CN117810244A - Pixel unit, LED display module and LED display screen - Google Patents
Pixel unit, LED display module and LED display screen Download PDFInfo
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- CN117810244A CN117810244A CN202311860249.5A CN202311860249A CN117810244A CN 117810244 A CN117810244 A CN 117810244A CN 202311860249 A CN202311860249 A CN 202311860249A CN 117810244 A CN117810244 A CN 117810244A
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- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 claims description 6
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Abstract
The invention relates to the technical field of LED display, solves the defects of serious abnormality of side light color and lower contrast ratio in the prior art, and provides a pixel unit, an LED display module and an LED display screen. The pixel unit includes: a substrate; a plurality of light emitting chips which are fixed on the front surface of the substrate and emit different colored lights, wherein the different colored lights comprise red light, blue light and green light, the light emitting chips are arranged in at least two rows staggered with each other along a first direction, at least one light emitting chip is arranged in each row, each light emitting chip is arranged in at least three columns staggered with each other along a second direction perpendicular to the first direction, and at least one light emitting chip is arranged in each column; a plurality of fillets fixed on the back side of the substrate; the pixel unit is manufactured by adopting MIP packaging technology. The pixel unit, the LED display module and the LED display screen have the advantages of reducing side light color abnormality and improving contrast.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to a pixel unit, an LED display module and an LED display screen.
Background
At present, an LED display screen generally has an excellent light color display effect for a front viewer during lighting display, however, due to limitations of the current structure and manufacturing method of the LED display screen, the existing LED display screen has abnormal light color display conditions such as light color mixing, and thus, a poor viewing effect of light color abnormality can be brought to a non-front viewer.
Although a novel package architecture-MIP (Micro LED in package) structure of Micro LEDs has been developed by those skilled in the art, the Micro LEDs and discrete devices are organically combined by separately packaging a large-area monolithic display panel. Specifically, the MIP structure includes a black substrate, a plurality of light emitting chips encapsulated on the front surface of the black substrate, and solder fillets formed on the back surface of the black substrate. When the LED display module is manufactured, a PCB is manufactured firstly, a layer of solder resist ink is formed on the front surface of the PCB, and a window is formed in the solder resist ink to expose a bonding pad on the PCB; and then welding the welding feet of the black substrate on the welding pads of the PCB. However, the art generally recognizes: on one hand, the current MIP structure process has higher cost for Micro LED application and device sorting; on the other hand, the MIP structure has small size and high requirement on the die bonding precision, and if the die bonding precision does not meet the requirement, the MIP structure may be skewed and offset. More disadvantageously, for example, R, G, B light emitting chips packaged on the front surface of the black substrate are packaged on the black substrate in an arrangement mode of mutually parallel overlapping in the horizontal direction, so that in the direction vertical to the side surface of the LED display module, the light emitting chips are substantially arranged in a straight line, and the defects of serious side surface light color abnormity and contrast reduction caused by the defects of large mutual shielding, overlapping light mixing and the like exist among the light emitting chips.
Therefore, in summary, although the MIP structure has a particular advantage for the conventional packaging structure of the LED display, the technology is not only realized in large scale popularization at the present stage, but is even generally considered to be difficult to be practically applied in the industry due to the defects of high cost, serious side light color anomaly and low contrast.
Therefore, it is desirable to provide a pixel unit, an LED display module and an LED display screen that reduce side light color anomalies and improve contrast.
Disclosure of Invention
The present invention provides a pixel unit for achieving an object of the present invention, which comprises: a substrate; a plurality of light emitting chips which are fixed on the front surface of the substrate and emit different colored lights, wherein the different colored lights comprise red light, blue light and green light, the light emitting chips are arranged in at least two rows staggered with each other along a first direction, at least one light emitting chip is arranged in each row, each light emitting chip is arranged in at least three columns staggered with each other along a second direction perpendicular to the first direction, and at least one light emitting chip is arranged in each column; a plurality of fillets fixed on the back side of the substrate; the pixel unit is manufactured by adopting MIP packaging technology.
Further, the plurality of light emitting chips on the substrate are respectively arranged in two rows and three columns along the first direction and the second direction, each column of light emitting chips is arranged along a direction parallel to the second direction, wherein one row is provided with two parallel and opposite first light emitting chips and second light emitting chips, the first light emitting chips and the second light emitting chips respectively emit first color light and second color light, and the other row is provided with a third light emitting chip which emits third color light.
Further, the plurality of light emitting chips on the substrate are respectively arranged into two rows and three columns along the first direction and the second direction, each light emitting chip is inclined by a preset acute angle in the second direction, the value range of the preset acute angle is 0-45 degrees, one row is provided with two inclined parallel spaced first light emitting chips and second light emitting chips, the first light emitting chips and the second light emitting chips respectively emit first color light and second color light, and the other row is provided with a third light emitting chip which emits third color light.
Further, the plurality of light emitting chips on the substrate are arranged in three rows and three columns along the first direction and the second direction respectively, each light emitting chip is arranged along a direction parallel to the first direction, each row is provided with a first light emitting chip for emitting first color light, a second light emitting chip for emitting second color light and a third light emitting chip for emitting third color light, each column is provided with a first light emitting chip for emitting first color light, a second light emitting chip for emitting second color light and a third light emitting chip for emitting third color light, and each light emitting chip is integrally arranged in a step shape.
Further, the first light emitting chip is welded on the first positive electrode bonding pad, the second light emitting chip is welded on the second positive electrode bonding pad, the positive electrode of the third light emitting chip is welded on the third positive electrode bonding pad, and the cathodes of the first light emitting chip, the second light emitting chip and the third light emitting chip are welded on the common cathode together.
Further, a black matrix layer and a transparent adhesive layer are sequentially arranged on the substrate, the top surface of the black matrix layer is lower than the light emitting surface of each light emitting chip, the transparent adhesive layer covers the light emitting surface of each chip, or a transparent adhesive layer and a low-permeability film are sequentially arranged on the substrate, the transparent adhesive layer covers the light emitting surface of each chip, the black matrix layer comprises black UV ink materials, the transparent adhesive layer adopts an OCA adhesive film or liquid epoxy resin, and the low-permeability film adopts the OCA adhesive film and is added with 40% -60% melanin.
To achieve another object of the present invention, there is provided an LED display module, including: a CB board provided with a plurality of bonding pads; a plurality of pixel units according to any one of claims 1 to 6, wherein each pixel unit is aligned in a plurality of rows and a plurality of columns in the first direction and the second direction, and the substrates of every two adjacent pixel units in each row are arranged on the PCB board at the same angle, or the substrates of every two adjacent pixel units in each row are alternately arranged on the PCB board at the same angle at the mirror image angles of every two adjacent pixel units; the fillets of each pixel cell are correspondingly soldered to the pads.
Further, when the plurality of light emitting chips on the substrate are arranged in two rows and three columns along the first direction and the second direction respectively and each light emitting chip is arranged along the direction parallel to the second direction, the LED display module is provided with two pixel units, wherein one pixel unit is equivalent to being obtained by rotating the center point of the substrate of the other pixel unit by 180 degrees and mirroring the pixel units in the first direction, the two pixel units in each row are arranged on the PCB board in a repeated alternating mode, so that the number of the light emitting chips in the same row in each pixel unit in the same row is two and one in an alternating mode, the types of the two rows of light emitting chips in the two adjacent pixel units are different, and the light emitting chips in each column in each pixel unit in the same column are mutually side-aligned and have the same type; when the light emitting chips on the substrate are respectively arranged into two rows and three columns along the first direction and the second direction, and each light emitting chip inclines at a preset acute angle along the second direction, the substrates of every two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of the light emitting chips in the same row in each pixel unit in the same row is one or two, the types of the light emitting chips in every two adjacent pixel units are the same, and the light emitting chips in every column in each pixel unit in the same column are aligned with each other in top and bottom surfaces and are the same in type; when the light emitting chips are arranged in three rows and three columns along the first direction and the second direction respectively and the light emitting chips are arranged along the direction parallel to the first direction, the substrates of every two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of the light emitting chips in the same row in each pixel unit in the same row is one, the types of the light emitting chips in every two adjacent pixel units are the same, and the top and bottom surfaces of the light emitting chips in every column in each pixel unit in the same column are aligned and the types are the same.
Further, in the first direction, the adjacent three light emitting chips of two adjacent pixel units can realize pixel multiplexing, and in the second direction, the adjacent three light emitting chips of two adjacent pixel units can realize pixel multiplexing.
In order to achieve the other object of the present invention, an LED display screen is provided, which is characterized by comprising any one of the above LED display modules.
The beneficial effects of the invention are as follows:
according to the pixel unit, the LED display module and the LED display screen, the plurality of light emitting chips are arranged into the plurality of rows and the plurality of columns, the pixel unit is manufactured in the MIP packaging mode, the defects of large mutual shielding, overlapping, light mixing and the like among the light emitting chips are overcome, the contrast is improved, the plurality of light emitting chips are arranged in the plurality of rows and the plurality of columns in a staggered mode, so that the pixels of two adjacent pixel units can be conveniently multiplexed, the number of the light emitting chips can be reduced to a certain extent under the same cost, the occurrence probability that the die bonding precision possibly does not reach the standard can be reduced, the adverse conditions of deflection and offset of the MIP structure are further reduced or eliminated, the resolution ratio of the display module and the display screen applied to the pixel unit can be improved by using the pixel multiplexing technology, and the manufacturing cost of the display module and the display screen is reduced.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described, and it is within the scope of the present invention to obtain other drawings according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a first embodiment of a pixel unit according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another embodiment of a pixel unit according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second embodiment of a pixel unit according to the present invention;
fig. 4 is a schematic diagram of a third embodiment of a pixel unit according to the present invention;
fig. 5 is a schematic diagram of a fourth embodiment of a pixel unit according to the present invention;
fig. 6 is a schematic diagram of a fifth embodiment of a pixel unit according to the present invention;
fig. 7 is a schematic diagram of a sixth embodiment of a pixel unit according to the present invention;
fig. 8 is a schematic diagram of a sixth embodiment of a pixel unit according to the present invention;
fig. 9 is a schematic diagram of an embodiment of an LED display module according to an embodiment of the present invention;
fig. 10 is a schematic diagram of a second embodiment of an LED display module according to an embodiment of the present invention;
fig. 11 is a schematic diagram of a third embodiment of an LED display module according to an embodiment of the present invention;
fig. 12 is a schematic diagram of a fourth embodiment of an LED display module according to an embodiment of the present invention;
fig. 13 is a schematic diagram of a fifth embodiment of an LED display module according to an embodiment of the present invention;
fig. 14 is a schematic diagram of a sixth embodiment of an LED display module according to an embodiment of the present invention;
fig. 15 is a schematic diagram of an embodiment seven of an LED display module according to an embodiment of the present invention;
FIG. 16 is a schematic side view of a package structure of an embodiment of a pixel unit according to the present invention;
fig. 17 is a schematic side view of another package structure of a pixel unit according to an embodiment of the invention.
Reference numerals illustrate:
a 10-pixel unit; 1-a substrate; 2-a first light emitting chip; 3-a second light emitting chip; 4-a third light emitting chip; 5-a black matrix layer; 6-a transparent adhesive layer; 7-low permeability film; 81-a first positive electrode pad; 82-a second positive electrode pad; 83-a third positive electrode pad; 9-a common negative electrode; x-a first direction; y-second direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or refer to the orientation or positional relationship shown based on the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the invention. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element limited by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. If not conflicting, the embodiments of the present invention and the features of the embodiments may be combined with each other, which are all within the protection scope of the present invention.
Referring to fig. 1 to 8, as an object of the present invention, there is provided a pixel unit 10, wherein the pixel unit 10 includes a substrate 1, a plurality of light emitting chips emitting different color lights and a plurality of solder tails, the pixel unit 10 is manufactured by adopting a MIP packaging process, specifically, the plurality of light emitting chips are transferred onto the substrate through a mass transfer technology, then packaged, and then cut into small packages, namely, the pixel unit 10, and if not specifically described, the pixel unit 10 in each embodiment is obtained by a novel package architecture-MIP (Micro LED in package) structure of Micro LEDs. Wherein the different colors of light include red light, blue light and green light, a plurality of light emitting chips and a plurality of fillets (not shown) are respectively fixed on the front and back surfaces of the substrate 1, for example, by soldering, the plurality of light emitting chips are arranged in a plurality of rows of two or more rows staggered from each other in the first direction X, at least one light emitting chip is arranged in each row, and in the second direction Y perpendicular to the first direction X, as shown in fig. 1 to 15, it is understood that in this specification, the first direction X and the second direction Y are respectively illustrated by taking the horizontal direction and the vertical direction as an example, each light emitting chip is arranged in a plurality of columns of three or more rows staggered from each other, and at least one light emitting chip is arranged in each column. Therefore, by arranging the light emitting chips into a plurality of rows and a plurality of columns, compared with the light emitting chips which are arranged in a straight line in the prior art, the defects of large mutual shielding, overlapping, light mixing and the like among the light emitting chips are overcome, the occurrence of side color light abnormal conditions can be reduced or even avoided, and the contrast is further improved. In addition, since the plurality of light emitting chips are staggered in a plurality of rows and a plurality of columns, pixel multiplexing (which will be described in further detail below) of two adjacent pixel units 10 can be facilitated, and further, under the same cost, the number of light emitting chips can be reduced to a certain extent, so that the occurrence probability that the die bonding precision may not reach the standard can be reduced, and further, the adverse conditions of skew and offset of the MIP structure can be reduced or stopped, and moreover, the resolution ratio of a display module and a display screen to which the pixel units 10 are applied can be improved by using a pixel multiplexing technology, and the manufacturing cost of the display module and the display screen can be reduced, thereby overcoming the technical bias that the cost is high when the technology of the MIP structure is applied to Micro LEDs by a person in the field, and reducing the cost of the pixel units 10 on the basis of obtaining the advantages of the MIP structure.
Referring to fig. 1 and fig. 2 in combination, as a first embodiment of the pixel unit of the present invention, a plurality of light emitting chips on a substrate 1 are arranged in two rows and three columns along a first direction X and a second direction Y, respectively, in each embodiment of the pixel unit 10 of the present invention, based on technology, operation feasibility and reliability, the light emitting chips are all rectangular in a strip shape, and the substrate 1 is all square in a shape similar to a square shape, and in addition, the substrate may be rectangular according to actual needs, and it is known that the rectangular shape and the square shape refer to the shapes of the cross sections of the light emitting chips and the substrate, respectively. The first light emitting chip 2, the second light emitting chip 3 and the third light emitting chip 4 are respectively of three types of chips, namely a red light chip, a blue light chip and a green light chip, and the specific types of chips used for the light emitting chips can be changed differently according to practical situations. Preferably, the anodes of the first, second and third light emitting chips 2, 3 and 4 are welded to the first, second and third anode pads 81, 82 and 83, respectively, and the cathodes of the three are welded together to the common cathode 9. The light emitting chips of each column, especially the long sides thereof, are arranged along the direction parallel to the second direction Y, as indicated by the Y-axis arrow shown in fig. 1 and 2, wherein the first row has two parallel spaced opposite first light emitting chips 2 and second light emitting chips 3, and the first light emitting chips 2 and the second light emitting chips 3 emit the first color light and the second color light respectively, the second row has one third light emitting chip 4 emitting the third color light, and the intervals of the light emitting chips in the first direction X are equal, which can be said to be that the parallel distances of the two parallel long sides of the two adjacent light emitting chips in the first direction X are equal. Specifically, as one implementation of the pixel unit 10 of the present embodiment, as shown in fig. 1, in the direction indicated by the Y-axis arrow, the first row has two parallel spaced apart first light emitting chips 2 and second light emitting chips 3 that emit first color light and second color light, respectively, and the second row has one third light emitting chip 4 that emits third color light, as shown in fig. 2, in the direction indicated by the Y-axis arrow, and as another implementation of the pixel unit 10 of the present embodiment, the first row has one third light emitting chip 4 that emits third color light, and the second row has two parallel spaced apart first light emitting chips 2 and second light emitting chips 3 that face each other, and for the two implementations of the pixel unit 10, the pitch of each light emitting chip in the first direction X is equal, which can also be said to be that the parallel distances of two parallel long sides of two adjacent light emitting chips in the first direction X are equal. In this way, since the first light emitting chip 2 and the second light emitting chip 3 are respectively staggered with the third light emitting chip 4 in the second direction Y, that is, the projections of the first light emitting chip 2 and the second light emitting chip 3 in the second direction Y do not coincide with the projections of the third light emitting chip 4 in the second direction Y, in addition, referring to fig. 9, when the pixel unit 10 of the two embodiments of the present embodiment is applied to the LED display module, the pixel units 10 are arranged in a plurality of rows and columns aligned on the PCB board of the LED display module, and for two pixel units 10 arranged adjacently and alternately, each of the following pixel units 10 is obtained by rotating 180 ° relative to the center point of the preceding pixel unit 10 and mirroring the same in the first direction, so that the two pixel units are seen from the outside of the substrate 1 along the first direction X, and the side surfaces of the two pixel units do not have the disadvantages of substantial mutual shielding, overlapping, light mixing, and the like. In addition, referring to fig. 9 and the following description related to the LED display module embodiment, it can be seen that, by using two pixel units 10 in the first pixel unit embodiment that are rotated 180 ° about the center point of the substrate 1 and mirrored in the first direction, two adjacent pixel units 10 in the first direction X and the second direction Y can each realize RGB three-primary-color pixel multiplexing, so that the LED display module and the display screen to which the pixel unit 10 of the present embodiment is applied have the advantage of higher resolution at the same cost. Similarly, the second to seventh embodiments of the pixel unit can also obtain the beneficial effects obtained by the first embodiment of the pixel unit, and the following description is omitted.
Referring to fig. 3 and 4 in combination, as a second embodiment of the pixel unit of the present invention, as shown in fig. 3, a plurality of light emitting chips on a substrate 1 are respectively arranged in two rows and three columns along a first direction X and a second direction Y, each light emitting chip is inclined by a preset acute angle with respect to the second direction Y, it is understood that the preset acute angle is an acute angle of the light emitting chips in the first embodiment with respect to the second direction Y, the preset acute angle may be in a range of 0 ° -45 °, and, according to repeated experiments of the applicant, when the preset acute angle is in a range of 0 ° -30 °, the process difficulty is relatively low and the overall light emitting effect applied to the display screen is better, as shown in fig. 3, each light emitting chip is rotated counterclockwise by a preset acute angle with respect to the second direction Y, wherein the first row has a third light emitting chip 4, and the second row has two obliquely parallel spaced first light emitting chips 2 and second light emitting chips 3. As a third embodiment of the pixel unit of the present invention, each light emitting chip has the same inclined preset acute angle as that of the second embodiment of the pixel unit 10, except that the first row has two inclined parallel spaced second light emitting chips 3 and first light emitting chips 2, and the second row has one third light emitting chip 4, as indicated by the Y-axis arrow in fig. 4.
Similarly, as a fifth embodiment of the pixel unit according to the present invention, each light emitting chip is rotated clockwise by a predetermined acute angle in the direction indicated by the Y-axis arrow shown in fig. 5, wherein the first row has a third light emitting chip 4 and the second row has two obliquely parallel spaced first light emitting chips 2 and second light emitting chips 3. In addition, as a fifth embodiment of the pixel unit of the present invention, each light emitting chip has the same inclined preset acute angle as that of each light emitting chip in the fourth embodiment of the pixel unit 10, except that the first row has two inclined parallel spaced second light emitting chips 3 and first light emitting chips 2, and the second light emitting chips 3 and first light emitting chips 2 emit second color light and first color light, respectively, and the second row has one third light emitting chip 4, as indicated by the Y-axis arrow in fig. 6. In the first to fifth embodiments of the pixel unit of the present invention, the projections of the first, second and third light emitting chips 2, 3 and 4 in the first direction X are respectively a first projection, a second projection and a third projection, and the third projection is located between the first projection and the second projection.
Referring to fig. 7 in combination, as a sixth embodiment of the pixel unit of the present invention, a plurality of light emitting chips on a substrate 1 are arranged in three rows and three columns along a first direction X and a second direction Y, respectively, each light emitting chip is arranged in parallel to the first direction X, and each light emitting chip is integrally arranged in a step shape of ascending from a lower left corner to an upper right corner, and the pitches in the first direction X and the second direction Y are equal, a first light emitting chip 2 emitting a first color light, a second light emitting chip 3 emitting a second color light, and a third light emitting chip 4 emitting a third color light are respectively arranged at each step position, that is, as shown in fig. 7, the light emitting chips in the first row, the first column, the second row, the second column, and the third row, and the third column are the second light emitting chip 3, the third light emitting chip 4, and the first light emitting chip 2, respectively, and the lengths of the two-by-two projection point connections of the rectangular short sides of the second light emitting chip 3, the third light emitting chip 4, and the first light emitting chip 2 are equal with respect to the projection in the first direction X, and the lengths of the two-by-two projection point connections of the rectangular long sides of the second light emitting chip 3, the third light emitting chip 4, and the first light emitting chip 2 are equal with respect to the projection in the second direction Y.
Similarly, as a seventh embodiment of the pixel unit of the present invention, the light emitting chips are integrally arranged in a stepwise manner, which is stepped down from the upper left corner toward the lower right corner, and the light emitting chips of the first row, the third column, the second row, the second column, and the third row and the first column are the second light emitting chip 3, the third light emitting chip 4, and the first light emitting chip 2, respectively, in directions indicated by the X-axis and the Y-axis arrows as shown in fig. 8.
Further preferably, for the above-mentioned various pixel units 10, please combine with reference to fig. 16, a black matrix layer 5 and a transparent adhesive layer 6 are sequentially arranged on the substrate 1, the top surface of the black matrix layer 5 is lower than the light emitting surface of each light emitting chip, the transparent adhesive layer 6 covers the light emitting surface of each chip, or, please combine with reference to fig. 17, a transparent adhesive layer 6 and a low-transmittance film 7 are sequentially arranged on the substrate, the transparent adhesive layer 6 covers the light emitting surface of each chip, and the black matrix layer 5 comprises black UV ink material, the transparent adhesive layer 6 adopts OCA adhesive film or liquid epoxy resin, the low-transmittance film 7 adopts OCA adhesive film and 40% -60% melanin is added. Therefore, unlike the prior art that only the transparent adhesive film is used for packaging, the pixel unit 10 is matched with and laminated with two light-transmitting layers with different light transmittance, the light transmittance of the outer light-transmitting layer is lower than that of the inner light-transmitting layer, so that the contrast ratio of the pixel unit 10 is higher, the display contrast ratio of the LED display module and the LED screen which adopt the pixel unit 10 is higher, and a good display effect is brought.
As another object of the present invention, referring to fig. 9 to 15 in combination, there is provided an LED display module including a PCB board (not shown), a plurality of pixel units 10 of any one of the above, and a plurality of pads (not shown) provided on the PCB board, the bonding pads of each pixel unit 10 being correspondingly bonded to the bonding pads. In the first direction X and the second direction Y, the pixel units 10 are aligned in a plurality of rows and a plurality of columns respectively on the PCB board, and for the pixel unit embodiments two to seven described above, the substrates of two adjacent pixel units 10 in each row are arranged at the same angle, that is, the light emitting chips located in the same row in each pixel unit 10 are all the same, while for the pixel unit embodiment one described above, the substrates of two adjacent pixel units 10 in each row are alternately rotated by 180 ° with respect to the previous pixel unit 10 by the center of the substrate, that is, the light emitting chips located in the same column in each pixel unit 10 are all the same. Therefore, the above-described LED display module having the pixel unit 10 including the examples shown in any of the above embodiments can obtain the beneficial effects of reducing the side color light anomaly and improving the contrast ratio.
Specifically, in the first LED display module embodiment corresponding to the first pixel unit embodiment described above, referring to fig. 9, when the plurality of light emitting chips on the substrate 1 are arranged in two rows and three columns along the first direction X and the second direction Y, respectively, and each of the light emitting chips is arranged in parallel to the second direction Y, the two adjacent pixel units 10 in each row arranged on the PCB board use the pixel units of the two embodiments in the first pixel unit embodiment, so that the number of light emitting chips in the same row in each pixel unit 10 in the same row is different in two and one kind of the two rows of light emitting chips in the same row in an alternating manner and two adjacent pixel units 10, and the light emitting chips in each column in each pixel unit 10 in the same column are mutually side-aligned and the kind is the same. In the second to fifth embodiments of the LED display module corresponding to the second to fifth embodiments of the pixel units, please refer to fig. 10 to 13, when the light emitting chips on the substrate 1 are respectively arranged in two rows and three columns along the first direction X and the second direction Y and each light emitting chip is inclined by a predetermined acute angle in the second direction Y, the substrates of two adjacent pixel units 10 in each row are arranged on the PCB board at an angle parallel to the first direction X, the number of light emitting chips in the same row in each pixel unit 10 in the same row is one or two, the types of light emitting chips in each row in each adjacent pixel unit 10 in the same column are the same, and the light emitting chips in each column in each pixel unit 10 in the same column are mutually aligned, i.e. the bottom surfaces of the light emitting chips are aligned with the top surfaces of the other light emitting chips and the same; in the LED display module according to the sixth embodiment and the seventh embodiment, referring to fig. 14 and 15, when a plurality of light emitting chips are arranged in three rows and three columns along the first direction X and the second direction Y, respectively, and each light emitting chip is arranged in parallel to the first direction X, the substrates of two adjacent pixel units 10 in each row are arranged on the PCB board at an angle parallel to the first direction X, the number of light emitting chips in the same row in each pixel unit 10 in the same row is one, the types of light emitting chips in each row in each two adjacent pixel units 10 are the same, and the light emitting chips in each column in each pixel unit 10 in the same column are aligned with each other in top and bottom surfaces and are the same. Therefore, the LED display module having the pixel unit 10 including any of the pixel unit 10 embodiments described above can obtain the beneficial effects of reducing side color light anomalies and improving contrast.
Referring to fig. 9 to 15 in combination, the dashed ellipses in each figure show the case where the adjacent three light emitting chips of two adjacent pixel units 10 can realize pixel multiplexing in the first direction X, and the solid circles in each figure show the case where the adjacent three light emitting chips of two adjacent pixel units 10 can realize pixel multiplexing in the second direction Y, so that the LED display module can obtain higher resolution at the same cost due to the realization of the pixel multiplexing of any three adjacent light emitting chips in the first direction X and the second direction Y.
As a further object of the present invention, there is provided an LED display screen, in particular, an LED display module obtained by a novel package structure-MIP (Micro LED in package) structure of Micro LEDs, so that the LED display screen can obtain any of the advantages of the LED display module described above, which will not be described in detail herein, when a viewer views from the side of the display screen, the side light color of the display screen will not be abnormal, thereby improving the side display effect of the display screen and also improving the contrast ratio of the display screen.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the invention, and any changes, equivalents, modifications and improvements that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. A pixel cell, comprising:
a substrate;
a plurality of light emitting chips which are fixed on the front surface of the substrate and emit different colored lights, wherein the different colored lights comprise red light, blue light and green light, the light emitting chips are arranged in at least two rows staggered with each other along a first direction, at least one light emitting chip is arranged in each row, each light emitting chip is arranged in at least three columns staggered with each other in a second direction perpendicular to the first direction, and at least one light emitting chip is arranged in each column;
a plurality of fillets fixed on a back side of the substrate;
the pixel unit is manufactured by adopting MIP packaging technology.
2. The pixel unit according to claim 1, wherein the plurality of light emitting chips on the substrate are arranged in two rows and three columns along the first direction and the second direction, respectively, each of the light emitting chips is arranged in parallel to the second direction, wherein one row has two parallel, spaced, opposite first and second light emitting chips, and the first and second light emitting chips emit first and second color lights, respectively, and the other row has one third light emitting chip that emits third color light.
3. The pixel unit according to claim 1, wherein the plurality of light emitting chips on the substrate are arranged in two rows and three columns along the first direction and the second direction, respectively, each light emitting chip is inclined at a preset acute angle in the second direction, the preset acute angle has a value ranging from 0 ° to 45 °, one row has two inclined parallel spaced first light emitting chips and second light emitting chips, and the first light emitting chips and the second light emitting chips emit first color light and second color light, respectively, and the other row has a third light emitting chip that emits third color light.
4. The pixel unit according to claim 1, wherein the plurality of light emitting chips on the substrate are arranged in three rows and three columns along the first direction and the second direction, respectively, each light emitting chip is arranged in parallel to the first direction, each row has a first light emitting chip emitting a first color light, a second light emitting chip emitting a second color light, and a third light emitting chip emitting a third color light, each column has a first light emitting chip emitting a first color light, a second light emitting chip emitting a second color light, and a third light emitting chip emitting a third color light, and each light emitting chip is integrally arranged in a step shape.
5. A pixel cell according to claim 2 or 3, wherein the first light emitting die is soldered onto a first positive electrode pad, the second light emitting die is soldered onto a second positive electrode pad, the positive electrode of the third light emitting die is soldered onto a third positive electrode pad, and the negative electrodes of the first light emitting die, the second light emitting die and the third light emitting die are soldered together onto a common negative electrode.
6. The pixel unit according to any one of claims 1 to 4, wherein a black matrix layer and a transparent adhesive layer are sequentially arranged on the substrate, the top surface of the black matrix layer is lower than the light emitting surface of each light emitting chip, the transparent adhesive layer covers the light emitting surface of each chip, or a transparent adhesive layer and a low-transmittance film are sequentially arranged on the substrate, the transparent adhesive layer covers the light emitting surface of each chip, and the black matrix layer comprises black UV ink material, the transparent adhesive layer adopts an OCA adhesive film or liquid epoxy resin, and the low-transmittance film adopts an OCA adhesive film and is added with 40% -60% melanin.
7. An LED display module, comprising:
the PCB is provided with a plurality of bonding pads;
a plurality of pixel units according to any one of claims 1 to 6, wherein each pixel unit is aligned in a plurality of rows and columns in the first direction and the second direction, and the substrates of every two adjacent pixel units in each row are arranged on the PCB board at the same angle, or the substrates of every two adjacent pixel units in each row are alternately arranged on the PCB board at the same angle at the mirror image angles of every two adjacent pixel units;
and the welding pins of the pixel units are correspondingly welded with the welding pads.
8. The LED display module of claim 7, wherein the LED display module is configured to display the LED display module,
when the light emitting chips on the substrate are respectively arranged in two rows and three columns along the first direction and the second direction and the light emitting chips are arranged along the direction parallel to the second direction, the LED display module is provided with two pixel units, wherein one pixel unit is equivalent to being obtained by rotating the center point of the substrate of the other pixel unit by 180 degrees and mirroring the pixel units in the first direction, the two pixel units in each row are arranged on the PCB board in a repeated alternating mode, so that the number of the light emitting chips in the same row in each pixel unit in the same row is two and one in an alternating mode, the types of the light emitting chips in the two rows of the two adjacent pixel units are different, and the light emitting chips in each row in each pixel unit in the same column are mutually side-aligned and have the same type;
when the light emitting chips on the substrate are respectively arranged into two rows and three columns along the first direction and the second direction, and each light emitting chip inclines at a preset acute angle along the second direction, the substrates of two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of the light emitting chips in the same row in each pixel unit in the same row is one or two, the types of the light emitting chips in each row in each two adjacent pixel units are the same, and the light emitting chips in each column in each pixel unit in the same column are mutually aligned in top and bottom surfaces and are the same in type;
when the light emitting chips are arranged in three rows and three columns along the first direction and the second direction respectively and the light emitting chips are arranged along the direction parallel to the first direction, the substrates of every two adjacent pixel units in each row are arranged on the PCB board at an angle parallel to the first direction, the number of the light emitting chips in the same row in every pixel unit in the same row is one, the types of the light emitting chips in every two adjacent pixel units are the same, and the top and bottom surfaces of the light emitting chips in every column in every pixel unit in the same column are aligned and the types are the same.
9. The LED display module of claim 7, wherein adjacent three light emitting chips of two adjacent pixel units can realize pixel multiplexing in the first direction, and adjacent three light emitting chips of two adjacent pixel units can realize pixel multiplexing in the second direction.
10. An LED display screen comprising an LED display module according to any one of claims 7 to 9.
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| CN202311860249.5A CN117810244A (en) | 2023-12-31 | 2023-12-31 | Pixel unit, LED display module and LED display screen |
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| CN202311860249.5A CN117810244A (en) | 2023-12-31 | 2023-12-31 | Pixel unit, LED display module and LED display screen |
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| CN113971633A (en) * | 2021-10-25 | 2022-01-25 | 深圳蓝普视讯科技有限公司 | Flip chip space pixel arrangement structure, pixel multiplexing method, system, device and storage medium |
| US20220216183A1 (en) * | 2020-10-21 | 2022-07-07 | Boe Technology Group Co., Ltd. | Display substrate and display device |
| CN115241343A (en) * | 2022-06-23 | 2022-10-25 | 佛山市国星光电股份有限公司 | LED packaging device, preparation method and display device thereof |
| CN218351463U (en) * | 2022-10-10 | 2023-01-20 | 深圳雷曼光电科技股份有限公司 | LED packaging module and LED display screen |
| CN116207086A (en) * | 2023-01-16 | 2023-06-02 | 佛山市国星光电股份有限公司 | LED display module and preparation method |
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| US20220216183A1 (en) * | 2020-10-21 | 2022-07-07 | Boe Technology Group Co., Ltd. | Display substrate and display device |
| CN113971633A (en) * | 2021-10-25 | 2022-01-25 | 深圳蓝普视讯科技有限公司 | Flip chip space pixel arrangement structure, pixel multiplexing method, system, device and storage medium |
| CN115241343A (en) * | 2022-06-23 | 2022-10-25 | 佛山市国星光电股份有限公司 | LED packaging device, preparation method and display device thereof |
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