battery 153, and the camera module 156 (e.g., the camera module 1080 of fig. 10) may be disposed at the opposite side (e.g., -Z-axis direction) of the first support member 111. In an embodiment, at least one recess in which the first printed circuit board 151, the first battery 153, and the camera module 156 are disposed may be formed at the opposite side of the first support member 111. In an embodiment, the camera module 156 may be disposed adjacent to the first frame 112 at an opposite side of the first support member 111.

In an embodiment, the camera module 156 may include at least one camera. For example, the camera module 156 may include a first camera configured to face in a forward direction and/or a second camera configured to face in a rearward direction to acquire images corresponding to the forward direction (e.g., + Z-axis direction) and/or the rearward direction (e.g., -Z-axis direction) of the electronic device 100. In an embodiment, an aperture 1121 overlapping the first camera may be formed in the first support member 111, and the first camera may acquire an image corresponding to the front surface through the aperture 1121. In an embodiment, a partial region 1191 of the first rear plate 119 overlapping the second camera may be substantially transparent, and the second camera may acquire an image corresponding to the rear surface through the partial region 1191 of the first rear plate 119.

In an embodiment, the second printed circuit board 152 and the second battery 154 may be disposed in the interior of the second housing 120. For example, the display 140 may be disposed at one side (e.g., +z-axis direction) of the second rear plate 129 of the second housing 120, and the second printed circuit board 152 and the second battery 154 may be disposed at the opposite side (e.g., -Z-axis direction) of the second rear plate 129.

In an embodiment, the first printed circuit board 151 and the second printed circuit board 152 may be electrically or operatively connected to each other through an FPCB (not shown) (e.g., FPCB 30 of fig. 3 a) extending from the first housing 110 to the second housing 120 across the hinge structure 200.

In an embodiment, at least one of the first battery 153, the camera module 156, and/or the second battery 154 may be electrically connected to the first printed circuit board 151 and/or the second printed circuit board 152 through an FPCB or a separate FPCB distinguished therefrom.

In embodiments, a processor (e.g., processor 1020 of fig. 10), a memory (e.g., memory 1030 of fig. 10), and/or an interface (e.g., interface 1077 of fig. 10) may be disposed in first printed circuit board 151 and/or second printed circuit board 152. For example, the processor may include one or more of a central processor, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. For example, the memory may include volatile memory and/or nonvolatile memory. For example, the interface may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB), an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card/MMC connector, and an audio connector.

In an embodiment, the first battery 153 and the second battery 154 (e.g., battery 1089 of fig. 10) may store power required by at least one element of the electronic device 100. For example, the first and second batteries 153 and 154 may include rechargeable batteries or fuel cells. In an embodiment, at least a portion of the first battery 153 and/or the second battery 154 may be disposed on substantially the same plane as that of at least a portion of the first printed circuit board 151 and/or the second printed circuit board 152, but the present disclosure is not limited thereto.

In an embodiment, at least a portion of display 140 may be flexible. For example, the display 140 may include a first region 141 disposed on the first case 110, a second region 142 disposed on the second case 120, and a folding region 143 between the first region 141 and the second region 142. In an embodiment, the fold region 143 may extend from the first region 141 to the second region 142. In an embodiment, the first and second regions 141 and 142 may be substantially flat, and the folded region 143 may be formed to be deformed into a flat surface or a curved surface.

According to an embodiment, the hinge structure 200 may include a first rotating structure 210 connected to the first housing 110 and a second rotating structure 220 connected to the second housing 120. The hinge structure 200 may be configured such that the first and second rotation structures 210 and 220 are rotatable about a rotation axis (e.g., an imaginary axis parallel to the X-axis direction). For example, when the first and second housings 110 and 120 are folded or unfolded, the first and second rotating structures 210 and 220 may rotate about their rotation axes.

Fig. 2a is a view showing a flat state of the electronic device according to the embodiment. Fig. 2b is a view showing a folded state of the electronic device according to the embodiment. Fig. 2c is a view showing a completely folded state of the electronic device according to the embodiment.

Referring to fig. 2a, 2b and 2c, in an embodiment, the first housing 110 and the second housing 120 may rotate about their axes of rotation. For example, the first housing 110 may rotate (e.g., pivot) about a first rotational axis R1 provided by a first rotational structure (e.g., the first rotational structure 210 of fig. 1) of the hinge structure (e.g., the hinge structure 200 of fig. 1), and the second housing 120 may rotate (e.g., pivot) about a second rotational axis R2 provided by a second rotational structure (e.g., the second rotational structure 220 of fig. 1) of the hinge structure 200. In an embodiment, the first housing 110 and the second housing 120 may rotate in opposite directions about their rotational axes R1 and R2, respectively. For example, in a folding operation from a flat state (e.g., fig. 2 a), the first housing 110 may rotate in a counterclockwise direction about the first rotation axis R1, while the second housing 120 may rotate in a clockwise direction about the second rotation axis R2.

In an embodiment, an axial direction parallel to the rotation axis R1 of the first housing 110 and the rotation axis R2 of the second housing 120 may be defined. For example, the axial direction may be defined as the extending direction of the folding region 143 of the display 140. In another example, the axial direction may be defined as the long-side direction of the folded region 143. As another example, axial may mean a direction parallel to the X axis of fig. 1.

To describe the state of the electronic device according to various embodiments of the present disclosure, a first outer circumference P1 of the electronic device 100 and a second outer circumference P2 of the electronic device 100, which are parallel to the axial direction, may be defined. To describe the state of the electronic device 100, a third outer periphery P3 of the electronic device 100 perpendicular to the axial direction and a fourth outer periphery P4 of the electronic device 100 may be defined. For example, the first and third outer circumferences P1 and P3 may include a portion of a first frame (e.g., the first frame 112 of fig. 1) of the first housing 110. For example, the second and fourth outer circumferences P2 and P4 may include a portion of a second frame (e.g., the second frame 122 of fig. 1) of the second housing 120.

The flat state of the electronic device will be described with reference to fig. 2 a. For example, the flat state of the electronic device 100 may include a state in which the folded region 143 of the display 140 is a substantially flat surface. For example, the flat state may include a state in which the first and second regions 141 and 142 of the display 140 are flat surfaces facing the same direction. As another example, the flat state may include a state in which the first region 141 and the second region 142 of the display 140 form one substantially flat surface. For example, the flat state may include a state in which a first normal vector n1 of the first region 141 and a second normal vector n2 of the second region 142 of the display 140 are parallel to each other. For example, the flat state may include a state in which the third outer periphery P3 and the fourth outer periphery P4 form one substantially straight line. For example, the flat state may include a state in which the third and fourth outer circumferences P3 and P4 form 180 degrees.

The folded state of the electronic device will be described with reference to fig. 2 b. For example, the folded state may include a state in which at least a portion of the folded region 143 of the display 140 is bent. For example, the folded state may include a state in which the first normal vector n1 of the first region 141 and the second normal vector n2 of the second region 142 form a specific angle other than 180 degrees. For example, the folded state may include a state in which the third and fourth outer circumferences P3 and P4 form a specific angle other than 180 degrees.

The fully folded state of the electronic device will be described with reference to fig. 2 c. For example, the fully folded state may mean a state in which the first and second outer circumferences P1 and P2 in the folded state substantially contact each other. For example, the folding region 143 in the fully folded state may include a curved surface having a curvature greater than that of the folding region 143 in the folded state.

Referring to fig. 2c, in the fully folded state, at least a portion of the hinge housing 130 may define a surface of the electronic device 100. For example, the hinge housing 130 may be visually exposed through a space between the first housing 110 and the second housing 120. Although not shown, in the folded state of fig. 2b, the area of the hinge housing 130 exposed to the outside may be smaller than that in the fully folded state. Although not shown, in the flat state of fig. 2a, the hinge housing 130 may be covered by the first housing 110 and the second housing 120 without being observed, and the present disclosure is not limited thereto.

Fig. 3b is a partial perspective view of an electronic device according to an embodiment. Fig. 3b may be a view illustrating the coupling of components of the electronic device illustrated in fig. 3a to each other.

Fig. 3c is a plan view of an electronic device according to an embodiment. Fig. 3c may be a view illustrating the coupling of components of the electronic device illustrated in fig. 3a to each other.

Hereinafter, repeated description of the configuration having the same reference numerals as the above configuration will be omitted.

Referring to fig. 3a, 3b and 3c, in an embodiment, the first through hole 10 may be formed in the first housing 110. For example, the first through hole 10 may be formed in the first support member 111 of the first housing 110. In an embodiment, the first through hole 10 may extend by a first length L1 by a first width W1. In an embodiment, the first length L1 of the first through hole 10 may mean a length of the first through hole 10 with respect to a first direction (for example, X-axis direction). In an embodiment, the first width W1 of the first through hole 10 may mean a length of the first through hole 10 with respect to a second direction (e.g., Y-axis direction) different from (e.g., orthogonal to) the first direction. In an embodiment, the first through hole 10 may pass through the first support member 111 of the first housing 110 in a third direction (e.g., a Z-axis direction) different from (e.g., orthogonal to) the first direction and the second direction.

In an embodiment, the second through hole 20 may be formed in the second housing 120. For example, the second through hole 20 may be formed in the second support member 121 of the second housing 120. In an embodiment, similar to the first via 10, the second via 20 may extend a second length by a second width. In an embodiment, the second through hole 20 may pass through the second support member 121 of the second housing 120 in a fourth direction (e.g., a Z-axis direction) different from (e.g., orthogonal to) the first direction and the second direction. In an embodiment, the second length and/or the second width of the second through hole 20 may be substantially the same as the first length L1 and the first width W1 of the first through hole 10, but the present disclosure is not limited thereto. In the embodiment, the fourth direction of the second through-hole 20 passing through the second support member 121 may be substantially the same as the third direction of the first through-hole 10, but the present disclosure is not limited thereto.

The electronic device 100 according to the embodiment may include a Flexible Printed Circuit Board (FPCB) 30 and a first sealing member 60.

In an embodiment, the FPCB 30 may extend from the first case 110 to the second case 120. In an embodiment, the FPCB 30 may extend from the first case 110 to the second case 120 across a hinge structure (e.g., the hinge structure 200 of fig. 1) disposed between the first case 110 and the second case 120. In an embodiment, the FPCB 30 may extend from the first case 110 to the second case 120 across a folding region of the display (e.g., folding region 143 of display 140 of fig. 1).

In an embodiment, the FPCB 30 may extend from the first case 110 to the second case 120 via the first and second through holes 10 and 20. For example, the FPCB 30 may sequentially pass through the first and second through holes 10 and 20 while extending from the first case 110 to the second case 120.

In an embodiment, the FPCB 30 may electrically connect a first printed circuit board (e.g., the first printed circuit board 151 of fig. 1) disposed in the first case 110 and a second printed circuit board (e.g., the second printed circuit board 152 of fig. 1) disposed in the second case 120. For example, the FPCB 30 may include a first connector portion (or first connector part) 30a located in the first housing 110 and connected to the first printed circuit board, and a second connector portion (or second connector part) 30b located in the second housing 120 and connected to the second printed circuit board. In an embodiment, an element disposed in the first printed circuit board (e.g., the processor 1020 of fig. 10) and an element connected to the second printed circuit board (e.g., the connection terminal 1078 or the sound output module 1055 of fig. 10) may be operatively connected or electrically connected to each other through the FPCB 30.

In an embodiment, the FPCB 30 may operatively connect or electrically connect the elements of the electronic device 100 disposed in the first printed circuit board to other elements. For example, the FPCB 30 may include a third connector portion (or third connector portion) 30c located in the first housing 110 and connected to the first printed circuit board, and a fourth connector portion (or fourth connector portion) 30d electrically connected to other elements. For example, a battery of the electronic device 100 (e.g., the second battery 154 of fig. 1) may be connected to the fourth connector portion 30d, and the battery may be operatively connected or electrically connected to a processor (e.g., the processor 1020 of fig. 10) and/or a power management module (e.g., the power management module 1088 of fig. 10) of the electronic device 100 through the FPCB 30. As another example, an antenna module for Near Field Communication (NFC) and/or wireless charging (e.g., antenna module 1097 of fig. 10) may be connected to the fourth connector portion 30d and may be operatively or electrically connected to a processor and/or wireless communication module of the electronic device 100 (e.g., wireless communication module 1092 of fig. 10) through the FPCB 30.

In an embodiment, the first sealing member 60 may be disposed in the first through hole 10 to form a waterproof structure of the first through hole 10. In an embodiment, the waterproof structure of the electronic device 100 may include at least the first sealing member 60. For example, the waterproof structure of the electronic device 100 may include the first sealing member 60, the first waterproof member 81 (which will be described below), and the stepped laminated structure of the FPCB 30 (which will be described below).

In an embodiment, the waterproof structure of the electronic device 100 may prevent foreign substances from being introduced through the first through hole 10. However, the waterproof structure is not limited to the purpose of blocking or blocking only "moisture", regardless of the name of the "waterproof" structure. For example, the waterproof structure of the electronic device 100 may block or block external foreign matters such as dust and moisture.

Referring to fig. 3a and 3d, in an embodiment, the first sealing member 60 may at least partially close the first through hole 10. In an embodiment, the first sealing member 60 may include a first member 61 and a second member 62. In an embodiment, the first member 61 may be elongated along the first longitudinal direction L1 of the first through hole 10. In an embodiment, the first member 61 may include stepped portions 613 formed at opposite ends thereof. In an embodiment, the second member 62 may be coupled to the first member 61.

In an embodiment, the first sealing member 60 may include a first receiving hole 63 formed between the first member 61 and the second member 62. In an embodiment, the FPCB 30 may pass through the first receiving hole 63 formed in the first sealing member 60.

In an embodiment, the first member 61 may be formed to be longer than the first length L1 of the first through hole 10. In this case, the first member 61 may be pressed while being disposed in the first through hole 10. For example, the first member 61 may be compressed to have the first length L1 when disposed in the first through hole 10. The first member 61 provided in the first through hole 10 may provide a first elastic force F1 to an inner surface (e.g., the inner surface 13 of fig. 4) of the first through hole 10 in the first longitudinal direction L1.

In an embodiment, the stepped portion 613 of the first member 61 may be formed to be wider than the first width W1 of the first through hole 10. In this case, the stepped portion 613 of the first member 61 may be pressed when the first member 61 is disposed in the first through hole 10. For example, the stepped portion 613 of the first member 61 may be pressed to have the first width W1 while being disposed in the first through hole 10. The stepped portion 613 of the first member 61 may provide the second elastic force F2 to the inner surface of the first through hole 10 in the direction of the first width W1. In another embodiment, the second elastic force F2 may be provided by the first member 61 and the second member 62 together. For example, the second member 62 may be formed longer than shown to at least partially overlap the stepped portion 613 of the first member 61 with respect to the direction of the first width W1. The width defined by the stepped portion 613 and the second member 62 may be formed to be greater than the first width W1 of the first through hole 10. The stepped portion 613 and the second member 62 may be pressed to have substantially the same width as the first width W1 to provide the second elastic force F2 in the first through hole 10.

In an embodiment, the second member 62 may be configured to provide the third elastic force F3 to the inner surface of the first through hole 10 together with the first member 61. For example, the second member 62 may be coupled to the first member 61 while being interposed between the stepped portions 613 of the first member 61. In a state where the first member 61 and the second member 62 are coupled to each other, a width defined by a portion of the first member 61 between the stepped portions 613 together with the second member 62 may be formed to be greater than a first width W1 of the first through hole 10. In the first through hole 10, the portion between the stepped portions 613 of the first member 61 and the second member 62 may be pressed to have substantially the same width as the first width W1. The first and second members 61 and 62 may provide the third elastic force F3 to the inner surface of the first through hole 10 in the direction of the first width W1.

In an embodiment, the first member 61 and the second member 62 may provide the fourth elastic force F4 in a direction facing the first receiving hole 63 formed therebetween. The direction of the fourth elastic force F4 may be opposite to the direction of the third elastic force F3. In an embodiment, a portion of the FPCB 30 passing through the first receiving hole 63 may be pressed by the fourth elastic force F4 provided by the first and second members 61 and 62.

In an embodiment, by the first, second, and third elastic forces F1, F2, and F3 provided because the first sealing member 60 is formed to be at least partially larger than the first through hole 10, contact surfaces (e.g., the inner surface 13 of fig. 4) of the first sealing member 60 and the first through hole 10 may be sealed. Further, by the fourth elastic force F4, a contact surface of a portion of the FPCB 30 passing through the first receiving hole 63 and the first sealing member 60 may be disposed.

However, in order to seal the contact surfaces of the first sealing member 60 and the first through hole 10, the first sealing member 60 is not limited to be configured to provide all of the first, second, and third elastic forces F1, F2, and F3. For example, the first sealing member 60 may be formed to be smaller than the first length L1 and/or the first width W1, and thus may be at least partially spaced apart from the inner surface of the first through hole 10. When the first sealing member 60 is completely spaced apart from the inner surface of the first through hole 10, none of the first, second and third elastic forces F1, F2 and F3 is provided by the first sealing member 60. When the first sealing member 60 is partially spaced apart from the inner surface of the first through hole 10, any one or any two of the first, second and/or third elastic forces F1, F2 and/or F3 may not be provided by the first sealing member 60. The first waterproof member 81, which will be described with reference to fig. 4, may be disposed in a slit (not shown) formed as the first sealing member 60 and the first through hole 10 are spaced apart from each other. The first waterproof member 81 may be formed in a scheme of applying the bonding liquid and then curing the bonding liquid. The first waterproof member 81 may be applied to the gap between the first sealing member 60 and the first through hole 10 and then cured. Even if the first sealing member 60 is spaced apart from the first through hole 10 so that at least some of the first, second, and/or third elastic forces F1, F2, and/or F3 are not provided, a space between the first through hole 10 and the first sealing member 60 may be sealed by the first waterproof member 81. The bonding liquid of the first waterproof member 81 applied to the gap between the first through hole 10 and the first sealing member 60 may have viscosity such that leakage before curing is prevented (e.g., such that leakage to the outside of the gap is prevented).

Because the first sealing member 60 is pressed by the inner surface of the first through hole 10 to be fixedly disposed in the first through hole 10, if not, the first sealing member 60 may be moved during the process of disposing the first sealing member 60 in the first through hole 10. For example, the first sealing member 60 may be configured not to provide the first, second, third, and fourth elastic forces F1, F2, F3, and F4. In this case, the first member 61 and the second member 62 of the first sealing member 60 may be fixedly disposed in the first through hole 10 by separate members. For example, the first member 61 and the second member 62 may be bonded to the inner surface of the first through hole 10 or to another region (for example, a region of the first support member 111 on the outside of the first through hole 10) by an adhesive member such as a double-sided tape so as to be fixedly located in the inside of the first through hole 10. However, the individual members for fixedly disposing the first member 61 and the second member 62 in the first through hole 10 are not limited to the double-sided adhesive tape described above.

As another example, the first and second members 61 and 62 of the first sealing member 60 are configured to provide the first and second elastic forces F1 and F2, but may be configured not to provide the third and fourth elastic forces F3 and F4. In this case, the first member 61 may be fixedly disposed in the first through hole 10 by at least the first elastic force F1 and the second elastic force F2, and the second member 62 may be movable in the first through hole 10. To prevent this, the second member 62 may be fixedly disposed in the first through hole 10 by a separate member such as a double-sided tape (e.g., the first adhesive member 86 of fig. 4).

Further, in order to seal the contact surface of the portion of the FPCB 30 passing through the first receiving hole 63 with the first sealing member 60, the first sealing member 60 is not necessarily limited to be configured to provide the fourth elastic force F4. For example, the width of the first receiving hole 63 of the first sealing member 60 may be formed to be greater than the thickness of the portion of the FPCB 30 passing through the first receiving hole 63. In this case, the FPCB 30 may be spaced apart from the first sealing member 60. Further, since the first sealing member 60 does not provide the fourth elastic force F4, the FPCB 30 is not pressed by the first sealing member 60. The first waterproof member 81 may be disposed in the first receiving hole 63 to surround the FPCB 30. For example, the first waterproof member 81 may be provided to fill at least a space formed in the first receiving hole 63 due to the FPCB 30 and the first sealing member 60 being spaced apart from each other. Even if the fourth elastic force F4 is not provided, the FPCB 30 positioned in the first receiving hole 63 may not move since the first waterproof member 81 is fixedly disposed. Further, even if the fourth elastic force F4 is not provided, the first receiving hole 63 through which the FPCB 30 passes may be sealed by the first waterproof member 81. The coupling liquid of the first waterproof member 81 applied to the first receiving hole 63 may have a specific viscosity so as not to leak before curing. The first waterproof member 81 may have a certain hardness due to the solidified bonding liquid such that the portion of the FPCB 30 located in the first receiving hole 63 is prevented from moving.

In an embodiment, the first sealing member 60 may include an elastomeric material such as rubber, for example, but the present disclosure is not limited thereto.

It has been described that the first sealing member 60 includes the first member 61 and the second member 62 coupled to each other, but the present disclosure is not limited thereto. For example, the first member 61 and the second member 62 of the first seal member 60 may be integrally formed.

The electronic device 100 according to the embodiment may include the second sealing member 65 disposed in the second through hole 20. The description provided with reference to the first sealing member 60 may be applicable to the second sealing member 65 in substantially the same, similar or corresponding scenarios. For example, the second sealing member 65 may be disposed in the second through hole 20 to at least partially close the second through hole 20. The second sealing member 65 may include a third member 66 and a fourth member 67. The third member 66 and the fourth member 67 may be partially spaced apart from each other to define a second receiving hole 68. The FPCB 30 may pass through the second accommodation hole 68. As in the description provided with reference to the first sealing member 60, the second sealing member 65 may be configured to provide elastic force to the inner surface of the second through hole 20, but may not be.

Fig. 4 is a cross-sectional view of an electronic device according to an embodiment. Fig. 4 may be a cross-sectional view taken along line A-A' of fig. 3 c.

Referring to fig. 4, the first support member 111 of the first case 110 may include a partition wall (or rib) 115 extending in a height direction (e.g., a Z-axis direction) of the electronic device 100. In an embodiment, the first support member 111 may include a recess 117 defined by the partition wall 115. The first battery 153 may be at least partially disposed in the recess 117.

In an embodiment, the recess 117 and the first through hole 10 may be positioned when the partition wall 115 is interposed between the recess 117 and the first through hole 10. In an embodiment, the first through hole 10 may enable the first opening 11 and the second opening 12 formed in the first support member 111 to communicate with each other. In an embodiment, the first through hole 10 may extend from the first opening 11 to the second opening 12 in a direction that becomes more and more distant from the first rear plate 119. For example, the first through hole 10 may extend from the first opening 11 to the second opening 12 toward the display 140 (e.g., in the +z axis direction). In an embodiment, the first opening 11 may be substantially parallel to the first rear plate 119. In the embodiment, the second opening 12 is shown to be inclined with respect to the first rear plate 119, but the present disclosure is not limited thereto. In another embodiment, the second opening 12 may be substantially parallel to the first back plate 119.

The electronic device 100 according to the embodiment may include a first waterproof member 81 disposed in the first through hole 10. In an embodiment, the first waterproof member 81 may be disposed in the first through hole 10. For example, the first waterproof member 81 may be provided on the first sealing member 60 (e.g., -Z-axis direction). As another example, the first waterproof member 81 may be disposed in the first through hole 10 between the first sealing member 60 and the first opening 11. In an embodiment, the first waterproof member 81 may be disposed in the first through hole 10 at least partially from the first sealing member 60 toward the first opening 11. In an embodiment, the first waterproof member 81 may surround the FPCB 30. As in the description provided with reference to fig. 3d, the first sealing member 60 according to another embodiment may be at least partially spaced apart from the FPCB 30 and/or the inner surface 13 of the first through hole 10, and the first waterproof member 81 is additionally at least partially disposed in a space (e.g., the first receiving hole 63 or a space formed by the inner surface 13 and the first sealing member 60 being spaced apart from each other) formed by the first sealing member 60 being spaced apart.

In an embodiment, the first waterproof member 81 may be filled in the first through hole 10. For example, the first waterproof member 81 may be formed by: after the first sealing member 60 and the FPCB 30 are disposed in the first through-hole 10, a bonding liquid is applied in the first through-hole 10 through the first opening 11, and then the bonding liquid is cured. In an embodiment, the bonding liquid may include, for example, a resin that may be cured (e.g., thermally cured or UV cured) after the liquid resin is applied in the first through hole 10. For example, the bonding liquid may include a resin that may be manufactured in a Cured In Place Gasket (CIPG) (e.g., silicone rubber), but the present disclosure is not limited to the above examples.

In an embodiment, the first waterproof member 81 may provide an elastic force (e.g., a third elastic force F3 of fig. 3 d) in a direction facing the inner surface 13 of the first through hole 10, and may provide an elastic force (e.g., a fourth elastic force F4 of fig. 3 d) in a direction facing the FPCB 30 surrounded by the first and second members 61 and 62.

In an embodiment, the first waterproof member 81 may prevent foreign substances including, but not limited to, moisture and dust from passing through the first sealing member 60 to be introduced into the first through hole 10. For example, the first waterproof member 81 may prevent foreign substances from being introduced between the inner surface 13 of the first through hole 10 and the first member 61, between the first member 61 and the FPCB 30, between the FPCB 30 and the second member 62, between the first member 61 and the second member 62, and between the inner surface 13 of the first through hole 10 and the second member 62.

In an embodiment, the first and second members 61 and 62 may include first and second protrusions 611 and 621 extending toward the first opening 11, respectively. In an embodiment, the first protrusion 611 may be located between the inner surface 13 of the first through hole 10 and the second protrusion 621. In an embodiment, the first protrusion 611 may be spaced apart from the inner surface 13 of the first through hole 10 and the second protrusion 621. In an embodiment, the second protrusions 621 may be spaced apart from the inner surface 13 of the first through-hole 10. In an embodiment, the valley 615 extending in the depth direction (e.g., the Z-axis direction) may be formed by the first protrusion 611, the second protrusion 621, and the inner surface 13 of the first through hole 10. In an embodiment, when the first flashing member 81 is applied, it may be applied to the valleys 615. Thereby, the defect rate due to the deviation of the application process of the first waterproof member 81 can be reduced, and the waterproof/dustproof performance can be improved.

In an embodiment, the FPCB 30 may include a plurality of layers 50. For example, the plurality of layers 50 may include a first layer 51, a second layer 52, a third layer 53, and a fourth layer 54 that are sequentially arranged (e.g., stacked). However, the number of the plurality of layers 50 is not limited to the illustrated example. In another embodiment, the plurality of layers 50 may include a greater number of layers than shown in fig. 4, and may include a lesser number of layers than shown in fig. 4. For example, the plurality of layers 50 may include a fifth layer (not shown) laminated to the fourth layer 54. For example, unlike the illustration, the plurality of layers 50 may include only the first layer 51 and the second layer 52 (e.g., the plurality of layers 50 of fig. 6 e). As another example, the plurality of layers 50 may include only the first layer 51, the second layer 52, and the third layer 53 (e.g., the plurality of layers 50 of fig. 6 d).

The FPCB 30 according to an embodiment may include a first laminate portion (or first laminate portion) 31, a first bent portion (or first bent portion) 32, a second laminate portion (or second laminate portion) 33, a second bent portion (or second bent portion) 34, and a third laminate portion (or third laminate portion) 35.

In an embodiment, the first lamination portion 31 may be formed to be flexible. In an embodiment, the first lamination portion 31 may include a portion of: in this portion, at least two of the plurality of layers 50 are laminated to one another. For example, the first lamination portion 31 may be a part of: in this portion, among the plurality of layers 50, the first layer 51 and the second layer 52 are bonded to each other. In this case, at least two layers may be bonded to each other by an adhesive layer interposed therebetween. The adhesive layer may include an adhesive having an epoxy-based resin, but the present disclosure is not limited thereto.

In another embodiment, the first lamination portion 31 may include a rigid portion. In this case, all of the plurality of layers 50 may be laminated to each other in the rigid portion by a bonding sheet (such as prepreg). For example, the first layer 51 to the fourth layer 54 may be bonded to each other by a bonding sheet, and may be formed to be rigid.

In an embodiment, the first lamination portion 31 may be located in the first housing 110. For example, the first lamination portion 31 may be disposed between the first back plate 119 and the first support member 111. In an embodiment, the first lamination portion 31 may be located between the first battery 153 and the first rear plate 119.

In an embodiment, the first lamination portion 31 may be positioned farther from the second housing (not shown) (e.g., the second housing 120 of fig. 3 a) than the first through hole 10. For example, the first through hole 10 may be located between the first lamination portion 31 and the second housing. In an embodiment, the first lamination portion 31 may extend from the outside of the first through hole 10 in a direction facing the second case. In an embodiment, the first lamination portion 31 may extend from the outside of the first through hole 10 toward the first opening 11.

In an embodiment, the first lamination portion 31 may extend in a direction different from the extending direction of the first through hole 10. For example, the first through hole 10 may extend in a direction that becomes more and more distant from the first rear plate 119. In contrast, the first laminate section 31 may extend substantially parallel to the first back plate 119.

In an embodiment, the first curved portion 32 may extend from the first lamination portion 31 toward the second lamination portion 33. In an embodiment, the first curved portion 32 may extend from the first lamination portion 31 and may pass through the first opening 11. In an embodiment, the first curved portion 32 may pass through the first opening 11 and may extend into the first through hole 10.

In an embodiment, the first curved portion 32 may include a portion that is at least partially curved. For example, the first curved portion 32 may include a first section 32a extending from the first lamination portion 31 and a second section 32b extending from the first section 32a. In an embodiment, the first segment 32a may extend at substantially the same inclination as the first lamination portion 31. In an embodiment, the first section 32a may be disposed between the first back plate 119 and the first support member 111. In an embodiment, the first segment 32a may be at least partially supported by the dividing wall 115. In an embodiment, the second section 32b may be bent while extending from the first section 32a into the first through hole 10. In an embodiment, portions of the plurality of layers 50 of the FPCB 30 corresponding to the second sections 32b may be curved. In another embodiment, the first curved portion 32 may not include the first segment 32a. In this case, as shown in fig. 5a, it is understood that the first lamination portion 31 extends to the partition wall 115 and the second section 32b extends from the first lamination portion 31 in a curved manner, but the present disclosure is not limited thereto.

In an embodiment, portions of the plurality of layers 50 corresponding to the first curved portion 32 may be separated from each other. For example, portions of the first to fourth layers 51 to 54 corresponding to the first curved portion 32 may be separated from each other.

In an embodiment, the second lamination portion 33 may extend from the first bending portion 32 inside the first through hole 10. In an embodiment, the second lamination portion 33 may extend from the first bending portion 32 toward the first sealing member 60. In an embodiment, the second lamination portion 33 may extend from the first bending portion 32 toward the display 140. In an embodiment, the second lamination portion 33 may extend from the first bending portion 32 to the first sealing member 60. In another embodiment, the second lamination portion 33 may extend from the first bending portion 32 to at least a portion of the first receiving hole 63 of the first sealing member 60.

In an embodiment, portions of the first layer 51 to the fourth layer 54 corresponding to the second lamination portion 33 may be laminated on each other. The first layer 51 and the second layer 52 may be bonded to each other by a first adhesive layer 91 interposed therebetween. The second layer 52 and the third layer 53 may be laminated to each other with a second adhesive layer 92 interposed therebetween. The third layer 53 and the fourth layer 54 may be bonded to each other by a third adhesive layer 93 disposed therebetween.

In an embodiment, the layers laminated on each other by the first, second and third adhesive layers 91, 92 and 93 may be laminated in such a manner as to define different lamination areas. For example, the area or location where the first adhesive layer 91 contacts the first layer 51 and the second layer 52 defines a first lamination area, the area or location where the second adhesive layer 92 contacts the second layer 52 and the third layer 53 defines a second lamination area, and the area or location where the third adhesive layer 93 contacts the third layer 53 and the fourth layer 54 defines a third lamination area.

According to an embodiment, the first layer 51 and the second layer 52 may be laminated on each other by the first adhesive layer 91 in an area having a first area A1 larger than the area of the second layer 52 and the third layer 53 laminated by the second adhesive layer 92. Further, the second layer 52 and the third layer 53 may be laminated on each other with an area larger than the area of the third layer 53 and the fourth layer 54 laminated by the third adhesive layer 93 by the second area A2.

In an embodiment, the second lamination portion 33 may include a portion of: in this portion, the plurality of layers 50 of the FPCB 30 are laminated on each other in such a manner as to define different lamination areas. In an embodiment, the second lamination portion 33 may include a third section 33a interposed between the second section 32b and the fourth section 33 b. According to one or more non-limiting embodiments described herein, the second segment 32b can define a first lamination area, the third segment 33a can define a second lamination area, and the fourth segment 33b can define a third lamination area.

According to an embodiment, the third section 33a extends from the first curved portion 32 (e.g., the second section 32 b), and the fourth section 33b extends from the third section 33 a. In an embodiment, the portions of the layer 50 corresponding to the third section 33a may be laminated to each other with different lamination areas (or different ranges). For example, the portions of the third layer 53 and the fourth layer 54 corresponding to the third section 33a may not be laminated on each other, but may be separated from each other. In an embodiment, the portions of the first layer 51 and the second layer 52 corresponding to the third section 33a may be laminated on each other by the first adhesive layer 91 in the first area A1 and the second area A2. In an embodiment, the portions of the second layer 52 and the third layer 53 corresponding to the third section 33a may be laminated on each other by the second adhesive layer 92 by the second area A2.

In an embodiment, the first to third adhesive layers 91 to 93 may include a first end portion facing the first opening 11 and a second end portion facing the second opening 12. In an embodiment, because the plurality of layers 50 are bonded to each other at different areas in the third section, the first end may be located at different distances from the first end of the first opening 11 (or the first back plate 119).

In an embodiment, the portions of layer 50 corresponding to fourth segment 33b may be laminated to one another in the same or different areas. In an embodiment, when portions of the plurality of layers 50 corresponding to the fourth segment 33b are laminated on each other in substantially the same area, the second ends of the first to third adhesive layers 91 to 93 may be substantially aligned (or overlapped with each other) along a direction (e.g., Y-axis direction) perpendicular to the extending direction of the fourth segment 33 b. In another embodiment, when portions of the plurality of layers 50 corresponding to the fourth section 33b are laminated on each other at different areas, the second ends of the first to third adhesive layers 91 to 93 may be located at different positions from the second ends of the second openings 12 (or the display 140). For example, a second end of the first adhesive layer 91 corresponding to the fourth segment 33b may extend to the first sealing member 60. In contrast, the second end portion of the second adhesive layer 92 corresponding to the fourth section 33b may extend to the inside of the first receiving hole 63 of the first sealing member 60. However, the present disclosure is not limited by the above examples.

Like the above-described third section 33a of the second laminate section 33, the FPCB 30 according to the embodiment may include sections in which at least portions of the plurality of layers 50 are laminated on each other with different lamination areas (or different ranges). As described above, the structure of the second laminate part 33 of the FPCB 30, in which a plurality of layers are laminated on each other with different lamination areas, may be referred to as a "stepped laminate structure". In one or more non-limiting embodiments, the second lamination portion 33 allows for the use of adhesive layers 91, 92, and 93 to laminate multiple layers 51, 52, 53, and 54 with different lamination areas. For example, the third laminate area (e.g., defined by segment 33 b) can include adhesive layers 91, 92, and 93, and the second laminate area (e.g., defined by segment 33 a) can include first adhesive layer 91 and second adhesive layer 92, while excluding third adhesive layer 93. Accordingly, the stepped laminate structure of the second laminate part 33 can prevent foreign substances from being introduced between the plurality of layers 50 of the FPCB 30 through the first receiving hole 63 of the first sealing member 60. This will be described below with reference to other figures.

In an embodiment, the second curved portion 34 may extend from the second lamination portion 33. According to one or more embodiments, a portion of the second curved portion 34 is interposed between the first member 61 and the second member 62. In an embodiment, the second curved portion 34 may extend from the second lamination portion 33 and may pass through the second opening 12. In an embodiment, the second curved portion 34 may pass through the second opening 12 and may extend to the outside of the first through hole 10. In an embodiment, the second curved portion 34 may pass through the second opening 12 and may extend in a direction facing the second housing. In an embodiment, the second curved portion 34 may extend from the second lamination portion 33 to the third lamination portion 35.

In an embodiment, the second curved portion 34 may include a portion that is at least partially curved. For example, the second curved portion 34 may include a portion of: in this portion, the plurality of layers 50 of the FPCB 30 are bent. In an embodiment, the second curved portion 34 may include a portion that curves in an opposite manner as the first curved portion 32. For example, referring to the illustration of fig. 4, the center of curvature of the curved portion of the first curved portion 32 may be adjacent to the first layer 51, whereas the center of curvature of the curved portion of the second curved portion 34 may be adjacent to the fourth layer 54. In other words, referring to the illustration of fig. 4, the first bending portion 32 may be bent while extending in a clockwise direction from the first lamination portion 31, whereas the second bending portion 34 may be bent while extending in a counterclockwise direction.

In an embodiment, portions of the plurality of layers 50 corresponding to the second curved portions 34 may be separated from each other. For example, portions of the first to fourth layers 51 to 54 corresponding to the second curved portions 34 may be separated from each other.

In an embodiment, the third laminated portion 35 may be located in the first housing 110. For example, the third laminated portion 35 may be disposed between the first support member 111 and the display 140. In an embodiment, the third laminated portion 35 may be disposed on the first support member 111, and may be supported by the first support member 111. In an embodiment, the third lamination portion 35 may be disposed at a position opposite to the first lamination portion 31 with respect to the first support member 111. For example, the third lamination portion 35 may be located at one side (e.g., +z-axis direction) of the first support member 111, and the first lamination portion 31 may be disposed at the other side (e.g., -Z-axis direction) of the first support member 111 opposite to the one side.

In an embodiment, the third lamination portion 35 may be positioned closer to the second housing than the first through hole 10. For example, the third lamination portion 35 may be located between the first through hole 10 and the second housing. In an embodiment, the third lamination portion 35 may extend from the outside of the first through hole 10 in a direction facing the second case. In an embodiment, the third lamination portion 35 may extend from the second bending portion 34 toward the second housing.

In an embodiment, the third laminated portion 35 may extend in a direction different from the extending direction of the first through hole 10. For example, the first through hole 10 may extend from the first rear plate 119 in a direction facing the first region 141 of the display 140. In an embodiment, the third lamination portion 35 may extend substantially parallel to the first region 141 of the display 140.

The electronic device 100 according to an embodiment may include a first plate structure 76. In an embodiment, the first plate structure 76 may be disposed adjacent to the extension surface 111a of the first support member 111, the extension surface 111a of the first support member 111 extending from a portion of the inner surface 13 of the first through hole 10 to the outside of the second opening 12. In an embodiment, the first plate structure 76 may support the display 140 together with the first support member 111.

In an embodiment, the first plate structure 76 may include a first plate 761 and a second plate 762 disposed on the first plate 761. In an embodiment, the first adhesive member 86 may be disposed between the first plate 761 and the first member 61. In an embodiment, a partial region of the first plate 761 may be bonded to the first member 61 by the first adhesive member 86. In an embodiment, the first adhesive member 86 may include a double-sided tape, but the present disclosure is not limited thereto.

Fig. 5b is a view illustrating a stepped laminate structure of the FPCB according to an embodiment. In fig. 5b, the FPCB is shown in a flat state for convenience of description. Direction 1 of fig. 5b may refer to a direction in which the FPCB 30 will bend. Reference numeral 501 of fig. 5b denotes an end portion of the adhesive layer.

Fig. 5c is a view illustrating a stepped laminate structure of the FPCB according to an embodiment. Fig. 5c may be a sectional view of the stepped laminate structure of the FPCB taken in a direction perpendicular to the longitudinal direction. Fig. 5c may be a cross-sectional view taken along line B-B' of fig. 4. In fig. 5c, the first member 61, the second member 62, and the first receiving hole 63 are shown together for convenience of description. Although the boundary of the first receiving hole 63 is not shown in fig. 5c, it is understood that the first receiving hole 63 is located between the first member 61 and the second member 62 and at least partially overlaps the FPCB 30.

In fig. 5a, the explanation of the adhesive layers (e.g., the first to third adhesive layers 91 to 93 of fig. 4) interposed between the plurality of layers 50 is omitted for convenience of description.

Referring to fig. 5a, in an embodiment, the plurality of layers 50 may be bent from the end surface 115a of the partition wall 115 of the first support member 111 toward the second lamination portion 33 extending substantially straight. For example, a portion of the plurality of layers 50 corresponding to the first curved portion 32 (or the second section 32b of fig. 4) may be curved from the boundary S1 between the end surface 115a of the partition wall 115 and the inner surface 13 of the first through hole 10 to the start point S2 of a substantially straight extending section (e.g., the fourth section 33b of fig. 4) of the FPCB 30. In this case, the first bending portion 32 may be bent at an angle corresponding to the center angle θ thereof. In an embodiment, the center angle θ may refer to an angle defined by the first reference line C1 and the second reference line C2. In an embodiment, the first reference line C1 may be a straight line perpendicular to the extending direction of the first lamination portion 31 (or the first segment 32a of fig. 4) and passing through the boundary S1 between the end surface 115a and the inner surface 13 (although fig. 5a shows that the first reference line C1 and the boundary S1 are spaced apart from each other for classification, the present disclosure is not limited to the illustrated embodiment). In an embodiment, the second reference line C2 may be a straight line passing through a section of the FPCB 30 extending substantially straight in the first via 10 and perpendicular to the extending direction of the FPCB 30.

In an embodiment, the plurality of layers 50 may include a first layer 51, a second layer 52, a third layer 53, a third layer, and an nth layer laminated in order closer to the partition wall 115. In an embodiment, a portion of the first layer 51 corresponding to the first curved portion 32 may be curved along the radius R. In this case, the length d1 of the first section of the first layer 51 corresponding to the first curved portion 32 may be represented as in the following formula 1.

[ 1]

d ₁ ＝θR

In an embodiment, the second layer 52, the third layer 53, the fourth layer 54, the..and the nth layer may be at a first distance l ₁ Second distance l ₂ Third distance l ₃ And the nth distance l _n Spaced from the first layer 51, the second layer 52, the third layer 53, the third layer, and the (n-1) th layer. In an embodiment, the lamination thicknesses of the second layer 52, the third layer 53, the fourth layer 54, the third, and the nth layer may be the first distance l ₁ Second distance l ₂ Third distance l ₃ The third, and nth distances l _n . In an embodiment, the nth segment length d of the nth layer _n Can be represented as in equation 2 as follows.

[ 2]

d _n ＝θ(l _n-1 +l _n-2 +…+l ₁ +R)

In an embodiment, the difference between the segment lengths of the nth layer and the (n-1) th layer adjacent to each other may be represented as in the following formula 3.

[ 3]

Δd _n ＝d _n+1 -d _n ＝θl _n

In the embodiment, as in equation 3, the difference Δd in the segment lengths of the (n+1) -th layer and the n-th layer adjacent to each other _n The central angles that can be bent by the first bending portion 32 are all θ and the spacing distance l of the layers _n Is defined by the product of (a).

Referring to formula 3, the plurality of layers 50 of the FPCB 30 according to the embodiment may define a length deviation in the bent section like the first bent portion 32.

The FPCB 30 of the electronic device 100 according to the embodiment may include a stepped laminate structure based on the length deviation of the layers represented in formula 3. Referring to fig. 5b, in an embodiment, a first difference Δd in segment lengths of the second layer 52 and the first layer 51 corresponding to the first curved portion 32 ₁ Can be defined by a center angle θ and a first distance l ₁ Is expressed by the product of (Δd) ₁ ＝θ×l ₁ ). In an embodiment, the second layer 52 andthe first layers 51 may be laminated to each other by a first adhesive layer 91. In an embodiment, the first adhesive layer 91 may be spaced apart from the first lamination portion 31 (or the second section 32b of fig. 4) by at least a second section length d ₂ . For example, the distance between the first end 91a of the first adhesive layer 91 facing the first lamination portion 31 and the boundary S1 may be at least the second length d ₂ . In an embodiment, the second segment length d of the second layer 52 ₂ May be a first length d of the first layer 51 ₁ From the first difference Deltad ₁ And (3) summing.

A second difference Deltad in segment lengths of the third layer 53 and the second layer 52 corresponding to the first curved portion 32 according to the embodiment ₂ Can be defined by the center angle θ and the second distance l ₂ Is expressed by the product of (Δd) ₂ ＝θ×l ₂ ). In an embodiment, the third layer 53 and the second layer 52 may be laminated to one another by a second adhesive layer 92. In an embodiment, the third layer 53 and the second layer 52 may be laminated according to the following areas: the area is smaller than the area of the first layer 51 and the second layer 52 laminated on each other by a second difference Deltad ₂ The corresponding area (e.g., the first area A1 of fig. 4).

In an embodiment, the second adhesive layer 92 may be formed to be shorter than the first adhesive layer 91 by a second difference Δd ₂ . For example, the second end 92a of the second adhesive layer 92 facing the first lamination portion 31 may be located at least a second difference Δd from the boundary S1 than the first end 91a ₂ Is located at the position of (2). In an embodiment, the second adhesive layer 92 may be spaced apart from the first lamination portion 31 (or the second section 32b of fig. 4) by at least a third length d ₃ . For example, the distance between the second end 92a of the second adhesive layer 92 and the boundary S1 may be at least a third length d ₃ . In an embodiment, the third segment length d of the third layer 53 ₃ May be the second segment length d ₂ And a second difference delta d ₂ And (3) summing.

A third difference Deltad in segment lengths of the fourth layer 54 and the third layer 53 corresponding to the first curved portion 32 according to the embodiment ₃ Can be defined by the center angle θ and the third distance l ₃ Is expressed by the product of (Δd) ₃ ＝θ×l ₃ ). In an embodiment, the firstThe four layers 54 and the third layer 53 may be laminated to each other by a third adhesive layer 93. In an embodiment, the fourth layer 54 and the third layer 53 may be laminated according to the following areas: the area is smaller than the area of the second layer 52 and the third layer 53 laminated on each other by a third difference Δd ₃ A corresponding area (e.g., second area A2 of fig. 4).

In an embodiment, the third adhesive layer 93 may be formed to be shorter than the second adhesive layer 92 by a third difference Δd ₃ . For example, the third end 93a of the third adhesive layer 93 facing the first lamination portion 31 may be located at least a third difference Δd from the boundary S1 than the second end 92a ₃ Is located at the position of (2). In an embodiment, the third adhesive layer 93 may be spaced apart from the first lamination portion 31 (or the second section 32b of fig. 4) by at least a fourth length d ₄ . For example, the distance between the third end 93a of the third adhesive layer 93 and the boundary S1 may be at least a fourth segment length d ₄ . In an embodiment, a fourth segment length d of the fourth layer 54 ₄ May be a third segment length d ₃ And a third difference delta d ₃ And (3) summing.

Unlike the above-described stepped laminated structure, portions of the plurality of layers 50 corresponding to the second laminated portions 33 may be laminated on each other in the same area. For example, portions of the first to third adhesive layers 91 to 93 corresponding to the second lamination portion 33 may be disposed such that the first to third ends 91a, 92a, and 93a overlap each other. In this case, since the portions of the plurality of layers 50 corresponding to the second bending portions 34 are fixed at the same position, they cannot accommodate the length variation due to bending thereof at different radii. Accordingly, the FPCB 30 may be deformed differently from the design. For example, the plurality of layers 50 may widen relative to each other. When the plurality of layers 50 are deformed, the FPCB 30 may exert a repulsive force when contacting another adjacent structure, and the FPCB 30 may be damaged. In addition, when the FPCB 30 applies a repulsive force to a first rear plate (e.g., the first rear plate 119 of fig. 4) adjacent to the second bent portion 34, the first rear plate collides, whereby a thin hole through which foreign matter can be introduced may be formed.

The electronic device 100 according to the embodiment may maintain the shape of a portion (e.g., the second bending portion 34) of the FPCB 30 bent through the stepped laminated structure. For example, as in the stepped laminate structure, the plurality of layers 50 are laminated on each other at different areas, whereby the shape of the second curved portion 34 of the FPCB 30 can be maintained. For example, the stepped laminate structure may accommodate a length change due to bending of portions of the plurality of layers 50 corresponding to the second bending portions 34 with different radii, whereby the shape of the FPCB 30 may be maintained.

The electronic device 100 according to the embodiment may prevent foreign substances from being introduced between the plurality of layers 50 of the FPCB 30 by the above-described stepped laminated structure. Referring to fig. 5c, the FPCB 30 according to an embodiment may include at least one valley 70 formed in the plurality of layers 50. In an embodiment, an adhesive layer 90 (e.g., first to third adhesive layers 91 to 93) may be interposed between the plurality of layers 50 to fill in the at least one valley 70.

In an embodiment, the at least one valley 70 may be formed by transmission lines disposed in the plurality of layers 50 of the FPCB 30. For example, the first layer 51 may include a base layer 503 and a transmission line 505 disposed on the base layer 503. In an embodiment, to prevent signals transmitted through the transmission line 505 from being disturbed, the transmission lines 505 may be spaced apart from each other on the base layer 503. In an embodiment, the transmission line 505 may protrude from the second surface 51b of the first layer 51, and the transmission line 505 may form the first valley 71 together with the base layer 503.

In an embodiment, the at least one valley 70 may include a first valley 71, a second valley 72, and a third valley 73. In an embodiment, at least one valley 70 may extend along a direction in which a transmission line disposed in the plurality of layers 50 extends. For example, the first valley 71 may extend along a direction in which the transmission line 505 of the first layer 51 extends. In an embodiment, the transmission line 505 may extend along the longitudinal direction of the FPCB 30, and the first valley 71 may also extend along the longitudinal direction of the FPCB 30.

In an embodiment, the base layer 503 may include a resin manufactured in the form of a film to be bent. For example, the base layer 503 may include polyimide, but the present disclosure is not limited thereto. In an embodiment, the transmission line 505 may include a conductive material for transmitting an electrical signal. For example, the transmission line 505 may include copper, but the present disclosure is not limited thereto.

Although not shown, the FPCB 30 according to an embodiment may include a protective layer (e.g., a capping layer) covering the transmission lines disposed in the plurality of layers 50. For example, the protective layers may be disposed on at least the second surface 51b of the first layer 51, the fourth surface 52b of the second layer 52, and the sixth surface 53b of the third layer 53, respectively. For example, the protective layer may be attached to the plurality of layers 50 by an adhesive (not shown), but the present disclosure is not limited to the above examples. For example, the protective layer may be manufactured in the form of a film by using a flexible resin (e.g., polyimide), but the present disclosure is not limited thereto.

In an embodiment, the first layer 51 may include a first surface 51a adjacent to the first member 61 and a second surface 51b facing in a direction opposite to the first surface 51a and adjacent to the second layer 52. In an embodiment, the second layer 52 may include a third surface 52a adjacent to the first layer 51 and a fourth surface 52b facing in a direction opposite to the third surface 52a and adjacent to the third layer 53. In an embodiment, the third layer 53 may include a fifth surface 53a adjacent to the second layer 52 and a sixth surface 53b facing in a direction opposite to the fifth surface 53a and adjacent to the fourth layer 54. In an embodiment, the fourth layer 54 may include a seventh surface 54a adjacent to the third layer 53 and an eighth surface 54b facing in a direction opposite to the seventh surface 54a and adjacent to the second member 62.

In an embodiment, the first valley 71 may be formed on the second surface 51b of the first layer 51. In an embodiment, the adhesive layer 90 (e.g., the first adhesive layer 91) may be filled in the first valley 71. In an embodiment, the adhesive layer 90 may be interposed between the second surface 51b of the first layer 51 and the third surface 52a of the second layer 52 to fill in the first valleys 71. In an embodiment, one or more first valleys 71 may be formed along the transmission line provided by the first layer 51.

In an embodiment, the second valleys 72 may be formed on the fourth surface 52b of the second layer 52. In an embodiment, an adhesive layer 90 (e.g., a second adhesive layer 92) may be filled in the second valleys 72. In an embodiment, the adhesive layer 90 may be interposed between the fourth surface 52b of the second layer 52 and the fifth surface 53a of the third layer 53 to fill in the second valleys 72. In an embodiment, one or more second valleys 72 may be formed along the transmission line provided by the second layer 52.

In an embodiment, the third valley 73 may be formed on the sixth surface 53b of the third layer 53. In an embodiment, the adhesive layer 90 (e.g., the third adhesive layer 93) may be filled in the third valley 73. In an embodiment, the adhesive layer 90 may be interposed between the sixth surface 53b of the third layer 53 and the seventh surface 54a of the fourth layer 54 to fill in the third valleys 73. In an embodiment, one or more third valleys 73 may be formed along the transmission line provided by the third layer 53.

In an embodiment, the first waterproof member 81 may surround the entire FPCB 30.

In the conventional device in which the adhesive layer 90 interposed between the plurality of layers 50 is omitted, foreign substances can be introduced through the at least one valley portion 70 even when the plurality of layers 50 are pressed by the first sealing member 60 and/or surrounded by the first waterproof member 81. One or more non-limiting embodiments of the present disclosure prevent foreign matter from being introduced by providing a method of filling at least one valley 70 with an adhesive of a protective layer. It may be difficult to apply an adhesive to only some portions of the FPCB 30 or to apply an adhesive to only some segments such that the thicknesses thereof are different. Accordingly, the adhesive can be thickly applied to all segments of the FPCB 30 to prevent foreign matter from being introduced through the at least one valley 70, and this increases the total thickness of the FPCB 30. When the total thickness of the FPCB 30 increases, the shape of the FPCB 30 may be severely affected, and the volume of the electronic device 100 may increase.

The electronic device 100 according to the embodiment may block foreign matter that may be introduced through the at least one valley 70 by the above-described stepped laminated structure. For example, the FPCB 30 according to an embodiment may block foreign substances that may be introduced through the at least one valley 70 by the adhesive layer 90 interposed between the plurality of layers 50. Because the stepped laminate structure is partially formed in some sections (e.g., the second laminate portion 33) of the FPCB 30, the total thickness of the FPCB 30 may not be increased.

In the embodiment, since the FPCB 30 is pressed by the first sealing member 60 and/or the first waterproof member 81 surrounds the FPCB 30 to close the first receiving hole 63, it is possible to prevent foreign substances from being introduced between the first surface 51a of the first layer 51 and the first member 61. In addition, the first waterproof member 81 may be applied to the boundary of the first surface 51a of the first layer 51 and the first member 61, whereby foreign matter may be prevented from being introduced.

In an embodiment, foreign matter may be prevented from being introduced between the eighth surface 54b of the fourth layer 54 and the second member 62 by surrounding the FPCB 30 such that the FPCB 30 is pressed by the first sealing member 60 and/or the first waterproof member 81 closes the first receiving hole 63. In addition, the first waterproof member 81 may be applied to the boundary of the eighth surface 54b of the fourth layer 54 and the second member 62, whereby foreign matter may be prevented from being introduced.

By the above-described stepped laminated structure, the electronic device 100 according to the embodiment can prevent foreign substances from being introduced between the layers 50 of the FPCB 30 while maintaining the shape of the FPCB 30.

Fig. 6a illustrates an FPCB of an electronic device having a stepped laminated structure according to another embodiment. In fig. 6a, the FPCB is shown in a flat state for convenience of description. Direction 1 of fig. 6a may refer to a direction in which the FPCB 630 will bend.

Fig. 6b is a view illustrating a stepped laminate structure of an FPCB according to another embodiment. Fig. 6b may be a sectional view of the stepped laminate structure of the FPCB taken in a direction perpendicular to the longitudinal direction. In fig. 6b, the first member 61 and the second member 62 are shown together for ease of description.

Referring to fig. 6a and 6b, the FPCB 630 of the electronic device 600 according to another embodiment may not include at least one valley (e.g., the second valley 72 of fig. 5 c) formed in the second layer 52. For example, at least one valley may not be formed on the third surface 52a and the fourth surface 52b of the second layer 52. In an embodiment, the third layer 53 may not include at least one valley facing the second layer 52. For example, at least one valley may not be formed on the fifth surface 53a of the third layer 53. In this case, the second layer 52 may not be laminated on the third layer in the second lamination portion 633. The FPCB 630 according to an embodiment may not include an adhesive layer (e.g., the second adhesive layer 92 of fig. 4) for laminating the second layer 52 on the third layer 53. In another embodiment, when the third layer 53 includes at least one valley formed on the fifth surface 53a, the second layer 52 may be laminated on the third layer 53 through the adhesive layer 90 in the second lamination portion 633.

In an embodiment, the second layer 52 and the third layer 53 may be pressed by the first sealing member 60 and/or the first waterproof member 81, or the boundary between the second layer 52 and the third layer 53 may be sealed by the elastic force provided by the first sealing member 60 and/or the first waterproof member 81. Therefore, even when the second layer 52 and the third layer 53 are not laminated on each other in the second lamination portion 633, foreign substances are not introduced between the second layer 52 and the third layer 53.

In an embodiment, the first layer 51 may include a first valley 71 facing the second layer 52. For example, the first valley 71 may be formed on the second surface 51b of the first layer 51. In an embodiment, the second layer 52 may be laminated on the first layer 51 by the first adhesive layer 91 in the second lamination portion 633. In an embodiment, the first adhesive layer 91 may be interposed between the first layer 51 and the second layer 52 to fill at least in the first valleys 71.

In an embodiment, the fourth difference in segment lengths of the first layer 51 and the third layer 53 corresponding to the first curved portion 32 may be defined by the center angle θ and the second distance l ₂ And a third distance l ₃ The product of the sums represents (θ× (l) ₂ +l ₃ )). In an embodiment, the third layer 53 and the fourth layer 54 may be laminated on each other by a third adhesive layer 93. In an embodiment, the area where the first layer 51 and the second layer 52 are laminated on each other and the area where the third layer 53 and the fourth layer 54 are laminated on each other may be different. For example, the third layer 53 and the fourth layer 54 may be laminated on each other as follows: the area is at least smaller than the area where the first layer 51 and the second layer 52 are laminated on each other by an area corresponding to the fourth difference.

Fig. 6c is a view illustrating a stepped laminate structure of an FPCB according to another embodiment. Fig. 6c may be a sectional view of the stepped laminate structure of the FPCB taken in a direction perpendicular to the longitudinal direction. In fig. 6c, the first member 61 and the second member 62 are shown together for ease of description.

Referring to fig. 6c, the FPCB 630-1 of the electronic device 600-1 according to another embodiment may not include at least one valley (e.g., the first valley of fig. 5 c) formed in the first layer 51. For example, at least one valley may not be formed on the first surface 51a and the second surface 51b of the first layer 51. In an embodiment, the at least one valley may not be formed on the third surface 52a of the second layer 52 facing the first layer 51. In this case, the first layer 51 and the second layer 52 may not be laminated on each other. The FPCB 630-1 according to an embodiment may not include an adhesive layer (e.g., the first adhesive layer 91 of fig. 4) for laminating the first layer 51 and the second layer 52.

In an embodiment, the first layer 51 and the second layer 52 may be pressed by the first sealing member 60 and/or the first waterproof member 81. In an embodiment, the boundary of the first layer 51 and the second layer 52 may be sealed by the elastic force provided by the first sealing member 60 and/or the first waterproof member 81. Therefore, even when the first layer 51 and the second layer 52 are not laminated on each other in the second lamination portion 633-1, foreign substances are not introduced between the first layer 51 and the second layer 52.

The FPCB 630-1 of the electronic device 600-1 according to the embodiment may not include at least one valley formed in the fourth layer 54. For example, at least one valley may not be formed on the seventh surface 54a and the eighth surface 54b of the fourth layer 54. In an embodiment, the third valley 73 may be formed on the sixth surface 53b of the third layer 53 facing the fourth layer 54. In an embodiment, the third layer 53 and the fourth layer 54 may be laminated to one another by an adhesive layer 90. In an embodiment, an adhesive layer may be at least between the third layer 53 and the fourth layer 54 to fill in the third valleys 73.

In the embodiment, in the second lamination portion 633-1, the area where the second layer 52 and the third layer 53 are laminated on each other and the area where the third layer 53 and the fourth layer 54 are laminated on each other may be different. The above description of the stepped laminate structure may be applied thereto in substantially the same, similar or corresponding versions.

In an embodiment, the first layer 51 and the fourth layer 54, which do not include at least one valley and are located on the outermost layer among the plurality of layers 50 of the FPCB 630-1, may include a shielding layer. In an embodiment, the shielding layer may improve signal transmission performance of the FPCB 630-1 by shielding electromagnetic waves that may be delivered to (from) electronic components located around the FPCB 630-1. In an embodiment, the shielding layer includes a film having a conductive metal layer, but the present disclosure is not limited thereto.

Fig. 6d is a view illustrating a stepped laminate structure of the FPCB according to another embodiment. Fig. 6d may be a sectional view of the stepped laminate structure of the FPCB taken in a direction perpendicular to the longitudinal direction. In fig. 6d, the first member 61 and the second member 62 are shown together for ease of description.

Referring to fig. 6d, in an embodiment, the plurality of layers 50 of the FPCB 630-2 may include a first layer 51, a second layer 52, and a third layer 53. In an embodiment, the plurality of layers 50 of the FPCB 630-2 may not include a fourth layer (e.g., the fourth layer 54 of fig. 4).

The FPCB 630-2 of the electronic device 600-2 according to the embodiment may include a first valley 71 formed in the first layer 51. The first valley 71 may be formed on the second surface 51b of the first layer 51.

The FPCB 630-2 according to an embodiment may include a second valley 72 formed in the second layer 52. In an embodiment, the second valleys 72 may be formed on the third surface 52a and the fourth surface 52b of the second layer 52.

In an embodiment, the first layer 51 and the second layer 52 may be laminated to each other by an adhesive layer 90. For example, the first layer 51 and the second layer 52 may be laminated on each other with the adhesive layer 90 interposed therebetween to fill in the first valley 71 and the second valley 72 formed on the third surface 52 a.

The FPCB 630-2 according to an embodiment may include at least one valley formed in the third layer 53. For example, at least one valley (e.g., third valley 73 of fig. 6 c) may not be formed on fifth surface 53a and sixth surface 53b of third layer 53.

In an embodiment, the first layer 51 and the second layer 52 may be laminated to each other by an adhesive layer 90. For example, the second layer 52 and the third layer 53 may be laminated on each other with the adhesive layer 90 interposed therebetween to fill in the second valleys 72 formed on the fourth surface 52 b.

In the embodiment, in the second lamination portion 633-2, the area where the first layer 51 and the second layer 52 are laminated on each other and the area where the second layer 52 and the third layer 53 are laminated on each other may be different. The above description of the stepped laminate structure may be applied thereto in substantially the same, similar or corresponding versions.

Fig. 6e is a view illustrating a stepped laminate structure of an FPCB according to another embodiment. Fig. 6e may be a sectional view of the stepped laminate structure of the FPCB taken in a direction perpendicular to the longitudinal direction. In fig. 6e, the first member 61 and the second member 62 are shown together for ease of description.

Referring to fig. 6e, in an embodiment, the plurality of layers 50 of the FPCB 630-3 may include a first layer 51 and a second layer 52. In an embodiment, the plurality of layers 50 of the FPCB 630-3 may not include the third layer 53 (e.g., the third layer 53 of fig. 4) and the fourth layer (e.g., the fourth layer 54 of fig. 4).

The FPCB 630-3 of the electronic device 600-3 according to the embodiment may include first and second valleys 71 and 72 formed in the first and second layers 51 and 52, respectively. In an embodiment, the first and second valleys 71 and 72 may be formed on opposite surfaces of the first and second layers 51 and 52. For example, the first valley 71 may be formed on the second surface 51b of the first layer 51, and the second valley 72 may be formed on the third surface 52a of the second layer 52.

In an embodiment, in the second lamination portion 633-3, the first layer 51 and the second layer 52 may be laminated on each other. For example, the first layer 51 and the second layer 52 may be laminated to one another by an adhesive layer 90. In an embodiment, the adhesive layer 90 may be interposed between the first layer 51 and the second layer 52. In an embodiment, the adhesive layer 90 may be filled in the first and second valleys 71 and 72.

The FPCB of the electronic device according to various embodiments of the present disclosure may include a plurality of layers. For example, the FPCB 30 of the electronic device 100 of fig. 4 may include a plurality of layers 50 having first to fourth layers 51 to 54. As another example, the FPCB 630-2 of the electronic device 600-2 of fig. 6d may include a plurality of layers 50 having first to third layers 51, 52 and 53. As another example, the FPCB 630-3 of the electronic device 600-3 of fig. 6e may include a plurality of layers 50 having a first layer 51 and a second layer 52.

The FPCB according to various embodiments of the present disclosure may include at least one valley formed in at least one of the plurality of layers. For example, the FPCB 30 of the electronic device 100 of fig. 5c may include a plurality of layers 50 having first to fourth layers 51 to 54. As another example, the FPCB 630 of the electronic device 600 of fig. 6b may include at least one valley 70 formed in the first layer 51 and the third layer 53, respectively. As another example, the FPCB 630-1 of the electronic device 600-1 of fig. 6c may include at least one valley 70 formed in the second layer 52 and the third layer 53, respectively.

At least one layer of the plurality of layers of the FPCB 30 according to the present disclosure may include at least one valley formed on one surface or an opposite surface thereof. For example, the FPCB 30 of fig. 5c may include at least one valley 70 (e.g., first to third valleys 71 to 73) formed on surfaces (e.g., the second, fourth and sixth surfaces 51b, 52b and 53 b) of the first, second and third layers 51, 52 and 53. As another example, the FPCB 630-2 of fig. 6d may include second valleys 72 formed on opposite surfaces (e.g., the third surface 52 and the fourth surface 52 b) of the second layer 52.

The FPCB of the electronic device according to various embodiments of the present disclosure may include a portion in which at least two layers of the plurality of layers are laminated on each other in the second lamination portion. For example, the FPCB 30 of fig. 4 may include a portion in which the first to fourth layers 51 to 54 are laminated on each other in the second lamination portion 33. As another example, the FPCB 630-1 of fig. 6c may include a portion in which the second layer 52, the third layer 53, and the fourth layer 54 are laminated on each other in the second lamination portion 633-1. As another example, the FPCB 630-3 of fig. 6e may include a portion in which the first layer 51 and the second layer 52 are laminated on each other in the second lamination portion 633-3.

The FPCB according to an embodiment of the present disclosure may include a portion in which at least three layers of the plurality of layers are separated from each other in the second laminate part 33. For example, the FPCB 30 of fig. 4 may include a portion in which the first to fourth layers 51 to 54 are laminated on each other in the third section 33a of the second lamination portion 33 among the plurality of layers 50. As another example, the FPCB 630-2 of fig. 6d may include a portion of the first to third layers 51, 52 and 53 among the plurality of layers 50, which are separated from each other in the second laminated portion 633-2.

Fig. 7a shows the electronic device in a flat state according to an embodiment.

Fig. 7c is a view of the electronic device showing a direction facing the hinge structure in a flat state.

Referring to fig. 7a, 7b and 7c, the electronic device 100 according to the embodiment may include a second sealing member 65, a second waterproof member 82, a second adhesive member 87 and a second plate structure 77. In embodiments, the description provided with reference to the first sealing member 60, the first waterproof member 81, the first adhesive member 86, and the first plate structure 76 may apply to the second sealing member 65, the second waterproof member 82, the second adhesive member 87, and the second plate structure 77 in substantially the same, similar, or corresponding schemes. For example, the second sealing member 65 may be disposed in the second through hole 20 formed in the second support member 121. The second sealing member 65 may include a third member 66 and a fourth member 67. A portion of the FPCB 30 passing through the second through hole 20 may be surrounded by the second sealing member 65 and/or the second waterproof member 82. The second waterproof member 82 may be disposed on the second sealing member 65 in the second through hole 20. The second waterproof member 82 may be formed to surround the fifth laminated portion 39 of the FPCB 30 extending beyond the second sealing member 65 in the second through hole 20. The second adhesive member 87 may partially bond the second plate structure 77 and the second sealing member 65. The second plate structure 77 may be disposed between the second support member 121 and the display 140. The second plate structure 77 may include a third plate 773 partially contacting the third member 66 and a fourth plate 774 disposed between the third plate 773 and the display 140.

The FPCB 30 according to the embodiment may include a folded portion 36, a fourth laminated portion 37, a third bent portion 38, a fifth laminated portion 39, and a fourth bent portion 40.

In an embodiment, the folded portion 36 may extend from the third laminated portion 35 to the fourth laminated portion 37. For example, the folded portion 36 may extend from the third laminated portion 35 to the fourth laminated portion 37 across the hinge housing 130 (or hinge structure 200). In an embodiment, the folded portion 36 may be located between the hinge housing 130 and the display 140. In an embodiment, the folded portion 36 may be configured to be at least partially curved and may be deformed according to a folding operation of the electronic device 100.

In the embodiment, the descriptions corresponding to the third laminated portion 35, the second bent portion 34, the second laminated portion 33, and the first bent portion 32 may be applied to the fourth laminated portion 37, the third bent portion 38, the fifth laminated portion 39, and the fourth bent portion 40 in substantially the same, similar, or corresponding schemes. For example, the fourth curved portion 40 may include a plurality of sections where the layer 50 is curved and may extend from a point between the second rear plate 129 and the second support member 121 to the second through hole 20. The fifth laminated portion 39 may extend from the fourth bent portion 40 to the second sealing member 65 in the second through hole 20. In the embodiment, the stepped laminate structure provided in the second laminate section 33 may also be provided in the fifth laminate section 39. By the stepped laminate structure provided in the second laminate part 33 and the fifth laminate part 39, foreign substances that may be introduced through paths (e.g., the first path (1) and the second path (2)) between the plurality of layers 50 of the FPCB 30 may be blocked. The third curved portion 38 may extend from the fifth laminated portion 39 to the outside of the second through hole 20. For example, the third curved portion 38 may extend from the fifth laminated portion 39 to a point between the second support member 121 and the second region 142 of the display 140. The fourth lamination portion 37 may extend from the third bending portion 38 to the folding portion 36 and may be at least partially supported by the second support member 121.

In an embodiment, the FPCB 30 may be disposed to partially overlap the hole formed in the first plate structure 76. For example, first and second holes 761h and 762h that at least partially overlap each other (or at least partially align with each other) may be formed in the first and second plates 761 and 762. The second curved portion 34, the third laminated portion 35, and the folded portion 36 of the FPCB 30 may partially overlap the first hole 761h and the second hole 762h. In an embodiment, the FPCB 30 may be at least partially located in the first and second holes 761h and 762h (e.g., the third laminated portion 35 and/or the second bent portion 34), but the disclosure is not limited thereto.

In an embodiment, the first hole 761h and the second hole 762h may provide a space in which the second curved portion 34 of the FPCB 30 extends into the first through hole 10 in a curved manner. In an embodiment, the first hole 761h and the second hole 762h may define a space that prevents the second curved portion 34 from contacting the display 140 when the second curved portion 34 is abnormally curved due to a defect in a folding operation of the electronic device 100 or in the process of forming the FPCB 30.

In an embodiment, the FPCB 30 may be disposed to partially overlap the hole formed in the second plate structure 77. For example, third and fourth holes 773h and 774h may be formed in the third and fourth plates 773 and 774 to at least partially overlap each other (or at least partially align with each other). The fourth laminated portion 37, the third bent portion 38, and the folded portion 36 of the FPCB 30 may partially overlap the third hole 773h and the fourth hole 774h. In an embodiment, the FPCB 30 may be at least partially located in the third hole 773h and the fourth hole 774h (e.g., the fourth lamination portion 37 and/or the third bending portion 38), but the disclosure is not limited thereto.

In an embodiment, the third hole 773h and the fourth hole 774h may define a space in which the third bent portion 38 of the FPCB 30 extends into the second through hole 20 in a bent manner. In an embodiment, the third hole 773h and the fourth hole 774h may define a space that prevents the third bending part 38 from contacting the display 140 when the third bending part 38 is abnormally bent due to a folding operation of the electronic device 100 or a defect in the process of forming the FPCB 30.

Referring to fig. 7c and fig. 7a and 7b, the hinge structure 200 according to the embodiment may include a first rotation structure 210, a second rotation structure 220, and a gear structure 730. In an embodiment, the hinge structure 200 may be at least partially disposed in an interior space provided by the hinge housing 130.

In an embodiment, the first rotating structure 210 may include a first shaft 710, a first rotating arm 712, and a first plate structure 76.

In an embodiment, the first shaft 710 may be long along its axial direction. In an embodiment, the first rotating arm 712 may be connected to the first shaft 710. In an embodiment, the first rotating arm 712 may be configured to rotate with the first shaft 710 or to rotate independently of the first shaft 710. In an embodiment, the first rotating arms 712 may be disposed at opposite ends of the first shaft 710, and the first plate structure 76 may be disposed between the first rotating arms 712. The first plate structure 76 may be coupled to the first rotating arm 712 and may rotate with the first rotating arm 712. For example, the first plate structure 76 may be fixedly coupled to the first rotary arm 712 by a fixing member such as a screw 735.

In an embodiment, the first rotary arm 712 may be connected to the first housing 110 (not shown in fig. 7 c). For example, the first support member 111 of the first housing 110 may be coupled to the first rotating arm 712 by a coupling member (e.g., a screw 735). In an embodiment, the first housing 110 may be rotatable by a first rotating arm 712.

In an embodiment, the first rotating structure 210 may include a second plate 762 of the first plate structure 76 and a first support surface 711a formed by the first rotating arm 712. In an embodiment, the first support surface 711a may be formed to be substantially flat and may support the display 140 disposed thereon.

In an embodiment, the second rotating structure 220 may include a second shaft 720, a second rotating arm 722, and a second plate structure 77.

In an embodiment, the second shaft 720 may be long extending along its axial direction. For example, the second shaft 720 may be spaced apart from the first shaft 710 and may extend substantially parallel to the first shaft 710. In an embodiment, the second rotating arm 722 may be connected to the second shaft 720. In an embodiment, the second rotating arm 722 may be configured to rotate with the second shaft 720 or to rotate independently of the first shaft 720. In an embodiment, the second rotating arms 722 may be disposed at opposite ends of the second shaft 720, and the second plate structure 77 may be disposed between the second rotating arms 722. The second plate structure 77 may be coupled to the second rotating arm 722 and may rotate together with the second rotating arm 722.

In an embodiment, the second rotating arm 722 may be connected to the second housing 120 (not shown in fig. 7 c). For example, the second support member 121 of the second housing 120 may be coupled to the second rotating arm 722. In an embodiment, the second housing 120 may be rotatable by a second rotating arm 722.

In an embodiment, the second rotating structure 220 may include a fourth plate 774 of the second plate structure 77 and a second support surface 713a formed by the second rotating arm 722. In an embodiment, the second support surface 713a may be formed substantially flat and may support the display 140 disposed thereon. In an embodiment, when the electronic device 100 is in a flat state, the first support surface 711a and the second support surface 713a may define one substantially flat surface, and a partial region (e.g., the folded region 143) of the display 140 disposed on the first support surface 711a and the second support surface 713a may be maintained in the substantially flat state.

Although it has been described that the electronic device according to various embodiments of the present disclosure is of a foldable type that allows a folding operation, the present disclosure is not limited thereto. For example, the electronic device may include a bar-type electronic device or an electronic device that does not support a folding operation. As another example, the electronic device may include a slidable electronic device in which a screen display area of the display may be expanded or contracted by a sliding operation. The stepped laminate structure of the FPCB according to various embodiments of the present disclosure may also be applicable to the following cases: the FPCB of the above-described various forms of electronic devices passes through a through hole provided in a support member or the like, and includes a portion bent with respect to the through hole.

Fig. 8a illustrates the FPCB 30 according to an embodiment. In fig. 8a, an extension direction "E" may be defined. For example, the extending direction "E" may be a direction substantially perpendicular to the axial direction of the electronic device 100. As another example, the extending direction "E" may be a longitudinal direction of the second laminated portion 33 (or the fifth laminated portion 39) of the FPCB 30. As another example, the extending direction "E" may be a direction substantially the same as the extending direction of the second lamination portion 33 (or the fifth lamination portion 39) of the FPCB 30. The extending direction "E" may include a first extending direction E1 and a second extending direction E2. For example, the first extension direction E1 may be a direction from the second housing (e.g., the second housing 120 of fig. 3 c) toward the first housing (e.g., the first housing 110 of fig. 3 c). As another example, the first extension direction E1 may be a direction facing the second connector portion 30b from the first connector portion 30a of the FPCB 30. The second extension direction E2 may be a direction opposite to the first extension direction E1.

Referring to fig. 8a, the first lamination portion 31 according to the embodiment may include at least some of two portions extending after branching in the second extension direction E2, and the first connector portion 30a and the third connector portion 30c may extend from the two portions.

In an embodiment, the fourth bent portion 40 may extend from the fifth laminated portion 39 in a direction different from the extending direction of the fifth laminated portion 39. For example, the fourth bent portion 40 may extend from the fifth laminated portion 39 in a direction substantially perpendicular to the extending direction "E".

The FPCB 30 according to the embodiment may include a fixing portion 45, a sixth lamination portion 41, a seventh lamination portion 42, a connection portion 43, and an eighth lamination portion 44.

In an embodiment, the fixing portion 45 may extend from the fourth bending portion 40 in the second extending direction E2. In an embodiment, the fixing portion 45 may be connected and fixed to a second support member (e.g., the second support member 121 of fig. 3 c) of a second housing (e.g., the second housing 120 of fig. 3 c).

In an embodiment, the sixth laminate section 41 may extend from the fourth curved section 40 toward the connection section 43. For example, the sixth laminate section 41 may include a first portion extending in the first extending direction E1 from the fourth curved section 40 by a first width, and a second portion extending in the first extending direction E1 from the first portion by a second width smaller than the first width. In the embodiment, the second portion of the sixth laminate section 41 may be longer than the first portion with respect to the extending direction "E", but the present disclosure is not limited thereto.

In an embodiment, portions of at least two layers of the plurality of layers 50 (see fig. 8 b) corresponding to the sixth lamination portion 41 may be laminated on each other. For example, when the plurality of layers 50 includes the first layer to the fifth layer, the fourth layer and the fifth layer may be laminated on each other, but the present disclosure is not limited to the above example.

In an embodiment, the seventh laminate section 42 may extend from the sixth laminate section 41. For example, the seventh lamination portion 42 may extend from one side of the first portion of the sixth lamination portion 41 (e.g., the right side of the sixth lamination portion 41 as illustrated with reference to fig. 8 a) in a direction (e.g., an axial direction) substantially perpendicular to the extending direction "E".

In an embodiment, portions of at least two layers of the plurality of layers 50 corresponding to the seventh laminated portion 42 may be laminated on each other. For example, when the plurality of layers 50 includes the first layer to the fifth layer, the first layer and the second layer of the seventh lamination portion 42 may be laminated on each other, but the present disclosure is not limited to the above example.

In an embodiment, the fourth connector portion 30d may extend from the seventh laminate portion 42.

In an embodiment, the connection portion 43 may extend from the sixth lamination portion 41 to the eighth lamination portion 44. In an embodiment, the connection portion 43 may include a portion extending in a flat state of the FPCB 30 to be inclined with respect to the extending direction "E" and a portion extending along the first extending direction E1. In an embodiment, the connection portion 43 may be formed to be at least partially curved. For example, portions of the plurality of layers 50 corresponding to the connection portions 43 may not be laminated on each other.

In an embodiment, the eighth laminated portion 44 may extend from the connection portion 43 in a direction (e.g., an axial direction) substantially perpendicular to the extending direction "E". In an embodiment, at least two layers of the plurality of layers corresponding to the eighth lamination portion 44 may be laminated on each other. For example, all of the layers corresponding to the eighth laminated portion 44 of the plurality of layers may be laminated on each other, but the present disclosure is not limited to the above example. In an embodiment, the eighth laminate section 44 may be formed to be at least partially rigid, but the present disclosure is not limited to the above examples. In an embodiment, the second connector portion 30b may extend from the eighth laminate portion 44 (e.g., in a direction perpendicular to the extending direction "E").

In the embodiment, the portions extending from the second laminated portion 33 and the fifth laminated portion 39 of the FPCB 30 (e.g., the first laminated portion 31, the first bent portion 32, the second bent portion 34, the folded portion 36, the third bent portion 38, etc.) have been described with respect to the extending direction "E", but the shape of the FPCB 30 is not limited to the illustrated embodiment, and various design modifications may be made as long as modifications can be easily made by one of ordinary skill in the art.

Fig. 8b is a view illustrating a method for laminating a plurality of layers (e.g., layers 51, 52, 53, and 54) of the FPCB according to an embodiment. Referring to fig. 8b, the first layer 51 may be first provided, and the first adhesive layer 91 may be applied to the second laminated portion 33 and the fifth laminated portion 39 of the second layer 52. The second layer 52 to which the first adhesive layer 91 is applied may be laminated on the first layer 51. In an embodiment, the second adhesive layer 92 may be applied to the second laminated portion 33 and the fifth laminated portion 39 of the third layer 53. In an embodiment, the second adhesive layer 92 may be applied to the second lamination portion 33 and the fifth lamination portion 39 in an area smaller than the area of the first adhesive layer 91 by the first area A1. In an embodiment, the third layer 53 with the second adhesive layer 92 applied thereto may be laminated on the second layer 52. In an embodiment, the third adhesive layer 93 may be applied to the second laminated portion 33 and the fifth laminated portion 39 of the fourth layer 54. In an embodiment, the third adhesive layer 93 may be applied to the second lamination portion 33 and the fifth lamination portion 39 in an area smaller than the area of the second adhesive layer 92 by the second area A2. In an embodiment, the fourth layer 54 to which the third adhesive layer 93 is applied may be laminated on the third layer 53.

In an embodiment, after the first to fourth layers 51 to 54 are laminated, the applied first to third adhesive layers 91 to 93 may be cured.

In the embodiment, although it is described that the difference between the areas of the first to third adhesive layers 91 to 93 applied to the second lamination portion 33 and the areas of the first to third adhesive layers 91 to 93 applied to the fifth lamination portion 39 is the same, the present disclosure is not limited thereto.

For example, the second adhesive layer 92 applied to the fifth laminated portion 39 of the third layer 53 may be applied with an area smaller than that of the first adhesive layer 91 applied to the fifth laminated portion 39 of the second layer 52 by a third area. The third area may be different from the first area A1. As another example, the third adhesive layer 93 applied to the fifth laminate 39 of the fourth layer 54 may be applied with an area smaller than the area of the second adhesive layer 92 applied to the fifth laminate 39 of the third layer 53 by a fourth area. The fourth area may be different from the second area A2.

Fig. 9a shows an electronic device according to an embodiment. In fig. 9a, for convenience of description, a description of a configuration (e.g., the first connector portion 30a and the third connector portion 30c of fig. 8 a) extending from the first laminate portion 31 of the FPCB 30 except for the first bent portion 32 is omitted. Further, in fig. 9a, the description of other configurations (e.g., the connection portion 43, the eighth lamination portion 44, and the second connector portion 30b of fig. 8 a) extending from the sixth lamination portion 41 is omitted for convenience of description.

Fig. 9b shows a second laminate section corresponding to region 903 of fig. 9 a.

Referring to fig. 9a, an electronic device 900 (e.g., the electronic device 100 of fig. 7 a) according to another embodiment may include the FPCB 30. Unlike the illustration of fig. 7a, the first laminate part 31 of the FPCB 30 may be located between the first through hole 10 and the second case 120. The first curved portion 32 may extend from the first lamination portion 31 in a direction that becomes more and more distant from the second housing 120. The first curved portion 32 may extend from the first lamination portion 31 to the first through hole 10. The second lamination portion 33 may extend from the first bending portion 32 to the first through hole 10. Unlike the illustration of fig. 7a, the first and second lamination portions 32 and 33 may include a portion bent in a counterclockwise direction with respect to a direction extending from the first lamination portion 31.

Since the bending direction of the second laminated portion 33 is different, the stepped laminated structure of the second laminated portion 33 may be constructed opposite to that shown in fig. 5. For example, referring to fig. 9b, the first layer 51 and the second layer 52 of the second laminate section 33 may be laminated on each other by a first adhesive layer 91 interposed therebetween. The second layer 52 and the third layer 53 may be laminated to each other with a second adhesive layer 92 interposed therebetween. The third layer 53 and the fourth layer 54 may be laminated on each other with a third adhesive layer 93 interposed therebetween. The first end 91a of the first adhesive layer 91 may be closer to the line C3 than the second end 92 a. For example, the first end 91a of the first adhesive layer 91 may be formed with a third difference (Δd of fig. 5b ₃ ) Closer to line C3 than second end 92 a. The second end 92a of the second adhesive layer 92 may be closer to the line C3 than the third end 93 a. For example, the second end 92a of the second adhesive layer 92 may be formed with a second difference (Δd of fig. 5b ₂ ) Closer to the line C3 than the third end 93 a. The line C3 may be any reference line passing through all of the first adhesive layer 91, the second adhesive layer 92, and the third adhesive layer 93 in a direction perpendicular to the extending direction of the second laminated portion 33.

Unlike the illustration of fig. 7a, the sixth laminate part 41 of the FPCB 30 may be located between the second through hole 20 and the first case 110. The fourth bending portion 40 may extend from the sixth lamination portion 41 in a direction that becomes more and more distant from the first housing 110. The fourth bent portion 40 may extend from the sixth laminated portion 41 to the second through hole 20. The fifth laminated portion 39 may extend from the fourth bent portion 40 in the second through hole 20. Unlike the illustration of fig. 7a, the fourth curved portion 40 and the fifth laminated portion 39 may include a portion curved in a clockwise direction with respect to a direction extending from the sixth laminated portion 41. Since the bending directions of the fifth laminated portions 39 are different, the stepped laminated structure of the fifth laminated portions 39 may be constructed opposite to the stepped laminated structure of the second laminated portion 33. For example, the stepped laminate structure of the fifth laminate section 39 may be substantially the same as or similar to the stepped laminate structure shown in fig. 5 b.

An electronic device (e.g., electronic device 100 of fig. 4) according to an embodiment may include: a first housing (e.g., first housing 110 of fig. 4) including a first through hole (e.g., first through hole 10 of fig. 4) having a first opening (e.g., first opening 11 of fig. 4) and a second opening (e.g., second opening 12 of fig. 4) in communication with each other; a second housing (e.g., second housing 120 of fig. 3 a) rotatably connected to the first housing; an FPCB (e.g., FPCB 30 of fig. 4) extending from the first case to the second case via the first through hole and including a plurality of layers (e.g., a plurality of layers 50 of fig. 4); and a first sealing member (e.g., first sealing member 60 of fig. 4) disposed in the first through hole and surrounding the FPCB, the FPCB may include: a first lamination portion (e.g., first lamination portion 31 of fig. 4) that extends in a direction that may be different from an extending direction of the first through hole in the first housing and that includes a portion in which a plurality of layers are at least partially laminated on each other; a first curved portion (e.g., first curved portion 32 of fig. 4) extending from the first laminate portion through the first opening and including a portion where the plurality of layers are separated from each other; a second lamination portion (e.g., second lamination portion 33 of fig. 4) extending from the first bending portion toward the first sealing member; and a second bending portion (e.g., second bending portion 34 of fig. 4) extending from the second lamination portion toward the second case via the second opening, the plurality of layers may include a first layer (e.g., first layer 51 of fig. 4) and a second layer (e.g., second layer 52 of fig. 4), a portion of the first layer and/or the second layer corresponding to the second lamination portion may include at least one first valley (e.g., first valley 71 of fig. 5 c) extending from a surface facing the adjacent layer in a longitudinal direction of the FPCB, and the second lamination portion may include a first adhesive layer (e.g., first adhesive layer 91 of fig. 5 b) interposed between the first layer and the second layer to fill in the at least one first valley.

In an embodiment, the plurality of layers may include a third layer (e.g., the third layer 53 of fig. 4), and the second layer may be located between the first layer and the third layer, a portion of the second layer and/or the third layer corresponding to the second lamination portion may include at least one second valley (e.g., the second valley 72 of fig. 5 c) extending from a surface facing the adjacent layer in the longitudinal direction of the FPCB, the second lamination portion may include a second adhesive layer interposed between the second layer and the third layer to fill in the at least one second valley, and an area of the first adhesive layer may be different from an area of the second adhesive layer.

In an embodiment, the portion of the first layer corresponding to the first curved portion may be curved to have a smaller radius than the portion of the second layer corresponding to the first curved portion, the portion of the second layer corresponding to the first curved portion may be curved to have a smaller radius than the portion of the third layer corresponding to the first curved portion, the first adhesive layer may include a first end portion (e.g., first end portion 91a of fig. 5 b) facing the first opening, the second adhesive layer may include a second end portion (e.g., second end portion 92a of fig. 5 b) facing the first opening, and the first end portion may be closer to the first opening than the second end portion.

In an embodiment, the plurality of layers may include a fourth layer (e.g., fourth layer 54 of fig. 4), and the third layer 53 may be located between the second layer 52 and the fourth layer 54, and a portion of the third layer 53 and/or the fourth layer 54 corresponding to the second lamination portion may include at least one third valley (e.g., third valley 73 of fig. 5 c) extending from a surface facing the adjacent layer in a longitudinal direction of the FPCB, the second lamination portion may include a third adhesive layer (e.g., third adhesive layer 93 of fig. 4) interposed between the third layer 53 and the fourth layer 54 to fill in the at least one third valley, and an area of the third adhesive layer 93 may be different from an area of the second adhesive layer 92.

In an embodiment, a portion of the third layer 53 corresponding to the first curved portion may be curved to have a radius smaller than a radius of a portion of the fourth layer 54 corresponding to the first curved portion, the third adhesive layer 93 may include a third end portion (e.g., the third end portion 93a of fig. 5 b) facing the first opening, and the second end portion may be closer to the first opening than the third end portion.

In an embodiment, at least one first valley may be formed only in the second layer 52, at least one third valley may be formed only in the third layer 53, the first layer 51 and the fourth layer 54 may be located at outermost sides of the plurality of layers, and the first layer 51 and the fourth layer 54 may be shielding layers including conductive metal layers.

In an embodiment, the second lamination portion may include a first segment (e.g., the third segment 33a of fig. 4) and a second segment (e.g., the fourth segment 33b of fig. 4) extending from the first segment toward the first sealing member, the first end of the first adhesive layer, the second end of the second adhesive layer, and the third end of the third adhesive layer may be located in the first segment, and portions of the first adhesive layer, the second adhesive layer, and the third adhesive layer corresponding to the first segment may extend to the second segment.

In an embodiment, the first sealing member 60 may include a first member (e.g., the first member 61 of fig. 4) and a second member (e.g., the second member 62 of fig. 4) that together surround the FPCB, and the second segment of the second laminate portion may extend to a point between the first member and the second member.

In an embodiment, the first housing 110 may include: a first support member (e.g., first support member 111 of fig. 4) having a first through hole; and a first back plate (e.g., first back plate 119 of fig. 4) coupled to the first support member, the first opening of the first through hole may be located between the first back plate and the second opening, and the first curved portion may extend into the first through hole between the first back plate and the first support member.

In an embodiment, the first opening of the first through hole may be substantially parallel to the first rear plate.

In an embodiment, the first layer and/or the second layer having at least one first valley may include a base layer (e.g., base layer 503 of fig. 5 c) and a transmission line (e.g., transmission line 505 of fig. 5 c) formed on the base layer, and the at least one first valley may be defined as a result of the transmission lines being spaced apart from one another on the base layer.

In an embodiment, the electronic device 100 may include: a first flashing member (e.g., first flashing member 81 of fig. 4) disposed on the first sealing member to at least partially surround the second laminate portion.

In an embodiment, the electronic device 100 may include a first printed circuit board (e.g., the first printed circuit board 151 of fig. 1) disposed in the first case and a second printed circuit board (e.g., the second printed circuit board 152 of fig. 1) disposed in the second case, and the first and second printed circuit boards may be electrically connected to each other through the FPCB.

In an embodiment, the electronic device 100 may include a second sealing member (e.g., the second sealing member 65 of fig. 7 a) and a second waterproof member (e.g., the second waterproof member 82 of fig. 7 a), the second case may include a second through hole (e.g., the second through hole 20 of fig. 7 a) extending in a direction different from the first laminated portion, a plurality of layers of the FPCB may pass through the second through hole, and the second sealing member may be disposed in the second through hole to surround the FPCB, the FPCB may include a third laminated portion (e.g., the fifth laminated portion 39 of fig. 7 a) located in the second through hole adjacent to the second sealing member, the second waterproof member may be disposed in the second through hole to at least partially surround the third laminated portion, and a portion of the first layer and/or the third layer corresponding to the third laminated portion may include at least one second valley extending from a surface facing the adjacent layer in a longitudinal direction of the FPCB, and the third laminated portion may include a second valley between the first layer and the second layer filling the second valley in the at least one of the second layers.

A foldable electronic device (e.g., electronic device 100 of fig. 4) according to an embodiment may include: a first housing (e.g., first housing 110 of fig. 4) including a first through hole (e.g., first through hole 10 of fig. 4), a first opening (e.g., first opening 11 of fig. 4) and a second opening (e.g., second opening 12 of fig. 4) of the first through hole communicating with each other; a second housing (e.g., second housing 120 of FIG. 3 a) thatThe body is rotatably connected to the first housing; an FPCB (e.g., FPCB 30 of fig. 4) extending from the first case to the second case via the first through hole and including a plurality of layers; a first sealing member (e.g., the first sealing member 60 of fig. 4) disposed in the first through hole to surround the FPCG and providing an elastic force in a direction facing an inner wall of the first through hole (e.g., the inner surface 13 of fig. 4) and a direction facing the FPCB; and a first waterproof member (e.g., first waterproof member 81 of fig. 4) located in the first through hole and formed on the first sealing member to surround the FPCB, the FPCB may include: a first curved portion (e.g., first curved portion 32 of fig. 4) extending from an outside of the first through hole to an inside of the first through hole via the first opening, wherein the first curved portion includes a section (e.g., second section 32b of fig. 4) curved from a first point (e.g., boundary S1 of fig. 5 a) on the outside of the first opening to a second point (e.g., starting point S2 of fig. 5 a) in the inside of the first through hole; a first lamination portion (e.g., the second lamination portion 33 of fig. 4) including a first segment (e.g., the third segment 33a of fig. 4) extending from the first curved portion and a second segment (e.g., the fourth segment 33b of fig. 4) extending from the first segment toward the first sealing member, the plurality of layers including a first layer (e.g., the first layer 51 of fig. 4), a second layer (e.g., the second layer 52 of fig. 4) laminated on the first layer, and a third layer (e.g., the third layer 53 of fig. 4) laminated on the second layer, the first layer including at least one first valley (e.g., the first valley 71 of fig. 5 c) formed on a surface facing the second layer, the second layer including at least one second valley (e.g., the second valley 72 of fig. 5 c) formed on a surface facing the third layer, the first lamination portion including a first adhesive layer (e.g., the first adhesive layer 91 of fig. 4) and a second adhesive layer (e.g., the second adhesive layer 92 of fig. 4), the first adhesive layer being interposed between the first and second adhesive layer and the second adhesive layer (e.g., the second adhesive layer 92) and the second adhesive layer being filled between the first and second layer and the second layer at least a second valley between the first and second layer and the second valley portion The first area A1), and the first area may be based on a center angle formed by the first point and the second point with respect to a center of curvature of a curved section of the first curved portion (e.g., a center angle θ of fig. 5 a) and a separation distance between the second layer and the third layer (e.g., a second distance l of fig. 5 a) ₂ ) And defined.

In an embodiment, the first area A1 may be defined by the center angle θ and the separation distance (e.g., the second distance l ₂ ) Is defined by the product of (a).

Fig. 10 is a block diagram illustrating an electronic device 1001 in a network environment 1000 in accordance with various embodiments. Referring to fig. 10, an electronic device 1001 in a network environment 1000 may communicate with the electronic device 1002 via a first network 1098 (e.g., a short-range wireless communication network) or with at least one of the electronic device 1004 or a server 1008 via a second network 1099 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1001 may communicate with the electronic device 1004 via the server 1008. According to an embodiment, the electronic device 1001 may include a processor 1020, a memory 1030, an input module 1050, a sound output module 1055, a display module 1060, an audio module 1070, a sensor module 1076, an interface 1077, a connection 1078, a haptic module 1079, a camera module 1080, a power management module 1088, a battery 1089, a communication module 1090, a Subscriber Identity Module (SIM) 1096, or an antenna module 1097. In some embodiments, at least one of the above-described components (e.g., connection 1078) may be omitted from electronic device 1001, or one or more other components may be added to electronic device 1001. In some embodiments, some of the components described above (e.g., sensor module 1076, camera module 1080, or antenna module 1097) may be implemented as a single component (e.g., display module 1060).

The processor 1020 may run, for example, software (e.g., program 1040) to control at least one other component (e.g., hardware component or software component) of the electronic device 1001 that is coupled to the processor 1020, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1020 may store commands or data received from another component (e.g., the sensor module 1076 or the communication module 1090) in the volatile memory 1032, process the commands or data stored in the volatile memory 1032, and store the resulting data in the non-volatile memory 1034. According to an embodiment, the processor 1020 may include a main processor 1021 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) or a secondary processor 1023 (e.g., a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent or combined with the main processor 1021. For example, when the electronic device 1001 includes a main processor 1021 and a secondary processor 1023, the secondary processor 1023 may be adapted to consume less power than the main processor 1021 or to be dedicated to a particular function. The secondary processor 1023 may be implemented separately from the primary processor 1021, or as part of the primary processor 1021.

The secondary processor 1023 (rather than the primary processor 1021) may control at least some of the functions or states associated with at least one of the components of the electronic device 1001 (e.g., the display module 1060, the sensor module 1076, or the communication module 1090) when the primary processor 1021 is in an inactive (e.g., sleep) state, or the secondary processor 1023 may control at least some of the functions or states associated with at least one of the components of the electronic device 1001 (e.g., the display module 1060, the sensor module 1076, or the communication module 1090) with the primary processor 1021 when the primary processor 1021 is in an active state (e.g., running an application). According to an embodiment, the secondary processor 1023 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 1080 or a communication module 1090) functionally related to the secondary processor 1023. According to an embodiment, the secondary processor 1023 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. Such learning may be performed, for example, by the electronic device 1001 where the artificial intelligence model is executed, or via a separate server (e.g., server 1008). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a Deep Neural Network (DNN), a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), a boltzmann machine limited (RBM), a Deep Belief Network (DBN), a bi-directional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include software structures in addition to hardware structures.

Memory 1030 may store various data used by at least one component of electronic device 1001 (e.g., processor 1020 or sensor module 1076). The various data may include, for example, software (e.g., program 1040) and input or output data for commands associated therewith. Memory 1030 may include volatile memory 1032 or nonvolatile memory 1034.

The program 1040 may be stored as software in the memory 1030, and the program 1040 may include, for example, an Operating System (OS) 1042, middleware 1044, or an application 1046.

The input module 1050 may receive commands or data from outside the electronic apparatus 1001 (e.g., a user) to be used by another component of the electronic apparatus 1001 (e.g., the processor 1020). The input module 1050 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons) or a digital pen (e.g., a stylus).

The sound output module 1055 may output a sound signal to the outside of the electronic device 1001. The sound output module 1055 may include, for example, a speaker or a receiver. Speakers may be used for general purposes such as playing multimedia or playing a record. The receiver may be used to receive an incoming call. Depending on the embodiment, the receiver may be implemented separate from the speaker or as part of the speaker.

The display module 1060 may visually provide information to an outside (e.g., a user) of the electronic device 1001. The display module 1060 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, the holographic device, and the projector. According to an embodiment, the display module 1060 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the intensity of a force caused by a touch.

The audio module 1070 may convert sound to an electrical signal and vice versa. According to an embodiment, the audio module 1070 may obtain sound via the input module 1050, or output sound via the sound output module 1055 or headphones of an external electronic device (e.g., electronic device 1002) coupled directly (e.g., wired) or wirelessly with the electronic device 1001.

The sensor module 1076 may detect an operational state (e.g., power or temperature) of the electronic device 1001 or an environmental state (e.g., a state of a user) external to the electronic device 1001 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1076 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1077 may support one or more particular protocols that will be used to couple (e.g., wire) the electronic device 1001 with an external electronic device (e.g., the electronic device 1002) or wirelessly. According to an embodiment, the interface 1077 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 1078 may include a connector via which the electronic device 1001 may be physically connected with an external electronic device (e.g., the electronic device 1002). According to an embodiment, the connection 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 1079 may convert the electrical signal into mechanical stimulus (e.g., vibration or motion) or electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electro-stimulator.

The camera module 1080 may capture still images or moving images. According to an embodiment, the camera module 1080 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 1088 may manage power supply to the electronic device 1001. According to an embodiment, the power management module 1088 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

Battery 1089 may power at least one component of electronic device 1001. According to an embodiment, battery 1089 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 1090 may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1001 and an external electronic device (e.g., the electronic device 1002, the electronic device 1004, or the server 1008), and perform communication via the established communication channel. The communication module 1090 may include one or more communication processors capable of operating independently of the processor 1020 (e.g., an Application Processor (AP)) and support direct (e.g., wired) or wireless communication. According to an embodiment, the communication module 1090 may include a wireless communication module 1092 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 1094 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may be via a first network 1098 (e.g., a short-range communication network such as bluetooth ^TM Wireless fidelity (Wi-Fi) direct or infrared data association (IrDA)) or a second network 1099 (e.g., a long-range communication network such as a conventional cellular network, 5G network, next-generation communication network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN))) with an external electronic device. These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other.The wireless communication module 1092 may identify and authenticate the electronic device 1001 in a communication network, such as the first network 1098 or the second network 1099, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1096.

The wireless communication module 1092 may support a 5G network following a 4G network as well as next generation communication technologies (e.g., new wireless (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), large-scale machine type communication (mctc), or Ultra Reliable Low Latency Communication (URLLC). The wireless communication module 1092 may support a high frequency band (e.g., millimeter-wave band) to achieve, for example, high data transmission rates. The wireless communication module 1092 may support various techniques for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 1092 may support various requirements specified in the electronic device 1001, an external electronic device (e.g., electronic device 1004), or a network system (e.g., second network 1099). According to an embodiment, the wireless communication module 1092 may support a peak data rate (e.g., 20Gbps or greater) for implementing an eMBB, a lost coverage (e.g., 164dB or less) for implementing an emtc, or a U-plane delay (e.g., 0.5ms or less, or 1ms or less round trip for each of the Downlink (DL) and Uplink (UL)) for implementing a URLLC.

The antenna module 1097 may transmit signals or power to or receive signals or power from outside the electronic device 1001 (e.g., an external electronic device). According to an embodiment, the antenna module 1097 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). According to an embodiment, the antenna module 1097 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1098 or the second network 1099) may be selected from the plurality of antennas by, for example, the communication module 1090 (e.g., the wireless communication module 1092). Signals or power may then be transmitted or received between the communication module 1090 and the external electronic device via the selected at least one antenna. According to an embodiment, another component other than the radiating element, such as a Radio Frequency Integrated Circuit (RFIC), may additionally be formed as part of the antenna module 1097.

According to various embodiments, antenna module 1097 may form a millimeter wave antenna module. According to an embodiment, a millimeter wave antenna module may include a printed circuit board, an RFIC disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

At least some of the above components may be coupled to each other and communicatively communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)).

According to an embodiment, commands or data may be sent or received between the electronic device 1001 and the external electronic device 1004 via the server 1008 coupled to the second network 1099. Each of the electronic device 1002 or the electronic device 1004 may be the same type of device as the electronic device 1001, or a different type of device from the electronic device 1001. According to an embodiment, all or some of the operations to be performed at the electronic device 1001 may be performed at one or more of the external electronic device 1002, the external electronic device 1004, or the server 1008. For example, if the electronic device 1001 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 1001 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 1001. The electronic device 1001 may provide the result as at least a partial reply to the request with or without further processing of the result. For this purpose, for example, cloud computing technology, distributed computing technology, mobile Edge Computing (MEC) technology, or client-server computing technology may be used. The electronic device 1001 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1004 may include an internet of things (IoT) device. The server 1008 may be an intelligent server using machine learning and/or a neural network. According to an embodiment, an external electronic device 1004 or a server 1008 may be included in the second network 1099. The electronic device 1001 may be applied to smart services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

It should be understood that the various embodiments of the disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather include various modifications, equivalents or alternatives to the respective embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to an item may include one or more things unless the context clearly indicates otherwise. As used herein, each of the phrases such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all possible combinations of items listed with a corresponding one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to simply distinguish one element from another element and not to limit the element in other respects (e.g., importance or order). It will be understood that if the term "operatively" or "communicatively" is used or the term "operatively" or "communicatively" is not used, then if an element (e.g., a first element) is referred to as being "coupled to," "connected to," or "connected to" another element (e.g., a second element), it is meant that the one element can be directly (e.g., wired) coupled to, wirelessly connected to, or coupled to the other element via a third element.

As used in connection with various embodiments of the present disclosure, the term "module" may include an element implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., program 1040) comprising one or more instructions stored in a storage medium (e.g., internal memory 1036 or external memory 1038) readable by a machine (e.g., electronic device 1001). For example, under control of a processor (e.g., processor 1020) of a machine (e.g., electronic device 1001), the processor may invoke and execute at least one of the one or more instructions stored in the storage medium with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein the term "non-transitory" merely means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed via an application store (e.g., playStore ^TM ) The computer program product may be distributed (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). At least a portion of the computer program product may be temporarily generated if distributed online, or at least a portion of the computer program product may be stored at least temporarily in a machine readable storage medium, such as a memory of a manufacturer's server, an application store's server, or a forwarding server.

According to various embodiments, each of the above-described components (e.g., a module or a program) may include a single entity or a plurality of entities, and some of the plurality of entities may be separately provided in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. According to various embodiments, operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device, the electronic device comprising:

a first housing including a first through-hole, a first opening and a second opening of the first through-hole communicating with each other;

a second housing rotatably connected to the first housing;

a Flexible Printed Circuit Board (FPCB) extending from the first case to the second case via the first through hole, and including a plurality of layers; and

a first sealing member disposed in the first through hole and surrounding the FPCB,

wherein, the FPCB includes:

a first lamination portion that extends in a direction different from an extending direction of the first through hole in the first housing, and that includes a portion where the plurality of layers are at least partially laminated on each other;

a first curved portion extending from the first laminated portion through the first opening, and including a portion where the plurality of layers are separated from each other;

a second lamination portion extending from the first bending portion toward the first sealing member; and

A second curved portion extending from the second laminated portion toward the second housing via the second opening,

wherein the plurality of layers includes a first layer and a second layer,

wherein the portion of the first layer and/or the second layer corresponding to the second laminate portion comprises at least one first valley extending in the longitudinal direction of the FPCB from the surface facing the adjacent layer, and

wherein the second laminate portion includes a first adhesive layer interposed between the first layer and the second layer to fill in the at least one first valley.

2. The electronic device of claim 1, wherein the plurality of layers further comprises a third layer, and the second layer is located between the first layer and the third layer,

wherein a portion of the second layer and/or the third layer corresponding to the second laminate portion includes at least one second valley extending in the longitudinal direction of the FPCB from a surface facing the adjacent layer,

wherein the second laminate section includes a second adhesive layer interposed between the second layer and the third layer to fill in the at least one second valley, and

Wherein the area of the first adhesive layer is different from the area of the second adhesive layer.

3. The electronic device of claim 2, wherein a portion of the first layer corresponding to the first curved portion is curved to have a smaller radius than a portion of the second layer corresponding to the first curved portion,

wherein a portion of the second layer corresponding to the first curved portion is curved to have a smaller radius than a portion of the third layer corresponding to the first curved portion,

wherein the first adhesive layer comprises a first end facing the first opening,

wherein the second adhesive layer includes a second end facing the first opening, an

Wherein the first end is closer to the first opening than the second end.

4. The electronic device of claim 3, wherein the plurality of layers further comprises a fourth layer, and the third layer is located between the second layer and the fourth layer,

wherein the portion of the third layer and/or the fourth layer corresponding to the second laminate portion comprises at least one third valley extending in the longitudinal direction of the FPCB from a surface facing the adjacent layer,

Wherein the second laminate section includes a third adhesive layer interposed between the third layer and the fourth layer to fill in the at least one third valley, and

wherein the area of the third adhesive layer is different from the area of the second adhesive layer.

5. The electronic device of claim 4, wherein a portion of the third layer corresponding to the first curved portion is curved to have a smaller radius than a portion of the fourth layer corresponding to the first curved portion,

wherein the third adhesive layer comprises a third end facing the first opening, and

wherein the second end is closer to the first opening than the third end.

6. The electronic device of claim 5, wherein the at least one first valley is formed only in the second layer,

wherein the at least one third valley is formed only in the third layer,

wherein the first layer and the fourth layer are located at the outermost sides of the plurality of layers, and

wherein the first layer and the fourth layer are shielding layers comprising a conductive metal layer.

7. The electronic device of claim 5, wherein the second laminate section includes a first segment and a second segment extending from the first segment toward the first sealing member,

Wherein the first end of the first adhesive layer, the second end of the second adhesive layer, and the third end of the third adhesive layer are located in the first section, and

wherein portions of the first, second, and third adhesive layers corresponding to the first segment extend to the second segment.

8. The electronic device of claim 7, wherein the first sealing member comprises a first member and a second member configured to together surround the FPCB, an

Wherein the second segment of the second laminate section extends to a point between the first member and the second member.

9. The electronic device of claim 5, wherein the first housing includes a first support member having the first through hole and a first back plate coupled to the first support member,

wherein the first opening of the first through hole is located between the first back plate and the second opening, and

wherein the first curved portion extends into the first through hole between the first back plate and the first support member.

10. The electronic device of claim 9, wherein the first opening of the first through-hole is substantially parallel to the first back plate.

11. The electronic device of claim 1, wherein the first layer and/or the second layer having the at least one first valley comprises a base layer and a transmission line formed on the base layer, and

wherein the at least one first valley is defined as a result of the transmission lines being spaced apart from one another on the base layer.

12. The electronic device of claim 1, the electronic device further comprising:

a first flashing member disposed on the first sealing member in such a way as to at least partially surround the second laminate portion.

13. The electronic device of claim 1, the electronic device further comprising:

a first printed circuit board disposed in the first housing and a second printed circuit board disposed in the second housing,

wherein the first printed circuit board and the second printed circuit board are electrically connected to each other through the FPCB.

14. The electronic device of claim 13, the electronic device further comprising:

a second sealing member and a second waterproof member,

wherein the second housing includes a second through hole extending in a direction different from the first laminated portion,

Wherein the plurality of layers of the FPCB pass through the second via hole,

wherein the second sealing member is disposed in the second through hole in such a manner as to surround the FPCB,

wherein the FPCB further includes a third laminated portion located in the second through hole adjacent to the second sealing member,

wherein the second waterproof member is provided in the second through hole in such a manner as to at least partially surround the third laminated portion,

wherein the portion of the first layer and/or the third layer corresponding to the third laminated portion comprises at least one second valley extending in the longitudinal direction of the FPCB from the surface facing the adjacent layer, and

wherein the third laminated portion includes a second adhesive layer interposed between the first layer and the second layer to fill in the at least one second valley.

15. The electronic device of claim 1, wherein the first curved portion comprises a curved section curved from a first point outside the first opening to a second point in the interior of the first through hole,

wherein the second lamination portion includes a first segment extending from the first bending portion and a second segment extending from the first segment toward the first sealing member,

Wherein the plurality of layers further comprises a third layer,

wherein the second layer is laminated on the first layer and the third layer is laminated on the second layer,

wherein the first layer comprises at least one first valley formed on a surface facing the second layer,

wherein the second layer comprises at least one second valley formed on a surface facing the third layer,

wherein the second laminate section includes a second adhesive layer interposed between the second layer and the third layer to fill in the at least one second valley,

wherein the range of the portion of the second adhesive layer corresponding to the first segment is smaller than the range of the portion of the first adhesive layer corresponding to the first segment by a first area, and

wherein the first area is defined based on a center angle formed by a center of curvature of the first point and the second point relative to the curved section of the first curved portion and a separation distance between the second layer and the third layer.