CN117801745B - Underfill with low thermal expansion coefficient, preparation method thereof and chip packaging structure - Google Patents
Underfill with low thermal expansion coefficient, preparation method thereof and chip packaging structure Download PDFInfo
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- CN117801745B CN117801745B CN202410217931.0A CN202410217931A CN117801745B CN 117801745 B CN117801745 B CN 117801745B CN 202410217931 A CN202410217931 A CN 202410217931A CN 117801745 B CN117801745 B CN 117801745B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims abstract description 116
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 116
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 34
- 229920000570 polyether Polymers 0.000 claims abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 15
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 15
- 239000003086 colorant Substances 0.000 claims abstract description 14
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 239000000945 filler Substances 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 125000001624 naphthyl group Chemical group 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000004043 dyeing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 glycidyl ester Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 101150091203 Acot1 gene Proteins 0.000 description 1
- 102100025854 Acyl-coenzyme A thioesterase 1 Human genes 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides an underfill with low thermal expansion coefficient, a preparation method thereof and a chip packaging structure, wherein the underfill comprises the following components in percentage by mass: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter; the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin; the three kinds of resin of three functional groups epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin of the compound are cured through the curing agent, basic performance is provided for the underfill, the performance of the underfill is enhanced by taking silicon dioxide as a filler, and meanwhile, the adhesive force between the underfill and a substrate is improved through the adhesive force promoter, so that the reliability and the service life of chip packaging are improved.
Description
Technical Field
The invention belongs to the technical field of underfill packaging, and particularly relates to an underfill with a low thermal expansion coefficient, a preparation method thereof and a chip packaging structure.
Background
The underfill is a key material in the packaging technology of electronic devices, and is mainly used for filling a narrow gap between a chip and a substrate, dispersing stress borne by the surface of the chip, relieving internal stress generated by mismatch of thermal expansion coefficients among the chip, solder and the substrate, reducing stress impact between the chip and the substrate caused by difference of the thermal expansion coefficients, improving the structural strength and reliability of the electronic devices, and enhancing the anti-dropping performance between the chip and the substrate.
Whether the underfill is effective or not is related to the difference between the expansion coefficients of the chip and the substrate, the lower the thermal expansion coefficient of the underfill, the better the degree of adhesion of the underfill to the surface of the chip, and the longer the service life of the chip. Therefore, the underfill needs to have not only a low thermal expansion coefficient but also high wet heat resistance.
Therefore, how to provide an underfill with a low thermal expansion coefficient, so as to have higher wet thermal resistance and better silicon adhesion, and improve the reliability and lifetime of the chip package is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The present invention is directed to an underfill having a low thermal expansion coefficient, a method for preparing the underfill, and a chip package structure, so as to at least solve one of the above-mentioned problems.
To achieve the above object, the first aspect of the present invention provides an underfill having a low thermal expansion coefficient, the underfill comprising the following components in mass percent: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter; the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin.
In the first aspect, the weight percentage of the trifunctional epoxy resin is 4% -20%, the weight percentage of the polyether modified epoxy resin is 4% -20%, and the weight percentage of the naphthalene type epoxy resin is 4% -20%.
In a first aspect, the curing agent is Ancamine 2264.
In a first aspect, the polyether modified epoxy resin has the structural formula:
。
In a first aspect, the trifunctional epoxy includes at least one of MF-3285 and TPNE 5501.
In a first aspect, the naphthalene type epoxy resin comprises at least one of SE-165 and EBA-65.
In a first aspect, the colorant comprises carbon black.
In a second aspect, the present invention provides a method for preparing the underfill having a low thermal expansion coefficient according to the first aspect, comprising:
S1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter;
s2: transferring the first slurry to a three-roller grinder for dispersion treatment to obtain uniformly dispersed second slurry;
S3: and carrying out vacuum defoaming on the second slurry to obtain the underfill.
In a second aspect, the epoxy resin is compounded from a trifunctional epoxy resin, a polyether-modified epoxy resin, and a naphthalene-type epoxy resin; the weight percentage of the trifunctional epoxy resin is 4% -20%, the weight percentage of the polyether modified epoxy resin is 4% -20%, and the weight percentage of the naphthalene type epoxy resin is 4% -20%.
The third aspect of the present invention provides a chip packaging structure, comprising a substrate, a chip disposed on the substrate, and a plurality of soldering bumps disposed between the substrate and the chip and electrically connected to the substrate and the chip, wherein a gap is formed between the substrate and the chip, and the glue solution of the underfill with a low thermal expansion coefficient of the first aspect is disposed at the edge of the substrate, so that the glue solution of the underfill flows from one end of the gap to the other end of the gap by capillary action to fill the gap; solidifying the glue solution of the underfill; and after the solidification is finished, obtaining the chip packaging structure.
The beneficial effects are that:
The application provides an underfill with a low thermal expansion coefficient, which comprises the following components in percentage by mass: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter; the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin; the trifunctional epoxy resin has the dual characteristics of alicyclic epoxy resin and glycidyl ester, and has high reactivity and high adhesiveness; the polyether modified epoxy resin has low viscosity and a large number of flexible groups, can increase the fluidity of the underfill, reduce the hardness, and improve the curing shrinkage and the flexibility; the naphthalene-type epoxy resin contains a naphthalene ring structure with high hydrophobicity and rigidity, can still keep good performance in a high-temperature environment, has higher Young modulus, in-plane orientation and stacking coefficient, has small free volume in which a molecular chain can move, has small expansion in the direction of the molecular chain, can inhibit thermal expansion in the direction perpendicular to the molecular chain along with the rise of temperature, can effectively reduce the thermal expansion coefficient of underfill, and is formed into a whole by curing three compounded three-functional epoxy resin, polyether modified epoxy resin and naphthalene-type epoxy resin by a curing agent, so that basic performance is provided for the underfill, the performance of the underfill is enhanced by taking silicon dioxide as a filler, the adhesive force between the underfill and a substrate is improved by taking an adhesive force promoter, and dyeing marking is carried out by adopting a dyeing agent; the underfill prepared by the specific formula proportion of the application has good fluidity, low thermal expansion coefficient and wet heat resistance, and simultaneously has good adhesive force to silicon chips, thereby improving the reliability and the service life of chip packaging.
Drawings
In order to more clearly illustrate the embodiments of the present description or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for preparing an underfill having a low thermal expansion coefficient according to the present application.
Detailed Description
The advantages and various effects of the present invention will be more clearly apparent from the following detailed description and examples. It will be understood by those skilled in the art that these specific embodiments and examples are intended to illustrate the invention, not to limit the invention.
Throughout the specification, unless specifically indicated otherwise, the terms used herein should be understood as meaning as commonly used in the art. Accordingly, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification will control.
Unless specifically indicated otherwise, the various raw materials, reagents, instruments, equipment, etc., used in the present invention are commercially available or may be obtained by existing methods.
The application provides an underfill with a low thermal expansion coefficient, which comprises the following components in percentage by mass: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter; the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin.
Specifically, the underfill with low thermal expansion coefficient provided by the application comprises the following components in percentage by mass: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter; the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin; the trifunctional epoxy resin has the dual characteristics of alicyclic epoxy resin and glycidyl ester, and has high reactivity and high adhesiveness; the polyether modified epoxy resin has low viscosity and a large number of flexible groups, can increase the fluidity of the underfill, reduce the hardness, and improve the curing shrinkage and the flexibility; the naphthalene-type epoxy resin contains a naphthalene ring structure with high hydrophobicity and rigidity, can still keep good performance in a high-temperature environment, has higher Young modulus, in-plane orientation and stacking coefficient, has small free volume in which a molecular chain can move, has small expansion in the direction of the molecular chain, can inhibit thermal expansion in the direction perpendicular to the molecular chain along with the rise of temperature, can effectively reduce the thermal expansion coefficient of underfill, and is formed into a whole by curing three compounded three-functional epoxy resin, polyether modified epoxy resin and naphthalene-type epoxy resin by a curing agent, so that basic performance is provided for the underfill, the performance of the underfill is enhanced by taking silicon dioxide as a filler, the adhesive force between the underfill and a substrate is improved by taking an adhesive force promoter, and dyeing marking is carried out by adopting a dyeing agent; the underfill prepared by the specific formula proportion of the application has good fluidity, low thermal expansion coefficient and wet heat resistance, and simultaneously has good adhesive force to silicon chips, thereby improving the reliability and the service life of chip packaging.
In some possible embodiments, the trifunctional epoxy is 4-20 wt%, the polyether modified epoxy is 4-20 wt%, and the naphthalene epoxy is 4-20 wt%.
It can be understood by those skilled in the art that the epoxy resin of the present application is compounded from trifunctional epoxy resin, polyether-modified epoxy resin and naphthalene-type epoxy resin, each of which has its specific properties and effects, and the thermal expansion coefficient, fluidity and wet heat resistance of the underfill can be controlled by compounding the three and adjusting the ratio between the three.
In some possible embodiments, the curing agent is Ancamine 2264.
This is because Ancamine 2264 is an epoxy curing agent having both alicyclic and aromatic characteristics, has a high glass transition temperature, and can react with an epoxy resin at a certain temperature to form a thermosetting compound having a three-dimensional network structure. In the application, the three epoxy resins with three functional groups, the polyether modified epoxy resin and the naphthalene type epoxy resin are connected into an integral structure through the curing agent, so that the performance of the underfill is further enhanced.
In some possible embodiments, the polyether modified epoxy resin has the structural formula:
。
the polyether modified epoxy resin is used as a material matrix, can provide adhesive property and mechanical property for the underfill, and can improve the fluidity of the underfill. The polyether modified epoxy resin may be SE-4125P.
In some possible embodiments, the trifunctional epoxy includes at least one of MF-3285 and TPNE 5501.
The trifunctional epoxy resin contains a large number of groups with high reactivity, which can provide crosslinking points for curing reaction for the underfill, and further improve the compatibility of the polyether epoxy resin and the naphthalene epoxy resin.
In some possible embodiments, the naphthalene type epoxy includes at least one of SE-165 and EBA-65.
The naphthalene type epoxy resin can still keep good performance at a high temperature of 150 ℃, and the molecular structure of the naphthalene type epoxy resin contains a rigid molecular structure, so that the thermal expansion coefficient of the underfill can be reduced, in addition, the thermal expansion coefficient of the underfill is further reduced by adding silicon dioxide, and meanwhile, the compatibility of the silicon dioxide and the underfill is also improved.
In some possible embodiments, the colorant comprises carbon black.
As will be appreciated by those skilled in the art, the colorant is used to color the underfill to facilitate chip identification, and in the present application, the colorant may be carbon black.
Based on a general inventive concept, referring to fig. 1, the present application also provides a method for preparing an underfill having a low thermal expansion coefficient according to the first aspect, the method comprising:
S1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: 24-33% of epoxy resin, 58-69% of silicon dioxide, 8-19% of curing agent, 0.1-0.3% of coloring agent and 0.2-0.4% of adhesion promoter; stirring and mixing are carried out by a centrifugal stirrer, the stirring and mixing time of the centrifugal stirrer is 115-155 s, the rotation is 1050r/min, and the revolution is 1320r/min;
S2: transferring the first slurry to a three-roller grinder for dispersion treatment to obtain uniformly dispersed second slurry; wherein, the feeding gap of the three-roller grinder is 10-40 mu m, and the discharging gap is 10-20 mu m;
s3: and carrying out vacuum defoaming on the second slurry to obtain the underfill. Wherein, the vacuum defoaming is carried out in a centrifugal stirrer, the vacuum defoaming time of the centrifugal stirrer is set to be 65-95 s, the rotation is 1050r/min, and the revolution is 1320r/min;
As another alternative embodiment, the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin; the weight percentage of the trifunctional epoxy resin is 4% -20%, the weight percentage of the polyether modified epoxy resin is 4% -20%, and the weight percentage of the naphthalene type epoxy resin is 4% -20%.
Based on one general inventive concept, the application also provides a chip packaging structure, which comprises a substrate, a chip arranged on the substrate, and a plurality of welding convex points arranged between the substrate and the chip and electrically connected with the substrate and the chip at intervals, wherein gaps are formed between the substrate and the chip,
Disposing the glue solution of the underfill having the low thermal expansion coefficient of the first aspect at the edge of the substrate, and flowing the glue solution of the underfill from one end of the gap to the other end of the gap by capillary action to fill the gap;
Solidifying the glue solution of the underfill;
And after the solidification is finished, obtaining the chip packaging structure.
The application will be further illustrated with reference to specific examples. It is to be understood that these examples are illustrative of the present application and are not intended to limit the scope of the present application. The experimental procedures, which are not specified in the following examples, are generally determined according to national standards. If the corresponding national standard does not exist, the method is carried out according to the general international standard, the conventional condition or the condition recommended by the manufacturer.
The underfill compositions of comparative examples 1-5 and examples 1-4 are shown in Table 1 below in mass percent:
TABLE 1 mass percent of raw material components
The underfill adhesives provided in examples 1-4 and comparative examples 1-5 were tested for storage modulus, glass transition temperature, coefficient of thermal expansion, elongation/tensile strength and flowability as follows:
1. the fluidity test method comprises the following steps: sticking four corners of a rectangular Si sheet with the thickness of 20mm multiplied by 40mm and the thickness of 0.5mm on a substrate by using double-sided adhesive with the thickness of 50um, transversely dispensing (30-35 mg) the underfill to be tested along one edge of the rectangular Si sheet by using a dispenser, placing the underfill on an electric heating plate at the temperature of 90 ℃, starting timing, and under the action of capillary force, allowing the underfill to flow at the bottom of the Si sheet, and recording the time from flowing to half of the Si sheet and the time when the underfill flows.
2. Coefficient of thermal expansion: reference standard ASTM E831-2019, samples were prepared with dimensions 5mm by 10mm, at 165℃for 2 hours to cure the samples completely. The samples were tested for coefficient of thermal expansion using TMA (compression mode). Parameter setting of TMA: preloading force: 0.2N, first scan: room temperature-260 ℃ (heating rate 20 ℃/min); second scan: 40-260 ℃ (heating rate 5 ℃/min), and taking curve data of a second heating segment; the coefficient of expansion CTE1/2 takes on values of 50℃to 90℃and 160℃to 200℃respectively.
3. Glass transition temperature Tg: reference standard: ASTM E2254-2018, take 165 ℃ for 2 hours of cured complete samples, prepare test samples of dimensions 55mm 10mm X/3 mm, measure with DMA, measurement mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10 μm, rate of temperature rise: 5 ℃/min.
4. Storage modulus: reference standard: ASTM E2254-2018, taking a sample cured at 165℃for 2 hours to complete, preparing test samples of dimensions 55 mm. Times.10 mm. Times.3 mm, measured using DMA, measurement mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10 μm, rate of temperature rise: 5 ℃/min; the energy storage modulus is measured at 25-245 ℃.
5. Reliability test: pouring a sample in a pudding die with the diameter of 3mm and the height of 2mm, contacting one end of the poured sample with a silicon wafer, fixing the silicon wafer and cloth Ding Moju, removing the pudding die after 165 ℃/2h solidification, taking out the sample, and testing by using a thrust machine; the mixture is taken out and tested by a thrust machine after being taken out by a high-temperature high-pressure cooking device (PCT) with the temperature of 120 ℃ and the humidity of 100 percent and 48 hours; the test speed of the thrust machine is 50um/s, and the contact height is 20um.
The test results are shown in table 2 below:
table 2 test results
From the above table, it can be seen that:
(1) In comparative example 1, only polyether modified epoxy resin and naphthalene type epoxy resin are added, and no trifunctional epoxy resin is added, so that the epoxy resin has better fluidity, but has higher thermal expansion coefficient, less crosslinking points and increased proportion of flexible chain segments in molecules during the curing reaction, so that the Tg of the material is smaller and the adhesive force is smaller;
(2) In comparative example 2, only naphthalene ring type resin and trifunctional epoxy resin were added, and no polyether modified epoxy resin was added, so that fluidity was deteriorated and shrinkage after curing was easy;
(3) The comparative example 3 is a polyether modified epoxy resin and a trifunctional epoxy resin, no naphthalene ring resin is added, the glass transition temperature of the underfill is low, the thermal expansion coefficient is large, and the Si adhesion is obviously reduced after PCT;
(4) The three resins are added in the comparative examples 4-5 for matching, but the addition amount is not within the specified percentage range of the application, the obtained underfill has general performance, and the Si adhesive force is lower, which is not beneficial to chip packaging;
(5) In the examples 1-4, the addition amount of silicon dioxide is the same, the example 1 uses trifunctional epoxy resin as main resin, and polyether modified epoxy resin and naphthalene ring resin are compounded, so that the adhesive force of the underfill Si is larger, and the Tg is higher; in the embodiment 2, polyether modified epoxy resin is used as main resin, and trifunctional epoxy resin and naphthalene ring resin are compounded, so that the fluidity of the underfill is good; in the embodiment 3, naphthalene ring resin is used as main resin, and tri-functionality epoxy resin and polyether modified epoxy resin are compounded, so that the thermal expansion coefficient of the underfill is low, and the Si adhesive force after PCT is increased; in the embodiment 4, the percentages of the trifunctional epoxy resin as the main resin, the polyether modified epoxy resin and the naphthalene ring resin are the same, the underfill has better fluidity, higher Tg and lower thermal expansion coefficient, and after PCT test, the underfill still has stronger Si adhesive force, thereby improving the reliability and the service life of the chip package.
In summary, the raw material components adopt the underfill adhesive configured in the specified range of the application, and the proportions of the polyether modified epoxy resin, the naphthalene ring resin and the trifunctional epoxy resin are adjusted in the fixed range, so that the underfill adhesive with good fluidity, low thermal expansion coefficient and excellent wet heat resistance can be obtained, namely, the underfill adhesive with low thermal expansion coefficient has higher wet heat resistance and better silicon adhesion, and the reliability and the service life of chip packaging are improved; in addition, the underfill of the application has a higher glass transition temperature and can be applied to more fields.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (3)
1. An underfill with a low thermal expansion coefficient is characterized by comprising the following components in percentage by mass: 24-33% of epoxy resin, 62% of silicon dioxide, 8-19% of curing agent, 0.2% of coloring agent and 0.3% of adhesion promoter; the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin;
The weight percentage of the trifunctional epoxy resin is 4% -20%, the weight percentage of the polyether modified epoxy resin is 4% -20%, and the weight percentage of the naphthalene type epoxy resin is 4% -20%;
the curing agent is Ancamine 2264;
The structural formula of the polyether modified epoxy resin is as follows:
；
The trifunctional epoxy resin is MF-3285;
the naphthalene type epoxy resin comprises at least one of SE-165 and EBA-65;
The colorant comprises carbon black;
The adhesion promoter is NXH-635.
2. A method of preparing the low coefficient of thermal expansion underfill of claim 1, comprising:
S1, stirring and mixing the components according to the respective mass percentages to obtain first slurry, wherein the mass percentages of the components specifically comprise: 24-33% of epoxy resin, 62% of silicon dioxide, 8-19% of curing agent, 0.2% of coloring agent and 0.3% of adhesion promoter;
s2: transferring the first slurry to a three-roller grinder for dispersion treatment to obtain uniformly dispersed second slurry;
S3: vacuum defoamation is carried out on the second slurry to obtain bottom filling glue;
the epoxy resin is compounded by trifunctional epoxy resin, polyether modified epoxy resin and naphthalene type epoxy resin; the weight percentage of the trifunctional epoxy resin is 4% -20%, the weight percentage of the polyether modified epoxy resin is 4% -20%, and the weight percentage of the naphthalene type epoxy resin is 4% -20%.
3. A chip packaging structure comprises a substrate, a chip arranged on the substrate, and a plurality of welding convex points arranged between the substrate and the chip and electrically connected with the substrate and the chip at intervals, wherein a gap is formed between the substrate and the chip,
Disposing a glue solution of the low coefficient of thermal expansion underfill of claim 1 at the edge of the substrate such that the glue solution of the underfill flows from one end of the gap to the other end of the gap by capillary action to fill the gap;
Solidifying the glue solution of the underfill;
And after the solidification is finished, obtaining the chip packaging structure.
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| JP2006206827A (en) * | 2005-01-31 | 2006-08-10 | Matsushita Electric Works Ltd | Liquid sealing epoxy resin composition and semiconductor device |
| JP2019083225A (en) * | 2017-10-27 | 2019-05-30 | 日立化成株式会社 | Liquid resin composition for underfill, electronic component device, and method of manufacturing electronic component device |
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| CN112724899A (en) * | 2020-12-30 | 2021-04-30 | 深圳先进电子材料国际创新研究院 | Underfill adhesive |
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| WO2023089878A1 (en) * | 2021-11-16 | 2023-05-25 | ナミックス株式会社 | Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor device |
| CN117186820A (en) * | 2023-11-03 | 2023-12-08 | 武汉市三选科技有限公司 | Adjustable underfill, preparation method thereof and chip packaging structure |
| CN117487489A (en) * | 2023-11-03 | 2024-02-02 | 武汉市三选科技有限公司 | Underfill with high stretching rate, preparation method thereof and chip packaging structure |
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2024
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| JP2019083225A (en) * | 2017-10-27 | 2019-05-30 | 日立化成株式会社 | Liquid resin composition for underfill, electronic component device, and method of manufacturing electronic component device |
| CN112218904A (en) * | 2018-06-18 | 2021-01-12 | 东丽株式会社 | Epoxy resin composition, prepreg, and fiber-reinforced composite material |
| CN112724899A (en) * | 2020-12-30 | 2021-04-30 | 深圳先进电子材料国际创新研究院 | Underfill adhesive |
| WO2023062877A1 (en) * | 2021-10-13 | 2023-04-20 | ナミックス株式会社 | Liquid sealing agent, electronic component and method for producing same, and semiconductor device |
| WO2023089878A1 (en) * | 2021-11-16 | 2023-05-25 | ナミックス株式会社 | Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor device |
| CN114045137A (en) * | 2022-01-12 | 2022-02-15 | 武汉市三选科技有限公司 | Panel driving circuit bottom filling adhesive, preparation method thereof and chip packaging structure |
| CN116042153A (en) * | 2022-12-19 | 2023-05-02 | 深圳先进电子材料国际创新研究院 | Underfill with high-temperature high-adhesion strength and low thermal expansion coefficient and preparation method thereof |
| CN117186820A (en) * | 2023-11-03 | 2023-12-08 | 武汉市三选科技有限公司 | Adjustable underfill, preparation method thereof and chip packaging structure |
| CN117487489A (en) * | 2023-11-03 | 2024-02-02 | 武汉市三选科技有限公司 | Underfill with high stretching rate, preparation method thereof and chip packaging structure |
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