CN117801740A - Epoxy resin composition comprising silane-containing compound, process using the same, and product - Google Patents
Epoxy resin composition comprising silane-containing compound, process using the same, and product Download PDFInfo
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- CN117801740A CN117801740A CN202211164372.9A CN202211164372A CN117801740A CN 117801740 A CN117801740 A CN 117801740A CN 202211164372 A CN202211164372 A CN 202211164372A CN 117801740 A CN117801740 A CN 117801740A
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- epoxy resin
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- silane
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 249
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 249
- 239000000203 mixture Substances 0.000 title claims abstract description 214
- 229910000077 silane Inorganic materials 0.000 title claims abstract description 39
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 150000001875 compounds Chemical class 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 239000004593 Epoxy Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000003085 diluting agent Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 238000001556 precipitation Methods 0.000 claims description 11
- 239000012752 auxiliary agent Substances 0.000 claims description 7
- 239000000080 wetting agent Substances 0.000 claims description 7
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- 238000012858 packaging process Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract description 5
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000001376 precipitating effect Effects 0.000 abstract description 4
- 238000003860 storage Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 20
- -1 silane compound Chemical class 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical group [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000001841 imino group Chemical group [H]N=* 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- SNGREZUHAYWORS-UHFFFAOYSA-N perfluorooctanoic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F SNGREZUHAYWORS-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 description 1
- KFUSXMDYOPXKKT-UHFFFAOYSA-N 2-[(2-methylphenoxy)methyl]oxirane Chemical compound CC1=CC=CC=C1OCC1OC1 KFUSXMDYOPXKKT-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Disclosed herein are an epoxy resin composition comprising a silane-containing compound, and a process and product using the same, the epoxy resin composition comprising: an epoxy resin composition substrate and a silane-containing compound. The epoxy resin composition can be prepared by using a commercially available epoxy adhesive as an epoxy resin composition substrate and adding a silane-containing compound in a certain proportion to the epoxy resin composition substrate when the epoxy resin composition is used, so that the epoxy resin composition is convenient to prepare. And the epoxy resin composition can prevent the epoxy resin from precipitating from the epoxy resin composition, so that the performance of an electric product is more stable and reliable when the epoxy resin composition is used for sealing or bonding. In addition, the epoxy resin composition can maintain fluidity and stability of performance after heating, so that the epoxy resin composition has good workability and is convenient for construction operation and storage.
Description
Technical Field
The present invention relates to the field of processing of electronic products, and in particular to a process and a product using an epoxy resin composition containing a silane compound and using the composition.
Background
During the processing of electronic products, it is often necessary to use an epoxy resin composition for the gluing or sealing process. In the gluing process, an epoxy resin composition is first applied to the surface of a substrate, then an adherend is applied to the substrate coated with the composition, and finally the composition is cured to bond the substrate and adherend. In the sealing process, an epoxy resin composition is injected into a gap to be sealed between a first member and a second member, and then the composition is cured to seal the gap to be sealed.
Disclosure of Invention
At least one object of the present application in a first aspect is to provide an epoxy resin composition comprising: an epoxy resin composition substrate comprising an epoxy resin; and a silane-containing compound for preventing precipitation of the epoxy resin from the epoxy resin composition; wherein the chemical formula of the silane-containing compound is shown as a formula (I):
n represents an integer of 0 to 20, and m represents an integer of 1 to 5.
According to the first aspect described above, the weight of the silane-containing compound is 0.1 to 2% of the weight of the epoxy resin composition substrate.
According to the first aspect, the epoxy resin accounts for 40-70% of the weight of the epoxy resin composition substrate; and the epoxy resin composition substrate further comprises a curing agent, wherein the curing agent accounts for 3-8% of the weight of the epoxy resin composition substrate.
According to the first aspect, the epoxy resin is bisphenol a epoxy resin.
According to the first aspect described above, n represents 2, and m represents 1.
According to the first aspect, the epoxy resin composition substrate further comprises: an epoxy diluent, wherein the epoxy diluent accounts for 1-10% of the weight of the epoxy resin composition substrate; and the balance of auxiliary agents.
According to the first aspect, the auxiliary agent comprises a colorant, an inorganic filler and a wetting agent.
According to the first aspect described above, the epoxy resin composition is used for a relay sealing process or a chip packaging process.
At least one object of the present application in a second aspect is to provide a use of the epoxy resin composition described above in a sealing process or a bonding process.
At least one object of the present application in a third aspect is to provide a bonding process comprising the steps of: applying the epoxy resin composition according to the above to a surface of a substrate; applying an adherend to a surface of a substrate coated with the epoxy resin composition; and curing the epoxy resin composition to bond the substrate and the adherend.
At least one object of the present application in a fourth aspect is to provide a sealing process comprising the steps of: applying the epoxy resin composition according to the above into the gap to be sealed between the first member and the second member; and curing the epoxy resin composition to seal the gap to be sealed.
At least one object of the present application in a fifth aspect is to provide a relay comprising: a housing; the cover body is arranged at the top of the shell in a covering manner, and a gap is reserved between the cover body and the shell; wherein the gap is sealed by the epoxy resin composition described above.
At least one object of the present application in a sixth aspect is to provide a chip, comprising: a substrate; and a metal sheet; wherein the substrate and the metal sheet are connected to each other by the epoxy resin composition according to any one of claims 1 to 9.
At least one object of the present application in a seventh aspect is to provide a use of a silane-containing compound having a chemical formula shown in formula (I):
n represents an integer of 0 to 20, and m represents an integer of 1 to 5.
Drawings
FIGS. 1A-4B show the separation of epoxy resins after the epoxy resins of the various examples or comparative examples are combined;
FIG. 5 is a schematic structural view of a relay using the epoxy resin composition of the present application;
fig. 6 is a schematic structural diagram of a chip using the present application.
Detailed Description
Various embodiments of the present application are described below with reference to the accompanying drawings, which form a part hereof. It is to be understood that, although directional terms, such as "front", "rear", "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", etc., may be used in this application to describe various example structural portions and elements of the present application, these terms are used herein for convenience of description only and are determined based on the example orientations shown in the drawings. Because the embodiments disclosed herein may be arranged in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting.
In this application, unless otherwise indicated, all units and materials are commercially available or are commonly used in the industry, and the methods described in the examples below are conventional in the art unless otherwise indicated.
The epoxy resin composition may be used in an adhesive or sealing process during the processing of electronic products. However, the inventors of the present application found that after the epoxy resin composition is applied to a substrate or a gap, the epoxy resin is easily precipitated from the composition, and the precipitate may affect the electrical properties of the electronic product. The present application provides an epoxy resin composition comprising an epoxy resin composition substrate comprising an epoxy resin and a silane-containing compound as a precipitation inhibitor for preventing precipitation of the epoxy resin from the epoxy resin composition.
The epoxy resin accounts for 40-70% of the weight of the epoxy resin composition substrate. The epoxy resin may be a conventional epoxy resin such as bisphenol a epoxy resin.
The epoxy resin composition substrate may also include an epoxy diluent. The epoxy diluent accounts for 1-10% of the weight of the epoxy resin composition substrate. The epoxy diluent is used to reduce the viscosity of the epoxy resin composition substrate to improve the flowability of the epoxy resin composition substrate. The epoxy diluent may be a conventional epoxy resin diluent, and as one example, the epoxy diluent is at least one of a glycidyl ether type epoxy diluent, an aliphatic lipid type epoxy diluent, or an aromatic lipid type epoxy diluent. The glycidyl ether type epoxy diluent can be alkylene glycidyl ether, butyl glycidyl ether, 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, C12-14 fatty glycidyl ether, 1, 6-hexanediol diglycidyl ether, benzyl glycidyl ether, o-tolyl glycidyl ether or neopentyl glycol diglycidyl ether, etc. The aromatic lipid may be dibutyl phthalate.
The epoxy resin composition substrate may also include a curing agent. The curing agent accounts for 3-8% of the weight of the epoxy resin composition substrate. The curing agent is used for carrying out chemical reaction with the epoxy resin to promote the curing of the epoxy resin so as to achieve the effect of gluing or sealing. As an example, the curing agent may be a conventional epoxy resin curing agent, such as an aliphatic amine, an aromatic amine, a heterocyclic amine, imidazole, or a modified imidazole curing agent, or the like.
The epoxy resin composition substrate may further include a balance of an auxiliary agent. The auxiliary agent comprises a colorant, an inorganic filler, a wetting agent and the like. Wherein the colorant comprises 0.5 to 4% by weight of the epoxy resin composition substrate. The colorant may be, for example, an inorganic pigment such as carbon black or titanium white, or an organic pigment such as an azo pigment. The inorganic filler accounts for 10 to 30 percent of the weight of the substrate of the epoxy resin composition. The inorganic filler can be calcium carbonate, calcium silicate, clay or glass beads, etc. The inorganic filler can increase the mechanical strength of the epoxy resin. The wetting agent accounts for 0.1 to 0.3 percent of the weight of the substrate of the epoxy resin composition. The wetting agent may be a silicone-based wetting agent. Wetting agents are used to reduce surface tension. Those skilled in the art will appreciate that more or less auxiliary agents may be included in the epoxy resin composition substrate as desired.
The weight of the silane-containing compound is 0.1 to 2% of the weight of the substrate of the epoxy resin composition. In formulating the epoxy resin composition of the present application, the epoxy resin composition substrate may be formulated first, and then a silane-containing compound may be added thereto in an amount of 0.1 to 2% by weight of the epoxy resin composition substrate.
In one embodiment, the epoxy resin composition substrate is a commercially available one-part epoxy adhesive. In this example, the epoxy resin composition of the present application was obtained by adding 0.1 to 2% of a silane-containing compound to a commercially available one-component epoxy adhesive.
In the present application, the chemical formula of the silane-containing compound is shown as formula (I):
wherein n represents an integer of 0 to 20, and m represents an integer of 1 to 5.
The applicant has found through research that if only the epoxy resin composition substrate according to the present application is used in the gluing or sealing process during the processing of electronic products, after the epoxy resin composition substrate is coated on the surface of the substrate, the epoxy resin may be precipitated from the epoxy resin composition substrate due to the lower adhesion of the epoxy resin to the epoxy resin composition substrate than the adhesion between the epoxy resin and the coated substrate. In contrast, if an epoxy resin composition comprising the epoxy resin composition base of the present application and a silane compound is used, the epoxy resin does not precipitate from the epoxy resin composition of the present application after the epoxy resin composition of the present application is applied to the surface of the substrate. This is because the silane-containing compound in the present application includes a polar group amine group and a nonpolar group siloxane group at both ends of a chain length, and the polar group amine group can be coupled with a polar component in the epoxy resin composition substrate, and the nonpolar group siloxane group and the epoxy resin in the epoxy resin composition substrate are coupled together. Thus, the silane-containing compound can help to retain the epoxy resin in the epoxy resin composition. Thus, the epoxy resin is less likely to precipitate from the epoxy resin composition after the application of the epoxy resin composition of the present application comprising the epoxy resin composition base and the silane-containing compound to the surface of the substrate. And the nonpolar group siloxane groups are easy to migrate to the surface of the epoxy resin composition, can form a barrier on the surface, and further prevent the epoxy resin from precipitating from the epoxy resin composition. Thus, the epoxy resin composition of the present application can prevent the precipitation of the epoxy resin from the surface of the composition.
When an operator performs a work operation of applying the epoxy resin composition to the surface of the substrate, it is desirable that the epoxy resin composition have good fluidity to facilitate the application. In particular, if the size of the substrate area where the epoxy composition is to be applied is limited, the tools used to apply the epoxy composition are very small, such as may be needles, in which case good flow of the epoxy composition is particularly important for the application operation. In order to provide good flowability to the epoxy resin composition, it is generally necessary to heat the composition to a certain temperature (e.g., 60 ℃).
As described hereinabove, the curing agent in the epoxy resin composition substrate of the present application includes primary amino groups (-NH) 2 ). The inventors of the present application have found that primary amine groups of the curing agent rapidly crosslink with the epoxy resin only when the epoxy resin composition substrate is heated to a relatively high temperature (e.g., 90 ℃ C. To 120 ℃ C.), allowing the epoxy resin composition substrate to cure. While primary amino groups do not crosslink with the epoxy resin for a certain period of time (e.g., 24 hours) when the epoxy resin composition substrate is heated to a lower temperature (e.g., 60 ℃). The inventors of the present application have also found thatThe imino group (-n=c) in the silane-containing compound is first hydrolyzed in air to produce ketone (c=o) and primary amino group (-NH) 2 ) Generating primary amino groups (-NH) 2 ) And then reacts with epoxy groups in the epoxy resin at a higher temperature (for example, 90 ℃ to 120 ℃). Therefore, the silane-containing compound selected by the inventors of the present application is advantageous in that it includes an imino group (-n=c) as a polar group, so that the epoxy resin composition of the present application has good fluidity when heated to a certain temperature (for example, 60 ℃) and is advantageous in coating of the epoxy resin composition, particularly in coating of the epoxy resin composition in the case where the size of the substrate site is limited.
In addition, since the silane-containing compound used herein includes an imino group (-n=c), when the temperature at which the epoxy resin composition is heated in air reaches the curing temperature, the imino group (-n=c) in the silane-containing compound can be hydrolyzed again into a primary amino group (-NH) 2 ) And then participate in the curing reaction, thereby facilitating the curing of the epoxy resin composition of the present application and enabling the reduction of the amount of other curing agents. Therefore, the silane-containing compound used in the application enables the epoxy resin composition to have good flow properties after being moderately heated, is beneficial to coating operation of the epoxy resin composition, and simultaneously can also participate in curing reaction at a curing temperature, thereby being beneficial to curing of the epoxy resin composition.
The effect of the epoxy resin composition of the present application is illustrated below by the epoxy resin compositions of several specific examples and comparative examples. All of the epoxy resin composition examples and comparative examples described below were identical in each component and content of the epoxy resin composition substrate, and different in the content of the silane-containing compound alone. Table 1 shows the components and contents of the epoxy resin composition substrates in the epoxy resin compositions of all examples and comparative examples. Table 2 shows the content of the constituent silane-containing compound in the epoxy resin compositions of each of the examples and comparative examples, and the viscosity data after 24 hours of standing at 60 ℃ after the epoxy resin composition was applied to the surface of the metal substrate.
Table 1 ingredients and contents of the epoxy resin composition substrates of each of the epoxy resin composition examples and comparative examples
| Composition of the components | Content (%) |
| Bisphenol A epoxy resin | 65 |
| Para-tertiary butyl phenol glycerol ether | 2.8 |
| Modified imidazoles | 5 |
| Carbon black | 1 |
| Calcium carbonate | 26 |
| Modified polydimethylsiloxane | 0.2 |
TABLE 2 silane compound content of each of the epoxy resin composition examples and comparative examples and viscosity after 24 hours at 60℃
| Second fraction content (%) | Viscosity after 24h at 60 DEG C | |
| Example 1 | 0.1 | 16100 |
| Example 2 | 1 | 16629 |
| Example 3 | 2 | 19400 |
| Comparative example 1 | 0 | 17939 |
| Comparative example 2 | 0.1 | 32800 |
| Comparative example 3 | 1 | Curing |
| Comparative example 4 | 2 | Curing |
In examples 1-3 of the present application, the silane-containing compound has a chemical formula shown in formula (I), and m is 1, and n is 2. In the comparative example, the silane-containing compound was holosilane octanoic acid (PFOA).
As can be seen from table 2, in examples 1 to 3 of the present application, after adding a certain amount of the silane-containing compound represented by formula (I) to the first part, the epoxy resin composition can maintain a low viscosity even after leaving the epoxy resin composition at 60 ℃ for 24 hours, and thus has good flow properties. As shown in Table 2, the viscosity of the compositions of examples 1-3 herein was lower or near that of comparative example 1, where no silane-containing compound was added. Whereas the epoxy resin compositions of comparative examples 2 to 4 to which PFOA was added were allowed to stand at 60℃for 24 hours, the viscosity of the epoxy resin composition was significantly increased and even curing occurred, and thus fluidity was deteriorated or fluidity was completely lost, resulting in failure of coating.
The epoxy resin compositions of comparative example 1 and examples 1-3 were left at 60℃for 24 hours after being applied to the surface of a metal substrate, as described hereinabove, at which time the epoxy resin compositions of comparative example 1 and examples 1-3 were not yet cured, and the precipitation of the epoxy resin was observed when the epoxy resin compositions were uncured. And after the epoxy resin compositions of comparative example 1 and examples 1 to 3 were applied to the surface of the metal substrate, the composition was allowed to stand at 120℃for 30 minutes to allow the epoxy resin composition to cure, and the precipitation of the epoxy resin after the curing of the epoxy resin composition was observed. Fig. 1A to 4B show the results of two observations for comparative example 1 and examples 1 to 3, respectively, for explaining the case of the epoxy resin precipitation in comparative example 1 and examples 1 to 3. Fig. 1A and 1B show cases where epoxy resin is precipitated from the epoxy resin composition before and after curing of the epoxy resin composition of comparative example 1 after the epoxy resin composition is applied to the surface of a metal substrate, respectively. Fig. 2A and 2B show cases where the epoxy resin composition of example 1 was applied to the surface of a metal substrate, and the epoxy resin was precipitated from the epoxy resin composition before and after curing, respectively. Fig. 3A and 3B show cases where epoxy resin is precipitated from the epoxy resin composition before and after curing of the epoxy resin composition after the epoxy resin composition of example 2 is applied to the surface of the metal substrate, respectively. Fig. 4A and 4B show cases where the epoxy resin composition of example 3 was applied to the surface of a metal substrate, and the epoxy resin was precipitated from the epoxy resin composition before and after curing, respectively.
As shown in fig. 1A and 1B, in the case where the silane-containing compound represented by the formula (I) in the present application is not added, the epoxy resin is precipitated in the epoxy resin composition before and after curing. 2A-4B show that no epoxy resin is precipitated in the epoxy resin composition before and after curing, after adding a certain amount of the silane-containing compound represented by formula (I) in the present application. Therefore, the epoxy resin composition of the present application can prevent the epoxy resin from precipitating from the epoxy resin composition.
In summary, the epoxy resin composition of the present application can not only prevent the precipitation of epoxy resin from the epoxy resin composition at the time of construction, but also maintain fluidity even after being heated to a certain temperature in order to meet the requirements of construction, thereby facilitating construction operations and storage.
Fig. 5 is a schematic structural view of a relay sealed with the epoxy resin composition of the present application. As shown in fig. 5, the relay 500 includes a housing 502 (i.e., a first member) and a cover 501 (i.e., a second member), the cover 501 being provided on top of the housing 502. The housing 502 has a cavity (not shown) therein for accommodating an electronic device or the like. The junction of the cover 501 and the housing 502 has a gap 503. The gap 503 needs to be sealed to prevent dust, water, etc. from entering the interior of the housing 502 through the gap 503, affecting the operation of the electronic device. In the sealing process, the gap 503 can be sealed after the epoxy resin composition is applied to the gap 503 and then heated to 120 ℃ to cure the epoxy resin composition.
To avoid affecting the electrical performance of the electronics inside the housing 502, it is undesirable for the epoxy applied to the gap 503 to separate out of the epoxy composition. And in the coating work, since the gap 503 is generally narrow, it is also necessary to heat the epoxy resin composition (e.g., 60 c) to improve its fluidity, so that the epoxy resin composition can be conveniently coated into the gap 503 using a fine tool. And to achieve continuous production of the relay 500, it is generally necessary to heat a sufficient amount of the epoxy resin composition at a time to continuously coat a large number of gaps 503 between the housing 502 and the cover 501 of the relay 500. In this case, the epoxy resin composition also needs to be stored for a certain time after heating. Therefore, it is also desirable that the epoxy resin composition not cure for a sufficient period of time after being heated to a certain temperature to maintain good fluidity. The epoxy resin composition of the present application is suitable for sealing the gap 503 because the epoxy resin composition of the present application can not only prevent the epoxy resin from being precipitated from the epoxy resin composition, but also maintain the fluidity of the epoxy resin composition after the epoxy resin composition is heated, facilitating the coating operation.
Fig. 6 is a schematic structural diagram of a chip glued using the epoxy resin composition of the present application. As shown in fig. 6, the chip 600 includes a substrate 611 (i.e., a base material) and a metal sheet 612 (i.e., an adherend). The metal sheets 612 are connected to each other through the epoxy resin composition and the substrate 611. In the bonding process, an epoxy resin composition is first applied to the upper surface of the substrate 611, then a metal sheet 612 is applied to the substrate 611 where the epoxy resin composition is applied, and finally the epoxy resin composition is cured to bond the metal sheet 612 and the substrate 611. Although not shown, the metal sheet 612 may further include fine electronic components such as pins. Epoxy resin compositions are also used to bond these fine electronic components to the substrate 611.
In order to prevent the electric performance of the chip from being affected, it is undesirable that the epoxy resin is precipitated from the epoxy resin composition. In addition, it is necessary to heat the epoxy resin composition (e.g., 60 ℃) to improve its fluidity, especially when fine electronic parts are bonded to the substrate 611 using the epoxy resin composition, in order to facilitate application of the epoxy resin composition to the fine electronic parts using a fine tool. And since a sufficient amount of the epoxy resin composition is heated to continuously perform the bonding operation on a large number of chips 600 in order to achieve continuous production of chip production, the epoxy resin composition also needs to be stored for a certain time after heating. Therefore, it is also desirable that the epoxy resin composition not cure for a sufficient period of time after being heated to a certain temperature to maintain good fluidity. The epoxy resin composition of the present application is suitable for use in a bonding process of chips because the epoxy resin composition of the present application can not only prevent the precipitation of epoxy resin from the epoxy resin composition, but also maintain fluidity of the epoxy resin composition after the epoxy resin composition is heated, facilitating a coating operation.
The epoxy resin composition has at least the following technical effects:
1. the present application may employ a commercially available epoxy adhesive as the epoxy resin composition substrate. When a commercially available epoxy adhesive is used as the epoxy resin composition substrate, the epoxy resin composition of the present application can be obtained by simply adding a certain proportion of the silane-containing compound according to the present application to the epoxy resin composition substrate at the time of use. The formulation of the epoxy resin composition of the present application is therefore convenient.
2. The epoxy resin composition can prevent the epoxy resin from precipitating from the epoxy resin composition, so that the performance of an electric product is more stable and reliable when the epoxy resin composition is used for sealing or bonding.
3. The epoxy resin composition can also maintain fluidity and stability of performance after heating, so that the epoxy resin composition has good workability and is convenient for construction operation and storage.
4. Since the silane-containing compound used herein participates in the curing reaction at the curing temperature, the epoxy resin composition of the present application is more easily cured at the curing temperature.
Although the present application will be described with reference to the specific embodiments shown in the drawings, it should be understood that many variations of the thermally conductive insulating film of the present application are possible without departing from the spirit and scope and the background of the teachings of the present application. Those of ordinary skill in the art will also recognize that there are different ways to alter the structure of the embodiments disclosed herein, and that they fall within the spirit and scope of the present application and the claims.
Claims (14)
1. An epoxy resin composition characterized by comprising:
an epoxy resin composition substrate comprising an epoxy resin; and
a silane-containing compound for preventing precipitation of the epoxy resin from the epoxy resin composition;
wherein the chemical formula of the silane-containing compound is shown as a formula (I):
n represents an integer of 0 to 20, and m represents an integer of 1 to 5.
2. The epoxy resin composition according to claim 1, wherein:
the weight of the silane-containing compound is 0.1 to 2% of the weight of the epoxy resin composition substrate.
3. The epoxy resin composition according to claim 2, characterized in that:
the epoxy resin accounts for 40-70% of the weight of the epoxy resin composition substrate; and
the epoxy resin composition substrate further comprises a curing agent, wherein the curing agent accounts for 3-8% of the weight of the epoxy resin composition substrate.
4. An epoxy resin composition according to claim 3, characterized in that:
the epoxy resin is bisphenol A epoxy resin.
5. An epoxy resin composition according to claim 3, characterized in that:
n represents 2, and m represents 1.
6. The epoxy resin composition according to claim 4, wherein:
the epoxy resin composition substrate further includes:
an epoxy diluent, wherein the epoxy diluent accounts for 1-10% of the weight of the epoxy resin composition substrate; and
the balance of auxiliary agents.
7. The epoxy resin composition according to claim 6, wherein:
the auxiliary agent comprises a colorant, an inorganic filler and a wetting agent.
8. The epoxy resin composition according to any one of claims 1 to 7, characterized in that:
the epoxy resin composition is used for a relay sealing process or a chip packaging process.
9. Use of an epoxy resin composition according to any one of claims 1 to 7 in a sealing process or a bonding process.
10. A bonding process characterized by comprising the steps of:
applying the epoxy resin composition according to any one of claims 1 to 9 to a substrate surface;
applying an adherend to a surface of a substrate coated with the epoxy resin composition; and
the epoxy resin composition is cured to bond the substrate and the adherend.
11. A sealing process characterized by comprising the steps of:
applying the epoxy resin composition according to any one of claims 1 to 9 into a gap to be sealed between a first part and a second part; and
the epoxy resin composition is cured to seal the gap to be sealed.
12. A relay, characterized by comprising:
a housing (502); and
a cover body (501), wherein the cover body (501) is arranged at the top of the shell (502) in a covering way, and a gap (503) is arranged between the cover body and the shell;
wherein the gap (503) is sealed by the epoxy resin composition according to any one of claims 1 to 9.
13. A chip, further characterized by comprising:
a substrate (611); and
a metal sheet (612);
wherein the substrate (611) and the metal sheet (612) are connected to each other by the epoxy resin composition according to any one of claims 1 to 9.
14. Use of a silane-containing compound having a chemical formula shown in formula (I) for preventing precipitation of an epoxy resin from an epoxy resin composition:
n represents an integer of 0 to 20, and m represents an integer of 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211164372.9A CN117801740A (en) | 2022-09-23 | 2022-09-23 | Epoxy resin composition comprising silane-containing compound, process using the same, and product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211164372.9A CN117801740A (en) | 2022-09-23 | 2022-09-23 | Epoxy resin composition comprising silane-containing compound, process using the same, and product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117801740A true CN117801740A (en) | 2024-04-02 |
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ID=90423788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211164372.9A Pending CN117801740A (en) | 2022-09-23 | 2022-09-23 | Epoxy resin composition comprising silane-containing compound, process using the same, and product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117801740A (en) |
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2022
- 2022-09-23 CN CN202211164372.9A patent/CN117801740A/en active Pending
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