CN117804856A - Self-matching nondestructive preparation method of composite material patch-adhered sample - Google Patents
Self-matching nondestructive preparation method of composite material patch-adhered sample Download PDFInfo
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- CN117804856A CN117804856A CN202311732357.4A CN202311732357A CN117804856A CN 117804856 A CN117804856 A CN 117804856A CN 202311732357 A CN202311732357 A CN 202311732357A CN 117804856 A CN117804856 A CN 117804856A
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- 239000002131 composite material Substances 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000012360 testing method Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 238000005498 polishing Methods 0.000 claims abstract description 11
- 238000004088 simulation Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 238000009461 vacuum packaging Methods 0.000 claims abstract description 4
- 230000008439 repair process Effects 0.000 claims description 33
- 239000004744 fabric Substances 0.000 claims description 28
- 238000000926 separation method Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 244000137852 Petrea volubilis Species 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 230000007547 defect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000011800 void material Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000011157 advanced composite material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of preparation of composite material samples, in particular to a self-matching nondestructive preparation method of a composite material patch adhesive joint sample, which comprises the following specific steps: s1, calculating the size parameter of the patch glued test sample; s2, cutting prepreg with corresponding size; s3, auxiliary paving by laser positioning; s4, vacuum packaging; s5, primary curing; s6, polishing and cleaning the surface to be glued; s7, cementing; s8, secondary curing; s9, cleaning surface residual glue; s10, quality inspection; on one hand, the superposition effect of the dimensional errors can be greatly reduced, the dimensional matching degree of the patch and the substrate is effectively improved, and the assembly stress is reduced; on the other hand, the method fundamentally avoids layering and burr damage caused by machining on the cured laminated plate, simplifies the process flow, improves the product efficiency, improves the bonding quality, effectively reduces the theoretical performance of the composite material repairing bonding sample, and fully plays a role in guiding engineering practice by theoretical simulation.
Description
Technical Field
The invention relates to the technical field of preparation of composite material samples, in particular to a self-matching nondestructive preparation method of a composite material repair adhesive joint sample.
Background
The composite material repair bonding technology is used as an advanced repair technology and is gradually applied to repair of the damage of the composite material structure of a multi-type aircraft body. The repair effect of the repair patch of the composite material is closely related to factors such as the ply design of the patch, the repair angle, the interface quality of the patch and the substrate, the size matching degree of the patch and the substrate, the curing process and the like, and before a repair scheme is given, engineers usually need to screen and optimize the most reasonable adhesive bonding parameters by means of theoretical calculation and finite element simulation, and then prepare a repair adhesive bonding sample based on the optimized parameters to test and verify the reliability of the repair scheme.
At present, the process of preparing composite material repair adhesive samples at home and abroad mainly comprises the steps of firstly preparing a finished composite material substrate laminated plate shown in figure 1a and a patch laminated plate shown in figure 1b, then respectively processing the substrate laminated plate and the patch laminated plate into a shape to be bonded shown in figures 1c and 1d by means of laser ablation, such as a damaged layer laser stripping method CN114905156A for repair of the composite material laminate plate proposed by semiconductor research of China academy of sciences, a resin-based composite material laser connection and repair method CN115781028A proposed by China civil aviation flight academy, or mechanical processing such as milling and polishing, such as a composite material R-angle repair equipment patent CN115972043A invented by Anhui Jia Liqi advanced composite material science and technology Co., and a standard hard patch method CN110877464A for quick repair of aircraft composite material proposed by northwest industrial university, according to a certain repair slope, and bonding the substrate laminated plate and the patch is completed by using structural adhesive after finishing surface burrs.
However, in the method, the substrate laminated plate and the patch laminated plate are respectively molded, and have process errors, and even if the bonding inclined plane is processed by adopting a numerical control processing mode, the process errors are further overlapped, so that the bonding sizes of the substrate and the patch are not matched, and the curing residual stress is introduced; meanwhile, in the process of processing the formed laminated plate into a tape bonding shape with a certain inclination, damages such as fiber breakage, resin breakage, edge burrs and the like are inevitably caused to the substrate and the patch, performance errors caused by secondary processing can further reduce the bonding degree of the composite material repairing adhesive bonding sample and the theoretical simulation sample, the reliability of simulation parameters is difficult to accurately verify, and effective combination of simulation and experiments cannot be realized.
Disclosure of Invention
In order to solve the problems, the invention provides a self-matching nondestructive preparation method of a composite material patch adhesive joint sample.
A self-matching nondestructive preparation method of a composite material patch-adhered sample comprises the following specific steps:
s1, calculating size parameters of the patch adhesive test sample: calculating the overall size of a substrate of the composite material patch adhesive bond test sample and the radius of each layer of patch according to patch adhesive bond parameters and test standards given by theoretical simulation;
s2, cutting the prepreg with the corresponding size: flatly laying the composite prepreg on an automatic cutting machine, cutting a rectangle and a circle layer by layer according to the size calculated in the step S1, taking out the circle from the rectangle to obtain two types of prepregs to be laid, namely circular sheets with different diameters and rectangles with round holes with different diameters, and recording the size characteristics of the prepregs layer by adopting a laser positioning instrument;
s3, auxiliary paving by laser positioning: the color of the projection light spot is adjusted according to the color of the table top so as to highlight the paving area, the size characteristics of each layer of prepreg are projected on the flat and smooth table top by using a laser positioning instrument, and the prepreg is accurately paved on the light spot positioning area layer by layer;
s4, vacuum packaging: sequentially laying a separation film, a release cloth, a substrate, the release cloth, the separation film, the release cloth, a patch, the release cloth, a suction fabric, the separation film, a pressure equalizing plate, an airfelt and a vacuum bag on a die, laying adhesive tape with equal thickness on the periphery of the substrate, and keeping the vacuum degree not higher than-0.92 Bar;
s5, primary curing: curing is completed in an autoclave according to a heating and pressurizing system of the prepreg, and the vacuum bag and the demolding cloth curing auxiliary materials are removed;
s6, polishing and cleaning the surface to be glued: polishing excessive resin overflowed from the substrate and the patch by using sand paper, dipping acetone solvent into clean plain cloth, cleaning the bonding surfaces of the substrate and the patch, and airing;
s7, cementing: uniformly smearing the structural adhesive on the bonding inclined plane of the patch and the substrate, and then quickly embedding the patch into the substrate and compacting;
s8, secondary curing: sequentially laying a separation film, a demolding cloth, an adhesive structure, the demolding cloth, the separation film, a pressure equalizing plate, an airfelt and a vacuum bag on a die, keeping the vacuum degree not higher than-0.92 Bar, completing curing in an autoclave according to a heating and pressurizing system of structural adhesive, and removing auxiliary curing materials such as the vacuum bag;
s9, cleaning surface residual glue: removing overflowed structural adhesive by adopting sand paper, and smoothly transiting the patch and the adhesive bonding surface by using a polishing machine;
s10, quality inspection: and (3) carrying out ultrasonic detection on the repaired area after repair to ensure that the interface has no debonding and void defects.
The repair bonding parameters in the step S1 comprise a damage radius R, a damage depth h and a repair inclination k, and the radius R of each patch layer 1 ＝r、R 2 ＝r+h 0 /k、…、R n ＝r+(n-1)h 0 /k(n＝h/h 0 Wherein h is 0 Is a single layer prepreg thickness).
And step S2, the one-to-one correspondence between the fiber layering direction and the size characteristic is ensured by adjusting the cutting direction.
And step S3, accurately paving the prepregs with the rectangle, the rectangle containing the R1 round hole, the rectangle containing the R2 round hole, the rectangle containing the … and the rectangle containing the Rn round hole in the light spot positioning area, and pre-compacting each 3-5 layers in a vacuum bag for 15 minutes to form the composite material substrate to be solidified.
And step S3, accurately paving the prepreg with Rn round shape, … round shape, R2 round shape and R1 round shape in the light spot positioning area, and pre-compacting each 3-5 layers in a vacuum bag for 15 minutes to form the composite material patch to be solidified.
In the step S4, the release cloth and the isolating film need to completely cover the patch, so as to effectively ensure that the patch and the substrate can be separated without damage after solidification is completed.
The beneficial effects of the invention are as follows: compared with the existing method for respectively forming the patch and the substrate and then machining, the method has the advantages that the size of the patch and the size of the substrate are designed before solidification, the substrate and the patch with the inclined surface appearance characteristic are prepared by adopting a self-matching integrated forming method, and the composite material repairing and gluing sample can be directly prepared without additional machining, so that the superposition effect of dimensional errors can be greatly reduced, the size matching degree of the patch and the substrate is effectively improved, and the assembly stress is reduced; on the other hand, the method fundamentally avoids layering and burr damage caused by machining on the cured laminated plate, simplifies the process flow, improves the product efficiency, improves the bonding quality, effectively reduces the theoretical performance of the composite material repairing bonding sample, and fully plays a role in guiding engineering practice by theoretical simulation.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of a composite repair bonded specimen prepared by a conventional process in the background of the invention;
FIG. 2 is a schematic diagram of a pretreatment process of a patch and a substrate in a composite material patch bonding structure of the present invention;
fig. 3 is a schematic diagram of co-cured encapsulation of a patch and a substrate in a composite repair bonded structure of the present invention.
Detailed Description
The present invention will be further described in the following to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the present invention easy to understand.
As shown in fig. 2 to 3, the dimensional parameters of the patch bond samples were calculated: the parameters of the patch cementing according to theoretical simulation are that the overall size is 100mm multiplied by 150mm multiplied by 2mm, the damage radius r=10mm, the damage depth h=1mm, the patch inclination k=1:20 and the single-layer thickness h 0 The ZT7H/QY9611 composite material with the thickness of 0.125mm is used for repairing the glued joint sample and the test standard, and the patch layer number n=h/H is calculated 0 Radius R of each patch layer =8 1 ＝r＝10mm、R 2 ＝r+(2-1)*h 0 /k＝12.5mm、R 3 ＝15mm、R 4 ＝17.8mm、R 5 ＝20mm、R 6 ＝22.5mm、R 7 ＝25mm、R 8 =27.5 mm, and correspondingly, the substrate notch radius of each layer is equal to the patch radius;
s2, cutting the prepreg with the corresponding size: spreading the composite prepreg on an automatic cutting machine, cutting a rectangle and a circle layer by layer according to the size calculated in the step S1, taking out the circle from the rectangle to obtain two types of prepregs to be spread, namely discs with different diameters and rectangles with round holes with different diameters, wherein the direction of the rectangle and the direction of the fiber are [45 degrees/90 degrees/45 degrees/0 degrees ] in the cutting process] 2s Synchronously adjusting and recording the size characteristics of the materials layer by adopting a laser positioning instrument;
s3, auxiliary paving by laser positioning: the color of the projection light spot is adjusted according to the color of the table top so as to highlight the paving area, the size characteristics of each layer of prepreg are projected on the flat and smooth table top by using a laser positioning instrument, and the prepreg is accurately paved on the light spot positioning area layer by layer;
s4, vacuum packaging: sequentially laying a separation film, a release cloth, a substrate, the release cloth, the separation film, a patch which is completely wrapped, a suction fabric, the separation film, a pressure equalizing plate, an air felt and a vacuum bag on a die, laying adhesive blocking strips with equal thickness on the periphery of the substrate, and keeping the vacuum degree not higher than-0.92 Bar after sealing;
s5, primary curing: curing is completed in an autoclave according to a heating and pressurizing system of ZT7H/QY9611 prepreg, and then a vacuum bag and a demolding cloth curing auxiliary material are removed;
s6, polishing and cleaning the surface to be glued: polishing excessive resin overflowed from the substrate and the patch by using No. 80 sand paper, dipping an acetone solvent into clean plain cloth, cleaning the bonding surfaces of the substrate and the patch, and airing;
s7, cementing: selecting and preparing structural adhesive, uniformly smearing the structural adhesive on an adhesive inclined plane of the patch and the substrate within 1 hour, and then quickly embedding the patch into the substrate and compacting;
s8, secondary curing: sequentially laying a separation film, a demolding cloth, an adhesive structure, the demolding cloth, the separation film, a pressure equalizing plate, an airfelt and a vacuum bag on a die, keeping the vacuum degree not higher than-0.92 Bar, completing solidification in an autoclave according to a heating and pressurizing system of the used structural adhesive, and removing auxiliary materials for solidifying the vacuum bag;
s9, cleaning surface residual glue: removing overflowed structural adhesive by adopting sand paper, and smoothly transiting the patch and the adhesive bonding surface by using a polishing machine;
s10, quality inspection: and (3) carrying out ultrasonic detection on the repaired area after repair to ensure that the interface has no debonding and void defects.
FIG. 1 is a schematic diagram of a composite repair bonded sample prepared by a conventional process: reference numeral a is a cured substrate laminate, reference numeral b is a cured patch laminate, reference numeral c is a machined substrate to be bonded, reference numeral d is a machined patch to be bonded, and reference numeral e is a cured composite patch.
Fig. 2 is a schematic diagram of a pretreatment process of a patch and a substrate in the composite material patch-repair bonding structure according to the present invention: reference numeral 1 is a composite prepreg; reference numeral 2 is a clipping path; reference numeral 3 is a numerical control cutter; reference numeral 4 is a pre-compacted patch laid layer by layer; reference numeral 5 denotes a pre-compacted substrate laid layer by layer.
Fig. 3 is a schematic diagram of co-cured encapsulation of a patch and a substrate in a composite repair bonded structure of the present invention.
Step S3 is to sequentially divide the rectangle into R 1 10mm round hole rectangle, containing R 2 Round hole rectangle of 12.5mm, …, containing R 8 Accurately paving the prepreg with the rectangular round holes of 27.5mm in a spot positioning area, and pre-compacting each 3-5 layers in a vacuum bag for 15 minutes to form a composite material substrate to be cured;
the step S3 sequentially comprises the steps of 8 =27.5 mm round, …, R 2 12.5mm round, R 1 The 10mm round prepreg was accurately laid down in the spot location area, and each 3-5 layers were pre-compacted in a vacuum bag for 15 minutes to form a composite patch to be cured.
In the step S4, the patch needs to be completely covered by a release cloth and an isolating film, and thermocouples are laid near the patch, as shown in fig. 3, the thermocouple laying connection process is consistent with the autoclave molding requirement, and is not in the protection scope of the invention.
The heating and pressurizing system of the ZT7H/QY9611 prepreg in the step S5 is as follows: the temperature is raised from normal temperature to 130 ℃ at the speed of 2 ℃/min, then the temperature is kept for 1 hour, the temperature is raised from 130 ℃ to 185 ℃ at the speed of 2 ℃/min, then the temperature is kept for 1 hour, the temperature is raised from 185 ℃ to 200 ℃ at the speed of 2 ℃/min, then the temperature is kept for 5 hours, and finally the temperature is lowered from 200 ℃ to 70 ℃ at the speed of-1 ℃/min, and finally the temperature is naturally cooled.
And (3) selecting and preparing the structural adhesive in the step S7: the structural adhesive is selected according to the principles of strong adhesive property, high shear strength and peeling strength and wide application temperature range. In the embodiment, the dual-component high-performance pasty structural adhesive J-349-1 is selected, and the component A and the component B of the J-349-1 structural adhesive are uniformly stirred according to the mass ratio of 100:30 to prepare 13g.
The heating and pressurizing system of the structural adhesive (J-349-1) used in the step S8 is as follows: raising the temperature from normal temperature to 80 ℃ at the speed of 1.5 ℃/min, preserving the heat for 3 hours, and then cooling the temperature from 80 ℃ to 50 ℃ at the speed of-1 ℃/min, and naturally cooling the temperature.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A self-matching nondestructive preparation method of a composite material repair adhesive joint sample is characterized by comprising the following steps of: the method comprises the following specific steps:
s1, calculating size parameters of the patch adhesive test sample: calculating the overall size of a substrate of the composite material patch adhesive bond test sample and the radius of each layer of patch according to patch adhesive bond parameters and test standards given by theoretical simulation;
s2, cutting the prepreg with the corresponding size: flatly laying the composite prepreg on an automatic cutting machine, cutting a rectangle and a circle layer by layer according to the size calculated in the step S1, taking out the circle from the rectangle to obtain two types of prepregs to be laid, namely circular sheets with different diameters and rectangles with round holes with different diameters, and recording the size characteristics of the prepregs layer by adopting a laser positioning instrument;
s3, auxiliary paving by laser positioning: the color of the projection light spot is adjusted according to the color of the table top so as to highlight the paving area, the size characteristics of each layer of prepreg are projected on the flat and smooth table top by using a laser positioning instrument, and the prepreg is accurately paved on the light spot positioning area layer by layer;
s4, vacuum packaging: sequentially laying a separation film, a release cloth, a substrate, the release cloth, the separation film, the release cloth, a patch, the release cloth, a suction fabric, the separation film, a pressure equalizing plate, an airfelt and a vacuum bag on a die, laying adhesive tape with equal thickness on the periphery of the substrate, and keeping the vacuum degree not higher than-0.92 Bar;
s5, primary curing: curing is completed in an autoclave according to a heating and pressurizing system of the prepreg, and the vacuum bag and the demolding cloth curing auxiliary materials are removed;
s6, polishing and cleaning the surface to be glued: polishing excessive resin overflowed from the substrate and the patch by using sand paper, dipping acetone solvent into clean plain cloth, cleaning the bonding surfaces of the substrate and the patch, and airing;
s7, cementing: uniformly smearing the structural adhesive on the bonding inclined plane of the patch and the substrate, and then quickly embedding the patch into the substrate and compacting;
s8, secondary curing: sequentially laying a separation film, a demolding cloth, an adhesive structure, the demolding cloth, the separation film, a pressure equalizing plate, an airfelt and a vacuum bag on a die, keeping the vacuum degree not higher than-0.92 Bar, completing curing in an autoclave according to a heating and pressurizing system of structural adhesive, and removing auxiliary curing materials such as the vacuum bag;
s9, cleaning surface residual glue: removing overflowed structural adhesive by adopting sand paper, and smoothly transiting the patch and the adhesive bonding surface by using a polishing machine;
s10, quality inspection: and (3) carrying out ultrasonic detection on the repaired area after repair to ensure that the interface has no debonding and void defects.
2. The self-matching nondestructive preparation method of the composite material repair bonded test sample according to claim 1, wherein the method comprises the following steps: the repair bonding parameters in the step S1 comprise a damage radius R, a damage depth h and a repair inclination k, and the radius R of each patch layer 1 ＝r、R 2 ＝r+h 0 /k、…、R n ＝r+(n-1)h 0 /k。
3. The self-matching nondestructive preparation method of the composite material repair bonded test sample according to claim 1, wherein the method comprises the following steps: and step S2, the one-to-one correspondence between the fiber layering direction and the size characteristic is ensured by adjusting the cutting direction.
4. The self-matching nondestructive preparation method of the composite material repair bonded test sample according to claim 1, wherein the method comprises the following steps: and step S3, accurately paving the prepregs with the rectangle, the rectangle containing the R1 round hole, the rectangle containing the R2 round hole, the rectangle containing the … and the rectangle containing the Rn round hole in the light spot positioning area, and pre-compacting each 3-5 layers in a vacuum bag for 15 minutes to form the composite material substrate to be solidified.
5. The self-matching nondestructive preparation method of the composite material repair bonded test sample according to claim 1, wherein the method comprises the following steps: and step S3, accurately paving the prepreg with Rn round shape, … round shape, R2 round shape and R1 round shape in the light spot positioning area, and pre-compacting each 3-5 layers in a vacuum bag for 15 minutes to form the composite material patch to be solidified.
6. The self-matching nondestructive preparation method of the composite material repair bonded test sample according to claim 1, wherein the method comprises the following steps: in the step S4, the release cloth and the isolating film need to completely cover the patch, so as to effectively ensure that the patch and the substrate can be separated without damage after solidification is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311732357.4A CN117804856A (en) | 2023-12-16 | 2023-12-16 | Self-matching nondestructive preparation method of composite material patch-adhered sample |
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| CN202311732357.4A CN117804856A (en) | 2023-12-16 | 2023-12-16 | Self-matching nondestructive preparation method of composite material patch-adhered sample |
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